EP3318831A1 - Micro-caloduc et son procédé de fabrication - Google Patents

Micro-caloduc et son procédé de fabrication Download PDF

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Publication number
EP3318831A1
EP3318831A1 EP15896788.5A EP15896788A EP3318831A1 EP 3318831 A1 EP3318831 A1 EP 3318831A1 EP 15896788 A EP15896788 A EP 15896788A EP 3318831 A1 EP3318831 A1 EP 3318831A1
Authority
EP
European Patent Office
Prior art keywords
pipe body
pipe
capillary structure
heat
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15896788.5A
Other languages
German (de)
English (en)
Other versions
EP3318831A4 (fr
Inventor
Chi-Te Chin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chin Chi Te
Original Assignee
Chin Chi Te
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chin Chi Te filed Critical Chin Chi Te
Publication of EP3318831A1 publication Critical patent/EP3318831A1/fr
Publication of EP3318831A4 publication Critical patent/EP3318831A4/fr
Withdrawn legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0225—Microheat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures

Definitions

  • the present disclosure relates to a heat dissipating device, and more particularly to a micro heat pipe and a method of manufacturing the same.
  • a heat pipe generally includes an enclosed pipe, a capillary structure disposed inside the enclosed pipe and formed by copper powder or metal mesh, and a working fluid filled in the enclosed pipe.
  • Taiwan patent No. 1447342 discloses a heat pipe having a composite capillary structure which is resulted from that the heat pipe is provided with an interior second pipe body having an additional capillary structure formed by copper powder and grooves.
  • Taiwan patent No. M499544 discloses a heat pipe having a plurality of capillary tissues.
  • the known heat pipes including the heat pipes disclosed in the aforesaid two patents, just have a 6 mm diameter.
  • no stable and effective technology can be used to manufacture the heat pipe having a diameter smaller than 3 mm.
  • the heat pipe having the diameter smaller than 3 mm is defined as the micro heat pipe in the present invention.
  • the first reason is that the existing method of forming the capillary structure is to sinter copper powder or dispose copper mesh on the pipe wall, or forming the grooves on the pipe wall by tube extrusion, and even use composite configuration (such as the two aforesaid patents). Because of the limitation of the space inside the micro heat pipe, it is very difficult and unpractical to dispose the copper powder or the copper mesh to form the capillary structure inside the micro heat pipe by the existing method.
  • the applied post-process may directly break the capillary structure, and it makes the working fluid hard to be smoothly guided backwards to a heat absorbing section of the heat pipe, which results in failure of the function of the heat pipe.
  • some conventional heat pipes have the capillary structure formed by grooves.
  • the grooves may be unlike the copper powder or the copper mesh not to occupy the space inside the heat pipe and not to cause reduction of diameter of the space.
  • the capillary structure formed by only grooves is hard to be processed as the pipe diameter become smaller.
  • the aforesaid post-process may also damage the capillary structure and cause the blocking of the working fluid, and it makes the failure of function of the heat pipe.
  • the thin pipe structure of the micro heat pipe always have extremely thin pipe wall, so how to form an effective capillary structure on such thin pipe wall of the thin pipe body becomes an important issue.
  • it is very hard to form the capillary structure inside the thin pipe body by manner of disposal of the grooves in the pipe, placement of copper powder or copper mesh in the pipe, or post-process, and no existing technology can effective solve this problem.
  • a primary objective of the present disclosure is to provide a micro heat pipe which is provided with etched patterns on an inner pipe wall thereof by etching.
  • the etched patterns serve as a first capillary structure of the present disclosure, so it is not necessary to extra add a layer of copper powder or copper mesh on the inner pipe wall for forming the capillary structure, and the problem that inner space of the pipe is occupied by the capillary structure to cause reduction of the diameter can be prevented.
  • the first capillary structure is composed of the etched patterns, so paths for guiding the working fluid backwards can have extremely high density to perform well capillary effect, and the working fluid can be effectively guided backwards.
  • a secondary objective of the present disclosure is to provide a micro heat pipe which can provide better paths for guiding the working fluid backwards than the conventional heat pipe having the capillary structure formed by only grooves.
  • a micro heat pipe including a pipe body, a second capillary structure, and a working fluid.
  • the pipe body has two enclosed ends and is defined along a body part thereof from one of the enclosed ends to the other enclosed end with a heat absorbing section, a heat isolating section and a condensing section.
  • the pipe body is provided on an inner pipe wall thereof with etched patterns serving as a first capillary structure and fully distributed in the heat absorbing section, the heat isolating section and the condensing section.
  • the second capillary structure is disposed inside the pipe body, and located in the heat absorbing section.
  • the heat absorbing section is filled up with the second capillary structure which is capable of absorbing liquid by capillary action.
  • the working fluid is injected into the pipe body.
  • the present disclosure uses the etching manner to form the etched patterns, which serve as the first capillary structure of the present disclosure, on the inner pipe wall, so it is not necessary to extra add a layer of copper powder or copper mesh on the inner pipe wall for forming the capillary structure, and the problem that inner space of the pipe is occupied by the capillary structure to cause reduction of the diameter can be prevented.
  • the first capillary structure is composed of the etched patterns, so it can have high-density paths for guiding the working fluid backwards to perform well capillary effect, and the working fluid can be effectively guided backwards.
  • the first capillary structure can provide better paths for guiding the working fluid backwards than the conventional heat pipe having the capillary structure formed by only grooves.
  • Another objective of the present disclosure is to provide a method of manufacturing a micro heat pipe, which is suitable to manufacture the micro heat pipe having a diameter smaller than 3 mm, and the micro heat pipe produced by the method can achieve the primary objective and the secondary objective.
  • the present disclosure provides a method of manufacturing a micro heat pipe, and the method includes the steps of: preparing a pipe body having two open ends, introducing etchant into the pipe body to etch an inner pipe wall of the pipe body to form etched patterns, which serve as a first capillary structure, on the inner pipe wall of the pipe body, sealing one of the two open ends of the pipe body by solderless welding, defining a heat absorbing section, a heat isolating section and a condensing section in order along a body part of the pipe body from the sealed end to the remained open end, disposing a second capillary material through the remained open end in the heat absorbing section of the pipe body in a way that the second capillary material fills up the heat absorbing section, sintering the second capillary material with the pipe body to make the second capillary material form a second capillary structure, introducing a working fluid into the pipe body, pumping air out of the pipe body to create a vacuum therein, and
  • the aforesaid steps can be performed to manufacture the micro heat pipe having the diameter smaller than 3 mm, and the micro heat pipe produced can achieve the primary objective and the secondary objective.
  • a micro heat pipe 10 of a first preferred embodiment of the present disclosure includes a pipe body 11, a second capillary structure 21 and a working fluid.
  • the pipe body 11 has two enclosed ends and is defined along the body part thereof from one enclosed end to the other enclosed end with a heat absorbing section H, a heat isolating section A and a condensing section C.
  • the pipe body 11 has etched patterns located on an inner pipe wall thereof.
  • the etched patterns which serve as a first capillary structure 12, are fully distributed in the heat absorbing section H, the heat isolating section A and the condensing section C.
  • the first capillary structure 12 is formed in a way that etchant flows through the pipe body 11 to etch the inner pipe wall of the pipe body 11 for forming the etched patterns with regular arrangement in the flowing direction of the etchant.
  • the first capillary structure 12 is the etched patterns with regular arrangement, as shown in Fig. 4 .
  • the diameter of the pipe body 11 is smaller than or equal to 3 mm; preferably, the diameter can be 2 mm, for example.
  • the second capillary structure 21 is disposed inside the pipe body 11 and located in the heat absorbing section H of the pipe body 11.
  • the heat absorbing section H is filled up with the second capillary structure 21 which is capable of absorbing liquid by capillary action.
  • the second capillary structure 21 formed by sintering of the copper powder is taken as example.
  • the second capillary structure 21 filled in the heat absorbing section H fully can absorb more working fluid.
  • the amount of the working fluid which can be injected into the pipe body 11 is relatively less, so it is hard to keep a certain quantity of the working fluid in the pipe body 11 during the whole manufacturing process.
  • the second capillary structure 21 of the present disclosure is filled in the heat absorbing section H fully, so as to effectively form an enormous capillary structure and receive sufficient amount of the working fluid.
  • the working fluid is injected into the pipe body 11.
  • pure water is taken as an example for the working fluid, but the present disclosure is not limited thereto.
  • the working fluid can also be other liquid having similar function.
  • the working fluid is an essential element of the conventional heat pipe, and other species or components of liquids are also well known by skills in this field, so their detailed description is omitted.
  • the state of the working fluid staying in the pipe is hard to be shown in a drawing, and the working fluid is a well-known element, so the working fluid is now illustrated in the drawings of the present disclosure.
  • the heat absorbing section H is touched with a heat source 99, such as an electronic chip, a central processor or a battery.
  • a heat source 99 such as an electronic chip, a central processor or a battery.
  • the working fluid received in the second capillary structure 21 is heated by the thermal energy generated by the heat source 99 into steam, the steam disperses to the condensing section C through the heat isolating section A in the pipe body 11 and is then condensed into liquid on the inner pipe wall of the condensing section C, and then guided backwards to the second capillary structure 21 through the first capillary structure 12.
  • This heat exchange action is repeated again and again, thereby achieving the desired effect of transferring heat to the condensing section C.
  • the first capillary structure 12 is the etched patterns formed on the inner pipe wall by etching, so it is not necessary to extra add a layer of copper powder or copper mesh on the inner pipe wall to forming the capillary structure, so that the problem in reduction of the pipe diameter due to the space inside the pipe occupied by the capillary structure can be prevented, and the first capillary structure 21 can perform well effect of guiding the working fluid backwards.
  • the capillary patterns formed by etching are very tiny, so the density of guiding paths and the capillary effect for guiding the working fluid backwards are better than the conventional pipe having the capillary structure composed of only grooves.
  • the first capillary structure 12 is not limited to the aforesaid etched patterns with regular arrangement, and may be the etched patterns with irregular arrangement as shown in FIG. 5 .
  • the pipe body 11 is left to stand or shaken so that the inner pipe wall of the pipe body 11 can be etched to form the patterns with irregular arrangement to serve as the first capillary structure 12, and such first capillary structure 12 can similarly perform effect of guiding the working fluid backwards.
  • the pipe body 11' can be a pipe having grooves at the inside thereof, that is, the pipe body 11 is provided on the inner pipe wall thereof with a plurality of axially extended grooves 14'.
  • the first capillary structure 12' is not only distributed on the inner pipe wall, but also fully distributed on the inner walls of the grooves 14'. While the pipe body 11' is the pipe having the grooves, the inner walls of the grooves 14' are directly etched to form the above-mentioned structure. The capillary effect of the grooves 14' plus that of the etched patterns can further improve the effect of guiding the working fluid backwards.
  • the second capillary structure 21 is only located in the heat absorbing section H and cannot be directly determined its location according to the appearance of the micro heat pipe 10.
  • a marker can be placed on the appearance of the micro heat pipe 10 to allow the user to directly determine the location of the heat absorbing section H.
  • a marker 19 is disposed on an outer surface of the pipe body 11 for recognizing the location of the heat absorbing section H, so the user can determine the location of the heat absorbing section H of the micro heat pipe 10 according to the appearance of the micro heat pipe 10.
  • the disposal of the marker 19 can be formed by etching the outer surface of the pipe body 11, so the etched part has a rough matted surface in appearance. The etched part shown in the Fig.
  • the marker 19 can be a sleeve, as shown in Fig. 9 ; for example, the marker 19 can be a ring sleeved onto the pipe body 11.
  • the marker 19 can be a coat of pigment applied on the outer surface of the pipe body 11.
  • the marker 19 can be a graph, such as an arrow, shown at any location on the surface of the pipe body 11 to indicate the location of the heat absorbing section H or the condensing section C.
  • Fig. 11 through Fig. 16 illustrate a method of manufacturing the micro heat pipe according to a second preferred embodiment of the present disclosure.
  • the elements shown in Fig. 12 through Fig. 16 are the same with that of the first embodiment, so the description below refers to the drawings and numbers the same with the first embodiment.
  • the method of manufacturing the micro heat pipe includes the following steps.
  • a preparation step is shown in Fig. 12 , wherein the pipe body 11 having two open ends is provided.
  • the pipe body 11 has a diameter smaller than or equal to 3 mm; preferably, the diameter can be 2 mm as an example.
  • etching step is shown in Fig. 13 , wherein the etchant 41 is introduced into the pipe body 11 to etch the inner pipe wall of the pipe body 11, so as to form the etched patterns, which serve as the first capillary structure 12, on the inner pipe wall of the pipe body 11.
  • the etching manners described in the first embodiment can be used to form the patterns with regular arrangement or irregular arrangement.
  • a sealing step is shown in Fig. 14 , wherein an end of the pipe body 11 is sealed by solderless welding, and the heat absorbing section H, the heat isolating section A and the condensing section C are defined along the body part from the sealed end to the remained open end.
  • solderless welding manner the part of the pipe wall located at the open end of the pipe body 11 is melt to fuse together by spot welding, argon arc welding, or high energy welding, thereby achieving the effect of sealing.
  • a second capillary material placement step is shown in Fig. 15 , wherein the second capillary material 29 is placed into the pipe body 11 through the remained open end and located in the heat absorbing section H to make the heat absorbing section H filled up with the second capillary material 29.
  • the second capillary material 29 is copper powder.
  • a sintering step is then performed in a way that the pipe body 11 is sintered with the second capillary material 29 so that the second capillary structure as shown in Fig. 2 is formed by the second capillary material.
  • An injection step is then performed in a way that the working fluid is injected into the pipe body 11.
  • the injection technology is a well-known technology, so no drawing is used to illustrate it.
  • FIG. 16 A vacuum pumping and sealing step is shown in Fig. 16 , wherein the air is pumped out of the pipe body 11 to create a vacuum therein, and the remained open end of the pipe body 11 is then sealed by the aforesaid solderless welding manner.
  • the technology of creating the vacuum is well known, so its detail description is omitted.
  • the micro heat pipe 10 can be produced.
  • the usage and effect of the micro heat pipe 10 produced by the aforesaid method are the same as that of the first embodiment, so the detailed description is omitted.
  • the method provided in the second embodiment can further include a marking step to dispose the marker 19 on the outer surface of the pipe body 11, so as to allow the user to recognize the location of the heat absorbing section H.
  • the user can determine the location of the heat absorbing section H of the micro heat pipe 10 according to the appearance of the micro heat pipe 10.
  • the manner of disposing the marker 19 is illustrated in the first embodiment, so the detailed description is omitted.
  • the pipe body 11 prepared in the preparation step can be a pipe having grooves, that is, the pipe body 11 is provided on the inner pipe wall thereof with a plurality of axially extended grooves 14.
  • the first capillary structure 12 is not only fully distributed on the inner pipe wall of the pipe body 11, but also fully distributed on the inner walls of the grooves 14.

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP15896788.5A 2015-06-30 2015-06-30 Micro-caloduc et son procédé de fabrication Withdrawn EP3318831A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/082950 WO2017000257A1 (fr) 2015-06-30 2015-06-30 Micro-caloduc et son procédé de fabrication

Publications (2)

Publication Number Publication Date
EP3318831A1 true EP3318831A1 (fr) 2018-05-09
EP3318831A4 EP3318831A4 (fr) 2019-02-20

Family

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Family Applications (1)

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EP15896788.5A Withdrawn EP3318831A4 (fr) 2015-06-30 2015-06-30 Micro-caloduc et son procédé de fabrication

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EP (1) EP3318831A4 (fr)
WO (1) WO2017000257A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11057983B2 (en) 2019-01-30 2021-07-06 Rohde & Schwarz Gmbh & Co. Kg PCB assembly and method of manufacturing a PCB assembly

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109443060B (zh) * 2018-09-25 2021-03-12 广东工业大学 一种超薄平板热管及其制造工艺

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Publication number Priority date Publication date Assignee Title
DE2919188C2 (de) * 1979-05-12 1986-10-30 Süddeutsche Kühlerfabrik Julius Fr. Behr GmbH & Co KG, 7000 Stuttgart Verfahren zur Behandlung einer Oberfläche einer metallischen Wand für die Übertragung von Wärme und dessen Anwendung
US7040382B2 (en) * 2004-07-06 2006-05-09 Hul-Chun Hsu End surface capillary structure of heat pipe
TWI275766B (en) * 2005-03-18 2007-03-11 Foxconn Tech Co Ltd Heat pipe
JP2007113820A (ja) * 2005-10-19 2007-05-10 Fujikura Ltd ヒートパイプ用蒸発部容器の製造方法
US20090308576A1 (en) * 2008-06-17 2009-12-17 Wang Cheng-Tu Heat pipe with a dual capillary structure and manufacturing method thereof
CN102466421B (zh) * 2010-11-08 2015-11-25 富瑞精密组件（昆山）有限公司 扁平热导管及其制造方法
US20130175008A1 (en) * 2012-01-10 2013-07-11 Chien-Chih Yeh Thin heat pipe
CN102818466B (zh) * 2012-08-15 2014-09-10 中山伟强科技有限公司 一种热管
CN103868385B (zh) * 2012-12-14 2017-02-08 富瑞精密组件（昆山）有限公司 热导管及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11057983B2 (en) 2019-01-30 2021-07-06 Rohde & Schwarz Gmbh & Co. Kg PCB assembly and method of manufacturing a PCB assembly

Also Published As

Publication number Publication date
EP3318831A4 (fr) 2019-02-20
WO2017000257A1 (fr) 2017-01-05

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