Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q1/00—Details of, or arrangements associated with, antennas
  • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
  • H01Q1/425—Housings not intimately mechanically associated with radiating elements, e.g. radome comprising a metallic grid
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F03—MACHINES OR ENGINES FOR LIQUIDS; WIND, SPRING, OR WEIGHT MOTORS; PRODUCING MECHANICAL POWER OR A REACTIVE PROPULSIVE THRUST, NOT OTHERWISE PROVIDED FOR
  • F03D—WIND MOTORS
  • F03D1/00—Wind motors with rotation axis substantially parallel to the air flow entering the rotor 
  • F03D1/06—Rotors
  • F03D1/0608—Rotors characterised by their aerodynamic shape
  • F03D1/0633—Rotors characterised by their aerodynamic shape of the blades
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q1/00—Details of, or arrangements associated with, antennas
  • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
  • H01Q1/422—Housings not intimately mechanically associated with radiating elements, e.g. radome comprising two or more layers of dielectric material
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
  • H01Q15/0006—Devices acting selectively as reflecting surface, as diffracting or as refracting device, e.g. frequency filtering or angular spatial filtering devices
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/038—Textiles
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
  • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
  • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
  • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
  • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/70—Wind energy
  • Y02E10/72—Wind turbines with rotation axis in wind direction

Definitions

• the present invention relates to a method for producing a composite wall and to the associated composite wall.
• the invention is particularly suitable for antenna protection radomes and wind turbine blades.
• the invention finds a particularly advantageous application for improving the electromagnetic transparency of dielectric composite materials used in the manufacture of radomes and blades of wind turbines.
• This radome is a dielectric composite material envelope, of sufficient thickness to protect the antenna and which must be transparent to the electromagnetic waves corresponding to the protected antennas.
• the same quality of transparency is desired on certain wind turbine blades in order to reduce their disturbances in the operation of nearby radars.
• the wind turbine blade generally hollow, consists of a dielectric composite material wall.
• the only solution to obtain the electromagnetic transparency without modifying the materials or the thicknesses is the use of conductive circuits with periodic patterns of adaptation.
• the solutions described consist in producing these circuits on a flexible support by chemical etching techniques (printed circuit).
• the flexible dielectric support is usually of the order of 0.1 mm thick made of polyimide material, polyester or epoxy glass.
• the thickness of the copper circuit is a few tens of microns.
• This type of circuit can also be used to give the radome band-pass filtering properties to, for example, improve its out-of-band stealth. It can also be used to allow anti-icing of the structure by circulating a continuous or low-frequency current in the metal circuit in order to heat the wall.
• the conductive patterns are not necessarily periodic and the composite material is not necessarily transparent. Indeed, this anti-icing can also be applied to antenna reflectors made of carbon composite or other materials.
• the dielectric wall is often made of composite material, for example glass or quartz / resin type (eg polyester, epoxy, etc.).
• the mechanical properties of the material can be degraded by the presence of the flexible printed circuit. Indeed, only the bonding on both sides of the printed circuit ensures the cohesion of the assembly.
• a large number of holes with a maximum surface area are usually practiced in the flexible support without disturbing the metallic patterns.
• the diagram of FIG. 1 reveals the state of the art for an example of a circuit with periodic metallic patterns comprising continuous wires 11 and crosses 12 on which a maximum of holes 13 have been made in the support 14.
• the cohesion between the two faces is thus partially restored if the percentage of perforated surface is important.
• the possible percentage depends on the shape of the metal patterns used and it is not always possible to exceed 50%.
• the present invention intends to overcome the disadvantages of the prior art by proposing to replace the conductive circuit with periodic patterns made in printed circuit by a conductive circuit obtained by the deposition of a conductive ink in screen printing or inkjet on a support of porous veil type.
• the present invention relates to a method for producing a composite wall comprising a porous web extending in the thickness of said composite wall, the method comprising a step of depositing a conductive ink on said porous web according to a predetermined mesh capable of conferring on said composite wall particular properties, electromagnetic transparency, electromagnetic filtering and / or deicing.
• the invention makes it possible to eliminate the need for drilling the support and to preserve the mechanical properties of the composite material.
• the circuit produced has a high tolerance to bending and deformations to safely handle surfaces of several tens of m 2 .
• the supple nature of the support also gives a better tolerance to laying on non-developable surfaces.
• the circuit is integrated in a method of manufacturing a composite wall by molding and injection of resin.
• the porosity of the support web of the conductive circuit allows the free circulation of the impregnating resin during the resin injection phase in the complete part.
• the step of depositing the conductive ink is performed by screen printing.
• the step of depositing the conductive ink is performed by ink jet.
• the step of depositing the conductive ink is carried out continuously over very long lengths. This embodiment makes it possible to realize large circuits and eliminates the problems of setting up circuits and continuity of patterns at the connections.
• the method comprises a step of depositing a dielectric ink on said porous web according to said predetermined mesh before the step of depositing said conductive ink, a deposited surface of said dielectric ink being greater than a deposited surface of said conductive ink so that said conductive ink is deposited on said dielectric ink.
• said porous web is made of polyester fibers.
• the invention relates to a composite wall made by an embodiment of the invention.
• said porous web and its conductive circuit are made of several distinct parts and the parts are assembled together by bonding and bridging by means of a conductive adhesive.
• This embodiment makes it possible to produce a wall of large size. This embodiment also limits the problems of setting up the circuits and continuity of the patterns at the connections.
• Figure 1 illustrates a printed circuit board with periodic metal patterns pierced with holes according to the state of the art
• FIG. 2 illustrates a porous web printed according to a first embodiment of the invention
• FIG. 3 illustrates a liquid resin impregnation bench of a composite wall according to one embodiment of the invention
• Figure 4 illustrates a porous web printed according to a second embodiment of the invention.
• Figure 2 shows part of a conductive circuit comprising a linear track printed on a porous web 1 6.
• the realization of the conductive circuit consists of depositing a conductive ink 15 on the porous web 1 6 in a periodic mesh suitably dimensioned to obtain the adaptation of the composite wall for which it is intended.
• the conductive circuits are obtained by the deposition of the conductive ink 15 by screen printing or by ink jet.
• the support used is a porous polyester web 16 which allows the free circulation of the liquid resin and which naturally integrates during the manufacture of the composite material. This step eliminates the need for drilling the support and keeps the mechanical properties of the composite material.
• the embodiment of the wall is shown in Figure 3 in the example of the use of a liquid resin impregnation bench.
• This embodiment consists in arranging said porous web 16 between different layers of reinforcing fibers 20 (woven or non-woven glass).
• the composite wall is made by resin transfer molding in the rigid mold (Infusion or RTM "Resin Transfer Molding" in English) without changing parameter.
• the reinforcing layers 20 are placed in a rigid heating mold having a lower portion 21 and an upper portion 22.
• a resin matrix 26 is injected 24 at a first end of the mold and sucked at a second end 25 opposite the first end.
• the dies 26 used in this process have a low viscosity to facilitate flow 27 and minimize porosity. This process makes it possible to manufacture composite parts having smooth surfaces with finite ribs.
• An exemplary embodiment has made it possible to obtain good results with a non-woven matte porous web 16 whose fibers are distributed in the plane of the sheet and maintained by a binder (called "binder" in English).
• the conductive ink corresponds, for example, to a thermoplastic or thermosetting liquid resin for printing containing conductive fillers (silver, carbon, etc.).
• the method of the invention also allows the printing of continuous circuits over very long lengths (screen printing process or inkjet Roll to Roll). This method also allows the easy assembly of circuits between them by bonding and possibly bridging by means of a conductive adhesive and thus to realize large circuits.
• the composite parts thus produced have a high tolerance to bending and deformations for safely handling assembled surfaces of several tens of m 2 .
• the supple nature of the support also gives a better tolerance to laying on non-developable surfaces.
• the invention also solves the problems of setting up the circuits and the continuity of the patterns at the connections.
• FIG. 4 shows a linear track 15 printed on an intermediate dielectric layer previously deposited on the porous web 1 6.
• the dielectric ink corresponds, for example, to a liquid thermoplastic or thermosetting resin for printing containing no conductive filler.
• the prior printing of a dielectric ink 17 on a surface slightly greater than that of the conductive patterns can improve the accuracy of pattern design.

Landscapes

• Engineering & Computer Science (AREA)
• Textile Engineering (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Fluid Mechanics (AREA)
• Life Sciences & Earth Sciences (AREA)
• Sustainable Development (AREA)
• Sustainable Energy (AREA)
• Chemical & Material Sciences (AREA)
• Combustion & Propulsion (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Manufacturing Of Printed Wiring (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Applications Claiming Priority (2)

Publications (1)

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ID=52016677

Family Applications (1)

Country Status (3)

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Family Cites Families (4)

• 2014
  • 2014-07-03 FR FR1456365A patent/FR3023420B1/fr active Active
• 2015
  • 2015-06-30 EP EP15734338.5A patent/EP3164909A1/de not_active Withdrawn
  • 2015-06-30 WO PCT/EP2015/064792 patent/WO2016001196A1/fr active Application Filing

Non-Patent Citations (2)

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