EP3283814A1 - Dispositif d'éclairage avec des led - Google Patents

Dispositif d'éclairage avec des led

Info

Publication number
EP3283814A1
EP3283814A1 EP16705919.5A EP16705919A EP3283814A1 EP 3283814 A1 EP3283814 A1 EP 3283814A1 EP 16705919 A EP16705919 A EP 16705919A EP 3283814 A1 EP3283814 A1 EP 3283814A1
Authority
EP
European Patent Office
Prior art keywords
substrate
lighting device
leds
reflector
remaining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16705919.5A
Other languages
German (de)
English (en)
Inventor
Philipp SCHLOSSER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP3283814A1 publication Critical patent/EP3283814A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/08—Refractors for light sources producing an asymmetric light distribution
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0025—Combination of two or more reflectors for a single light source
    • F21V7/0033—Combination of two or more reflectors for a single light source with successive reflections from one reflector to the next or following
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/28—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/049—Patterns or structured surfaces for diffusing light, e.g. frosted surfaces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0008—Reflectors for light sources providing for indirect lighting
    • F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/50—Light sources with three-dimensionally disposed light-generating elements on planar substrates or supports, but arranged in different planes or with differing orientation, e.g. on plate-shaped supports with steps on which light-generating elements are mounted
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present invention relates to a
  • Lighting device with a flat substrate and a plurality of LEDs on it.
  • LED-based compared to conventional light sources, for example. Have energy efficiency, are known.
  • a challenge may arise with respect to the relative arrangement, ie, in concrete terms, the mounting of the LEDs, for example, to produce a desired light distribution in the far field or else a special, typically as homogeneous as possible illumination intensity distribution on a radiating surface.
  • the present invention is based on the technical problem, a particularly advantageous
  • this object solves a
  • a lighting device for emitting light comprising a sheet substrate, a printed circuit pattern on the substrate, a plurality of LEDs mounted on the substrate mounted and electrically conductive with the
  • Conductor track structure are connected, wherein a plurality of subregions of the substrate of the remaining substrate with one of the substrate in the thickness direction passing, but in their longitudinal extension but open parting line are partially separated, so are each still connected via a bridge area with the rest of the substrate, which joints each spaced from one edge of the substrate with respect to its surface directions extend completely within the substrate, and wherein in the sub-regions in each case at least one of the LEDs is arranged and which portions are further folded respectively around the bridge area from the rest of the substrate and so obliquely employed; and a method comprising the steps of: providing the substrate; Introduction of the joints;
  • a basic idea of the invention is thus to provide a flat, ie thin substrate, but nevertheless to achieve an at least partially detached from the surface adaptability of the light output (with respect to the directions) by folding out the subregions.
  • the substrate can be equipped with the LEDs approximately before folding out the subregions, that is, in principle, two-dimensionally, which can be easier to integrate into a mass production than equipping a three-dimensional object.
  • the "planar" substrate has in each of its surface directions a considerably larger, for example, by at least 20, 50, 100, 250, 500 or 1,000 times (in the order of naming increasingly preferred), extension as In the case of a thickness varying across the substrate, an average value formed over the substrate is considered, and preferably the thickness is constant.
  • the subregions are each partially separated with a parting line from the rest of the substrate.
  • the "remaining substrate” is the substrate apart from all subareas, so there is no subregion to it, but this separation is only conceptual in nature, each of the subregions is connected to the rest of the substrate via the respective bridge region, which is also part of the substrate.
  • the substrate is at least in relation on the surface directions, preferably in the whole, a monolithic part of it, apart from statistically randomly arranged inclusions therein, such as reflection particles, in its interior is free of material boundaries between different materials or materials of different production history.
  • the partial regions, the remaining substrate and the bridge regions are made of the same, continuous substrate material.
  • the joints in their longitudinal extension each describe open (not closed) curves;
  • the joints are each U-shaped.
  • the joints are each completely within the substrate, so do not reach to an outer edge of the substrate (but are just spaced with respect to the surface directions of the substrate).
  • the parting lines (with respect to the surface directions) each extend between two end points and in each case both end points lie within the planar substrate. This may, for example, be advantageous insofar as an edge region of the substrate can remain free of joints, which can increase the mechanical stability.
  • the illumination device according to the invention has a "plurality" of LEDs, for example in this order increasingly preferably at least 5, 10, 20, 30, 40, 50, 60, 70, 80, 90 or 100 LEDs, possible upper limits can (independently thereof), for example With the lighting device and a corresponding number of LEDs, for example, a large-area light output can be realized, with the folded out partial areas, as explained in more detail below, for example, a uniform
  • Illuminance distribution on the exit side can be achieved.
  • At least one of the LEDs should be provided in each case and, for example, not more than 5, 4, 3 or 2 LEDs (increasingly preferred in the order in which they are mentioned); Particularly preferably, exactly one LED is arranged in each subarea.
  • LED preferably means an LED chip which is enclosed in its own form.
  • plural of subareas, for example, at least 5 subareas (and independently thereof) may be used, for example. B. be provided not more than 1,000 sub-areas; The lower and upper limits disclosed above for the number of LEDs in the lighting device may also be preferred in the case of the subregions (also irrespective of how many LEDs are provided per subregion).
  • LEDs and other components may be disposed on the substrate, such as a driver ⁇ and / or control electronics, or resistors, connectors or more of the contacting / operation of the LEDs serving components.
  • a driver ⁇ and / or control electronics or resistors, connectors or more of the contacting / operation of the LEDs serving components.
  • resistors, connectors or more of the contacting / operation of the LEDs serving components may be provided on the substrate.
  • further LEDs on the substrate Preferably, however, all the LEDs of the lighting device are arranged in folded out partial areas, which are each formed with a parting line.
  • the subregions for example, each have an area of at least 10 mm 2 , 30 mm 2 or 50 mm 2 and independently thereof of not more than 5,000 mm 2 , 3,000 mm 2 , 1,000 mm 2 or 500 mm 2 (in each case in FIG the order of naming increasingly preferred).
  • the subregions are folded out of the rest of the substrate around the respective bridge region, ie bent out of the rest of the substrate as a kind of hinge, for example, in each case in order more preferably at least 10 °, 15 °, 20 °, 25 °, 30 ° , 35 ° and 40 ° and (independently) by not more than in this order increasingly preferably at most 80 °, 70 °, 60 ° and 50 °, respectively.
  • the three-dimensional arrangement created by bending out remains due to plastic deformation of the substrate itself and / or a part connected thereto (preferably the track structure, see below).
  • the subregions are each folded out of the remaining substrate around a fold line, thus in each case a fold line marks the transition between the subregion and the remaining substrate.
  • the respective fold line then preferably extends as straight connecting line between the two end points of the associated parting line.
  • the rest of the substrate is flat for itself and / or the subregions are each plan by itself, particularly preferably both.
  • the remainder of the substrate is considered to be "self-leveling" if a region thereof within which the subregions are located is planar, so that the remaining substrate can be bent over in an edge region for assembly purposes, for example for example, to a surface portion of at least 70%, 80% or 90% plan.
  • the remaining substrate on the substrate has an area fraction of at least 30%, wherein at least 40%, 50% or 60% are further, in the order of naming increasingly preferred lower limits.
  • the surface area of the rest of the substrate should amount to, for example, not more than 90% or 80%.
  • the folded-out or "obliquely" employment of a respective partial area relative to the rest of the substrate means, for example, that the thickness direction in the respective partial area to that in the remaining substrate is increasingly preferably at least 10 °, 15 °, 20 °, 25 °, 30 ° in this order °, 35 ° or 40 ° tilted upper limits independent of these lower limits may, for example, in this order increasingly preferably at most 80 °, 70 °, 60 ° or 50 °.
  • the main propagation direction of the light emitted from the respective partial area relative to the thickness direction of the remaining substrate may be increased in this order increasingly preferably at least 10 °, 15 °, 20 °, 25 °, 30 °, 35 ° or 40 ° tilted, possible upper limits are (independent of the lower limits), for example, in this order increasingly preferably at most 80 °, 70 °, 60 ° or 50 °
  • the "main propagation direction” is formed in each case as the mean value of all the direction vectors along which light is emitted by the LED (s), wherein in this averaging each direction vector is weighted with its associated light intensity.
  • the thickness direction of the remaining substrate is initially taken directly per subarea at the parting line of the respective subarea in the remaining substrate, if necessary, as formed along the parting line average.
  • the thickness direction of the planar part thereof is taken as the basis.
  • the subregions are therefore preferably planar in each case, in general they can also have a more complex structure, for example, in each case being subdivided into a plurality of subareas. For each subarea, for example, the next adjacent subareas can then be tilted relative to each other, but in each case be flat.
  • the substrate is made of a plastic material, such as a
  • Polyester material preferably made of
  • the substrate is preferably single-layered (monolithic with respect to the thickness direction), so it is, for example, a simple plastic sheet.
  • the substrate could also be made of a metal, for example aluminum or an aluminum alloy.
  • An insulation layer such as an imide layer, would then be arranged between the substrate and the conductor track structure.
  • the substrate is disposed on a support having a higher flexural rigidity.
  • the bending stiffness of the carrier should, for example, be at least 2, 4, 6, 8 or 10 times that of the substrate.
  • a rigid support may also be provided, although preferred upper limits are, for example, at most 1,000, 500 or 100 times the flexural rigidity of the substrate.
  • the carrier can be provided, for example, of a metal or preferably a plastic material, particularly preferably of PET.
  • the higher bending stiffness can, for example, also be achieved by a greater thickness compared to the substrate.
  • a grid as a carrier is conceivable, with respect to its surface directions continuously (uninterrupted) trained flat carrier is preferred, such as a plate.
  • Its perpendicular to the surface directions generally taken as an average, preferably constant, thickness may, for example, at least 0.5 mm, preferably at least 1 mm, more preferably at least 1.5 mm, more preferably at least 2 mm, be possible, with possible upper limits (thereof independently), for example, at most 5 mm, 4 mm or 3 mm (in the order of naming increasingly preferred).
  • the carrier its extension from outer edge to outer edge
  • the carrier connects in the thickness direction of the remaining substrate, this and the carrier extend parallel to each other.
  • the carrier should, for example, extend over at least 60%, 70%, 80% or 90% of the area of the remaining substrate on the remaining substrate.
  • the carrier is preferably a part of the whole plan.
  • the substrate and the carrier are integrally separable with each other, that is, non-destructively (without destruction of either or both of the layers).
  • the carrier and the substrate are set as previously separate parts together and connected to one another with a material-bonding joint connection, preferably an adhesive compound, particularly preferably a large-area adhesive film.
  • the assembly of substrate and carrier can, for example, in a tape or reel process (reel-to-reel) take place.
  • the latter is interrupted where the subregions are folded out.
  • the support may also be interrupted in the remaining substrate in the region of these interruptions (with respect to its thickness direction), partially or preferably completely congruent with the interruptions in the remaining substrate. This may be of interest, for example, in the case of a lighting device which is to emit light on both sides of the substrate, ie approximately in the case of Trap of a luminaire intended to illuminate both wall and / or ceiling and the room in front of it.
  • a planar reflector is provided on the substrate (see the above disclosure on the "flatness" of the substrate and support); the reflector and the substrate are integral with one another, ie, non-destructively separable (see the above disclosure of the support).
  • the reflector can also be applied as a reflection layer, that is to say as a layer which is formed / emerged only when it is applied and insofar as it was not a separate part, but preferably the reflector and the substrate are placed against one another as previously separate parts cohesive joint connection held together, particularly preferably an adhesive bond, in particular a large-area adhesive film (see the above disclosure to support and substrate).
  • the reflector is made of a material with a reflectance of at least 60%, in this order increasingly preferably at least 65%, 70%, 75%, 80, 85%, 90%, 95%, 97% and 98%, respectively; although the highest possible degree of reflection may be preferred, an upper limit can for example be 99.9% for technical reasons (considered in each case an average formed over the visible spectral range from 380 ⁇ m to 780 ⁇ m).
  • the reflector could also be made of metal, but is preferably a reflector made of a plastic material and is the Reflectivity more preferably adjusted by embedded therein inclusions, such as embedded gas bubbles or preferably reflection particles, eg. B. titanium dioxide particles.
  • the reflector is preferably a plastic sheet.
  • the carrier and reflector are the same part, which is thus characterized at the same time by the bending stiffness and the reflection properties. It must then, for example, fewer items are assembled.
  • the reflector is arranged on a front side of the substrate on which the LEDs of the subregions are mounted.
  • the partial regions can then preferably be folded out to a rear side opposite this front side, ie the light from the LEDs is indeed emitted at the front side of the substrate, but then reflected and emitted by the illumination device as a whole at the rear side of the substrate, cf. Fig. 1 for illustration.
  • This indirectly emitted light can, for example, already produce a comparatively homogenous illumination intensity distribution on a downstream diffusing screen of a luminaire, which, for example, permits a smaller distance between the illuminating device and the diffusing screen and thus a compact construction (compare FIG. 4 for illustration).
  • the scattering coefficient of the lens can be reduced, namely, the lens must to produce a homogeneous
  • Illuminance is more homogeneous on its entrance side. This can increase the efficiency.
  • the subareas are thus folded out to one of the front side (see the following definition) opposite back of the substrate.
  • the subregions are thus folded into a rear space, which rear space faces the rear side of the substrate (and faces away from the front side).
  • the reflector provided on the front extends over the
  • the proportion of light emitted indirectly can be maximized; it can be, for example, at least 70%, 80% or 90% (increasingly preferred in the order in which they are mentioned), more preferably the lighting device emits exclusively indirect light So be called "glare-free".
  • the "front side” is that side of the substrate on which the LEDs of the subregions in question are arranged, which subregions are each equipped on one side, that is, one side per subarea free of LEDs; Further, the LEDs of the portions are mounted on the same side of the substrate, which is just referred to as the front.
  • the LEDs of the portions are mounted on the same side of the substrate, which is just referred to as the front.
  • LEDs can also be mounted on the back of the substrate, preferably, however, the back of the substrate is free of LEDs, the substrate is in the whole so only one-sided equipped.
  • the one-sided assembly can be simplified compared to a two-sided assembly. Preferably then all subregions of the lighting device are folded out to the same side.
  • the subregions are flipped out to the front of the substrate.
  • the subregions are thus folded into a front space, which faces the front side of the substrate.
  • Diffuser can be achieved even if only part of the light incident thereon is indirect light.
  • the sub-area just eg. Folded out to the front and the reflector can be arranged on this front.
  • the light is emitted
  • the lens of the (partially covered with the reflector) front of the substrate is facing.
  • a mixture of light emitted directly by the LEDs (reflectance-free) and light reflected by the reflector then falls on the diffuser, and the ratio can also be set by how inclined the subregions are (the more obliquely the more light is reflected).
  • the substrate has a thickness of at least 150 ym, preferably at least 200 ym, more preferably at least 250 ym.
  • Advantageous upper limits may be, for example, at most 500 ym, preferably at most 450 ym, more preferably at most 400 ym, particularly preferably at most 350 ym, wherein the upper and lower limits may be expressly also independently of interest.
  • the preferred plastic material for example the PET
  • the inventor has found in the stated range, on the one hand, a good basic stability of the substrate, but on the other hand, the partial regions can also be folded out well.
  • the conductor tracks have a thickness of at least 20 ⁇ m, preferably at least 25 ⁇ m, more preferably at least 30 ⁇ m, particularly preferably at least 35 ⁇ m.
  • Advantageous upper limits can, for example, at most 100 ym, preferably at most 90 ym, more preferably at most 80 ym, more preferably at most 70 ym, wherein the upper and lower limits may in turn be independently of interest.
  • a copper material is preferable.
  • the copper may, for example, be laminated or be so that, for example, a copper foil is adhesively bonded to the substrate via an adhesive layer.
  • first part of the layer can be deposited and patterned or even deposited onto a mask, and then in a second deposition step the seed layer is reinforced to form the conductor track structure.
  • seed layer can be deposited and patterned or even deposited onto a mask, and then in a second deposition step the seed layer is reinforced to form the conductor track structure.
  • the thickness of the substrate / trace structure is taken along the thickness direction (s) of the substrate, and in the case of a nonuniform thickness across the substrate, a mean value formed above it is considered. In each case a constant thickness is preferred.
  • the invention also relates to a luminaire with a lighting device disclosed herein and a diffusing screen.
  • the illumination device and the lens are arranged relative to one another such that at least a portion of the light emitted by the illumination device falls onto the lens, for example at least 30%, preferably at least 40%, of the light.
  • the Lighting device generally also be designed to emit light on both sides of the substrate, not necessarily all the light must be passed over the lens, it can, for example.
  • a wall / ceiling and the diffuser the room in front of it be illuminated (see the front).
  • It can also be provided a second lens, so that is then arranged on both sides of the substrate in each case a lens. In the example just mentioned, the space would then be illuminated via the first diffuser and would be illuminated via the second diffuser wall / ceiling.
  • the diffuser is preferably designed as a plane-parallel plate, at least in the area which passes through the light emitted by the lighting device.
  • the scattering of the scattering disk can be adjusted, for example, by means of scattering centers embedded in the scattering disk material, for example scattering particles, and / or surface scattering centers at the entry and / or exit side of the scattering disk.
  • the surface scattering centers can be realized, for example, by roughening the surface or by applying a scattering coating.
  • the invention also relates to a production method.
  • the above execution too the lighting device or luminaire should be expressly disclosed in this regard.
  • the joints are introduced with a mechanical cutting tool or by laser cutting.
  • a mechanical cutting tool or by laser cutting.
  • Cutting tool is a punching tool preferred, it is then the parting lines stamped, which, for example, in a reel-to-reel process is possible. In general, however, the joints could, for example, also be etched; On the other hand, however, punching can offer advantages in terms of throughput and thus in particular in a mass production, whereas laser cutting allows a high degree of flexibility.
  • the joints can also have a very different width depending on the production.
  • the width of a parting line is in each case taken perpendicular to its longitudinal extension, in a respective surface direction of the substrate, and indeed in the case of a width varying over the length extent as an average formed above.
  • the substrate is considered with not yet folded out partial areas, so in the case of the finished lighting device, a situation as if the sections were not yet unfolded (or mentally collapsed again).
  • the width of the parting line is not greater than 500 ⁇ m, 400 ⁇ m, 300 ⁇ m or 200 ⁇ m.
  • the conductor track structure is plastically deformed locally during the folding out of the subregions, that is to say that the conductor track structure then at least partially stabilizes the folded-out position.
  • the conductor track structure would therefore have to be plastically deformed again in order to fold back the subregions.
  • the above-mentioned thicknesses have proved to be advantageous.
  • the "local" deformation takes place, for example, in each case where a respective fold line in the substrate with the
  • a stabilization metallization which is not electrically conductively connected thereto but is preferably applied in the same process as the conductor track structure is provided. So such not contributing to the power supply Stabilization metallization can, for example, cover the respective fold lines as extensively as possible and, as just described for the printed conductor structure, deform plastically there when folding out the partial areas.
  • the LEDs are already mounted on the substrate when folding out the subregions, ie the LEDs are first mounted and then the subregions folded out. This can considerably simplify the mounting of the LEDs.
  • the LEDs are already mounted on the substrate during insertion of the parting lines.
  • a preferred lighting device comprises a support and / or a reflector, preferably the two as an integrated part.
  • the assembly then takes place in a preferred embodiment such that first the subregions folded out of the substrate and then the substrate and the carrier / reflector are assembled.
  • the carrier / reflector When assembling the carrier / reflector with the substrate so the sub-areas are already folded out of the latter.
  • Fig. 1 is a lamp with an inventive
  • Figures 2a-f show various steps in the manufacture of a lighting device according to the invention
  • FIG. 3 shows a lighting device according to the invention in an oblique view
  • Fig. 4 is a schematic diagram for illustrating the invention with a
  • Illumination device on the diffuser of the luminaire according to FIG. 1 achievable homogenization of the illumination intensity distribution.
  • Fig. 1 shows a lamp 1 with a lighting device 2 according to the invention, which is arranged in a housing 3 of the lamp 1.
  • the light output is in the figure up, and the lighting device 2 downstream is a diffuser 4 of the lamp 1 is provided.
  • the light emitted by the lighting device 2 falls on an entrance side 5 of the lens 4, is scattered on scattering particles embedded in the lens material (not shown) and with a correspondingly more homogeneous Illuminance distribution at an exit side 6 of the lens 4 issued.
  • the distance between lens 4 and lighting device 2 can be reduced, which may allow the construction of particularly flat lamps 1, in the lamp 1 is preferably a recessed light.
  • the lighting device 2 according to the invention is constructed from a substrate 7, from which a plurality of partial regions 7a are folded out.
  • a plastic sheet of PET having a thickness of 300 ⁇ m is provided.
  • the partial regions 7a are partially separated from the remaining substrate 7b via a parting line, cf. in particular also Fig. 2d for illustration.
  • an LED 8 is mounted in each case, the LEDs 8 are therefore each folded out together with their respective portion 7a from the rest of the substrate 7b and so obliquely employed.
  • the LEDs 8 are mounted on a front side 9 of the substrate 7.
  • the partial regions 7a are each at a rear side 10 opposite this front side 9 popped up.
  • the LEDs 8 each emit the light approximately lambert, with a respective, as a mean value per LED 8 formed Schoausbreitungsraum 11 obliquely downwards (approximately at 45 ° to the vertical).
  • the reflector 12 is a PET plastic sheet which, however, is thicker than the substrate 7 with a thickness of 600 ⁇ m. Due to the greater thickness of the reflector 12 has a greater bending stiffness compared to the substrate 7. The reflector 12 thus serves at the same time a mechanical stabilization of the substrate 7, that is, at the same time also a carrier.
  • the latter is interrupted.
  • the reflector / carrier 12 is formed continuously in the region of these interruptions 13, so extends over the interruptions 13 away.
  • each of the LEDs 8 Since the light emitted by the LEDs 8 now only partially free of reflection reaches the lens 4, but for the most part is previously reflected, each of the LEDs 8, a larger area of the lens 4 is illuminated. These areas overlap, resulting in a result in a relatively uniform illumination intensity distribution on the inlet side 5 of the lens 4, cf. see also Fig. 4 in detail. In FIG. 1, for clarity, one of the electrical contacting of the LEDs 8 serving conductor track structure is not shown.
  • Printed wiring pattern is deposited on the front side 9 of the substrate 7 (before assembling the substrate 7 and the reflector 12). In the finished illumination device 2, it then extends in sections between the substrate 7 and the reflector 12 and in the subregions 7a on the side of the subregions 7a facing the reflector 12.
  • the luminaire 1 further has a drive electronics 14 arranged in the housing 3 together with the lighting device 2, which is electrically conductively connected to the printed conductor structure arranged on the substrate 7. Via external power supply lines (not shown), the driver electronics 14 is connected to a mains connection, it then adapts the mains voltage for operation of the LEDs 8.
  • a driver electronics such as a ballast, but can also be arranged outside of the lamp 1, which may optionally allow a more compact design. Furthermore, this may also be advantageous, for example, if light is to be emitted with the luminaire 1 on both sides of the substrate 7 (both into the room and to the wall / ceiling).
  • a copper layer 21 is applied to the substrate 7, that is to say de-energized in a bath.
  • a substrate with a laminated on, so glued copper layer could be used.
  • the conductor track structure 22 is then worked out (FIG. 2 b), for which purpose the copper layer 21 is masked with a photoresist. This is exposed and opened locally, so that in a subsequent etching process, the areas are exposed, which then lie between the tracks 22. After the etching, therefore, the conductor track structure 22 remains (and the photoresist is removed).
  • the LED 8 is then mounted on the printed conductor structure 22 in a next step (FIG. 2 c), specifically as a so-called SMD component [Surface Mounted Device].
  • the LED 8 thus has two rear side contacts (not shown) facing the interconnect structure 22 and the underlying substrate 7, which are connected to the interconnect structure 22 via a cohesive joint connection layer, either via an electrically conductive adhesive (eg filled with silver). or a low-temperature solder.
  • a parting line 23 which partially separates the respective subarea 7a from the remaining substrate 7b is structured, which extends as a non-closed, U-shaped curve (FIG. 2d). however, each of the partial regions 7a remains connected to the remaining substrate 7b via a bridge region 24.
  • the joints 13 are either by laser cutting, which allows high flexibility, or introduced by punching, which can enable a good throughput.
  • the partial regions 7a are then folded out of the remaining substrate 7b around the bridge region 24 as a hinge, in each case at an angle of approximately 45 °.
  • a fold line then extends, which marks the transition between partial region 7a and remaining substrate 7b.
  • the reflector 12 is assembled with the substrate 7, for which purpose the front side 9 of the substrate 7 in the region of the remaining substrate 7b is coated with an adhesive film and substrate 7 and reflector 12 are then brought together.
  • the rear side 10 of the substrate 7 may additionally be provided with a reflective layer (not shown).
  • the substrate 7 it is also already possible for the substrate 7 to be reflective due to reflection particles embedded in the PET material.
  • Fig. 3 shows the lighting device 2 in an oblique view, namely looking from that back space on it, in which the partial areas 7a are folded into it.
  • the partial areas 7a are in each case folded out to a rear side 10 of the substrate; this back 10 faces the just mentioned rear space, in which the lighting device then emits the light.
  • FIG. 4 illustrates how the light from the lighting device 2 according to the invention is illustrated by means of two schematic diagrams with obliquely employed partial areas due to multiple reflections per LED 8 already illuminated a comparatively large area of the lens 4. These areas, each illuminated over a large area, overlap, resulting in a comparatively good homogeneity of the illuminance on the entrance side.
  • FIG. 4b shows a (not according to the invention) arrangement in which the LEDs 8 are arranged on a substrate without partial regions and illuminate the diffusing screen 4 directly.
  • the main propagation direction 11 of the light emitted by one of the LEDs 8 is perpendicular to the entrance side 5 of the lens 4.
  • the area of the lens 4 illuminated by each LED 8 is significantly smaller than in the case of FIG. 4a. Accordingly, in order to achieve the same illumination intensity distribution on the exit side 6 of the diffusing screen 4 as in FIG. 4 a, the diffusing screen 4 must be provided with greater scattering and / or a greater distance between the LEDs 8 and the diffusing screen. The latter is disadvantageous in terms of a compact design, the increased scattering deteriorates the efficiency.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

La présente invention concerne un dispositif d'éclairage (2) comprenant un substrat plat (7) et des LED (8) sur celui-ci. Dans le substrat (7), une pluralité de zones partielles (7a) sont partiellement isolées du reste du substrat (7b) respectivement par un joint de séparation (23) ouvert, les zones partielles (7a) ne sont ainsi respectivement reliées au reste du substrat (7b) que par une zone formant pont (24). Au moins l'une des LED (8) est respectivement montée dans lesdites zones partielles (7a) et lesdites zones partielles (7a) sont en outre rabattues vers l'extérieur hors du reste du substrat (7b) autour de la zone formant pont (24) et sont ainsi positionnées en biais par rapport à celui-ci.
EP16705919.5A 2015-04-15 2016-02-17 Dispositif d'éclairage avec des led Withdrawn EP3283814A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015206801.3A DE102015206801A1 (de) 2015-04-15 2015-04-15 Beleuchtungsvorrichtung mit LEDs
PCT/EP2016/053326 WO2016165856A1 (fr) 2015-04-15 2016-02-17 Dispositif d'éclairage avec des led

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EP3283814A1 true EP3283814A1 (fr) 2018-02-21

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US (1) US20180094781A1 (fr)
EP (1) EP3283814A1 (fr)
CN (1) CN107466351A (fr)
DE (1) DE102015206801A1 (fr)
WO (1) WO2016165856A1 (fr)

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EP3573434A1 (fr) * 2018-05-25 2019-11-27 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Dispositif électronique étirable
US10310197B1 (en) * 2018-09-17 2019-06-04 Waymo Llc Transmitter devices having bridge structures

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JP2000100216A (ja) * 1998-09-21 2000-04-07 Ichikoh Ind Ltd 車両用ランプ装置
DE10351462B4 (de) * 2003-11-04 2007-10-18 Hella Kgaa Hueck & Co. Fahrzeugleuchte
AT500892B1 (de) * 2004-09-01 2008-01-15 Pollmann Austria Ohg Lichtquellen-trageinheit
JP2006127963A (ja) * 2004-10-29 2006-05-18 Hitachi Ltd 配光制御デバイス
DE102004061472A1 (de) * 2004-12-21 2006-07-06 Carl Freudenberg Kg Baueinheit mit einem Flachkabel aus einer mehradrigen flexiblen Flachbandleitung
JP4588474B2 (ja) * 2005-02-04 2010-12-01 株式会社フジクラ 照明装置及び照明用光源の実装方法
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DE102015206801A1 (de) 2016-10-20
CN107466351A (zh) 2017-12-12
WO2016165856A1 (fr) 2016-10-20
US20180094781A1 (en) 2018-04-05

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