EP3253908A1 - Method for producing multicrystalline silicon - Google Patents
Method for producing multicrystalline siliconInfo
- Publication number
- EP3253908A1 EP3253908A1 EP16702122.9A EP16702122A EP3253908A1 EP 3253908 A1 EP3253908 A1 EP 3253908A1 EP 16702122 A EP16702122 A EP 16702122A EP 3253908 A1 EP3253908 A1 EP 3253908A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- silicon
- less
- crucible
- multicrystalline
- multicrystalline silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims abstract description 91
- 238000004519 manufacturing process Methods 0.000 title abstract description 15
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 162
- 239000010703 silicon Substances 0.000 claims abstract description 160
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 158
- 238000000576 coating method Methods 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 30
- 238000007711 solidification Methods 0.000 claims abstract description 15
- 230000008023 solidification Effects 0.000 claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 12
- 230000008018 melting Effects 0.000 claims abstract description 10
- 238000002844 melting Methods 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 150000001875 compounds Chemical class 0.000 claims abstract description 6
- 229910052681 coesite Inorganic materials 0.000 claims abstract description 5
- 229910052906 cristobalite Inorganic materials 0.000 claims abstract description 5
- 229910052682 stishovite Inorganic materials 0.000 claims abstract description 5
- 229910052905 tridymite Inorganic materials 0.000 claims abstract description 5
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 57
- 230000008569 process Effects 0.000 claims description 32
- 235000012431 wafers Nutrition 0.000 claims description 20
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- 229910052736 halogen Inorganic materials 0.000 claims description 7
- 150000002367 halogens Chemical class 0.000 claims description 7
- 229910052801 chlorine Inorganic materials 0.000 claims description 5
- 239000000460 chlorine Substances 0.000 claims description 5
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 4
- 238000005215 recombination Methods 0.000 claims description 3
- 230000006798 recombination Effects 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 7
- 239000013078 crystal Substances 0.000 description 20
- 239000002245 particle Substances 0.000 description 17
- 238000009736 wetting Methods 0.000 description 16
- 238000010899 nucleation Methods 0.000 description 14
- 230000006911 nucleation Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 239000002667 nucleating agent Substances 0.000 description 8
- 239000002994 raw material Substances 0.000 description 7
- 229910005091 Si3N Inorganic materials 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 239000008187 granular material Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000012495 reaction gas Substances 0.000 description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 4
- 229910010271 silicon carbide Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 4
- 239000005052 trichlorosilane Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000011449 brick Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 239000011856 silicon-based particle Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000005046 Chlorosilane Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical group Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004876 x-ray fluorescence Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 229910003822 SiHCl3 Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 244000052616 bacterial pathogen Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000035784 germination Effects 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 238000003947 neutron activation analysis Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- -1 oxides Chemical class 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004857 zone melting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B11/00—Single-crystal growth by normal freezing or freezing under temperature gradient, e.g. Bridgman-Stockbarger method
- C30B11/002—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B21/00—Unidirectional solidification of eutectic materials
- C30B21/02—Unidirectional solidification of eutectic materials by normal casting or gradient freezing
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B28/00—Production of homogeneous polycrystalline material with defined structure
- C30B28/04—Production of homogeneous polycrystalline material with defined structure from liquids
- C30B28/06—Production of homogeneous polycrystalline material with defined structure from liquids by normal freezing or freezing under temperature gradient
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/12—Halides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0368—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including polycrystalline semiconductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention relates to a process for the production of multicrystalline silicon.
- Multicrystalline silicon is used to manufacture photovoltaic solar cells.
- the crystal has different
- Feedstock for the production of monocrystalline or multicrystalline silicon is polycrystalline silicon.
- the polycrystalline silicon is usually produced by means of the Siemens process.
- a bell-shaped reactor (“Siemens reactor") thin filament rods ("thin rods") of silicon are heated by direct current passage and a reaction gas containing a silicon-containing component and hydrogen introduced.
- a reaction gas containing a silicon-containing component and hydrogen introduced.
- An alternative is the production of polycrystalline silicon granules in a fluidized bed reactor. This is done by fluidization of silicon particles by means of a gas flow in a fluidized bed, which is heated by a heater to high temperatures. By adding a silicon-containing reaction gas, a deposition reaction takes place on the hot
- TCS Terichlorosilane
- Single-crystalline silicon can be produced by means of crucible pulling (Czochralski or CZ process) or by zone melting (float zone or FZ process).
- the solidification of the silicon is usually carried out in Quarzguttiegeln, with
- Silicon nitride are coated.
- the silicon nitride prevents the silicon from adhering to the crucible. In the case of adhesion, cracks in the silicon material and loss of the crystallized silicon may occur.
- the silicon is heated until it melts. When completely melted, the silicon solidifies from bottom to top. After solidification, the crystal is slowly cooled controlled.
- the crystal After the crystal has cooled, the crystal can be removed and processed into wafers.
- the crystal blocks are first separated by means of a réellelochsäge into smaller blocks or bricks (raw and finished columns).
- the smaller bricks are then cut into wafers using a wire saw.
- the approach is pursued to influence the initial crystal microstructure on the bottom of the crucible by moderation of the axial heat transfer.
- US 201 1/239933 A1 discloses a method for producing silicon blocks comprising the following steps:
- the removal of the heat takes place in such a way that sets in the region of the bottom on the inside of the vessel at least temporarily an inhomogeneous temperature distribution.
- the temperature distribution comprises one
- Production of silicon ingots comprising the following steps: providing a container for receiving a silicon melt,
- liquid silicon may be brought into contact with a substrate having a temperature below the melting temperature of silicon.
- the substrate preferably consists of a fine-grained raw material such as silicon, silicon carbide, silicon nitride or graphite having a mean grain size in the range of 0.1 mm to 3 mm, which is placed directly on a bottom of the container and in particular a thickness in the range of 1 cm to 5 cm.
- the temperature in the fine-grained layer is below the silicon melting temperature and the melting and
- Solidification process can take place either in the same or two different crucibles and the crystallized silicon block has a height of at least 50 cm.
- the number of grains should decrease from the bottom to the cap and thereby decrease at least 20%, in particular at least 30%. It is reported that the electrically recombination-active defect content remains constant above a certain block height.
- US 2013/136918 A1 discloses a process for producing a crystalline
- Forming tool wherein the mold itself sets a vertical direction
- crystalline silicon block having a lower portion and defining a vertical direction, characterized in that the crystalline silicon block has a plurality of vertically grown ones
- the rate of increase of the defect density in the vertical direction of the block is in a range of 0.01 to 10% / mm.
- Nucleation promotion layer should consist of irregular particles with a size of less than 50 mm and composed of silicon and silicon carbide particles. Furthermore, the nucleation promoting layer may consist of a plate having a melting point above that of silicon and having a roughness of 300 to 1000 ⁇ m.
- the crystal material (block and wafer) should have predominantly crystal orientations of the silicon grains between (001) and (1 1 1), wherein a volume percentage of the silicon grains with the predominant
- Crystal orientations should be greater than 50%.
- Providing a temperature control device for controlling the temperature of the silicon melt in the container Arranging raw material in the container comprising silicon and at least one nucleating agent to promote heterogeneous nucleation in the silicon melt, and
- the nucleating agent comprises nanoscale particles.
- nucleating agents for heterogeneous nucleation in the silicon melt.
- the specification of the additional nucleating agents takes place in the vicinity of the bottom of the crucible, preferably in an area where the nucleating agent concentration is greater than the saturation concentration of the elements involved.
- the nucleating agents should have a surface area of at least 2 m 2 / g, the particles optionally
- Getterzentren be for metal atoms, consisting of at least a portion of silicon and at least one element of C, O and N. 90% of the nucleating particles should have a size of at most 1 ⁇ .
- a silicon ingot having a longitudinal axis, a first end in the direction of the longitudinal axis, a second end in the direction of the longitudinal axis, a length (L) in the direction of the longitudinal axis, a multicrystalline structure and a grain density, which in the region of the first end at least 400 dm “2 , in particular at least 600 dm " 2 , in particular at least 800 dm "2 .
- a silicon wafer of multicrystalline silicon is known, with a wafer surface and with particles, wherein at least 90% of the particles have a
- Diameter of at most 1 ⁇ have, and the particles have a proportion of a compound of silicon and at least one of the elements selected from the group of carbon, oxygen and nitrogen.
- silicon wafers which have an area ratio of at least 80 and up to 95% and a dislocation density of less than 10 5 cm "2.
- Production of silicon ingots comprising the steps of providing a crucible for receiving a silicon melt, having a bottom and a plurality of side walls connected to the bottom; Attaching germs at least on an inner side of the bottom of the crucible, wherein the seeds have a melting temperature which is greater than the melting temperature of silicon; Filling the crucible with the silicon melt; Solidification of the silicon melt on the seeds starting and removing the solidified silicon from the crucible.
- the process leads to an initially fine-grained crystal structure.
- the necessary germ density is in the range of 0.001 to 100 / cm 2 , the seed size in the range of 0.01 to 50,000 ⁇ .
- materials to be used one or more compounds of the elements of III., IV. And / or V. main group are described, but in particular AI2O3, SiC, SiO, SiO2, Si3N4, BN, BP, AIAs, AIN or BeO.
- DE 10 201 1 003 578 A1 and US 201 1/203517 A1 describe a method for the production of silicon blocks comprising the following steps:
- a vessel for receiving a silicon melt which has on at least one vessel wall at least in regions a nucleation-suppressing surface and at least one seed target on the inside provided with the nucleation-suppressing surface on an inner side of at least one vessel wall; arranging a silicon melt; Melt in the vessel by pouring liquid silicon or by melting solid silicon,
- materials to be used are silicon carbide, graphite, silicon nitride,
- nucleation-promoting layer and a diffusion-inhibiting layer is constructed and may consist of various Ba compounds, oxides, carbides, nitrides, etc.
- the processes described in the prior art are technologically complex due to the costly adjustment of the heat transfer and the longer process times, eg. B. when germinating on Siliciunnrohstoff.
- the problem of the invention resulted.
- the object was multicrystalline silicon with a lower electrically recombination-active surface area and thus higher
- the object of the invention is achieved by a method for producing multicrystalline silicon, comprising the following steps:
- the bottom of the crucible has a coating comprising one or more compounds selected from the group consisting of Si 3 N 4, Si 3 N 4 and oxidized S1O2,
- the silicon layer releases a reducing agent upon heating of the crucible and / or melting of the silicon layer.
- the silicon layer comprises a silicon raw material conditioned to release a reducing agent. This changes the wetting behavior of the Crucible coating against the silicon melt produced from the polycrystalline silicon. This wetting behavior varies with the oxygen content of the crucible coating. A chemical attack by the reducing agent reduces the oxygen content of the crucible coating, thereby influencing the wetting properties. This allows the initial
- the silicon layer comprises polycrystalline silicon produced by means of the previously described Siemens process and then added to
- the silicon-containing component of the reaction gas is monosilane or a halosilane, e.g. Trichlorosilane mixed with hydrogen. Hydrogen and halogens are thereby added e.g. enclosed in the granular silicon particles.
- the silicon layer comprises polycrystalline silicon having a
- Hydrogen in silicon can be measured by "inert gas fusion thermal conductivity / infrared detection method" analogously to ASTM E 1447.
- the silicon layer comprises polycrystalline silicon with a
- the silicon layer comprises polycrystalline silicon having a
- Halogens or chloride can be analyzed via SEMI PV 10, "Test Method for Instrumental, Neutron Activation Analysis (INAA) of Silicon” or also
- the silicon layer comprises granular polycrystalline silicon with a particle size of 50 to 4000 ⁇ m. Particularly preferred is a grain size of 50 to 400 ⁇ .
- the determination of the particle size can be carried out by means of an optical particle size analyzer. This is the dynamic
- the silicon layer in one embodiment is placed in the crucible so as to cover at least 30% of the area of the bottom of the crucible. Preferably, at least 50% of the bottom surface of the crucible is covered. In one embodiment, the silicon layer completely covers the bottom surface of the crucible.
- the silicon layer preferably has a height of 50 ⁇ to 100 cm, more preferably 50 ⁇ to 10 cm and most preferably 50 ⁇ to 1 cm.
- polycrystalline silicon may be fractions (Siemens process) or polycrystalline silicon granules.
- the crucible coating at least 200 ⁇ , preferably 300-500 ⁇ thick, the chemical attack by the reducing agent, which is released from the silicon layer, only in the upper part of the crucible coating (50-150 ⁇ thickness). Only in the upper range does the wetting behavior change. Under the chemically attacked upper part of the coating remains a non-wetting coating that prevents complete penetration of the silicon melt to the crucible bottom.
- the silicon layer has no contact with the inside of the crucible.
- the distance to the inside of the crucible should be at least 1 mm. In one embodiment, the distance is at least 1 cm. This can be done
- the directional solidification of the silicon melt preferably produces a multicrystalline silicon block or a crude and finished column (Brick), hereinafter referred to as a silicon column having an average particle size of less than 12.5 mm 2 , more preferably less than 5 mm 2 , most preferably less than 2.5 mm 2 in the bottom region of the multicrystalline silicon block or the multicrystalline silicon column.
- a silicon column having an average particle size of less than 12.5 mm 2 , more preferably less than 5 mm 2 , most preferably less than 2.5 mm 2 in the bottom region of the multicrystalline silicon block or the multicrystalline silicon column.
- the bottom area extends from the bottom of the silicon block or the bottom of the silicon column to a height of the block of 5 cm (range 0-5 cm from the floor).
- the mean grain size can be determined for example by means of the identification and
- the multicrystalline silicon block, the multicrystalline silicon column and a multicrystalline silicon wafer made therefrom have a maximum mean grain size - measured on an area of 156 x 156 mm 2 - of 12.5 mm 2 , more preferably 10 mm 2 and most preferably 7 mm 2 ,
- the multicrystalline silicon block, the multicrystalline silicon column and a multicrystalline silicon wafer produced therefrom preferably have a homogeneous areal distribution of the grain orientation.
- individual grain orientations should not have an area fraction on an area of 156 ⁇ 156 mm 2 of block, column or wafer of greater than 50%, particularly preferably greater than 25%.
- Individual grain orientations should have an area fraction of less than 25%, more preferably less than 10%, and most preferably less than 5%.
- a microstructure of multicrystalline silicon block, multicrystalline silicon pillar, and a multicrystalline silicon wafer made thereof should have one
- Block-close wafers preferably have an electrically recombination-active area fraction of 0.2-2.5%.
- Multicrystalline silicon wafers with the lowest electrically recombination active area fraction from the block cap, ie at the end of solidification, preferably have an average particle size of 6-1 1 mm 2 .
- the crucible is preferably a quartz crucible, the one
- Coating containing Si3N has.
- the resulting silicon layer comprises silicon, which releases an agent that chemically attacks oxide-containing surfaces.
- Siliciumeinwaage (silicon seed layer and arranged above it polycrystalline silicon) can be melted within the crucible, thus the process takes less time and then can be germinated small-grained on the wetting crucible coating. In addition, the expansion of the bad bottom area, which is due to solid-state diffusion from the crucible and the coating, is reduced.
- the initial seeding in the directional solidification of multicrystalline silicon can be controlled by the presentation of a specific silicon raw material in the form of Siliciunn- layer.
- the spatial variation of the addition also allows the spatial structure of the wetting behavior to be defined.
- a local or locally varied template is possible.
- the crucible may consist of S1O2, Si3N or C.
- the coating may be composed of Si3N particles, which in turn have an oxidized surface. It can also be different
- Crucible coatings can be combined: one crucible coating can slow down or even prevent the chemical attack induced by the silicon layer, while the second crucible coating promotes chemical attack.
- the silicon layer which is in direct contact with the oxidized Si3N-based crucible coating, can be arranged in the crucible in different ways: it can be either full-surface or locally confined to the crucible
- Fig. 1 shows a coated crucible with silicon layer and polycrystalline silicon in cross-section.
- Fig. 2 shows a coated crucible with silicon layer and polycrystalline silicon in cross-section.
- Fig. 3 shows a coated crucible with silicon layer and polycrystalline silicon in plan view.
- Fig. 4 shows a coated crucible with silicon layer and polycrystalline silicon in cross-section.
- Fig. 5 shows a coated with two different materials crucible with silicon layer and polycrystalline silicon in cross section.
- Fig. 6 shows defect content and average grain size over the height of the crystal block for Example and Comparative Example. List of reference numbers used
- Fig. 1 shows the sketch of a crucible 3 in cross section, consisting of side walls and a crucible bottom. You can see from the outside in the crucible 3, the
- silicon-releasing material namely the silicon layer 1 is filled and the area which is filled with "normal” silicon raw material, namely with polycrystalline silicon
- Figs. 2 and 3 show sketches of a crucible 3 in cross section, consisting of
- Fig. 4 shows the sketch of a crucible 3 in cross section, consisting of side walls and a crucible bottom.
- the specification of the silicon layer 1 takes place here in such a way that the silicon layer 1 does not come in direct contact with the side walls of the crucible 3.
- Fig. 5 shows the sketch of a crucible 3 in cross section, consisting of side walls and a crucible bottom. You can see from the outside in the crucible 3, the
- the crucible coating 41 is characterized in that the silicon layer 1 slows down induced chemical attack or does not take place at all.
- Crucible coating 42 is characterized in that the induced by silicon layer 1 chemical attack proceeds favorably.
- the inventive process A is characterized by the specification of a polycrystalline silicon granules, which was deposited on trichlorosilane in a fluidized bed, with a grain size of 0 to 4000 ⁇ and a chlorine content of greater than 35 ppmw.
- the standard process B is characterized by the specification of broken polycrystalline silicon on the crucible bottom, produced by the Siemens process, with a grain size of 0-15 mm and a chlorine content of less than 1 ppmw.
- Fig. 6 shows a comparison of the defect content and the average grain size over the block height for the presentation of a silicon layer 1 on the crucible bottom, which releases a suitable reducing agent (process A), compared to the template of polycrystalline silicon 2 on the crucible bottom, which is not a suitable reducing agent contains (process B).
- Process A are lower over the entire block height than process B.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Silicon Compounds (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015201988.8A DE102015201988A1 (en) | 2015-02-05 | 2015-02-05 | Process for the production of multicrystalline silicon |
PCT/EP2016/051995 WO2016124509A1 (en) | 2015-02-05 | 2016-01-29 | Method for producing multicrystalline silicon |
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Publication Number | Publication Date |
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EP3253908A1 true EP3253908A1 (en) | 2017-12-13 |
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ID=55272489
Family Applications (1)
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EP16702122.9A Withdrawn EP3253908A1 (en) | 2015-02-05 | 2016-01-29 | Method for producing multicrystalline silicon |
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EP (1) | EP3253908A1 (en) |
JP (2) | JP6517355B2 (en) |
KR (1) | KR101954785B1 (en) |
CN (1) | CN107208308B (en) |
DE (1) | DE102015201988A1 (en) |
MY (1) | MY183217A (en) |
SG (1) | SG11201704945YA (en) |
TW (1) | TWI591217B (en) |
WO (1) | WO2016124509A1 (en) |
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KR102366166B1 (en) | 2021-08-18 | 2022-02-23 | 주식회사 린텍 | Manufacturing Method of Polycrystalline Silicon Ingot in which an Oxygen Exhaust Passage is Formed inside a Crucible by Single Crystal and Polycrystalline Rod |
CN113716878B (en) * | 2021-09-10 | 2023-06-16 | 湖南倍晶新材料科技有限公司 | Quartz surface composite coating and preparation method thereof |
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JPH02233514A (en) | 1989-03-06 | 1990-09-17 | Osaka Titanium Co Ltd | Production of polycrystalline silicon |
WO2006059632A1 (en) | 2004-11-30 | 2006-06-08 | Space Energy Corporation | Process for producing polycrystalline silicon ingot |
US8211965B2 (en) * | 2009-07-16 | 2012-07-03 | MEMC Singapore Pte. Ltd. (UEN 200614794D) | Coating compositions |
DE102010000687B4 (en) | 2010-01-05 | 2012-10-18 | Solarworld Innovations Gmbh | Crucible and method for producing silicon blocks |
DE102011003578A1 (en) | 2010-02-25 | 2011-08-25 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80686 | Apparatus and method for producing silicon blocks |
US20110239933A1 (en) | 2010-04-01 | 2011-10-06 | Bernhard Freudenberg | Device and method for the production of silicon blocks |
DE102011002598B4 (en) * | 2011-01-12 | 2016-10-06 | Solarworld Innovations Gmbh | Process for producing a silicon ingot |
DE102011002599B4 (en) | 2011-01-12 | 2016-06-23 | Solarworld Innovations Gmbh | Process for producing a silicon ingot and silicon ingot |
TWI441962B (en) * | 2011-10-14 | 2014-06-21 | Sino American Silicon Prod Inc | Crystalline silicon ingot and method of fabricating the same |
CN103088418B (en) * | 2011-11-01 | 2015-07-08 | 昆山中辰矽晶有限公司 | Crystalline silicon ingot and its making method |
US9493357B2 (en) | 2011-11-28 | 2016-11-15 | Sino-American Silicon Products Inc. | Method of fabricating crystalline silicon ingot including nucleation promotion layer |
DE102011087759B4 (en) | 2011-12-05 | 2018-11-08 | Solarworld Industries Gmbh | Process for the production of silicon ingots and silicon ingots |
US20130193559A1 (en) * | 2012-01-27 | 2013-08-01 | Memc Singapore Pte. Ltd. (Uen200614794D) | CAST SILICON ingot prepared BY DIRECTIONAL SOLIDIFICATION |
TWI580825B (en) * | 2012-01-27 | 2017-05-01 | Memc新加坡有限公司 | Method of preparing cast silicon by directional solidification |
TWI620838B (en) * | 2012-02-15 | 2018-04-11 | 中美矽晶製品股份有限公司 | Crystalline silicon ingot including nucleation promotion particles and method of fabricating the same |
CN102776561B (en) * | 2012-04-01 | 2017-12-15 | 江西赛维Ldk太阳能高科技有限公司 | Polycrystal silicon ingot and preparation method thereof, polysilicon chip and crucible used for polycrystalline silicon ingot casting |
CN103074669B (en) * | 2013-01-29 | 2015-05-13 | 江西赛维Ldk太阳能高科技有限公司 | Polycrystalline silicon ingot, preparation method thereof and polycrystalline silicon chip |
CN102776555B (en) * | 2012-04-01 | 2015-11-18 | 江西赛维Ldk太阳能高科技有限公司 | A kind of polycrystal silicon ingot and preparation method thereof and polysilicon chip |
DE102012206439A1 (en) | 2012-04-19 | 2013-10-24 | Wacker Chemie Ag | Polycrystalline silicon granules and their preparation |
DE102012207505A1 (en) | 2012-05-07 | 2013-11-07 | Wacker Chemie Ag | Polycrystalline silicon granules and their preparation |
WO2014037965A1 (en) | 2012-09-05 | 2014-03-13 | MEMC ELECTRONIC METERIALS S.p.A. | Method of loading a charge of polysilicon into a crucible |
TWI541393B (en) | 2012-12-28 | 2016-07-11 | 中美矽晶製品股份有限公司 | Seed used for crystalline silicon ingot casting |
CN103361722B (en) * | 2013-07-23 | 2016-03-02 | 江西赛维Ldk太阳能高科技有限公司 | Polycrystal silicon ingot and preparation method thereof, polysilicon chip and crucible used for polycrystalline silicon ingot casting |
CN103834994A (en) * | 2014-03-13 | 2014-06-04 | 江西赛维Ldk太阳能高科技有限公司 | Polycrystalline silicon ingot and preparation method thereof and polycrystalline silicon wafer |
-
2015
- 2015-02-05 DE DE102015201988.8A patent/DE102015201988A1/en not_active Withdrawn
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2016
- 2016-01-29 SG SG11201704945YA patent/SG11201704945YA/en unknown
- 2016-01-29 CN CN201680007941.5A patent/CN107208308B/en not_active Expired - Fee Related
- 2016-01-29 KR KR1020177018795A patent/KR101954785B1/en active IP Right Grant
- 2016-01-29 MY MYPI2017000903A patent/MY183217A/en unknown
- 2016-01-29 EP EP16702122.9A patent/EP3253908A1/en not_active Withdrawn
- 2016-01-29 JP JP2017541336A patent/JP6517355B2/en not_active Expired - Fee Related
- 2016-01-29 WO PCT/EP2016/051995 patent/WO2016124509A1/en active Application Filing
- 2016-02-04 TW TW105103649A patent/TWI591217B/en not_active IP Right Cessation
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KR101954785B1 (en) | 2019-03-06 |
CN107208308A (en) | 2017-09-26 |
TW201629278A (en) | 2016-08-16 |
KR20170094317A (en) | 2017-08-17 |
TWI591217B (en) | 2017-07-11 |
JP2018504359A (en) | 2018-02-15 |
WO2016124509A1 (en) | 2016-08-11 |
JP6517355B2 (en) | 2019-05-22 |
SG11201704945YA (en) | 2017-08-30 |
MY183217A (en) | 2021-02-18 |
CN107208308B (en) | 2020-05-15 |
JP2019069898A (en) | 2019-05-09 |
DE102015201988A1 (en) | 2016-08-11 |
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