DE102016012639A1 - Chainable, fully encapsulated, flexible light emitting diode strip and method for its production - Google Patents

Abstract

Light-emitting diode band comprising: • a flexible open profile (U) of extruded plastic, • having at least two electrical leads (L1, L2,, Ln) integrated in the wall (UW) inside a wall (UW) of the profile (U) parallel to each other and end connectors (S, B) for the linking of the light emitting diode bands (LB) with each other, • with recesses up to the electrical lines (L1, L2,, Ln) in the wall (UW), which is the contact surface for the Connection of on a flexible conductor carrier (LP) arranged chip light-emitting diodes (LED1, LED2, .., LEDn) form and • with a profile (U) inside filling transparent or translucent potting compound (V), such that the chip LEDs (LED1, LED2, .., LEDn) are protected from moisture or weather influences, the sum current through the connector (S, B) connected to lines (L1, L2,, Ln) of the profile (U) flows and wherein the light emitting diode band (LB) vertical to He stretch direction is flexible.

Description

The invention relates, according to claim 1, a verkettbares, vollvergossenes, flexible light emitting diode strip. Furthermore, the invention relates according to claim 9, a method for its preparation.

Light tubes usually flexible type, especially for decoration purposes and promotional purposes have long been known. For example, is from the DE 102 43 948 A1 a flexible light tube and its application in a filament known, which is preferably used in the light advertising based on LEDs. Specifically, inside a translucent plastic tube, two cables are routed as a plus rail and a minus rail, and between the plus rail and the minus rail, at least two or more groups of at least two or more series-connected LEDs arranged in parallel are electrically connected to each other and to a dropping resistor. All LEDs are directed with their light exit side in one direction and individual sections within the plastic tube are provided with additional pieces of tubing, preferably a shrink tube, between the LEDs, which pieces of tubing, the plus rail, the negative rail and the connecting cable between the LEDs and better fix the LEDs and the connecting wires within the light tube allow, without the flexibility of the light tube is obstructed. Finally, the cavities within the plastic tube are filled with a transparent, elastic plastic, whereby a further barrier effect against penetrating moisture is achieved. On one side of the filament, which consists of a plastic body, at least one groove is milled, in which the light tube is inserted as a light source and cast or glued with a synthetic resin. To realize a wider light propagation, the groove walls of the groove widen outwards.

Furthermore, from the DE 201 19 861 U1 a flexible transparent light tube made of plastic, in which the tube wall of the flexible transparent tube is connected to a strand-shaped bendable and after bending the shape retaining reinforcing element. The reinforcing element is preferably integrated in the tube wall and preferably has a substantially circular cross-section. In the manufacture of such a transparent tube, the reinforcing element can be inserted directly into the tube wall during the extrusion of the tube. Inside the tube, a plurality of small light-emitting elements are arranged, which are connected via electrical connection wires, which end in a plug and are supplied with electrical voltage.

Furthermore, from the DE 20 2005 002 425 U1 a flexible light tube known, which has at least two parallel copper wires for power supply, a flexible opaque but translucent strip, multiple boards equipped with multiple LEDs and a light-transmissive molded part, which is strip-shaped. The strip is quadrangular in cross-section and has a longitudinally formed through-hole and a side of the through hole arranged slot, which is provided for the assembly of the boards. Each board has a contact terminal at each of its two ends. The boards are inserted through the slot in the through hole of the strip, wherein the contact terminals of the boards are electrically connected to the copper wires. The light emitted by the juxtaposed LEDs is emitted to the outside through the molded part, which has a surface that is semicircular in cross-section to the outside. In this case, the emitted light beam of adjacent LEDs overlaps in an overlapping zone. Furthermore, a plastic envelope is provided consisting of opaque PVC, which is arranged below the molding on both sides and at the bottom of the strip. In a further embodiment of the light tube, the boards provided with multiple LEDs are enveloped by a strip which is produced by injection molding from white or differently colored plastic. The strip has at its upper end a notch and a longitudinally formed slot, which serves to bring the board into the through hole of the strip can. In order to increase the lighting effect, the notch may additionally be provided with a reflective film. In this embodiment, the strip is made of opaque plastic. For example, to form the word "OPEN" with the light tube, a plurality of fixing elements are provided for fastening the light tube to a plate.

Furthermore, light-emitting diode bands - also of a flexible nature - have long been known. For example, is from the DE 10 2012 110 136 A1 an LED strip is known, which has a plurality of light-emitting diodes, which are arranged in a row and are cast in a flexible elongated housing. The housing forms a, in particular U-shaped or V-shaped, mold comprising two upwardly (z-direction) extending side walls, ie with two upwardly to the open side of the mold extending side walls, in a lower region , in particular by a floor, are interconnected. The light-emitting diodes are introduced into the mold; the mold is then with Pouring compound filled. Viewed from bottom to top (in the z-direction), the casting mold becomes a marking, that is, a marking edge extending horizontally through at least one side wall, wherein the wall portion of the side wall immediately above the marking edge is vertically aligned or further than the marking edge into the interior (the mold) protrudes (also to form an at least partially "unsteady" transition from an upper wall portion to a lower wall portion of the side wall), filled with a first potting compound. From the mark the mold is filled with a second potting compound. In this case, further encapsulants may be arranged above or below the marking. At the mark, a horizontal boundary line between the first and second potting compound forms, wherein the first potting compound forms the bottom of the casting mold for the second potting compound after curing. The first potting compound is in particular a transparent potting compound; the second potting compound is in particular an opaque potting compound. As casting compounds are basically polyurethane (PU) materials. In particular, the marking is now formed by at least one marking edge extending horizontally on one of the side walls, in particular on both of the side walls. The wall portion of the side wall adjoining immediately above the marking edge is vertically aligned or protrudes farther than the marking edge into the interior space. In this case, the immediately following above the marking edge wall portion of the side wall protrude further into the interior of the mold as an immediately below the marking edge subsequent portion of the side wall. The side wall is mandatory in one piece and good adjustability occurs in particular when a horizontally extending marker edge is arranged on both side walls, wherein both marker edges are arranged on the same vertical position (z-direction). In a preferred embodiment of an LED strip, adjacent light-emitting diodes are articulated to one another in three degrees of freedom. For this purpose, the adjacent light-emitting diodes are connected to one another exclusively by exposed cable lines and are not fastened on a conduction band or on a band-shaped circuit board. It can be seen that the exposed cable lines per se allow for rotations and bends in all directions. Exposed means that this cable line (= strand + insulation of the strand) were enclosed by no material before pouring; but after pouring the exposed cable can be enclosed by the potting compound. A cable may include multiple cable lines.

• -Platzieren jeweils eines positiven Drahtes und eines negativen Drahtes an vorbestimmten Positionen in einer Gussform,
• - Platzieren von „blanken“ LED-Chips an vorbestimmten Positionen in der Gussform, - Verbinden jedes einzelnen „blanken“ LED-Chips mit dem positiven Draht und dem negativen Draht mittels Anschlussdrähten,
• - Einspritzen von geschmolzenem (Verpackungs-) Material auf bzw. in die Gussform, welche den positiven und den negativen Draht sowie die „blanken“ LED-Chips enthält und
• - Nachbehandeln bzw. Aushärten der Kapselung (Verpackungsmaterial).

Regarding the connection technology is from the DE 20 2008 002 044 U1 a flexible so-called LED bar light device known, which consists of at least one positive wire and at least one negative wire (power supply lines), which are parallel to each other. Furthermore, LED chips are provided, each of which is connected by means of connecting wires with the positive and the negative wire. Finally, a packaging material is provided for encapsulating the positive wire, the negative wire, and the (bare) LED chip in the flexible LED bar light device. The encapsulation (packaging material) may be any material that is transparent and flexible after curing, for example, thermosetting resin, epoxy, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, polyimide, polyacrylate, etc. In the flexible LED bar light device, the positive and negative wires continue to be clad with insulation material except where the (bare) LED chips are plugged. The manufacturing process consists of the following steps:

• Placing each of a positive wire and a negative wire at predetermined positions in a mold,
• Placing "bare" LED chips at predetermined positions in the mold, - connecting each individual "bare" LED chip to the positive wire and the negative wire by means of connecting wires,
• - Injection of molten (packaging) material on or in the mold, which contains the positive and the negative wire and the "bare" LED chips and
• - After treatment or curing of the encapsulation (packaging material).

Furthermore, from the DE 20 2005 006 643 U1 a flexible LED cable lighting with a flexible and flat insulating body with a longitudinal slot and a plurality of recesses for each connection to the longitudinal slot known. Furthermore, at least two wires for power supply are embedded in parallel in the insulating body and a plurality of strands are provided, each comprising a plurality of LEDs and at least one connected in series and arranged in the longitudinal slot resistor, which is smaller than the LEDs. The LEDs are each mounted in the recesses, which are slightly larger than the LEDs, and electrically connected between the at least two wires. Each LED is mounted on a printed circuit board, which is electrically connected via conductors with the at least two wires by soldering or forming two prongs, that is electrically connected in parallel. This allows the LED cable lighting to be cut to desired lengths. Finally, a protective layer covers the insulator and the LEDs, the protective layer being made of translucent material or semi-translucent material, in particular polyvinyl chloride (PVC). To attach the cable lighting, a two-component adhesive is applied to the protective layer. The serial connection of the strands by means of solenoids, which are pushed into the insulating body of a segment and thus electrically connected to the at least two wires. The joint is sealed with adhesive and covered with a hose.

Furthermore, from the DE 20 2011 003 608 A1 a so-called clad LED module known. The packaged LED module includes a module having at least one LED disposed thereon, a one-piece housing having a receptacle for the module, a substantially optically transmissive region allowing outward projection of light from the LED and an opening. A Vergießblockiermittel, which is provided or arranged between the module and the housing, is designed such that it is the penetration of a via the opening in the housing equipped with the module potting compound (by means of a two- or multi-component spray system) in prevents a region between the LED and the substantially optically transmissive region, by eliminating the capillary action between the module and the housing. Preferably, the potting compound of polyurethane, silicone resin, epoxy or the like known materials to a material with high thermal conductivity. The housing is designed so that it can be poured immediately after inserting the LED module into the receptacle from the rear, ie via the opening. The Vergießblockiermittel achieve in particular an interruption or cancellation of the capillary between the module inserted into the housing and the housing, so that the cast potting compound does not penetrate due to capillary action in the region between the LED and substantially optically transmissive region. Thus, a targeted emission of light from the LED is still possible to the outside. The use of Vergießblockiermittel makes it possible in a particularly simple manner that the LED module and connectable to the module connection cable in the housing without the use of an additional material, such as. A separate sealing element, sealed to the outside and can be poured without the potting compound penetrates forward between the LED and the substantially optically transmissive region. Also on additional partitions or the like can be omitted, which would lead to an enlargement of the entire component. Since the packaged LED module can be fully potted, no additional lower part is needed to close the housing. To produce a non-positive and positive connection between the housing and module and to improve the positional fixation of the module and ensure positioning means (placement pins) of the housing can be caulked with plugged module. This reliably prevents the module arranged in the housing from becoming detached from its predetermined position. Alternatively or additionally, the positioning means of the housing, for example the aforementioned placement pins, provide an electrical connection between the module and at least one, preferably at least two, connection cables used for electrical contacting of the module. For this purpose, the positioning means preferably have an electrically conductive surface or are made of an electrically conductive material. The regions of the placement openings of the module which come into contact with the positioning means likewise have electrically conductive connections for this purpose. In order to enable contact with the connection cable (s), either the positioning pins have insulation displacement contacts on their end facing the connection cables, or the connection cables are stripped of insulation at corresponding points, so that an electrical connection is established by simple contact contact. This connection is finally fixed by the potting body, which fills the housing and sealingly connects housing with module and connecting cables. Preferably, the housing further has lateral connection guides with recesses in which at least one, preferably at least two connection cables used for electrical contacting of the module are guided. The recesses preferably have tapers, which reduce in sections the diameter of the recess. Particularly preferably, the tapers are designed as sealing lips of the recesses into which the connection cable or cables are pressed in order to fix the connection cable or cables sealingly in the connection guides. An additional sealing element can thus be dispensed with. The potting body alone and also supported by the sealing lips thus makes it possible that the LED module is mounted in the housing without the use of additional material sealingly and securely fixed. In addition, the tapers serve as an additional strain relief, so that the forces acting on the connection cable or cables tensile forces can be transmitted to the housing safely. The module may also have, for example, on its side facing away from the LED, contacting elements for making electrical contact with the module with connection cables. This in particular if the locating pins are not used for electrical contact between the module and the connection cable. The contacting element is preferably electrically conductive and may consist of a metal or a metal alloy. The contacting elements are preferably designed as insulation displacement contacts, piercing contacts, crimp contacts or the like known contacting elements. Insulation displacement contacts are usually designed such that they have a slot into which the corresponding conductor is inserted. The slot has such a size that the insulation of the line is cut when pushed in. Thus, an electrical contact with the line can be realized. In this case, the slot preferably has a width such that the conductor, for example a wire or strands, is not cut. Thus, by simply plugging or attaching the connection cable an electrical connection or plug contact can be made. An arbitrarily long LED chain can be formed by simply arranging and mounting a plurality of packaged LED modules on the connection cables at arbitrary positions. The connection cables between the housed LED modules are uninterrupted cables that are either stripped or contacted at the contact points with insulation displacement contacts, without interrupting the endless cable. This solution allows an endless chaining as well as the use of pre-programmable, freely changeable module distances also within the LED chain. By using flexible connection cables, the area of use can be increased compared to rigid conductors. Thus, an infinite number of possible distances (uniform, nonuniform, repetitive) of the LED modules 1 are given on a connecting cable, which can be easily produced by casting the potting body. Likewise, by the possible use of endless cables any chain length is possible, which can also take any form of flexible connection cables.

1. (a) Bereitstellen eines bandförmigen Trägers, welcher an zumindest einer Seite mit mehreren Halbleiterlichtquellen, insbesondere Leuchtdioden, bestückt ist,
2. (b) Anordnen mindestens einer elektrischen Leitung an dem Träger und
3. (c) Vergießen der mindestens einen elektrischen Leitung an dem Träger.

Furthermore, from the DE 10 2012 213 309 A1 a method for producing a light strip with a band-shaped carrier is known, which is equipped on at least one side with a plurality of semiconductor light sources, with at least one electrical line, which is arranged on the carrier and with a common encapsulation of the carrier and the electrical line. The method comprises the following steps:

1. (a) providing a band-shaped carrier which is equipped on at least one side with a plurality of semiconductor light sources, in particular light-emitting diodes,
2. (B) arranging at least one electrical line on the carrier and
3. (c) potting the at least one electrical line on the carrier.

The serving for power supply and / or data transmission electrical line is thus made separately from the carrier and is not limited to production methods for printed conductors. The cross-sectional area is not limited to the cross-sectional area of conductor tracks, but may be much larger, so that it may have a much lower electrical resistance with respect to an equal length. Thereby, an electric wire of a large cross section can be provided inexpensively. Due to the spatially close (contacting or non-contacting) arrangement of the carrier to the electrical line, the common casting with a, in particular translucent, potting compound is made possible in a simple manner. This method is particularly simple and z. B. without elaborate preparatory steps implemented. Furthermore, the already fully stocked, but not yet cast carrier can be prepared as before and need not be modified until its Verguss. The electrical line may be a metal wire, which is usually thin, long and flexible or deformable. The use of wire thus does not impede flexibility of the lighting device or at least not significantly. The wire may have a circular, square, flat, etc. cross section. As metals z. As iron, copper, brass, aluminum, silver, gold and stainless steel and alloys are used. The placing of the electrical line on the carrier comprises arranging so that it can be cast together by a Vergusseinheit, eg extruding machine. In particular, arranging on the carrier in step (b) comprises applying the electrical line to the carrier, whereby the line thus mechanically contacts the carrier. As a result, a particularly compact encapsulated light strip can be generated and an accurate positioning of the electrical line (s) is possible. Alternatively, the placing in step (b) comprises a loose application of the electrical line to the carrier. Loose application means, in particular, a non-autonomous (non-positive, positive and / or cohesive) holding of the electrical line (s) on the carrier. Rather, the system by an external device, for. As a pressing or clamping mechanism, or caused by gravity. Alternatively, the placing in step (b) comprises a material-locking fastening of the electrical line to the carrier, e.g. B. by a primer, z. B. a double-sided tape. This enables a particularly precise positioning of the electrical line. However, the line can also be pressed in and thereby held in a force and / or form-fitting manner by the carrier. Alternatively, the arranging in step (b) comprises a spaced arrangement of the electrical line to the carrier. This has the advantage that an expense for mechanical contacting of the electrical line (s) can be omitted. The spaced-apart arrangement may in particular be arranged at a small distance include. Alternatively, the arranging in step (b) comprises a tensioning of the electrical line, whereby the electrical line is straightened and so in particular loosely applied to the carrier or can be kept thereof at a defined distance. In a further embodiment, the provision in step (a) comprises providing a carrier equipped only on its front side and arranging in step (b) comprising arranging the electrical line on a rear side of the carrier. As a result, an embodiment of the front, z. B. a guide of printed conductors, are largely unaffected by the presence of at least one electrical line configured. Alternatively or additionally, in step (a), the method comprises providing a carrier mounted only on its front side and arranging in step (b) arranging the electrical line on a rear side of the carrier. As a result, an embodiment of the front side, for example a guide of the conductor tracks, can be designed largely uninfluenced by the presence of the electrical line. The band-shaped carrier may in particular be a band-shaped printed circuit board or a flexible carrier, for. B. of polyimide. This also makes it possible to provide a flexible luminous band, in particular if the potting compound used for step (c) is a flexible potting compound. z. Silicone. The potting of the electrical line (s) on the carrier comprises at least a partial shedding of the carrier. The Teilvergießen causes in particular a positive connection of the carrier and the electrical line, possibly also a material connection. For example, in a partial encapsulation, the light-emitting diodes or their emitter surface may remain free and, if desired, may be cast in a further step, eg. B. with a different potting compound. For example, the potting compound connecting the carrier and the at least one electrical line may be opaque, while the potting compound is transparent to potting the light-emitting diodes. Furthermore, steps (b) and (c) include placing at least one exposed (non-electrically isolated) electrical lead. Exposed electrical lines, z. B. bare wires, facilitate electrical contact. In general, the electrical line can also have an electrically insulating jacket o. Ä., For. B. in the form of one or more cables. Furthermore, the method comprises a following step (d) of electrical connection of the electrical line to at least a part of the semiconductor light sources, optionally via an interconnected interconnect structure. The electrical connection can be effected by soldering or welding (laser, resistance or friction welding) (in the case of at least one electrical line on a side facing away from the semiconductor light sources, if necessary via plated-through holes (vias)). In particular, if the electrical line is arranged on a side facing away from the semiconductor light sources side, the electrical contact z. B. also by crimping, etc. In a further embodiment, the casting in step (c) comprises a common complete casting of the carrier and the at least one electrical line. As a result, the casting can be carried out very easily. The potting material used for this purpose is preferably translucent. In particular, the semiconductor light source comprises at least one light-emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. A color can be monochrome (eg red, green, blue, etc.) or multichrome (eg, white). The light emitted by the at least one light-emitting diode can also be an infrared light (IR LED) or an ultraviolet light (UV LED). Several light emitting diodes can produce a mixed light; z. B. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor (conversion LED). The phosphor may alternatively or additionally be arranged remotely from the light-emitting diode ("remote phosphor"), z. B. in the potting compound. The light-emitting diode may be in the form of at least one individually packaged light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The light emitting diode may be equipped with at least one own and / or common optics for beam guidance, z. At least one Fresnel lens, collimator, and so on. Instead of or in addition to inorganic light emitting diodes, z. Based on InGaN or AlInGaP, organic LEDs (OLEDs, eg polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source z. B. have at least one diode laser.

As the above assessment of the prior art shows, differently configured light tubes or flexible elastic light-emitting diode bands including various embodiments of the connection technology are known for this purpose. Starting from the method for producing a luminous band with a band-shaped carrier according to the DE 10 2012 213 309 A1 with the variety of alternatives described there is missing in practice for the indoor, outdoor and underwater areas with a degree of protection of up to IP68 a linkable, fully encapsulated, flexible light-emitting diode strip, which improvements in terms of cost, compactness and / or reliability of electrical and mechanical connection allows. This is particularly significant because the lighting manufacturing industry is an advanced, development-friendly industry that is quick to pick up on and make improvements and simplifications.

The invention is opposite to the light-emitting diode bands according to the DE 10 2012 213 309 A1 the task of further developing these so that the user a verkettbares, vollvergossenes, flexible light emitting diode band is provided, which has a reliable electrical and mechanical connection at long feed lengths and is inexpensive to produce.

• • einem flexiblen offenen Profil aus extrudiertem Kunststoff,
• • mit mindestens zwei im Innern einer Wand des Profils integrierten elektrischen Leitungen, welche in der Wand parallel zueinander verlaufen und endseitig Steckverbinder für die Verkettung der Leuchtdiodenbänder miteinander aufweisen,
• • mit Ausnehmungen bis zu den elektrischen Leitungen in der Wand, welche die Kontaktfläche für den Anschluss von auf einem flexiblen Leitungsträger angeordneten Chip-Leuchtdioden bilden und
• • mit einer das Profil innen auffüllenden transparenten oder transluzenten Vergußmasse,

derart, dass die Chip-Leuchtdioden vor Feuchtigkeit bzw. Witterungseinflüssen geschützt sind, wobei der Summenstrom durch die mittels Steckverbinder verbundenen Leitungen des Profils fließt und wobei das Leuchtdiodenband vertikal zur Erstreckungsrichtung biegeelastisch ist.This object is achieved, according to claim 1, by a light-emitting diode band with:

• A flexible open profile of extruded plastic,
• • having at least two electrical lines integrated in the interior of a wall of the profile, which run parallel to one another in the wall and have plug connectors for the connection of the light-emitting diode bands to one another on the end,
• • With recesses up to the electrical lines in the wall, which form the contact surface for the connection of arranged on a flexible conductor carrier chip LEDs and
• With a transparent or translucent potting compound filling the profile inside,

in such a way that the chip light-emitting diodes are protected against moisture or weather influences, wherein the total current flows through the lines of the profile connected by means of plug connectors and wherein the light-emitting diode strip is flexurally elastic in the direction of extension.

1. a) ein flexibles offenes Profil mit mindestens zwei im Innern einer Wand des Profils integrierten elektrischen Leitungen aus Kunststoff extrudiert wird,
2. b) das Profil auf die Länge des fertigen Produktes abgelängt wird,
3. c) Ausnehmungen bis zu den elektrischen Leitungen in der Wand, welche die Kontaktfläche für den Anschluss von auf einem flexiblen Leitungsträger angeordneten Chip-Leuchtdioden bilden mit einem spanabhebenden Werkzeug hergestellt werden,
4. d) am Anfang und/oder am Ende des Profils ein Stecksystem konfektioniert wird, indem die äußere Geometrie des Profils entfernt wird, sodass nur die isolierten elektrischen Leitungen auf der Stirnseite des Profils herausragen und nach Abisolieren in einer bestimmten, zum Anschluss erforderlichen Länge ein Stecker oder eine Buchse montiert wird,
5. e) das Profil mit Stecksystem in einer Form in horizontaler Längserstreckung fixiert wird,
6. f) eine Verstärkung auf den inneren Boden des Profils mittels Kleber aufgebracht wird,
7. g) ein flexibler Leitungsträger auf der mechanischen Verstärkung mit einem Kleber eingebracht wird,
8. h) eine Kontaktierung zwischen den im Boden des Profils verlaufenden Leitern und dem flexiblen Leitungsträger durch eine stoffschlüssige Verbindung hergestellt wird und
9. i) eine Vergußmasse in das innere Profil eingefüllt wird.

Furthermore, this object is achieved according to claim 9 by a method for producing a light-emitting diode strip according to claim 1, in which:

1. a) a flexible open profile is extruded with at least two integrated in the interior of a wall of the profile electrical wiring made of plastic,
2. b) the profile is cut to the length of the finished product,
3. c) recesses up to the electrical lines in the wall, which form the contact surface for the connection of arranged on a flexible conductor carrier chip light-emitting diodes are made with a cutting tool,
4. d) at the beginning and / or end of the profile, a plug-in system is assembled by the outer geometry of the profile is removed, so that only the insulated electrical lines on the front side of the profile protrude and after stripping in a certain length required for connection a plug or a socket is mounted,
5. e) the profile is fixed with plug-in system in a mold in horizontal longitudinal extent,
6. f) a reinforcement is applied to the inner bottom of the profile by means of adhesive,
7. g) a flexible conductor carrier is introduced on the mechanical reinforcement with an adhesive,
8. h) a contact between the running in the bottom of the profile conductors and the flexible conductor carrier is made by a material connection and
9. i) a potting compound is filled in the inner profile.

The light-emitting diode strip according to the invention has the advantage that it can be manufactured in any length in a surprisingly simple and cost-effective manner, with the flexible open profile (with integrated electrical lines with or without insulation for power supply and / or control and / or data transmission) serves both as a carrier and as a casting mold.

• 1 eine erste Ausführungsform des flexiblen offenen Profil mit 4 isolierten Leitern, innen im Boden des Profils liegend gemäß der Erfindung,
• 2 das Profil nach 1 mit einem eingelegten Knickschutz,
• 3 das Profil nach 2 mit eingebrachter flexibler Leiterplatte mit LEDs bestückt,
• 4 das Profil nach 3 mit Verguss,
• 5 die Prinzipskizze der elektrischen Verschaltung der LEDs,
• 6 den Verfahrensschritt zur Freilegung der im Inneren des Profils verlaufenden Leiter mittels Hobel,
• 7 den Verfahrensschritt zur Freilegung der im Inneren des Profils verlaufenden Leiter mittels Fräser,
• 8 eine einkanalige Ausführung eines mit LEDs bestückten flexiblen Leitungsträgers,
• 9 eine mehrkanalige Ausführung eines mit LEDs bestückten flexiblen Leitungsträgers,
• 10 eine einkanalige Ausführung mit Zusammenfassen von Leitungen eines mit LEDs bestückten flexiblen Leitungsträgers,
• 11 die Verkettung der Leuchtdiodenbänder mittels Stecker-Buchse,
• 12 die Verkettung der Leuchtdiodenbänder mittels Stecker-Buchse und Stoß an Stoß,
• 13 eine erste Ausführungsform des Leuchtdiodenbands nach 4 eingebracht in ein U-förmiges Gehäuse,
• 14 eine zweite Ausführungsform des Leuchtdiodenbands nach 4 eingebracht in ein U-förmiges Gehäuse,
• 15 eine dritte Ausführungsform des Leuchtdiodenbands eingebracht in ein starres Profil,
• 16 eine zweite Ausführungsform des flexiblen offenen Profils,
• 17 eine dritte Ausführungsform des flexiblen offenen Profils,
• 18 eine vierte Ausführungsform des flexiblen offenen Profils,
• 19 eine fünfte Ausführungsform des flexiblen offenen Profils,
• 20 eine sechste Ausführungsform des flexiblen offenen Profils und
• 21 eine vierte Ausführungsform des Leuchtdiodenbands mit Halbrund ausgeführter Grundform gemäß der Erfindung.

Further advantages and details can be taken from the following description of preferred embodiments of the invention with reference to the drawing. In the drawing shows:

• 1 a first embodiment of the flexible open profile with 4 insulated conductors, lying inside in the bottom of the profile according to the invention,
• 2 the profile after 1 with an inserted bend protection,
• 3 the profile after 2 fitted with flexible printed circuit board with LEDs,
• 4 the profile after 3 with potting,
• 5 the schematic diagram of the electrical wiring of the LEDs,
• 6 the method step for exposing the conductor running inside the profile by means of a planer,
• 7 the method step for exposing the conductors running inside the profile by means of milling cutters,
• 8th a single-channel design of a flexible cable carrier equipped with LEDs,
• 9 a multi-channel design of a flexible cable carrier equipped with LEDs,
• 10 a single-channel design with the combination of lines of a flexible cable carrier equipped with LEDs,
• 11 the linking of the light-emitting diode bands by means of plug socket,
• 12 the linking of the light-emitting diode bands by means of plug socket and push-and-pull,
• 13 a first embodiment of the light emitting diode band according to 4 inserted into a U-shaped housing,
• 14 a second embodiment of the light emitting diode band according to 4 inserted into a U-shaped housing,
• 15 a third embodiment of the light-emitting diode band introduced into a rigid profile,
• 16 a second embodiment of the flexible open profile,
• 17 a third embodiment of the flexible open profile,
• 18 a fourth embodiment of the flexible open profile,
• 19 a fifth embodiment of the flexible open profile,
• 20 a sixth embodiment of the flexible open profile and
• 21 a fourth embodiment of the light-emitting diode strip with half-round executed basic form according to the invention.

1 to 21 show various embodiments of a light-emitting diode band LB according to the invention, in particular of linkable, fully potted, LED strips below LB called light bands with long operable length with at least one feed, respectively power supply. Such compact, cast LED strips LB with very long feed lengths up to 100m and beyond, are required in tunnel lighting, among other applications. The geometry of the cross section of the light-emitting diode band LB can be rectangular, square (polygonal) or even semicircular. In particular 13 . 14 respectively. 15 and 21 turn, this manufactured, potted LED strip LB turn can also serve as a basic lighting element for other geometries.

As a basic form is a flexible open profile U, in particular as in detail in 1 to 4 illustrated embodiment, a U-shell, in the thickened bottom of the wiring and thus the power supply of a flexible cable carrier LP is performed.

The two legs of the U-shell U are preferably designed with an undercut H to the ground. This undercut H ensures in the production process for an optimal anchoring of a potting compound V on the U-shell U.

The material of the U-shell U is preferably made of polyurethane and is preferably produced by extrusion. The U-shell U is adjustable by additive particles in color and properties. It is conceivable, for example, by adding color particles, a pure white U-shell U for optimal light output or by color particles of the RAL palette individual color design depending on the place of use (decorative element). Furthermore, by incorporation of special particles, a flame-retardant material property can be achieved, v.a. for use in areas with increased safety requirements. Furthermore, a heat-conducting property is possible by ceramic particles.

On the base between the two legs, a flexible conductor carrier LP is equipped with LEDs and glued and filled with a preferably clear, consisting of polyurethane potting compound V and thereby protected from moisture or weathering. In order to minimize the point glare can be within the scope of the invention, a translucent potting compound V (see also 13 . 14 . 15 . 21 V2).

In the thickened bottom of the U-shell U run, for example, 4, possible with 2 and more conductors, preferably insulated lines L1, L2,, Ln. These lines L1, L2,, Ln take over the power supply to the individual lengths of the flexible conductor carrier LP. As a result, the total current load is taken from the LED strip LB and most of the current (I1 + I2 + I3 ... + In) passes through the lines in the bottom of the U-shell. Now only the single current I1, I2, I3 ... In, but no longer the sum of the currents flows via the individual flexible line carrier LP (see 5 ). The total current passes through the lines of the U-shell U. connected by plug connectors, in particular plug S and socket B. As a result, the critical voltage drop is taken via the flexible line carrier LP, which has hitherto prevented such large feed lengths.

In the manufacture of the light-emitting diode strip LB according to the invention, a flexible conductor carrier LP, which is preferably equipped with chip light-emitting diodes (LED1, LED2, .., LEDn) in the U-shell U, is introduced. The flexible conductor support LP is glued to the inner bottom between the legs of the profile U. Prior to this step, a mechanical reinforcement T may optionally be introduced to prevent bending against the allowable bending direction of the flexible conductor carrier LP. The individual components are non-positively connected by a suitable adhesive tape.

1. a) einkanalige Ausführung, hierbei werden zwei Leitungen parallel genutzt, d.h., nur 2 Pole der 4 Pole belegt (siehe 8) oder zwei Leitungen zusammengefasst, um Leitungsquerschnitt pro Kanal zu erhöhen und somit den Spannungsfall zu minimieren (siehe 10),
2. b) mehrkanalige Ausführung, hierbei werden je zwei Leitungen für einen Kanal genutzt, d.h. zwei Kanäle als Redundanz, oder drei Kanäle bspw. als Indikator Beleuchtung (RGB) (siehe 9),
3. c) als 3-Kanal, hierbei wird eine Leitung als gemeinsame Kathode bzw. gemeinsame Anode genutzt, die verbleibenden drei Leitungen stehen der 3 - Kanal Ansteuerung zur Verfügung.

The contacting of the flexible conductor support LP with the running in the bottom of the U-shell U insulated lines L1, L2,, Ln, can be done at the end, beginning, center or both sides. Depending on the application, the preferably four lines can be used as follows (see 8th . 9 . 10 ):

1. a) single-channel design, this two lines are used in parallel, ie, only 2 poles of the 4 poles occupied (see 8th ) or two lines in order to increase the line cross section per channel and thus to minimize the voltage drop (see 10 )
2. b) multichannel design, this two channels are used for a channel, ie two channels as redundancy, or three channels, for example, as indicator lighting (RGB) (see 9 )
3. c) as a 3-channel, in this case a line is used as a common cathode or common anode, the remaining three lines are the 3-channel control available.

By a suitable, preferably planer-like tool W (see 6 ), the U-shell U itself and the insulation of the line L1, L2,, Ln are opened and removed on the inside of the U-shell U in such a way that access to the desired line or lines L1, L2, , Ln is exposed at the or the respective points.

A further possibility for exposing the conductors L1, L2,, Ln running inside the U-shell U represents the technique of material removal by grinding or milling (see 7 ). By means of a suitable grinding / milling device with a defined contact pressure and immersion depth, the upper layer of the U-shell U is removed in a defined manner and the conductors L1, L2,, Ln in the interior of the U-shell U become accessible at the respective location or locations.

At this exposed point can now be made (solder) connection to the flexible conductor support LP.

Through a feed on both sides, the maximum length which can be operated with one feed can be repeated, i. to a maximum of twice, be increased.

Another possibility of contacting is the so-called. Piercing technology. In this case, the U-shell U and the line insulation are cut by means of particular needle-like insulation displacement terminals and made a contact with the running inside conductors L1, L2,, Ln.

The production process is briefly described below:

The basic shape used for the finished product is an open profile U made of extruded plastic, preferably polyurethane (PUR). During the extrusion process - as in the 1 to 21 shown - preferably four conductors L1, L2,, Ln introduced so that they run parallel to the bottom of the profile U. This profile U is almost produced in an endless process (see 1 ).

Before further processing, the profile U is cut to the length of the finished product.

The next manufacturing step is now the opening of the inner bottom towards the preferably four, running in the interior of the open profile U, lines L1, L2,, Ln to there later contacting with the flexible conductor support LP, which later on the inner bottom of the open profile U is applied to produce. This opening of the insulation in the floor area can, for example. Via a planer-like tool W (see 6 ) or a suitable grinding / milling combination W (see 7 ) defined. The insulation in the bottom area of the U-shell and the conductors L1, L2,, Ln located therein is removed until the copper conductors of the lines L1, L2,, Ln are bare and thus contacting is possible.

In the next step, the beginning and / or the end of the open profile U is assembled, which means that we removed the outer geometry of the profile U, so that only the insulated or uninsulated conductors L1, L2,, Ln from the bottom of the U-shell just lie. Virtually four individual wires L1, L2,, Ln protrude from the profile U, virtually at each end.

At these exposed individual wires L1, L2,, Ln, a now preferably IP-protected plug-in system S, B is now assembled at the beginning and / or end of the open profile U.

Now, the base body / profile U has a defined length, preferably has an IP plug-in system S, B at the beginning and / or end, is open at a defined point in the interior of the profile U and thus access to the running in the ground conductors L1, L2 , Ln exposed.

In the next step, the profile U is inserted or clamped in a suitable shape, which represents the fixation. As a result, the profile U is fixed in the longitudinal direction, is kept straight and has no height differences. This, in turn, is important for the later process of introducing the potting compound V.

In the next step, the assembly with the mechanical reinforcement T takes place. This reinforcement T, preferably a flat plate with Recesses or a grid is applied to the inner bottom of the open profile U by means of a suitable adhesive. As a result, the exposed conductors L1, L2,, Ln in the bottom of the profile U are not covered and are still free to reach for a contact (see 2 )).

In the next step, the flexible charge carrier LP is introduced on the mechanical reinforcement T introduced in the previous step with a suitable adhesive (see 3 ). It should be noted that a defined distance to the exposed conductors in the bottom of the open profile U is kept free.

In the next step, the contacting takes place between the conductors L1, L2,, Ln running in the bottom of the profile U, and the flexible conductor carrier LP. The connection is preferably made by soldering to ensure a permanent and uninterrupted contact.

The prepared profile U, with connectors S, B at the beginning / end of the introduced mechanical reinforcement T, which is connected to the running inside the open profile U conductors L1, L2, Ln connected flexible conductor support LP and completely in a clamping profile and defined Length unit is now ready for potting.

By means of a linear and CNC controlled casting machine, a defined amount of a sealing compound V, preferably consisting of polyurethane, is now discharged in such a manner that a uniform filling level in the open profile U is achieved. Wherein the potting compound V can consist of one or more layers and in turn can be influenced even by the addition of additives in their properties. In particular, translucent particles for reduced glare and a more uniform light distribution or fluorescent particles which make it possible to emit afterglow are to be mentioned as conceivable settings, above all in areas for safety-relevant orientation illuminations.

The running in the interior of the profile U lines L1, L2,, Ln are at the beginning and at the end each with preferably IP-protected connector S, B confectioned (see 11 ).

By means of a suitable cutting tool, in the beginning and end region of the profile U, the lower part, in which the insulated or non-insulated conductors L1, L2,, Ln extend, can be removed. Now the stripped conductors L1, L2,, Ln are exposed in the beginning and end area and can be assembled with plug S and socket B. Thanks to this technology, the flexible conductor carriers LP, which continue to run on the upper side, can be fitted with the next element, without having to accept a shadow effect at the beginning and at the end (see 12 ).

Furthermore, it is possible within the scope of the invention, the above-described potted LED strip LB or the LED module LB in a horizontally or vertically bending elastic light emitting diode band LEB with homogeneous light emission up to 180 ° and translucent potting compound V2, as in German Patent 10 2013 019 039.8 B3 insert (see 13 . 14 ) to realize long lengths with one feed. As described there and in 13 shown, at least the first leg S1 of the housing G partially consists of a translucent, corresponding to the capillary effect in the wall thickness and tapered in the plastic material of the housing G passing second potting compound V2 and at least partially made of the plastic material of the (U-shaped) housing G, wherein the already finished encapsulated LED strip / LED line LB is arranged on this leg part S1 and embedded in a first transparent sealing compound V1. The light of the chip LEDs LED is reflected by the inner surfaces of the housing G and diffused by the one end face ST of the housing G forming second potting compound V2, wherein the light emitting diode band LEB is horizontally flexible in the extension direction. How to continue in German Patent 10 2013 019 039.8 B3 described and in 14 is shown, in an alternative embodiment, the already finished encapsulated LED strip / LED line LB can be arranged on one of the front side ST of the housing G opposite wall. In this case, part of the light of the chip LEDs LED is reflected by the inner surfaces of the housing G and diffused by the one end face ST of the housing G forming second potting compound V2, wherein the light emitting diode band LEB is vertically elastic in the extension direction. In both alternative embodiments of the light-emitting diode band LEB, both positive properties, namely the opal, homogeneous and flat illuminated surface are combined with a large operable length according to the invention. The manufacturing process of this product type is unchanged from that in the German Patent 10 2013 019 039.8 B3 Now, no flexible conductor carrier is introduced as a light source, but the already finished encapsulated LED strip / LED line LB with the running in profile U isolated or non-insulated conductors L1, L2, .., Ln.

Similar to the use in flexible, homogeneous light lines according to the German Patent 10 2013 019 039.8 B3 The technique can also be used / combined in rigid profiles P, which are preferably made of aluminum. Thereby Again, the positive properties such as the high mechanical strength of the profile U are combined with the large operable length (see 15 ). Here, the already finished encapsulated LED strip / LED line LB can be embedded in a first transparent potting compound V1 and the light of the chip LEDs LED is diffused diffused by the front side ST forming the second potting compound V2.

In the context of the invention, the open profile U, which according to the invention serves both as a carrier and as a casting mold VG, have different geometries; Undercuts or the like in the profile U / in the form U are to be regarded as unproblematic, since the profile U and the potting material V are bending elastic and compensate for the forces occurring during demoulding.

16 shows in detail a second embodiment, namely a convex formation of the open profile U, 17 shows in detail a third embodiment with upwardly tapered flanks of the open profile U, 18 shows in detail a fourth embodiment with convex flanks and straight bottom of the open profile U, 19 shows in detail a fifth embodiment with undercuts and upwardly tapered flanks of the open profile U and 20 shows in detail a sixth embodiment of the flexible open profile, namely a double-T profile U.

Finally shows 21 a third embodiment of the light emitting diode band LEB semi-circular executed basic shape VG according to the invention.

Through the use of two LED modules LED on the double-T profile U (see 20 ) These can also be controlled independently of each other. For example, by differently colored LED strips decorative effects can be achieved by a different dimming of the strip LED; Thus, the color mixture in the luminaire body can be made variable and dynamic. The same principle can also be applied to different shades of white, thus a lamp can be variably adjusted from a warm white tone to a cool white tone. For example, to simulate a daylight simulation (early evening: warm white, during the day: cool white).

Another way, when using several (two or more LED strips) on the double-T profile U (see 20 ) that a strand of LED modules are used for emergency lighting purposes. In practice, in the event of a power failure, the primary illumination of the luminaire does not occur, but an emergency lighting, in particular one of the strings of LED modules, is fed via the separately designed channel.

The holding possibilities of the embodiments of the light emitting diode strip LB according to the invention according to the invention are as follows. By a corresponding profiling of the legs of the open profile U, with symmetrical cross-section, by means of a prestressed holder made of plastic or spring steel, which engages in the negative profiling, a corresponding holding device can be provided, which is easy and quick to assemble. Alternatively, a headband with preload which tapers upwardly and in which the cast light / light emitting diode tape is snapped may be used as a mounting bracket.

The invention is not limited to the illustrated and described embodiments, but also includes all the same in the context of the invention embodiments. Another mounting option of the light-emitting diode strip LB according to the invention is to see a groove with an undercut on the back outside the open profile U itself before. In this undercut groove, a mushroom-shaped holder is inserted and locked, which holds the LED strip LB.

Furthermore, the invention has hitherto not been in the claims 1 , and 9 defined feature combinations, but may also be defined by any other combination of certain features of all individually disclosed individual features. This means that basically every single feature of the claims 1 and 9 omitted or replaced by at least one disclosed elsewhere in the application individual feature.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 10243948 A1 [0002]
• DE 20119861 U1 [0003]
• DE 202005002425 U1 [0004]
• DE 102012110136 A1 [0005]
• DE 202008002044 U1 [0006]
• DE 202005006643 U1 [0007]
• DE 202011003608 A1 [0008]
• DE 102012213309 A1 [0009, 0011, 0012]
• DE 102013019039 B3 [0045, 0046]

Claims (10)

Light-emitting diode band with: A flexible open profile (U) of extruded plastic, • with at least two inside the wall (UW) of the profile (U) integrated electrical lines (L1, L2,, Ln), which run parallel to each other in the wall (UW) and end connectors (S, B) for the chaining of Having light-emitting diode (LB) bands with one another, • With recesses up to the electrical lines (L1, L2,, Ln) in the wall (UW), which the contact surface for the connection of on a flexible conductor carrier (LP) arranged chip light-emitting diodes (LED1, LED2, .., LEDn ) and • with a profile (U) inside filling transparent or translucent potting compound (V), such that the chip light emitting diodes (LED1, LED2, .., LEDn) are protected from moisture or weathering, the total current through the means of connectors (S, B) connected lines (L1, L2,, Ln) of the profile (U) flows and wherein the light emitting diode band (LB) is flexurally elastic to the extension direction. LED strip after Claim 1 , characterized in that the profile (U) is substantially U-shaped and the wall thickness of the walls without electrical lines (L1, L2,, Ln) is smaller. LED strip after Claim 1 , characterized in that the profile (U) is substantially double T-shaped and the wall thickness of the walls without electrical lines (L1, L2,, Ln) is smaller. LED strip after Claim 2 or 3 , characterized in that the legs of the profile (U) are the same length and on the inner circumferential surface a recess (H). LED strip according to one or more of Claims 1 to 4 , characterized in that the outer circumferential surface of the light-emitting diode strip (LB) in cross section is rectangular, square, polygonal, circular or elliptical. LED strip according to one or more of Claims 1 to 5 , characterized in that the flexible conductor carrier (LP) is adhesively bonded to the wall (UW) with the electrical lines. LED strip according to one or more of Claims 1 to 6 , characterized in that, in order to prevent bending against the permissible bending direction of the flexible conductor carrier (LP), a part (T) with recesses for mechanical reinforcement is arranged parallel to the flexible printed circuit board (LP). LED strip according to one or more of Claims 1 to 7 , characterized in that in the potting compound (V) individually or in combination with each other reflective or translucent or fluorescent particles or ceramic particles or color particles or flame-retardant particles are incorporated. Method for producing a light-emitting diode strip according to Claim 1 in which: a) a flexible open profile (U) is extruded with at least two plastic electrical conduits integrated inside a wall of the profile (U), b) the profile (U) is cut to the length of the finished product, c ) Recesses up to the electrical lines in the wall, which form the contact surface for the connection of on a flexible conductor carrier (LP) arranged chip light-emitting diodes (LED) are produced with a cutting tool, d) at the beginning and / or at the end of Profiles (U) a plug-in system is made by the outer geometry of the profile (U) is removed, so that only the isolated electrical wires on the front side of the profile (U) protrude and after stripping in a certain length required for connection a plug or a socket is mounted, e) the profile (U) is fixed with plug-in system in a mold in horizontal longitudinal extent, f) a reinforcement (T) on the inner bottom g) a flexible conductor carrier (LP) is placed on the mechanical reinforcement with an adhesive, h) a contact between the conductors running in the bottom of the profile (U) and the flexible conductor carrier (LP) is produced by a cohesive connection and i) a potting compound (V) in the inner profile (U) is filled. Method according to Claim 9 in which: after method step i) in a further method step j), the light-emitting diode band according to one or more of Claims 1 to 8th introduced into an open casting mold (VG) and then filled up to the filling edge of the casting mold (VG) a transparent and / or translucent potting compound (V, V2).

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