EP3387887A1 - Procédé pour étanchéifier et/ou relier électriquement des composants d'un véhicule automobile et dispositif pour un véhicule automobile - Google Patents

Procédé pour étanchéifier et/ou relier électriquement des composants d'un véhicule automobile et dispositif pour un véhicule automobile

Info

Publication number
EP3387887A1
EP3387887A1 EP16797521.8A EP16797521A EP3387887A1 EP 3387887 A1 EP3387887 A1 EP 3387887A1 EP 16797521 A EP16797521 A EP 16797521A EP 3387887 A1 EP3387887 A1 EP 3387887A1
Authority
EP
European Patent Office
Prior art keywords
region
electrically conductive
interface
layer
additives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16797521.8A
Other languages
German (de)
English (en)
Inventor
Sebastian Frank
Björn Pucher
Peter Fischer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vitesco Technologies GmbH
Original Assignee
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE102015225026.1A external-priority patent/DE102015225026A1/de
Priority claimed from DE102016202589.9A external-priority patent/DE102016202589A1/de
Application filed by Continental Automotive GmbH filed Critical Continental Automotive GmbH
Publication of EP3387887A1 publication Critical patent/EP3387887A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0236—Plating catalyst as filler in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components

Definitions

  • the invention relates to a method for sealing and / or electrical connection of components for a motor vehicle and a device for a motor vehicle, which is adapted to an interface between two components for a
  • Plastic and the conductor and / or for electrically connecting the plurality of interconnects of the so-called MID (molded interconnected device) with the metallic conductor In applications with high temperature requirements, the problem may arise that due to the different thermal expansion coefficients of the Plastic and the metallic conductor thermal stresses are generated, which affect the tightness of the interface between the plastic and the metallic conductor and must also be compensated by the electrical connections.
  • interconnect structures are known from WO 2003/005784 A2 and WO 1999/005895 A1. It is therefore an object of the invention to provide a method for sealing and / or electrical connection of components for a motor vehicle and a device for a motor vehicle, which are suitable for a
  • a method for sealing and / or electrically connecting components for a motor vehicle comprises providing a first element having a recess and a second element, which is arranged in the recess of the first element.
  • the first and second members each have an outer wall having a first area and a second area, the first area being in contact with the other first area, respectively, and the second area being exposed, respectively.
  • the respective second region of the two elements is exposed and thus is not in contact with the respective other element.
  • a circuit region is preferably arranged on the outer wall of the first element.
  • the method further comprises introducing electrically conductive additives into the first element in a region of an interface formed as a transition of the adjacent second regions of the first and second elements.
  • the method further includes exposing the electrically conductive additives of the first element in the region of the interface.
  • the method comprises chemically depositing a given material and thereby forming a sealing layer and / or an electrically conductive bonding layer on the first element and the second element and thereby sealing the interface between the two elements and / or electrically connecting the two elements.
  • the cooperating components in this context are the first and second elements which are at least partially in contact with each other.
  • sealing and / or electrical connection by chemical deposition of a given material, the interface between the two elements can be reliably sealed and / or the two elements can be reliably electrically connected to one another, thus achieving a sealed and reliable condition of the interacting elements.
  • the inventive method is based on known art ⁇ material techniques, in particular the galvanization of
  • the chemical deposition is further used to reliably seal two interacting components by means of a sealing layer produced by the chemical deposition and / or by means of an electrical connection layer produced by the chemical deposition, the two components together electrically connect.
  • the sealing layer produced by chemical deposition electrically conductive compound layer
  • electrically conductive connection layer solder layer
  • the interface is protected by the method described from damage, such as the formation of cracks or cracks, and it is made a contribution to an increased life of the ready state.
  • the chemically deposited sealing layer and / or electrically conductive connection layer has a function of pre ⁇ added material a reliable chemical resistance and, in comparison with alternative methods of sealing and / or electrically connecting high mechanical stresses, in particular stresses which expansion coefficient by unequal pressure- of the first and second elements.
  • the sealing layer and / or electrically conductive connecting layer thus reliably counteracts unwanted distancing of the two elements, a so-called delamination, as well as rupture of one or both elements and can simultaneously serve the integrated circuit layout with the second element in the first element electrically connect.
  • a sealing element and / or electrically conductive connecting element is re ⁇ alised, which forms one or more sealing and / or connecting material layers between the elements to be sealed and / or connected, due to Attach molecular binding forces to the first and second element.
  • alternative methods of sealing on adhesion adheresive, impregnation, encapsulation
  • as an elastic interference fit based on the formation of a positive connection O-ring, sealing lip
  • alternative methods of bonding may be based on adhesion (conductive bonding, bonding).
  • the sealing layer and / or electrically conductive connection ⁇ layer composed for example of metal particles, such as copper, or comprises such, and forms a continuous Materi- al Wein a reliable seal between the two elements and / or reliable electrical connection of the two elements.
  • the first element and / or the second element has electrically conductive additives in the region of the interface and / or in the circuit region and the second Element comprises an alloy that must be accessible for deposition of the chemically depositing material.
  • the electrically conductive additives or the alloy act as carrier particles and act as germ cells for the sealing layer to be formed and / or electrically conductive connection layer and are advantageously formed of the same material as the material to be chemically deposited. They act as mechanical anchors for the chemical deposition of the given material and may, for example, be directly constituents of an alloy or of the first element or of both elements.
  • the first element is preferably formed as a plastic component and has electrically conductive additives in the form of metal particles, while the second element is designed as a metal ⁇ component and is partially disposed in the first element or this completely penetrates.
  • the additives are introduced into the first element and / or into the second element in the region of the interface and / or in the circuit region or are admixed, for example, with a substance from which the plastic component is formed and thus realized the first element.
  • the chemical deposition can be carried out in a controlled manner.
  • the exposure may be performed, for example, by mechanically or laser-removing a plastic pellicle on the surface of the first member about the penetrating second member.
  • the method comprises introducing electrically conductive additives into the second element in the area of the interface and exposing the electrically conductive additives of the first element and the second element at the interface.
  • the method is extended to the effect that the second element, which is arranged at least partially in the recess of the first element, is provided with electrically conductive additives in order to chemically deposit the given material and form the sealing layer or electrical connection layer to enable both elements.
  • the first and second elements are made of a material which alone does not allow any or no sufficient chemical deposition.
  • the first element and the second element are plastic components having metal particles as additives which, after exposure, enable chemical deposition.
  • the additives are beneficially designed such that a ⁇ verfactes to chemical deposition, and forming the sealing layer and / or the electrically conductive connection layer is also possible.
  • Metal particles and a metallic one are beneficially designed such that a ⁇ verfactes to chemical deposition, and forming the sealing layer and / or the electrically conductive connection layer is also possible.
  • sealing layer and / or electrically conductive compound ⁇ layer are advantageous, inter alia, due to an associated coefficient of thermal expansion to thermal To be able to compensate for stresses and to counteract the tendency to cracking.
  • the deposition of the sealing layer and / or the electrically conductive connection layer on the first element and / or the second element comprises a galvanic deposition of the sealing layer and / or electrically conductive connection layer and thereby sealing the interface between the first element and the second Element and / or electrically connecting the first element to the second element.
  • additives are introduced into the first element and / or into the second element in the area of the interface and / or in the circuit area prior to providing the first element and / or the second element such that the first element and / or the second element can be provided with additives.
  • the additives gal for the chemical and / or vanish deposition can already be arranged or incorporated in or on the first element and / or second element.
  • the first element is made of plastic, so that in the production of the first element the raw material already admixed with the desired additives, from which the first element is made.
  • the second element is formed as already Me ⁇ tallkomponente and is partially encapsulated by a substance comprising the additives and forming the first element in a final state.
  • the exposure of the additives at the interface and / or in the circuit region of the first and second elements comprises a thermal and / or mechanical processing of a surface of the first and / or second element in the region of the interface and / or in the circuit ⁇ area of the first element.
  • the additives are exposed by means of grinding, milling or laser processing, so that a part of the surface of the first element is roughened and removed, in order to enable a chemical and / or galvanic deposition .
  • the provision of the first and second elements comprises a previous transfer or injection of the second element and thereby forming the first element and arranging the second element in the recess of the first element.
  • the second element is partially encapsulated with a raw material from which the first element is formed
  • the second element is necessarily arranged in the recess of the first element.
  • the first element has a recess due to the on or overmolding, which is due to the geometric configuration of a part of the second element, which is overmolded.
  • the second element is realized as a metallic conductor which penetrates a plastic feedthrough which produces the first element by means of injection molding.
  • the first and second element can be produced separately, so that, for example, the metallic conductor is subsequently introduced into the already configured plastic leadthrough.
  • the method described also makes it possible in such a case to reliably and reliably seal and / or electrically connect the interface between the two elements by means of chemical and / or galvanic deposition and formation of the sealing layer and / or electrically conductive connection layer.
  • the introduction of electrically conductive additives into the first element or into the first and second element in the region of the interface and / or in the circuit region comprises an introduction of metal particles.
  • a device for a motor vehicle comprises a first element having a recess and an outer wall having a first region and a second region.
  • the device further comprises a second element which is arranged in the recess of the first element and which likewise has an outer wall with a first region and a second region.
  • the respective first regions of the first and second elements are respectively in contact with the other first region while the respective second regions are exposed.
  • the device comprises a sealing layer and / or an electrically conductive compound ⁇ binding layer, which is applied by means of chemical and / or galvanic deposition on the first and second element and an interface, as the transition of the adjacent second regions of the first and second elements is formed, seals and / or electrically connects the first element with the second element.
  • a circuit area is arranged on the outer wall of the first element, which is designed to produce a circuit layout.
  • the electrically conductive Verbin ⁇ dung layer is adapted to connect the circuit portion with the region of the interface electrically, so that the Circuit area of the first element is electrically connected to the second element.
  • Such a device realizes a reliable and safe sealed with each other and / or electrically connected component for a motor vehicle, which prevents undesired entry and / or exit of a surrounding medium, or at least more difficult, or prevents an unintentional separation of the elekt ⁇ step compound or at least partially difficult.
  • a device can in particular be produced by means of one of the methods described above, so that all the properties and features described for the method are also disclosed for the device and vice versa.
  • the first element and / or second element has additives which are arranged in the region of the interface and / or in the circuit region respectively in or on the first and / or second element and on which the sealing layer and / or electrically conductive Compound layer is deposited.
  • the sealing layer and / or electrically conductive bonding layer is material and / or positively coupled to the first element and the second element.
  • the chemical and / or electrolytic deposition of a substance and / or form-locking connection of the sealing layer and / or electri- cally conductive connecting layer with the respective acti ⁇ fourth and roughened surface of the first or the first and second members implemented.
  • the area of the interface is sealed reliably and ⁇ bordering media are prevented from entering through the interface between the material pairing.
  • the circuit area can be reliably electrically connected to the second element.
  • the additives are formed as metal particles.
  • the sealing layer and / or electrically conductive connection layer comprises a metal layer.
  • the sealing layer and / or electrically conductive Verbin ⁇ dung layer is for example formed by means of chemical deposition as a copper layer and optionally additionally sealed by means of galvanic deposition of a gold layer.
  • the sealing layer and / or electrically conductive connection layer can thus be formed as a single layer or as a multilayer of identical or different materials.
  • the second element penetrates the first element.
  • the first element plastic and the second element metal are formed from the first element plastic and the second element metal.
  • the second element can preferably be realized as an electrical conductor or connector pin and completely penetrate the first element made of plastic.
  • interfaces are formed on an upper and lower side of the first and second members, which are respectively formed as boundary regions of the respective second exposed portions of the first and second members. The one or more interfaces thus represent the area where the contacting first regions of the two elements terminate and the exposed second regions begin.
  • Circuit region a arranged in or on an element and by the area of the interface separate region which is adapted to generate a circuit layout.
  • a scarf ⁇ tung layout may be preformed, which by ansch manendes Ap Pliers of electrical components, such as resistors, diodes, capacitors, transistors, ASICS, bare dies, leads to an integrated circuit in the respective element. Consequently, separate methods for mounting printed conductors can be dispensed with, since they are already present through the circuit region and the formation of the electrically conductive connecting layer on the respective element.
  • the method disclosed herein and the apparatus disclosed herein are suitable for any electrical components having a plug connection, such as sensors, actuators, controllers.
  • the method according to the invention and the device according to the invention find useful application in elements, of which at least one is electrically conductive (eg a metallic element) and at least one of which is rendered electrically conductive at least in regions by the chemical deposition, for example a provided with electrically conductive additives plastic.
  • Fig. 3 is a flowchart for a method for
  • an electrically conductive connection layer 3 which can also act as a sealing layer 3 at the same time.
  • the electrically conductive connecting layer 3 is a pure sealing layer 3, which is designed to only reliably seal the interface between two elements and not to electrically connect the two elements. For simplicity, therefore, only the electrically conductive connection layer 3 will be ⁇ written , wherein the sealing layer 3 can be generated in the same way.
  • FIG. 1A to IC show an embodiment of steps of a method for manufacturing a device 1 for a motor vehicle, comprising an electrically conductive connection ⁇ layer 3 which is formed by means of chemical and / or galvanic deposition and a reliable and secure electrical connection of allows two interacting components.
  • the electrically conductive connection layer 3 is a sealing layer which is formed by chemical and / or galvanic deposition and can allow a reliable and secure sealing of two interacting components.
  • the electrically conductive connection layer 3 also acts as a sealing layer, that is, by forming the electrically conductive connection layer 3, an electrical connection of the two components takes place and At the same time the interface between the two components can be reliably sealed.
  • FIG. Fig. 1A shows in perspective view different position in the context of a manufacturing process of the device 1.
  • Fig. 1B illustrates cross sections corresponding to the positions shown in Fig. 1A.
  • FIG. 1C shows, corresponding to FIG. 1B, enlarged views of marked regions A, B and C.
  • FIG. 1A shows in perspective view different position in the context of a manufacturing process of the device 1.
  • Fig. 1B illustrates cross sections corresponding to the positions shown in Fig. 1A.
  • FIG. 1C shows, corresponding to FIG. 1B, enlarged views of marked regions A, B and C.
  • a second element 20 is provided, which is designed as a metallic conductor.
  • the metallic conductor is formed from copper.
  • the second element 20 is arranged in a recess 14 of a first element 10, which is formed in this embodiment as a plastic component.
  • the second element 20 is partially disposed in the recess 14 of the first element 10 and thus partially enclosed by this.
  • the first and second elements 10 and 20 can be provided prefabricated or the first element 10 is injected, for example, in the context of an injection molding process or around the second element 20.
  • the first and second elements 10 and 20 each have a first region 11 and 21 and a second region 12 and 22.
  • the respective first region 11 and 21 is in contact with the respective other first region 21 and 11, so that the first regions 11 and 21 realize a contact region between the two elements 10 and 20.
  • the respective second regions 12 and 22 are exposed so that these second regions 12 and 22 are not in contact with the other element 20 and 10, respectively.
  • the device 1 further comprises one or more interfaces 5, which is formed as a transition between the first and second elements 10 and 20. In other words, the
  • Interface 5 a range of surfaces of the first and second member 10 and 20 at which the contacting first portions 11 and 21 of the two elements 10 and 20 terminate and the exposed second portions 12 and 22 begin.
  • the interface 5 represents an area which may be sensitive to penetration of a surrounding medium and which accordingly must be reliably sealed.
  • the interface may constitute a region where a reliable electrical connection between the first element 10 and the second element 20 is to be provided.
  • the electrically conductive connection layer 3 can also act as a sealing layer and damage such as cracking or cracking and an undesirable input and / or
  • the device 1, more particularly the first element 10, further comprises a circuit portion 16 which is spaced from the region of the interface 5, but connected to the region of the interface 5.
  • the circuit region 16 is formed for example in the form of interconnects and is therefore intended to produce a circuit layout on which electrical components, such as resistors, capacitors,
  • Diodes, etc. can be attached, which can bridge the tracks.
  • the circuit region 16 must therefore be electrically connected to the second element 10 designed as an electrical conductor.
  • the circuit region 16 is arranged, for example, on a side surface of the substantially cuboid-shaped first element 10. However, in other embodiments, the circuit portion 16 may be provided at any suitable position in or on the second member 16.
  • electrically conductive Additives are introduced into the region of the interface 5 and / or into the circuit region 16 in the first element 10, which allow a chemical and / or galvanic deposition of a given material and forming the electrically conductive connection layer 3 and / or sealing layer.
  • electrically conductive additives can take place in a further step of the method or the electrically conductive additives have already been introduced in the embodiment of the first element 10.
  • the first element 10 is produced by means of an injection molding process, so that the desired additives have already been admixed with the raw material to be sprayed on.
  • the additives on the surface of the first element 10 are thermally and / or mechanically, for
  • the additives are preferably exposed in the circuit area 16 such that the shape of a desired and suitable circuit layout is formed.
  • a plurality of elongated strips may be produced in the form of recesses that are not directly in communication with one another.
  • at least one of the plurality of strips is connected to the exposed portion of the interface 5, so that in a later step, the electrically conductive connection layer 3 can be formed.
  • the exposed additives act as carrier particles and act as seed cells for the trainee electrically conductive connection layer 3 and are advantageously but not necessarily formed of the same material as that from ⁇ zuscheidende material.
  • the additives Kup ⁇ ferpitate that the raw material of the first element 10 prior to Training were mixed as a plastic component. They act as mechanical anchors for the chemical and / or galvanic deposition of the given material.
  • the formed electrically conductive connection layer 3 can be further reinforced, for example, by means of electrodeposition, a further metal layer in the region of the interface 5 and / or in the
  • Circuit area 16 is applied.
  • the electrically conductive connection layer 3 can thus be of multilayer construction and can comprise, for example, a copper and a gold layer. Alternatively or additionally, other materials such as silver and / or copper can also be applied by means of chemical and / or galvanic deposition.
  • FIGS. 2A to 2C show a further exemplary embodiment of steps of a method for producing a device 1 for a motor vehicle, which comprises one or more electrically conductive connecting layers 3 and / or sealing layers 3, which are formed by chemical and / or galvanic deposition.
  • a method for producing a device 1 for a motor vehicle which comprises one or more electrically conductive connecting layers 3 and / or sealing layers 3, which are formed by chemical and / or galvanic deposition.
  • FIG. 2A shows a perspective view of various positions in the context of a manufacturing process of the device 1.
  • FIG. 2B illustrates cross sections corresponding to the positions shown in FIG. 2A.
  • FIG. 2C, corresponding to FIG. 2B shows enlarged views of marked regions X, Y and Z.
  • FIG. In contrast to the exemplary embodiment of the device 1 illustrated in FIGS.
  • the second element 20 does not completely penetrate the first element in this exemplary embodiment.
  • a device 1 is realized in which the second element 20 only partially penetrates the first element 10 and an interface 5 is formed on an upper or lower side of the first and second elements 10 and 20, respectively.
  • the interface can be sealed by forming a respective bonding layer 3 and / or sealing layer.
  • this embodiment represents a reli ⁇ permeable sealing of penetrating into a plastic component and / or teilumspritzte metallic conductors, which have, in particular in relation to motor vehicles, a need for a reli ⁇ transmitting electrical connection and / or sealing, in the alternative joining and / or sealing methods often show no sufficient and / or long-lasting effect.
  • copper-containing conductor guides second element 20
  • first element 10 a plastic housing
  • the method described realizes a sealing method and / or connection method in which, for example, an arbitrarily shaped conductor (second element 20) with a significant copper content is injection-molded by an injection molding process with a thermoplastic material (first element 10). In this way, the first element 10 is formed around the second element 20, wherein prior to the injection molding process
  • Plastic raw material, such as granules, for ⁇ from the first element 10 is predetermined offset with copper particles, which distribute evenly in the injection molding during the injection molding (first element 10). Due to the injection molding, the additives are üb ⁇ SHORT- not found on the surface of the formed first element 10, so that the surface of the first Elements 10 is thermally and / or mechanically treated in the region of the interface 5 and the scarf ⁇ area 16 and the copper particles are exposed. Subsequently, for example, copper is chemically deposited and it forms on the plastic component (first element 10) in the region of the interface 5 and in the circuit region 16 on or on the exposed metal particles, the connecting layer 3, which may alternatively be a sealing layer or additionally as a sealing layer can work.
  • the connecting layer 3 which may alternatively be a sealing layer or additionally as a sealing layer can work.
  • the connecting layer 3 also deposits on the metallic conductor (second element 20) and covers it completely, provided that the exposed second region 22 of the second element 20 is arranged in the area of influence of the chemical and / or galvanic deposition.
  • the chemically from ⁇ divorced compound layer 3 can be further coated by galvanic ⁇ African depositing and forming a further metal layer, so that a stable compound layer is realized 3, then an additionally comprises corrosion protection, for example, and a particularly reliable From ⁇ seal is forming.
  • a sealing of plastic ⁇ coated metal bushings, in which the metallic connection partner may appear in its ur- or reshaped shape or non-chipping processing and a plastic blank subsequently penetrates by mechanical and / or thermal influence or by a further forming process, such as encapsulation or encapsulation of Plastic is enclosed.
  • the plastic (first element 10) is at least locally in the region of the interface 5.
  • the plastic (first element 10) is preferably at least locally in the region of the interface 5 and in the circuit region 16 with additives of the same material of the enclosed metallic connection partner (second element 20). doped, which subsequently be chemically deposited in a galvanic bath. Examples of such metal-plastic composites are injection-molded lead frames, wires or milled parts as electrical feedthrough and insulated cables.
  • prefabricated material connections can be sealed, so that a reliable seal and secure attachment of prefixed material partners, for example inserted plastic bodies (first element 10) on metal ⁇ bodies (second element 20) or vice versa, by means of be ⁇ written method is achieved.
  • predetermined material pairings can be reliably electrically connected to each other by means of chemical and / or galvanic deposition of corresponding material particles and / or sealed resistant to resistance.
  • the connecting layer 3 by forming the connecting layer 3, a complex positive connection is created between the activated, microrough surfaces of the first element 10 and the additives embedded and enclosed therein.
  • a material connection of the one or more applied layers of the electrically conductive connection layer 3 and the first or even both elements 10 and 20 is created.
  • adjacent media can be prevented from entering through the interface 5 between the material pairing of first and second elements 10 and 20 and the two elements 10 and 20 are efficiently electrically connected to each other, with no limit to the configuration of the shape of the circuit portion 16.
  • the electrically conductive connection layer 3 may compensate com- due to their training higher mechanical and thermal stresses and also has a higher chemical Bestän ⁇ speed, as an alternative connection methods, such as routing ⁇ adhesive, bonding, and elastic connection elements and / or sealing methods.
  • connection methods such as routing ⁇ adhesive, bonding, and elastic connection elements and / or sealing methods.
  • the material partners optionally have the same material properties, but have not been produced in the same original forming process, such as the molding or spraying of the second member 20 with the first element 10.
  • such material pairings have been made in the context of a two-stage casting or a press fit ,

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé, destiné à étanchéifier et/ou relier électriquement des composants d'un véhicule automobile, comprenant la production d'un premier élément (10) et d'un second élément (20) disposé dans un évidement (14) du premier élément (10). Le procédé comprend en outre l'introduction d'additifs électriquement conducteurs dans le premier élément (10) au niveau d'une interface (5) réalisée sous la forme d'une transition entre les premier et second éléments (10, 20). Le procédé comprend en outre le dénudage de l'interface (5) entre le premier élément (10) et le second élément (20). En outre, le procédé comprend le dépôt chimique d'une matière prédéterminée et de cette manière la formation d'une couche d'étanchéité et/ou d'une couche de liaison (3) électriquement conductrice sur le premier élément (10) et le second élément (20) et donc l'étanchéification de l'interface (5) et/ou la réalisation de la liaison électrique entre le premier élément (10) et le second élément (20).
EP16797521.8A 2015-12-11 2016-11-15 Procédé pour étanchéifier et/ou relier électriquement des composants d'un véhicule automobile et dispositif pour un véhicule automobile Withdrawn EP3387887A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015225026.1A DE102015225026A1 (de) 2015-12-11 2015-12-11 Verfahren zum Abdichten von Komponenten für ein Kraftfahrzeug und Vorrichtung für ein Kraftfahrzeug
DE102016202589.9A DE102016202589A1 (de) 2016-02-19 2016-02-19 Verfahren zum elektrischen Verbinden von Komponenten für ein Kraftfahrzeug und Vorrichtung für ein Kraftfahrzeug
PCT/EP2016/077674 WO2017097547A1 (fr) 2015-12-11 2016-11-15 Procédé pour étanchéifier et/ou relier électriquement des composants d'un véhicule automobile et dispositif pour un véhicule automobile

Publications (1)

Publication Number Publication Date
EP3387887A1 true EP3387887A1 (fr) 2018-10-17

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Application Number Title Priority Date Filing Date
EP16797521.8A Withdrawn EP3387887A1 (fr) 2015-12-11 2016-11-15 Procédé pour étanchéifier et/ou relier électriquement des composants d'un véhicule automobile et dispositif pour un véhicule automobile

Country Status (2)

Country Link
EP (1) EP3387887A1 (fr)
WO (1) WO2017097547A1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19731346C2 (de) 1997-06-06 2003-09-25 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und ein Verfahren zu deren Herstellung
WO2003005784A2 (fr) 2001-07-05 2003-01-16 Lpkf Laser & Electronics Ag Structures de traces conducteurs et procede permettant de les produire
TWI505552B (zh) * 2012-06-01 2015-10-21 Wistron Neweb Corp 天線結構之製造方法
WO2014204494A1 (fr) * 2013-06-21 2014-12-24 Laird Technologies, Inc. Ensembles antennes véhiculaires mimo multibandes

Also Published As

Publication number Publication date
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