EP3346806A1 - Atmospheric-pressure plasma generation device - Google Patents
Atmospheric-pressure plasma generation device Download PDFInfo
- Publication number
- EP3346806A1 EP3346806A1 EP15903005.5A EP15903005A EP3346806A1 EP 3346806 A1 EP3346806 A1 EP 3346806A1 EP 15903005 A EP15903005 A EP 15903005A EP 3346806 A1 EP3346806 A1 EP 3346806A1
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- Prior art keywords
- plasma
- emitting device
- cylindrical section
- section
- processing gas
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- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 34
- 239000011521 glass Substances 0.000 description 6
- 210000000988 bone and bone Anatomy 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
- H05H1/2443—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes the plasma fluid flowing through a dielectric tube
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
- H05H1/4645—Radiofrequency discharges
- H05H1/466—Radiofrequency discharges using capacitive coupling means, e.g. electrodes
Definitions
- the present invention relates to an atmospheric pressure plasma generating device that emits plasma from an emission port.
- Patent literature 1 JP-A-2012-059548
- the atmospheric plasma generating device disclosed in the above patent literature, it is possible to perform plasma processing on a target body. However, because it is not possible to check plasma visually, there are cases in which plasma is not applied appropriately to the target body.
- the present invention takes account of such circumstances and an object thereof is to appropriately apply plasma to a target body.
- an atmospheric pressure plasma generating device disclosed herein is provided with an emission port from which plasma is emitted, and an emitting device that emits lights in the emission direction of the plasma from the emission port.
- the disclosed atmospheric pressure plasma generating device With the disclosed atmospheric pressure plasma generating device, light is emitted in the emission direction of the plasma from the emission port. Accordingly, due to the light, it is possible to visually check the plasma emission position, and it is possible to appropriately apply plasma to a target body.
- Fig. 1 shows an embodiment of the present invention, plasma emitting device 10.
- Plasma emitting device 10 is for emitting plasma to a target body.
- Plasma emitting device 10 is provided with main body section 12, pair of electrodes 14 and 16, glass pipe 18, gas supply device 20, and laser emitting device 22.
- Main body section 12 is formed from sapphire glass and is configured from cylindrical section 23 and bent section 24.
- Cylindrical section 23 is substantially a round tube.
- Bent section 24 is bent into an L-shape, and an end section thereof is connected in an upright state to an outer surface of cylindrical section 23 near the other end of cylindrical section 23. Note that, the inside of cylindrical section 23 and the inside of bent section 24 are linked.
- electrode 14 includes multiple electrical discharge sections 26 and connecting sections 30, and electrode 16 includes multiple electrical discharge sections 28 and connecting sections 32.
- fig. 2 is a theoretical view showing electrodes 14 and 16 removed from cylindrical section 23.
- the multiple electrical discharge sections 26 of electrode 14 are vacuum deposited on the outer circumferential surface of cylindrical section 23 extending in the circumferential direction, and are arranged at a specified interval lined up in the axis direction of cylindrical section 23.
- connecting sections 30 of electrode 14 are vacuum deposited on the outer circumferential surface of cylindrical section 23 extending in a line in the axis direction of cylindrical section 23, and are connected to the multiple electrical discharge sections 26.
- electrical discharge section 26 positioned at one end is vacuum deposited around the entire circumference in the circumferential direction of cylindrical section 23; the other electrical discharge sections 26 are vacuum deposited extending in the circumferential direction of cylindrical section 23, except for a portion on the opposite side to connecting section 30.
- current passing section 36 is formed on the electrical discharge section 26 vacuum deposited across the entire circumference in the circumferential direction of cylindrical section 23 protruding from an end of cylindrical section 23.
- the multiple electrical discharge sections 28 of electrode 16 are vacuum deposited on the outer circumferential surface of cylindrical section 23 extending in the circumferential direction, and are arranged lined up in the axis direction of cylindrical section 23 so as to be positioned between the multiple electrical discharge sections 26 of electrode 14. Note that, from among the multiple electrical discharge sections 28 of electrode 16, electrical discharge sections 28 positioned between two of the electrical discharge sections 26 of electrode 14 are vacuum deposited extending in the circumferential direction of cylindrical section 23 excluding connecting section 30 of electrode 14; the remaining electrical discharge sections 28 positioned at the ends are vacuum deposited across the entire circumference in the circumferential direction of cylindrical section 23.
- Current passing section 38 is formed on the electrical discharge section 28 vacuum deposited across the entire circumference in the circumferential direction of cylindrical section 23 protruding from an end of cylindrical section 23.
- connecting sections 32 of electrode 16 are vacuum deposited on the outer circumferential surface of cylindrical section 23 extending in a line in the axis direction of cylindrical section 23 at locations where electrical discharge sections 26 of electrode 14 are not vacuum deposited, and are connected to the multiple electrical discharge sections 28.
- the pair of electrodes 14 and 16 have electrical discharge sections 26 of electrode 14 and electrical discharge sections 28 of electrode 16 vacuum deposited on the outer circumferential surface of cylindrical section 23 lined up alternately with a specified gap between them.
- glass tube 18 is arranged on the outer circumferential surface of cylindrical section 23 of main body section 12 so as to entirely cover the pair of electrodes 14 and 16 vacuum deposited on the outer circumferential surface of main body section 12.
- electrodes 14 and 16 are encased by glass pipe 18, glass pipe 18 encroaches in between electrical discharge sections 26 of electrode 14 and electrical discharge sections 28 of electrode 16.
- Gas supply device 20 supplies processing gas and is connected to an end of bent section 24 opposite to an end of bent section that is connected to cylindrical section 23.
- processing gas is supplied inside cylindrical section 23 via bent section 24.
- processing gas may be gas in which an inert gas such as nitrogen is mixed with active gases in the air such as oxygen at a given ratio, or may be only an inert gas, or only air.
- gas supply device 20 may also be provided with a function to heat or cool the processing gas, such that processing gas can be supplied at a given temperature.
- Laser emitting device 22 emits laser light and is substantially a short cylinder. An end surface of laser emitting device 22 is axially connected to an end surface of cylindrical section 23 at which bent section 24 is arranged. Note that, laser emitting device 22 is removably attached to cylindrical section 23. Also, in a central portion of the end surface of laser emitting device 22 connected to cylindrical section 23, emitting hole 40 (refer to fig. 2 ) is formed, and laser emitting device 22 emits laser light from emitting hole 40 in an axial direction of cylindrical section 23. Note that, the laser light is laser light of long wavelength visible light and of an ultraviolet region.
- laser emitting device 50 different to laser emitting device 22 is prepared.
- Laser emitting device 50 has the same dimensions as laser emitting device 22, such that by removing laser emitting device 22 from cylindrical section 23, laser emitting device 50 can be connected to cylindrical section 23 instead of laser emitting device 22. Note that, similar to laser emitting device 22, laser emitting device 50 emits laser light, but the laser light emitted by laser emitting device 50 is long wavelength visible light that does not include ultraviolet light.
- plasma emitting device 10 emits plasma from an end of cylindrical section 23, so as to apply plasma to a target body.
- processing gas from gas supply device 20 is supplied inside cylindrical section 23 via bent section 24. Because the end of cylindrical section 23 on which bent section 24 is arranged is covered by laser emitting device 22, processing gas supplied to cylindrical section 23 flows from that end towards the opposite end. That is, processing gas flows towards the inside of cylindrical section 23 on which electrodes 14 and 16 are vacuum deposited.
- current passing sections 36 and 38 apply voltage to electrodes 14 and 16, such that current flows through electrodes 14 and 16.
- electrical discharge is generated between electrical discharge sections 26 and 28 of the pair of electrodes 14 and 16.
- electrodes 14 and 16 are encased by glass pipe 18, which is an insulating body, electrical discharge is generated inside cylindrical section 23 such that the processing gas flowing inside cylindrical section 23 is plasmarized.
- plasma is emitted in an axial direction of cylindrical section 23 from an opening (also referred to as an "emission port") of cylindrical section 23 formed in an end surface of cylindrical section 23 opposite to an end of cylindrical section 23 to which laser emitting device 22 is connected.
- plasma is applied to a target body arranged along the line of the emission direction of the plasma.
- plasma emitting device 10 is provided with laser emitting device 22, and by the laser light emitted by laser emitting device 22, the emission position of plasma can be checked.
- laser emitting device 22 is connected to an end surface of cylindrical section 23, and emits laser light in an axial direction of cylindrical section 23. That is, laser emitting device 22 emits laser light axially to the emission direction of plasma. Also, laser light is directional light that travels straight. Thus, the laser light emitted from laser emitting device 22 passes through cylindrical section 23 and is emitted from the emission port of cylindrical section 23 axially to the emission direction of the plasma. Thus, the laser light is emitted at a location at which plasma is applied to the target body. Because the wavelength of the laser light applied to the target body includes a wavelength is a visible range, an operator can visually check the laser light. Thus, due to the laser light, an operator can check the emission position of the plasma to ensure that plasma is appropriately applied to the target body.
- laser emitting device 22 is arranged at an upstream location to where the processing gas is plasmarized.
- processing gas is supplied inside cylindrical section 23 from gas supply device 20 via bent section 24. And, processing gas supplied inside cylindrical section 23 flows towards the emission port.
- the processing gas is plasmarized between a location where bent section 24 is connected to cylindrical section 23 and the emission port.
- Laser emitting device 22 is connected to the end of cylindrical section 23 opposite to the emission port.
- laser emitting device 22 is arranged at an upstream location to where the processing gas is plasmarized. Therefore, laser emitting device 22 is exposed to processing gas, but is not exposed to plasma. This prevents plasma being applied to laser emitting device 22.
- emitting of plasma by plasma emitting device 10 is performed after the emission location is confirmed by laser light.
- laser light is emitted by laser emitting device 22.
- supply of processing gas from gas supply device 20 and applying of voltage to electrodes 14 and 16 are not being performed.
- an operator points the emission port of cylindrical section 23 towards the target body to align the planned plasma emitting position with the laser light.
- processing gas is supplied by gas supply device 20, and voltage is supplied to electrodes 14 and 16.
- Plasma includes reactive oxygen radicals, and the target body to which plasma is applied is activated at the surface, such that plasma can be applied to a target body for various purposes.
- skin can be activated by applying plasma to the skin for the purpose of generating the skin.
- the surface of the bone becomes more hydrophilic, which improves bonding strength of adhesive.
- plasma can be applied for the purpose of bonding bone.
- plasma can be applied for the purposes of surface processing and surface improvement of metals or the like. In this manner, technology for applying plasma is used in various fields.
- the emission temperature of the plasma is adjusted depending on the purpose of applying plasma. Specifically, for example, in a case of applying plasma to regenerate skin, processing gas with a relatively low temperature is supplied by gas processing device 20. Therefore, the emission temperature of the plasma can be made appropriate for applying to skin. Also, for example, in a case of applying plasma to bone, metal, or the like, processing gas with a relatively high temperature is supplied by gas supply device 20. Thus, the emission temperature of the plasma is high, and effective plasma processing can be performed.
- laser emitting device 22 emits laser light of long wavelength visible light and of an ultraviolet region.
- the surface of the target body to which the laser light is applied is activated by ultraviolet light. That is, the surface of the target body is also activated by the laser light that is used for checking the emission position of the plasma.
- the surface of the target body can be activated by the laser light and the plasma, such that effective surface processing can be performed on the target body.
- Laser emitting device 50 emits laser light of long wavelength visible light that does not include does not include ultraviolet light. Thus, it is possible apply laser light and to check the emission position of plasma even for a target body to which it is not desirable to apply ultraviolet light.
- Figs. 3 and 4 show a second embodiment, plasma emitting device 70.
- Plasma emitting device 70 is provided with main body section 72, earth plate 74, emitting nozzle 76, pair of electrodes 78 and 80, and laser emitting device 82.
- the main sections of plasma emitting device 70 are shown as transparent, and fig. 4 is a cross section along the line A-A of fig. 3 .
- laser emitting device 82 is not shown in fig. 3 .
- Main body section 72 is approximately cuboid, and is formed from a ceramic.
- Reaction chamber 86 is formed inside main body section 72.
- Four first flow paths 88 are formed at a bottom surface of reaction chamber 86 extending down. Note that, first flow paths 88 do not open to the lower surface of main body section 72.
- second flow paths 90 that open to the front surface of main body section 72 are formed in main body 72 from the lower end of first flow paths 88. The end of second flow paths 90 on the front side of main body section 72 are blocked by plugs 96.
- third flow paths 98 that pierce second flow paths 90 in a vertical direction between both ends of flow paths 90 are formed in main body section 72. Note that, an upper end section of third flow path 98 does not open at a top surface of main body section 72, but a lower end of third flow path does open on a lower surface of main body section 72.
- Earth plate 74 is formed from metal, and is fixed to a lower surface of main body section 72.
- Four through-holes 100 that run in a vertical direction are formed in earth plate 74, with through-holes 100 being connected to third flow paths 98 of main body section 72 in a coaxial manner.
- Emitting nozzle 76 is fixed to a lower surface of earth plate 74.
- Four nozzle holes 102 that run in a vertical direction are formed in emitting nozzle 76, with nozzle holes 102 being connected to through-holes 100 of earth plate 74 in a coaxial manner.
- the pair of electrodes 78 and 80 are rod shaped, and are inserted into reaction chamber 86 in a state separated from each other.
- laser emitting device 82 is arranged inside main body section 72 and is connected to an upper end of third flow path 98.
- Laser emitting device 82 is a device for emitting laser light, and emits laser light in an axial direction of third flow path 98.
- plasma emitting device 70 emits laser light from an opening (also referred to as emission port) at the lower end of nozzle hole 102 of emitting nozzle 76, and that laser light is used to emit plasma to a planned plasma emission position.
- laser light is emitted by laser emitting device 82 along an axial direction of third flow path 98.
- laser light is emitted from the emission port via third flow path 98, through-hole 100, and nozzle hole 102.
- an operator points the emission port towards the target body to align the laser light with the planned plasma emitting position.
- processing gas is supplied to reaction chamber 86, and voltage is applied to the pair of electrodes 78 and 80.
- voltage is applied to the pair of electrodes 78 and 80.
- the processing gas is plasmarized by the electrical discharge.
- the plasma is emitted from the emission port via first flow path 88, second flow path 90, through-hole 100, and nozzle hole 102.
- the emission direction of the plasma is the axial direction of second flow path 90, through-hole 100, and nozzle hole 102.
- plasma is emitted towards the laser light being applied to the target body.
- second embodiment plasma emitting device 70 too, similar to with first embodiment plasma emitting device 10, the plasma emission position can be checked with the laser light, and plasma can be appropriately applied to the planned plasma emission position.
- plasma emitting device 10 is an example of an atmospheric pressure plasma generator.
- Main body section 12 is an example of a flow path.
- Electrodes 14 and 16 are examples of an electrode.
- Gas supply device 20 is an example of a supply device.
- Laser emitting device 22 is an example of an emitting device.
- Laser emitting device 50 is an example of an emitting device.
- Plasma emitting device 70 is an example of an atmospheric pressure plasma device.
- Electrodes 78 and 80 are examples of an electrode.
- Laser emitting device 82 is an example of an emitting device.
- First flow path 88, second flow path 90, through-hole 100, and nozzle hole 102 are examples of a flow path.
- laser light is used as a light emitted to the target body, but various types of light may be used, so long as the light is visible.
- 10 plasma emitting device (atmospheric pressure plasma generator); 12: main body section (flow path); 14: electrode; 16: electrode; 20: gas supply device (supply device); 22: laser emitting device (emitting device); 50: laser emitting device (emitting device);70: plasma emitting device (atmospheric pressure plasma generator); 78: electrode; 80: electrode; 82: laser emitting device (emitting device); 88: first flow path (flow path); 90: second flow path (flow path); 100: through-hole (flow path); 102: nozzle hole (flow path)
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- Spectroscopy & Molecular Physics (AREA)
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Abstract
Description
- The present invention relates to an atmospheric pressure plasma generating device that emits plasma from an emission port.
- With an atmospheric pressure generating device, by emitting plasma from an emission port towards a target body, plasma is applied to the target body such that processing is performed. An example of a plasma generating device is disclosed in the patent literature below.
- Patent literature 1:
JP-A-2012-059548 - According to the atmospheric plasma generating device disclosed in the above patent literature, it is possible to perform plasma processing on a target body. However, because it is not possible to check plasma visually, there are cases in which plasma is not applied appropriately to the target body. The present invention takes account of such circumstances and an object thereof is to appropriately apply plasma to a target body.
- To solve the above problems, an atmospheric pressure plasma generating device disclosed herein is provided with an emission port from which plasma is emitted, and an emitting device that emits lights in the emission direction of the plasma from the emission port.
- With the disclosed atmospheric pressure plasma generating device, light is emitted in the emission direction of the plasma from the emission port. Accordingly, due to the light, it is possible to visually check the plasma emission position, and it is possible to appropriately apply plasma to a target body.
-
- [
Fig. 1 ]
Fig. 1 is a perspective view showing a plasma emitting device of a first embodiment. - [
Fig. 2 ]
Fig. 2 is an exploded view of the plasma emitting device offig. 1 . - [
Fig. 3 ]
Fig. 3 is a perspective view showing a plasma emitting device of a second embodiment. - [
Fig. 4 ]
Fig. 4 is a cross section of line AA shown infig. 3 . - The following describes in detail referring to the figures an example embodiment of the present invention.
-
Fig. 1 shows an embodiment of the present invention,plasma emitting device 10.Plasma emitting device 10 is for emitting plasma to a target body.Plasma emitting device 10 is provided withmain body section 12, pair ofelectrodes glass pipe 18,gas supply device 20, andlaser emitting device 22. -
Main body section 12 is formed from sapphire glass and is configured fromcylindrical section 23 andbent section 24.Cylindrical section 23 is substantially a round tube.Bent section 24 is bent into an L-shape, and an end section thereof is connected in an upright state to an outer surface ofcylindrical section 23 near the other end ofcylindrical section 23. Note that, the inside ofcylindrical section 23 and the inside ofbent section 24 are linked. - Also, multiple
electrical discharge sections electrodes cylindrical section 23 ofmain body section 12 so as to be lined up alternately in an axis direction ofcylindrical section 23. In detail, as shown infig. 2 ,electrode 14 includes multipleelectrical discharge sections 26 and connectingsections 30, andelectrode 16 includes multipleelectrical discharge sections 28 and connectingsections 32. Note that,fig. 2 is a theoreticalview showing electrodes cylindrical section 23. - The multiple
electrical discharge sections 26 ofelectrode 14 are vacuum deposited on the outer circumferential surface ofcylindrical section 23 extending in the circumferential direction, and are arranged at a specified interval lined up in the axis direction ofcylindrical section 23. Also, connectingsections 30 ofelectrode 14 are vacuum deposited on the outer circumferential surface ofcylindrical section 23 extending in a line in the axis direction ofcylindrical section 23, and are connected to the multipleelectrical discharge sections 26. Note that, from among the multipleelectrical discharge sections 26 ofelectrode 14,electrical discharge section 26 positioned at one end is vacuum deposited around the entire circumference in the circumferential direction ofcylindrical section 23; the otherelectrical discharge sections 26 are vacuum deposited extending in the circumferential direction ofcylindrical section 23, except for a portion on the opposite side to connectingsection 30. Also,current passing section 36 is formed on theelectrical discharge section 26 vacuum deposited across the entire circumference in the circumferential direction ofcylindrical section 23 protruding from an end ofcylindrical section 23. - Further, the multiple
electrical discharge sections 28 ofelectrode 16 are vacuum deposited on the outer circumferential surface ofcylindrical section 23 extending in the circumferential direction, and are arranged lined up in the axis direction ofcylindrical section 23 so as to be positioned between the multipleelectrical discharge sections 26 ofelectrode 14. Note that, from among the multipleelectrical discharge sections 28 ofelectrode 16,electrical discharge sections 28 positioned between two of theelectrical discharge sections 26 ofelectrode 14 are vacuum deposited extending in the circumferential direction ofcylindrical section 23 excluding connectingsection 30 ofelectrode 14; the remainingelectrical discharge sections 28 positioned at the ends are vacuum deposited across the entire circumference in the circumferential direction ofcylindrical section 23.Current passing section 38 is formed on theelectrical discharge section 28 vacuum deposited across the entire circumference in the circumferential direction ofcylindrical section 23 protruding from an end ofcylindrical section 23. Also, connectingsections 32 ofelectrode 16 are vacuum deposited on the outer circumferential surface ofcylindrical section 23 extending in a line in the axis direction ofcylindrical section 23 at locations whereelectrical discharge sections 26 ofelectrode 14 are not vacuum deposited, and are connected to the multipleelectrical discharge sections 28. Thus, the pair ofelectrodes electrical discharge sections 26 ofelectrode 14 andelectrical discharge sections 28 ofelectrode 16 vacuum deposited on the outer circumferential surface ofcylindrical section 23 lined up alternately with a specified gap between them. - As shown in
fig. 1 ,glass tube 18 is arranged on the outer circumferential surface ofcylindrical section 23 ofmain body section 12 so as to entirely cover the pair ofelectrodes main body section 12. By this, it is possible to prevent exposure ofelectrodes electrodes glass pipe 18,glass pipe 18 encroaches in betweenelectrical discharge sections 26 ofelectrode 14 andelectrical discharge sections 28 ofelectrode 16. -
Gas supply device 20 supplies processing gas and is connected to an end ofbent section 24 opposite to an end of bent section that is connected tocylindrical section 23. Thus, processing gas is supplied insidecylindrical section 23 viabent section 24. Note that, processing gas may be gas in which an inert gas such as nitrogen is mixed with active gases in the air such as oxygen at a given ratio, or may be only an inert gas, or only air. Also,gas supply device 20 may also be provided with a function to heat or cool the processing gas, such that processing gas can be supplied at a given temperature. -
Laser emitting device 22 emits laser light and is substantially a short cylinder. An end surface oflaser emitting device 22 is axially connected to an end surface ofcylindrical section 23 at whichbent section 24 is arranged. Note that,laser emitting device 22 is removably attached tocylindrical section 23. Also, in a central portion of the end surface oflaser emitting device 22 connected tocylindrical section 23, emitting hole 40 (refer tofig. 2 ) is formed, andlaser emitting device 22 emits laser light from emittinghole 40 in an axial direction ofcylindrical section 23. Note that, the laser light is laser light of long wavelength visible light and of an ultraviolet region. - Also, as shown in
fig. 2 ,laser emitting device 50 different tolaser emitting device 22 is prepared.Laser emitting device 50 has the same dimensions aslaser emitting device 22, such that by removinglaser emitting device 22 fromcylindrical section 23,laser emitting device 50 can be connected tocylindrical section 23 instead oflaser emitting device 22. Note that, similar tolaser emitting device 22,laser emitting device 50 emits laser light, but the laser light emitted bylaser emitting device 50 is long wavelength visible light that does not include ultraviolet light. - According to the above configuration,
plasma emitting device 10 emits plasma from an end ofcylindrical section 23, so as to apply plasma to a target body. In detail, processing gas fromgas supply device 20 is supplied insidecylindrical section 23 viabent section 24. Because the end ofcylindrical section 23 on whichbent section 24 is arranged is covered bylaser emitting device 22, processing gas supplied tocylindrical section 23 flows from that end towards the opposite end. That is, processing gas flows towards the inside ofcylindrical section 23 on whichelectrodes - Then, current passing
sections electrodes electrodes electrical discharge sections electrodes electrodes glass pipe 18, which is an insulating body, electrical discharge is generated insidecylindrical section 23 such that the processing gas flowing insidecylindrical section 23 is plasmarized. Thus, plasma is emitted in an axial direction ofcylindrical section 23 from an opening (also referred to as an "emission port") ofcylindrical section 23 formed in an end surface ofcylindrical section 23 opposite to an end ofcylindrical section 23 to whichlaser emitting device 22 is connected. Thus, plasma is applied to a target body arranged along the line of the emission direction of the plasma. - However, because the wavelength of the plasma is in a vacuum ultraviolet range, it cannot be checked visually. Therefore, there are cases in which plasma is not applied appropriately to the target body. Considering this point,
plasma emitting device 10 is provided withlaser emitting device 22, and by the laser light emitted bylaser emitting device 22, the emission position of plasma can be checked. - In detail, as described above,
laser emitting device 22 is connected to an end surface ofcylindrical section 23, and emits laser light in an axial direction ofcylindrical section 23. That is,laser emitting device 22 emits laser light axially to the emission direction of plasma. Also, laser light is directional light that travels straight. Thus, the laser light emitted fromlaser emitting device 22 passes throughcylindrical section 23 and is emitted from the emission port ofcylindrical section 23 axially to the emission direction of the plasma. Thus, the laser light is emitted at a location at which plasma is applied to the target body. Because the wavelength of the laser light applied to the target body includes a wavelength is a visible range, an operator can visually check the laser light. Thus, due to the laser light, an operator can check the emission position of the plasma to ensure that plasma is appropriately applied to the target body. - Also, with
plasma emitting device 10,laser emitting device 22 is arranged at an upstream location to where the processing gas is plasmarized. In detail, processing gas is supplied insidecylindrical section 23 fromgas supply device 20 viabent section 24. And, processing gas supplied insidecylindrical section 23 flows towards the emission port. Here, the processing gas is plasmarized between a location wherebent section 24 is connected tocylindrical section 23 and the emission port.Laser emitting device 22 is connected to the end ofcylindrical section 23 opposite to the emission port. Thus,laser emitting device 22 is arranged at an upstream location to where the processing gas is plasmarized. Therefore,laser emitting device 22 is exposed to processing gas, but is not exposed to plasma. This prevents plasma being applied tolaser emitting device 22. - Note that, emitting of plasma by
plasma emitting device 10 is performed after the emission location is confirmed by laser light. In detail, first, laser light is emitted bylaser emitting device 22. Here, supply of processing gas fromgas supply device 20 and applying of voltage toelectrodes cylindrical section 23 towards the target body to align the planned plasma emitting position with the laser light. Once the planned plasma emitting position is aligned with the laser light, processing gas is supplied bygas supply device 20, and voltage is supplied toelectrodes - Plasma includes reactive oxygen radicals, and the target body to which plasma is applied is activated at the surface, such that plasma can be applied to a target body for various purposes. In detail, for example, in a medical field, skin can be activated by applying plasma to the skin for the purpose of generating the skin. Also, for example, by applying plasma to bone, the surface of the bone becomes more hydrophilic, which improves bonding strength of adhesive. Thus, plasma can be applied for the purpose of bonding bone. Further, for example, in an industrial field, plasma can be applied for the purposes of surface processing and surface improvement of metals or the like. In this manner, technology for applying plasma is used in various fields.
- Due to the above, the emission temperature of the plasma is adjusted depending on the purpose of applying plasma. Specifically, for example, in a case of applying plasma to regenerate skin, processing gas with a relatively low temperature is supplied by
gas processing device 20. Therefore, the emission temperature of the plasma can be made appropriate for applying to skin. Also, for example, in a case of applying plasma to bone, metal, or the like, processing gas with a relatively high temperature is supplied bygas supply device 20. Thus, the emission temperature of the plasma is high, and effective plasma processing can be performed. - Also, as described above,
laser emitting device 22 emits laser light of long wavelength visible light and of an ultraviolet region. Thus, the surface of the target body to which the laser light is applied is activated by ultraviolet light. That is, the surface of the target body is also activated by the laser light that is used for checking the emission position of the plasma. By this, the surface of the target body can be activated by the laser light and the plasma, such that effective surface processing can be performed on the target body. However, there are target bodies to which it is not desirable to apply ultraviolet light. Therefore, as described above, withplasma emitting device 10,laser emitting device 50 can be attached toplasma emitting device 10 instead oflaser emitting device 22.Laser emitting device 50 emits laser light of long wavelength visible light that does not include does not include ultraviolet light. Thus, it is possible apply laser light and to check the emission position of plasma even for a target body to which it is not desirable to apply ultraviolet light. -
Figs. 3 and 4 show a second embodiment,plasma emitting device 70.Plasma emitting device 70 is provided withmain body section 72,earth plate 74, emittingnozzle 76, pair ofelectrodes laser emitting device 82. Note that, infig. 3 , the main sections ofplasma emitting device 70 are shown as transparent, andfig. 4 is a cross section along the line A-A offig. 3 . Also, for clarity,laser emitting device 82 is not shown infig. 3 . -
Main body section 72 is approximately cuboid, and is formed from a ceramic.Reaction chamber 86 is formed insidemain body section 72. Fourfirst flow paths 88 are formed at a bottom surface ofreaction chamber 86 extending down. Note that,first flow paths 88 do not open to the lower surface ofmain body section 72. Also,second flow paths 90 that open to the front surface ofmain body section 72 are formed inmain body 72 from the lower end offirst flow paths 88. The end ofsecond flow paths 90 on the front side ofmain body section 72 are blocked byplugs 96. Further,third flow paths 98 that piercesecond flow paths 90 in a vertical direction between both ends offlow paths 90 are formed inmain body section 72. Note that, an upper end section ofthird flow path 98 does not open at a top surface ofmain body section 72, but a lower end of third flow path does open on a lower surface ofmain body section 72. -
Earth plate 74 is formed from metal, and is fixed to a lower surface ofmain body section 72. Four through-holes 100 that run in a vertical direction are formed inearth plate 74, with through-holes 100 being connected tothird flow paths 98 ofmain body section 72 in a coaxial manner. - Emitting
nozzle 76 is fixed to a lower surface ofearth plate 74. Four nozzle holes 102 that run in a vertical direction are formed in emittingnozzle 76, withnozzle holes 102 being connected to through-holes 100 ofearth plate 74 in a coaxial manner. - The pair of
electrodes reaction chamber 86 in a state separated from each other. Also,laser emitting device 82 is arranged insidemain body section 72 and is connected to an upper end ofthird flow path 98.Laser emitting device 82 is a device for emitting laser light, and emits laser light in an axial direction ofthird flow path 98. - According to such a construction,
plasma emitting device 70 emits laser light from an opening (also referred to as emission port) at the lower end ofnozzle hole 102 of emittingnozzle 76, and that laser light is used to emit plasma to a planned plasma emission position. In detail, first, laser light is emitted bylaser emitting device 82 along an axial direction ofthird flow path 98. Thus, laser light is emitted from the emission port viathird flow path 98, through-hole 100, andnozzle hole 102. Thereby, an operator points the emission port towards the target body to align the laser light with the planned plasma emitting position. - Continuing, processing gas is supplied to
reaction chamber 86, and voltage is applied to the pair ofelectrodes electrodes first flow path 88,second flow path 90, through-hole 100, andnozzle hole 102. Here, the emission direction of the plasma is the axial direction ofsecond flow path 90, through-hole 100, andnozzle hole 102. Thus, plasma is emitted towards the laser light being applied to the target body. In this manner, with second embodimentplasma emitting device 70, too, similar to with first embodimentplasma emitting device 10, the plasma emission position can be checked with the laser light, and plasma can be appropriately applied to the planned plasma emission position. - Note that,
plasma emitting device 10 is an example of an atmospheric pressure plasma generator.Main body section 12 is an example of a flow path.Electrodes Gas supply device 20 is an example of a supply device.Laser emitting device 22 is an example of an emitting device.Laser emitting device 50 is an example of an emitting device.Plasma emitting device 70 is an example of an atmospheric pressure plasma device.Electrodes Laser emitting device 82 is an example of an emitting device. First flowpath 88,second flow path 90, through-hole 100, andnozzle hole 102 are examples of a flow path. - Further, the present invention is not limited to the above example embodiments, and various changed or improved methods of embodiment are possible based on the knowledge of someone skilled in the art. Specifically, for example, in an embodiment above, laser light is used as a light emitted to the target body, but various types of light may be used, so long as the light is visible. However, to appropriately check the plasma emission position, it is desirable to use light with excellent straightness and convergence properties, that is, so-called directional light.
- 10: plasma emitting device (atmospheric pressure plasma generator); 12: main body section (flow path); 14: electrode; 16: electrode; 20: gas supply device (supply device); 22: laser emitting device (emitting device); 50: laser emitting device (emitting device);70: plasma emitting device (atmospheric pressure plasma generator); 78: electrode; 80: electrode; 82: laser emitting device (emitting device); 88: first flow path (flow path); 90: second flow path (flow path); 100: through-hole (flow path); 102: nozzle hole (flow path)
Claims (3)
- An atmospheric pressure plasma generating device comprising:an emission port from which plasma is emitted, andan emitting device that emits lights in the emission direction of the plasma from the emission port.
- The atmospheric pressure plasma generating device according to claim 1, including
a supply device configured to supply processing gas,
a flow path for the processing gas configured such that processing gas supplied from the supply device flows towards the emission port, and
an electrode for applying an electric current to the processing gas in the flow path such that plasma is generated,
wherein
the emitting device is provided further on an upstream side than a location of the flow path at which the processing gas is plasmarized by the electrode. - The atmospheric pressure plasma generator according to claim 1 or 2, including multiple of the emitting devices configured to emit light of different frequencies, wherein
any of the multiple emitting devices may be removably attached to the atmospheric pressure plasma generator.
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PCT/JP2015/074919 WO2017037885A1 (en) | 2015-09-02 | 2015-09-02 | Atmospheric-pressure plasma generation device |
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JP2604020B2 (en) * | 1988-10-11 | 1997-04-23 | 株式会社東芝 | Laser diagnostic equipment |
JPH06233778A (en) * | 1993-02-12 | 1994-08-23 | Terumo Corp | Laser system for laser diagnosis and treatment |
US5810841A (en) * | 1997-01-22 | 1998-09-22 | Minrad Inc. | Energy guided apparatus and method with indication of alignment |
US6890332B2 (en) * | 1999-05-24 | 2005-05-10 | Csaba Truckai | Electrical discharge devices and techniques for medical procedures |
US6374158B1 (en) * | 2000-02-15 | 2002-04-16 | General Electric Company | Robotic laser pointer |
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US7633231B2 (en) * | 2007-04-23 | 2009-12-15 | Cold Plasma Medical Technologies, Inc. | Harmonic cold plasma device and associated methods |
EP3062589A1 (en) * | 2007-08-06 | 2016-08-31 | Plasma Surgical Investments Limited | Pulsed plasma device |
US8758010B2 (en) * | 2008-07-18 | 2014-06-24 | Yoshida Creation Inc. | Dental clinical apparatus and plasma jet applying device for dentistry |
JP2011154951A (en) * | 2010-01-28 | 2011-08-11 | Hitachi Displays Ltd | Equipment and method for treating plasma |
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JPWO2017037885A1 (en) | 2018-06-21 |
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