EP3255362A4 - Halbleiterkühlanlage - Google Patents

Halbleiterkühlanlage Download PDF

Info

Publication number
EP3255362A4
EP3255362A4 EP15880937.6A EP15880937A EP3255362A4 EP 3255362 A4 EP3255362 A4 EP 3255362A4 EP 15880937 A EP15880937 A EP 15880937A EP 3255362 A4 EP3255362 A4 EP 3255362A4
Authority
EP
European Patent Office
Prior art keywords
semiconductor cooling
cooling refrigerator
refrigerator
semiconductor
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15880937.6A
Other languages
English (en)
French (fr)
Other versions
EP3255362B1 (de
EP3255362A1 (de
Inventor
Haibo TAO
Kui Zhang
Jianru Liu
Peng Li
Chunyang Li
Feifei QI
Lisheng JI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Co Ltd
Original Assignee
Qingdao Haier Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Co Ltd filed Critical Qingdao Haier Co Ltd
Publication of EP3255362A1 publication Critical patent/EP3255362A1/de
Publication of EP3255362A4 publication Critical patent/EP3255362A4/de
Application granted granted Critical
Publication of EP3255362B1 publication Critical patent/EP3255362B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/003—General constructional features for cooling refrigerating machinery
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP15880937.6A 2015-02-03 2015-09-29 Halbleiterkühlanlage Active EP3255362B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510055838.5A CN104729182B (zh) 2015-02-03 2015-02-03 半导体制冷冰箱
PCT/CN2015/091094 WO2016123995A1 (zh) 2015-02-03 2015-09-29 半导体制冷冰箱

Publications (3)

Publication Number Publication Date
EP3255362A1 EP3255362A1 (de) 2017-12-13
EP3255362A4 true EP3255362A4 (de) 2018-08-29
EP3255362B1 EP3255362B1 (de) 2019-11-13

Family

ID=53453320

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15880937.6A Active EP3255362B1 (de) 2015-02-03 2015-09-29 Halbleiterkühlanlage

Country Status (4)

Country Link
US (1) US20170328610A1 (de)
EP (1) EP3255362B1 (de)
CN (1) CN104729182B (de)
WO (1) WO2016123995A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104729182B (zh) * 2015-02-03 2016-11-23 青岛海尔股份有限公司 半导体制冷冰箱
WO2018183731A1 (en) * 2017-03-29 2018-10-04 Rockwell Collins, Inc. Liquid chilled galley bar unit
JP6640401B1 (ja) * 2019-04-18 2020-02-05 古河電気工業株式会社 ヒートシンク
CN112856615B (zh) * 2021-01-07 2022-06-24 施斌卿 除湿机防结冰控制方法及除湿机
CN115164493A (zh) * 2022-07-15 2022-10-11 青岛海容商用冷链股份有限公司 风冷式半导体冷冻柜及其控制方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0592044A2 (de) * 1992-10-05 1994-04-13 Thermovonics Co., Ltd Thermoelektrische Kühlvorrichtung für thermoelektrischen Kühlschrank und Verfahren zu ihrer Herstellung
US6865906B1 (en) * 1999-02-26 2005-03-15 Tempra Technology Inc. Preparation of heat sink materials

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5253702A (en) * 1992-01-14 1993-10-19 Sun Microsystems, Inc. Integral heat pipe, heat exchanger, and clamping plate
JPH11257882A (ja) * 1998-03-12 1999-09-24 Sharp Corp ヒートパイプ及び集熱装置
US6664673B2 (en) * 2001-08-27 2003-12-16 Advanced Rotary Systems Llc Cooler for electronic devices
JP2004125381A (ja) * 2002-08-02 2004-04-22 Mitsubishi Alum Co Ltd ヒートパイプユニット及びヒートパイプ冷却器
CN2681057Y (zh) * 2003-12-10 2005-02-23 来学恩 热管散热式微型电子冰箱
CN2720383Y (zh) * 2004-07-21 2005-08-24 侯祺 集束型热管散热器
CN2797986Y (zh) * 2005-04-29 2006-07-19 王龙岩 半导体冰箱的制冷散热结构
CN201281563Y (zh) * 2008-10-21 2009-07-29 顺德职业技术学院 以环保制冷剂-纳米铝为工质的多环路立管式热管
CN101941072B (zh) * 2009-07-08 2013-06-05 富准精密工业(深圳)有限公司 平板式热管的制造方法
CN104990436B (zh) * 2009-07-17 2018-07-10 史泰克公司 热电冷却装置
JP5773976B2 (ja) * 2012-12-27 2015-09-02 三菱電機株式会社 冷蔵庫
CN204612291U (zh) * 2015-02-03 2015-09-02 青岛海尔股份有限公司 半导体制冷冰箱
CN104729182B (zh) * 2015-02-03 2016-11-23 青岛海尔股份有限公司 半导体制冷冰箱

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0592044A2 (de) * 1992-10-05 1994-04-13 Thermovonics Co., Ltd Thermoelektrische Kühlvorrichtung für thermoelektrischen Kühlschrank und Verfahren zu ihrer Herstellung
US6865906B1 (en) * 1999-02-26 2005-03-15 Tempra Technology Inc. Preparation of heat sink materials

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016123995A1 *

Also Published As

Publication number Publication date
WO2016123995A1 (zh) 2016-08-11
CN104729182A (zh) 2015-06-24
CN104729182B (zh) 2016-11-23
EP3255362B1 (de) 2019-11-13
US20170328610A1 (en) 2017-11-16
EP3255362A1 (de) 2017-12-13

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