EP3232480B1 - Metall-insulator-graphen tunneldiode mit vorspannungsinduzierter barrierenmodulation - Google Patents

Metall-insulator-graphen tunneldiode mit vorspannungsinduzierter barrierenmodulation Download PDF

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EP3232480B1
EP3232480B1 EP16165293.8A EP16165293A EP3232480B1 EP 3232480 B1 EP3232480 B1 EP 3232480B1 EP 16165293 A EP16165293 A EP 16165293A EP 3232480 B1 EP3232480 B1 EP 3232480B1
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electrically conductive
layer
electronic device
graphene
conductive layer
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EP3232480A1 (de
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Klaus Kern
Marko Burghard
Dinh Loc Duong
Robert Urcuyo
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Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/88—Tunnel-effect diodes
    • H—ELECTRICITY
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0642—Isolation within the component, i.e. internal isolation
    • H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
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    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66015—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene
    • H01L29/66022—Multistep manufacturing processes of devices having a semiconductor body comprising semiconducting carbon, e.g. diamond, diamond-like carbon, graphene the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
    • H01L29/6603—Diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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    • H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264—Inorganic materials
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    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/062—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the metal-insulator-semiconductor type
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    • H01L31/08—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
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    • Y02E10/547—Monocrystalline silicon PV cells

Definitions

  • the invention relates to an electronic device comprising:
  • MIM-diodes are promising for application in high frequency mixers, photo detectors and in rectenna devices for solar energy harvesting.
  • the wave-nature may also be used in antenna-coupled diode solar cells.
  • the wave-nature of the photon may be used if photon energy is concentrated on a device that is smaller than the photon wavelength and that responds fast enough to the oscillations of the photon field.
  • the photon energies are collected by antenna devices provided with a rectifying element.
  • Diodes are mainly based on semiconductors, for example p-n diodes which use the potential barrier at the p-n junction, Schottky-diodes which exploit the Schottky barrier between a metal and a semiconductor and Esaki diodes which use interband-tunneling at the p-n junction. Since tunneling transport happens typically faster than electron/hole transport, diodes based on tunneling have a smaller time constant. Semiconductor-based diodes have, however, the disadvantage that they exhibit comparatively low plasma frequencies. Thus, MIM-diodes (metal-insulator-metal) show the smallest time constant.
  • a MIM-diode comprises two metal layers which are separated by an oxide layer.
  • the thickness of the oxide layer is designed such that tunneling carrier transport between the two metal layers is possible.
  • the properties of such a device are characterized by their band structure.
  • the shape of the band structure, in particular the shape of the tunnel barrier is determined by the work functions of the two metal layers, the electron affinity of the insulator, the band gap of the insulator and the valence- and conduction-band-offsets.
  • the tunneling transport should dominate in the device.
  • the insulting layer needs to exhibit an appropriate thickness.
  • Such a tunneling dominated device shows, however, the disadvantage of a small asymmetry in the I-V curve, due to the fact that a tunneling current makes a significant contribution at a reverse bias. Efficient rectifying requires, however, a high asymmetry.
  • WF work function
  • MIM diodes exhibit a rather high roughness that is in the order of the thickness of the oxide.
  • the roughness of the metallic surfaces results in a non-uniform electric field and therefore in a non-uniform tunneling current.
  • US 2013/162333 A1 discloses a MIM diode comprising a graphene layer as a first electrode, a dielectric layer and a metal layer as second electrode.
  • the dielectric layer can be made of Al 2 O 3 , HfO 2 , BN or DLC.
  • US 2015/0014630 A1 discloses a tunneling diode comprising a dielectric layer sandwiched between two layers of 2D materials, for example p- or n-doped graphene.
  • US 2016/041335 A1 discloses a rectenna comprising a dielectric layer sandwiched between two different metal layers.
  • a graphene layer can be formed between the dielectric layer and the top metal layer to improve the asymmetry of the I-V characteristic.
  • US 8 735 271 B2 discloses a gate tunable tunnel diode comprising a dielectric layer sandwiched between a graphene layer and a metal layer.
  • the graphene work function can be modulated by means of a voltage applied to a gate electrode separated from the graphene layer by means of a gate dielectric layer.
  • Object of the invention is therefore to provide an electronic device that overcomes the above-mentioned disadvantages.
  • an electronic device comprising:
  • the bias applied between the first and the second electrically conductive layers causes a carrier transport between the first and the second electrically conductive layers through said insulating layer.
  • said carrier transport is modified due to the modulation of the barrier-height of the tunneling barrier.
  • said carrier transport is electron or hole transport.
  • the carrier transport could, however, also be transport of other quasiparticles.
  • the carrier transport is dominated by a transport mechanism that is based on a tunneling and/or on thermionic emission. Thermionic emission is the thermally induced flow of charge carriers over the potential-energy barrier. This occurs because the thermal energy given to the carrier overcomes the potential-energy barrier.
  • the first electrically conductive layer consists of monolayer graphene.
  • a first electrically conductive layer comprising monolayer graphene has the advantage that the corresponding first work function may be modulated more extensively. It is, however, equally conceivable that the first electrically conductive layer consists of multilayer graphene.
  • the first and the second electrically conductive layers are provided with ohmic contacts which form electrodes for the applied bias.
  • the first electrically conductive layer comprising graphene is provided with a Ti/Au contact through standard e-beam lithography.
  • the second electrically conductive layer is grounded and a potential is applied to the first electrically conductive layer.
  • the electronic device is a two terminal diode in which the first work function and therefore said barrier-height of the tunneling barrier is modulated only by the bias applied at the two terminals.
  • the first work function has a larger value than the second work function.
  • the work function ⁇ 1 of the graphene layer has a larger value than the work function ⁇ 2 of the material of the second layer. The difference between the work functions leads to a trapezoidal barrier at zero bias.
  • the first work function ⁇ 1 of the graphene layer increases by ⁇ ⁇ , in case a positive bias is applied.
  • the effective barrier height for the current based on thermionic emission also called thermionic current, depends on the increased first work function minus the applied potential ( ⁇ 1 + ⁇ ⁇ - eV).
  • the thermionic current depends on the relative magnitude of eV and ⁇ ⁇ .
  • the condition eV ⁇ ⁇ ⁇ may be achieved. In this case, the thermionic current would be fully blocked.
  • the effective barrier height for the thermionic current is given by the first work function minus the applied potential ( ⁇ 1 -eV). For high biases, the effective barrier height reaches a minimum of ⁇ 2 . Further, the first work function ⁇ 1 of the graphene layer decreases by ⁇ ⁇ , in case a negative bias is applied.
  • the second electrically conductive layer is grounded and the potential is applied to the first electrically conductive layer.
  • the effective barrier height for the current based on thermionic emission also called thermionic current, depends on the increased first work function minus the applied potential ( ⁇ 1 - ⁇ ⁇ ).
  • the electronic device is a two terminal diode which in comparison to the conventional MIM-diode allows a higher thermionic current in forward direction.
  • Forward direction here means that a preferably electron current flows from the ground potential of the second electrically conductive layer to the first electrically conductive layer, comprising graphene. Accordingly, an electron current backward direction would mean an electron current flow from the first electrically conductive layer, comprising graphene, to the second electrically conductive layer and to the ground potential.
  • the tunneling current in the electronic device of the present invention exceeds that in the MIM structure, which renders the former type of electronic device more efficient.
  • the second electrically conductive layer consists of a metal.
  • the carrier transport is electron transport
  • such a metal could preferably be Ti, Au, Cr, Ag, Ni or an alloy comprising Ti, Au, Cr, Ag.
  • the present invention is not limited to the use of these metals/ alloys.
  • the selected metal or alloy preferably has a work function that is smaller than the work function of the first electrically conductive layer, comprising graphene.
  • the insulating layer consists of an oxide.
  • the oxide is TiO x , ZnO or graphene-oxide.
  • the TiO x is deposited on the first electrically conductive layer comprising graphene by thermal evaporation of Ti.
  • Ti is deposited on the first electrically conductive layer with an oxidation step preferably performed under ambient oxidation at the end of each cycle.
  • the insulating layer consists of a native metal oxide.
  • Native metal oxides are oxidized through contact with the ambient air rather than by contact with supplied oxygen.
  • a suitable material for this native oxidation would be Ti.
  • the insulating layer can also consist of ZnO or graphene-oxide.
  • the ZnO is deposited on the first electrically conductive layer comprising graphene by atomic layer deposition (ALD).
  • ALD atomic layer deposition
  • a graphene multilayer of the first electrically conductive layer serves as a starting point.
  • the first layers may then be oxidized through oxygen plasma.
  • the conductive layer consists preferably of a metal with a high work function such as Pd or Pt. Further, in this case as an insulating layer preferably an oxide layer is chosen which blocks electron transport. According to the invention such oxides are NiO or WO 3 .
  • the electronic device further comprises a substrate on which the first electrically conductive layer is deposited.
  • a substrate could consist of Si layer that is coated with a SiO 2 -layer.
  • the thickness of the SiO 2 -layer is in the range of 200 nm to 500 nm, more preferably the thickness of the SiO 2 is 300 nm.
  • the substrate consists of a flexible material preferably a polymer.
  • the first electrically conductive layer comprising graphene is deposited on the substrate. It would be equally conceivable that the second electrically conductive layer is deposited on the substrate.
  • the second electrically conductive layer preferably a metallic layer
  • the first electrically conductive layer comprising graphene
  • the first electrically conductive layer consists of p-doped graphene.
  • an electronic device comprising a first electrically conductive layer that consists of a monolayer graphene, a deposition of a metal, for example Ti, causes a n-doping in the graphene monolayer. Such an n-doping is undesirable, since through such n-doping the barrier height is reduced.
  • the n-doping effect might be at least partially compensated.
  • Such a p-doped graphene could be fabricated by vapor deposition of inorganic oxides, for example MoO 3 , or inorganic molecules, for example F4-TCNQ.
  • the graphene layer/s is/are exfoliated from highly oriented pyrolytic graphite (HOPG). It is also conceivable that graphene layer/s is/are grown epitaxially or produced by chemical vapor deposition.
  • HOPG highly oriented pyrolytic graphite
  • the second electrically conductive layer has a thickness in the range of 5 nm to 50 nm.
  • the conductive layer has a thickness of 25 nm.
  • the insulating layer has a thickness in the range of 1 nm to 15 nm.
  • the insulating layer has a thickness 6 nm.
  • FIG.1 schematically the structure of an electronic device (1) is displayed.
  • the electronic device (1) comprises a first electrically conductive layer (2) provided with a first work function (3), a second electrically conductive layer (4) provided with a second work function (5) and an insulating layer (6) arranged between said first electrically conductive layer (2) and said second electrically conductive layer (4).
  • a tunneling barrier (7) is formed, wherein a barrier-height (8) of the tunneling barrier (6) depends on said first (3) and second work functions (5).
  • the first electrically conductive layer (2) comprises graphene, wherein a bias applied between the first (2) and the second electrically conductive layer (4) modulates said first work function (3) and therefore said barrier-height (8) of the tunneling barrier (7).
  • a topographic AFM image of the structure is displayed in fig. 3 .
  • the first electrically conductive layer (2) may consist of a monolayer graphene or a multilayer.
  • the first (2) and the second electrically conductive layers (4) are provided with ohmic contacts which form electrodes (9, 10) for the applied bias, wherein the second electrically conductive layer (4) is grounded and a potential is applied to the first electrically conductive layer (2).
  • the graphene bottom electrode was mechanically exfoliated from highly oriented pyrolytic graphite (HOPG) onto a substrate (11).
  • the substrate (11) consists of a Si-layer (11a) and a 300 nm thick SiO 2 layer (11b).
  • the graphene layer was then provided with the ohmic contacts, consisting of Ti/Au through standard e-beam lithography followed by thermal evaporation of the metals. Subsequently, 6 nm of TiO x which form the insulating layer (6) were deposited by three subsequent cycles of thermal evaporation of 2 nm Ti, with an oxidation step performed under ambient oxidation at the end of each cycle.
  • Ti top electrodes forming the second electrically conductive layer (4), were defined on top of the TiO x insulator via standard e-beam lithography.
  • the first (2) and second electrically conductive layer (4) both contact the insulating layer.
  • the energy band diagram of the electronic device (1) is shown.
  • the energy band diagram is determined by the first work function (3) of the graphene layer (2), the second work function (5) of the metal layer (4) and the electron affinity of the insulating layer (6).
  • the work functions of graphene and Ti are 4.5 eV and 4.2 eV, respectively. Titanium thus fulfills the requirement that the first work function (3) has a larger value than the second work function (5).
  • the electron affinity of TiO 2 is -4.0 eV.
  • Fig. 4 displays the back gate dependence of the normalized resistance of the graphene channel before and after deposition of 25 nm of Ti on top.
  • a back gate could be a metallic layer underneath the SiO 2 layer (11b).
  • Fig. 4 displays a pronounced shift of the Dirac of the graphene from +5 to -40 V after deposition of the 25 nm Ti top electrode. This indicates an appreciable n-type doping of the graphene through the deposition of the Ti layer. This observation strongly supports the band alignment shown in fig. 2 .
  • the work function difference between Ti and graphene is determined by Kelvin force microscopy.
  • fig. 5a a surface potential image of the electronic device (1) is shown.
  • 5b displays a section profile along the solid line (12) in the surface potential map in fig 5a .
  • the dashed line (13) in the potential map marks the graphene sheet.
  • the scale bar (14) is 2 ⁇ m.
  • the detected potential difference of -200 meV is in reasonable agreement with the expected value of 0.3 eV.
  • the somewhat smaller experimental value can be attributed to the n-doping of the graphene by the Ti.
  • the n-doping of the graphene causes a reduction of the barrier height (8).
  • the graphene layer (2) might be provided with a p-doping.
  • fig. 6a, 6b, 6c the energy band diagram of the electronic device (1) is shown for different biases.
  • Fig. 6b displays the energy band diagram at zero bias
  • fig. 6a shows the energy band diagram at negative bias
  • fig. 6c depicts the energy band diagram at positive bias.
  • the energy band diagram is determined by the first work function (3) of the graphene layer (2), the second work function (5) of the metal layer (4) and the electron affinity of the insulating layer (6).
  • the graphene (2) and the metal layers (4) are provided with ohmic contacts which form electrodes (9, 10) for the applied bias.
  • the metal layer (4) is grounded and the potential is applied to the graphene layer (2).
  • the bias applied between the first (2) and the second electrically conductive layers (4) causes a carrier transport between the first (2) and the second electrically conductive layers (4) through said insulating layer (6).
  • the carrier transport is electron transport which is dominated by transport based on a tunneling mechanism and based on thermionic emission.
  • a thermionic current (J TH ) and a tunneling current (J T ) between the first (2) and the second electrically conductive layers (4) are the dominating currents.
  • a positive bias is applied to the electronic device.
  • the barrier height (8) between the graphene layer (2) and the insulator layer (6) depends on the applied bias in the electronic device (1), caused by the modification of the first work function (3, ⁇ 1 ) of graphene under a bias.
  • the first work function ( ⁇ 1 ) of the graphene layer (2) increases by ⁇ ⁇ , in case a positive bias is applied.
  • the effective barrier height for the thermionic current (J TH ) depends on the increased first work function minus the applied potential ( ⁇ 1 + ⁇ ⁇ - eV).
  • the thermionic current (J TH ) depends on the relative magnitude of eV and ⁇ ⁇ .
  • the condition eV ⁇ ⁇ ⁇ may be achieved. In this case, the thermionic current (J TH ) would be fully blocked.
  • first work function ⁇ 1 of the graphene layer decreases by ⁇ ⁇ , in case a negative bias is applied. This case is shown in Fig. 6c .
  • the effective barrier height for the thermionic current (J TH ) depends on the increased first work function minus the applied potential ( ⁇ 1 - ⁇ ⁇ ).
  • the effective barrier height for the thermionic current is given by the first work function minus the applied potential ( ⁇ 1 -eV). For high biases, the effective barrier height reaches a minimum of ⁇ 2 . In the negative bias regime, the barrier height for the thermionic current is ⁇ 1 , independent of the magnitude of the bias. Therefore, the thermal current is forward when a positive bias is applied. With respect to the tunneling current, it is relevant that the slope of trapezoid potential decreases upon application of a positive bias, but increases when a negative bias is applied. Accordingly, the tunneling current is forward when a negative bias is applied.
  • the electronic device according to the present invention allows a higher thermionic current (J TH ) in forward direction.
  • Forward direction here means that a preferably electron current flows from the ground potential of the second electrically conductive layer to the first electrically conductive layer, comprising graphene. Accordingly, an electron current backward direction would mean an electron current flow from the graphene layer (2) to the second electrically conductive layer (4) and to the ground potential.
  • the tunneling current in the electronic device (1) of the present invention exceeds that in the MIM-structure, which renders the former type of electronic device (1) more efficient.
  • Fig. 7 shows the I-V characteristics and the dependence of the resistance of the graphene layer (2) on the bias.
  • the I-V characteristics of the Gr-TiOx-Ti-diode (1) acquired between a four layer-thick graphene layer (2) and the metal layer (4), displays a diode-like behavior with a high current under negative bias and a low current under positive bias.
  • the current comprising the thermionic (J TH ) and tunneling currents (J T ) flows from the graphene layer (2) to the metal layer (4) under a bias applied between the graphene (2) and the metal layer (4).
  • the resistance of the graphene layer (2) measured as a function of bias applied to the metal layer (4) signifies a change in the work function of the graphene layer, confirming the operation principle outlined above. In this measurement, a small bias of 0.01 V is applied to the graphene layer (2).
  • the plot reveals a maximum asymmetry of 1800 at 1.2 V and a corresponding nonlinearity of 7.
  • the decrease of the asymmetry at higher bias is attributable to the rate of the Fermi level shift being dependent on the applied bias. Specifically, when the Fermi level is near the Dirac point, this rate is high due to the low density of states. By comparison, when the Fermi level moves away from the Dirac point, this rate decreases, such that the forward current saturates while the reverse current increases.
  • FIG. 9a the electrical characteristics of the Gr-TiOx-Ti-diodes (1) in dependence of the thickness of the graphene layer are shown. All data were acquired at room temperature.
  • Fig. 9a the I-V characteristics of two different Gr-TiOx-Ti-diodes (1) comprising a graphene bilayer and a 6 nm thick graphene sheet, are displayed.
  • fig. 9b the normalized resistance of the graphene layer (2) as a function of the Ti electrodevoltage is depicted.
  • fig. 9c the dependence of the asymmetry and the nonlinearity on the bias voltage for a Gr-TiOx-Ti-diode (1), comprising a bilayer graphene layer (2) is plotted.
  • fig. 9d the dependence of the asymmetry and the nonlinearity on the bias voltage for Gr-TiOx-Ti diode (1), comprising the 6 nm thick graphene layer (2), is plotted.
  • the initial position of the Fermi level in graphene affects the diode performance.
  • an asymmetry of up to 9000 and a nonlinearity of 8 at 1 V are observed as shown in figure 9c .
  • the on-current density is estimated to be ⁇ 0.1 A/cm 2 . This value is comparable to those reported for the best MIM-diodes realized as Nb-Nb 2 O 5 -Pt 10 and much higher than for Nb-TiO 2 -Pt diodes in which TiO x also serves as an insulator.
  • the Ti electrode acts similarly like a top gate in field-effect transistor configuration.
  • the diode performance also depends on the size of graphene area. Specifically, the performance decreases with decreasing the lateral size of the graphene sheet. This trend can be explained by an increasing influence of the Ti/Au contact, which in the smallest devices is likely to pin the Femi level of the graphene in the region below the TiOx/Ti layer.
  • FIG. 10a and 10b display the effect of temperature on the Gr-TiOx-Ti-diode (1) performance.
  • Fig. 10a depicts the I-V characteristics at different temperatures and fig. 10b the temperature dependence of the asymmetry.
  • the current decreases notably with decreasing temperature as shown in figure 10a .
  • the current is less than 10-12 A at 1.5 V. This strong temperature activation demonstrates that tunneling is not the predominant transport mechanism within the bias window of ⁇ 1.5 V.
  • the temperature dependence of the diode asymmetry exhibits a fast decrease upon cooling as displayed in fig. 10b .
  • the asymmetry should increase with decreasing temperature if the thermionic current is dominant (( ⁇ exp(( ⁇ 1 - ⁇ 2 )/k B T)).
  • This discrepancy involves the presence of trap states inside the insulating (TiO x ) layer (6), which limits the charge transport through the barrier.
  • the on-current at high negative bias increases only slowly, while the off-current at high positive bias still exponentially increases with bias ( Figure 10a ).
  • asymmetry f ASYM first increases upon increasing the bias, then reaches a maximum at a voltage of -1.1 V, and finally decreases.
  • the fact that the voltage position of the maximum shifts to higher bias upon cooling can be explained by the presence of trap states, due to which a higher bias must be applied to reach maximum current at lower temperatures.
  • An opposite trend compared to f ASYM is observed for f NL , which increases upon cooling.
  • f ASYM and f NL both at a bias of 1.2 V
  • two different exponential regimes can be discerned, indicative of two major types of current contributions.
  • the trap states emerge as the major factor that limits of the diode performance.
  • Significant reduction of the trap density might be achievable by alternative methods of depositing the insulating (TiO x ) layer (6), for instance with the aid of atomic layer deposition.
  • the high performance GrIM-diode (1) exhibits an operation principle that conceptually differs from conventional MIM diodes.
  • the key mechanism involves the bias-induced modulation of the work function of the graphene layer, which in turn alters the transport barrier height.
  • the Gr-TiOx-Ti diodes (1) reach a very high asymmetry and nonlinearity up to 9000 and 8, respectively, while maintaining a large on-current of 0.1 A/cm 2 at 1 V, rendering the devices competitive to state-of-the-art MIM diodes.
  • the thermionic (J TH ) and tunneling currents (J T ) are simultaneously enhanced upon negatively biasing the graphene layer.

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Claims (13)

  1. Elektronische Vorrichtung (1) umfassend:
    - eine erste elektrisch leitende Schicht (2), welche mit einer ersten Austrittsarbeit (3) bereitgestellt ist,
    - eine zweite elektrisch leitende Schicht (4), welche mit einer zweiten Austrittsarbeit (5) bereitgestellt ist, und
    - eine isolierende Schicht (6), welche zwischen der ersten elektrisch leitenden Schicht (2) und der zweiten elektrisch leitenden Schicht (4) angeordnet ist,
    wobei eine Tunnelbarriere (7) zwischen den ersten (2) und zweiten elektrisch leitenden Schichten (4) angeordnet ist und eine Barrierehöhe (8) der Tunnelbarriere (6) von den ersten (3) und zweiten Austrittsarbeiten (5) abhängt, wobei die erste elektrisch leitende Schicht (2) Graphen umfasst,
    wobei die elektronische Vorrichtung (1) eine Diode ist und ausgebildet ist, dass eine Vorspannung, welche zwischen den ersten (2) und den zweiten elektrisch leitenden Schichten (4) angelegt ist, einen Ladungsträgertransport zwischen den ersten (2) und den zweiten elektrisch leitenden Schichten (4) durch die isolierende Schicht (6) verursacht und die erste Austrittsarbeit (3) und dementsprechend die Barrierehöhe (8) der Tunnelbarriere (7) moduliert, wobei der Ladungsträgertransport Elektrontransport oder Lochtransport ist und wobei die isolierende Schicht (6) aus einen Oxid besteht, wobei das Oxid TiOx oder ZnO oder Graphenoxid im Fall des Elektrontransports oder das Oxid NiO oder WO3 im Fall des Lochtransports ist.
  2. Elektronische Vorrichtung (1) nach Anspruch 1, dadurch gekennzeichnet, dass der Ladungsträgertransport aufgrund der Modulation der Höhe (8) der Tunnelbarriere (7) modifiziert ist.
  3. Elektronische Vorrichtung (1) nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Ladungsträgertransport durch einen Transportmechanismus dominiert ist, welcher auf einer Tunnel- und/oder thermionischen Emission basiert.
  4. Elektronische Vorrichtung (1) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die erste elektrisch leitende Schicht (2) aus Monoschicht-Graphen oder Multischicht-Graphen besteht.
  5. Elektronische Vorrichtung (1) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die ersten (2) und die zweiten elektrisch leitenden Schichten (4) mit ohmschen Kontakten bereitgestellt sind, welche Elektroden (9, 10) für die angelegte Vorspannung ausbilden, wobei die zweite elektrisch leitende Schicht (4) zum erden geeignet ist und die erste elektrisch leitende Schicht (2) zum Erhalten eines Potentials geeignet ist.
  6. Elektronische Vorrichtung (1) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die erste Austrittsarbeit (3) einen größeren Wert als die zweite Austrittsarbeit (5) aufweist.
  7. Elektronische Vorrichtung (1) nach einem der Ansprüche 1-5, dadurch gekennzeichnet ,dass die zweite elektrisch leitende Schicht (4) aus einem Metall besteht, wobei das Metall ausgewählt ist aus Ti, Au, Cr, Ag, Ni oder einer Legierung umfassend Ti, Au, Cr, Ag, Ni, falls der Ladungsträgertransport Elektrontransport ist, wobei das Metall Pd oder Pt ist falls der Ladungsträgertransport Lochtransport ist.
  8. Elektronische Vorrichtung nach einem der vorhergehenden Ansprüche, weiter umfassend ein Substrat (11), auf welchem die erste elektrisch leitende Schicht (2) aufgebracht ist, wobei das Substrat aus einer Si-Schicht (11a) besteht, welche mit einer SiO2-Schicht (11b) beschichtet ist, oder wobei das Substrat aus einem flexiblen Material besteht.
  9. Elektronische Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die erste elektrisch leitende Schicht (2) aus p-dotierten Graphen besteht.
  10. Elektronische Vorrichtung nach Anspruch 4, dadurch gekennzeichnet, dass die Graphenschicht/Graphenschichten sich von highly oriented pyrolytic graphite (HOPG) abschält/abschälen oder mittels chemischer Gasphasenabscheidung hergestellt sind.
  11. Elektronische Vorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die zweite elektrisch leitende Schicht (4) eine Dicke aus dem Bereich 5 nm bis 50 nm und/oder die isolierende Schicht (6) eine Dicke aus dem Bereich 1 nm bis 15 nm aufweist.
  12. Elektronische Vorrichtung (1) nach Anspruch 4, dadurch gekennzeichnet, dass die erste elektrisch leitende Schicht (2) aus einem Multischicht-Graphen mit zwei oder vier Schichten besteht.
  13. Elektronische Vorrichtung (1) nach Anspruch 8, dadurch gekennzeichnet, dass das flexible Material ein Polymer ist.
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Publication number Priority date Publication date Assignee Title
US9202945B2 (en) * 2011-12-23 2015-12-01 Nokia Technologies Oy Graphene-based MIM diode and associated methods
US8735271B2 (en) * 2012-08-24 2014-05-27 International Business Machines Corporation Gate tunable tunnel diode
KR102100415B1 (ko) * 2013-07-15 2020-04-14 삼성전자주식회사 터널링 소자 및 그 제조방법
US9557480B2 (en) * 2013-11-06 2017-01-31 R.A. Miller Industries, Inc. Graphene coupled MIM rectifier especially for use in monolithic broadband infrared energy collector

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* Cited by examiner, † Cited by third party
Title
CHRIS M. CORBET ET AL: "Oxidized Titanium as a Gate Dielectric for Graphene Field Effect Transistors and Its Tunneling Mechanisms", ACS NANO, vol. 8, no. 10, 28 October 2014 (2014-10-28), US, pages 10480 - 10485, XP055497189, ISSN: 1936-0851, DOI: 10.1021/nn5038509 *

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