EP3147592A1 - Dampfkompressionssystem mit unterkühlung - Google Patents

Dampfkompressionssystem mit unterkühlung Download PDF

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Publication number
EP3147592A1
EP3147592A1 EP15186353.7A EP15186353A EP3147592A1 EP 3147592 A1 EP3147592 A1 EP 3147592A1 EP 15186353 A EP15186353 A EP 15186353A EP 3147592 A1 EP3147592 A1 EP 3147592A1
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EP
European Patent Office
Prior art keywords
liquid refrigerant
vapor compression
condensed liquid
compression system
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP15186353.7A
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English (en)
French (fr)
Inventor
Pavel Trnka
Paul McGahan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ademco Cz SRO
Original Assignee
Honeywell sro
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell sro filed Critical Honeywell sro
Priority to EP15186353.7A priority Critical patent/EP3147592A1/de
Publication of EP3147592A1 publication Critical patent/EP3147592A1/de
Pending legal-status Critical Current

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B40/00—Subcoolers, desuperheaters or superheaters
    • F25B40/02—Subcoolers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/30—Expansion means; Dispositions thereof
    • F25B41/39—Dispositions with two or more expansion means arranged in series, i.e. multi-stage expansion, on a refrigerant line leading to the same evaporator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/04—Details of condensers
    • F25B2339/047—Water-cooled condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/16—Receivers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/24—Storage receiver heat
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/17—Control issues by controlling the pressure of the condenser
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/19—Refrigerant outlet condenser temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/25—Control of valves
    • F25B2600/2503—Condenser exit valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/25—Control of valves
    • F25B2600/2513—Expansion valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/19—Pressures
    • F25B2700/195—Pressures of the condenser
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/19—Pressures
    • F25B2700/197—Pressures of the evaporator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00—Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21—Temperatures
    • F25B2700/2117—Temperatures of an evaporator
    • F25B2700/21175—Temperatures of an evaporator of the refrigerant at the outlet of the evaporator

Definitions

  • the present disclosure relates to a vapor compression system with subcooling.
  • a heat pump such as, for instance, a residential or commercial refrigerator, freezer, or air conditioner, may use a vapor compression circuit to transport heat from a low temperature reservoir (e.g., outdoor air) to a high temperature reservoir (e.g., hydronic heating water).
  • the vapor compression circuit may be designed and/or controlled in such a way as to transport the heat with the highest possible efficiency.
  • the efficiency of the vapor compression circuit can be characterized by the ratio of the transported heat to the mechanical and/or electrical energy consumption (e.g., compressor electric power consumption) of the circuit, and this ratio can be denoted as the coefficient of performance for the heat pump.
  • the vapor compression circuit of a typical heat pump may include a liquid refrigerant receiver, which can be an accumulation vessel that holds (e.g., stores) excess liquid refrigerant present in the circuit. Holding the excess liquid refrigerant in the receiver can reduce the vapor compression circuit's sensitivity to the charge of the refrigerant (e.g., to changes in the charge of the refrigerant during operation of the circuit). Further, utilization of a liquid refrigerant receiver can simplify operation of the vapor compression circuit, and therefore simplify operation of the heat pump.
  • liquid refrigerant receiver may reduce the efficiency of the vapor compression circuit, and thereby may reduce the coefficient of performance for the heat pump.
  • the vapor-liquid equilibrium present (e.g., on the surface of the liquid held) in the liquid refrigerant receiver may reduce the efficiency and coefficient of performance of the circuit and heat pump, respectively.
  • one or more embodiments include a condenser configured to condense a refrigerant into a liquid, a liquid refrigerant receiver configured to receive the condensed liquid refrigerant, and a valve configured to adjust a pressure of the condensed liquid refrigerant before the condensed liquid refrigerant is received by the liquid refrigerant receiver to subcool the condensed liquid refrigerant.
  • a vapor compression system in accordance with the present disclosure can be (e.g., operate) more efficiently than a typical vapor compression circuit that includes (e.g., uses) a liquid refrigerant receiver, while still realizing the benefits (e.g., reduced refrigerant charge sensitivity and/or simplified operation) of the liquid refrigerant receiver.
  • a vapor compression system in accordance with the present disclosure can use (e.g. operate with and/or achieve) subcooling to increase its enthalpy gain, and therefore increase its efficiency, in combination with a liquid refrigerant receiver.
  • typical (e.g., previous) vapor compression circuits that include a liquid refrigerant receiver may not be able to operate with or achieve a significant degree of subcooling.
  • a or "a number of” something can refer to one or more such things.
  • a number of sensors can refer to one or more sensors.
  • FIG. 1 illustrates an example of a vapor compression system 100 in accordance with one or more embodiments of the present disclosure.
  • vapor compression system 100 can include a vapor compression circuit 102 and a controller 104.
  • Vapor compression circuit 102 can be part of a heat pump, such as, for instance, a residential or commercial refrigerator, freezer, or air conditioner.
  • Controller 104 can be a microcontroller integrated into the heat pump, or controller 104 can be separate from the heat pump and communicate with vapor compression circuit 102 via a wired or wireless network, as will be further described herein.
  • vapor compression circuit 102 can include a compressor 110, a condenser 112, a throttling valve 114, a liquid refrigerant receiver 116, an expansion valve 118, and an evaporator 120.
  • Controller 104 can operate (e.g., control the operation of) throttling valve 114 and expansion valve 118, as will be further described herein.
  • a refrigerant can flow (e.g., circulate and/or cycle) through vapor compression circuit 102 in a counterclockwise direction, as indicated in Figure 1 .
  • the refrigerant can enter compressor 110 as a superheated vapor.
  • Compressor 110 can compress the refrigerant to a higher pressure.
  • the hot, compressed vapor can then flow (e.g., be routed) to condenser 112. That is, condenser 112 can be downstream from compressor 110 in vapor compression circuit 102, as illustrated in Figure 1 .
  • Condenser 112 can condense (e.g., cool) the refrigerant (e.g., superheated) vapor into a liquid.
  • condenser 112 can include a coil or tubes, and condenser 112 can condense the refrigerant vapor into a liquid by flowing the refrigerant through the coil or tubes while flowing cool water or cool air across the coil or tubes, such that heat from the refrigerant is carried away by the water or air.
  • the condensed liquid refrigerant can then flow through throttling valve 114 and be received by (e.g., input into) liquid refrigerant receiver 116. That is, throttling valve 114 can be located between condenser 112 and liquid refrigerant receiver 116 (e.g., downstream from condenser 112 and upstream from liquid refrigerant receiver 116) in vapor compression circuit 102, as illustrated in Figure 1 .
  • Liquid refrigerant receiver 116 can be a pressure accumulation vessel that holds (e.g., stores) excess liquid refrigerant present in vapor compression circuit 102. By holding the excess liquid refrigerant, receiver 116 can adjust (e.g., minimize) the active charge of the refrigerant, which can reduce the sensitivity of vapor compression circuit 102 to the refrigerant charge (e.g., to changes in the charge of the refrigerant during operation of the circuit).
  • Liquid refrigerant receiver 116 can include an upstream port through which the condensed liquid refrigerant enters (e.g., is input), and a downstream port through which the condensed liquid refrigerant exits (e.g., is output).
  • the upstream port can have a nozzle to promote mixing and heat exchange of the input refrigerant within a vapor region, and the downstream port can have a pipe reaching to the bottom of a liquid region.
  • throttling valve 114 can adjust (e.g., decrease) the pressure of the condensed liquid refrigerant to subcool (e.g., remove heat from) the condensed liquid refrigerant. That is, controller 104 can operate (e.g., adjust) throttling valve 114 to adjust the pressure of the condensed liquid refrigerant to subcool the condensed liquid refrigerant.
  • Throttling valve 114 can be any type of valve that can obstruct the flow of the condensed liquid refrigerant to adjust (e.g., decrease) its pressure.
  • throttling valve 114 can be a modulating electronic throttling valve.
  • the subcooling of the condensed liquid refrigerant can refer to the refrigerant being cooled to a temperature below its saturation temperature, and/or to the amount (e.g., number of degrees) by which the condensed liquid refrigerant is subcooled (e.g., the magnitude of the temperature drop of the condensed liquid refrigerant).
  • the amount by which the condensed liquid refrigerant is subcooled can correspond to the difference between a condensing temperature and the temperature of the liquid refrigerant before reaching throttling valve 114.
  • the condensing temperature can refer to the temperature at which the refrigerant changes from gas to liquid in condenser 112.
  • the subcooling may take place in condenser 112.
  • the superheated refrigerant entering condenser 112 may first be desuperheated to saturated vapor, then condensed to saturated liquid, and then subcooled.
  • the desuperheating, condensing, and subcooling may take place in different parts of condenser 112.
  • Subcooling the condensed liquid refrigerant can increase the efficiency of vapor compression circuit 102 (e.g., the efficiency of the heat pump that includes circuit 102).
  • subcooling the condensed liquid refrigerant can increase the coefficient of performance of vapor compression circuit 102 (e.g., the ratio of the amount of heat transported by compression circuit 102 to the mechanical and/or electrical energy consumption of the circuit).
  • This efficiency increase can be, for example, in the range of 5-10% (e.g., vapor compression circuit 102 can operate 5-10% more efficiently than previous vapor compression circuits).
  • throttling valve 114 can subcool the condensed liquid refrigerant by a particular (e.g., pre-determined) amount (e.g., a particular number of degrees). That is, throttling valve 114 can control the magnitude of the subcooling occurring in condenser 112. For instance, controller 104 can operate throttling valve 114 to adjust the pressure of the condensed liquid refrigerant by the amount needed to subcool the condensed liquid refrigerant by the particular amount.
  • a particular amount e.g., a particular number of degrees
  • the particular amount by which the condensed liquid refrigerant is to be subcooled can be the amount that will result in the greatest possible efficiency increase for vapor compression circuity 102 (e.g., the amount that will result in optimal subcooling of the condensed liquid refrigerant).
  • the particular amount by which the condensed liquid refrigerant is to be subcooled can be the amount that will result in the greatest possible increase of the coefficient of performance of vapor compression circuit 102.
  • the coefficient of performance of vapor compression circuit 102 may initially increase as the subcooling of the condensed liquid refrigerant (e.g., the amount by which the condensed liquid refrigerant is subcooled) increases from zero (e.g., due to a fast increase in the efficiency of evaporator 120). However, once the subcooling of the condensed liquid refrigerant reaches a certain amount, the coefficient of performance of vapor compression circuit 102 may begin to decrease (e.g., due to the power consumption of compressor 110 beginning to dominate). This amount corresponds to the amount of subcooling that will result in the greatest possible efficiency increase (e.g., the greatest possible coefficient of performance increase) for vapor compression circuit 102.
  • the particular amount by which the condensed liquid refrigerant is to be subcooled can be determined by controller 104.
  • controller 104 can determine the particular amount based on the type of the refrigerant and/or the operating conditions of vapor compression circuit 102. That is, the optimal subcooling amount for the condensed liquid refrigerant can depend on the type (e.g., class) of the refrigerant (e.g., R1234yf, R410A, R134a, R717, etc.), and/or on the operating conditions (e.g., air temperature, water temperature, etc.) of vapor compression circuit 102.
  • type e.g., class
  • the refrigerant e.g., R1234yf, R410A, R134a, R717, etc.
  • the operating conditions e.g., air temperature, water temperature, etc.
  • the pressure adjustment (e.g., the magnitude of the pressure adjustment) made to the condensed liquid refrigerant by throttling valve 114 can be based (e.g., depend) on the pressure of the condensed liquid refrigerant before it flows through throttling valve 114 (e.g., the pressure of the condensed liquid refrigerant downstream from condenser 112 and upstream from throttling valve 114), and on the pressure of the condensed liquid refrigerant after it exits (e.g., downstream from) liquid refrigerant receiver 116.
  • the adjustment of throttling valve 114 made by controller 104 can be based on the pressure of the condensed liquid refrigerant before it flows through throttling valve 114 and after it exits liquid refrigerant receiver 116.
  • controller 104 can determine the adjustment to throttling valve 114 that will result in the pressure of the condensed liquid refrigerant being adjusted by the amount needed to subcool the condensed liquid refrigerant by the particular amount (e.g., the amount resulting in the greatest possible efficiency increase for vapor compression circuit 102) based on (e.g., using) the pressure of the condensed liquid refrigerant before it flows through throttling valve 114 and after it exits liquid refrigerant receiver 116, and adjust throttling valve 114 accordingly.
  • vapor compression system 100 can include pressure sensors 122-1 and 122-2, as illustrated in Figure 1 .
  • Pressure sensor 122-1 can sense the pressure of the condensed liquid refrigerant before its pressure is adjusted by throttling valve 114 (e.g., between condenser 112 and throttling valve 114), and pressure sensor 122-2 can sense the pressure of the condensed liquid refrigerant after it exits liquid refrigerant receiver 116 (e.g., between liquid refrigerant receiver 116 and expansion valve 118).
  • Controller 104 can receive the sensed pressures from sensors 122-1 and 122-2, and adjust throttling valve 114 (e.g., operate throttling valve 114 to adjust the pressure of the condensed liquid refrigerant) as needed to subcool the condensed liquid refrigerant by the particular amount based on the received pressures.
  • throttling valve 114 e.g., operate throttling valve 114 to adjust the pressure of the condensed liquid refrigerant
  • Controller 104 can communicate with throttling valve 114 and pressure sensors 122-1 and 122-2 (e.g., control the operation of throttling valve 114 and receive sensed pressures from pressure sensors 122-1 and 122-2) via a direct (e.g., wired) connection (e.g., in embodiments in which controller 104 is integrated into the heat pump), or via a wired or wireless network or networks (e.g., in embodiments in which controller 104 is separate from the heat pump).
  • the wireless network(s) can be, for instance, a wide area network (WAN) such as the Internet, a local area network (LAN), a personal area network (PAN), a campus area network (CAN), or metropolitan area network (MAN), among other types of wireless networks.
  • WAN wide area network
  • LAN local area network
  • PAN personal area network
  • CAN campus area network
  • MAN metropolitan area network
  • a "network” can provide a communication system that directly or indirectly links two or more computers and/or peripheral devices and allows users to access resources on other computing devices and exchange messages with other users.
  • a network can allow users to share resources on their own systems with other network users and to access information on centrally located systems or on systems that are located at remote locations.
  • a network can tie a number of computing devices together to form a distributed control network.
  • a network may provide connections to the Internet and/or to the networks of other entities (e.g., organizations, institutions, etc.). Users may interact with network-enabled software applications to make a network request, such as to get a file or print on a network printer. Applications may also communicate with network management software, which can interact with network hardware to transmit information between devices on the network.
  • entities e.g., organizations, institutions, etc.
  • network management software can interact with network hardware to transmit information between devices on the network.
  • vapor compression circuit 100 can include a temperature sensor that can sense the temperature of the condensed liquid refrigerant before its pressure is adjusted by throttling valve 114 (e.g., between condenser 112 and throttling valve 114).
  • controller 104 can receive the sensed pressure from pressure sensor 122-1 and the sensed temperature from the temperature sensor, and adjust throttling valve 114 (e.g., operate throttling valve 114 to adjust the pressure of the condensed liquid refrigerant) as needed to subcool the condensed liquid refrigerant by the particular amount based on the sensed pressure and temperature.
  • controller 104 can determine the pressure of the condensed liquid refrigerant after it exits liquid refrigerant receiver 116 based on known characteristics, such as known positions, of throttling valve 114 and/or expansion valve 118.
  • pressure sensor 122-2 can be omitted from vapor compression system 100.
  • expansion valve 118 can be located downstream from liquid refrigerant receiver 116 in vapor compression circuit 102, as illustrated in Figure 1 .
  • Expansion valve 118 can adjust (e.g., further decrease) the pressure of the condensed liquid refrigerant. That is, expansion valve 118 can be operated by controller 104 (e.g., via a direct connection or a wired or wireless network(s)) to decrease the pressure of the subcooled liquid output from liquid refrigerant receiver 116. This decrease in pressure can be an abrupt pressure decrease that results in an adiabatic flash evaporation of part of the liquid refrigerant, which can lower the temperature of the refrigerant to a temperature that is lower than the temperature of the space to be cooled.
  • the liquid refrigerant can enter the coil or tubes of evaporator 120.
  • a fan can circulate warm air from the enclosed space across the coil or tubes carrying the cold liquid refrigerant, which can cool the air and thus lower the temperature of the enclosed space.
  • the warm air evaporates the liquid refrigerant, so that the refrigerant is once again a saturated vapor.
  • the saturated vapor can exit evaporator 120 and flow to compressor 110, and the cycle can be repeated.
  • vapor compression system can include a pressure sensor 122-3 and a temperature sensor 124.
  • Pressure sensor 122-3 and temperature sensor 124 can sense the pressure and temperature, respectively, of the saturated refrigerant vapor after it exits evaporator 120 (e.g., between evaporator 120 and condenser 110).
  • Controller 104 can receive (e.g., via a direct connection or a wired or wireless network) the sensed pressure and temperature from sensors 122-3 and 124, and utilize the sensed pressure and temperature to control the superheating of the refrigerant vapor performed by compressor 110. That is, controller 104 can be both a subcooling and superheating controller (e.g., control both the subcooling and superheating of the refrigerant).
  • Figure 2 illustrates a pressure-enthalpy diagram 230 of a cycle 232 of a vapor compression system (e.g., vapor compression circuit) in accordance with one or more embodiments of the present disclosure.
  • the vapor compression system can be, for example, vapor compression system 100 previously described in connection with Figure 1 . That is, cycle 232 can correspond to a cycle of refrigerant through vapor compression circuit 102 previously described in connection with Figure 1 .
  • point 234-1 on cycle 232 can correspond to a location in the cycle between compressor 110 and condenser 112 (e.g., downstream from compressor 110 and upstream from condenser 112).
  • point 234-2 on cycle 232 can correspond to a location in the cycle between condenser 112 and throttling valve 114 (e.g., downstream from condenser 112 and upstream from throttling valve 114).
  • point 234-3 on cycle 232 can correspond to a location in the cycle between throttling valve 114 and liquid refrigerant receiver 116 (e.g., downstream from throttling valve 114 and upstream from liquid refrigerant receiver 116), and/or a location in the cycle between liquid refrigerant receiver 116 and expansion valve 118 (e.g., downstream from liquid refrigerant receiver 116 and upstream from expansion valve 118).
  • point 234-4 on cycle 232 can correspond to a location in the cycle between expansion valve 118 and evaporator 120 (e.g., downstream from expansion valve 118 and upstream from evaporator 120).
  • Diagram 230 also illustrates the saturated liquid curve 236 for the refrigerant flowing through vapor compression circuit 102. As shown in Figure 2 , cycle point 234-3 is located on saturated liquid curve 236. The pressure drop between cycle points 234-2 and 234-3 is the pressure adjustment controlled by throttling valve 114. This pressure drop leads to subcooling that is a difference between condensing temperature and refrigerant temperature at cycle point 234-2.
  • Diagram 230 also illustrates the subcooling enthalpy gain ⁇ h SC of vapor compression circuit 102 (e.g., evaporator 120 of compression circuit 102) in the saturation region.
  • This enthalpy gain results from the subcooling of the refrigerant, and increases the efficiency (e.g., the coefficient of performance) of vapor compression circuit 102, as previously described herein.
  • a previous vapor compression circuit e.g., a vapor compression circuit that includes a liquid refrigerant receiver but not a throttling valve analogous throttling valve 114
  • a previous vapor compression circuit would not achieve the enthalpy gain ⁇ h SC illustrated in Figure 2 . Rather, the cycle of a previous vapor compression circuit would follow the dotted line shown in Figure 2 .
  • FIG 3 illustrates an example of a controller 304 of a vapor compression system in accordance with one or more embodiments of the present disclosure.
  • Controller 304 can be, for example, controller 104 of vapor compression system 100 previously described in connection with Figure 1 .
  • controller 304 can include a memory 344 and a processor 342.
  • Memory 344 can be any type of storage medium that can be accessed by processor 342 to perform various examples of the present disclosure.
  • memory 344 can be a non-transitory computer readable medium having computer readable instructions (e.g., computer program instructions) stored thereon that are executable by processor 342 to achieve subcooling in a vapor compression system in accordance with the present disclosure. That is, processor 342 can execute the executable instructions stored in memory 344 to achieve subcooling in a vapor compression system in accordance with the present disclosure.
  • Memory 344 can be volatile or nonvolatile memory. Memory 344 can also be removable (e.g., portable) memory, or non-removable (e.g., internal) memory.
  • memory 344 can be random access memory (RAM) (e.g., dynamic random access memory (DRAM) and/or phase change random access memory (PCRAM)), read-only memory (ROM) (e.g., electrically erasable programmable read-only memory (EEPROM) and/or compact-disk read-only memory (CD-ROM)), flash memory, a laser disk, a digital versatile disk (DVD) or other optical disk storage, and/or a magnetic medium such as magnetic cassettes, tapes, or disks, among other types of memory.
  • RAM random access memory
  • DRAM dynamic random access memory
  • PCRAM phase change random access memory
  • ROM read-only memory
  • EEPROM electrically erasable programmable read-only memory
  • CD-ROM compact-disk read-only memory
  • flash memory a laser disk,
  • memory 344 is illustrated as being located in controller 304, embodiments of the present disclosure are not so limited.
  • memory 344 can also be located internal to another computing resource (e.g., enabling computer readable instructions to be downloaded over the Internet or another wired or wireless connection).

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Air Conditioning Control Device (AREA)
EP15186353.7A 2015-09-22 2015-09-22 Dampfkompressionssystem mit unterkühlung Pending EP3147592A1 (de)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021255921A1 (de) * 2020-06-19 2021-12-23

Citations (7)

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JPWO2021255921A1 (de) * 2020-06-19 2021-12-23
WO2021255921A1 (ja) * 2020-06-19 2021-12-23 三菱電機株式会社 冷凍サイクル装置
JP7301230B2 (ja) 2020-06-19 2023-06-30 三菱電機株式会社 冷凍サイクル装置

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