EP3301757B1 - Élément d'antenne à plaque et procédé de fabrication d'un élément d'antenne à plaque - Google Patents

Élément d'antenne à plaque et procédé de fabrication d'un élément d'antenne à plaque Download PDF

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Publication number
EP3301757B1
EP3301757B1 EP16191341.3A EP16191341A EP3301757B1 EP 3301757 B1 EP3301757 B1 EP 3301757B1 EP 16191341 A EP16191341 A EP 16191341A EP 3301757 B1 EP3301757 B1 EP 3301757B1
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EP
European Patent Office
Prior art keywords
patch
antenna element
protrusions
patch antenna
ground plane
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EP16191341.3A
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German (de)
English (en)
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EP3301757A1 (fr
Inventor
Josef Hagn
Omer ASAF
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Intel IP Corp
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Intel IP Corp
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Priority to EP16191341.3A priority Critical patent/EP3301757B1/fr
Priority to EP21158628.4A priority patent/EP3859889A1/fr
Priority to PCT/US2017/045199 priority patent/WO2018063497A1/fr
Publication of EP3301757A1 publication Critical patent/EP3301757A1/fr
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0414—Substantially flat resonant element parallel to ground plane, e.g. patch antenna in a stacked or folded configuration

Definitions

  • the present disclosure relates to antennas for telecommunications and, more particularly, to patch antennas, which, for example, can be used in antenna arrays for wireless communication systems.
  • a patch antenna is a type of radio antenna with a low profile, which can be mounted on a flat surface. It comprises a flat sheet or "patch" of metal, mounted over a larger sheet of metal called a ground plane. Note that the patch can be of many shapes, such as rectangular, circular, triangular, etc. The two metal sheets together form a resonant piece which can be thought of a microstrip transmission line with a length of approximately half a wavelength. The radiation mechanism arises from discontinuities at each truncated edge of the microstrip transmission line. Patch antennas are commonly used in telecommunication devices because they can be extremely compact. However, one issue of conventional patch antennas is their relatively narrow bandwidth. Known patch antenna designs are described in US 2016/276751 A1 , EP 1 775 795 A1 , or US 2016/197404 A1 , for example.
  • MIMO Multiple-Input Multiple-Output
  • 5G 5th Generation
  • the channel matrix has to fulfill some requirements, whereas one of them is that the component channels are uncorrelated.
  • An advantageous way to get two uncorrelated channels in the mm-wave region i.e., the wavelength is in the mm region
  • dual polarized patch antennas since through dual polarization these antennas need less space than single polarized antennas (when all other antenna requirements stay the same, e.g. realized gain).
  • a disadvantage of introducing a second polarization is that the patch antenna design looses a parameter to tune (e.g., the parameter "patch-width" for a simple patch antenna) which makes it harder to fulfill the increasingly bandwidth requirements in the mm-wave range ( ⁇ 10% relative bandwidth).
  • a parameter to tune e.g., the parameter "patch-width" for a simple patch antenna
  • FIGS. 1A and 1B are top and side views of a patch antenna element 10.
  • Patch antenna element 10 comprises a dielectric substrate 12 (for example, Bakelite, FR4 Glass Epoxy, RO4003, Taconic TLC or RT Duroid) bearing a metal patch 14 on the top surface thereof, wherein patch 14 has length l and width w.
  • the length l of patch 14 typically is selected to be 1 ⁇ 2 of the wavelength ⁇ of the signal that patch 14 is intended to radiate (or receive), so that patch 14 resonates at the frequency of the signal and thereby transmits the desired wireless signal.
  • the "length" of a patch antenna generally refers to the distance between the radiating edges of the patch. Thus, for example, in a square patch, this would be the length of a side of the square. For a circular patch, this would be the diameter of the patch. For a rectangular patch, it would be the orthogonal distance between the two radiating edges of the patch (which could be either the short or the long edges depending on the design).
  • metal patch 14 is peripherally surrounded by a frame structure 16, which will also be referred to as top ground plane.
  • Metal patch 14 is separated from top ground plane 16 by gap G.
  • Top ground plane 16 can be implemented in the same metal layer as metal patch 14.
  • Patch 14 and top ground plane 16 may be created by conventional manufacturing techniques such as depositing one or more metal layers on the substrate 12 by any of a number of techniques known in semiconductor fabrication industry and etching them by any of a number of techniques known in the semiconductor fabrication industry to create the two distinct metallizations, i.e., the top ground plane 16 and the patch 14.
  • a feed line 18 may be etched on the opposite side of the substrate 12 or could be etched on a second substrate 20 disposed below the first substrate 12 and bonded thereto. Feed line 18 is coupled to a drive signal (not shown). In the illustrated example, feedline 18 is directly coupled to patch 14 by a feedline via (vertical interconnect access) 18'. In other examples, via 18' could also be omitted so that feed line 18 capacitively drives a signal on patch 14.
  • the feed line of a patch antenna may be coupled directly to the patch in order to directly drive (or receive) the signal. However, a patch antenna also may be exited using a proximity coupled feed line. Particularly, the feed line, whether it is a microstrip or a stripline, may be electrically separated from patch 14 by a dielectric material, including air, and may drive (or receive) the waves on the patch capacitively.
  • feed line 18 alternately may be deposited on the top surface of the second substrate 20, rather than the bottom surface of the first substrate 12.
  • a bottom ground plane 22 is deposited on the bottom of the second substrate 20.
  • Side walls 24 through the substrates 12 and 20 conductively connect the top ground plane 16 to the bottom ground plane 22.
  • Side walls 24 may be implemented using plated through vias, for example. Note that feed line 18 alternately could also be deposited below bottom ground plane 22 for better isolating it from patch 14. For more than one antenna polarization, more then one feed line and/or feed points may be provided to drive patch 14.
  • vias 24 electrically couple the top and bottom ground planes 16 and 22 to each other and thus form a shielded cavity around the patch 14.
  • vias 24 may also be regarded as vertically extending side walls of the cavity laterally surrounding patch 14. This helps to minimize coupling between adjacent patch antenna elements in an array of patch antenna elements.
  • patch antennas elements of this type may be arranged in arrays of hundreds or even thousands of patch antennas elements. More particularly, multiple patch antennas elements may be fabricated on large substrates, such as substrates 12 and 20, that contain multiple patch antenna elements. The fields surrounding the vias help isolate the patch antenna elements from each other.
  • the bandwidth of the antenna can be increased by increasing the volume of the antenna.
  • the volume generally can be understood as the space between the two ground planes 16, 22 and the side walls 24, generally called the cavity of the antenna.
  • the antenna structure of Figs. 1A and 1B is also sometimes referred to as "cavity backed patch antenna".
  • the bandwidth of a cavity backed patch antenna can be increased by decreasing the substrate's 12, 22 permittivity and/or by increasing the distance between the patch 14 and the bottom ground plane 22, i.e., by increasing the vertical dimension of the antenna.
  • the bandwidth also can be increased by increasing the horizontal dimension of the antenna, but this is undesirable in an antenna array environment for several reasons, most notably because it would increase the spacing between the elements which directly impacts the performance of an antenna array (like steering capability, grating lobes, ). However, varying these distances can affect the bandwidth only within a limited range. Furthermore, it is desirable to reduce the size and weight of electronic components, particularly electronic components in telecommunication devices, such as mobile terminals, for example.
  • FIGS. 2A and 2B A perspective view of a simple stacked patch antenna 30 is shown in FIGS. 2A and 2B . While Fig. 2A shows the antenna with substrate layers, Fig. 2B shows the metal layers of antenna 30 without any substrate layers. Note that stacked patch antenna 30 may also be implemented as cavity backed stacked patch antenna, similar to the cavity structure described with respect to Figs. 1A and 1B .
  • a second (parasitic) patch 26 can be placed above the first patch 14 and separated therefrom by a dielectric material (for example, a dielectric substrate) having a permittivity similar to air.
  • the second patch 26 can have approximately similar dimensions as first patch 14.
  • a signal to be transmitted can be input to the antenna through feed line 18, which then can drive both patches 14, 26 simultaneously.
  • the second patch 26 parasitically couples to the drive signal by parasitically capacitively coupling to the first patch 14.
  • the additional resonance provided by the second patch can increase the frequency bandwidth of the antenna. It can also enhance its gain.
  • a second linear polarization is introduced (e.g., by a dual-polarized patch antenna) the antenna loses a tuning parameter and thus loses bandwidth.
  • the present disclosure proposes to bring a tuning parameter back by capacitive coupling of the cavity to a patch and thus achieving a higher bandwidth than without the coupling effect.
  • FIG. 3A it is illustrated an enhanced patch antenna design according to an example of the present disclosure, which can provide an increased bandwidth compared to the examples described above.
  • FIG. 3A is a side view of a patch antenna element 40 according to an example. It comprises a substrate 20, a patch 14 disposed on the substrate 20, and a ground plane 22 disposed on the substrate 20 below the patch 14.
  • patch 14 can be of many shapes, including circular, triangular, and rectangular shapes.
  • ground plane 22 horizontally extends beyond patch 14 (i.e., has a larger horizontal extension) and conductively connects to vertically extending electrically conductive side walls 24 laterally surrounding patch 14.
  • Side walls 24 comprise or conductively connect to a conductive planar arrangement in form of protrusions or projections 36 horizontally extending from the side walls 24 toward the patch 14.
  • electrically conductive protrusions 36 extend inwardly from side walls 24 to patch 14.
  • patch antenna element 40 can be manufactured with an adequate manufacturing method.
  • An example flowchart of a corresponding manufacturing method 130 is illustrated in FIG. 13A .
  • Method 130 includes disposing 132 an antenna ground plane 22 on a substrate 20, wherein the ground plane horizontally extends beyond an area of a patch 14.
  • Method 130 further includes disposing 134 vertically extending side walls 24 on the ground plane 22, wherein the side walls laterally surround the area of the patch.
  • Method 130 further includes forming 136 a conductive planar arrangement in form of protrusions 36 which horizontally extend from the side walls toward the patch 14, and disposing 138 the patch 14 on the substrate 20 above the ground plane 22 such that the patch, the ground plane, the side walls, and the protrusions circumscribe a volume V between the patch and the ground plane.
  • Antenna element 40 may be created by conventional semiconductor manufacturing techniques such as depositing one or more metal layers on one or more substrate layers 12, 20 by any of a number of techniques known in Printed Circuit Board (PCB)/ semiconductor fabrication industry and etching them by any of a number of techniques known in the semiconductor fabrication industry.
  • PCB Printed Circuit Board
  • a horizontal distance d between protrusions 36 and patch 14 may be smaller than a horizontal distance between side walls 24 and patch 14.
  • a horizontal extension h of the protrusions 36 may be larger than a horizontal extension or width h SW of the side walls 24 extending between the protrusions 36 and ground plane 22, i.e. h ⁇ hsw.
  • Side walls 24 may connect to protrusions 36 at a horizontally outer end of protrusions 36, the outer end facing away from patch 14. Thereby, the horizontally inner end of protrusions 36 faces patch 14.
  • the distance d is measured between the horizontally inner end of protrusions 36 and the horizontally outer end of patch 14.
  • protrusions 36 can form a peripheral protruding frame at least partially surrounding patch 14.
  • Protrusions 36 reaching close to patch 14 increase the capacitive coupling between patch 14 and the surrounding cavity formed by protrusions 36, side walls 24, and ground plane 22. This capacitive coupling between protrusions 36 and patch 14 can yield an additional tuning parameter which can be used to enhance the bandwidth of patch antenna element 40 with respect to conventional designs.
  • the protrusions 36 also help to streamline radiating electric field lines in the horizontal direction. A stronger horizontal electric field means more "voltage" over the radiation resistance and this in turn can lead to more radiated power and to a larger bandwidth.
  • protrusions 36 can be formed by a metallic frame structure peripherally surrounding patch 14. This protruding frame structure may also be regarded as an upper ground plane, since it is short circuited with bottom ground plane 22 via side walls 24.
  • the horizontal or lateral gap between protrusions 36 and patch 14 is considerably smaller in FIG. 3A .
  • protrusions 36 reach closer to patch 14 compared to the conventional design of FIGS. 1A and 1B . That is, the capacitive coupling can be implemented by a closely spaced annular or peripheral ring around patch 14 that is connected to ground.
  • Patch 14, ground plane 22, side walls 24, and protrusions 36 may all be formed of one or more metal layers.
  • protrusions 36 extend horizontally toward the patch 14 from an upper end of side walls 24.
  • protrusions 36 may thus also be considered as a top ground plane.
  • a horizontal extension h of the protrusions 36 may be equal to or smaller than ⁇ /4, i.e. 0 ⁇ h ⁇ ⁇ /4, wherein h ⁇ h SW .
  • the protrusions could also be larger than ⁇ /4, but when the antenna is used in an array a good configuration is ⁇ ⁇ /4. Edges of the patch 14 and of the protrusions 36 facing each other are separated by a gap G having width d.
  • the width d of the gap can be smaller than ⁇ /5. According to the invention, it has been found that d ⁇ ⁇ /10 leads to good bandwidth performance of patch antenna element 40.
  • ⁇ denotes the wavelength (in free space) of the Radio Frequency (RF) signal to be emitted or received.
  • protrusions 36 and patch 14 can be implemented in the same metal layer of a layer stack.
  • Patch 14 and protrusions 36 may be created by conventional PCB/ semiconductor manufacturing techniques such as depositing one or more metal layers on the substrate 20 by any of a number of techniques known in semiconductor fabrication industry and etching them by any of a number of techniques known in the semiconductor fabrication industry to create the two distinct metallizations, i.e., protrusions 36 and patch 14.
  • ground plane 22, side walls 24, and protrusions 36 circumscribe a volume V or a cavity between patch 14 and ground plane 22.
  • the volume V may comprise dielectric substrate material 12, for example.
  • Dielectric substrate material 12 can extend underneath the protrusions 36, such that the volume or area 38 directly underneath the protrusions 36 also comprises dielectric substrate material 12.
  • side walls 24, which may be formed by vias, and ground plane 22 form a shielded cavity around the patch 14, which helps to minimize coupling between adjacent patch antenna elements in an array of patch antenna elements.
  • patch antenna element 40 will further comprise at least one feedline (not shown) which can be coupled (e.g. by an ohmic contact) to the patch 14 in various ways. It may be directly coupled to the patch 14 via at least one feedpoint. In other examples, the feedline and patch 14 may be capacitively coupled. In the first case, the at least one feedline may be guided to the at least one feedpoint of the patch 14 through the ground plane 22. In examples related to multi-polarized patch antennas, patch antenna element 40 may optionally comprise a first feedline coupled to patch 14 via a first feedpoint configured for a first antenna polarization and a second feedline coupled to patch 14 via a second feedpoint configured for a second antenna polarization.
  • the side walls 24 of FIG. 3A could also be omitted, leading to an example patch antenna element 40' without cavity but merely with a conductive planar arrangement or frame structure 36 above ground plane 22, wherein the conductive planar arrangement 36 at least partially laterally surrounds patch 14. Edges of the patch 14 and of the conductive planar arrangement 36 facing each other are separated by gap G having width d.
  • the width d gap G can be smaller than ⁇ /5. It has been found that d ⁇ ⁇ /10 can lead to good bandwidth performance of patch antenna element 40'.
  • a horizontal extension h of the conductive planar arrangement 36 may be equal to or smaller than ⁇ /4, i.e. 0 ⁇ h ⁇ ⁇ /4, wherein h ⁇ h SW . However, horizontal extension h of the conductive planar arrangement 36 could also be larger than ⁇ /4.
  • patch antenna element 40' can be manufactured with an adequate manufacturing method.
  • An example flowchart of a corresponding manufacturing method 130' is illustrated in FIG. 13B .
  • Method 130' includes disposing 132 an antenna ground plane 22 on a substrate 20, wherein the ground plane horizontally extends beyond an area of a patch 14.
  • Method 130' further includes disposing 138 the patch 14 on the substrate 20 above the ground plane 22, and forming or disposing 139 a conductive planar arrangement or frame structure 36 on the substrate 20 above the ground plane 22, wherein the conductive planar arrangement or frame structure 36 at least partially laterally surrounds the patch 14.
  • Antenna element 40' may be created by conventional semiconductor manufacturing techniques such as depositing one or more metal layers on one or more substrate layers 12, 20 by any of a number of techniques known in Printed Circuit Board (PCB)/ semiconductor fabrication industry and etching them by any of a number of techniques known in the semiconductor fabrication industry.
  • PCB Printed Circuit Board
  • FIG. 4A shows a further example of a patch antenna element 50 according to the present disclosure.
  • patch antenna element 50 comprises a second parasitic patch 26 disposed above the first patch 14 to form a cavity backed stacked patch antenna.
  • Parasitic patch 26 is separated from the first patch 14 by dielectric substrate material 52 disposed between parasitic patch 26 and the first patch 14 for capacitive coupling between parasitic patch 26 and patch 14.
  • side walls 24 extend up to parasitic patch 26 in order to isolate the patch antenna element 50 from adjacent ones.
  • protrusions 36 do not extend horizontally toward the patch 14 from an upper end of the side walls but from a portion of the side walls 24 in essentially the same vertical height as the first patch 14.
  • the side walls 24 could also end in the height of the first patch 14, similar to FIG. 3 .
  • the side walls 24 of FIG. 4A could also be omitted, leading to an example patch antenna element 50' without cavity but merely with a conductive planar arrangement or frame structure 36 at least partially laterally surrounding patch 14 vis-à-vis the radiating edges of patch 14. Edges of the patch 14 and of the conductive planar arrangement 36 facing each other are separated by gap G having width d.
  • the width d gap G can be smaller than ⁇ /5 or even smaller than ⁇ /10.
  • a horizontal extension h of the conductive planar arrangement 36 may be equal to or smaller than ⁇ /4, i.e. 0 ⁇ h ⁇ ⁇ /4, wherein h ⁇ h SW .
  • horizontal extension h of the conductive planar arrangement 36could also be larger than ⁇ /4.
  • FIGS. 5 and 6 show further examples of the present disclosure.
  • side walls 24 comprise or conductively connect to protrusions 36 and 36' horizontally extending toward patch 14 and parasitic patch 26, respectively.
  • Protrusions 36' related to parasitic patch 26 can be formed by a metallic frame structure peripherally surrounding parasitic patch 26.
  • protrusions 36' extend horizontally toward the parasitic patch 26 from an upper end of side walls 24. Edges of the parasitic patch 26 and the protrusions 36' facing each other are separated by a gap.
  • a width d' of the gap is smaller than ⁇ /5. It has been found that d ⁇ ⁇ /10 can lead to good performance of patch antenna element 60.
  • widths d and d' can be different from each other in some examples.
  • protrusions 36' and parasitic patch 26 can be implemented in the same metal layer of a layer stack.
  • Parasitic patch 26 and corresponding protrusions 36' may be created by conventional PCB/ semiconductor manufacturing techniques such as depositing one or more metal layers on the substrate 20, 12, 52 by any of a number of techniques known in semiconductor fabrication industry and etching them by any of a number of techniques known in the PCB/ semiconductor fabrication industry to create the distinct metallizations.
  • the side walls 24 of FIG. 5A could also be omitted, leading to an example patch antenna element 60' without cavity but merely with a first conductive planar arrangement or frame structure 36 at least partially laterally surrounding patch 14 vis-à-vis the radiating edges of patch 14 and a second conductive planar arrangement or frame structure 36' at least partially laterally surrounding parasitic patch 26 vis-à-vis the radiating edges of parasitic patch 26.
  • side walls 24 only comprise or conductively connect to protrusions 36' horizontally extending toward parasitic patch 26.
  • the protrusions 36 of the previous examples are omitted here. Due to the protrusions 36' related to parasitic patch 26 still a better bandwidth of patch antenna element 70 may be achieved compared to conventional solutions.
  • the side walls 24 of FIG. 6A could also be omitted, leading to an example patch antenna element 70' without cavity but merely with a conductive planar arrangement or frame structure 36' at least partially laterally surrounding parasitic patch 26 vis-à-vis the radiating edges of parasitic patch 26.
  • protrusions may be located below or above patch 14 or parasitic patch 26. That is to say, patch and related protrusions do not necessarily have to be implemented in the same metal layer. Examples also allow for an implementation in different metal layers, leading to a different vertical position of patch and related protrusions.
  • FIGS. 7 and 8 provide a comparison between a conventional cavity backed stacked patch antenna 80, which is similar to the example discussed with respect to FIGS. 1A and 1B , and an enhanced cavity backed stacked patch antenna 90 according to an example of the present disclosure.
  • FIG. 7 shows a substrate 20 which can comprise a plurality of substrate layers.
  • a ground metal layer 82 is formed on substrate 20 and separated from a feed line 84 by substrate material.
  • Above feedline 84 antenna ground plane 22 is deposited.
  • Electrically conductive sidewalls 24 electrically couple the top and bottom ground planes 16 and 22 to each other and thus form a shielded cavity around patch 14.
  • Further dielectric layers 52 and a parasitic patch 26 are bonded on top of patch 14. Due to the larger gap (here: in the mm range) between top ground plane 16 and patch 14 there is only a relatively weak capacitive coupling between top ground plane 16 and patch 14 in the conventional device 80.
  • top ground plane 16 additionally comprises protrusion portions 36 extending inwardly toward patch 14, thus leading to a considerably smaller gap between protrusion portions 36 and patch 14.
  • the protrusion portions 36 are only implemented in the top metal layer of a metal layer stack forming the side walls 24.
  • the gap between protrusion portions 36 and patch 14 only has a horizontal width of 200 ⁇ m compared to a horizontal extension of patch 14 in the mm range. This smaller gap leads to higher capacitive coupling between protrusion portions 36 and patch 14 in the device 90.
  • the ground metal 22 is strongly coupled to the adjacent patch 14. This coupling can take place on all four sides of the patch 14 in some embodiments, and can thus enable a broadband matching of the antenna.
  • FIGS. 9A and 9B A perspective view the stacked patch antenna 90 of FIG. 8 is shown in FIGS. 9A and 9B . While FIG. 9A shows the antenna 90 with substrate layers, FIG. 9B shows antenna 90 without substrate layers.
  • FIGS. 10A , B and 11A, B shows a possible improvement between a conventional stacked patch antenna design without improved metal cavity surrounding and a stacked patch antenna design with metal cavity surrounding according to an example of the present disclosure.
  • a significant antenna bandwidth improvement can be achieved with metal cavity surrounding and protrusions.
  • the antenna bandwidth (for example, where the antenna reflection is less than - 10dB) has been improved from 2,032 GHz for the conventional case to 3,173 GHz, which is a substantial increase in bandwidth.
  • FIG. 11C depicts the radiation efficiency and total efficiency of both conventional and enhanced antenna structures. It can be seen that the increase in bandwidth of the enhanced design does not originate from a decrease in radiation efficiency. In fact a slight increase in radiation efficiency can be recognized for the enhanced metal cavity backed stacked patch antenna (EMCBSPA).
  • EMCBSPA enhanced metal cavity backed stacked patch antenna
  • FIGS. 12A and 12B illustrate the influence of a horizontal thickness of the sidewalls hsw relative to the horizontal extension of the protrusions h P , given the same vertical and horizontal extensions of the patch antenna element h PA and the same minimum gap width d between sidewalls and patch.
  • the ratio h P / h SW may be chosen larger than 1 (i.e., h P > h SW ) or even larger than 2 (i.e., h P > 2 h SW ).
  • the proposed capacitive coupling of the metal cavity to the main and/or parasitic patch can bring back a tuning parameter which can be used to enhance the bandwidth.
  • the proposed metal cavity can ensure a good metal density on every layer (> 50%) which may be crucial for the lamination process.
  • the higher metallization density may on top of that be very helpful for heat dissipation generated by an Radio Frequency Integrated Circuit (RFIC) which can be flip-chip mounted to the other side of the antenna.
  • RFIC Radio Frequency Integrated Circuit
  • the proposed metal cavity can attenuate the coupling between neighboring elements in an antenna array due to the fact that the metal walls damp the propagation of surface waves in the dielectric substrate.
  • An example of an antenna array 140 comprising a plurality (here: four) of enhanced cavity backed patch antenna elements according to the present disclosure is shown FIG. 14 .
  • FIG. 15 is a more detailed block diagram of an example of a device, e.g. a telecommunication device, in which enhanced cavity backed patch antenna elements according to example implementations can be implemented.
  • Device 1500 can represent a mobile computing device, such as a computing tablet, a mobile phone or smartphone, a wireless-enabled e-reader, wearable computing device, or other telecommunication device. It will be understood that certain of the components are shown generally, and not all components of such a device are shown in device 1500.
  • Device 1500 includes processor 1510, which performs the primary processing operations of device 1500.
  • Processor 1510 can include one or more physical devices, such as microprocessors, application processors, microcontrollers, programmable logic devices, or other processing means.
  • the processing operations performed by processor 1510 include the execution of an operating platform or operating system on which applications and/or device functions are executed.
  • the processing operations include operations related to I/O (input/output) with a human user or with other devices, operations related to power management, and/or operations related to connecting device 1500 to another device.
  • the processing operations can also include operations related to audio I/O and/or display I/O.
  • device 1500 includes audio subsystem 1520, which represents hardware (e.g., audio hardware and audio circuits) and software (e.g., drivers, codecs) components associated with providing audio functions to the computing device. Audio functions can include speaker and/or headphone output, as well as microphone input. Devices for such functions can be integrated into device 1500, or connected to device 1500. In one embodiment, a user interacts with device 1500 by providing audio commands that are received and processed by processor 1510.
  • audio subsystem 1520 represents hardware (e.g., audio hardware and audio circuits) and software (e.g., drivers, codecs) components associated with providing audio functions to the computing device. Audio functions can include speaker and/or headphone output, as well as microphone input. Devices for such functions can be integrated into device 1500, or connected to device 1500. In one embodiment, a user interacts with device 1500 by providing audio commands that are received and processed by processor 1510.
  • Display subsystem 1530 represents hardware (e.g., display devices) and software (e.g., drivers) components that provide a visual and/or tactile display for a user to interact with the computing device.
  • Display subsystem 1530 includes display interface 1532, which includes the particular screen or hardware device used to provide a display to a user.
  • display interface 1532 includes logic separate from processor 1510 to perform at least some processing related to the display.
  • display subsystem 1530 includes a touchscreen device that provides both output and input to a user.
  • display subsystem 1530 includes a high definition (HD) display that provides an output to a user.
  • High definition can refer to a display having a pixel density of approximately 100 PPI (pixels per inch) or greater, and can include formats such as full HD (e.g., 1080p), retina displays, 4K (ultra high definition or UHD), or others.
  • I/O controller 1540 represents hardware devices and software components related to interaction with a user. I/O controller 1540 can operate to manage hardware that is part of audio subsystem 1520 and/or display subsystem 1530. Additionally, I/O controller 1540 illustrates a connection point for additional devices that connect to device 1500 through which a user might interact with the system. For example, devices that can be attached to device 1500 might include microphone devices, speaker or stereo systems, video systems or other display device, keyboard or keypad devices, or other I/O devices for use with specific applications such as card readers or other devices.
  • I/O controller 1540 can interact with audio subsystem 1520 and/or display subsystem 1530.
  • input through a microphone or other audio device can provide input or commands for one or more applications or functions of device 1500.
  • audio output can be provided instead of or in addition to display output.
  • display subsystem includes a touchscreen
  • the display device also acts as an input device, which can be at least partially managed by I/O controller 1540.
  • I/O controller 1540 manages devices such as accelerometers, cameras, light sensors or other environmental sensors, gyroscopes, global positioning system (GPS), or other hardware that can be included in device 1500.
  • the input can be part of direct user interaction, as well as providing environmental input to the system to influence its operations (such as filtering for noise, adjusting displays for brightness detection, applying a flash for a camera, or other features).
  • device 1500 includes power management 1550 that manages battery power usage, charging of the battery, and features related to power saving operation.
  • Memory subsystem 1560 includes memory device(s) 1562 for storing information in device 1500.
  • Memory subsystem 1560 can include nonvolatile (state does not change if power to the memory device is interrupted) and/or volatile (state is indeterminate if power to the memory device is interrupted) memory devices.
  • Memory 1560 can store application data, user data, music, photos, documents, or other data, as well as system data (whether longterm or temporary) related to the execution of the applications and functions of system 1500.
  • memory subsystem 1560 includes memory controller 1564 (which could also be considered part of the control of system 1500, and could potentially be considered part of processor 1510).
  • Memory controller 1564 includes a scheduler to generate and issue commands to memory device 1562.
  • Connectivity 1570 includes hardware devices (e.g., wireless and/or wired connectors and communication hardware) and software components (e.g., drivers, protocol stacks) to enable device 1500 to communicate with external devices.
  • the external device could be separate devices, such as other computing devices, wireless access points or base stations, as well as peripherals such as headsets, printers, or other devices.
  • Connectivity 1570 can include multiple different types of connectivity.
  • device 1500 is illustrated with cellular connectivity 1572 and wireless connectivity 1574.
  • Cellular connectivity 1572 refers generally to cellular network connectivity provided by wireless carriers, such as provided via GSM (global system for mobile communications) or variations or derivatives, CDMA (code division multiple access) or variations or derivatives, TDM (time division multiplexing) or variations or derivatives, LTE (long term evolution - also referred to as "4G"), or other cellular service standards.
  • Wireless connectivity 1574 refers to wireless connectivity that is not cellular, and can include personal area networks (such as Bluetooth), local area networks (such as WiFi), and/or wide area networks (such as WiMax), or other wireless communication, such as NFC.
  • Wireless communication refers to transfer of data through the use of modulated electromagnetic radiation through a non-solid medium. Wired communication occurs through a solid communication medium.
  • Cellular connectivity 1572 and/or wireless connectivity 1574 can implement example patch antennas of the present disclosure.
  • Peripheral connections 1580 include hardware interfaces and connectors, as well as software components (e.g., drivers, protocol stacks) to make peripheral connections. It will be understood that device 1500 could both be a peripheral device ("to" 1582) to other computing devices, as well as have peripheral devices ("from” 1584) connected to it. Device 1500 commonly has a "docking" connector to connect to other computing devices for purposes such as managing (e.g., downloading and/or uploading, changing, synchronizing) content on device 1500. Additionally, a docking connector can allow device 1500 to connect to certain peripherals that allow device 1500 to control content output, for example, to audiovisual or other systems.
  • software components e.g., drivers, protocol stacks
  • device 1500 can make peripheral connections 1580 via common or standards-based connectors.
  • Common types can include a Universal Serial Bus (USB) connector (which can include any of a number of different hardware interfaces), DisplayPort including MiniDisplayPort (MDP), High Definition Multimedia Interface (HDMI), Firewire, or other type.
  • USB Universal Serial Bus
  • MDP MiniDisplayPort
  • HDMI High Definition Multimedia Interface
  • Firewire or other type.
  • a functional block denoted as "means for " performing a certain function may refer to a circuit that is configured to perform a certain function.
  • a "means for s.th.” may be implemented as a "means configured to or suited for s.th.”, such as a device or a circuit configured to or suited for the respective task.
  • Functions of various elements shown in the figures may be implemented in the form of dedicated hardware, such as “a signal provider”, “a signal processing unit”, “a processor”, “a controller”, etc. as well as hardware capable of executing software in association with appropriate software.
  • a processor the functions may be provided by a single dedicated processor, by a single shared processor, or by a plurality of individual processors, some of which or all of which may be shared.
  • processor or “controller” is by far not limited to hardware exclusively capable of executing software, but may include digital signal processor (DSP) hardware, network processor, application specific integrated circuit (ASIC), field programmable gate array (FPGA), read only memory (ROM) for storing software, random access memory (RAM), and non-volatile storage.
  • DSP digital signal processor
  • ASIC application specific integrated circuit
  • FPGA field programmable gate array
  • ROM read only memory
  • RAM random access memory
  • non-volatile storage Other hardware, conventional and/or custom, may also be included.
  • a block diagram may, for instance, illustrate a high-level circuit diagram implementing the principles of the disclosure.
  • a flow chart, a flow diagram, a state transition diagram, a pseudo code, and the like may represent various processes, operations or steps, which may, for instance, be substantially represented in computer readable medium and so executed by a computer or processor, whether or not such computer or processor is explicitly shown.
  • Methods disclosed in the specification or in the claims may be implemented by a device having means for performing each of the respective acts of these methods.

Landscapes

  • Waveguide Aerials (AREA)

Claims (13)

  1. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) comprenant :
    un substrat (12 ; 20) ;
    une plaque (14 ; 26) disposée sur le substrat ;
    un plan de masse (22) disposé sur le substrat en dessous de la plaque, le plan de masse s'étendant horizontalement au-delà de la plaque ; et
    un agencement plan conducteur (24 ; 36 ; 36') entourant au moins partiellement latéralement la plaque ;
    dans lequel des bords de la plaque (14 ; 26) et de l'agencement plan conducteur (24 ; 36 ; 36') se faisant face sont séparés par un espace (G) ;
    caractérisé en ce que
    une extension horizontale (d, d') de l'espace (G) est inférieure à λ/10, λ désignant une longueur d'onde d'un signal radiofréquence à émettre ou recevoir par l'intermédiaire de l'élément d'antenne à plaque.
  2. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon l'une quelconque des revendications précédentes, comprenant en outre des parois latérales s'étendant verticalement (24), connectés de manière conductrice au plan de masse (22), les parois latérales (24) entourant latéralement la plaque et comprenant des protubérances planes (36 ; 36') s'étendant horizontalement vers la plaque.
  3. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon la revendication 2, dans lequel le plan de masse (22), les parois latérales (24), et les protubérances (36 ; 36') circonscrivent un volume entre la plaque (14 ; 26) et le plan de masse (22).
  4. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon la revendication 2 ou 3, dans lequel les protubérances (36 ; 36') s'étende horizontalement vers la plaque (14 ; 26) à partir d'une extrémité supérieure des parois latérales (24).
  5. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon l'une quelconque des revendications 2 à 4, dans lequel une extension horizontale (36 ; 36') des protubérances est supérieure à une extension horizontale des parois latérales (24) entre les protubérances (36 ; 36') et le plan de masse (22).
  6. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon l'une quelconque des revendications 2 à 5, dans lequel une extension horizontale des protubérances (36 ; 36') est égale ou inférieure à λ/4, λ désignant une longueur d'onde d'un signal radiofréquence à émettre ou recevoir par l'intermédiaire de l'élément d'antenne à plaque.
  7. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon l'une quelconque des revendications précédentes, comprenant en outre :
    une plaque parasite (26) disposée au-dessus de la plaque (14).
  8. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon la revendication 7, dans lequel la plaque parasite (26) est séparée de la plaque (14) par un matériau de substrat diélectrique disposé entre la plaque parasite (26) et la plaque (14) pour un couplage capacitif entre la plaque parasite et la plaque.
  9. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon l'une quelconque des revendications 7 ou 8, dans lequel une extension horizontale de la plaque parasite (26) est inférieure à une extension horizontale de la plaque (14).
  10. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon l'une quelconque des revendications précédentes, dans lequel l'espace comprend un matériau de substrat diélectrique.
  11. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon l'une quelconque des revendications précédentes, comprenant en outre :
    au moins une ligne d'alimentation couplée à la plaque (14 ; 26).
  12. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon la revendication 11, comprenant une première ligne d'alimentation couplée à la plaque (14 ; 26) par l'intermédiaire d'un premier point d'alimentation configuré pour une première polarisation d'antenne et une seconde ligne d'alimentation couplée à la plaque (14 ; 26) par l'intermédiaire d'un second point d'alimentation configuré pour une seconde polarisation d'antenne.
  13. Elément d'antenne à plaque (40 ; 50 ; 60 ; 70 ; 90) selon l'une quelconque des revendications précédentes, dans lequel la plaque (14 ; 26) et l'agencement plan conducteur (24 ; 36 ; 36') sont mis en œuvre dans la même couche métallique d'un empilement de couches.
EP16191341.3A 2016-09-29 2016-09-29 Élément d'antenne à plaque et procédé de fabrication d'un élément d'antenne à plaque Active EP3301757B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP16191341.3A EP3301757B1 (fr) 2016-09-29 2016-09-29 Élément d'antenne à plaque et procédé de fabrication d'un élément d'antenne à plaque
EP21158628.4A EP3859889A1 (fr) 2016-09-29 2016-09-29 Élément d'antenne à plaque et procédé de fabrication d'un élément d'antenne à plaque
PCT/US2017/045199 WO2018063497A1 (fr) 2016-09-29 2017-08-03 Élément d'antenne patch et procédé de fabrication d'un élément d'antenne patch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP16191341.3A EP3301757B1 (fr) 2016-09-29 2016-09-29 Élément d'antenne à plaque et procédé de fabrication d'un élément d'antenne à plaque

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP21158628.4A Division EP3859889A1 (fr) 2016-09-29 2016-09-29 Élément d'antenne à plaque et procédé de fabrication d'un élément d'antenne à plaque

Publications (2)

Publication Number Publication Date
EP3301757A1 EP3301757A1 (fr) 2018-04-04
EP3301757B1 true EP3301757B1 (fr) 2021-02-24

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EP21158628.4A Pending EP3859889A1 (fr) 2016-09-29 2016-09-29 Élément d'antenne à plaque et procédé de fabrication d'un élément d'antenne à plaque
EP16191341.3A Active EP3301757B1 (fr) 2016-09-29 2016-09-29 Élément d'antenne à plaque et procédé de fabrication d'un élément d'antenne à plaque

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP21158628.4A Pending EP3859889A1 (fr) 2016-09-29 2016-09-29 Élément d'antenne à plaque et procédé de fabrication d'un élément d'antenne à plaque

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Country Link
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WO (1) WO2018063497A1 (fr)

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US11380979B2 (en) 2018-03-29 2022-07-05 Intel Corporation Antenna modules and communication devices
US10854978B2 (en) * 2018-04-23 2020-12-01 Samsung Electro-Mechanics Co., Ltd. Antenna apparatus and antenna module
WO2019210979A1 (fr) * 2018-05-04 2019-11-07 Telefonaktiebolaget Lm Ericsson (Publ) Élément d'antenne à cavité et agencement d'antenne réseau
US11011827B2 (en) * 2018-05-11 2021-05-18 Intel IP Corporation Antenna boards and communication devices
CN108417995B (zh) * 2018-05-11 2023-09-12 深圳市信维通信股份有限公司 用于5g移动通信的天线单元及阵列天线
US11509068B2 (en) 2018-08-24 2022-11-22 Kyocera Corporation Structure, antenna, wireless communication module, and wireless communication device
US11831082B2 (en) 2018-08-24 2023-11-28 Kyocera Corporation Structure, antenna, wireless communication module, and wireless communication device
EP3846288A4 (fr) * 2018-08-27 2022-05-25 Kyocera Corporation Structure de résonnance et antenne
US10931014B2 (en) 2018-08-29 2021-02-23 Samsung Electronics Co., Ltd. High gain and large bandwidth antenna incorporating a built-in differential feeding scheme
CN109860986B (zh) * 2019-01-23 2020-07-17 电子科技大学 一种基于环形辐射贴片的频率可重构微带天线
CN113178697B (zh) * 2021-04-09 2023-11-10 维沃移动通信有限公司 电路板及电子设备
TWI819386B (zh) * 2021-09-29 2023-10-21 群邁通訊股份有限公司 天線單元及陣列天線

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US7636063B2 (en) * 2005-12-02 2009-12-22 Eswarappa Channabasappa Compact broadband patch antenna
KR100758998B1 (ko) * 2006-05-24 2007-09-17 삼성전자주식회사 근거리 통신용 패치 안테나
US7427957B2 (en) * 2007-02-23 2008-09-23 Mark Iv Ivhs, Inc. Patch antenna
WO2015083457A1 (fr) * 2013-12-03 2015-06-11 株式会社村田製作所 Antenne à plaque
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Publication number Publication date
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EP3301757A1 (fr) 2018-04-04
EP3859889A1 (fr) 2021-08-04

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