EP3178970B8 - Gestell zur aufnahme von ringförmigen bauteilen sowie verfahren - Google Patents

Gestell zur aufnahme von ringförmigen bauteilen sowie verfahren Download PDF

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Publication number
EP3178970B8
EP3178970B8 EP15198402.8A EP15198402A EP3178970B8 EP 3178970 B8 EP3178970 B8 EP 3178970B8 EP 15198402 A EP15198402 A EP 15198402A EP 3178970 B8 EP3178970 B8 EP 3178970B8
Authority
EP
European Patent Office
Prior art keywords
mounting
frame
annular components
annular
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15198402.8A
Other languages
English (en)
French (fr)
Other versions
EP3178970A1 (de
EP3178970B1 (de
Inventor
Józef Kusnierz
Joanna PROCELEWSKA
Robert Krautwald
Bertram Haag
Milan Madron
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kamaf SC
Schaeffler Technologies AG and Co KG
Original Assignee
Schaeffler Technologies AG and Co KG
Kamaf SC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schaeffler Technologies AG and Co KG, Kamaf SC filed Critical Schaeffler Technologies AG and Co KG
Priority to HUE15198402A priority Critical patent/HUE039958T2/hu
Priority to EP15198402.8A priority patent/EP3178970B8/de
Priority to PCT/DE2016/200574 priority patent/WO2017097300A1/de
Priority to CN201680069409.6A priority patent/CN108291322B/zh
Priority to KR1020187015824A priority patent/KR102642760B1/ko
Publication of EP3178970A1 publication Critical patent/EP3178970A1/de
Publication of EP3178970B1 publication Critical patent/EP3178970B1/de
Application granted granted Critical
Publication of EP3178970B8 publication Critical patent/EP3178970B8/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • C25D17/08Supporting racks, i.e. not for suspending
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005Contacting devices
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04Electroplating with moving electrodes
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/04Tubes; Rings; Hollow bodies
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/10Bearings
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02Electroplating of selected surface areas
    • C25D5/022Electroplating of selected surface areas using masking means
EP15198402.8A 2015-12-08 2015-12-08 Gestell zur aufnahme von ringförmigen bauteilen sowie verfahren Active EP3178970B8 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
HUE15198402A HUE039958T2 (hu) 2015-12-08 2015-12-08 Állvány gyûrû alakú alkatrészek felvételére, valamint eljárás
EP15198402.8A EP3178970B8 (de) 2015-12-08 2015-12-08 Gestell zur aufnahme von ringförmigen bauteilen sowie verfahren
PCT/DE2016/200574 WO2017097300A1 (de) 2015-12-08 2016-12-01 Gestell zur aufnahme von ringförmigen bauteilen sowie verfahren
CN201680069409.6A CN108291322B (zh) 2015-12-08 2016-12-01 用于容纳环形的构件的托架和方法
KR1020187015824A KR102642760B1 (ko) 2015-12-08 2016-12-01 환형 부품 수용용 래크, 그리고 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15198402.8A EP3178970B8 (de) 2015-12-08 2015-12-08 Gestell zur aufnahme von ringförmigen bauteilen sowie verfahren

Publications (3)

Publication Number Publication Date
EP3178970A1 EP3178970A1 (de) 2017-06-14
EP3178970B1 EP3178970B1 (de) 2018-06-27
EP3178970B8 true EP3178970B8 (de) 2019-04-03

Family

ID=54838212

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15198402.8A Active EP3178970B8 (de) 2015-12-08 2015-12-08 Gestell zur aufnahme von ringförmigen bauteilen sowie verfahren

Country Status (5)

Country Link
EP (1) EP3178970B8 (de)
KR (1) KR102642760B1 (de)
CN (1) CN108291322B (de)
HU (1) HUE039958T2 (de)
WO (1) WO2017097300A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5301993B2 (ja) 2005-08-12 2013-09-25 モジュメタル エルエルシー 組成変調複合材料及びその形成方法
CN102639758B (zh) 2009-06-08 2016-05-18 莫杜美拓有限公司 用于防腐蚀的电镀纳米叠层涂层和包层
BR112015022235A2 (pt) 2013-03-15 2017-07-18 Modumetal Inc revestimentos nanolaminados
EA201500949A1 (ru) 2013-03-15 2016-02-29 Модьюметл, Инк. Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие
EP2971266A4 (de) 2013-03-15 2017-03-01 Modumetal, Inc. Verfahren und vorrichtung zum kontinuierlichen auftragen von nanolaminierten metallbeschichtungen
CN106794673B (zh) 2014-09-18 2021-01-22 莫杜美拓有限公司 通过电沉积和添加制造工艺制备制品的方法
CA2961508C (en) 2014-09-18 2024-04-09 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
AR109584A1 (es) 2016-09-08 2018-12-26 Modumetal Inc Procesos para proveer recubrimientos laminados sobre piezas de trabajo, y los artículos que se obtienen con los mismos
WO2018195516A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
EP3540098A3 (de) * 2018-03-16 2019-11-06 Airbus Defence and Space GmbH Vorrichtung und verfahren zur kontinuierlichen metallisierung eines objekts
US11519093B2 (en) 2018-04-27 2022-12-06 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN109518241B (zh) * 2018-12-27 2020-08-14 中国电子科技集团公司第二研究所 活塞环电镀生产线的自动上下料及储料方法
CN110438537B (zh) * 2019-08-09 2021-10-01 常州大学 一种高通量换热管及其制备方法和应用
KR20220081494A (ko) 2020-12-09 2022-06-16 이강찬 규조토 우산 케이스
CN112647112B (zh) * 2020-12-15 2021-12-14 杭州富阳鸿日电器有限公司 电子材料表面电镀处理设备及其电镀处理方法
CN113073370B (zh) * 2021-03-31 2022-04-15 成都文亿辉科技有限公司 一种利用铝合金微弧氧化处理导辊的固定装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001073198A (ja) * 1999-07-01 2001-03-21 Sumitomo Special Metals Co Ltd 電気めっき用装置および該装置を用いた電気めっき方法
DE10309401B4 (de) * 2003-03-04 2006-02-09 Vacuumschmelze Gmbh & Co. Kg Vorrichtung und Verfahren zu Beschichtung von Gegenständen
EP1493847A3 (de) * 2003-07-04 2008-10-01 Seiko Epson Corporation Plattierungswerkzeug, Plattierungsverfahren, Elektroplattierungsvorrichtung, plattiertes Produkt und Verfahren zu dessen Herstellung
US7498062B2 (en) * 2004-05-26 2009-03-03 Wd Media, Inc. Method and apparatus for applying a voltage to a substrate during plating
DE102008020499A1 (de) * 2008-04-23 2009-10-29 Leistchamm Beteiligungen Ag Lackbeschichtungsvorrichtung und Verfahren zur Lackbeschichtung von Maschinenelementen
CN201268728Y (zh) * 2008-08-04 2009-07-08 张嘉宏 一种电镀挂具
KR101230433B1 (ko) 2012-07-05 2013-02-06 삼현도금 주식회사 전기도금설비의 지그 스윙장치

Also Published As

Publication number Publication date
HUE039958T2 (hu) 2019-02-28
WO2017097300A1 (de) 2017-06-15
EP3178970A1 (de) 2017-06-14
KR20180090278A (ko) 2018-08-10
CN108291322B (zh) 2021-07-30
EP3178970B1 (de) 2018-06-27
CN108291322A (zh) 2018-07-17
KR102642760B1 (ko) 2024-03-05

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