EP3278372A4 - Uv light emitting device - Google Patents
Uv light emitting device Download PDFInfo
- Publication number
- EP3278372A4 EP3278372A4 EP16773395.5A EP16773395A EP3278372A4 EP 3278372 A4 EP3278372 A4 EP 3278372A4 EP 16773395 A EP16773395 A EP 16773395A EP 3278372 A4 EP3278372 A4 EP 3278372A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- light emitting
- emitting device
- light
- emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/12—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP21190742.3A EP3926696A1 (en) | 2015-03-31 | 2016-03-28 | Uv light emitting device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150045557A KR102347387B1 (en) | 2015-03-31 | 2015-03-31 | Uv light emitting device |
PCT/KR2016/003149 WO2016159614A1 (en) | 2015-03-31 | 2016-03-28 | Uv light emitting device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21190742.3A Division EP3926696A1 (en) | 2015-03-31 | 2016-03-28 | Uv light emitting device |
Publications (3)
Publication Number | Publication Date |
---|---|
EP3278372A1 EP3278372A1 (en) | 2018-02-07 |
EP3278372A4 true EP3278372A4 (en) | 2018-10-31 |
EP3278372B1 EP3278372B1 (en) | 2021-08-18 |
Family
ID=57006211
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP16773395.5A Active EP3278372B1 (en) | 2015-03-31 | 2016-03-28 | Uv light emitting device |
EP21190742.3A Pending EP3926696A1 (en) | 2015-03-31 | 2016-03-28 | Uv light emitting device |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP21190742.3A Pending EP3926696A1 (en) | 2015-03-31 | 2016-03-28 | Uv light emitting device |
Country Status (6)
Country | Link |
---|---|
US (1) | US10374123B2 (en) |
EP (2) | EP3278372B1 (en) |
JP (1) | JP6505248B2 (en) |
KR (1) | KR102347387B1 (en) |
CN (2) | CN107534073B (en) |
WO (1) | WO2016159614A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107195742B (en) * | 2017-07-17 | 2019-04-30 | 圆融光电科技股份有限公司 | The preparation method and ultraviolet LED of ultraviolet LED |
JP2019036629A (en) * | 2017-08-15 | 2019-03-07 | 国立研究開発法人理化学研究所 | Deep ultraviolet light-emitting diode and electrical equipment with the same |
US11342479B2 (en) * | 2018-09-11 | 2022-05-24 | Facebook Technologies, Llc | Reducing bowing of materials before wafer-to-wafer bonding for LED manufacturing |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100187496A1 (en) * | 2009-01-23 | 2010-07-29 | Invenlux Corporation | Strain balanced light emitting devices |
US20110064103A1 (en) * | 2009-08-21 | 2011-03-17 | The Regents Of The University Of California | Semipolar nitride-based devices on partially or fully relaxed alloys with misfit dislocations at the heterointerface |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02295133A (en) * | 1989-05-10 | 1990-12-06 | Hitachi Ltd | Crystal structure and manufacture thereof |
JPH04324645A (en) * | 1991-04-24 | 1992-11-13 | Hitachi Cable Ltd | Semiconductor transistor |
JP3121202B2 (en) * | 1994-05-10 | 2000-12-25 | エア・ウォーター株式会社 | Light emitting device and method of manufacturing the same |
JP2900990B2 (en) * | 1995-11-24 | 1999-06-02 | 日亜化学工業株式会社 | Nitride semiconductor light emitting device |
US5959307A (en) * | 1995-11-06 | 1999-09-28 | Nichia Chemical Industries Ltd. | Nitride semiconductor device |
US6695913B1 (en) * | 1997-07-10 | 2004-02-24 | Sharp Kabushiki Kaisha | III-Nitride optoelectronic semiconductor device containing lattice mismatched III-Nitride semiconductor materials |
JP3557876B2 (en) | 1997-10-10 | 2004-08-25 | 豊田合成株式会社 | GaN-based semiconductor device and method of manufacturing the same |
JP3557875B2 (en) | 1997-10-10 | 2004-08-25 | 豊田合成株式会社 | GaN-based semiconductor device and method of manufacturing the same |
KR100763827B1 (en) * | 2000-06-08 | 2007-10-05 | 니치아 카가쿠 고교 가부시키가이샤 | Semiconductor laser device, and method of manufacturing the same |
CN1147010C (en) * | 2000-11-16 | 2004-04-21 | 中国科学院半导体研究所 | Self-passinvating non-planar junction subgroup III nitride semi-conductor device and its making method |
JP3548735B2 (en) | 2001-06-29 | 2004-07-28 | 士郎 酒井 | Method of manufacturing gallium nitride based compound semiconductor |
JP2004179452A (en) * | 2002-11-28 | 2004-06-24 | Shin Etsu Handotai Co Ltd | Hetero epitaxial wafer |
JP2004281553A (en) | 2003-03-13 | 2004-10-07 | Nippon Telegr & Teleph Corp <Ntt> | Light emitting diode |
JPWO2010032423A1 (en) * | 2008-09-16 | 2012-02-02 | 昭和電工株式会社 | Method for manufacturing group III nitride semiconductor light emitting device, group III nitride semiconductor light emitting device and lamp, and method for reducing variation in emission wavelength distribution of group III nitride semiconductor light emitting device wafer |
JP5316210B2 (en) * | 2009-05-11 | 2013-10-16 | 住友電気工業株式会社 | Nitride semiconductor light emitting device |
CN102136536A (en) * | 2010-01-25 | 2011-07-27 | 亚威朗(美国) | Strain balanced light emitting device |
KR20120079393A (en) | 2011-01-04 | 2012-07-12 | (주)세미머티리얼즈 | A method for manufacturing semiconductor light emitting device |
JP5662184B2 (en) | 2011-02-01 | 2015-01-28 | 日本碍子株式会社 | Epitaxial substrate for semiconductor device and method for manufacturing epitaxial substrate for semiconductor device |
CN102637793B (en) * | 2011-02-15 | 2015-08-12 | 展晶科技(深圳)有限公司 | III-family nitrogen compound semiconductor ultraviolet light-emitting diodes |
JP5945409B2 (en) * | 2011-12-09 | 2016-07-05 | スタンレー電気株式会社 | Semiconductor device and manufacturing method thereof |
JP5874593B2 (en) * | 2011-12-23 | 2016-03-02 | 豊田合成株式会社 | Group III nitride semiconductor light emitting device and method for manufacturing the same |
JP5319810B2 (en) * | 2012-03-08 | 2013-10-16 | 株式会社東芝 | Method for manufacturing nitride semiconductor layer |
KR20140090801A (en) * | 2013-01-10 | 2014-07-18 | 엘지이노텍 주식회사 | Light emitting device |
JP6265328B2 (en) | 2013-07-29 | 2018-01-24 | 国立大学法人 名古屋工業大学 | Semiconductor laminated structure and semiconductor element using the same |
KR20150015760A (en) * | 2013-08-01 | 2015-02-11 | 서울바이오시스 주식회사 | Template for light emitting device fabricating and method of fabricating ultraviolet light emitting device |
KR20160060749A (en) * | 2013-09-23 | 2016-05-30 | 센서 일렉트로닉 테크놀로지, 인크 | Group III Nitride Heterostructure for Optoelectronic Device |
-
2015
- 2015-03-31 KR KR1020150045557A patent/KR102347387B1/en active IP Right Grant
-
2016
- 2016-03-28 CN CN201680020506.6A patent/CN107534073B/en active Active
- 2016-03-28 JP JP2017551155A patent/JP6505248B2/en active Active
- 2016-03-28 CN CN201911375106.9A patent/CN111129239B/en active Active
- 2016-03-28 EP EP16773395.5A patent/EP3278372B1/en active Active
- 2016-03-28 WO PCT/KR2016/003149 patent/WO2016159614A1/en active Application Filing
- 2016-03-28 US US15/563,526 patent/US10374123B2/en active Active
- 2016-03-28 EP EP21190742.3A patent/EP3926696A1/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100187496A1 (en) * | 2009-01-23 | 2010-07-29 | Invenlux Corporation | Strain balanced light emitting devices |
US20110064103A1 (en) * | 2009-08-21 | 2011-03-17 | The Regents Of The University Of California | Semipolar nitride-based devices on partially or fully relaxed alloys with misfit dislocations at the heterointerface |
Non-Patent Citations (3)
Title |
---|
HAEGER DANIEL A ET AL: "384 nm laser diode grown on asemipolar relaxed AlGaN buffer layer", APPLIED PHYSICS LETTERS, A I P PUBLISHING LLC, US, vol. 100, no. 16, 16 April 2012 (2012-04-16), pages 161107 - 161107, XP012155635, ISSN: 0003-6951, [retrieved on 20120419], DOI: 10.1063/1.4704560 * |
See also references of WO2016159614A1 * |
YOUNG ERIN C ET AL: "Compositionally graded relaxed AlGaN buffers on semipolar GaN for mid-ultraviolet emission", APPLIED PHYSICS LETTERS, A I P PUBLISHING LLC, US, vol. 101, no. 14, 1 October 2012 (2012-10-01), pages 142109 - 142109, XP012165157, ISSN: 0003-6951, [retrieved on 20121004], DOI: 10.1063/1.4757423 * |
Also Published As
Publication number | Publication date |
---|---|
US10374123B2 (en) | 2019-08-06 |
CN111129239B (en) | 2024-04-02 |
WO2016159614A1 (en) | 2016-10-06 |
EP3278372B1 (en) | 2021-08-18 |
CN107534073A (en) | 2018-01-02 |
CN107534073B (en) | 2020-02-07 |
KR20160117012A (en) | 2016-10-10 |
EP3278372A1 (en) | 2018-02-07 |
JP6505248B2 (en) | 2019-04-24 |
EP3926696A1 (en) | 2021-12-22 |
JP2018511945A (en) | 2018-04-26 |
KR102347387B1 (en) | 2022-01-06 |
CN111129239A (en) | 2020-05-08 |
US20180090640A1 (en) | 2018-03-29 |
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