EP3246767A1 - Method for manufacturing a timepiece provided with a hollow or raised casing element - Google Patents

Method for manufacturing a timepiece provided with a hollow or raised casing element Download PDF

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Publication number
EP3246767A1
EP3246767A1 EP16170379.8A EP16170379A EP3246767A1 EP 3246767 A1 EP3246767 A1 EP 3246767A1 EP 16170379 A EP16170379 A EP 16170379A EP 3246767 A1 EP3246767 A1 EP 3246767A1
Authority
EP
European Patent Office
Prior art keywords
metal layer
substrate
volume
pattern
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16170379.8A
Other languages
German (de)
French (fr)
Other versions
EP3246767B1 (en
Inventor
Pascal Grossenbacher
Stewes Bourban
Pierry Vuille
Yves Winkler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Swatch Group Research and Development SA
Original Assignee
Swatch Group Research and Development SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Swatch Group Research and Development SA filed Critical Swatch Group Research and Development SA
Priority to CH00647/16A priority Critical patent/CH712475A2/en
Priority to EP16170379.8A priority patent/EP3246767B1/en
Priority to US15/587,797 priority patent/US10528008B2/en
Priority to JP2017096238A priority patent/JP6343701B2/en
Priority to CN201710351445.8A priority patent/CN107402512B/en
Publication of EP3246767A1 publication Critical patent/EP3246767A1/en
Application granted granted Critical
Publication of EP3246767B1 publication Critical patent/EP3246767B1/en
Priority to US16/696,359 priority patent/US11300930B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0002—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe
    • G04D3/0043—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe for components of the time-indicating mechanisms
    • G04D3/0048—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe for components of the time-indicating mechanisms for dials
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B37/00—Cases
    • G04B37/22—Materials or processes of manufacturing pocket watch or wrist watch cases
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/04—Hands; Discs with a single mark or the like
    • G04B19/042—Construction and manufacture of the hands; arrangements for increasing reading accuracy
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/06—Dials
    • G04B19/10—Ornamental shape of the graduations or the surface of the dial; Attachment of the graduations to the dial
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/06—Dials
    • G04B19/12—Selection of materials for dials or graduations markings
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B19/00—Indicating the time by visual means
    • G04B19/06—Dials
    • G04B19/18—Graduations on the crystal or glass, on the bezel, or on the rim
    • G—PHYSICS
    • G04—HOROLOGY
    • G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
    • G04B45/00—Time pieces of which the indicating means or cases provoke special effects, e.g. aesthetic effects
    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0069—Watchmakers' or watch-repairers' machines or tools for working materials for working with non-mechanical means, e.g. chemical, electrochemical, metallising, vapourising; with electron beams, laser beams
    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
    • G04D3/0074—Watchmakers' or watch-repairers' machines or tools for working materials for treatment of the material, e.g. surface treatment
    • G04D3/0092—Watchmakers' or watch-repairers' machines or tools for working materials for treatment of the material, e.g. surface treatment for components of the time-indicating mechanism, e.g. dials
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C27/00—Making jewellery or other personal adornments

Definitions

  • the invention relates to a method of manufacturing a piece such as a timepiece, jewelery or jewelery, for example a watch face, a bezel, a bracelet, etc.
  • the method more particularly makes it possible to produce a covering element on said part, such as an hour indicator, a decorative element, etc.
  • a disadvantage of this method is the limitation in the shape and depth of the openings, causing a limitation in the shape and length of the cladding elements.
  • the method does not make it possible to form covering elements extending over only a portion of the dial.
  • the cladding elements are possibly made of precious material, for example gold, so it is advantageous to limit their depth in the dial, not appreciable from the outside.
  • the method does not allow to produce trim elements with textured heads, for example guilloche.
  • Another disadvantage is that the method does not make it possible to produce cladding elements formed of a non-metallic material.
  • the method does not make it possible to produce cladding elements that are not in relief but hollow, forming recesses of a desired shape, and in particular recesses with a colored background.
  • the object of the present invention is to overcome all or part of the disadvantages mentioned above.
  • the method according to the first embodiment makes it possible to manufacture a part provided with a cladding element forming a recess in the part.
  • the geometry of the recess is determined by the geometry of the relief pattern present on the substrate; it is therefore understood that the recess can take any desired shape.
  • the recess has a background of the color of the metal layer, for example a gold background if the metal layer is made of gold.
  • This metal layer forms an insert whose disengagement of the volume of base material is impossible without destroying the part.
  • the invention takes advantage of a characteristic of the galvanic growth of a metal often considered as a defect, according to which the metal grows not only vertically from a surface disposed horizontally in a terrestrial reference, but also laterally .
  • the method according to the second embodiment makes it possible to manufacture a part provided with a covering element forming an outgrowth.
  • the protrusion is constituted by the part of the metal layer protruding from the volume of base material, the protrusion is therefore the color of the metal layer.
  • the geometry of the protrusion is determined by the geometry of the hollow pattern machined on the substrate; it is therefore understood that the protrusion can take any desired shape within the limits of machining possibilities of the substrate.
  • the metal layer forms an insert whose disengagement of the volume of base material is impossible, for the same reasons as explained in relation to the first embodiment.
  • the manufacturing method according to the first or second embodiment may include one or more of the features below, in any technically possible combination.
  • the base material is an amorphous or partially amorphous metal or metal alloy or a polymer
  • the covering step being carried out by pressing a block of base material on the assembly comprising the substrate and the metal layer.
  • the base material is metallic, the covering step being performed by galvanic growth of the base material on the assembly comprising the substrate and the layer. metallic.
  • the metal layer is made of gold, silver, nickel or an alloy of the aforementioned metals.
  • the insulating layer is made of resin.
  • the method according to the invention comprises the following steps.
  • a SB electrically conductive substrate also called master in the middle of the molding.
  • the substrate SB is advantageously made of brass, but may be made of another material, for example stainless steel, aluminum, nickel, a cermet composite, a ceramic or a polymer rendered conductor (electrolytic deposition or plasma treatment for example), etc.
  • the substrate SB comprises an MT pattern forming a relief, or projection, from an upper surface SP of the substrate SB.
  • the MT pattern was obtained by machining the SB substrate.
  • the pattern was not obtained by machining but by injection, or by hot pressing of a partially or totally amorphous metal alloy, based on zirconium or platinum, for example.
  • the MT pattern has a flat top ST extending parallel to the upper surface SP and FC sides extending substantially orthogonally at the top ST.
  • the FC sidewalls could be inclined with respect to the upper surface SP at an angle ⁇ less than 90 °, the crown ST might not be quite parallel to the upper surface SP, etc.
  • the SP upper surface and the top ST have optionally undergone a surface machining to create a particular texture that is desired to give the piece, for example a guilloche, as seen on the figure 1a .
  • an insulating layer CI is deposited on the upper surface SP, on a thickness E less than or equal to the height H of the pattern MT.
  • the deposition step Md_Cis is for example made by steaming a resin in viscous form deposited around the MT pattern.
  • the excess is removed by surfacing.
  • this surfacing also makes it possible to create or recreate a texture at the level of the summit ST.
  • a step Md_Cga shown at figure 1c depositing a metal layer CM on the top ST (electrically conductive) of the MT pattern by galvanic growth.
  • the SB substrate surmounted by the insulating layer CI is thus immersed in a galvanic bath suitable for the deposition of a metal such as gold, silver, nickel, or any other metal or metal alloy that can be deposited in a relatively thick.
  • a metal such as gold, silver, nickel, or any other metal or metal alloy that can be deposited in a relatively thick.
  • the metal deposit increases not only orthogonally at the top ST, but also laterally, that is to say in the direction of the insulating layer CI.
  • the metal layer CM therefore has lateral ends EL which rest on the insulating layer CI.
  • the metal layer CM is machined to reduce its thickness P and / or to structure or polish its surface.
  • step Md_Dis shown at the figure 1d the insulating layer CI is dissolved. There then remains only a set ES formed of the SB substrate and the CM metal layer.
  • a surface treatment of this set ES is carried out.
  • This treatment is for example the application of an agent of demolding or a passivation treatment. The interest of this step appears in the rest of the text.
  • this ES assembly is covered by a volume VL of a base material of the part to be manufactured, so that the volume VL forms an imprint of the assembly ES.
  • the base material is amorphous or partially amorphous metal, interesting for its mechanical properties.
  • the base material is a polymer. In both cases, an amorphous or partially amorphous metal or metal block or polymer block is pressed onto the ES assembly at a temperature at which it has a pasty consistency, which allows it to deform to fit the shapes of the assembly ES, and in particular the shapes of the lateral ends EL of the metal layer CM.
  • the base material is any other metal or metal alloy, for example nickel, gold, etc., and the coating is made by galvanic growth of said metal. Note that at the end of the Md_Enr step, the metal layer CM is secured to the volume VL of the base material, because its lateral ends EL form hooks sealed in the volume VL of base material.
  • the volume VL of the base material and the metal layer CM are separated from the substrate SB.
  • the SB substrate is for example immersed in a selective acid bath in which it is dissolved.
  • the separation is carried out by force demolding. Having previously carried out a surface treatment of the ES assembly then makes it easier to demold.
  • the volume VL of the base material has a recess EV of shape corresponding to the imprint of the pattern MT of the substrate SB, whose bottom FD is the color of the metal layer CM. It is noted that the transition between the volume VL of base material and the CM metal layer is clear. Moreover, by impression effect, the volume VL has a textured appearance: the bottom FD of the EV recess has a mirror appearance similar to that of the top ST of the substrate SB, and the surface SF of the volume VL which was previously vis-à-vis the upper surface SP of the substrate SB has a mirror appearance similar to that of said upper surface SP.
  • figure 1f shows the substrate SB and the metal layer CM as they are when in step Md_Cis the insulating layer CI is deposited on a thickness E substantially equal to the height H of the MT pattern.
  • the lateral ends EL of the metal layer CM then extend parallel to the bottom FD of the recess EV.
  • figure 1g shows the volume VL and the metal layer CM as they are when in step Md_Cis the insulating layer CI is deposited on a thickness E less than the height H of the MT pattern.
  • the lateral ends EL of the metal layer CM then extend over a portion of the side walls PL of the recess EV.
  • the first embodiment thus makes it possible to manufacture a PC part equipped with an enclosed cladding element.
  • This covering element consists of an obvious EV having a bottom FD of the color of the metal layer CM, for example gold or silver.
  • the interface between the volume VL and the metal layer CM is clear, without burrs.
  • the CM metal layer is inseparable from the rest of the room.
  • the SF surface of the PC part and the FD bottom of the EV obviously are textured.
  • the method according to the invention comprises the following steps.
  • a conductive substrate SB ' is provided.
  • the substrate SB ' is advantageously made of brass, but may be made of another material, for example stainless steel, aluminum, nickel, etc.
  • the upper surface SP 'of the substrate SB' has optionally undergone a surface machining to create a particular texture that is desired give the piece, for example a guilloche, as we see on the figure 2a .
  • an insulating layer CI 'of thickness E' is deposited on the upper surface SP 'of the substrate SB'.
  • the deposition step Md'_ cis is for example carried out by steaming a resin in viscous form deposited on the upper surface SP '.
  • the insulating layer CI 'and the substrate SB' are machined, so as to produce a hollow MT 'pattern extending through the insulating layer CI' and on a portion of the substrate SB 'of thickness G.
  • the pattern MT ' has a flat bottom ST' extending parallel to the upper surface SP 'of the substrate SB', and flanks FC 'extending substantially orthogonal to said bottom ST', but this form is not limiting.
  • the flanks FC 'could be inclined with respect to the upper surface SP' at an angle ⁇ 'of less than 90 °, the bottom ST' might not be entirely parallel to the upper surface SP ', etc.
  • a metal layer CM ' is deposited in the pattern MT' by galvanic growth.
  • the substrate SB 'surmounted by the insulating layer CI' is thus immersed in a galvanic bath suitable for the deposition of a metal such as gold, silver, nickel, or any other metal or metal alloy that can be deposited in relatively thick layer.
  • a metal such as gold, silver, nickel, or any other metal or metal alloy that can be deposited in relatively thick layer.
  • the metal deposit not only increases orthogonally to the bottom ST' of the pattern MT ', but also laterally so as to be deposited on the insulating layer CI'.
  • the metal layer CM 'therefore has lateral ends EL' which rest on the insulating layer CI '.
  • the metal layer CM ' is machined to reduce the thickness P' of the lateral ends EL 'and / or to structure or polish the surface of the metal layer CM'.
  • step Md'_Dis shown at the figure 2d the insulating layer CI 'is dissolved. There then remains only a set ES 'formed of the substrate SB' and the metal layer CM '.
  • a surface treatment of this set ES ' is carried out.
  • This treatment is for example the application of an oil or a passivation. The interest of this step appears in the rest of the text.
  • this set ES ' is covered by a volume VL' of a base material of the part to be manufactured, so that the volume VL forms an imprint of the assembly ES.
  • the base material is an amorphous or partially amorphous metal or metal alloy.
  • the base material is a polymer. In both cases, a block of amorphous or partially amorphous metal or polymer is pressed on the assembly ES 'at a temperature at which it has a pasty consistency, which allows it to deform to fit the shapes of the set ES ', and in particular the shapes of the lateral ends EL' of the metal layer CM '.
  • the base material is any other metal, for example nickel, gold, etc., and the coating is made by galvanic growth of said metal. Note that at the end of the step Md'_En, the metal layer CM 'is secured to the volume VL' of base material, because its lateral ends EL 'form hooks sealed in the volume VL' of material basic.
  • the volume VL 'of base material and the metal layer CM' are separated from the substrate SB '.
  • the SB 'substrate is for example immersed in a selective acid bath in which it is dissolved.
  • the separation is carried out by demoulding in force. Having previously carried out a surface treatment of the assembly ES 'then makes it easier to demold.
  • the metal layer CM ' forms a protrusion EV' on the volume VL 'of shape corresponding to the imprint of the pattern MT' in the substrate SB '. It is noted that the transition between the volume VL 'of base material and the metal layer CM' is clear. Moreover, by impression effect, the volume VL 'has a textured appearance: the surface SF' of the volume VL 'which was previously vis-a-vis the upper surface SP' of the substrate SB 'has a similar mirror appearance to that of said upper surface SP '.
  • the second embodiment thus makes it possible to manufacture a piece PC 'provided with a relief dressing element.
  • This covering element consists of a protrusion EV 'formed by the metal layer CM'.
  • the interface between the volume VL 'and the metal layer CM' is clear, without burrs.
  • the metal layer CM ' is inseparable from the rest of the room.
  • the surface SF 'of the piece PC can be textured.
  • the method according to the first or the second embodiment optionally comprises the following additional steps, making it possible to modify the appearance of the covering element.
  • the anchor arms BA are advantageously used to retain an element, such as a colored resin, a fluorescent lacquer, a metal, a mineral, etc.
  • the method comprises a step Md_Rs1, shown in FIG. figure 3b , partial or total filling of the cavity CV with resin or lacquer RL, optionally colored or fluorescent.
  • the resin or lacquer RL is for example inserted in pasty form, then steamed to be solidified. Thanks to the BA anchor arms, it is then impossible to separate the resin or lacquer RL volume VL, VL '.
  • the method comprises a step of inserting a metal, a metal alloy or a composite into the cavity CV.
  • the metal is for example inserted in liquid form and then cooled to solidify. Thanks to the anchoring arms, it is impossible to separate the metal from the volume VL, VL '.
  • the metal can alternatively be deposited by galvanic growth. In this case, if the base material constituting the volume VL, VL 'is not metallic, it is necessary to carry out beforehand a step of physical vapor deposition of at least one metal thin film in the cavity CV.
  • the method comprises a step Md_Min, shown in FIG. figure 3c crimping a mineral MN, for example a diamond, in the cavity.
  • the mineral MN then has a base surmounted by EC notches, said EC notches cooperating with a rail leading to the cavity CV.
  • the anchoring arms BA When the mineral MN is in the cavity CV, it is retained by the anchoring arms BA.
  • the side walls PL of the cavity CV form a sharp angle with the anchoring arms BA, as can be seen in FIG. figure 3c , so that the side walls PL fit into the notches EC.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Adornments (AREA)
  • Micromachines (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention se rapporte à un procédé de fabrication d'une pièce (PC) dotée d'un élément d'habillage, le procédé comprenant les étapes suivantes : - Se munir (Md_Sub) d'un substrat (SB) comprenant une surface supérieure (SP) électriquement conductrice et un motif (MT) en relief sur ladite surface supérieure (SP), le motif (MT) comportant un sommet (ST) - Déposer (Md_Cis) une couche électriquement isolante (CI) sur la surface supérieure (SP) du substrat (SB), autour du motif (MT), sur une épaisseur (E) inférieure ou égale à la distance (H) entre le sommet (ST) et la surface supérieure (SP) - Déposer (Md_Cga) une couche métallique (CM) sur le sommet (ST) du motif (MT) par croissance galvanique, de sorte qu'à l'issue de cette étape, la couche métallique (MT) repose en partie sur la couche isolante (CI) - Dissoudre (Md_Dis) la couche isolante (CI) - Recouvrir (Md_Enr) un ensemble (ES) comprenant le substrat (SB) et la couche métallique (CM), par un volume (VL) d'un matériau de base de la pièce (PC), le volume (VL) formant une empreinte de l'ensemble (ES) - Séparer (Md_Dem) le volume (VL) et la couche métallique (CM), du substrat (SB), le volume (VL) présentant alors un élément d'habillage constitué par un évidemment (EV) dont la forme correspond à l'empreinte du motif (MT) et dont le fond (FD) s'interface avec la couche métallique (CM).The invention relates to a method of manufacturing a workpiece (PC) with a cladding element, the method comprising the following steps: - Providing (Md_Sub) a substrate (SB) comprising an electrically conductive upper surface (SP) and a raised pattern (MT) on said upper surface (SP), the pattern (MT) having a vertex (ST) - Depositing (Md_Cis) an electrically insulating layer (CI) on the upper surface (SP) of the substrate (SB), around the pattern (MT), on a thickness (E) less than or equal to the distance (H) between the vertex (ST) and the upper surface (SP) - Deposit (Md_Cga) a metal layer (CM) on the top (ST) of the pattern (MT) by galvanic growth, so that at the end of this step, the metal layer (MT) rests in part on the layer insulating (IC) - Dissolve (Md_Dis) the insulating layer (IC) - Cover (Md_Enr) an assembly (ES) comprising the substrate (SB) and the metal layer (CM), by a volume (VL) of a base material of the workpiece (PC), the volume (VL) forming a impression of the set (ES) - Separating (Md_Dem) the volume (VL) and the metal layer (CM) from the substrate (SB), the volume (VL) then having a covering element constituted by an obviously (EV) whose shape corresponds to the pattern imprint (MT) and whose bottom (FD) interfaces with the metal layer (CM).

Description

Domaine de l'inventionField of the invention

L'invention se rapporte à un procédé de fabrication d'une pièce telle qu'une pièce d'horlogerie, de joaillerie ou de bijouterie, par exemple un cadran de montre, une lunette, un bracelet, etc. Le procédé permet plus particulièrement de réaliser un élément d'habillage sur ladite pièce, tel qu'un indicateur des heures, un élément décoratif, etc.The invention relates to a method of manufacturing a piece such as a timepiece, jewelery or jewelery, for example a watch face, a bezel, a bracelet, etc. The method more particularly makes it possible to produce a covering element on said part, such as an hour indicator, a decorative element, etc.

Arrière-plan de l'inventionBackground of the invention

Dans le domaine de l'horlogerie, la joaillerie ou la bijouterie, il est classique de réaliser des éléments d'habillage en relief, maintenus de façon indésolidarisable de leur support. On connaît notamment de l'art antérieur la demande de brevet EP2192454A1 , qui décrit un procédé de fabrication d'un élément d'habillage formant relief sur un cadran. Selon le troisième mode de réalisation décrit dans cette demande, on réalise un cadran de montre comportant des ouvertures traversantes en forme de T. Puis, un masque est apposé sur le cadran. Le masque comporte des ouvertures disposées de sorte à communiquer avec les ouvertures du cadran. Ensuite, les ouvertures sont remplies, par galvanoplastie, par pressage d'un matériau amorphe ou par injection de métal, de sorte à former des éléments d'habillage. Enfin, l'épaisseur du matériau de remplissage dépassant du masque est supprimée, et le masque est retiré.In the field of watchmaking, jewelery or jewelery, it is conventional to make embossing elements in relief, maintained in an undesirable way of their support. Patent application is known in particular from the prior art. EP2192454A1 , which describes a method of manufacturing a dressing element forming a relief on a dial. According to the third embodiment described in this application, a watch dial having T-shaped through-openings is made. Then, a mask is affixed to the dial. The mask has apertures arranged to communicate with the apertures of the dial. Then, the openings are filled, by electroplating, by pressing an amorphous material or by injection of metal, so as to form cladding elements. Finally, the thickness of the filler material protruding from the mask is removed, and the mask is removed.

Un inconvénient de ce procédé est la limitation dans la forme et la profondeur des ouvertures, à l'origine d'une limitation dans la forme et la longueur des éléments d'habillage. Par exemple, le procédé ne permet pas de former des éléments d'habillage s'étendant sur une portion seulement du cadran. Or, les éléments d'habillage sont éventuellement constitués de matériau précieux, par exemple de l'or, il est donc avantageux de limiter leur profondeur dans le cadran, non appréciable de l'extérieur. Un autre inconvénient est que le procédé ne permet pas de réaliser des éléments d'habillage à têtes texturées, par exemple guillochées. Un autre inconvénient est que le procédé ne permet pas de réaliser des éléments d'habillage formés d'un matériau non métallique. Un autre inconvénient est que le procédé ne permet pas de réaliser des éléments d'habillage non pas en relief mais creux, formant des évidements d'une forme souhaitée, et en particulier des évidements à fond coloré.A disadvantage of this method is the limitation in the shape and depth of the openings, causing a limitation in the shape and length of the cladding elements. For example, the method does not make it possible to form covering elements extending over only a portion of the dial. However, the cladding elements are possibly made of precious material, for example gold, so it is advantageous to limit their depth in the dial, not appreciable from the outside. Another disadvantage is that the method does not allow to produce trim elements with textured heads, for example guilloche. Another disadvantage is that the method does not make it possible to produce cladding elements formed of a non-metallic material. Another disadvantage is that the method does not make it possible to produce cladding elements that are not in relief but hollow, forming recesses of a desired shape, and in particular recesses with a colored background.

Résumé de l'inventionSummary of the invention

Le but de la présente invention est de pallier en tout ou en partie les inconvénients évoqués précédemment.The object of the present invention is to overcome all or part of the disadvantages mentioned above.

A cet effet, selon un premier mode de réalisation, l'invention se rapporte à un procédé de fabrication d'une pièce dotée d'un élément d'habillage, le procédé comprenant les étapes suivantes :

  • Se munir d'un substrat électriquement conducteur comprenant une surface supérieure et un motif en relief sur ladite surface supérieure, le motif comportant un sommet
  • Déposer une couche électriquement isolante sur la surface supérieure du substrat, autour du motif, sur une épaisseur inférieure ou égale à la distance entre le sommet et la surface supérieure
  • Déposer une couche métallique sur le sommet du motif par croissance galvanique, de sorte qu'à l'issue de cette étape, la couche métallique repose en partie sur la couche isolante
  • Dissoudre la couche isolante
  • Recouvrir un ensemble comprenant le substrat et la couche métallique, par un volume d'un matériau de base de la pièce, le volume formant une empreinte de l'ensemble
  • Séparer le volume et la couche métallique, du substrat, le volume présentant alors un élément d'habillage constitué par un évidemment dont la forme correspond à l'empreinte du motif et dont le fond s'interface avec la couche métallique.
For this purpose, according to a first embodiment, the invention relates to a method of manufacturing a part equipped with a covering element, the method comprising the following steps:
  • Providing an electrically conductive substrate comprising an upper surface and a raised pattern on said upper surface, the pattern having a vertex
  • Deposit an electrically insulating layer on the upper surface of the substrate, around the pattern, to a thickness less than or equal to the distance between the top and the top surface
  • Deposit a metal layer on the top of the pattern by galvanic growth, so that at the end of this step, the metal layer rests partly on the insulating layer
  • Dissolve the insulating layer
  • Cover an assembly comprising the substrate and the metal layer, by a volume of a base material of the workpiece, the volume forming an impression of the whole
  • Separating the volume and the metal layer from the substrate, the volume then having a covering element constituted by a naturally whose shape corresponds to the imprint of the motif and whose bottom interfaces with the metal layer.

Le procédé selon le premier mode de réalisation permet de fabriquer une pièce dotée d'un élément d'habillage formant un évidement dans la pièce. La géométrie de l'évidement est déterminée par la géométrie du motif en relief présent sur le substrat ; on comprend donc que l'évidement peut prendre toute forme souhaitée. De plus, l'évidement présente un fond de la couleur de la couche métallique, par exemple un fond doré si la couche métallique est constituée d'or. Cette couche métallique forme un insert dont le désengagement du volume de matériau de base est impossible sans détruire la pièce. En effet, l'invention tire profit d'une caractéristique de la croissance galvanique d'un métal souvent considérée comme un défaut, selon laquelle le métal croît non seulement verticalement à partir d'une surface disposée horizontalement dans un repère terrestre, mais également latéralement. Cette caractéristique permet à la couche métallique de reposer en partie sur la couche isolante à l'issue de l'étape de dépôt par croissance galvanique. Les parties de la couche métallique reposant sur la couche isolante, appelées extrémités latérales dans la suite du texte, forment alors des crochets se retrouvant scellés dans le volume de matériau de base de la pièce à l'issue de l'étape de recouvrement.The method according to the first embodiment makes it possible to manufacture a part provided with a cladding element forming a recess in the part. The geometry of the recess is determined by the geometry of the relief pattern present on the substrate; it is therefore understood that the recess can take any desired shape. In addition, the recess has a background of the color of the metal layer, for example a gold background if the metal layer is made of gold. This metal layer forms an insert whose disengagement of the volume of base material is impossible without destroying the part. Indeed, the invention takes advantage of a characteristic of the galvanic growth of a metal often considered as a defect, according to which the metal grows not only vertically from a surface disposed horizontally in a terrestrial reference, but also laterally . This characteristic allows the metal layer to rest partially on the insulating layer at the end of the deposition step by galvanic growth. The parts of the metal layer resting on the insulating layer, called lateral ends in the following text, then form hooks being found sealed in the volume of base material of the part at the end of the recovery step.

Selon un deuxième mode de réalisation, l'invention se rapporte à un procédé de fabrication d'une pièce dotée d'un élément d'habillage, comportant les étapes suivantes :

  • Se munir d'un substrat électriquement conducteur comprenant une surface supérieure
  • Déposer une couche électriquement isolante sur la surface supérieure du substrat
  • Usiner la couche isolante et le substrat de sorte à réaliser un motif creux traversant la couche isolante et s'étendant sur une portion du substrat
  • Déposer une couche métallique dans le motif par croissance galvanique, de sorte qu'à l'issue de cette étape, la couche métallique repose en partie sur la couche isolante
  • Dissoudre la couche isolante
  • Recouvrir un ensemble comprenant le substrat et la couche métallique, par un volume d'un matériau de base de la pièce, le volume formant une empreinte de l'ensemble
  • Séparer le volume et la couche métallique, du substrat, la couche métallique formant alors sur le volume une excroissance constituant un élément d'habillage, la forme de l'excroissance correspondant à l'empreinte du motif.
According to a second embodiment, the invention relates to a method of manufacturing a part equipped with a covering element, comprising the following steps:
  • Have an electrically conductive substrate with a top surface
  • Deposit an electrically insulating layer on the top surface of the substrate
  • Machining the insulating layer and the substrate so as to produce a hollow pattern passing through the insulating layer and extending over a portion of the substrate
  • Deposit a metal layer in the pattern by galvanic growth, so that at the end of this step, the metal layer rests partly on the insulating layer
  • Dissolve the insulating layer
  • Cover an assembly comprising the substrate and the metal layer, by a volume of a base material of the workpiece, the volume forming an impression of the whole
  • Separating the volume and the metal layer from the substrate, the metal layer then forming on the volume a protrusion constituting a covering element, the shape of the outgrowth corresponding to the imprint of the pattern.

Le procédé selon le deuxième mode de réalisation permet de fabriquer une pièce dotée d'un élément d'habillage formant une excroissance. L'excroissance est constituée par la partie de la couche métallique faisant saillie du volume de matériau de base, l'excroissance est donc de la couleur de la couche métallique. La géométrie de l'excroissance est déterminée par la géométrie du motif creux usiné sur le substrat ; on comprend donc que l'excroissance peut prendre toute forme souhaitée dans la limite des possibilités d'usinage du substrat. De plus, la couche métallique forme un insert dont le désengagement du volume de matériau de base est impossible, pour les mêmes raisons que celle expliquées en relation avec le premier mode de réalisation.The method according to the second embodiment makes it possible to manufacture a part provided with a covering element forming an outgrowth. The protrusion is constituted by the part of the metal layer protruding from the volume of base material, the protrusion is therefore the color of the metal layer. The geometry of the protrusion is determined by the geometry of the hollow pattern machined on the substrate; it is therefore understood that the protrusion can take any desired shape within the limits of machining possibilities of the substrate. In addition, the metal layer forms an insert whose disengagement of the volume of base material is impossible, for the same reasons as explained in relation to the first embodiment.

En outre, le procédé de fabrication selon le premier ou le deuxième mode de réalisation peut comprendre une ou plusieurs des caractéristiques ci-dessous, selon toutes les combinaisons techniquement possibles.In addition, the manufacturing method according to the first or second embodiment may include one or more of the features below, in any technically possible combination.

Dans un mode de réalisation non limitatif, le procédé selon le premier mode de réalisation comporte l'étape suivante :

  • Usiner le sommet du motif de sorte à créer une texture, par exemple un guillochis.
In a non-limiting embodiment, the method according to the first embodiment comprises the following step:
  • Machine the top of the pattern to create a texture, such as a guilloche.

Dans un mode de réalisation non limitatif, le procédé selon le premier ou le deuxième mode de réalisation comporte l'étape suivante :

  • Dissoudre la couche métallique, le volume présentant alors une cavité comprenant des bras d'ancrage formés par empreinte de la couche métallique.
In a non-limiting embodiment, the method according to the first or second embodiment comprises the following step:
  • Dissolving the metal layer, the volume then having a cavity comprising anchor arms formed by imprinting the metal layer.

Dans un mode de réalisation non limitatif, le procédé selon le premier ou le deuxième mode de réalisation comporte l'étape suivante, suivant l'étape de dissolution de la couche métallique :

  • Remplir la cavité d'un composé, tel qu'une résine, une laque ou un métal.
In a non-limiting embodiment, the method according to the first or second embodiment comprises the following step, following the step of dissolving the metal layer:
  • Fill the cavity with a compound, such as a resin, a lacquer or a metal.

Dans un mode de réalisation non limitatif du procédé selon le premier ou le deuxième mode de réalisation, le matériau de base du volume n'est pas métallique, le composé étant métallique, le procédé comportant l'étape suivante, entre l'étape de dissolution de la couche métallique et l'étape de remplissage de la cavité par le composé :

  • Réaliser un dépôt physique par phase vapeur d'un film métallique sur des parois de la cavité,
et l'étape de remplissage étant réalisée par croissance galvanique du composé sur le film métallique.In a non-limiting embodiment of the method according to the first or second embodiment, the base material of the volume is not metallic, the compound being metallic, the process comprising the following step, between the dissolution step of the metal layer and the step of filling the cavity with the compound:
  • Realize a physical vapor deposition of a metal film on walls of the cavity,
and the filling step being carried out by galvanic growth of the compound on the metal film.

Dans un mode de réalisation non limitatif, le procédé selon le premier ou le deuxième mode de réalisation comporte l'étape suivante :

  • Insérer un minéral, par exemple un diamant, dans la cavité par l'intermédiaire d'un rail débouchant dans la cavité, le minéral étant alors retenu dans la cavité au niveau des bras d'ancrage.
In a non-limiting embodiment, the method according to the first or second embodiment comprises the following step:
  • Insert a mineral, for example a diamond, into the cavity via a rail opening into the cavity, the mineral being then retained in the cavity at the anchor arms.

Dans un mode de réalisation non limitatif, le procédé selon le premier ou le deuxième mode de réalisation comporte l'étape suivante, réalisée avant l'étape de dépôt de la couche isolante :

  • Usiner la surface supérieure du substrat sorte à créer une texture, par exemple un guillochis.
In a non-limiting embodiment, the method according to the first or second embodiment comprises the following step, performed before the step of depositing the insulating layer:
  • Machine the upper surface of the substrate so as to create a texture, for example a guilloche.

Dans un mode de réalisation non limitatif, le procédé selon le premier ou le deuxième mode de réalisation comporte l'étape suivante, réalisée après l'étape de dépôt de la couche métallique :

  • Usiner la couche métallique de sorte à réduire au moins une de ses dimensions et/ou structurer au moins une de ses surfaces.
In a non-limiting embodiment, the method according to the first or second embodiment comprises the following step, performed after the step of depositing the metal layer:
  • Machining the metal layer so as to reduce at least one of its dimensions and / or structure at least one of its surfaces.

Dans un mode de réalisation non limitatif du procédé selon le premier ou le deuxième mode de réalisation, le matériau de base est un métal ou un alliage métallique amorphe ou partiellement amorphe ou un polymère, l'étape de recouvrement étant réalisée par pressage d'un bloc de matériau de base sur l'ensemble comprenant le substrat et la couche métallique.In a non-limiting embodiment of the method according to the first or second embodiment, the base material is an amorphous or partially amorphous metal or metal alloy or a polymer, the covering step being carried out by pressing a block of base material on the assembly comprising the substrate and the metal layer.

Dans un mode de réalisation non limitatif du procédé selon le premier ou le deuxième mode de réalisation, le matériau de base est métallique, l'étape de recouvrement étant réalisée par croissance galvanique du matériau de base sur l'ensemble comprenant le substrat et la couche métallique.In a non-limiting embodiment of the method according to the first or second embodiment, the base material is metallic, the covering step being performed by galvanic growth of the base material on the assembly comprising the substrate and the layer. metallic.

Dans un mode de réalisation non limitatif du procédé selon le premier ou le deuxième mode de réalisation, la couche métallique est constituée d'or, d'argent, de nickel ou d'un alliage des métaux précités.In a non-limiting embodiment of the method according to the first or second embodiment, the metal layer is made of gold, silver, nickel or an alloy of the aforementioned metals.

Dans un mode de réalisation non limitatif du procédé selon le premier ou le deuxième mode de réalisation, la couche isolante est constituée de résine.In a non-limiting embodiment of the method according to the first or second embodiment, the insulating layer is made of resin.

Description sommaire des dessinsBrief description of the drawings

D'autres particularités et avantages ressortiront clairement de la description qui en est faite ci-après, à titre indicatif et nullement limitatif, en référence aux dessins annexés, dans lesquels :

  • les figures 1a à 1g sont des représentations schématiques d'étapes du procédé de fabrication d'une pièce dotée d'un élément d'habillage, selon un premier mode de réalisation de l'invention
  • les figures 2a à 2f sont des représentations schématiques d'étapes du procédé de fabrication d'une pièce dotée d'un élément d'habillage selon un deuxième mode de réalisation de l'invention
  • les figures 3a à 3c sont des représentations schématiques d'étapes additionnelles du procédé selon le premier ou le deuxième mode de réalisation.
Other particularities and advantages will emerge clearly from the description which is given hereinafter, by way of indication and in no way limiting, with reference to the appended drawings, in which:
  • the Figures 1a to 1g are schematic representations of steps of the method of manufacturing a part provided with a covering element, according to a first embodiment of the invention
  • the Figures 2a to 2f are schematic representations of steps of the method of manufacturing a part provided with a covering element according to a second embodiment of the invention
  • the Figures 3a to 3c are schematic representations of additional steps of the method according to the first or second embodiment.

Description détaillée des modes de réalisation préférésDetailed Description of the Preferred Embodiments

Selon un premier mode de réalisation illustré aux figures 1a à 1g, le procédé selon l'invention comporte les étapes suivantes.According to a first embodiment illustrated in Figures 1a to 1g the method according to the invention comprises the following steps.

Selon une étape Md_Sub, montrée à la figure 1a, on se munit d'un substrat SB électriquement conducteur, aussi appelé master dans le milieu du moulage. Le substrat SB est avantageusement constitué de laiton, mais peut être constitué d'un autre matériau, par exemple de l'inox, de l'aluminium, du nickel, d'un composite cermet, d'une céramique ou d'un polymère rendu conducteur (par dépôt électrolytique ou traitement plasma par exemple), etc. De plus, le substrat SB comporte un motif MT formant un relief, ou saillie, à partir d'une surface supérieure SP du substrat SB. Dans un mode de réalisation, le motif MT a été obtenu par usinage du substrat SB. Dans un autre mode de réalisation, le motif n'a pas été obtenu par usinage mais par injection, ou par pressage à chaud d'un alliage métallique partiellement ou totalement amorphe, à base de zirconium ou de platine, par exemple.According to a step Md_Sub, shown at figure 1a , it is equipped with a SB electrically conductive substrate, also called master in the middle of the molding. The substrate SB is advantageously made of brass, but may be made of another material, for example stainless steel, aluminum, nickel, a cermet composite, a ceramic or a polymer rendered conductor (electrolytic deposition or plasma treatment for example), etc. In addition, the substrate SB comprises an MT pattern forming a relief, or projection, from an upper surface SP of the substrate SB. In one embodiment, the MT pattern was obtained by machining the SB substrate. In another embodiment, the pattern was not obtained by machining but by injection, or by hot pressing of a partially or totally amorphous metal alloy, based on zirconium or platinum, for example.

Dans l'exemple de la figure 1a, le motif MT présente un sommet ST plat s'étendant parallèlement à la surface supérieure SP et des flancs FC s'étendant sensiblement orthogonalement au sommet ST. Cette forme n'est pas limitative ; les flancs FC pourraient être inclinés par rapport à la surface supérieure SP selon un angle α inférieur à 90°, le sommet ST pourrait ne pas être tout à fait parallèle à la surface supérieure SP, etc. On note que la surface supérieure SP et le sommet ST ont éventuellement subi un usinage de surface pour créer une texture particulière que l'on souhaite donner à la pièce, par exemple un guillochis, comme on le voit sur la figure 1a.In the example of the figure 1a , the MT pattern has a flat top ST extending parallel to the upper surface SP and FC sides extending substantially orthogonally at the top ST. This form is not limiting; the FC sidewalls could be inclined with respect to the upper surface SP at an angle α less than 90 °, the crown ST might not be quite parallel to the upper surface SP, etc. We note that the SP upper surface and the top ST have optionally undergone a surface machining to create a particular texture that is desired to give the piece, for example a guilloche, as seen on the figure 1a .

Selon une étape Md_Cis, montrée à la figure 1b, on dépose une couche isolante CI, avantageusement une résine, sur la surface supérieure SP, sur une épaisseur E inférieure ou égale à la hauteur H du motif MT. L'étape de dépôt Md_Cis est par exemple réalisée par étuvage d'une résine sous forme visqueuse déposée autour du motif MT. En pratique, si la couche isolante CI est déposée sur une épaisseur E amenant la couche isolante CI au-delà du sommet ST du motif MT, l'excès est retiré par surfaçage. Eventuellement, ce surfaçage permet aussi de créer ou recréer une texture au niveau du sommet ST.According to a step Md_Cis, shown in the figure 1b , an insulating layer CI, advantageously a resin, is deposited on the upper surface SP, on a thickness E less than or equal to the height H of the pattern MT. The deposition step Md_Cis is for example made by steaming a resin in viscous form deposited around the MT pattern. In practice, if the insulating layer CI is deposited on a thickness E bringing the insulating layer CI beyond the peak ST of the MT pattern, the excess is removed by surfacing. Optionally, this surfacing also makes it possible to create or recreate a texture at the level of the summit ST.

Selon une étape Md_Cga, montrée à la figure 1c, on dépose une couche métallique CM sur le sommet ST (électriquement conducteur) du motif MT par croissance galvanique. Le substrat SB surmonté de la couche isolante CI est ainsi plongé dans un bain galvanique adapté à la déposition d'un métal tel que l'or, l'argent, le nickel, ou tout autre métal ou alliage métallique pouvant se déposer en couche relativement épaisse. Etant donné la configuration de la couche isolante CI sur le substrat SB, le dépôt métallique croit non seulement orthogonalement au sommet ST, mais également latéralement, c'est-à-dire en direction de la couche isolante CI. A l'issue de l'étape Md_Cga, la couche métallique CM comporte donc des extrémités latérales EL qui reposent sur la couche isolante CI.According to a step Md_Cga, shown at figure 1c depositing a metal layer CM on the top ST (electrically conductive) of the MT pattern by galvanic growth. The SB substrate surmounted by the insulating layer CI is thus immersed in a galvanic bath suitable for the deposition of a metal such as gold, silver, nickel, or any other metal or metal alloy that can be deposited in a relatively thick. Given the configuration of the insulating layer CI on the substrate SB, the metal deposit increases not only orthogonally at the top ST, but also laterally, that is to say in the direction of the insulating layer CI. At the end of the step Md_Cga, the metal layer CM therefore has lateral ends EL which rest on the insulating layer CI.

Selon une étape optionnelle, on usine la couche métallique CM pour réduire son épaisseur P et/ou structurer ou polir sa surface.According to an optional step, the metal layer CM is machined to reduce its thickness P and / or to structure or polish its surface.

Selon une étape Md_Dis, montrée à la figure 1d, on dissout la couche isolante CI. Il ne reste alors plus qu'un ensemble ES formé du substrat SB et de la couche métallique CM.According to a step Md_Dis, shown at the figure 1d the insulating layer CI is dissolved. There then remains only a set ES formed of the SB substrate and the CM metal layer.

Selon une étape optionnelle, on réalise un traitement de surface de cet ensemble ES. Ce traitement est par exemple l'application d'un agent de démoulage ou un traitement de passivation. L'intérêt de cette étape apparaît dans la suite du texte.According to an optional step, a surface treatment of this set ES is carried out. This treatment is for example the application of an agent of demolding or a passivation treatment. The interest of this step appears in the rest of the text.

Selon une étape Md_Enr, montrée à la figure 1e, on recouvre cet ensemble ES par un volume VL d'un matériau de base de la pièce à fabriquer, de sorte que le volume VL forme une empreinte de l'ensemble ES. Dans un mode de réalisation, le matériau de base est du métal amorphe ou partiellement amorphe, intéressant pour ses propriétés mécaniques. Dans un autre mode de réalisation, le matériau de base est un polymère. Dans ces deux cas, un bloc de métal ou d'alliage métallique amorphe ou partiellement amorphe, ou de polymère, est pressé sur l'ensemble ES à une température à laquelle il a une consistance pâteuse, ce qui lui permet de se déformer pour épouser les formes de l'ensemble ES, et notamment les formes des extrémités latérales EL de la couche métallique CM. Dans un autre mode de réalisation, le matériau de base est tout autre métal ou alliage métallique, par exemple du nickel, de l'or, etc., et le recouvrement est réalisé par croissance galvanique dudit métal. On remarque qu'à l'issue de l'étape Md_Enr, la couche métallique CM est solidarisée avec le volume VL de matériau de base, car ses extrémités latérales EL forment des crochets scellés dans le volume VL de matériau de base.According to a step Md_Enr, shown in the figure 1e , this ES assembly is covered by a volume VL of a base material of the part to be manufactured, so that the volume VL forms an imprint of the assembly ES. In one embodiment, the base material is amorphous or partially amorphous metal, interesting for its mechanical properties. In another embodiment, the base material is a polymer. In both cases, an amorphous or partially amorphous metal or metal block or polymer block is pressed onto the ES assembly at a temperature at which it has a pasty consistency, which allows it to deform to fit the shapes of the assembly ES, and in particular the shapes of the lateral ends EL of the metal layer CM. In another embodiment, the base material is any other metal or metal alloy, for example nickel, gold, etc., and the coating is made by galvanic growth of said metal. Note that at the end of the Md_Enr step, the metal layer CM is secured to the volume VL of the base material, because its lateral ends EL form hooks sealed in the volume VL of base material.

Selon une étape Md_Dem, montrée à la figure 1f, on sépare le volume VL de matériau de base et la couche métallique CM du substrat SB. Pour ce faire, le substrat SB est par exemple plongé dans un bain acide sélectif au sein duquel il est dissout. Alternativement, la séparation est réalisée par démoulage en force. Avoir préalablement réalisé un traitement de surface de l'ensemble ES permet alors de faciliter le démoulage.According to a step Md_Dem, shown in the figure 1f the volume VL of the base material and the metal layer CM are separated from the substrate SB. To do this, the SB substrate is for example immersed in a selective acid bath in which it is dissolved. Alternatively, the separation is carried out by force demolding. Having previously carried out a surface treatment of the ES assembly then makes it easier to demold.

A l'issue de l'étape Md_Dem, le volume VL de matériau de base présente un évidement EV de forme correspondant à l'empreinte du motif MT du substrat SB, dont le fond FD est de la couleur de la couche métallique CM. On note que la transition entre le volume VL de matériau de base et la couche métallique CM est nette. Par ailleurs, par effet d'empreintes, le volume VL présente un aspect texturé : le fond FD de l'évidemment EV présente un aspect miroir similaire à celui du sommet ST du substrat SB, et la surface SF du volume VL qui était précédemment en vis-à-vis de la surface supérieure SP du substrat SB présente un aspect miroir similaire à celui de ladite surface supérieure SP.At the end of the step Md_Dem, the volume VL of the base material has a recess EV of shape corresponding to the imprint of the pattern MT of the substrate SB, whose bottom FD is the color of the metal layer CM. It is noted that the transition between the volume VL of base material and the CM metal layer is clear. Moreover, by impression effect, the volume VL has a textured appearance: the bottom FD of the EV recess has a mirror appearance similar to that of the top ST of the substrate SB, and the surface SF of the volume VL which was previously vis-à-vis the upper surface SP of the substrate SB has a mirror appearance similar to that of said upper surface SP.

On note que la figure 1f montre le substrat SB et la couche métallique CM tels qu'ils sont lorsqu'à l'étape Md_Cis la couche isolante CI est déposée sur une épaisseur E sensiblement égale à la hauteur H du motif MT. Les extrémités latérales EL de la couche métallique CM s'étendent alors parallèlement au fond FD de l'évidement EV. Au contraire, la figure 1g montre le volume VL et la couche métallique CM tels qu'ils sont lorsqu'à l'étape Md_Cis la couche isolante CI est déposée sur une épaisseur E inférieure à la hauteur H du motif MT. Les extrémités latérales EL de la couche métallique CM s'étendent alors sur une portion des parois latérales PL de l'évidement EV.We note that the figure 1f shows the substrate SB and the metal layer CM as they are when in step Md_Cis the insulating layer CI is deposited on a thickness E substantially equal to the height H of the MT pattern. The lateral ends EL of the metal layer CM then extend parallel to the bottom FD of the recess EV. On the contrary, figure 1g shows the volume VL and the metal layer CM as they are when in step Md_Cis the insulating layer CI is deposited on a thickness E less than the height H of the MT pattern. The lateral ends EL of the metal layer CM then extend over a portion of the side walls PL of the recess EV.

Le premier mode de réalisation permet donc de fabriquer une pièce PC dotée d'un élément d'habillage enclavé. Cet élément d'habillage est constitué d'un évidemment EV présentant un fond FD de la couleur de la couche métallique CM, par exemple doré ou argenté. De plus, l'interface entre le volume VL et la couche métallique CM est nette, sans bavures. En outre, la couche métallique CM est inséparable du reste de la pièce. Enfin, la surface SF de la pièce PC et le fond FD de l'évidemment EV sont texturés.The first embodiment thus makes it possible to manufacture a PC part equipped with an enclosed cladding element. This covering element consists of an obvious EV having a bottom FD of the color of the metal layer CM, for example gold or silver. In addition, the interface between the volume VL and the metal layer CM is clear, without burrs. In addition, the CM metal layer is inseparable from the rest of the room. Finally, the SF surface of the PC part and the FD bottom of the EV obviously are textured.

Selon un deuxième mode de réalisation illustré aux figures 2a à 2f, le procédé selon l'invention comporte les étapes suivantes.According to a second embodiment illustrated in Figures 2a to 2f the method according to the invention comprises the following steps.

Selon une étape, on se munit d'un substrat SB' conducteur. Le substrat SB' est avantageusement constitué de laiton, mais peut être constitué d'un autre matériau, par exemple de l'inox, de l'aluminium, du nickel, etc. La surface supérieure SP' du substrat SB' a éventuellement subi un usinage de surface pour créer une texture particulière que l'on souhaite donner à la pièce, par exemple un guillochis, comme on le voit sur la figure 2a.In one step, a conductive substrate SB 'is provided. The substrate SB 'is advantageously made of brass, but may be made of another material, for example stainless steel, aluminum, nickel, etc. The upper surface SP 'of the substrate SB' has optionally undergone a surface machining to create a particular texture that is desired give the piece, for example a guilloche, as we see on the figure 2a .

Selon une étape Md'_Cis, montrée à la figure 2a, on dépose une couche isolante CI' d'épaisseur E', avantageusement une résine, sur la surface supérieure SP' du substrat SB'. L'étape de dépôt Md'_Cis est par exemple réalisée par étuvage d'une résine sous forme visqueuse déposée sur la surface supérieure SP'.According to a step Md'_Cis, shown in the figure 2a an insulating layer CI 'of thickness E', advantageously a resin, is deposited on the upper surface SP 'of the substrate SB'. The deposition step Md'_ cis is for example carried out by steaming a resin in viscous form deposited on the upper surface SP '.

Selon une étape Md'_Uge, montrée à la figure 2b, on usine la couche isolante CI' et le substrat SB', de sorte à réaliser un motif MT' creux s'étendant au travers de la couche isolante CI' et sur une portion du substrat SB' d'épaisseur G. Dans l'exemple de la figure 2b, le motif MT' présente un fond ST' plat s'étendant parallèlement à la surface supérieure SP' du substrat SB', et des flancs FC' s'étendant sensiblement orthogonalement audit fond ST', mais cette forme n'est pas limitative. Les flancs FC' pourraient être inclinés par rapport à la surface supérieure SP' selon un angle α' inférieur à 90°, le fond ST' pourrait ne pas être tout à fait parallèle à la surface supérieure SP', etc.According to a step Md'_Uge, shown at the figure 2b , the insulating layer CI 'and the substrate SB' are machined, so as to produce a hollow MT 'pattern extending through the insulating layer CI' and on a portion of the substrate SB 'of thickness G. In the example of the figure 2b , the pattern MT 'has a flat bottom ST' extending parallel to the upper surface SP 'of the substrate SB', and flanks FC 'extending substantially orthogonal to said bottom ST', but this form is not limiting. The flanks FC 'could be inclined with respect to the upper surface SP' at an angle α 'of less than 90 °, the bottom ST' might not be entirely parallel to the upper surface SP ', etc.

Selon une étape Md'_Cga, montrée à la figure 2c, on dépose une couche métallique CM' dans le motif MT' par croissance galvanique. Le substrat SB' surmonté de la couche isolante CI' est ainsi plongé dans un bain galvanique adapté à la déposition d'un métal tel que l'or, l'argent, le nickel, ou tout autre métal ou alliage métallique pouvant se déposer en couche relativement épaisse. Lorsque le motif MT' est complètement rempli de dépôt métallique, le dépôt métallique croit non seulement orthogonalement au fond ST' du motif MT', mais également latéralement de sorte à se déposer sur la couche isolante CI'. A la fin de l'étape Md'_Cga, la couche métallique CM' comporte donc des extrémités latérales EL' qui reposent sur la couche isolante CI'.According to a step Md'_Cga, shown at Figure 2c a metal layer CM 'is deposited in the pattern MT' by galvanic growth. The substrate SB 'surmounted by the insulating layer CI' is thus immersed in a galvanic bath suitable for the deposition of a metal such as gold, silver, nickel, or any other metal or metal alloy that can be deposited in relatively thick layer. When the pattern MT 'is completely filled with metallic deposit, the metal deposit not only increases orthogonally to the bottom ST' of the pattern MT ', but also laterally so as to be deposited on the insulating layer CI'. At the end of the step Md'_Cga, the metal layer CM 'therefore has lateral ends EL' which rest on the insulating layer CI '.

Selon une étape optionnelle, on usine la couche métallique CM' pour réduire l'épaisseur P' des extrémités latérales EL' et/ou structurer ou polir la surface de la couche métallique CM'.According to an optional step, the metal layer CM 'is machined to reduce the thickness P' of the lateral ends EL 'and / or to structure or polish the surface of the metal layer CM'.

Selon une étape Md'_Dis, montrée à la figure 2d, on dissout la couche isolante CI'. Il ne reste alors plus qu'un ensemble ES' formé du substrat SB' et de la couche métallique CM'.According to a step Md'_Dis, shown at the figure 2d the insulating layer CI 'is dissolved. There then remains only a set ES 'formed of the substrate SB' and the metal layer CM '.

Selon une étape optionnelle, on réalise un traitement de surface de cet ensemble ES'. Ce traitement est par exemple l'application d'une huile ou une passivation. L'intérêt de cette étape apparaît dans la suite du texte.According to an optional step, a surface treatment of this set ES 'is carried out. This treatment is for example the application of an oil or a passivation. The interest of this step appears in the rest of the text.

Selon une étape Md'_Enr, montrée à la figure 2e, on recouvre cet ensemble ES' par un volume VL' d'un matériau de base de la pièce à fabriquer, de sorte que le volume VL forme une empreinte de l'ensemble ES. Dans un mode de réalisation, le matériau de base est du métal ou un alliage métallique amorphe ou partiellement amorphe. Dans un autre mode de réalisation, le matériau de base est un polymère. Dans ces deux cas, un bloc de métal amorphe ou partiellement amorphe ou de polymère est pressé sur l'ensemble ES' à une température à laquelle il a une consistance pâteuse, ce qui lui permet de se déformer pour épouser les formes de l'ensemble ES', et notamment les formes des extrémités latérales EL' de la couche métallique CM'. Dans un autre mode de réalisation, le matériau de base est tout autre métal, par exemple du nickel, de l'or, etc., et le recouvrement est réalisé par croissance galvanique dudit métal. On remarque qu'à l'issue de l'étape Md'_Enr, la couche métallique CM' est solidarisée avec le volume VL' de matériau de base, car ses extrémités latérales EL' forment des crochets scellés dans le volume VL' de matériau de base.According to a step Md'Enr, shown at the figure 2e this set ES 'is covered by a volume VL' of a base material of the part to be manufactured, so that the volume VL forms an imprint of the assembly ES. In one embodiment, the base material is an amorphous or partially amorphous metal or metal alloy. In another embodiment, the base material is a polymer. In both cases, a block of amorphous or partially amorphous metal or polymer is pressed on the assembly ES 'at a temperature at which it has a pasty consistency, which allows it to deform to fit the shapes of the set ES ', and in particular the shapes of the lateral ends EL' of the metal layer CM '. In another embodiment, the base material is any other metal, for example nickel, gold, etc., and the coating is made by galvanic growth of said metal. Note that at the end of the step Md'_En, the metal layer CM 'is secured to the volume VL' of base material, because its lateral ends EL 'form hooks sealed in the volume VL' of material basic.

Selon une étape Md'_Dem, montrée à la figure 2f, on sépare du substrat SB' le volume VL' de matériau de base et la couche métallique CM'. Pour ce faire, le substrat SB' est par exemple plongé dans un bain acide sélectif au sein duquel il est dissout. Alternativement, la séparation est réalisée par démoulage en force. Avoir préalablement réalisé un traitement de surface de l'ensemble ES' permet alors de faciliter le démoulage.According to a step Md'_Dem, shown at the figure 2f the volume VL 'of base material and the metal layer CM' are separated from the substrate SB '. To do this, the SB 'substrate is for example immersed in a selective acid bath in which it is dissolved. Alternatively, the separation is carried out by demoulding in force. Having previously carried out a surface treatment of the assembly ES 'then makes it easier to demold.

A l'issue de l'étape Md'_Dem, la couche métallique CM' forme une excroissance EV' sur le volume VL' de forme correspondant à l'empreinte du motif MT' dans le substrat SB'. On note que la transition entre le volume VL' de matériau de base et la couche métallique CM' est nette. Par ailleurs, par effet d'empreintes, le volume VL' présente un aspect texturé : la surface SF' du volume VL' qui était précédemment en vis-à-vis de la surface supérieure SP' du substrat SB' présente un aspect miroir similaire à celui de ladite surface supérieure SP'.At the end of the step Md'_Dem, the metal layer CM 'forms a protrusion EV' on the volume VL 'of shape corresponding to the imprint of the pattern MT' in the substrate SB '. It is noted that the transition between the volume VL 'of base material and the metal layer CM' is clear. Moreover, by impression effect, the volume VL 'has a textured appearance: the surface SF' of the volume VL 'which was previously vis-a-vis the upper surface SP' of the substrate SB 'has a similar mirror appearance to that of said upper surface SP '.

Le deuxième mode de réalisation permet donc de fabriquer une pièce PC' dotée d'un élément d'habillage en relief. Cet élément d'habillage est constitué d'une excroissance EV' formée par la couche métallique CM'. De plus, l'interface entre le volume VL' et la couche métallique CM' est nette, sans bavure. En outre, la couche métallique CM' est inséparable du reste de la pièce. Enfin, la surface SF' de la pièce PC peut être texturée.The second embodiment thus makes it possible to manufacture a piece PC 'provided with a relief dressing element. This covering element consists of a protrusion EV 'formed by the metal layer CM'. In addition, the interface between the volume VL 'and the metal layer CM' is clear, without burrs. In addition, the metal layer CM 'is inseparable from the rest of the room. Finally, the surface SF 'of the piece PC can be textured.

Par ailleurs, le procédé selon le premier ou le deuxième mode de réalisation comporte éventuellement les étapes additionnelles suivantes, permettant de modifier l'aspect de l'élément d'habillage.Moreover, the method according to the first or the second embodiment optionally comprises the following additional steps, making it possible to modify the appearance of the covering element.

Selon une étape Md_Ddr optionnelle montrée à la figure 3a, on dissout chimiquement la couche métallique CM, CM'. Le volume VL, VL' présente alors une cavité CV comportant des bras d'ancrage BA formés par empreinte des extrémités latérale EL, EL' de la couche métallique CM, CM'. La géométrie de la cavité CV dépend de plusieurs paramètres :

  • La largeur L, L' du motif MT, MT', montrée aux figures 1 a et 2b
  • La hauteur H, E'+G du motif MT, MT', montrée aux figures 1b et 2b
  • L'inclinaison α, α' des flancs FC, FC' du motif MT, MT', montrée aux figures 1a et 2b
  • La largeur G, G' des extrémités latérales EL, EL' de la couche métallique CM, CM', montrée aux figures 1c et 2c
  • L'épaisseur P, P' desdites extrémités latérales EL, EL' de la couche métallique CM, CM' (qui est égale à leur largeur G, G' à moins que la couche métallique CM, CM' n'ait été usinée), montrée aux figures 1c et 2c
  • L'épaisseur E, E' de couche isolante CI, CI' déposée à l'étape Md_Cis ou Md'_Cis, montrée aux figures 1b et 2b.
According to an optional Md_Ddr step shown in FIG. figure 3a the metal layer CM, CM 'is chemically dissolved. The volume VL, VL 'then has a cavity CV comprising BA anchoring arms formed by imprinting the lateral ends EL, EL' of the metal layer CM, CM '. The geometry of the cavity CV depends on several parameters:
  • The width L, L 'of the MT, MT' pattern, shown in FIGS. figures 1 a and 2b
  • The height H, E '+ G of the MT, MT' pattern, shown in FIGS. figures 1b and 2b
  • The inclination α, α 'of the sides FC, FC' of the pattern MT, MT ', shown in FIGS. figures 1a and 2b
  • The width G, G 'of the lateral ends EL, EL' of the metal layer CM, CM ', shown in FIGS. figures 1c and 2c
  • The thickness P, P 'of said lateral ends EL, EL' of the metal layer CM, CM '(which is equal to their width G, G' unless the metal layer CM, CM 'has been machined), shown to figures 1c and 2c
  • The thickness E, E 'of insulating layer CI, CI' deposited in step Md_Cis or Md'_Cis, shown in FIGS. figures 1b and 2b .

Les bras d'ancrage BA sont avantageusement utilisés pour retenir un élément, tel qu'une résine colorée, une laque fluorescente, un métal, un minéral, etc.The anchor arms BA are advantageously used to retain an element, such as a colored resin, a fluorescent lacquer, a metal, a mineral, etc.

Ainsi, dans un mode de réalisation, le procédé comporte une étape Md_Rsl, montrée à la figure 3b, de remplissage partiel ou total de la cavité CV par de la résine ou de la laque RL, éventuellement colorée ou fluorescente. La résine ou la laque RL est par exemple insérée sous forme pâteuse, puis étuvée pour être solidifiée. Grâce aux bras d'ancrage BA, il est alors impossible de désolidariser la résine ou la laque RL du volume VL, VL'.Thus, in one embodiment, the method comprises a step Md_Rs1, shown in FIG. figure 3b , partial or total filling of the cavity CV with resin or lacquer RL, optionally colored or fluorescent. The resin or lacquer RL is for example inserted in pasty form, then steamed to be solidified. Thanks to the BA anchor arms, it is then impossible to separate the resin or lacquer RL volume VL, VL '.

Dans un mode de réalisation alternatif, le procédé comporte une étape d'insertion d'un métal, d'un alliage métallique ou d'un composite dans la cavité CV. Le métal est par exemple inséré sous forme liquide, puis refroidi pour être solidifié. Grâce aux bras d'ancrage, il est alors impossible de désolidariser le métal du volume VL, VL'. Le métal peut alternativement être déposé par croissance galvanique. Dans ce cas, si le matériau de base constituant le volume VL, VL' n'est pas métallique, il est nécessaire de réaliser préalablement une étape de dépôt physique par phase vapeur d'au moins un film mince métallique dans la cavité CV.In an alternative embodiment, the method comprises a step of inserting a metal, a metal alloy or a composite into the cavity CV. The metal is for example inserted in liquid form and then cooled to solidify. Thanks to the anchoring arms, it is impossible to separate the metal from the volume VL, VL '. The metal can alternatively be deposited by galvanic growth. In this case, if the base material constituting the volume VL, VL 'is not metallic, it is necessary to carry out beforehand a step of physical vapor deposition of at least one metal thin film in the cavity CV.

Dans un mode de réalisation alternatif, le procédé comporte une étape Md_Min, montrée à la figure 3c, de sertissage d'un minéral MN, par exemple un diamant, dans la cavité. Le minéral MN comporte alors une base surmontée d'encoches EC, lesdites encoches EC coopérant avec un rail menant à la cavité CV. Lorsque le minéral MN est dans la cavité CV, il y est retenu par les bras d'ancrage BA. On note que dans ce cas, il est avantageux que les parois latérales PL de la cavité CV forment un angle vif avec les bras d'ancrage BA, comme cela est visible à la figure 3c, afin que les parois latérales PL s'emboîtent dans les encoches EC. Cela correspond à un motif MT, MT' dont les flancs FC, FC' présentent un angle d'inclinaison α, α' faible.In an alternative embodiment, the method comprises a step Md_Min, shown in FIG. figure 3c crimping a mineral MN, for example a diamond, in the cavity. The mineral MN then has a base surmounted by EC notches, said EC notches cooperating with a rail leading to the cavity CV. When the mineral MN is in the cavity CV, it is retained by the anchoring arms BA. Note that in this case, it is advantageous that the side walls PL of the cavity CV form a sharp angle with the anchoring arms BA, as can be seen in FIG. figure 3c , so that the side walls PL fit into the notches EC. This corresponds to a pattern MT, MT 'whose sides FC, FC' have an angle of inclination α, α 'low.

Bien entendu, la présente invention ne se limite pas à l'exemple illustré mais est susceptible de diverses variantes et modifications qui apparaîtront à l'homme de l'art.Of course, the present invention is not limited to the illustrated example but is susceptible of various variations and modifications that will occur to those skilled in the art.

Claims (13)

Procédé de fabrication d'une pièce (PC) dotée d'un élément d'habillage, le procédé comprenant les étapes suivantes : - Se munir (Md_Sub) d'un substrat (SB) électriquement conducteur comprenant une surface supérieure (SP) et un motif (MT) en relief sur ladite surface supérieure (SP), le motif (MT) comportant un sommet (ST) - Déposer (Md_Cis) une couche électriquement isolante (CI) sur la surface supérieure (SP) du substrat (SB), autour du motif (MT), sur une épaisseur (E) inférieure ou égale à la distance (H) entre le sommet (ST) et la surface supérieure (SP) - Déposer (Md_Cga) une couche métallique (CM) sur le sommet (ST) du motif (MT) par croissance galvanique, de sorte qu'à l'issue de cette étape, la couche métallique (MT) repose en partie sur la couche isolante (CI) - Dissoudre (Md_Dis) la couche isolante (CI) - Recouvrir (Md_Enr) un ensemble (ES) comprenant le substrat (SB) et la couche métallique (CM), par un volume (VL) d'un matériau de base de la pièce (PC), le volume (VL) formant une empreinte de l'ensemble (ES) - Séparer (Md_Dem) le volume (VL) et la couche métallique (CM), du substrat (SB), le volume (VL) présentant alors un élément d'habillage constitué par un évidemment (EV) dont la forme correspond à l'empreinte du motif (MT) et dont le fond (FD) s'interface avec la couche métallique (CM). A method of manufacturing a workpiece (PC) having a cladding element, the method comprising the steps of: - Providing (Md_Sub) an electrically conductive substrate (SB) comprising an upper surface (SP) and a pattern (MT) in relief on said upper surface (SP), the pattern (MT) having a vertex (ST) - Depositing (Md_Cis) an electrically insulating layer (CI) on the upper surface (SP) of the substrate (SB), around the pattern (MT), on a thickness (E) less than or equal to the distance (H) between the vertex (ST) and the upper surface (SP) - Deposit (Md_Cga) a metal layer (CM) on the top (ST) of the pattern (MT) by galvanic growth, so that at the end of this step, the metal layer (MT) rests in part on the layer insulating (IC) - Dissolve (Md_Dis) the insulating layer (IC) - Cover (Md_Enr) an assembly (ES) comprising the substrate (SB) and the metal layer (CM), by a volume (VL) of a base material of the workpiece (PC), the volume (VL) forming a impression of the set (ES) - Separating (Md_Dem) the volume (VL) and the metal layer (CM) from the substrate (SB), the volume (VL) then having a covering element constituted by an obviously (EV) whose shape corresponds to the pattern imprint (MT) and whose bottom (FD) interfaces with the metal layer (CM). Procédé de fabrication selon la revendication précédente, comportant l'étape suivante : - Usiner le sommet (ST) du motif (MT) de sorte à créer une texture, par exemple un guillochis. Manufacturing method according to the preceding claim, comprising the following step: - Machine the top (ST) of the pattern (MT) so as to create a texture, for example a guilloche. Procédé de fabrication d'une pièce (PC') dotée d'un élément d'habillage, comportant les étapes suivantes : - Se munir d'un substrat (SB') électriquement conducteur comprenant une surface supérieure (SP') - Déposer (Md'_Cis) une couche électriquement isolante (CI') sur la surface supérieure (SP') du substrat (SB') - Usiner (Md'_Uge) la couche isolante (CI') et le substrat (SB'), de sorte à réaliser un motif (MT') creux traversant la couche isolante (CI') et s'étendant sur une portion du substrat (SB') - Déposer (Md'_Cga) une couche métallique (CM') dans le motif (MT') par croissance galvanique, de sorte qu'à l'issue de cette étape, la couche métallique (CM') repose en partie sur la couche isolante (CI') - Dissoudre (Md'_Dis) la couche isolante (CI') - Recouvrir (Md'_Enr) un ensemble (ES') comprenant le substrat (SB') et la couche métallique (CM'), par un volume (VL') d'un matériau de base de la pièce (PC'), le volume (VL') formant une empreinte de l'ensemble (ES') - Séparer (Md'_Enr) le volume (VL') et la couche métallique (CM'), du substrat (SB'), la couche métallique (CM') formant alors sur le volume (VL') une excroissance (EV') constituant un élément d'habillage, la forme de l'excroissance (EV') correspondant à l'empreinte du motif (MT'). A method of manufacturing a workpiece (PC ') having a cladding element, comprising the steps of: - To provide an electrically conductive substrate (SB ') comprising an upper surface (SP') - Deposit (Md'_Cis) an electrically insulating layer (CI ') on the upper surface (SP') of the substrate (SB ') - Machining (Md'_Uge) the insulating layer (CI ') and the substrate (SB'), so as to achieve a pattern (MT ') hollow through the insulating layer (CI') and extending over a portion of the substrate (SB ') - Deposit (Md'_Cga) a metal layer (CM ') in the pattern (MT') by galvanic growth, so that at the end of this step, the metal layer (CM ') rests in part on the layer insulating (CI ') - Dissolve (Md'_Dis) the insulating layer (CI ') - Cover (Md'_Enr) a set (ES ') comprising the substrate (SB') and the metal layer (CM '), by a volume (VL') of a base material of the piece (PC '), the volume (VL ') forming an imprint of the set (ES') - Separating (Md'Enr) the volume (VL ') and the metal layer (CM'), the substrate (SB '), the metal layer (CM') then forming on the volume (VL ') an outgrowth (EV' ) constituting a covering element, the shape of the protuberance (EV ') corresponding to the imprint of the pattern (MT'). Procédé de fabrication selon l'une des revendications précédentes, comportant l'étape suivante : - Dissoudre (Md_Ddr) la couche métallique (CM, CM'), le volume (VL, VL') présentant alors une cavité (CV) comprenant des bras d'ancrage (BA) formés par empreinte de la couche métallique (CM, CM'). Manufacturing method according to one of the preceding claims, comprising the following step: - Dissolve (Md_Ddr) the metal layer (CM, CM '), the volume (VL, VL') then having a cavity (CV) comprising anchoring arms (BA) formed by imprinting the metal layer (CM, CM) '). Procédé de fabrication selon la revendication précédente, comportant l'étape suivante, suivant l'étape de dissolution (Md_Ddr) de la couche métallique (CM, CM') : - Remplir (Md_Rsl) la cavité d'un composé (RL), tel qu'une résine, une laque ou un métal. Manufacturing method according to the preceding claim, comprising the following step, following the dissolution step (Md_Ddr) of the metal layer (CM, CM '): - Fill (Md_Rsl) the cavity of a compound (RL), such as a resin, a lacquer or a metal. Procédé de fabrication selon la revendication précédente, le matériau de base du volume (VL, VL') n'étant pas métallique, le composé (RL) étant métallique, le procédé comportant l'étape suivante, entre l'étape de dissolution (Md_Ddr) de la couche métallique (CM, CM') et l'étape de remplissage (Md_Rsl) de la cavité (CV) par le composé (RL) : - Réaliser un dépôt physique par phase vapeur d'un film métallique sur des parois de la cavité (CV), et l'étape de remplissage (Md_Rsl) étant réalisée par croissance galvanique du composé (RL) sur le film métallique.Manufacturing method according to the preceding claim, the base material of the volume (VL, VL ') not being metallic, the compound (RL) being metallic, the process comprising the following step, between the dissolution step (Md_Ddr ) of the metal layer (CM, CM ') and the filling step (Md_Rs1) of the cavity (CV) with the compound (RL): - Realize a physical vapor deposition of a metal film on the walls of the cavity (CV), and the filling step (Md_Rsl) being carried out by galvanic growth of the compound (RL) on the metal film. Procédé de fabrication selon la revendication 4, comportant l'étape suivante : - Insérer un minéral (MN), par exemple un diamant, dans la cavité (CV) par l'intermédiaire d'un rail débouchant dans la cavité (CV), le minéral (MN) étant alors retenu dans la cavité (CV) au niveau des bras d'ancrage (BA). Manufacturing method according to claim 4, comprising the following step: - Insert a mineral (MN), for example a diamond, in the cavity (CV) via a rail opening into the cavity (CV), the mineral (MN) then being retained in the cavity (CV) at level of the anchor arms (BA). Procédé de fabrication selon l'une des revendications précédentes, comportant l'étape suivante, réalisée avant l'étape de dépôt (Md_Cis, Md'_Cis) de la couche isolante (CI, CI') : - Usiner la surface supérieure du substrat (SB, SB') de sorte à créer une texture, par exemple un guillochis. Manufacturing method according to one of the preceding claims, comprising the following step, carried out before the deposition step (Md_Cis, Md__Cis) of the insulating layer (CI, CI '): - Machine the upper surface of the substrate (SB, SB ') so as to create a texture, for example a guilloche. Procédé de fabrication selon l'une des revendications précédentes, comportant l'étape suivante, réalisée après l'étape de dépôt (Md_Cga, Md'_Cga) de la couche métallique (CM, CM') : - Usiner la couche métallique (CM, CM') de sorte à réduire au moins une de ses dimensions (G, P, G', P') et/ou structurer au moins une de ses surfaces. Manufacturing method according to one of the preceding claims, comprising the following step, carried out after the step of depositing (Md_Cga, Md'_Cga) of the metal layer (CM, CM '): - Machining the metal layer (CM, CM ') so as to reduce at least one of its dimensions (G, P, G', P ') and / or structure at least one of its surfaces. Procédé de fabrication selon l'une des revendications précédentes, le matériau de base étant un métal ou un alliage métallique amorphe ou partiellement amorphe ou un polymère, l'étape de recouvrement (Md_Enr, Md'_Enr) étant réalisée par pressage d'un bloc de matériau de base sur l'ensemble (ES, ES') comprenant le substrat (SB, SB') et la couche métallique (CM, CM').Manufacturing method according to one of the preceding claims, the base material being an amorphous or partially amorphous metal or metal alloy or a polymer, the covering step (Md_Enr, Md'_Enr) being performed by pressing a block of base material on the assembly (ES, ES ') comprising the substrate (SB, SB') and the metal layer (CM, CM '). Procédé de fabrication selon l'une des revendications 1 à 9, le matériau de base étant métallique, l'étape de recouvrement (Md_Enr, Md'_Enr) étant réalisée par croissance galvanique du matériau de base sur l'ensemble (ES, ES') comprenant le substrat (SB, SB') et la couche métallique (CM, CM').Production method according to one of claims 1 to 9, the base material being metallic, the covering step (Md_Enr, Md'_Enr) being performed by galvanic growth of the base material on the assembly (ES, ES ' ) comprising the substrate (SB, SB ') and the metal layer (CM, CM'). Procédé de fabrication selon l'une des revendications précédentes, la couche métallique (CM, CM') étant constituée d'or, d'argent, de nickel ou d'un alliage des métaux précités.Manufacturing method according to one of the preceding claims, the metal layer (CM, CM ') being made of gold, silver, nickel or an alloy of the aforementioned metals. Procédé de fabrication selon l'une des revendications précédentes, la couche isolante (CI, CI') étant constituée de résine.Manufacturing method according to one of the preceding claims, the insulating layer (CI, CI ') being made of resin.
EP16170379.8A 2016-05-19 2016-05-19 Method for manufacturing a timepiece provided with a hollow or raised casing element Active EP3246767B1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH00647/16A CH712475A2 (en) 2016-05-19 2016-05-19 Process for the manufacture of a watch-making part with a hollow or raised dressing element
EP16170379.8A EP3246767B1 (en) 2016-05-19 2016-05-19 Method for manufacturing a timepiece provided with a hollow or raised casing element
US15/587,797 US10528008B2 (en) 2016-05-19 2017-05-05 Process for the production of a timepiece provided with a hollow or raised external element
JP2017096238A JP6343701B2 (en) 2016-05-19 2017-05-15 Method for manufacturing a timer with a concave or raised outer element
CN201710351445.8A CN107402512B (en) 2016-05-19 2017-05-18 Method for manufacturing a timepiece provided with a hollow or convex external element
US16/696,359 US11300930B2 (en) 2016-05-19 2019-11-26 Process for the production of a timepiece provided with a hollow or raised external element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP16170379.8A EP3246767B1 (en) 2016-05-19 2016-05-19 Method for manufacturing a timepiece provided with a hollow or raised casing element

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EP3246767A1 true EP3246767A1 (en) 2017-11-22
EP3246767B1 EP3246767B1 (en) 2019-01-09

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EP (1) EP3246767B1 (en)
JP (1) JP6343701B2 (en)
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US20200096946A1 (en) 2020-03-26
CN107402512A (en) 2017-11-28
JP6343701B2 (en) 2018-06-13
US11300930B2 (en) 2022-04-12
CN107402512B (en) 2020-04-24
US10528008B2 (en) 2020-01-07
US20170336762A1 (en) 2017-11-23
CH712475A2 (en) 2017-11-30
JP2017207487A (en) 2017-11-24
EP3246767B1 (en) 2019-01-09

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