EP3312506A1 - Chainable, fully cast, flexible, light emitting diode strip and method for producing the same - Google Patents
Chainable, fully cast, flexible, light emitting diode strip and method for producing the same Download PDFInfo
- Publication number
- EP3312506A1 EP3312506A1 EP17020490.3A EP17020490A EP3312506A1 EP 3312506 A1 EP3312506 A1 EP 3312506A1 EP 17020490 A EP17020490 A EP 17020490A EP 3312506 A1 EP3312506 A1 EP 3312506A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- profile
- light
- emitting diode
- flexible
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
- F21V15/013—Housings, e.g. material or assembling of housing parts the housing being an extrusion
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/005—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips for several lighting devices in an end-to-end arrangement, i.e. light tracks
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
- F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates, according to claim 1, a verkettbares, vollvergossenes, flexible light emitting diode strip. Furthermore, the invention relates, according to claim 13, a process for its preparation.
- Light tubes usually flexible type, especially for decoration purposes and promotional purposes have long been known.
- two cables are routed as a plus rail and a minus rail, and between the plus rail and the minus rail, at least two or more groups of at least two or more series-connected LEDs arranged in parallel are electrically connected to each other and to a dropping resistor.
- All LEDs are directed with their light exit side in one direction and individual sections within the plastic tube are provided with additional pieces of tubing, preferably a shrink tube, between the LEDs, which pieces of tubing, the plus rail, the negative rail and the connecting cable between the LEDs and better fix the LEDs and the connecting wires within the light tube allow, without the flexibility of the light tube is obstructed.
- the cavities within the plastic tube are filled with a transparent, elastic plastic, whereby a further barrier effect against penetrating moisture is achieved.
- the filament which consists of a plastic body, at least one groove is milled, in which the light tube inserted as a light source and with a Resin is poured or glued. To realize a wider light propagation, the groove walls of the groove widen outwards.
- a flexible transparent light tube made of plastic, in which the tube wall of the flexible transparent tube is connected to a strand-shaped bendable and after bending the shape retaining reinforcing element.
- the reinforcing element is preferably integrated in the tube wall and preferably has a substantially circular cross-section. In the manufacture of such a transparent tube, the reinforcing element can be inserted directly into the tube wall during the extrusion of the tube. Inside the tube, a plurality of small light-emitting elements are arranged, which are connected via electrical connection wires, which end in a plug and are supplied with electrical voltage.
- a flexible light tube which has at least two parallel copper wires for power supply, a flexible opaque but translucent strip, multiple boards equipped with multiple LEDs and a light-transmissive molded part, which is strip-shaped.
- the strip is quadrangular in cross-section and has a longitudinally formed through-hole and a side of the through hole arranged slot, which is provided for the assembly of the boards.
- Each board has a contact terminal at each of its two ends. The boards are inserted through the slot in the through hole of the strip, wherein the contact terminals of the boards are electrically connected to the copper wires.
- the light emitted by the juxtaposed LEDs is emitted to the outside through the molded part, which has a surface that is semicircular in cross-section to the outside. In this case, the emitted light beam of adjacent LEDs overlaps in an overlapping zone.
- Plastic cover provided consisting of opaque PVC, which is located below the molding on both sides and at the bottom of the strip.
- the boards provided with multiple LEDs are enveloped by a strip which is produced by injection molding from white or differently colored plastic.
- the strip has at its upper end a notch and a longitudinally formed slot, which serves to bring the board into the through hole of the strip can.
- the through hole in the product has the risk of condensation / capillary effect.
- the notch may additionally be provided with a reflective film.
- the strip is made of opaque plastic.
- a plurality of fixing elements are provided for fastening the light tube to a plate. In the manufacturing process, only the extrusion is used; an inspiration for a potting is the DE 20 2005 002 425 U1 not removable.
- light-emitting diode bands - also of a flexible nature - have long been known.
- an LED strip is known, which has a plurality of light-emitting diodes, which are arranged in a row and are cast in a flexible elongated housing.
- the housing forms a, in particular U-shaped or V-shaped, mold comprising two upwardly (z-direction) extending side walls, ie with two upwardly to the open side of the mold extending side walls, in a lower region , in particular by a floor, are interconnected.
- the light-emitting diodes are introduced into the mold;
- the mold is then filled with potting compound.
- the casting mold becomes a marking, ie, a marking edge extending horizontally through at least one side wall, wherein the wall portion of the side wall adjoining immediately above the marking edge is vertically aligned or further than the marking edge in the interior (the mold) protrudes (also to form an at least partially "unsteady" transition from an upper wall portion to a lower wall portion of the side wall), filled with a first potting compound. From the marking the mold is filled with a second potting compound. In this case, further potting compounds can be arranged above or below the marking.
- a horizontal boundary line between the first and second potting compound forms, wherein the first potting compound forms the bottom of the casting mold for the second potting compound after curing.
- the first potting compound is in particular a transparent potting compound; the second potting compound is in particular an opaque potting compound.
- casting compounds are basically polyurethane (PU) materials.
- the marking is now formed by at least one marking edge extending horizontally on one of the side walls, in particular on both of the side walls. The wall portion of the side wall adjoining immediately above the marking edge is vertically aligned or protrudes farther than the marking edge into the interior space.
- the immediately following above the marking edge wall portion of the side wall protrude further into the interior of the mold as an immediately below the marking edge subsequent portion of the side wall.
- the side wall is mandatory in one piece and good adjustability occurs in particular when a horizontally extending marker edge is arranged on both side walls, wherein both marker edges are arranged on the same vertical position (z-direction).
- adjacent light-emitting diodes are articulated to one another in three degrees of freedom.
- a cable may include multiple cable lines.
- a flexible LED cable lighting with a flexible and flat insulating body with a longitudinal slot and a plurality of recesses for each connection to the longitudinal slot known. Furthermore, at least two wires for power supply are embedded in parallel in the insulating body and a plurality of strands are provided, each comprising a plurality of LEDs and at least one connected in series and arranged in the longitudinal slot resistor, which is smaller than the LEDs.
- the LEDs are each mounted in the recesses, which are slightly larger than the LEDs, and electrically connected between the at least two wires.
- Each LED is mounted on a printed circuit board, which is electrically connected via conductors with the at least two wires by soldering or forming two prongs, that is electrically connected in parallel. This allows the LED cable lighting to be cut to desired lengths.
- a protective layer covers the insulator and the LEDs, the protective layer being made of translucent material or semi-translucent material, in particular polyvinyl chloride (PVC).
- PVC polyvinyl chloride
- a two-component adhesive is applied to the protective layer. The serial connection of the strands by means of radial prongs, which are pushed into the insulating body of a segment and thus electrically connected to the at least two wires. The joint is sealed with adhesive and covered with a hose.
- the packaged LED module includes a module having at least one LED disposed thereon, a one-piece housing having a receptacle for the module, a substantially optically transmissive region allowing outward projection of light from the LED and an opening.
- a Verg tellblockierstoff which is provided or arranged between the module and the housing, is designed such that it prevents the penetration of a prevented over the opening in the housing equipped with the module potting compound (by means of a two-component or multi-component spray system) in a region between the LED and the substantially optically transmissive region, by removing the capillary action between the module and the housing.
- the potting compound of polyurethane, silicone resin, epoxy or the like known materials to a material with high thermal conductivity.
- the housing is designed so that it can be poured immediately after inserting the LED module into the receptacle from the rear, ie via the opening.
- the Verg cordblockierstoff achieve in particular an interruption or cancellation of the capillary between the module inserted into the housing and the housing, so that the cast potting compound does not penetrate due to capillary action in the region between the LED and substantially optically transmissive region.
- a targeted emission of light from the LED is still possible to the outside.
- Verg cordblockiermittel makes it possible in a particularly simple manner that the LED module and connectable to the module connection cable in the housing without the use of an additional material, such as.
- the positioning of the housing for example, the aforementioned placement pins, an electrical connection between the module and provide at least one, preferably at least two connection cables used for making electrical contact with the module.
- the positioning means preferably have an electrically conductive surface or are made of an electrically conductive material.
- the regions of the placement openings of the module which come into contact with the positioning means likewise have electrically conductive connections for this purpose.
- the connection cable either the positioning pins have insulation displacement contacts on their end facing the connection cables, or the connection cables are stripped of insulation at corresponding points, so that an electrical connection is established by simple contact contact.
- the housing further has lateral connection guides with recesses in which at least one, preferably at least two connection cables used for electrical contacting of the module are guided.
- the recesses preferably have tapers, which reduce in sections the diameter of the recess.
- the tapers are designed as sealing lips of the recesses into which the connection cable or cables are pressed in order to fix the connection cable or cables sealingly in the connection guides.
- An additional sealing element can thus be dispensed with.
- the potting body alone and also supported by the sealing lips thus makes it possible that the LED module is mounted in the housing without the use of additional material sealingly and securely fixed.
- the tapers serve as an additional strain relief, so that the forces acting on the connection cable or cables tensile forces can be transmitted to the housing safely.
- the module may also have, for example, on its side facing away from the LED, contacting elements for making electrical contact with the module with connection cables. This in particular if the locating pins are not used for electrical contact between the module and the connection cable.
- the contacting element is to preferably electrically conductive and may consist of a metal or a metal alloy.
- the contacting elements are preferably designed as insulation displacement contacts, piercing contacts, crimp contacts or the like known contacting elements. Insulation displacement contacts are usually designed such that they have a slot into which the corresponding conductor is inserted.
- the slot has such a size that the insulation of the line is cut when pushed in. Thus, an electrical contact with the line can be realized.
- the slot preferably has a width such that the conductor, for example a wire or strands, is not cut.
- An arbitrarily long LED chain can be formed by simply arranging and mounting a plurality of packaged LED modules on the connection cables at arbitrary positions.
- the connection cables between the housed LED modules are uninterrupted cables that are either stripped or contacted at the contact points with insulation displacement contacts, without interrupting the endless cable. This solution allows an endless chaining as well as the use of pre-programmable, freely changeable module distances also within the LED chain.
- connection cables By using flexible connection cables, the area of use can be increased compared to rigid conductors. Thus, an infinite number of possible distances (uniform, nonuniform, repetitive) of the LED modules 1 are given on a connection cable, which can be easily produced by casting the potting body. Likewise, by the possible use of endless cables any chain length is possible, which can also take any form of flexible connection cables.
- the light strip has a strip-shaped substrate with at least one semiconductor light source arranged on at least one flat side of the substrate.
- the substrate is a ribbon cable with multiple wires, wherein at least one core is at least partially stripped on at least one flat side and the semiconductor light source electrically contacted stripped areas of at least one core.
- the light strip has at least one core which is not stripped off on a flat side and is at least at stripped areas of the at least one flat side of a light-permeable cover, in particular potting compound (such as silicone, polyimide, PVC, PE, PP and for a high light yield transparent or, for example, for a more homogeneous Lichtabstrahlmuster translucent (opaque, milky) be covered), wherein the light strip at its at least one non-stripped edge-side wire is free of the cover.
- potting compound such as silicone, polyimide, PVC, PE, PP and for a high light yield transparent or, for example, for a more homogeneous Lichtabstrahlmuster translucent (opaque, milky) be covered
- the light strip at its at least one non-stripped edge-side wire is free of the cover.
- ribbon cables eg, with different trace thicknesses, trace shapes, trace materials, color of insulation, etc.
- an electrical connection can be particularly easy to introduce and change, for. B. by introducing interruptions of the wires or simple soldering of cables, possibly even during assembly or by an end user.
- many standard commercial plugs and tails are available for commercial flat ribbon cables, including IP protection, UL approval, and / or similar certifications.
- cores of a ribbon cable typically have a higher cross-section than a conductor of a printed circuit board, which in turn allows higher current densities and a parallel connection of semiconductor light sources.
- the non-stripped wire does not contribute to the electrical connection of the at least one semiconductor light source, but may increase the stability of the luminous band.
- a wire is a means of heat dissipation, to which it may be associated in particular with at least one heat sink.
- the potting compound provides protection, in particular IP protection, for the at least one semiconductor light source and the stripped areas of the flat sides available.
- the release of the non stripped wire from the cover allows for higher heat dissipation and saves material for the cover.
- the peripheral wire can prevent overflow of a potting compound, if such is used, for. B. by the not removed insulation acts as a stop edge. Provision of the at least one stripped conductor can be achieved, for example, by scraping, cutting.
- the at least one semiconductor light source comprises at least one light-emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. Several light emitting diodes can produce a mixed light, z. B. a white mixed light.
- the at least one light-emitting diode may contain at least one wavelength-converting phosphor (conversion LED). The phosphor may alternatively or additionally be arranged remotely from the light-emitting diode ("remote phosphor"), z. B. in a potting compound.
- the at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount").
- the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, z. At least one Fresnel lens, collimator, and so on.
- the electrical contact of the contact areas can be done by soldering or an electrically conductive adhesion promoter such as solder paste or conductive adhesive.
- the solder paste or the conductive adhesive can be applied for example by means of printing, dispensing or jetting.
- the semiconductor light source may be materially connected to the at least one contact areas.
- the ribbon cable can be equipped in a similar manner with electrical and / or electronic components, for. B. surface-mounted devices ("SMDs"). At least some of these components like a driver or part of a driver for the driver represent at least one semiconductor light source.
- the method of manufacturing a luminous band according to DE 10 2013 203 666 B4 includes the following steps: (a) providing a ribbon cable with multiple wires; (B) stripping at least a portion of at least one core on at least one flat side of the ribbon cable; and (c) attaching at least one semiconductor light source to an associated flat side so as to be electrically connected to contact areas of the at least one stripped wire.
- the stripping step is followed by a step of introducing at least one break into a stripped portion of at least one wire, and the step of attaching comprises electrically connecting at least one semiconductor light source to discontinuously separated contact areas of a common wire.
- the method comprises a step of applying an electrically conductive adhesion promoter to at least one section of at least one stripped-apart core.
- the adhesion promoter can in particular be applied before or after an interruption has been introduced.
- the application of the electrically conductive adhesion promoter is followed by the step of attaching the at least one semiconductor light source.
- This step comprises equipping with at least one semiconductor light source and / or with at least one electrical or electronic component at the location of the electrically conductive adhesion promoter, and thus at an associated contact region.
- the attachment of at least one semiconductor light source can be followed by a temperature process with elevated temperature, for. B. for melting the solder paste or for curing the conductive adhesive.
- a temperature process with elevated temperature, for. B. for melting the solder paste or for curing the conductive adhesive.
- a flat strip or one side only stripped or populated ribbon cable that a step of attaching z.
- B. a double-sided adhesive tape on the non-stripped or not equipped flat side connects.
- the double-sided tape also omitted or applied after casting with a translucent potting compound at least stripped points of at least one flat side of the ribbon cable.
- the light strip according to the DE 10 2013 203 666 B4 has therefore parallel arranged cores, in particular two outer, non-current cores, a central core with interruption to the series connection of the LEDs and right and left thereof extending over their entire length stripped or isolated from the insulation cores, where the operating voltage (plus and minus pole) is applied.
- the two arranged on the edge, not stripped wires serve to increase the mechanical stability of the light strip and as a stop edge for the potting compound.
- a light strip known for example for facade lighting, which has a flexible printed circuit board and a plurality of light sources and a first conductor for powering the light sources, wherein the light sources are arranged so that the light is emitted substantially normal to the flexible printed circuit board.
- a housing is formed around the flexible circuit board and the light sources to form a flexible, elongated object, the housing having at least a first portion and a second portion extending along the flexible circuit board.
- the first section is substantially transparent to the light emitted by the light sources.
- the first and second portions are arranged such that the emitted light is reflected at the second portion and the main distribution direction of the emitted light is redirected to produce an intensity pattern having a maximum intensity in one direction at a non-zero angle to the normal of the flexible one PCB.
- the angle to the normal of the flexible circuit board is between 30 degrees and 60 degrees, in particular about 45 degrees. At least approximately half of the light emitted by the light sources is reflected / redirected by the second section.
- the flexible light strip has a substantially rectangular shape with first and second in cross section opposite surfaces and third and fourth opposing surfaces, wherein the flexible circuit board extends substantially parallel to the first surface, and the first and second sections are arranged such that at least approximately half of the light emitted from the light strip is from the third and / or or fourth surface is emitted.
- the light strip has one or more second electrical conductors that extend substantially continuously parallel to the flexible circuit board and are electrically connected to the flexible circuit board at a plurality of positions.
- the housing is formed around the flexible circuit board, the light sources and the second electrical conductors to form a flexible elongated object.
- the flexible printed circuit board has a plurality of regions which are mechanically and electrically interconnected by connecting elements.
- an arrangement has at least one first flexible light strip, a second flexible light strip and a connector for connecting at least one first conductor of both the first and the second flexible light strip to at least one second conductor of the at least one first and second flexible light strip.
- the invention is opposite to the light-emitting diode bands according to the DE 10 2012 213 309 A1 the task of further developing these so that the user a verkettbares, vollvergossenes, flexible light emitting diode band is provided, which has a reliable electrical and mechanical connection at long feed lengths and is inexpensive to produce.
- the light-emitting diode strip according to the invention has the advantage that it can be manufactured in any length in a surprisingly simple and cost-effective manner, with the flexible open profile (with integrated electrical lines with or without insulation for power supply and / or control and / or data transmission) both as a carrier and as a casting mold serves.
- the inventive combination, in particular of extruded profile and the Vergusstechnik be in a surprisingly simple manner, in the DE 10 2013 203 666 B4 described disadvantages of the prior art (LED strip lights with a U-shaped profile and with a potting with translucent silicone) overcome, with a flat light exit surface can be realized.
- Fig. 1 to Fig. 21 show various embodiments of a light-emitting diode band LB according to the invention, in particular of linkable, fully potted, LED strips below LB called light bands with long operable length with at least one feed, respectively power supply.
- Such compact, cast LED strips LB with very long feed lengths up to 100m and beyond, are required in tunnel lighting, among other applications. This is achieved by combining the individual summation currents I1, I2, I3, .., In (see Fig. 5 ) of each flexible conductor carrier LP on the electrical lines L1, L2, Ln in a flexible, open to one side profile U (in particular a U-shell / U-profile).
- the geometry of the cross section of the light-emitting diode band LB can be rectangular, square (polygonal) or even semicircular.
- Fig. 13, Fig. 14 respectively.
- Fig. 15 and Fig. 21 turn, this manufactured, potted LED strip LB turn can also serve as a basic lighting element for other geometries.
- a U-shell also called U-profile
- the flexible conductor carriers LP preferably have a module length of 5 m to 10 m and a population density of 10 LEDs / m to 100 LEDs / m.
- the two legs of the U-shell U are preferably designed with an undercut H to the ground.
- This undercut H ensures in the production process for an optimal anchoring of a potting compound V on the U-shell U.
- the material of the U-shell U is preferably made of polyurethane and is preferably produced by extrusion.
- the U-shell U is adjustable by additive particles in color and properties. It is conceivable, for example, by adding color particles, a pure white U-shell U for optimal light output or by color particles of the RAL palette individual color design depending on the place of use (decorative element). Furthermore, by incorporation of special particles, a flame-retardant material property can be achieved, v.a. for use in areas with increased safety requirements. Furthermore, a heat-conducting property is possible by ceramic particles.
- a flexible conductor carrier LP is equipped with LEDs and glued and filled with a preferably clear, consisting of polyurethane potting compound V and thereby protected from moisture or weathering. around the point glare too
- a translucent potting compound V see also FIG Fig. 13, Fig. 14 . Fig. 15 . Fig. 21 V2).
- each flexible conductor carrier LP By combining the individual currents I1, I2, I3, .., into each flexible conductor carrier LP as a sum current onto the electrical conductors L1 , L2,, Ln in the U-shell, the limitation of the current carrying capacity of the flexible conductor carrier LP is bypassed, which has so far prevented such large feed lengths.
- a flexible conductor carrier LP which is preferably equipped with chip light-emitting diodes (LED1, LED2, .., LEDn) in the U-shell U.
- the flexible conductor support LP is glued to the inner bottom between the legs of the profile U.
- a mechanical reinforcement T which is for example a plastic film, a metal foil, alternatively a plastic tape / metal band, a grid or a glass fiber reinforced fabric tape to prevent bending against the permissible bending direction of the flexible conductor carrier LP, can be introduced.
- the individual components are non-positively connected by a suitable adhesive tape.
- a suitable, preferably planer-like tool W is on the inside of the U-shell U, the U-shell U itself and the insulation of the line L1, L2,, Ln limited opened at the point of contact in a manner and removed that each access to the or desired line L1, L2,, Ln at the or the respective points is exposed.
- a further possibility for exposing the conductors L1, L2,, Ln running inside the U-shell U represents the technique of material removal by grinding or milling (see Fig. 7 ).
- the upper layer of the U-shell U is defined limited at the point of contact removed and the conductors L1, L2,, Ln inside the U-shell U are accessible at the or the respective locations.
- the maximum length which can be operated with one feed can be repeated, i. to a maximum of twice, be increased.
- the profile U is cut to the length of the finished product.
- the next production step is now the opening of the inner bottom towards the preferably four, running in the interior of the open profile U, lines L1, L2,, Ln, there to make a subsequent contact with the flexible conductor support LP, which is later applied to the inner bottom of the open profile U, to produce.
- This opening of the insulation in the floor area can, for example. Via a planer-like tool W (see Fig. 6 ) or a suitable grinding / milling combination W (see Fig. 7 ) defined.
- the insulation in the bottom area of the U-shell and the conductors L1, L2,, Ln located therein is removed until the copper conductors of the lines L1, L2,, Ln are bare and thus contacting is possible.
- the beginning and / or the end of the open profile U is assembled, which means that we removed the outer geometry of the profile U, so that only the insulated or uninsulated conductors L1, L2,, Ln from the bottom of the U-shell just lie. Virtually at each end, four individual wires L1, L2,, Ln project out of the profile U (free wire ends).
- a now preferably IP-protected plug-in system S, B is now assembled at the beginning and / or end of the open profile U.
- the main body / profile U has a defined length, preferably has an IP plug-in system S, B at the beginning and / or end, is open at a defined point in the interior of the profile U and thus access to the running in the ground conductors L1, L2,, Ln exposed.
- the profile U is inserted or clamped in a suitable shape, which represents the fixation.
- the profile U is fixed in the longitudinal direction, is kept straight and has no height differences. This in turn is important for the later process of introducing the potting compound V.
- This reinforcement T preferably a plastic film, a metal foil, alternatively plastic tape / metal strip, a grid or a glass fiber reinforced fabric tape, or a flat plate with recesses, is applied to the inner bottom of the open profile U by means of a suitable adhesive.
- a suitable adhesive preferably a plastic film, a metal foil, alternatively plastic tape / metal strip, a grid or a glass fiber reinforced fabric tape, or a flat plate with recesses
- the flexible charge carrier LP is introduced on the mechanical reinforcement T introduced in the previous step with a suitable adhesive (see Fig. 3 ). It should be noted that a defined distance to the exposed conductors in the bottom of the open profile U is kept free.
- the contacting takes place between the conductors L1, L2,, Ln running in the bottom of the profile U, and the flexible conductor carrier LP.
- the connection is preferably made by soldering to ensure a permanent and uninterrupted contact.
- a defined amount of a potting compound V preferably made of polyurethane, is discharged in such a way that a uniform filling level in the open profile U is achieved.
- the potting compound V can consist of one or more layers and in turn even by the addition can be influenced by additives in their properties.
- translucent particles for reduced glare and a more uniform light distribution or fluorescent particles which make it possible to emit afterglow are to be mentioned as conceivable settings, above all in areas for safety-relevant orientation illuminations.
- the lower part, in which the insulated or non-insulated conductors L1, L2,, Ln run can be removed in the beginning and end regions of the profile U. Now the stripped conductors L1, L2,, Ln are exposed in the beginning and end area and can be assembled with plug S and socket B. Thanks to this technology, the flexible conductor carriers LP, which continue to run on the upper side, can be fitted with the next element, without having to accept a shadow effect at the beginning and at the end (see Fig. 12 ).
- German Patent 10 2013 019 039.8 B3 insert see Fig. 13, Fig. 14
- the first leg S1 of the housing G partially consists of a translucent, corresponding to the capillary effect in the wall thickness and tapered in the plastic material of the housing G passing second potting compound V2 and at least partially made of the plastic material of the (U-shaped) housing G, being already finished on this leg portion S1 encapsulated LED strip / LED line LB arranged and embedded in a first transparent potting compound V1.
- the light of the chip LEDs LED is reflected by the inner surfaces of the housing G and diffused by the one end face ST of the housing G forming second potting compound V2, wherein the light emitting diode band LEB is horizontally flexible in the extension direction.
- German patent 10 2013 019 039.8 B3 described and in Fig.
- the already finished encapsulated LED strip / LED line LB can be arranged on one of the front side ST of the housing G opposite wall.
- part of the light of the chip LEDs LED is reflected by the inner surfaces of the housing G and diffused by the one end face ST of the housing G forming second potting compound V2, wherein the light emitting diode band LEB is vertically elastic in the extension direction.
- both positive properties, namely the opal, homogeneous and flat illuminated surface are combined with a large operable length according to the invention.
- the open profile U which according to the invention serves both as a carrier and as a casting mold VG, have different geometries; Undercuts or the like in the profile U / in the form U are to be regarded as unproblematic, since the profile U and the potting material V are bending elastic and compensate for the forces occurring during demoulding.
- Fig. 16 shows in detail a second embodiment, namely a convex formation of the open profile U
- Fig. 17 shows in detail a third embodiment with upwardly tapered flanks of the open profile U
- Fig. 18 shows in detail a fourth embodiment with convex flanks and straight bottom of the open profile U
- Fig. 19 shows in detail a fifth embodiment with undercuts and upwardly tapered flanks of the open profile U
- Fig. 20 shows in detail a sixth embodiment of the flexible open profile, namely a double-T profile U.
- FIG. 21 a third embodiment of the light emitting diode band LEB semi-circular executed basic shape VG according to the invention.
- LED modules LED on the double-T profile U can also be controlled independently of each other.
- decorative effects can be achieved by a different dimming of the strip LED;
- the color mixture in the luminaire body can be made variable and dynamic.
- the same principle can also be applied to different shades of white, thus a lamp can be variably adjusted from a warm white tone to a cool white tone. For example, to simulate a daylight simulation (early evening: warm white, during the day: cool white).
- the holding possibilities of the embodiments of the light emitting diode strip LB according to the invention according to the invention are as follows.
- a corresponding profiling of the legs of the open profile U, with symmetrical cross-section by means of a prestressed holder made of plastic or spring steel, which engages in the negative profiling, a corresponding holding device can be provided, which is easy and quick to assemble.
- a headband with preload which tapers upwardly and in which the cast light / light emitting diode tape is snapped may be used as a mounting bracket.
- Another mounting option of the light-emitting diode strip LB according to the invention is to see a groove with an undercut on the back outside the open profile U itself before. In this undercut groove, a mushroom-shaped holder is inserted and locked, which holds the LED strip LB.
- the open profile is made of polyurethane / extruded or in particular of thermoplastics (eg: acrylonitrile-butadiene-styrene (ABS), polyamides (PA), polylactate (PLA), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET ), Polyethylene (PE), polypropylene (PP), polystyrene (PS), polyetheretherketone (PEEK) and polyvinyl chloride (PVC) by injection molding or by extrusion getting produced.
- thermoplastics eg: acrylonitrile-butadiene-styrene (ABS), polyamides (PA), polylactate (PLA), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET ), Polyethylene (PE), polypropylene (PP), polystyrene (PS), polyetheretherketone (PEEK) and polyvinyl chloride (PVC) by
- subregions of the profile in particular a leg of a U-profile or the vertical middle part and / or the upper and / or the lower transverse part of a double-T-profile, made of transparent plastic, so that in combination with the radiation through the transparent or translucent potting compound V an emission angle greater than 180 ° up to 360 °, with all-round light emitting diodes (COG-LEDs (Chip On Glass), which have an all-round radiation characteristic through their glass substrate in conjunction with a recess / hole in the flexible conductor support LP through which the COG LED emits their light up and down, virtually all around, radiating out) or arranged back to back along the gravity line of the double T-profile LEDs LED1, LED2, .., LEDn, in particular chip LEDs, and completely transparent profile U become.
- COG-LEDs Chip On Glass
- a 270 ° -radiation can in particular in an arrangement of the electrical lines L1, L2,, Ln in the base of the U-profile and a transparent leg or arrangement of the electrical lines (L1, L2,, Ln) in a leg and transparent other leg as well as transparent basis are realized.
- the profile U for strain relief / increasing the tensile strength at least one wire or a strand (consisting of several individual wires), which in particular in the leg of a U-profile or in the base between the electrical lines L1, L2, Ln or the upper and / or in the lower transverse part of a double-T-profile or in the vertical middle part between the electrical lines L1, L2,, Ln is / are arranged.
- the wire / strand is in a side wall (leg) which abuts the wall, and the electrical lines L1, L2,, Ln are in the bottom (base) of the profile U (U-profile) in Extension direction of the light emitting diode band LB arranged.
- the side wall and bottom are in particular opaque (the side wall and / or the bottom being coated on the inside with reflective material, in particular reflective particles embedded in the coating) and the light of the light emitting diodes LED1, LED2, .., LEDn coming on the opposite, transparent or translucent sidewall (Leg) into the room and up or down through the transparent or translucent potting V (arrangement on the side wall of a room).
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Abstract
Leuchtdiodenband mit: €¢ einem flexiblen, nach einer Seite offenen Profil (U) aus extrudiertem Kunststoff, €¢ mindestens zwei im Innern einer Wand (UW) des Profils (U) integrierten elektrischen Leitungen (LI, L2, , Ln), welche in der Wand (UW) parallel zueinander verlaufen und endseitig Steckverbinder (S, B) oder freie Drahtenden für die Verkettung der Leuchtdiodenbänder (LB) miteinander aufweisen, €¢ Ausnehmungen bis zu den elektrischen Leitungen (LI, L2, , Ln) in der Wand (UW), welche die durch die Ausnehmung begrenzte Kontaktfläche für den Anschluss von flexiblen Leitungsträgern (LP) mit darauf angeordneten Chip-Leuchtdioden (LED1, LED2, .. , LEDn) bilden und €¢ einer das Profil (U) innen auffüllenden transparenten oder transluzenten Vergussmasse (V),derart, dass die flexiblen Leitungsträger (LP) mit den Chip-Leuchtdioden (LED1, LED2, .. , LEDn) vor Feuchtigkeit oder Witterungseinflüssen geschützt sind und dass die flexiblen Leitungsträger (LP) in Parallelschaltung mit den elektrischen Leitungen (LI, L2, , Ln) verbunden sind, wobei der Summenstrom durch die mittels Steckverbinder (S, B) oder freien Drahtenden verbundenen Leitungen (LI, L2, , Ln) des Profils (U) fließt und wobei das Leuchtdiodenband (LB) vertikal zur Erstreckungsrichtung biegeelastisch ist.Light-emitting diode band with: € ¢ a flexible profile (U) made of extruded plastic, open to one side, At least two electrical lines (LI, L2,, Ln) integrated inside a wall (UW) of the profile (U) which run parallel to one another in the wall (UW) and end connectors (S, B) or free wire ends for the chaining of the light-emitting diode (LB) bands with each other, Recesses up to the electrical lines (LI, L2,, Ln) in the wall (UW), which defines the contact area limited by the recess for the connection of flexible conductor carriers (LP) with chip LEDs arranged thereon (LED1, LED2, .., LEDn) form and € ¢ a transparent or translucent potting compound (V) filling the profile (U) inside, in such a way that the flexible cable carriers (LP) with the chip LEDs (LED1, LED2, .., LEDn) are protected against moisture or weathering and the flexible conductor supports (LP) are connected in parallel with the electrical leads (LI, L2,, Ln), the total current flowing through the leads (LI, L2,, Ln) of the profile connected by means of connectors (S, B) or free wire ends (U) flows and wherein the light emitting diode band (LB) is flexurally elastic to the direction of extension.
Description
Die Erfindung betrifft, gemäß Patentanspruch 1, ein verkettbares, vollvergossenes, flexibles Leuchtdiodenband. Weiterhin betrifft die Erfindung, gemäß Patentanspruch 13, ein Verfahren zu dessen Herstellung.The invention relates, according to claim 1, a verkettbares, vollvergossenes, flexible light emitting diode strip. Furthermore, the invention relates, according to
Lichtschläuche meist flexibler Art, insbesondere zu Dekorationszwecken und Werbezwecken sind seit langem bekannt. Beispielsweise ist aus der
Weiterhin ist aus der
Weiterhin ist aus der
Weiterhin sind Leuchtdiodenbänder - auch flexibler Art - seit langem bekannt. Beispielsweise ist aus der
Hinsichtlich der Anschlusstechnik ist aus der
- Platzieren jeweils eines positiven Drahtes und eines negativen Drahtes an vorbestimmten Positionen in einer Gussform,
- Platzieren von "blanken" LED-Chips an vorbestimmten Positionen in der Gussform,
- Verbinden jedes einzelnen "blanken" LED-Chips mit dem positiven Draht und dem negativen Draht mittels Anschlussdrähten,
- Einspritzen von geschmolzenem (Verpackungs-) Material auf bzw. in die Gussform, welche den positiven und den negativen Draht sowie die "blanken" LED-Chips enthält und
- Nachbehandeln bzw. Aushärten der Kapselung (Verpackungsmaterial).
- Placing each of a positive wire and a negative wire at predetermined positions in a mold,
- Placing "bare" LED chips at predetermined positions in the mold,
- Connecting each single "bare" LED chip to the positive wire and the negative wire using lead wires,
- Injecting molten (packaging) material onto or into the mold containing the positive and the negative wire as well as the "bare" LED chips and
- After treatment or curing of the encapsulation (packaging material).
Weiterhin ist aus der
Weiterhin ist aus der
Weiterhin ist aus der
- (a) Bereitstellen eines bandförmigen Trägers, welcher an zumindest einer Seite mit mehreren Halbleiterlichtquellen, insbesondere Leuchtdioden, bestückt ist,
- (b) Anordnen mindestens einer elektrischen Leitung an dem Träger und
- (c) Vergießen der mindestens einen elektrischen Leitung an dem Träger.
- (a) providing a band-shaped carrier which is equipped on at least one side with a plurality of semiconductor light sources, in particular light-emitting diodes,
- (B) arranging at least one electrical line on the carrier and
- (c) potting the at least one electrical line on the carrier.
Um den Nachteil von LED-Leuchtbänder mit einem U-förmigen Profil und mit einem Verguss mit lichtdurchlässigen Silikon hinsichtlich einer begrenzten Länge und Zusammensetzung für größere Längen aus mehreren LED-Leuchtbänder zu vermeiden, ist aus der
Schließlich ist aus der
Wie die vorstehende Würdigung des Standes der Technik aufzeigt, sind unterschiedlich ausgestaltete Lichtschläuche oder biegeelastische Leuchtdiodenbänder einschließlich verschiedener Ausgestaltungen der Anschlusstechnik hierzu bekannt. Ausgehend von dem Verfahren zum Herstellen eines Leuchtbands mit einem bandförmigen Träger gemäß der
Der Erfindung liegt gegenüber den Leuchtdiodenbändern gemäß der
Diese Aufgabe wird, gemäß dem Patentanspruch 1, durch ein Leuchtdiodenband gelöst mit:
- einem flexiblen, nach einer Seite offenen Profil aus extrudiertem Kunststoff,
- mindestens zwei im Innern einer Wand des Profils integrierten elektrischen Leitungen, welche in der Wand parallel zueinander verlaufen und endseitig Steckverbinder oder freie Drahtenden für die Verkettung der Leuchtdiodenbänder miteinander aufweisen,
- Ausnehmungen bis zu den elektrischen Leitungen in der Wand, welche die durch die Ausnehmung begrenzte Kontaktfläche für den Anschluss von flexiblen Leitungsträgern mit darauf angeordneten Chip-Leuchtdioden bilden und
- einer das Profil innen auffüllenden transparenten oder transluzenten Vergussmasse,
- a flexible profile of extruded plastic, open to one side,
- at least two electrical lines integrated in the interior of a wall of the profile, which run parallel to one another in the wall and have plug connectors or free wire ends for the connection of the light-emitting diode bands to one another on the end,
- Recesses up to the electrical lines in the wall, which form the limited by the recess contact surface for the connection of flexible conductor carriers with thereon arranged chip LEDs and
- a profile filling the inside transparent or translucent potting compound,
Weiterhin wird diese Aufgabe, gemäß Anspruch 13, durch ein Verfahren zur Herstellung eines Leuchtdiodenbands nach Anspruch 1 gelöst, bei dem:
- a) ein flexibles nach einer Seite offenes Profil mit mindestens zwei im Innern einer Wand des Profils integrierten elektrischen Leitungen aus Kunststoff extrudiert wird,
- b) das Profil auf die Länge des fertigen Produktes abgelängt wird,
- c) Ausnehmungen bis zu den elektrischen Leitungen in der Wand, welche die durch die Ausnehmung begrenzte Kontaktfläche für den Anschluss von flexiblen Leitungsträgern mit darauf angeordneten Chip-Leuchtdioden bilden, mit einem spanabhebenden Werkzeug hergestellt werden,
- d) am Anfang und/oder am Ende des Profils ein Stecksystem konfektioniert wird, indem die äußere Geometrie des Profils entfernt wird, sodass nur die isolierten elektrischen Leitungen auf der Stirnseite des Profils herausragen und nach Abisolieren in einer bestimmten, zum Anschluss erforderlichen Länge ein Stecker oder eine Buchse montiert wird,
- e) das Profil mit Stecksystem in einer Form in horizontaler Längserstreckung fixiert wird,
- f) ein flexibler Leitungsträger auf der Wand mit den elektrischen Leitungen mit einem Kleber eingebracht wird,
- g) eine Kontaktierung zwischen den in der Wand mit den elektrischen Leitungen des Profils verlaufenden Leitern und dem flexiblen Leitungsträger durch eine stoffschlüssige Verbindung hergestellt wird und
- h) eine Vergussmasse in die Gussform des Profils eingefüllt wird.
- a) a flexible profile open to one side is extruded with at least two plastic conduits integrated in the interior of a wall of the profile,
- b) the profile is cut to the length of the finished product,
- c) recesses up to the electrical lines in the wall, which form the contact surface limited by the recess for the connection of flexible conductor carriers with chip light-emitting diodes arranged thereon, are produced with a cutting tool,
- d) at the beginning and / or end of the profile, a plug-in system is assembled by the outer geometry of the profile is removed, so that only the insulated electrical lines on the front side of the profile protrude and after stripping in a certain length required for connection a plug or a socket is mounted,
- e) the profile is fixed with plug-in system in a mold in horizontal longitudinal extent,
- f) a flexible conductor carrier is introduced on the wall with the electrical leads with an adhesive,
- g) a contact between the running in the wall with the electrical lines of the profile conductors and the flexible conductor carrier is made by a material connection and
- h) a potting compound is poured into the mold of the profile.
Das erfindungsgemäße Leuchtdiodenband weist den Vorteil auf, dass dieses auf überraschend einfache und kostengünstige Art und Weise in beliebiger Länge hergestellt werden kann, wobei das flexible offene Profil (mit integrierten elektrischen Leitungen mit oder ohne Isolierung zur Stromversorgung und/oder Steuerung und/oder Datenübertragung) sowohl als Träger als auch als Vergußform dient. Durch die erfindungsgemäße Kombination, insbesondere aus extrudiertem Profil und der Vergusstechnik, werden auf überraschend einfache Art und Weise, die in der
Weitere Vorteile und Einzelheiten lassen sich der nachfolgenden Beschreibung von bevorzugten Ausführungsformen der Erfindung unter Bezugnahme auf die Zeichnung entnehmen. In der Zeichnung zeigt:
- Fig. 1
- eine erste Ausführungsform des flexiblen offenen Profil mit 4 isolierten Leitern, innen im Boden des Profils liegend gemäß der Erfindung,
- Fig. 2
- das Profil nach
FIG. 1 mit einem eingelegten Knickschutz, - Fig. 3
- das Profil nach
FIG. 2 mit eingebrachter flexibler Leiterplatte mit LEDs bestückt, - Fig. 4
- das Profil nach
FIG. 3 mit Verguss, - Fig. 5
- die Prinzipskizze der elektrischen Verschaltung der LEDs,
- Fig. 6
- den Verfahrensschritt zur Freilegung der im Inneren des Profils verlaufenden Leiter mittels Hobel,
- Fig. 7
- den Verfahrens schritt zur Freilegung der im Inneren des Profils verlaufenden Leiter mittels Fräser,
- Fig. 8
- eine einkanalige Ausführung eines mit LEDs bestückten flexiblen Leitungsträgers,
- Fig. 9
- eine mehrkanalige Ausführung eines mit LEDs bestückten flexiblen Leitungsträgers,
- Fig. 10
- eine einkanalige Ausführung mit Zusammenfassen von Leitungen eines mit LEDs bestückten flexiblen Leitungsträgers,
- Fig. 11
- die Verkettung der Leuchtdiodenbänder mittels Stecker-Buchse,
- Fig. 12
- die Verkettung der Leuchtdiodenbänder mittels Stecker-Buchse und Stoß an Stoß,
- Fig. 13
- eine erste Ausführungsform des Leuchtdiodenbands nach
FIG. 4 eingebracht in ein U-förmiges Gehäuse, - Fig. 14
- eine zweite Ausführungsform des Leuchtdiodenbands nach
FIG. 4 eingebracht in ein U-förmiges Gehäuse, - Fig. 15
- eine dritte Ausführungsform des Leuchtdiodenbands eingebracht in ein starres Profil,
- Fig. 16
- eine zweite Ausführungsform des flexiblen offenen Profils,
- Fig. 17
- eine dritte Ausführungsform des flexiblen offenen Profils,
- Fig. 18
- eine vierte Ausführungsform des flexiblen offenen Profils,
- Fig. 19
- eine fünfte Ausführungsform des flexiblen offenen Profils,
- Fig. 20
- eine sechste Ausführungsform des flexiblen offenen Profils und
- Fig. 21
- eine vierte Ausführungsform des Leuchtdiodenbands mit Halbrund ausgeführter Grundform gemäß der Erfindung.
- Fig. 1
- a first embodiment of the flexible open profile with 4 insulated conductors, lying inside in the bottom of the profile according to the invention,
- Fig. 2
- the profile after
FIG. 1 with an inserted bend protection, - Fig. 3
- the profile after
FIG. 2 fitted with flexible printed circuit board with LEDs, - Fig. 4
- the profile after
FIG. 3 with potting, - Fig. 5
- the schematic diagram of the electrical wiring of the LEDs,
- Fig. 6
- the method step for exposing the conductor running inside the profile by means of a planer,
- Fig. 7
- the process step for exposing the running inside the profile ladder by means of milling cutter,
- Fig. 8
- a single-channel design of a flexible cable carrier equipped with LEDs,
- Fig. 9
- a multi-channel design of a flexible cable carrier equipped with LEDs,
- Fig. 10
- a single-channel design with the combination of lines of a flexible cable carrier equipped with LEDs,
- Fig. 11
- the linking of the light-emitting diode bands by means of plug socket,
- Fig. 12
- the linking of the light-emitting diode bands by means of plug socket and push-and-pull,
- Fig. 13
- a first embodiment of the light emitting diode band according to
FIG. 4 inserted into a U-shaped housing, - Fig. 14
- a second embodiment of the light emitting diode band according to
FIG. 4 inserted into a U-shaped housing, - Fig. 15
- a third embodiment of the light-emitting diode band introduced into a rigid profile,
- Fig. 16
- a second embodiment of the flexible open profile,
- Fig. 17
- a third embodiment of the flexible open profile,
- Fig. 18
- a fourth embodiment of the flexible open profile,
- Fig. 19
- a fifth embodiment of the flexible open profile,
- Fig. 20
- a sixth embodiment of the flexible open profile and
- Fig. 21
- a fourth embodiment of the light-emitting diode strip with half-round executed basic form according to the invention.
Als Grundform dient ein flexibles, nach einer Seite offenes Profil U, insbesondere wie die im Detail in
Die beiden Schenkel der U-Schale U sind vorzugsweise mit einem Hinterschnitt H zum Boden hin ausgeführt. Dieser Hinterschnitt H sorgt im Produktionsprozess für eine optimale Verankerung einer Vergussmasse V an der U-Schale U.The two legs of the U-shell U are preferably designed with an undercut H to the ground. This undercut H ensures in the production process for an optimal anchoring of a potting compound V on the U-shell U.
Das Material der U-Schale U besteht vorzugsweise aus Polyurethan und wird vorzugsweise im Extrusionsverfahren hergestellt. Die U-Schale U ist durch additive Partikel in Farbe und Eigenschaften einstellbar. Denkbar ist etwa durch Beimischung von Farbpartikeln eine reinweiße U-Schale U für eine optimale Lichtausbeute oder durch Farbpartikel der RAL Palette eine individuelle Farbgestaltung je nach Einsatzort (Dekorationselement). Des Weiteren kann durch die Beimischung spezieller Partikel eine flammwidrige Materialeigenschaft erzielt werden, v.a. für den Einsatz in Bereichen mit erhöhten Sicherheitsanforderungen. Ferner ist durch Keramik-Partikel eine wärmeleitende Eigenschaft möglich.The material of the U-shell U is preferably made of polyurethane and is preferably produced by extrusion. The U-shell U is adjustable by additive particles in color and properties. It is conceivable, for example, by adding color particles, a pure white U-shell U for optimal light output or by color particles of the RAL palette individual color design depending on the place of use (decorative element). Furthermore, by incorporation of special particles, a flame-retardant material property can be achieved, v.a. for use in areas with increased safety requirements. Furthermore, a heat-conducting property is possible by ceramic particles.
Auf die Grundfläche zwischen den beiden Schenkeln wird ein flexibler Leitungsträger LP mit LEDs bestückt und verklebt und mit einer vorzugsweise klaren, aus Polyurethan bestehenden Vergussmasse V gefüllt und dadurch vor Feuchtigkeit bzw. Witterungseinflüssen geschützt. um die Punktlichtblendung zu minimieren kann im Rahmen der Erfindung auch eine transluzente Vergussmasse V (siehe auch
In dem verdickten Boden der U-Schale U laufen beispielsweise 4, möglich mit 2 und mehr Leitern, vorzugsweise isolierte Leitungen L1, L2, , Ln. Diese Leitungen L1, L2, , Ln übernehmen die Stromführung zu den Einzellängen der flexiblen Leitungsträger LP. Dadurch wird die Summenstrombelastung vom LED Streifen LB genommen, und der Großteil des Stromes (I1+I2+I3...+In) läuft über die Leitungen im Boden der U-Schale. Über den einzelnen flexiblen Leitungsträger LP fließt nunmehr nur der Einzelstrom I1, I2, I3... In, jedoch nicht mehr die Summe aus den Strömen (siehe
Bei der Herstellung des erfindungsgemäßen Leuchtdiodenbands LB wird in die U-Schale U ein flexibler Leitungsträger LP, welcher in längs Erstreckung vorzugsweise mit Chip-Leuchtdioden (LED1, LED2, .. , LEDn) bestückt ist, eingebracht. Der flexible Leitungsträger LP wird auf dem innenliegenden Boden zwischen den Schenkeln des Profils U verklebt. Vor diesem Schritt kann eine mechanische Verstärkung T, welche beispielsweise eine Kunststofffolie, eine Metallfolie, alternativ ein Kunststoffband/Metallband, ein Gitter oder ein glasfaserverstärktes Gewebeband ist, um ein Biegen entgegen der zulässigen Biegerichtung des flexiblen Leitungsträgers LP zu verhindern, eingebracht werden. Die Einzelkomponenten werden durch ein geeignetes Klebeband miteinander kraftschlüssig verbunden.In the manufacture of the light-emitting diode strip LB according to the invention, a flexible conductor carrier LP, which is preferably equipped with chip light-emitting diodes (LED1, LED2, .., LEDn) in the U-shell U, is introduced. The flexible conductor support LP is glued to the inner bottom between the legs of the profile U. Prior to this step, a mechanical reinforcement T, which is for example a plastic film, a metal foil, alternatively a plastic tape / metal band, a grid or a glass fiber reinforced fabric tape to prevent bending against the permissible bending direction of the flexible conductor carrier LP, can be introduced. The individual components are non-positively connected by a suitable adhesive tape.
Die Kontaktierung des flexiblen Leitungsträger LP mit den in dem Boden der U-Schale U verlaufenden isolierten Leitungen L1, L2, , Ln, kann am Ende, Anfang, mittig oder auch beiderseitig erfolgen. Je nach Anwendung können die vorzugsweise vier Leitungen wie folgt genutzt werden (siehe
- a) einkanalige Ausführung, hierbei werden zwei Leitungen parallel genutzt, d.h., nur zwei Pole der vier Pole belegt (siehe
Fig. 8 ) oder zwei Leitungen zusammengefasst, um den Leitungsquerschnitt pro Kanal zu erhöhen (bei gleich großem Leiterquerschnitt zu verdoppeln) und somit den Spannungsfall zu minimieren (sieheFig. 10 ), - b) mehrkanalige Ausführung, hierbei werden je zwei Leitungen für einen Kanal genutzt, d.h. zwei Kanäle als Redundanz, oder drei Kanäle bspw. als Indikator Beleuchtung (RGB) (siehe
Fig. 9 ), - c) als 3-Kanal, hierbei wird eine Leitung als gemeinsame Kathode bzw. gemeinsame Anode genutzt, die verbleibenden drei Leitungen stehen der 3 - Kanal Ansteuerung zur Verfügung.
- a) single-channel design, this two lines are used in parallel, ie, only two poles of the four poles occupied (see
Fig. 8 ) or two lines in order to increase the line cross-section per channel (to double for a conductor cross-section of the same size) and thus to minimize the voltage drop (seeFig. 10 ) - b) multichannel design, this two channels are used for a channel, ie two channels as redundancy, or three channels, for example, as indicator lighting (RGB) (see
Fig. 9 ) - c) as a 3-channel, in this case a line is used as a common cathode or common anode, the remaining three lines are the 3-channel control available.
Durch ein geeignetes, vorzugsweise hobelartiges Werkzeug W (siehe
Eine weitere Möglichkeit zur Freilegung der im Inneren der U-Schale U verlaufenden Leiter L1, L2, , Ln stellt die Technik des Materialabtragens durch Schleifen bzw. Fräsen dar (siehe
An dieser jeweils freigelegten Stelle kann nun eine (Löt-) Verbindung zum flexiblen Leitungsträger LP hergestellt werden.At this exposed point can now be made (solder) connection to the flexible conductor support LP.
Durch eine beidseitige Einspeisung kann die maximal mit einer Einspeisung betreibbare Länge nochmals, d.h. auf maximal das Doppelte, vergrößert werden.Through a feed on both sides, the maximum length which can be operated with one feed can be repeated, i. to a maximum of twice, be increased.
Eine weitere Möglichkeit der Kontaktierung stellt die sog. Piercing Technologie dar. Hierbei werden mittels insbesondere nadelartiger Schneidklemmen die U-Schale U und die Leitungsisolierung (in der Regel undurchsichtige Isolierung in blau=Nullleiter, Schwarz=Phase, grün-gelb=Erde u.a. um den Draht/Litze mit einem Querschnitte von 1mm2 oder mehr herum, in
Nachfolgend wird das Herstellungsverfahren kurz beschrieben:
- Als Grundform für das fertige Produkt dient ein offenes Profil U aus extrudiertem Kunststoff, vorzugsweise Polyurethan (PUR). Während des Extrusionsprozesses werden - wie in den
Fig. 1 bis Fig. 21 gezeigt - vorzugsweise vier Leiter L1, L2, , Ln (zwei 2-Drahtleitungen) eingebracht, sodass diese parallel im Boden des Profils U verlaufen. Dieses Profil U wird quasi im Endlosprozess hergestellt (sieheFig. 1 ).
- The basic shape used for the finished product is an open profile U made of extruded plastic, preferably polyurethane (PUR). During the extrusion process - as in the
Fig. 1 to Fig. 21 shown - preferably four conductors L1, L2,, Ln (two 2-wire lines) introduced so that they run parallel to the bottom of the profile U. This profile U is almost produced in an endless process (seeFig. 1 ).
Vor der weiteren Verarbeitung wird das Profil U auf die Länge des fertigen Produktes abgelängt.Before further processing, the profile U is cut to the length of the finished product.
Der nächste Herstellungsschritt ist nun das Öffnen des inneren Bodens hin zu den vorzugsweise vier, im Inneren des offenen Profils U verlaufenden, Leitungen L1, L2, , Ln, um dort eine spätere Kontaktierung mit dem flexiblen Leitungsträger LP, welche später auf den inneren Boden des offenen Profils U aufgebracht wird, herstellen zu können. Dieses Öffnen der Isolierung im Bodenbereich kann bspw. über ein hobelartiges Werkzeug W (siehe
Im nächsten Schritt wird der Anfang und/oder das Ende des offenen Profils U konfektioniert, was bedeutet, es wir die äußere Geometrie des Profils U entfernt, sodass nur die isolierten oder nichtisolierten Leiter L1, L2, , Ln aus dem Boden der U-Schale bloß liegen. Quasi an jedem Ende ragen nun vorzugsweise vier Einzeladern L1, L2, , Ln aus dem Profil U heraus (freie Drahtenden).In the next step, the beginning and / or the end of the open profile U is assembled, which means that we removed the outer geometry of the profile U, so that only the insulated or uninsulated conductors L1, L2,, Ln from the bottom of the U-shell just lie. Virtually at each end, four individual wires L1, L2,, Ln project out of the profile U (free wire ends).
An diesen freigelegten Einzeladern L1, L2, , Ln wird nun am Anfang und/oder Ende des offenen Profils U ein nun vorzugsweise IP-geschütztes Stecksystem S, B konfektioniert.At these exposed individual wires L1, L2,, Ln, a now preferably IP-protected plug-in system S, B is now assembled at the beginning and / or end of the open profile U.
Nun besitzt der Grundkörper/Profil U eine definierte Länge, hat vorzugsweise ein IP-Stecksystem S, B am Anfang und / oder Ende, ist an einer definierten Stelle im Inneren des Profils U geöffnet und somit der Zugang zu dem im Boden verlaufenden Leitern L1, L2, , Ln freigelegt.Now, the main body / profile U has a defined length, preferably has an IP plug-in system S, B at the beginning and / or end, is open at a defined point in the interior of the profile U and thus access to the running in the ground conductors L1, L2,, Ln exposed.
Im nächsten Schritt wird das Profil U in eine geeignete Form, welche die Fixierung darstellt, eingelegt bzw. geklemmt. Dadurch ist das Profil U in Längserstreckung fixiert, in sich gerade gehalten wird und weist keine Höhenunterschiede auf. Das wiederum ist wichtig für den späteren Prozess des Einbringens der Vergussmasse V.In the next step, the profile U is inserted or clamped in a suitable shape, which represents the fixation. As a result, the profile U is fixed in the longitudinal direction, is kept straight and has no height differences. This in turn is important for the later process of introducing the potting compound V.
Im nächsten Schritt findet die Bestückung mit der mechanischen Verstärkung T statt. Diese Verstärkung T, vorzugsweise eine Kunststofffolie, eine Metallfolie, alternativ Kunststoffband/Metallband, ein Gitter oder ein glasfaserverstärktes Gewebeband, oder eine ebene Platte mit Aussparungen, wird auf den inneren Boden des offenen Profils U mittels geeignetem Kleber aufgebracht. Dadurch werden die freigelegten Leiter L1, L2, , Ln im Boden des Profils U nicht überdeckt und sind weiterhin für eine Kontaktierung frei zu erreichen (siehe
Im nächsten Schritt wird der flexible Ladungsträger LP auf der im vorherigen Schritt eingebrachten mechanischen Verstärkung T mit einem geeigneten Kleber eingebracht (siehe
Im nächsten Schritt findet nun die Kontaktierung zwischen den im Boden des Profils U verlaufenden Leitern L1, L2, , Ln und dem flexiblen Leitungsträger LP statt. Die Verbindung wird vorzugsweise mittels Löttechnik hergestellt, um eine dauerhafte und unterbrechungsfreie Kontaktierung zu gewährleisten.In the next step, the contacting takes place between the conductors L1, L2,, Ln running in the bottom of the profile U, and the flexible conductor carrier LP. The connection is preferably made by soldering to ensure a permanent and uninterrupted contact.
Das vorbereitete Profil U, mit Steckverbindern S, B am Anfang/Ende, der eingebrachten mechanischen Verstärkung T, dem mit den im Inneren des offenen Profils U verlaufenden Leiter L1, L2, , Ln verbundenen flexiblen Leitungsträger LP und vollständig in einem Klemmprofil fixierten und definierten Länge befindlichen Einheit ist nun vorbereitet für den Verguss.The prepared profile U, with connectors S, B at the beginning / end of the introduced mechanical reinforcement T, which is connected to the running inside the open profile U conductors L1, L2, Ln connected flexible conductor support LP and completely in a clamping profile and defined Length unit is now ready for potting.
Mittels einer linearen und CNC gesteuerten Vergussmaschine wird nun eine definierte Menge an einer vorzugsweise aus Polyurethan bestehenden Vergussmasse V in einer Art und Weise ausgetragen, dass eine gleichmäßige Füllhöhe im offenen Profil U erreicht wird. Wobei die Vergussmasse V aus einer bzw. mehreren Schichten bestehen kann und wiederum selbst durch die Zugabe von Additiven in ihren Eigenschaften beeinflusst werden kann. Als denkbare Einstellungen sind hier insbesondere transluzente Partikel für eine reduzierte Blendung und eine gleichmäßigere Lichtverteilung oder fluoreszierende Partikel, die ein Nachleuchten des Produktes ermöglichen zu nennen, vor allem in Bereichen für sicherheitsrelevante Orientierungs-Beleuchtungen.By means of a linear and CNC controlled potting machine, a defined amount of a potting compound V, preferably made of polyurethane, is discharged in such a way that a uniform filling level in the open profile U is achieved. Wherein the potting compound V can consist of one or more layers and in turn even by the addition can be influenced by additives in their properties. In particular, translucent particles for reduced glare and a more uniform light distribution or fluorescent particles which make it possible to emit afterglow are to be mentioned as conceivable settings, above all in areas for safety-relevant orientation illuminations.
Die im Inneren des Profils U laufenden Leitungen L1, L2, , Ln werden am Anfang und am Ende jeweils mit vorzugsweise IP-geschützten Steckverbinder S, B konfektioniert (siehe
Durch ein geeignetes Schneidwerkzeug kann im Anfangs - und Endbereich des Profils U der untere Teil, in dem die isolierten oder nicht isolierten Leiter L1, L2, , Ln verlaufen, abgenommen werden. Nun liegen die abisolierten Leiter L1, L2, , Ln im Anfangs- und Endbereich frei und können mit Stecker S und Buchse B konfektioniert werden. Durch diese Technik können die auf der Oberseite weiter laufenden flexiblen Leitungsträger LP Stoß an Stoß mit dem nächsten Element verbaut werden, ohne eine Schattenwirkung an Anfangs und Endstellen in Kauf nehmen zu müssen (siehe
Weiterhin ist es im Rahmen der Erfindung möglich, den oben beschriebenen vergossenen LED Streifen LB bzw. das LED Modul LB in ein horizontal oder vertikal biegeelastisches Leuchtdiodenband LEB mit homogenen Lichtaustritt bis zu 180° und transluzenter Vergussmasse V2, wie dies im Deutschen Patent
Analog zum Einsatz in flexiblen, homogenen Lichtlinien gemäß dem Deutschen Patent
Im Rahmen der Erfindung kann das offene Profil U, welches erfindungsgemäß sowohl als Träger als auch als Vergußform VG dient, verschiedene Geometrien aufweisen; Hinterschnitte oder dergleichen im Profil U / in der Form U sind als unproblematisch zu sehen, da das Profil U sowie das Vergussmaterial V biegeelastisch sind und die bei der Entformung auftretenden Kräfte ausgleichen.In the context of the invention, the open profile U, which according to the invention serves both as a carrier and as a casting mold VG, have different geometries; Undercuts or the like in the profile U / in the form U are to be regarded as unproblematic, since the profile U and the potting material V are bending elastic and compensate for the forces occurring during demoulding.
Schließlich zeigt
Durch den Einsatz von zwei LED Modulen LED auf dem Doppel-T Profil U (siehe
Eine weitere Möglichkeit, bei dem Einsatz von mehreren (zwei oder mehr LED Streifen) auf dem Doppel-T Profil U (siehe
Die Halte(r)möglichkeiten der Ausführungsformen des erfindungsgemäßen Leuchtdiodenbands LB gemäß der Erfindung sind wie folgt. Durch eine entsprechende Profilierung der Schenkel des offenen Profils U, bei symmetrischen Querschnitt, kann mittels eines vorgespannten Halters aus Kunststoff oder Federstahl, welche in die negative Profilierung greift, eine entsprechende Haltevorrichtung vorgesehen werden, welche einfach und schnell zu montieren ist. Alternativ kann ein Haltebügel, mit Vorspannung, welcher sich nach oben hin verjüngt und in welchem die gegossene Leuchte/ Leuchtdiodenband eingeschnappt wird, als Montagehalter verwendet werden.The holding possibilities of the embodiments of the light emitting diode strip LB according to the invention according to the invention are as follows. By a corresponding profiling of the legs of the open profile U, with symmetrical cross-section, by means of a prestressed holder made of plastic or spring steel, which engages in the negative profiling, a corresponding holding device can be provided, which is easy and quick to assemble. Alternatively, a headband with preload which tapers upwardly and in which the cast light / light emitting diode tape is snapped may be used as a mounting bracket.
Die Erfindung ist nicht auf die dargestellten und beschriebenen Ausführungsbeispiele beschränkt, sondern umfasst auch alle im Sinne der Erfindung gleichwirkende Ausführungen. Eine weitere Befestigungsmöglichkeit des erfindungsgemäßen Leuchtdiodenbands LB ist eine Nut mit Hinterschnitt auf der Rückseite außen des offenen Profils U selbst vor zu sehen. In dieser hinterschnittenen Nut wird ein pilzförmiger Halter eingeschoben und eingerastet, welcher das Leuchtdiodenband LB hält. Vorzugsweise ist das offene Profil aus Polyurethan hergestellt/extrudiert oder kann insbesondere aus Thermoplaste (z.B.: Acrylnitril-Butadien-Styrol (ABS), Polyamide (PA), Polylactat (PLA), Polymethylmethacrylat (PMMA), Polycarbonat (PC), Polyethylenterephthalat (PET), Polyethylen (PE), Polypropylen (PP), Polystyrol (PS), Polyetheretherketon (PEEK) und Polyvinylchlorid (PVC) im Spritzgießverfahren oder durch Extrusion hergestellt werden. Vorzugsweise können Teilbereiche des Profils, insbesondere ein Schenkel eines U-Profils oder das senkrechte Mittelteil und/oder das obere und/oder das untere Querteil eines Doppel-T-Profils, aus durchsichtigem Kunststoff bestehen, so dass in Kombination mit der Abstrahlung durch die transparente oder transluzente Vergussmasse V ein Abstrahlwinkel größer 180° bis zu 360°, bei rundum abstrahlenden Leuchtdioden (COG-LEDs (Chip On Glas), welche eine Rundum-Abstrahlcharakteristik durch ihr Glassubstrat aufweisen in Verbindung mit einer Ausnehmung/Loch im flexiblen Leitungsträger LP durch welches die COG LED ihr Licht nach oben und unten, quasi rundum, abstrahlt) oder Rücken an Rücken entlang der Schwerelinie des Doppel-T-Profils angeordneten Leuchtdioden LED1, LED2, .. , LEDn, insbesondere Chip-Leuchtdioden, und komplett durchsichtigen Profil U erreicht werden. Eine 270°-Abstrahlung kann insbesondere bei einer Anordnung der elektrischen Leitungen L1, L2, , Ln in der Basis des U-Profils und einem durchsichtigen Schenkel oder Anordnung der elektrischen Leitungen (L1, L2, , Ln) in einem Schenkel und durchsichtiger anderer Schenkel sowie durchsichtige Basis realisiert werden. Vorzugsweise weist das Profil U zur Zugentlastung /Erhöhung der Zugfestigkeit mindestens einen Draht bzw. eine Litze (bestehend aus mehreren Einzeldrähten) auf, welche insbesondere im Schenkel eines U-Profils oder in der Basis zwischen den elektrischen Leitungen L1, L2, , Ln oder im oberen und/oder im unteren Querteil eines Doppel-T-Profils oder im senkrechten Mittelteil zwischen den elektrischen Leitungen L1, L2, , Ln angeordnet ist/sind. Vorzugsweise ist (bei teilweise transparentem Mantelmaterial) der Draht/Litze in einer Seitenwand (Schenkel), welche an der Wand anliegt, und die elektrischen Leitungen L1, L2, , Ln sind im Boden (Basis) des Profils U (U-Profils) in Erstreckungsrichtung des Leuchtdiodenbands LB angeordnet. Seitenwand und Boden sind insbesondere undurchsichtig (wobei die Seitenwand und/oder der Boden innenseitig mit reflektivem Material beschichtet ist, insbesondere in die Beschichtung eingelagerte reflektierende Partikel) und das Licht der Leuchtdioden LED1, LED2, .. , LEDn tritt an der gegenüberliegenden, durchsichtigen oder transluzenten Seitenwand (Schenkel) in den Raum hinein und nach oben oder nach unten durch die transparente oder transluzente Vergussmasse V aus (Anordnung an der Seitenwand eines Raumes).The invention is not limited to the illustrated and described embodiments, but also includes all the same in the context of the invention embodiments. Another mounting option of the light-emitting diode strip LB according to the invention is to see a groove with an undercut on the back outside the open profile U itself before. In this undercut groove, a mushroom-shaped holder is inserted and locked, which holds the LED strip LB. Preferably, the open profile is made of polyurethane / extruded or in particular of thermoplastics (eg: acrylonitrile-butadiene-styrene (ABS), polyamides (PA), polylactate (PLA), polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene terephthalate (PET ), Polyethylene (PE), polypropylene (PP), polystyrene (PS), polyetheretherketone (PEEK) and polyvinyl chloride (PVC) by injection molding or by extrusion getting produced. Preferably, subregions of the profile, in particular a leg of a U-profile or the vertical middle part and / or the upper and / or the lower transverse part of a double-T-profile, made of transparent plastic, so that in combination with the radiation through the transparent or translucent potting compound V an emission angle greater than 180 ° up to 360 °, with all-round light emitting diodes (COG-LEDs (Chip On Glass), which have an all-round radiation characteristic through their glass substrate in conjunction with a recess / hole in the flexible conductor support LP through which the COG LED emits their light up and down, virtually all around, radiating out) or arranged back to back along the gravity line of the double T-profile LEDs LED1, LED2, .., LEDn, in particular chip LEDs, and completely transparent profile U become. A 270 ° -radiation can in particular in an arrangement of the electrical lines L1, L2,, Ln in the base of the U-profile and a transparent leg or arrangement of the electrical lines (L1, L2,, Ln) in a leg and transparent other leg as well as transparent basis are realized. Preferably, the profile U for strain relief / increasing the tensile strength at least one wire or a strand (consisting of several individual wires), which in particular in the leg of a U-profile or in the base between the electrical lines L1, L2, Ln or the upper and / or in the lower transverse part of a double-T-profile or in the vertical middle part between the electrical lines L1, L2,, Ln is / are arranged. Preferably (with partially transparent sheath material) the wire / strand is in a side wall (leg) which abuts the wall, and the electrical lines L1, L2,, Ln are in the bottom (base) of the profile U (U-profile) in Extension direction of the light emitting diode band LB arranged. The side wall and bottom are in particular opaque (the side wall and / or the bottom being coated on the inside with reflective material, in particular reflective particles embedded in the coating) and the light of the light emitting diodes LED1, LED2, .., LEDn coming on the opposite, transparent or translucent sidewall (Leg) into the room and up or down through the transparent or translucent potting V (arrangement on the side wall of a room).
Ferner ist die Erfindung bislang auch nicht auf die in den Patentansprüchen 1, und 13 definierten Merkmalskombinationen beschränkt, sondern kann auch durch jede beliebige andere Kombination von bestimmten Merkmalen aller insgesamt offenbarten Einzelmerkmalen definiert sein. Dies bedeutet, dass grundsätzlich praktisch jedes Einzelmerkmal der Patentansprüche 1 und 13 weggelassen bzw. durch mindestens ein an anderer Stelle der Anmeldung offenbartes Einzelmerkmal ersetzt werden kann.Furthermore, the invention has hitherto not been restricted to the combinations of features defined in
Claims (15)
dadurch gekennzeichnet, dass die äußere Mantelfläche des Leuchtdiodenbands (LB) im Querschnitt rechteckig, quadratisch, polygonal-, kreis- oder ellipsenförmig ist.Light-emitting diode band according to one or more of claims 1 to 5,
characterized in that the outer surface of the light emitting diode band (LB) in cross section is rectangular, square, polygonal, circular or elliptical.
dadurch gekennzeichnet, dass der flexible Leitungsträger (LP) mit Klebeband an der Wand (UW) mit den elektrischen Leitungen angeklebt ist.Light-emitting diode band according to one or more of Claims 1 to 6,
characterized in that the flexible conductor carrier (LP) is adhesively bonded to the wall (UW) with the electrical lines.
dadurch gekennzeichnet, dass, um ein Biegen gegen der zulässigen Biegerichtung des flexiblen Leitungsträger (LP) zu verhindern, parallel und unterhalb der flexiblen Leiterplatte (LP) ein Teil (T) mit Aussparungen zur mechanischen Verstärkung angeordnet ist.Light-emitting diode band according to one or more of Claims 1 to 6,
characterized in that in order to prevent bending against the permissible bending direction of the flexible conductor support (LP), a part (T) with recesses for mechanical reinforcement is arranged parallel to and below the flexible printed circuit board (LP).
dadurch gekennzeichnet, dass in die Vergussmasse (V) einzeln oder in Kombination miteinander reflektierende oder transluzente oder fluoreszierende Partikel oder Keramik-Partikel oder Farbpartikel oder flammwidrige Partikel eingelagert sind.Light-emitting diode band according to one or more of Claims 1 to 8,
characterized in that in the potting compound (V) individually or in combination with each other reflective or translucent or fluorescent particles or ceramic particles or color particles or flame-retardant particles are incorporated.
dadurch gekennzeichnet, dass der flexible Leitungsplatten (LP) eine Modullänge von vorzugsweise zwischen 5m bis 10m und eine Bestückungsdichte mit den Chip-Leuchtdioden (LED1, LED2, .. , LEDn) von vorzugsweise 10 bis 100LEDs/m aufweist.Light-emitting diode band according to one or more of Claims 1 to 9,
characterized in that the flexible circuit board (LP) has a module length of preferably between 5m to 10m and a population density with the chip light emitting diodes (LED1, LED2, .., LEDn) of preferably 10 to 100LEDs / m.
dadurch gekennzeichnet, dass die Chip-Leuchtdioden (LED1, LED2, .. , LEDn) der jeweiligen Leitungsplatte (LP) in Serienschaltung oder Serien-Parallelschaltung miteinander verbunden.Light-emitting diode band according to one or more of Claims 1 to 10,
characterized in that the chip light-emitting diodes (LED1, LED2, .., LEDn) of the respective line plate (LP) connected in series or series-parallel connection with each other.
dadurch gekennzeichnet, dass bereits fertig vergossene LED Streifen/LED Linien (LB) mit den im Profil (U) verlaufenden Leiter (L1, L2, .. , Ln) in einer Vergußform (VG) angeordnet sind, welche bis zum Füllrand der Vergußform (VG) mit einer transparenten und/oder transluzenten Vergussmasse (V, V2) gefüllt ist.Light-emitting diode band according to one or more of claims 1 to 11,
characterized in that already finished encapsulated LED strips / LED lines (LB) with the profile (U) extending conductor (L1, L2, .., Ln) in a casting mold (VG) are arranged, which up to the filling edge of the casting mold ( VG) with a transparent and / or translucent potting compound (V, V2) is filled.
Applications Claiming Priority (1)
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DE102016012639.6A DE102016012639B4 (en) | 2016-10-24 | 2016-10-24 | Chainable, fully encapsulated, flexible light emitting diode strip and method for its production |
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EP17020490.3A Withdrawn EP3312506A1 (en) | 2016-10-24 | 2017-10-23 | Chainable, fully cast, flexible, light emitting diode strip and method for producing the same |
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DE102016012639B4 (en) | 2018-09-20 |
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