EP3187599B1 - Temperature control station. - Google Patents
Temperature control station. Download PDFInfo
- Publication number
- EP3187599B1 EP3187599B1 EP16203792.3A EP16203792A EP3187599B1 EP 3187599 B1 EP3187599 B1 EP 3187599B1 EP 16203792 A EP16203792 A EP 16203792A EP 3187599 B1 EP3187599 B1 EP 3187599B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact
- contact plate
- heating
- board
- temperature adjustment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010438 heat treatment Methods 0.000 claims description 37
- 230000001105 regulatory effect Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 230000001939 inductive effect Effects 0.000 claims description 2
- 238000005496 tempering Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910000851 Alloy steel Inorganic materials 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000617 Mangalloy Inorganic materials 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- PALQHNLJJQMCIQ-UHFFFAOYSA-N boron;manganese Chemical compound [Mn]#B PALQHNLJJQMCIQ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C51/00—Measuring, gauging, indicating, counting, or marking devices specially adapted for use in the production or manipulation of material in accordance with subclasses B21B - B21F
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D11/00—Arrangement of elements for electric heating in or on furnaces
- F27D11/02—Ohmic resistance heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/20—Deep-drawing
- B21D22/208—Deep-drawing by heating the blank or deep-drawing associated with heat treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/02—Stamping using rigid devices or tools
- B21D22/022—Stamping using rigid devices or tools by heating the blank or stamping associated with heat treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/16—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/62—Quenching devices
- C21D1/673—Quenching devices for die quenching
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D11/00—Process control or regulation for heat treatments
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D8/00—Modifying the physical properties by deformation combined with, or followed by, heat treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D11/00—Arrangement of elements for electric heating in or on furnaces
- F27D11/06—Induction heating, i.e. in which the material being heated, or its container or elements embodied therein, form the secondary of a transformer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D19/00—Arrangements of controlling devices
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/46—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals
- C21D9/48—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for sheet metals deep-drawing sheets
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D19/00—Arrangements of controlling devices
- F27D2019/0028—Regulation
- F27D2019/0034—Regulation through control of a heating quantity such as fuel, oxidant or intensity of current
Definitions
- the present invention relates to a tempering station having the features in the preamble of claim 1.
- the board After heating, the board is thermoformed and then cured by rapid cooling.
- Object of the present invention is therefore to improve the possibilities of contact heating of a board.
- the temperature control station for contact heating of a circuit board is used to heat it to a temperature above room temperature.
- the target temperature of the board is more than 500 ° C, most preferably more than Austenitmaschinestemperatur thus more than 700 ° C, in particular more than 900 ° C.
- the board can be partially heated, but preferably also completely.
- the temperature control station has an upper tool and a lower tool, wherein a contact plate for contact heating is provided at least on the upper tool and / or on the lower tool.
- a contact pressure is exerted on the board to be tempered or to be heated when the temperature control station is closed.
- this is closed Temperierstation exerted contact pressure now adjustable or controllable.
- the heating board can slide past due to low friction on the contact plate, but at the same time the contact pressure is adjusted or controlled so that a sufficient heat conduction from contact plate to board.
- a circuit board which has been heated free of stress can be heated in a short cycle time in a process-economical manner, whereby the wear of the contact plate as a result of thermal expansion of the circuit board is simultaneously minimized in mass production.
- the at least one contact plate is preferably formed as an elongated contact plate. This means for the purposes of the invention that this has at least one length which corresponds to twice the width. However, it is also possible, for example, to arrange a plurality of contact plates next to one another on a tool, preferably two or three elongate contact plates are arranged parallel next to one another.
- the contact pressure exerted on the board to be tempered with the tempering station closed is determined in particular as a function of the contact area between the contact plate and the board and / or the cross-sectional area of the contact plate and / or the yield strength Rp 0.2 (from the contact plate) and / or Actual temperature (the contact plate) and / or the coefficient of adhesion (coefficient of friction) between contact plate and board regulated or controlled.
- the contact pressure is regulated or controlled as a function of the following formula: p ⁇ R p 0.2 T * A Q plate A K circuit board * ⁇
- the contact pressure can also be calculated and then the tempering be adjusted so that the calculated contact pressure is applied.
- sensors may also be provided in the temperature control station and then the previously calculated contact pressure during the heating process are controlled.
- the contact pressure is preferably greater than zero.
- temper uncoated boards in particular from a steel alloy, for example a boron-manganese steel. Tempering means for the purposes of this invention significantly heating. However, it is also possible for areas to be cooled simultaneously or kept at a temperature, whereas adjacent areas are heated. However, it is also possible with the invention to temper coated circuit boards, for example with an anti-corrosion coating, in particular an aluminum-silicon coating.
- the heating of the at least one contact plate takes place in particular with one of the following heating sources.
- inductive heating so that by using an inductor, the contact plate is inductively heated and then in turn heated by heat conduction of the board.
- the contact plate can be heated by means of a burner heating.
- the contact plate is heated by a burner and thus heats the board by heat conduction.
- resistance heating it is either provided that the contact plate itself is designed as an electrical resistance and heats itself when exposed to a voltage.
- an indirect or indirect resistance heating can be carried out so that heating conductors or heating cartridges are heated due to their electrical resistance and these heat the contact plate.
- the heating of the board is again by heat conduction from the contact plate to the board.
- the contact plate itself is coupled via at least one movable bearing with the upper tool.
- this is also coupled via at least one movable bearing with the lower tool.
- An expansion of the contact plate as a result of heating this itself can thus be compensated by the floating bearing. A curvature of the contact plate is thereby avoided.
- Either the main drive of the temperature control is used only to carry out the closing movement or opening movement of the temperature control. It can also be changed in the closed state of the pressure exerted on the board contact pressure on the main drive.
- additional actuators or control units can be provided which change the contact pressure exerted on the circuit board when the temperature control station is closed.
- the temperature control is initially closed with inserted board.
- the setting as well as the regulation and / or control of the contact pressure then takes place via the actuators.
- These can be operated in particular pneumatically, electrically or hydraulically.
- the contact pressure in two at least locally adjacent regions is adjustable differently from one another.
- the contact pressure is preferably different regions controllable or controllable. If, for example, a board is not heated at certain areas or at a lower temperature than an adjacent area of the board, the contact pressure can preferably be set differently from one another in both areas that are different from one another.
- different contact plates are then provided from each other, so that preferably for each contact plate individually the contact pressure can be controlled or controlled.
- the contact pressure on a contact plate can be partially set different from each other, or it can be used a plurality of contact plates, which are adapted to a different contact pressure.
- FIG. 1 Further, a contact plate 4 is provided on the upper tool 2 and shown here in the lower tool 3 an insulating 5. It can, however, both the upper tool 2 and the lower tool 3 contact plates 4 to be arranged or on the lower tool 3, a contact plate 4 and on an upper tool 2 an insulating plate. 5
- upper tool 2 and lower tool 3 each still have a base plate 6, wherein the contact plate 4 and insulating plate 5 is fixed to the base plate 6.
- the contact plates 4 or insulating plates 5 can be exchangeably coupled, in particular releasably coupled, so that an easy conversion to different board sizes to be heated is possible. Inserted in between is a board to be heated. 7
- FIG. 2 is that out FIG. 1 shown tempering 1 closed.
- the closing movement is carried out by the lower tool 3.
- actuators 8 are provided, which raise the base plate 6 and the insulating plate 5 in this case.
- the board 7 is thus substantially full surface with its top 9 on the contact plate 4 and with its bottom 10 on the insulating plate 5 at. there is applied between the contact surface 11 of the contact plate 4 and the contact surface 12 of the insulating plate 5 and the respective top 9 and the bottom 10 of the board 7, a contact pressure p.
- the contact pressure p is the same everywhere.
- the contact pressure p can be different in regions, in particular in the case of two contact plates 4 and / or insulating plates 5, which are separate from one another and are arranged next to one another in the vertical direction.
- the contact pressure p is regulated or controlled in the closed state via the actuators 8, so that an optimum contact pressure p is applied depending on the temperature, and in particular a lengthwise extension of the circuit board 7 in the longitudinal direction L does not cause a longitudinal expansion of the contact plate 4 and / or Insulating plate 5 leads.
- the board 7 can thus perform a relative movement to the contact plate 4 due to thermal expansion in the longitudinal direction L.
- FIG. 3a to d show four different design variants of contact plates 4, 4a, 4b.
- FIGS. A, b and c each show a board 7 as a board blank, so that the area A7 of the board 7 is smaller than the area A4 of the contact plate 4, 4a, 4b.
- the design variant according to FIG. 3a shows a contact plate 4, which has a corresponding area A4 of the contact plate 4. In particular, the length L4 of the contact plate 4 is greater than the width B4 of the contact plate.
- two contact plates 4a and 4b are provided. These each also have an area A4a or A4b.
- Figure 3c are also two contact plates 4a and 4b provided.
- a respective length extension of the board 7 in the longitudinal direction L is compensated according to the invention such that it performs a relative movement in the longitudinal direction L to the contact plate 4 / the contact plates 4a, 4b. Also, in all embodiments mentioned in this document, a relative movement in the transverse direction Q take place.
- a contact plate 4 is shown, on which two boards 7a and 7b rest simultaneously. These have an area A7a and A7b.
- Such boards 7a, 7b are used in particular for the production of door impact beams.
- two boards 7a, 7b can be tempered simultaneously in the tempering station according to the invention.
- the contact plate is formed of two contact plates 4a and 4b as resistance heating, so that a voltage can be applied via the connection of electrical poles 13, so that the contact plates 4a, 4b heat themselves.
- An electrical connection 14 ensures a flow of current through the contact plates 4a, 4b. Are placed two boards 7a, 7b.
- FIG. 5 shows the contact plate 4 in side view.
- the storage takes place on one side with a fixed bearing 15 and on the opposite side with a floating bearing 16, so that due to the Festloslagerverbunds a longitudinal extension of the contact plate 4 is also made possible in the longitudinal direction L as a result of thermal heating.
- FIG. 6 shows a contact plate 4 with an attached board 7. Good to see here is the cross-sectional area AQ plate and the surface AK board . Between the board 7 and the contact plate 4 is then a coefficient ⁇ . Illustrated by way of example is the contact pressure p, which according to the invention by pressing the contact plate 4 to another contact plate 4, not shown, or an insulating plate 5, in particular under integration of the board 7, is formed.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Heat Treatment Of Articles (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Control Of Resistance Heating (AREA)
Description
Die vorliegende Erfindung betrifft eine Temperierstation mit den Merkmalen im Oberbegriff von Patentanspruch 1.The present invention relates to a tempering station having the features in the preamble of
Aus dem Stand der Technik ist die Warmumform- und Presshärtetechnologie bekannt. Hierbei werden Platinen zumindest bereichsweise, insbesondere vollständig auf eine Temperatur über Austenitisierungstemperatur erwärmt. Diese Temperaturen liegen je nach verwendeter Stahllegierung bei ca. 700°C, in der Regel 900°C oder höher.From the prior art, hot forming and press hardening technology is known. Here, boards are at least partially, in particular completely heated to a temperature above Austenitisierungstemperatur. Depending on the steel alloy used, these temperatures are around 700 ° C, usually 900 ° C or higher.
Nach der Erwärmung wird die Platine im warmen Zustand umgeformt und wiederum anschließend durch schnelles Abkühlen gehärtet.After heating, the board is thermoformed and then cured by rapid cooling.
Aus dem Stand der Technik sind zum Erwärmen einer solchen Platine verschiedene Methoden bekannt. Oftmals werden Durchlauföfen verwendet.From the prior art, various methods are known for heating such a board. Often, continuous ovens are used.
In letzter Zeit sind jedoch vermehrt Temperierstationen mit Kontakterwärmung bekannt geworden. Hierzu wird mindestens einseitig eine Kontaktplatte auf den zu erwärmenden Bereich der Platine bzw. auf die gesamte Platine aufgebracht und die Wärme der Kontaktplatte mittels Wärmeleitung an die Platine abgegeben. In Folge der Erwärmung dehnt sich die Platine insbesondere in Parallelrichtung zu der Oberfläche der Kontaktplatte aus. Aufgrund des Anlagenkontaktes mit der Kontaktplatte führt diese thermische Ausdehnung in der Großserienherstellung zu einer plastischen Verformung der Kontaktplatte. Ferner werden zumindest im Bereich der Oberfläche der zu erwärmenden Platine Spannungen eingebracht. Aus der vorangemeldeten, jedoch nachveröffentlichten
Ferner sind aus der
Aufgabe der vorliegenden Erfindung ist es daher, die Möglichkeiten der Kontakterwärmung einer Platine zu verbessern.Object of the present invention is therefore to improve the possibilities of contact heating of a board.
Die zuvor genannte Aufgabe wird mit einer Temperierstation zur Kontakterwärmung einer Platine mit den Merkmalen im Patentanspruch 1 gelöst.The above object is achieved with a tempering for contact heating of a board with the features in
Vorteilhafte Ausgestaltungen der Erfindung sind in den abhängigen Patentansprüchen beschrieben.Advantageous embodiments of the invention are described in the dependent claims.
Die Temperierstation zur Kontakterwärmung einer Platine wird eingesetzt, um diese auf eine Temperatur oberhalb der Raumtemperatur zur erwärmen. Insbesondere beträgt die Zieltemperatur der Platine mehr als 500°C, ganz besonders bevorzugt mehr als Austenitisierungstemperatur mithin mehr als 700°C, insbesondere mehr als 900°C. Die Platine kann bereichsweise erwärmt werden, aber bevorzugt auch vollständig.The temperature control station for contact heating of a circuit board is used to heat it to a temperature above room temperature. In particular, the target temperature of the board is more than 500 ° C, most preferably more than Austenitisierungstemperatur thus more than 700 ° C, in particular more than 900 ° C. The board can be partially heated, but preferably also completely.
Hierzu weist die Temperierstation ein Oberwerkzeug und ein Unterwerkzeug auf, wobei mindestens an dem Oberwerkzeug und/oder an dem Unterwerkzeug eine Kontaktplatte zur Kontakterwärmung vorgesehen ist. Nach Einlegen der Platine werden Oberwerkzeug und Unterwerkzeug geschlossen, so dass auf die zu temperierende bzw. zu erwärmende Platine ein Kontaktdruck bei geschlossener Temperierstation ausgeübt wird. Erfindungsgemäß ist dieser bei geschlossener Temperierstation ausgeübte Kontaktdruck nunmehr regelbar oder steuerbar. Hierdurch ist es erfindungsgemäß möglich, dass die Haftreibung zwischen zu erwärmender Platine und Kontaktplatte durch die Regelung oder Steuerung derart optimiert bzw. minimiert werden kann, dass eine in Folge der Kontakterwärmung auftretende Längen- bzw. Breitenänderung der Platine nicht zu einer Längenänderung bzw. einem irreversiblen Wachstum der Kontaktplatte führt.For this purpose, the temperature control station has an upper tool and a lower tool, wherein a contact plate for contact heating is provided at least on the upper tool and / or on the lower tool. After inserting the board, upper tool and lower tool are closed, so that a contact pressure is exerted on the board to be tempered or to be heated when the temperature control station is closed. According to the invention this is closed Temperierstation exerted contact pressure now adjustable or controllable. This makes it possible according to the invention that the static friction between board to be heated and contact plate can be optimized or minimized by the regulation or control such that a length or width change of the board occurring as a result of the contact heating does not lead to a change in length or irreversible Growth of the contact plate leads.
Mithin kann die sich erwärmende Platine aufgrund geringer Haftreibung an der Kontaktplatte vorbeigleiten, wobei jedoch gleichzeitig der Kontaktdruck so eingeregelt oder gesteuert wird, dass eine hinreichende Wärmeleitung von Kontaktplatte zu Platine erfolgt. Als erfindungsgemäßer Vorteil ist eine spannungsfrei erwärmte Platine verfahrensökonomisch in kurzer Taktzeit erwärmbar, wobei gleichzeitig in der Großserienproduktion der Verschleiß der Kontaktplatte in Folge von Wärmeausdehnung der Platine minimiert wird.Consequently, the heating board can slide past due to low friction on the contact plate, but at the same time the contact pressure is adjusted or controlled so that a sufficient heat conduction from contact plate to board. As a benefit according to the invention, a circuit board which has been heated free of stress can be heated in a short cycle time in a process-economical manner, whereby the wear of the contact plate as a result of thermal expansion of the circuit board is simultaneously minimized in mass production.
Die mindestens eine Kontaktplatte ist bevorzugt als längliche Kontaktplatte ausgebildet. Dies bedeutet im Sinne der Erfindung, dass diese mindestens eine Länge aufweist, die dem Zweifachen der Breite entspricht. Es können jedoch beispielsweise auch mehrere Kontaktplatten an einem Werkzeug nebeneinander angeordnet werden, bevorzugt werden zwei oder drei längliche Kontaktplatten parallel nebeneinander angeordnet.The at least one contact plate is preferably formed as an elongated contact plate. This means for the purposes of the invention that this has at least one length which corresponds to twice the width. However, it is also possible, for example, to arrange a plurality of contact plates next to one another on a tool, preferably two or three elongate contact plates are arranged parallel next to one another.
Der bei geschlossener Temperierstation auf die zu temperierende Platine ausgeübte Kontaktdruck wird im Rahmen der Erfindung insbesondere in Abhängigkeit der Kontaktfläche zwischen Kontaktplatte und Platine und/oder der Querschnittsfläche der Kontaktplatte und/oder der Dehngrenze Rp0,2 (von der Kontaktplatte) und/oder der Ist-Temperatur (der Kontaktplatte) und/oder dem Haftbeiwert (Reibungskoeffizient) zwischen Kontaktplatte und Platine geregelt oder gesteuert. Besonders bevorzugt wird der Kontaktdruck in Abhängigkeit der nachfolgenden Formel geregelt oder gesteuert:
Der Kontaktdruck kann jedoch auch berechnet werden und dann die Temperierstation so eingestellt werden, dass der berechnete Kontaktdruck anliegt. Es können jedoch auch in der Temperierstation Sensoren vorgesehen sein und dann der vorher berechnete Kontaktdruck während des Erwärmungsvorganges geregelt werden. Der Kontaktdruck ist bevorzugt größer null.However, the contact pressure can also be calculated and then the tempering be adjusted so that the calculated contact pressure is applied. However, sensors may also be provided in the temperature control station and then the previously calculated contact pressure during the heating process are controlled. The contact pressure is preferably greater than zero.
Somit ist es möglich, unbeschichtete Platinen, insbesondere aus einer Stahllegierung, beispielsweise einem Bor-Mangan-Stahl, zu temperieren. Temperieren bedeutet im Sinne dieser Erfindung maßgeblich Erwärmen. Es können jedoch auch gleichzeitig Bereiche gekühlt werden oder aber auf einer Temperatur gehalten werden, wohingegen benachbarte Bereiche erwärmt werden. Es ist jedoch mit der Erfindung ebenfalls möglich, beschichtete Platinen, beispielsweise mit einer Antikorrosionsbeschichtung, insbesondere einer Aluminium-Silizium-Beschichtung, zu temperieren.Thus, it is possible to temper uncoated boards, in particular from a steel alloy, for example a boron-manganese steel. Tempering means for the purposes of this invention significantly heating. However, it is also possible for areas to be cooled simultaneously or kept at a temperature, whereas adjacent areas are heated. However, it is also possible with the invention to temper coated circuit boards, for example with an anti-corrosion coating, in particular an aluminum-silicon coating.
Die Erwärmung der mindestens einen Kontaktplatte erfolgt insbesondere mit einer der nachfolgend benannten Erwärmungsquellen. Als induktive Erwärmung, so dass durch Einsatz eines Induktors die Kontaktplatte induktiv erwärmt wird und dann wiederum mittels Wärmeleitung die Platine erwärmt. Auch kann die Kontaktplatte mittels einer Brennererwärmung erwärmt werden. So wird auf der der Platine abgewandten Seite die Kontaktplatte durch einen Brenner erwärmt und erwärmt so die Platine durch Wärmeleitung. Ebenfalls ist es möglich, die Erwärmung als Widerstandserwärmung durchzuführen. Hierzu ist entweder vorgesehen, dass die Kontaktplatte selbst als elektrischer Widerstand ausgebildet ist und sich bei Beaufschlagen mit einer Spannung selbst erwärmt. Auch kann jedoch eine mittelbare oder indirekte Widerstandserwärmung ausgeführt werden, so dass Heizleiter oder Heizkartuschen aufgrund ihres elektrischen Widerstands erwärmt werden und diese die Kontaktplatte erwärmen. Die Erwärmung der Platine erfolgt wiederum durch Wärmeleitung von der Kontaktplatte an die Platine.The heating of the at least one contact plate takes place in particular with one of the following heating sources. As inductive heating, so that by using an inductor, the contact plate is inductively heated and then in turn heated by heat conduction of the board. Also, the contact plate can be heated by means of a burner heating. Thus, on the side facing away from the board, the contact plate is heated by a burner and thus heats the board by heat conduction. It is also possible to carry out the heating as resistance heating. For this purpose, it is either provided that the contact plate itself is designed as an electrical resistance and heats itself when exposed to a voltage. However, an indirect or indirect resistance heating can be carried out so that heating conductors or heating cartridges are heated due to their electrical resistance and these heat the contact plate. The heating of the board is again by heat conduction from the contact plate to the board.
Die Kontaktplatte selbst ist über mindestens ein Loslager mit dem Oberwerkzeug gekoppelt. Im Falle einer Kontaktplatte, die mit dem Unterwerkzeug gekoppelt ist, ist diese ebenfalls über mindestens ein Loslager mit dem Unterwerkzeug gekoppelt. Eine Ausdehnung der Kontaktplatte in Folge der Erwärmung dieser selbst kann somit durch das Loslager kompensiert werden. Eine Krümmung der Kontaktplatte wird dadurch vermieden.The contact plate itself is coupled via at least one movable bearing with the upper tool. In the case of a contact plate which is coupled to the lower tool, this is also coupled via at least one movable bearing with the lower tool. An expansion of the contact plate as a result of heating this itself can thus be compensated by the floating bearing. A curvature of the contact plate is thereby avoided.
Damit nunmehr der bei geschlossener Temperierstation auf die zu erwärmende Platine ausgeübte Kontaktdruck im Zuge der Regelung oder Steuerung veränderbar ist, kann dies auf zwei bevorzugte Weisen erfolgen.In order that the contact pressure exerted on the board to be heated when the temperature control station is closed can then be changed in the course of regulation or control, this can be done in two preferred ways.
Entweder wird der Hauptantrieb der Temperierstation genutzt nur zur Ausführung der Schließbewegung bzw. Öffnungsbewegung der Temperierstation. Es kann auch im geschlossenen Zustand der auf die Platine ausgeübte Kontaktdruck über den Hauptantrieb verändert werden. Ergänzend oder alternativ können zusätzliche Aktoren oder Steuereinheiten vorgesehen sein, die den auf die Platine bei geschlossener Temperierstation ausgeübten Kontaktdruck verändern. Somit wird die Temperierstation zunächst bei eingelegter Platine geschlossen. Die Einstellung sowie die Regelung und/oder Steuerung des Kontaktdruckes erfolgt dann über die Aktoren. Diese können insbesondere pneumatisch, elektrisch oder hydraulisch betrieben sein.Either the main drive of the temperature control is used only to carry out the closing movement or opening movement of the temperature control. It can also be changed in the closed state of the pressure exerted on the board contact pressure on the main drive. In addition or as an alternative, additional actuators or control units can be provided which change the contact pressure exerted on the circuit board when the temperature control station is closed. Thus, the temperature control is initially closed with inserted board. The setting as well as the regulation and / or control of the contact pressure then takes place via the actuators. These can be operated in particular pneumatically, electrically or hydraulically.
In einer weiteren bevorzugten Ausgestaltungsvariante der Erfindung ist der Kontaktdruck in zwei mindestens örtlich benachbarten Bereichen voneinander verschieden einstellbar. Bevorzugt ist somit der Kontaktdruck bereichsweise verschiedenen regelbar oder steuerbar. Wird eine Platine beispielsweise bereichsweise gar nicht erwärmt oder auf eine geringere Temperatur als ein demgegenüber benachbarter Bereich der Platine, so kann bevorzugt in beiden voneinander verschiedenen Bereichen der Kontaktdruck voneinander verschieden eingestellt werden. Insbesondere sind dann voneinander verschiedene Kontaktplatten vorgesehen, so dass bevorzugt für jede Kontaktplatte individuell der Kontaktdruck einregelbar oder steuerbar ist. Somit kann der Kontaktdruck an einer Kontaktplatte bereichsweise voneinander verschieden eingestellt werden, oder es können mehrere Kontaktplatten verwendet werden, die mit einem voneinander verschiedenen Kontaktdruck angepasst werden.In a further preferred embodiment variant of the invention, the contact pressure in two at least locally adjacent regions is adjustable differently from one another. Thus, the contact pressure is preferably different regions controllable or controllable. If, for example, a board is not heated at certain areas or at a lower temperature than an adjacent area of the board, the contact pressure can preferably be set differently from one another in both areas that are different from one another. In particular, different contact plates are then provided from each other, so that preferably for each contact plate individually the contact pressure can be controlled or controlled. Thus, the contact pressure on a contact plate can be partially set different from each other, or it can be used a plurality of contact plates, which are adapted to a different contact pressure.
Weitere Vorteile, Merkmale, Eigenschaften und Aspekte der vorliegenden Erfindung sind Bestandteil der nachfolgenden Beschreibung. Bevorzugte Ausgestaltungsvarianten werden in den schematischen Figuren dargestellt. Diese dienen dem einfachen Verständnis der Erfindung. Es zeigen:
Figur 1- die erfindungsgemäße Temperierstation im geöffneten Zustand in Seitenansicht,
Figur 2- die Temperierstation in geschlossener Ansicht aus
,Figur 1 - Figur 3a bis d
- die Kontaktplatten mit aufliegender zu erwärmender Platine in Draufsicht,
Figur 4- zwei parallel nebeneinander liegende längliche Kontaktplatten in Draufsicht,
Figur 5- eine Kontaktplatte mit Fest- und Loslager in Seitenansicht und
Figur 6- eine Darstellung der Formelzeichen.
- FIG. 1
- the tempering station according to the invention in the open state in side view,
- FIG. 2
- the temperature control station in closed view
FIG. 1 . - FIG. 3a to d
- the contact plates with overlying board to be heated in plan view,
- FIG. 4
- two parallel adjacent elongate contact plates in plan view,
- FIG. 5
- a contact plate with fixed and floating bearing in side view and
- FIG. 6
- a representation of the formula symbols.
In den Figuren werden für gleiche oder ähnliche Bauteile dieselben Bezugszeichen verwendet, auch wenn eine wiederholte Beschreibung aus Vereinfachungsgründen entfällt.In the figures, the same reference numerals are used for the same or similar components, even if a repeated description is omitted for reasons of simplicity.
Ferner weisen Oberwerkzeug 2 und Unterwerkzeug 3 jeweils noch eine Grundplatte 6 auf, wobei die Kontaktplatte 4 bzw. Isolierplatte 5 an der Grundplatte 6 befestigt ist. Insbesondere können die Kontaktplatten 4 bzw. Isolierplatten 5 austauschbar gekoppelt sein, insbesondere lösbar gekoppelt sein, so dass eine leichte Umrüstung an verschiedene zu erwärmende Platinengrößen möglich ist. Dazwischen eingelegt ist eine zu erwärmende Platine 7.Furthermore,
Gemäß
Gemäß der Ausgestaltungsvariante von
Gemäß
- 1 -1 -
- Temperierstationheating station
- 2 -2 -
- Oberwerkzeugupper tool
- 3 -3 -
- Unterwerkzeuglower tool
- 4 -4 -
- Kontaktplattecontact plate
- 4a -4a -
- Kontaktplattecontact plate
- 4b -4b -
- Kontaktplattecontact plate
- 5 -5 -
- Isolierplatteinsulation
- 6 -6 -
- Grundplattebaseplate
- 7 -7 -
- Platinecircuit board
- 7a -7a -
- Platinecircuit board
- 7b -7b -
- Platinecircuit board
- 8 -8th -
- Aktoractuator
- 9 -9 -
- Oberseite zu 7Top to 7
- 10 -10 -
- Unterseite zu 7Bottom to 7
- 11 -11 -
- Kontaktfläche zu 4Contact area to 4
- 12 -12 -
- Kontaktfläche zu 5Contact area to 5
- 13 -13 -
- elektrischer Polelectric pole
- 14 -14 -
- elektrische Verbindungelectrical connection
- 15 -15 -
- Festlagerfixed bearing
- 16 -16 -
- Loslagermovable bearing
- A4 -A4 -
- Fläche zu 4Area to 4
- A4a -A4a -
- Fläche zu 4aSurface to 4a
- A4b -A4b -
- Fläche zu 4bArea to 4b
- A7 -A7 -
- Fläche zu 7Area to 7
- A7a -A7a -
- Fläche zu 7Area to 7
- A7b -A7b -
- Fläche zu 7Area to 7
- B4 -B4 -
- Breite zu 4Width to 4
- L -L -
- Längsrichtunglongitudinal direction
- L4 -L4 -
- Länge zu 4Length to 4
- p -p -
- Kontaktdruckcontact pressure
- Q -Q -
- Querrichtungtransversely
- AKPlatine -AK board -
- Fläche zu 7Area to 7
- AQPlatte -AQ plate -
- Querschnittsfläche zu 4, 4a, 4bCross-sectional area to 4, 4a, 4b
- µ -μ -
- Haftbeiwert zwischen 4 und 7Haftbeiwert between 4 and 7
Claims (6)
- Temperature adjustment station (1) for the contact heating of a blank (7), in particular for the at least partial austenitisation of a blank (7), having an upper die (2) and a lower die (3), with at least one contact plate (4, 4a, 4b), wherein the contact pressure (p) exerted on the blank (7), the temperature of which is to be adjusted, can be regulated or can be controlled when the temperature adjustment station (1) is closed, characterised in that a contact plate (4, 4a, 4b) is coupled to the upper die (2) via at least one movable bearing (16) and/or that a contact plate (4, 4a, 4b) is coupled to the lower die (3) via at least one movable bearing (16) and that the change in the contact pressure as a result of the regulation or control is performed by the main drive of the temperature adjustment station (1) and/or that actuators (8) are provided for this.
- Temperature adjustment station according to claim 1, characterised in that the contact plate (4, 4a, 4b) is designed as an elongate contact plate, in particular the contact plate (4, 4a, 4b) has a length L which corresponds at least to 1.2 to 2 times the width (B4).
- Temperature adjustment station according to claim 1 or 2, characterised in that the contact pressure (p) is regulated or controlled depending on the contact surface and/or the cross-sectional area of the contact plate (4, 4a, 4b) and/or the yield strength of the contact plate (4, 4a, 4b) and/or the coefficient of adhesion (µ) and/or the actual temperature.
- Temperature adjustment station according to any one of claims 1 to 3, characterised in that at least one of the following heating sources: inductive heating, burner heating or resistance heating, is provided for heating the at least one contact plate (4, 4a, 4b).
- Temperature adjustment station according to the preceding claim, characterised in that, in the case of resistance heating, the contact plate (4, 4a, 4b) as electrical resistor heats itself or that the contact plate (4, 4a, 4b) can be heated via heat conductors or heating cartridges.
- Temperature adjustment station according to any one of claims 1 to 5, characterised in that the contact pressure (p) can be set differently in at least two locally adjacent regions.
Applications Claiming Priority (1)
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DE102015121842.9A DE102015121842B4 (en) | 2015-12-15 | 2015-12-15 | Method for operating a tempering station |
Publications (2)
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EP3187599A1 EP3187599A1 (en) | 2017-07-05 |
EP3187599B1 true EP3187599B1 (en) | 2018-08-08 |
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Application Number | Title | Priority Date | Filing Date |
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EP16203792.3A Active EP3187599B1 (en) | 2015-12-15 | 2016-12-13 | Temperature control station. |
Country Status (5)
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US (1) | US10369606B2 (en) |
EP (1) | EP3187599B1 (en) |
CN (1) | CN106885474B (en) |
DE (1) | DE102015121842B4 (en) |
ES (1) | ES2690742T3 (en) |
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DE102015121842B4 (en) * | 2015-12-15 | 2018-11-29 | Benteler Automobiltechnik Gmbh | Method for operating a tempering station |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US2551224A (en) * | 1947-02-24 | 1951-05-01 | Edi Holding Inc | Cold cathode triode electronic timer |
US3753798A (en) | 1969-01-25 | 1973-08-21 | Toyoda Chuo Kenkyusho Kk | Process and apparatus for the partial or localized tempering of a steel sheet-or the like stock |
JPWO2007013279A1 (en) * | 2005-07-27 | 2009-02-05 | 菊池プレス工業株式会社 | Heating apparatus and heating method |
US20110283851A1 (en) * | 2010-05-21 | 2011-11-24 | Thyssenkrupp Sofedit S.A.S. | Method and hot forming system for producing press-hardened formed components of sheet steel |
ES2609328T3 (en) * | 2010-10-05 | 2017-04-19 | Schwartz Gmbh | Procedure and oven to treat work pieces |
DE102011080528B3 (en) | 2011-08-05 | 2013-02-07 | Friedrich-Alexander-Universität Erlangen-Nürnberg | Method and tool for heat treatment of aluminum sheet material and heat treated aluminum sheet material according to such a method |
DE102013021264A1 (en) * | 2013-12-14 | 2014-07-17 | Daimler Ag | Device useful for heating of metal plates, comprises heating device which is arranged and designed for direct contact heating of portion of metal plate and comprises heated ceramic element comprising opening formed for direct contact |
DE102014101539B9 (en) * | 2014-02-07 | 2016-08-11 | Benteler Automobiltechnik Gmbh | Hot forming line and method of making hot formed sheet metal products |
DE102014006763A1 (en) * | 2014-05-08 | 2015-02-26 | Daimler Ag | Device for heating a light metal component |
DE102015101668A1 (en) * | 2015-02-05 | 2016-08-11 | Benteler Automobiltechnik Gmbh | Double falling heating and forming tool and method for producing thermoformed and press-hardened motor vehicle components |
DE102015112812A1 (en) * | 2015-08-04 | 2017-02-09 | Benteler Automobiltechnik Gmbh | Apparatus and method for the partial tempering of metal components |
DE102015121842B4 (en) * | 2015-12-15 | 2018-11-29 | Benteler Automobiltechnik Gmbh | Method for operating a tempering station |
-
2015
- 2015-12-15 DE DE102015121842.9A patent/DE102015121842B4/en active Active
-
2016
- 2016-12-13 EP EP16203792.3A patent/EP3187599B1/en active Active
- 2016-12-13 ES ES16203792.3T patent/ES2690742T3/en active Active
- 2016-12-14 CN CN201611149050.1A patent/CN106885474B/en active Active
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ES2690742T3 (en) | 2018-11-22 |
EP3187599A1 (en) | 2017-07-05 |
DE102015121842B4 (en) | 2018-11-29 |
US10369606B2 (en) | 2019-08-06 |
US20170165731A1 (en) | 2017-06-15 |
CN106885474A (en) | 2017-06-23 |
CN106885474B (en) | 2019-03-22 |
DE102015121842A1 (en) | 2017-06-22 |
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