EP3233731A1 - Method for producing aryl-functional silanes - Google Patents
Method for producing aryl-functional silanesInfo
- Publication number
- EP3233731A1 EP3233731A1 EP15870544.2A EP15870544A EP3233731A1 EP 3233731 A1 EP3233731 A1 EP 3233731A1 EP 15870544 A EP15870544 A EP 15870544A EP 3233731 A1 EP3233731 A1 EP 3233731A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- metal
- alternatively
- aryl
- silicon
- reactant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 150000004756 silanes Chemical class 0.000 title description 13
- 238000004519 manufacturing process Methods 0.000 title description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 134
- 239000002184 metal Substances 0.000 claims abstract description 134
- 238000000034 method Methods 0.000 claims abstract description 100
- 239000003054 catalyst Substances 0.000 claims abstract description 95
- 229910000676 Si alloy Inorganic materials 0.000 claims abstract description 80
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 56
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000010703 silicon Substances 0.000 claims abstract description 53
- 239000010949 copper Substances 0.000 claims abstract description 46
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000000376 reactant Substances 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 37
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000004615 ingredient Substances 0.000 claims abstract description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 150000001502 aryl halides Chemical class 0.000 claims abstract description 25
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910000077 silane Inorganic materials 0.000 claims abstract description 24
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 20
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000010931 gold Substances 0.000 claims abstract description 18
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 18
- 239000011651 chromium Substances 0.000 claims abstract description 16
- 239000011777 magnesium Substances 0.000 claims abstract description 16
- 239000011572 manganese Substances 0.000 claims abstract description 16
- 229910052737 gold Inorganic materials 0.000 claims abstract description 14
- 229910052709 silver Inorganic materials 0.000 claims abstract description 13
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 11
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 11
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 11
- 239000001257 hydrogen Substances 0.000 claims abstract description 10
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 230000008021 deposition Effects 0.000 claims abstract description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims abstract description 7
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims abstract description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 7
- 239000010941 cobalt Substances 0.000 claims abstract description 7
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000004332 silver Substances 0.000 claims abstract description 7
- 238000005530 etching Methods 0.000 claims abstract description 6
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Substances ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 claims description 18
- 238000010926 purge Methods 0.000 claims description 18
- 125000003118 aryl group Chemical group 0.000 claims description 12
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 10
- 125000005843 halogen group Chemical group 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 239000002243 precursor Substances 0.000 claims description 6
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 claims description 4
- 239000005049 silicon tetrachloride Substances 0.000 claims description 4
- MVPPADPHJFYWMZ-IDEBNGHGSA-N chlorobenzene Chemical group Cl[13C]1=[13CH][13CH]=[13CH][13CH]=[13CH]1 MVPPADPHJFYWMZ-IDEBNGHGSA-N 0.000 claims 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 15
- 150000002431 hydrogen Chemical class 0.000 description 14
- 239000007789 gas Substances 0.000 description 13
- 230000008901 benefit Effects 0.000 description 10
- 230000008569 process Effects 0.000 description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052801 chlorine Inorganic materials 0.000 description 7
- 239000000460 chlorine Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 150000003839 salts Chemical class 0.000 description 6
- -1 halide compound Chemical class 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000005693 optoelectronics Effects 0.000 description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910004028 SiCU Inorganic materials 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- 239000012159 carrier gas Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229910003691 SiBr Inorganic materials 0.000 description 3
- 238000010923 batch production Methods 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010924 continuous production Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000012433 hydrogen halide Substances 0.000 description 3
- 229910000039 hydrogen halide Inorganic materials 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 3
- 239000010457 zeolite Substances 0.000 description 3
- 229910004721 HSiCl3 Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001350 alkyl halides Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000002199 base oil Substances 0.000 description 2
- GZUXJHMPEANEGY-UHFFFAOYSA-N bromomethane Chemical compound BrC GZUXJHMPEANEGY-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Inorganic materials [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- SNHMUERNLJLMHN-UHFFFAOYSA-N iodobenzene Chemical compound IC1=CC=CC=C1 SNHMUERNLJLMHN-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- BIIBYWQGRFWQKM-JVVROLKMSA-N (2S)-N-[4-(cyclopropylamino)-3,4-dioxo-1-[(3S)-2-oxopyrrolidin-3-yl]butan-2-yl]-2-[[(E)-3-(2,4-dichlorophenyl)prop-2-enoyl]amino]-4,4-dimethylpentanamide Chemical compound CC(C)(C)C[C@@H](C(NC(C[C@H](CCN1)C1=O)C(C(NC1CC1)=O)=O)=O)NC(/C=C/C(C=CC(Cl)=C1)=C1Cl)=O BIIBYWQGRFWQKM-JVVROLKMSA-N 0.000 description 1
- MPPPKRYCTPRNTB-UHFFFAOYSA-N 1-bromobutane Chemical compound CCCCBr MPPPKRYCTPRNTB-UHFFFAOYSA-N 0.000 description 1
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical compound CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 description 1
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 1
- DWKNOLCXIFYNFV-HSZRJFAPSA-N 2-[[(2r)-1-[1-[(4-chloro-3-methylphenyl)methyl]piperidin-4-yl]-5-oxopyrrolidine-2-carbonyl]amino]-n,n,6-trimethylpyridine-4-carboxamide Chemical compound CN(C)C(=O)C1=CC(C)=NC(NC(=O)[C@@H]2N(C(=O)CC2)C2CCN(CC=3C=C(C)C(Cl)=CC=3)CC2)=C1 DWKNOLCXIFYNFV-HSZRJFAPSA-N 0.000 description 1
- HFGHRUCCKVYFKL-UHFFFAOYSA-N 4-ethoxy-2-piperazin-1-yl-7-pyridin-4-yl-5h-pyrimido[5,4-b]indole Chemical compound C1=C2NC=3C(OCC)=NC(N4CCNCC4)=NC=3C2=CC=C1C1=CC=NC=C1 HFGHRUCCKVYFKL-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 239000005046 Chlorosilane Substances 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 238000005727 Friedel-Crafts reaction Methods 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- JUZTWRXHHZRLED-UHFFFAOYSA-N [Si].[Cu].[Cu].[Cu].[Cu].[Cu] Chemical compound [Si].[Cu].[Cu].[Cu].[Cu].[Cu] JUZTWRXHHZRLED-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 150000001343 alkyl silanes Chemical class 0.000 description 1
- 125000000304 alkynyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- YCOXTKKNXUZSKD-UHFFFAOYSA-N as-o-xylenol Natural products CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- RDHPKYGYEGBMSE-UHFFFAOYSA-N bromoethane Chemical compound CCBr RDHPKYGYEGBMSE-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- KMGBZBJJOKUPIA-UHFFFAOYSA-N butyl iodide Chemical compound CCCCI KMGBZBJJOKUPIA-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- NEHMKBQYUWJMIP-NJFSPNSNSA-N chloro(114C)methane Chemical compound [14CH3]Cl NEHMKBQYUWJMIP-NJFSPNSNSA-N 0.000 description 1
- HRYZWHHZPQKTII-UHFFFAOYSA-N chloroethane Chemical compound CCCl HRYZWHHZPQKTII-UHFFFAOYSA-N 0.000 description 1
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 1
- 238000000975 co-precipitation Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 229910021360 copper silicide Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 229960003750 ethyl chloride Drugs 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000002290 gas chromatography-mass spectrometry Methods 0.000 description 1
- 238000001165 gas chromatography-thermal conductivity detection Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- HVTICUPFWKNHNG-UHFFFAOYSA-N iodoethane Chemical compound CCI HVTICUPFWKNHNG-UHFFFAOYSA-N 0.000 description 1
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 1
- SORXVYYPMXPIFD-UHFFFAOYSA-N iron palladium Chemical compound [Fe].[Pd] SORXVYYPMXPIFD-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 229910001510 metal chloride Inorganic materials 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229940102396 methyl bromide Drugs 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- AYOOGWWGECJQPI-NSHDSACASA-N n-[(1s)-1-(5-fluoropyrimidin-2-yl)ethyl]-3-(3-propan-2-yloxy-1h-pyrazol-5-yl)imidazo[4,5-b]pyridin-5-amine Chemical compound N1C(OC(C)C)=CC(N2C3=NC(N[C@@H](C)C=4N=CC(F)=CN=4)=CC=C3N=C2)=N1 AYOOGWWGECJQPI-NSHDSACASA-N 0.000 description 1
- SNMVRZFUUCLYTO-UHFFFAOYSA-N n-propyl chloride Chemical compound CCCCl SNMVRZFUUCLYTO-UHFFFAOYSA-N 0.000 description 1
- PVWOIHVRPOBWPI-UHFFFAOYSA-N n-propyl iodide Chemical compound CCCI PVWOIHVRPOBWPI-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- XULSCZPZVQIMFM-IPZQJPLYSA-N odevixibat Chemical compound C12=CC(SC)=C(OCC(=O)N[C@@H](C(=O)N[C@@H](CC)C(O)=O)C=3C=CC(O)=CC=3)C=C2S(=O)(=O)NC(CCCC)(CCCC)CN1C1=CC=CC=C1 XULSCZPZVQIMFM-IPZQJPLYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004344 phenylpropyl group Chemical group 0.000 description 1
- 238000002464 physical blending Methods 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000011896 sensitive detection Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- AIFMYMZGQVTROK-UHFFFAOYSA-N silicon tetrabromide Chemical compound Br[Si](Br)(Br)Br AIFMYMZGQVTROK-UHFFFAOYSA-N 0.000 description 1
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 description 1
- JHGCXUUFRJCMON-UHFFFAOYSA-J silicon(4+);tetraiodide Chemical compound [Si+4].[I-].[I-].[I-].[I-] JHGCXUUFRJCMON-UHFFFAOYSA-J 0.000 description 1
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(I) nitrate Inorganic materials [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 1
- 239000012265 solid product Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- IBOKZQNMFSHYNQ-UHFFFAOYSA-N tribromosilane Chemical compound Br[SiH](Br)Br IBOKZQNMFSHYNQ-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic System
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/12—Organo silicon halides
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Definitions
- halosilanes are produced commercially by the Mueller-Rochow Direct Process, which comprises passing a halide compound over zero-valent silicon (Si ⁇ ) in the presence of a copper catalyst and various optional promoters. Mixtures of halosilanes are produced by the Direct Process. When an organohalide is used, a mixture of organohalosilanes is produced by the Direct Process.
- the typical process for making the Si ⁇ used in the Direct Process consists of the carbothermic reduction of S1O2 in an electric arc furnace. Extremely high temperatures are required to reduce the S1O2, so the process is energy intensive. Consequently, production of
- 0 adds costs to the Direct Process for producing halosilanes. Therefore, there is a need for a more economical method of producing halosilanes that avoids or reduces the need of using S ' fi.
- Aryl-functional silanes are useful as precursors for the preparation of aryl- functional siloxane polymers and network resins.
- Aryl- functional resins are used in high temperature coatings and adhesives, and in cookware.
- the aryl- functional resins are also useful in optoelectronic applications such as for LEDs and optical interconnects.
- the aryl-functional silanes may further include alkyl groups, which are used to make aryl-, alkyl- functional siloxane polymers.
- the aryl-, alkyl- functional siloxane polymers are stable at relatively high
- a method for preparing a reaction product comprising an aryl-functional silane comprises sequential steps (1 ) and (2), where:
- step (1 ) is contacting, under silicon deposition conditions
- step (2) is contacting the silicon alloy catalyst and (C) a reactant comprising an aryl halide under silicon etching conditions;
- reaction product comprises the aryl-functional silane and a spent catalyst.
- Pr “Pr” means propyl and includes various structures such as iPr and nPr. iPr Isopropyl
- Aryl halide means a compound having an aromatic hydrocarbyl ring in which one halogen atom is covalently bonded to a carbon atom in the ring (i.e., an aromatic hydrocarbon in which one of the hydrogen atoms directly bonded to a carbon atom in an aromatic ring is replaced by a halogen atom).
- the aryl halide is exemplified by, but not limited to,
- chlorobenzene phenyl chloride
- phenyl bromide phenyl bromide
- phenyl iodide phenyl iodide
- Metallic means that the metal has an oxidation number of zero.
- urging means to introduce a gas stream into a container to remove unwanted materials.
- Residence time means the time which a material takes to pass through a reactor system in a continuous process, or the time a material spends in the reactor in a batch process.
- residence time may refer to the time in step (1 ) (and when present, step (3)) during which one reactor volume of the metal combination (B) makes contact with the ingredient (A) as the metal combination (B) passes through the reactor in a continuous process or during which the metal combination (B) is placed within the reactor in a batch process.
- residence time may refer to the time in step (2) (and when present, step (4)) during which one reactor volume of the silicon alloy catalyst makes contact with the reactant (C) as the silicon alloy catalyst passes through the reactor system in a continuous process or during which the silicon alloy catalyst is placed within the reactor in a batch process.
- residence time may refer to the time for one reactor volume of reactant (C) gas to pass through a reactor charged with the silicon alloy catalyst, e.g., the time for one reactor volume of the reactant (C) to pass through a reactor charged with the silicon alloy catalyst.
- silicon alloy means a material of empirical formula CupAuqCo r Cr s FetMg u Mn v Ni w Pd x AgySi z , where subscripts p, q, r, s, t, u, v, w, x, y, and z represent the molar amounts of each element present, and p > 0, q ⁇ 0, r ⁇ 0 , s ⁇ 0, t ⁇ 0, u ⁇ 0, v ⁇ 0, w ⁇ 0, x ⁇ 0, y ⁇ 0, and z > 0; with the proviso that at least one of q, r, s, t, u, v, w, x and y is not 0.
- Silicon alloy catalyst means a solid product that is formed in step (1 ) of the method described herein, and/or re-formed in step (3) of the method described herein, which is capable of reacting with the aryl halide to form the reaction product.
- Spent catalyst refers to the silicon alloy catalyst after step (2) (and after step (4), when step (4) is present).
- the spent catalyst after step (2) (or step (4)) contains an amount of silicon that is less than the amount of silicon in the silicon alloy catalyst after step (1 ) and before beginning step (2) (or after step (3) and before beginning step (4)).
- Spent catalyst may, or may not, be exhausted, i.e., spent catalyst may lack silicon or may contain some silicon that may or may not be reactive. Spent catalyst that contains some silicon that is reactive is not exhausted.
- Treating means to introduce a gas stream into a container to pre-treat a component before contacting the component with another component. Treating includes contacting the metal combination (B) to reduce or otherwise activate the metals before contacting with the ingredient (A) in step (1 ) of the method and/or to reduce or otherwise activate the silicon alloy catalyst before step (2) of the method.
- a method for preparing a reaction product comprising an aryl-functional silane comprises sequential steps (1 ) and (2), where:
- step (1 ) is contacting, under silicon deposition conditions
- step (2) is contacting the silicon alloy catalyst and (C) a reactant comprising an aryl halide under silicon etching conditions;
- reaction product comprises the aryl-functional silane and a spent catalyst
- the method may optionally further comprise sequential steps (3) and (4), where step (3) is contacting, under silicon deposition conditions, an additional ingredient comprising (I) an additional halosilane, and optionally (II) additional H2; thereby re-forming the silicon alloy catalyst, and
- step (4) is contacting the silicon alloy catalyst re-formed in step (3) with an additional reactant comprising an additional aryl halide; thereby forming an additional amount of the reaction product, where the reaction product comprises the aryl-functional silane and the spent catalyst; and where the method, when further comprising steps (3) and (4), optionally further comprises step (5), where step (5) is repeating steps (3) and (4) at least one time; and
- step (6) is recovering the aryl-functional silane after step (2), and/or when present, step (4), and/or step (5).
- a silicon alloy catalyst is formed by contacting an ingredient (A) and a metal combination (B).
- the ingredient (A) comprises (I) a halosilane and optionally (II) H2.
- the halosilane (I) may be a silicon tetrahalide of formula S1X4, a trihalosilane of formula HS1X3, or a combination thereof.
- Each X may be independently selected from the group consisting of fluorine (F), chlorine (CI), bromine (Br), and iodine (I); alternatively, CI, Br, or I; alternatively CI, Br, or F; alternatively CI or Br.
- each X may be Br; alternatively each X may be CI; alternatively each X may be F; and alternatively each X may be I.
- the tetrahalosilane examples include, but are not limited to, silicon tetrachloride, silicon tetrabromide, silicon tetraiodide, and silicon tetrafluoride.
- trihalosilanes include trichlorosilane (HSiCl3), tribromosilane, and a combination thereof.
- the metal combination (B) comprises Cu and at least one other metal selected from Ag, Au, Co, Cr, Fe, Mg, Mn, Ni, and Pd.
- the at least one other metal may be selected from Ag, Co, Cr, Fe, Mn, Ni, and Pd.
- the at least one other metal may be selected from Ag, Au, Co, Cr, Mg, Mn, Ni, and Pd.
- the at least one other metal may be selected from Ag, Co, Cr, Fe, and Mn.
- the at least one other metal may be Ag.
- the at least one other metal may be Au.
- the at least one other metal may be Co.
- the at least one other metal may be Cr.
- the at least one other metal may be Fe.
- the at least one other metal may be Mg.
- the at least one other metal may be Mn.
- the at least one other metal may be Ni.
- the at least one other metal may be Pd.
- more than one other metal may be present in the metal combination.
- the metal combination may be Cu, Au, and Mg.
- the metal combination may be Cu, Ni, and Pd.
- the metal combination may be Cu, Fe, and Pd.
- the amount of each metal in the metal combination depends on various factors including the specific metals and temperature selected for step (1 ).
- the metal combination may contain an amount of Cu up to 90%, alternatively up to 80%, alternatively 20% to 80%, and alternatively 50% of the metal combination, with the balance being one or more of Ag, Au, Co, Cr, Fe, Mg, Mn, Ni, and Pd.
- step (1 ) the ingredient (A) and the metal combination (B) are contacted under silicon deposition conditions to form a silicon alloy catalyst, i.e., the ingredient (A) and the metal combination (B) are contacted under conditions so as to deposit silicon, such that a ternary or higher silicon alloy catalyst is formed.
- the silicon alloy catalyst is typically a mixture comprising two or more silicon alloys that differ in at least one property such as amount of Si present, amount of Cu present, morphology, structure and which other metal and/or metals are present.
- step (1 ) may be conducted at a first temperature of 200 ⁇ C to 1000 ⁇ C, alternatively 500 ⁇ C to 1000 ⁇ C, alternatively 600 °C to 900 °C, alternatively 650 °C to 850 ⁇ C, alternatively 700 ⁇ C to 800 °C, and alternatively 750 °C, for a time sufficient to form the silicon alloy catalyst.
- the copper and at least one other metal of the metal combination (B) may be provided in any convenient form, such as metallic form, e.g., metallic copper, metallic gold, metallic silver, metallic iron, metallic cobalt, metallic chromium, metallic nickel, and metallic palladium.
- the metallic forms may be mixtures of particles or alloys.
- metal salts including, but not limited to, halide, acetate, nitrate, and carboxylate salts of Cu, and one or more of Ag, Au, Co, Cr, Fe, Mg, Mn, Ni, and Pd, may be mixed in desired proportions and then reduced with hydrogen at elevated temperature, typically > 300 'C, before step (1 ).
- suitable metal salts which are commercially available, include CuCl2-2H20, FeCl3-6H20, NiCl2-6H20,
- the Cu and at least one other metal of the metal combination (B) may optionally be provided on a support.
- supports include activated carbon and metal oxides, i.e., oxides of aluminum, titanium, zirconium, and/or silicon.
- the support may be selected from silica, alumina, and a combination thereof.
- the support may be alumina.
- supports that are highly crystalline can be used. Crystalline silica and certain zeolites, such as Zeolite Y or Zeolite Beta products (e.g., which are commercially available as Zeolyst CBV 780 from Zeolyst International), are also examples of supports that can be used.
- the supported metal combination When the metal combination is provided on a support, the supported metal combination may have 5% to 50% of the metal combination with the balance being the support. Alternatively, the supported metal combination may have 10% to 40 % metals, alternatively 1 1 % to 30% metals, alternatively 16% to 17% metals, with the balance being the support.
- Supported metal combinations may be prepared by any convenient means, such as incipient wetness impregnation or co-precipitation or sol-gel or physical blending of metal oxides.
- the supported metal combination is prepared by impregnating the support with the precursor.
- the term "impregnating” means permeating with a wetted, melted, or molten substance throughout all or a portion of a support (e.g., via an incipient wetness technique), preferably to a point where essentially all of a liquid phase substance is adsorbed, producing a liquid-saturated but unagglomerated solid.
- An illustrative example of a suitable impregnating technique may be found in Example 1 of WO 201 1/106194.
- impregnating may be performed by a depositing-adsorbing technique, such as that found in Example 3 of WO
- the precursor may comprise, for example, an aqueous solution of Cu(N03)2,
- the aqueous solution may optionally further comprise an acid, such as HCI.
- the support may be, for example, alumina, Fe203, ⁇ 2 ⁇ 3, S1O2, MgO, La203 or Zr02- Alternatively, the support may be alumina.
- Step (1 ) can be performed in any reactor suitable for the combining of gases and solids.
- the reactor configuration can be a packed bed, stirred bed, vibrating bed, moving bed, re-circulating bed, or a fluidized bed.
- the silicon alloy catalyst can be circulated from a bed for conducting step (1 ) to a separate bed for conducting step (2).
- the reactor should have means to control the temperature of the reaction zone, e.g., the portion of the reactor in which (A) the ingredient and (B) the metal combination contact one another and/or the portion of the reactor in which (A) the ingredient and the silicon alloy catalyst contact one another in step (2).
- the pressure at which the ingredient (A) is contacted with the metal combination (B) in step (1 ) can be sub-atmospheric, atmospheric, or super-atmospheric.
- the pressure may range from > 0 kilopascals absolute (kPa) to 3500 kPa, alternatively 10 kPa to 2100 kPa; alternatively 101 kPa to 2101 kPa; alternatively 101 kPa to 1 101 kPa; and alternatively 101 kPa to 900 kPa; and alternatively 201 kPa to 901 kPa.
- the mole ratio of hydrogen (II) halosilane (I) in the ingredient (A) contacted with the metal combination (B) in step (1 ) ranges from 10,000:1 to 0.01 :1 , alternatively 100:1 to 1 :1 , alternatively 20:1 to 5:1 , alternatively 20:1 to 4:1 , alternatively 20:1 to 2:1 , alternatively 20:1 to 1 :1 , alternatively 4:1 to 1 :1 , and alternatively 3:1 to 1 .2:1 .
- the residence time for the ingredient (A) is sufficient for the ingredient to contact the metal combination (B) and form the silicon alloy catalyst in step (1 ) and depends on various factors including reactor size and particle size of the metal combination (B).
- a sufficient residence time for the ingredient (A) may be at least 0.01 s, alternatively at least 0.1 s, alternatively 0.1 s to 10 min, alternatively 0.1 s to 1 min, alternatively 0.5 s to 10 s, alternatively 1 min to 3 min, and alternatively 5 s to 10 s.
- the residence time for the metal combination (B) to be in contact with the ingredient (A) in step (1 ) is typically at least 0.1 min; alternatively at least 0.5 minutes; alternatively 0.1 min to 120 min; alternatively 0.5 min to 9 min; alternatively 0.5 min to 6 min.
- the desired residence time may be achieved by adjusting the flow rate of the H2 and the halosilane, or by adjusting the total reactor volume, or by any combination thereof.
- the H2 (II) may be fed to the reactor simultaneously with the halosilane in step (1 ); however, other methods of combining, such as by separate pulses, are also envisioned.
- the halosilane (I) and the H2 (II) may be mixed together before feeding to the reactor; alternatively, halosilane (I) and the H2 (II) may be fed into the reactor as separate streams.
- the metal combination (B) is used in a sufficient amount.
- a "sufficient amount" of metal combination is enough to form the silicon alloy catalyst, described herein, when halosilane (I) and, when present, the H2 (II) are contacted with the metal combination.
- a sufficient amount of metal combination may be at least 0.01 mg metal/cm ⁇ of reactor volume; alternatively at least 0.5 mg metal/cm ⁇ of reactor volume; alternatively 1 mg metal/cm ⁇ of reactor volume to maximum bulk density of the metal combination based on the reactor volume, alternatively 1 mg to 5,000 mg metal/cm ⁇ of reactor volume, alternatively 1 mg to 1 ,000 mg metal/cm ⁇ of reactor volume, and alternatively 1 mg to 900 mg metal/cm ⁇ of reactor volume.
- step (1 ) There is no upper limit on the time for which step (1 ) is conducted.
- step (1 ) is usually conducted for at least 0.1 s, alternatively from 1 s to 5 hr, alternatively from 1 min to 1 hr.
- Step (1 ) produces a silicon alloy catalyst comprising an initial weight percent of silicon in the silicon alloy catalyst, based on the total weight of the silicon alloy catalyst, at least 0.1 %, alternatively 0.1 % to 90%, alternatively 35% to 90%, alternatively 0.1 % to 35%, alternatively 1 % to 20%, alternatively from 1 % to 5%, of silicon.
- the percentage of silicon in the silicon alloy catalyst can be determined using standard analytical tests.
- the percentage of silicon may be determined using inductively coupled plasma atomic emission spectroscopy (ICP-AES) or ICP mass spectrometry (ICP-MS).
- ICP-AES inductively coupled plasma atomic emission spectroscopy
- ICP-MS ICP mass spectrometry
- step (2) of the method the silicon alloy catalyst formed in step (1 ) and a reactant (C) comprising an aryl halide are contacted under silicon etching conditions, i.e., conditions such that the reaction product comprising the aryl-functional silane is formed.
- silicon etching conditions i.e., conditions such that the reaction product comprising the aryl-functional silane is formed.
- the second temperature may be 100 ⁇ € to 600 °C, alternatively 100 ⁇ € to 500 °C, alternatively 200 °C to 500 °C, alternatively 300 °C to 500 °C, alternatively 400 °C to 500 ⁇ €, alternatively 275 ⁇ € to 300 ⁇ € and alternatively 450 °C to form the reaction product.
- the reactant (C) used in step (2) comprises an aryl halide.
- the aryl halide may have formula R 1 X, where each X is independently a halogen atom, which may be the same as or different from the halogen atom in the silicon tetrahalide (I) described above.
- R 1 is an aryl group. Examples of aryl groups that can be used for R 1 include phenyl, naphthyl, tolyl, xylyl, phenylethyl, phenyl propyl, and phenyl butyl. Alternatively, R 1 is selected from phenyl, tolyl and xylyl. Alternatively, R1 is phenyl.
- the aryl halide include chlorobenzene, bromobenzene, iodobenzene, and combinations thereof. Alternatively, the aryl halide may be chlorobenzene.
- the reactant (C) used in step (2) may optionally further comprise one or more additional components.
- H2 may be used in addition to the aryl halide.
- an inert gas may be fed with the aryl halide in step (2).
- argon or nitrogen, alternatively argon can be fed in step (2) of the method described herein.
- an alkyl halide such as methyl chloride, methyl bromide, methyl iodide, ethyl chloride, ethyl bromide, ethyl iodide, propyl chloride, propyl bromide, propyl iodide, butyl chloride, butyl bromide, or butyl iodide may be added in step (2) in addition to the aryl halide.
- an hydrogen halide such as HCI, HBr, or HI; alternatively HCI may be used in addition to the aryl halide in step (2).
- reactors suitable for use in (2) are as described for (1 ).
- the same reactor may be used for step (2) as used in step (1 ); however, separate reactors may also be used.
- the reactor used in steps (1 ) and (2) may be a multistage reactor in which step (1 ) is performed in a first stage and step (2) is performed in a second stage.
- the reactant (C) may be contacted with the silicon alloy catalyst by feeding the reactant (C) into a reactor containing the silicon alloy catalyst produced in step (1 ).
- the reactor for step (2) may be the same as, or different from the reactor used in step (1 ).
- the residence time for (C) the reactant is sufficient for the reactant to contact the silicon alloy catalyst and form the aryl-functional silane in step (2).
- a sufficient residence time for the reactant may be at least 0.01 s, alternatively at least 0.1 s, alternatively 0.1 s to 10 min, alternatively 0.1 s to 1 min, alternatively 0.5 s to 10 s, alternatively 1 min to 3 min, and alternatively 5 s to 10 s.
- the residence time for the silicon alloy catalyst to be in contact with the reactant in step (2) is typically at least 0.1 min; alternatively at least 0.5 minutes; alternatively 0.1 min to 120 min; alternatively 0.5 min to 9 min; alternatively 0.5 min to 6 min.
- the desired residence time may be achieved by adjusting the flow rate of the reactant, or by adjusting the total reactor volume, or by any combination thereof.
- Step (2) is typically conducted until the amount of silicon in the silicon alloy catalyst falls below a predetermined limit, e.g., until the silicon alloy catalyst is spent.
- step (2) may be conducted until the amount of silicon in the silicon alloy catalyst is below 90%, alternatively 1 % to 90%, alternatively 1 % to 40%, of its initial weight percent.
- the initial weight percent of silicon in the silicon alloy catalyst is the weight percent of silicon in the silicon alloy catalyst after step (1 ) and before beginning step (2).
- the amount of silicon in the silicon alloy catalyst can be monitored by correlating production of the reaction product of step (2) with the weight percent of silicon in the reactant and then monitoring the reactor effluent or may be determined as described herein.
- step (2) is conducted until at least 1 % of the silicon contributed in step (1 ) is reacted; alternatively, step (2) is conducted until 1 % to 40% of the silicon contributed in step (1 ) is reacted; alternatively, step (2) is conducted until at least 90% of the silicon contributed in step (1 ) is reacted; alternatively step (2) is conducted until greater than 95% of the silicon contributed in step (1 ) is reacted, alternatively step (2) is conducted until greater than 99% of the silicon contributed in step (1 ) is reacted, and alternatively step (2) is conducted until 99.9% of the silicon contributed in step (1 ) is reacted.
- step (1 ) of the method described herein more silicon is deposited in step (1 ) of the method described herein, and more silicon is removed in step (2) in this method as compared to methods in which only a binary silicon alloy catalyst (i.e., an alloy of silicon and only one other metal in the catalyst) is used with the same ingredients and reactants.
- a binary silicon alloy catalyst i.e., an alloy of silicon and only one other metal in the catalyst
- the pressure at which the ingredient comprising hydrogen and the halosilane is contacted with the silicon alloy catalyst in step (2) can be sub-atmospheric, atmospheric, or super-atmospheric.
- the pressure may range from 0 kPa to 3500 kPa, 10 kPa to 2100 kPa; alternatively 101 kPa to 2101 kPa; alternatively 101 kPa to 1 101 kPa; and alternatively 101 kPa to 900 kPa; and alternatively 201 kPa to 901 kPa.
- the silicon alloy catalyst is used in a sufficient amount.
- a "sufficient amount" of silicon alloy catalyst is enough catalyst to form the aryl-functional silane described below.
- a sufficient amount of silicon alloy catalyst may be at least 0.01 mg silicon alloy catalyst/cm ⁇ of reactor volume; alternatively at least 0.5 mg metal/cm ⁇ of reactor volume; alternatively 1 mg silicon alloy catalyst/cm ⁇ of reactor volume to maximum bulk density of the silicon alloy catalyst based on the reactor volume, alternatively 1 mg to 5,000 mg silicon alloy catalyst/cm ⁇ of reactor volume, alternatively 1 mg to 1 ,000 mg silicon alloy catalyst/cm ⁇ of reactor volume, and alternatively 1 mg to 900 mg silicon alloy catalyst/cm ⁇ of reactor volume.
- Steps (1 ) and (2) of the method are performed sequentially. Alternatively, steps (1 ) and (2) of the method may be performed separately and sequentially. "Separate" and
- step (1 ) and step (2) do not overlap or coincide.
- step (1 ) and step (2) do not overlap or coincide.
- step (2) does not overlap or coincide.
- step (3) and step (2) refer to either spatially or temporally or both.
- step (2) is performed after step (1 )
- step (4) is performed after step (3)
- additional steps may be performed between the sequential steps (e.g., between step (1 ) and step (2) and/or between step (3) and step (4), when steps (3) and (4) are present in the method), as described below.
- steps (3) and (4) are present and are also performed sequentially; alternatively steps (3) and (4) may be performed separately and sequentially.
- the method described herein may optionally further comprise purging and/or treating. Purging and/or treating may be performed at various times during the method.
- the method described herein may optionally further comprise one or more of the following purging and/or treating steps: purging and/or treating the metal combination, before contacting the metal combination with the ingredient comprising the halosilane in step (1 ); and/or
- step (2) purging and/or treating the silicon alloy catalyst, before contacting the silicon alloy catalyst with the reactant comprising the aryl halide in step (2); and/or
- the purging step comprises introducing a gas stream into the reactor to remove unwanted materials.
- Unwanted materials in step (2), and when present step (4), may include, for example, H2, O2, H2O and HX, where X is a halogen atom as defined above
- Purging may be accomplished with an inert gas, such as argon, nitrogen, or helium or with a reactive gas, such as the halosilane (I) (e.g., silicon tetrachloride), which reacts with moisture thereby removing it.
- Purging before step (1 ) may be done to at least partially remove any oxide layer that may be present on a metal in the metal combination.
- the treating step may comprise introducing a gas stream into the reactor containing the metal combination to pre-treat the metal combination before contacting it with the ingredient (A) in step (1 ).
- the treating step may comprise introducing a gas stream into the reactor containing the silicon alloy catalyst to activate and/or reduce it before contacting the silicon alloy catalyst with the aryl halide. Treating may be accomplished with a gas, such as H2 or the aryl halide; alternatively H2. Purging and/or treating may be performed at ambient or elevated temperature, e.g., at least 25 °C, alternatively at least 300 ' ⁇ , alternatively 25 °C to 500 °C, and alternatively 300 °C to 500 °C.
- the method may optionally further comprise recovering side products and unreacted ingredients and/or unreacted reactants after each step of this method.
- a hydrogen halide such as HCI
- HCI hydrogen halide
- This hydrogen halide may be removed.
- Unreacted ingredients, such as S1CI4 may be recycled in step (1 ) or fed to step
- the method further comprises step (3) repeating step (1 ) by contacting the spent catalyst formed in step (2) with an additional ingredient (A) comprising an additional halosilane and optionally additional H2 under silicon deposition conditions (e.g., at the first temperature of 200 ⁇ to ⁇ ⁇ ' ⁇ ); thereby re-forming the silicon alloy catalyst; and step (4) repeating step (2) by contacting an additional reactant (C) and the silicon alloy catalyst re- formed in step (3) under silicon etching conditions ⁇ e.g., at the second temperature from ⁇ ⁇ ' ⁇ to 600 ' ⁇ ), to form additional reaction product.
- an additional ingredient (A) comprising an additional halosilane and optionally additional H2 under silicon deposition conditions (e.g., at the first temperature of 200 ⁇ to ⁇ ⁇ ' ⁇ ); thereby re-forming the silicon alloy catalyst
- the additional halosilane (I) used in step (3) may be the same as or different from, the halosilane used in step (1 ), and the additional reactant (C) may be the same as, or different from, the reactant (C) used in step (2), as described above.
- Step (3) may be performed without introducing an additional amount of ingredient (B).
- the temperature selected for step (4) is lower than the temperature selected for step (3). Without wishing to be bound by theory, it is thought that use of the silicon alloy catalyst described herein may prevent loss of metal upon repeated cycles (repetitions of steps (3) and (4)).
- the method described herein allows for maximizing the number of cycles for repeating steps (3) and (4).
- the method may optionally further comprise step (5), which is repeating steps (3) and (4) at least 1 time, alternatively from 1 to 10 7 times, alternatively 10 ⁇ to 10 7 times, alternatively from 1 to 1 ,000 times, alternatively from 1 to 100 times, alternatively 2 to 15 times, and alternatively from 1 to 10 times.
- the binary metal silicide catalyst may suffer from the drawback of metal loss upon repeated cycles (repetitions of steps (3) and (4)), and that the method described herein may provide higher throughput for each cycle than previous methods in which a binary copper silicide, is used instead of a silicon alloy catalyst described herein.
- the method may further comprise pre-heating and gasifying the halosilane (I) by known methods prior to contacting with the metal combination (B) in step (1 ).
- the method may further comprise pre-heating and gasifying the aryl halide prior to contacting with the silicon alloy catalyst in step (2).
- the method may further comprise step (6), recovering the aryl-functional silane from the reaction product produced.
- the aryl-functional silane may be recovered by, for example, removing gaseous silicon tetrahalide and any other gases from the reactor followed by isolation of the aryl-functional silane by distillation.
- the aryl-functional silane produced by the process described and exemplified above has the formula R 2 dHcR 1 bSiX(4-b-c-d)> wnere eacn * ' s a halogen atom as described above, subscript c has an average value from ⁇ 0 to ⁇ 4, subscript b has an average value from >0 to 4, subscript d has an average value from 0 to ⁇ 4, each R 1 is an aryl group, and each R 2 is independently a hydrocarbyl group selected from alkyl, alkenyl, cycloalkyl, and alkynyl. Alternatively, subscript b has an average value from 1 to 4.
- subscript c is 0 or 1
- subscript d is 0 or 1
- subscript b is 1 to 3.
- aryl-functional silanes prepared according to the present method include, but are not limited to, PhHSiCl2, PhSiCl3, Ph2SiCl2, Ph 3 SiCI, PhSiBr 3 , Ph 2 SiBr 2 , Ph 3 SiBr, PhHSiBr 2 , PhSil 3 , Ph 2 Sil2, PhHSi ⁇ , and Ph 3 Sil.
- the aryl-functional silanes prepared according to the present method include, but are not limited to, PhSiCI 3 , P ⁇ SiC ⁇ , and PhHSiC ⁇ .
- the method may produce aryl-, alkyl- functional silanes (i.e., the aryl-functional silane may further comprise an alkyl group). Examples of such aryl-, alkyl-functional silanes may include one or more of PhMeSiCI,
- PhMeSiCI 2 Ph 2 MeSiCI, PhMeSiBr, PhMeSiBr 2 , Ph 2 MeSiBr, PhMeSil, PhMeSil 2 , and
- Ph 2 MeSil alternatively one or more of PhMeSiCI, PhMeSiC ⁇ , and Ph 2 MeSiCI.
- the method described herein can produce an aryl-functional silane from a halosilane, such as a silicon tetrahalide. Since silicon tetrahalide, such as silicon tetrachloride, is a byproduct of other industrial processes and may be produced using less energy than required to produce zero-valent silicon, the method of the invention may be more economical than methods of producing aryl-functional silanes using S ' fi. The method described herein may also provide a benefit over other chemistries for making aryl-functional silanes, such as Psuedo Friedel Crafts reactions and/or Grignard processes, in that the method described herein produces fewer cyclohexyltrihalosilane impurities. The method described herein may also be performed without the use of organic solvents.
- Aryl-functional silanes are useful as precursors for the preparation of aryl-functional siloxane polymers and resins.
- aryl-functional silanes may also include alkyl groups (i.e., aryl-, alkyl silanes), these maybe used as precursors for the preparation of and aryl-, alkyl- functional siloxane polymers.
- alkyl groups i.e., aryl-, alkyl silanes
- the aryl-, alkyl- functional siloxane polymers are stable at relatively high temperatures and are useful as pump fluids, heat exchange fluids, and base oils for high temperature fluids.
- Aryl- functional siloxane resins are used in high temperature coatings and adhesives, for example, in cookware.
- the aryl- functional siloxane resins generally have high refractive index, which render them useful in optoelectronic applications.
- the aryl-functional siloxane resins may be used in optoelectronic applications such as for forming encapsulating materials for optoelectronic components such as LEDs, optoelectronic coatings, and optical interconnects.
- the reaction apparatus used in the examples herein comprised a 4.8 mm inner diameter quartz glass tube in a flow reactor.
- the reactor tube was heated using a
- Samples were taken from the reaction stream by actuating the injection valve and the 100 ⁇ sample passed directly into the injection port of a 6890N Agilent GC for analysis with a split ratio at the injection port of 100: 1 .
- the GC contained two Restek DCA columns. One column was connected to a mass spectrometer (Agilent 5975C SD) for sensitive detection of trace products and positive identification of any products that formed. The other was connected to a thermal conductivity detector for quantification of the compounds observed in the reactor effluent by the MSD. The columns were heated by the GC oven. Flow rate ratios were determined using thermodynamic principles with the flow rates, at standard temperature and pressure, of Hydrogen, Argon, SiCU, and chlorobenzene.
- a copper salt and at least one other metal salt were dissolved in de-ionized H 2 0.
- a portion of the resulting solution was added to activated carbon granules.
- the granules were then placed under vacuum for 30 min. After removing the vacuum, the resulting solid was dried at 80 °C for 2 hr.
- An additional impregnation was done (solution added to the solid, vacuum pulled, and heated), so that all of the solution had been added to the granules, which were then dried a final time at 120 ⁇ for 15 hours. After drying, the granules were weighed to determine the metal loading.
- hydrochloric acid was added to the metal salt/H20 solution dropwise to fully dissolve the metal salt and then used for impregnation.
- HCI hydrochloric acid
- HCI hydrochloric acid
- it was added dropwise until the metal chloride was dissolved, and the concentration of HCI was 5 % to 37 %.
- the supported metal combinations prepared in this manner are described below in Table 2. Table 2. Supported metal combination samples used in the Examples.
- the PhCI was fed through the reactor with either H 2 or Ar at a flow rate of 2 seem and atmospheric pressure.
- the reactor effluent was periodically sampled and analyzed by GC-TCD/GC-MS as described above to determine the composition of the reaction product.
- the PhCI feed was ceased, and the spent catalyst was contacted again with H 2 /SiCI 4 for 30 min at 750 °C to reform the silicon alloy catalyst.
- the combined flow rate of H 2 and SiCI 4 was 109 seem, and the mole ratio of H 2 to SiCI 4 was 1 1 .25: 1 .
- the silicon alloy catalyst was reformed, it was cooled to 400 ⁇ under H 2 , again, and PhCI was contacted with the reformed silicon alloy as described above. This cycle was repeated multiple times for each metal combination.
- the selectivity and chlorobenzene conversion for each sample are shown below in Tables 3 and 4.
- Samples 1 and 2 demonstrated that a copper: nickel metal combination used in the method described herein produced a reaction product with a selectivity that favored the formation of Si-Ph containing species. It also demonstrated that the amount of copper had an effect on both the product selectivity and the PhCI conversion.
- Samples 3 and 4 demonstrated that a copper: iron metal combination used in the method described herein produced a reaction product with selectivities that favored the formation of Si-Ph containing species. It also demonstrates that the amount of copper on the catalyst had an effect on both the product selectivity and the PhCI conversion.
- Samples 5 and 6 demonstrated that a copper:palladium metal combination used in the method described herein produced a reaction product with a selectivity that favored the formation of Si-Ph containing species. It also demonstrated that the amount of copper on the catalyst had an effect on both the product selectivity and the PhCI conversion. These samples also produced lower levels of PhSiCI 3 than the Samples with Cu:Ni and Cu:Fe metal combinations, but these samples converted the majority of the PhCI.
- Sample 7 demonstrated that a copper:cobalt metal combination used in the method described herein produced a reaction product with a selectivity that favored the Si-Ph containing species.
- Sample 8 demonstrated that a copper:chromium metal combination used in the method described herein produced a reaction product with a selectivity that favored the Si-Ph species.
- Example - 6 Copper:Manganese [0060] Sample 9 demonstrated that a copper:manganese metal combination used in the method described herein produced a reaction product with selectivity that favored formation of Si-Ph species.
- Sample 10 demonstrated that a copper:silver metal combination used in the method described herein produced a reaction product with selectivity that favored the Si-Ph species. Table 9.
- Samples 1 1 and 12 demonstrated that a copper:nickel:palladium metal combination used in the method described herein produced a reaction product with selectivity that favored the formation of Si-Ph containing species. It also produced those Si-Ph containing species with a greater than 25% conversion of PhCI.
- the use of Ar as the carrier gas for the PhCI in Sample 12 significantly impacted the reaction product content with more Si-Ph containing phenyl- functional being produced than in Sample 1 1 , in which H2 was used as the carrier gas for the PhCI in step (2).
- Samples 13, 14, and 15 demonstrated that the amount of palladium in the copper- nickel-palladium metal combination had an effect on both the product selectivity and PhCI conversion. As the palladium amount decreased, the amount of PhHSiCl2 increased and the PhCI conversion decreased. In the trial with Sample 15, which had the lowest amount of palladium of samples 13, 14, and 15, the amounts of HSiCl3 and S1CI4 in the reaction product significantly increased.
- Sample 16 demonstrated that a copper:iron palladium metal combination when used in the method described herein produced a reaction product with selectivity that favored the formation of Si-Ph containing species.
- Sample 17 demonstrated that a copper:gold:magnesium metal combination used in the method described herein produced a reaction product with selectivity that favored the formation of Si-Ph containing species. Table 3
- step (2) of the method where chlorobenzene was added to the reactor the carrier gas was Ar.
- the method provides a benefit in selectivity to produce more aryl-functional silanes (e.g., phenyl, chlorosilanes) in the reaction product.
- aryl-functional silanes e.g., phenyl, chlorosilanes
- Higher amounts of one or more of Ph 2 SiCI 2 , PhHSiCl2 and PhSiCl3 indicate favorable selectivity to a desired reaction product.
- the method may provide the benefit of reduced amounts of unreacted halosilane and/or aryl halide (e.g., S1CI4 and chlorobenzene) in the reaction product as compared to a method in which is used a different metal from the metal combination described herein for ingredient (B).
- the method may provide the benefit provide for reduced amounts of side product (e.g., benzene) production.
- side product e.g., benzene
- Certain embodiments of this invention may independently solve additional problems and/or have benefits. Certain embodiments of this invention may have one, or one or more, but not all of the aforementioned benefits and still be within the scope of the invention set forth in the claims.
- ranges includes the range itself and also anything subsumed therein, as well as endpoints.
- disclosure of a range of >0 to 4 includes not only the range of 2 to 4, but also 2.1 , 2.3, 3.4, 3.5, and 4 individually, as well as any other number subsumed in the range.
- disclosure of a range of, for example, >0 to 4 includes the subsets of, for example, 2.1 to 3.5, 2.3 to 3.4, 2.6 to 3.7, and 3.8 to 4, as well as any other subset subsumed in the range.
- PhSiCl3, Ph 2 SiCl2, Ph 3 SiCI, PhSiBr 3 , Ph 2 SiBr 2 , Ph 3 SiBr, PhSil3, Ph 2 Sil2, and Ph 3 Sil , and combinations of two or more of PhSiCl3, Ph 2 SiCl2, Ph 3 SiCI, PhSiBr 3 , Ph 2 SiBr 2 , Ph 3 SiBr, PhSil 3 , Ph 2 Sil 2 , and Ph 3 Sil includes the member PhSiCI 3 individually, the subgroup PhSiCI 3 and Ph 2 SiCI 2 , and any other individual member and subgroup subsumed therein.
- any ranges and subranges relied upon in describing various embodiments of the present disclosure independently and collectively fall within the scope of the appended claims, and are understood to describe and contemplate all ranges including whole and/or fractional values therein, even if such values are not expressly written herein.
- the enumerated ranges and subranges sufficiently describe and enable various embodiments of the present disclosure, and such ranges and subranges may be further delineated into relevant halves, thirds, quarters, fifths, and so on.
- a range "of 500 to 1000" may be further delineated into a lower third, i.e., from 500 to 666, a middle third, i.e., from 667 to 833, and an upper third, i.e., from 834 to 1000, which individually and collectively are within the scope of the appended claims, and may be relied upon individually and/or collectively and provide adequate support for specific embodiments within the scope of the appended claims.
- a range such as "at least,” “greater than,” “less than,” “no more than,” and the like, it is to be understood that such language includes subranges and/or an upper or lower limit.
- a range of "at least 0.1 %" inherently includes a subrange from 0.1 % to 35%, a subrange from 10% to 25%, a subrange from 23% to 30%, and so on, and each subrange may be relied upon individually and/or collectively and provides adequate support for specific embodiments within the scope of the appended claims.
- an individual number within a disclosed range may be relied upon and provides adequate support for specific embodiments within the scope of the appended claims.
- a range of ">0 to 4" includes various individual integers, such as 0 or 3, as well as individual numbers including a decimal point (or fraction), such as 2.1 , which may be relied upon and provide adequate support for specific embodiments within the scope of the appended claims.
Abstract
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- 2015-11-06 WO PCT/US2015/059369 patent/WO2016099690A1/en active Application Filing
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EP3233731A4 (en) | 2018-10-17 |
JP6725510B2 (en) | 2020-07-22 |
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CN107207730A (en) | 2017-09-26 |
EP3233731B1 (en) | 2020-08-05 |
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WO2016099690A1 (en) | 2016-06-23 |
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