EP3138161A1 - Contact element for an electric connection, copper strip for producing a plurality of contact elements - Google Patents
Contact element for an electric connection, copper strip for producing a plurality of contact elementsInfo
- Publication number
- EP3138161A1 EP3138161A1 EP15718369.0A EP15718369A EP3138161A1 EP 3138161 A1 EP3138161 A1 EP 3138161A1 EP 15718369 A EP15718369 A EP 15718369A EP 3138161 A1 EP3138161 A1 EP 3138161A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact
- copper
- contact element
- connection
- copper material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010949 copper Substances 0.000 title claims abstract description 65
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 64
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 239000000463 material Substances 0.000 claims abstract description 71
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 238000010894 electron beam technology Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 235000019589 hardness Nutrition 0.000 description 15
- 239000004020 conductor Substances 0.000 description 8
- 229910000906 Bronze Inorganic materials 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 4
- 239000010974 bronze Substances 0.000 description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910016356 CuSn5 Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
Definitions
- the present invention relates to a contact element for electrical connection and a circuit arrangement with at least one said contact element. Furthermore, the invention relates to a copper strip for producing a plurality of said contact elements.
- Circuit arrangements include circuit components of different types and designs, such as. B. circuit board, conductors, power components or sockets. These circuit components must be electrically connected to each other so that the circuits can perform certain functions. For this purpose, the circuit arrangements have contact elements which are provided for the formation of stable electrical connections between circuit components.
- a contact element for electrical connection comprises a first contact region of a first, electrically conductive copper material (copper or copper alloy) for electrical connection to a first circuit component.
- the compact member further includes a second contact region of a second electrically conductive copper material (copper or copper alloy) for electrical connection to a second circuit component.
- the first and the second contact area have different material hardnesses.
- the first and the second contact region are connected to one another via a material connection.
- contact area consists of a copper material
- the phrase "contact area consists of a copper material” means that the respective contact area contains the corresponding end of a copper material in the predominant weight percent ⁇ share Accordingly, there is a contact element almost entirely of a copper material, except for manufacturing ⁇ technically related material impurities or material additives. which protect the contact element from external influences, such as corrosion by moisture, or from material fatigue.
- the term “material hardness” primarily means a mechanical resistance of a material forming the aforementioned first or second copper material, Contrary to the generally accepted distinction to the term “strength”, the term “material hardness” in this application also secondarily includes strength of the material mean, which is a Wi ⁇ derstandsever of the material, that is the first or the second copper material against mechanical deformation and separation.
- the text section that "the first and the second contact area are connected to each other via a cohesive connection” means in this application that the two contact areas not necessarily adjacent to each other at the location of cohesive connection, but that between the two contact areas quite a section of the Contact ⁇ elements may be present, through which the cohesive connection extends and over which the two contact areas are connected to each other cohesively.
- the first and second contact areas on the respective contacting side do not exclusively comprise surfaces which are completely contacted, but may also have free surfaces which are not contacted.
- the two contact areas extend in relation to each other
- the longitudinal direction of the contact element flush wherein the longitudinal direction is transverse or oblique to the direction of the cohesive connection.
- the invention is based on the idea that to form an electrical connection between two circuit components with different connection methods a contact element with contact areas for forming the electrical connections to the respective two circuit components is required, in which the two contact areas must meet different mechanical and material requirements, which presuppose different connection methods.
- the contact element is formed with two contact areas with different materials, then these two contact areas must be connected to one another mechanically and electrically conductively, so that a stable electrical connection can be ensured between the two circuit components, which electrically connects the contact element.
- Copper materials ie copper or copper alloy, have proven in the context of this invention as the materials for contact areas, which both have a high electrical conductivity and are optimally suited for a cohesive connection. Since the copper materials are generally available at low cost, contact elements with contact areas with different copper materials can be produced cost-effectively.
- the first copper material has a material hardness up to 110 HV, in particular up to 100 HV, especially up to 95 HV.
- the hardness unit "HV" means the Vickers hardness.
- the copper material with a low material hardness up to 110 HV, or 100 HV or 95 HV allows the first contact area to form a material connection with the first circuit component, without mechanically affecting the first circuit component too much.
- the first copper material is a raw copper according to standard DIN EN 1976/98.
- the first copper material is a toughened electrolyte copper.
- the first copper material is a Cu-ETP ("Electrolytic-Tough").
- the copper-ETP also known as E-Cu, formerly known as E-Cu58 or E-Cu57, is an oxygenated (toughened) copper produced by electrolytic refining that has a very high conductivity for heat and electricity and thus is best suited for a contact ⁇ element.
- the second copper material has a material hardness of at least 130 HV, in particular at least 150 HV, or preferably above 170 HV.
- the second copper material a Mate ⁇ rialhärte of not more than 300 HV, more preferably not more than 250 HV, and preferably not more than 200 HV.
- the second copper material contains tin, preferably with a weight percentage of over 0.15%, in particular over 1%, especially over 5%.
- the second copper material contains tin at a weight percentage of up to 22%, especially up to 20%, up to 15%, up to 12%, up to 10% or up to 9%, especially up to 7%.
- the second copper material is a tin bronze, especially CuSn6. Tin bronze is also available as a low-cost mass-produced item in various designs.
- additives such as. As magnesium, nickel, zinc and / or silicon, may be contained in the second copper material.
- copper alloys can be used as the second copper material that are suitable for forming press-fit connections. These include, for example, CuSnO.15, CuSn4, CuSn5, CuSn6, CuMg, CuSn3Zn9, CuNiSi.
- the first and the second contact region via a electron beam welded connection with each other are cohesively ver ⁇ tied.
- An electron beam welded joint between the two contact areas of different copper materials has an electrical contact resistance which is lower than the electrical resistance in the two contact areas.
- the electron beam welded connection allows a mechanically very stable connection between the two contact areas.
- a scarf ⁇ tion arrangement comprises a first circuit component and a second circuit component. Furthermore, the circuit arrangement comprises at least one contact element described above.
- the first contact region of the contact element via a material locking connection ⁇ , esp. An ultrasonic welding or solder joint, electrically connected to the first circuit component conductive and mechanically stable connected.
- the second contact ⁇ region of the contact element is electrically connected via a frictional connection, esp. A press-fit (press-fit connection), with the second circuit component and mechanically stable.
- the copper strip comprises a first elongated strip of a first copper material and a second elongated strip of a second copper material.
- the copper strip also has a material connection extending in the longitudinal direction of the first and second strips.
- about the cohesive connection of the first and the second strip are material ⁇ conclusive, electrically conductive and mechanically stable connected.
- the cohesive connection is formed as an electron beam welded joint. From such a copper band, the contact elements described above can be punched out with a simple punching machine in a simple punching operation.
- Figure 1 shows a circuit arrangement with a contact element according to an embodiment of the invention in a schematic side view
- Figure 2 shows a portion of a copper strip according to a
- the circuit arrangement SA comprises a circuit carrier ST1, which in this embodiment is designed as a ceramic substrate. On a surface OF1 of the circuit substrate STl, a conductor track LB for current transmission is arranged, which forms a first circuit component of the circuit arrangement SA.
- a power semiconductor device LH On a side facing away from the circuit carrier STL surface OF2 of the conductor LB is a power semiconductor device LH, such. B. power transistor, arranged, which is mechanically and electrically conductively connected via a solder joint LV to the conductor LB.
- a contact element KE On the same surface OF2 of the conductor LB and in addition to the power semiconductor device LH, a contact element KE is further arranged.
- the contact element KE is L-shaped and has a first contact area Bl and a second contact area B2, which are perpendicular to each other.
- the first and second contact portions Bl, B2 via a elektronenstrahlge- welded connection EV are integrally with each other in an electrically conductive and mechanically stable manner, which is located on the bending edge of the contact element KE between the two Kon ⁇ clock domains Bl, B2.
- the first contact area Bl lies on the surface OF2 of the conductor track LB and is mechanically and electrically conductively connected to the conductor track LB via an ultrasound-welded connection UV.
- the first contact area Bl consists of E copper (Cu-ETP) and has a low material hardness of less than 100HV (Vickers hardness).
- the low material hardness at the first contact area Bl reduces the risk of delamination (delamination, detachment) of the interconnect LB from the circuit carrier ST1 or a material fracture at the circuit carrier ST1.
- the second contact portion B2 is in the form of a press-fit pin and is inserted into a metallized via contact DK a further circuit carrier ST2, which forms a second circuit component of the circuit arrangement SA from ⁇ .
- the second contact region B2 with a Metalli ⁇ tion MT on the inner wall of the feedthrough DK forms a non-positive press-fit connection PV (press-fit connection).
- the second contact region B2 consists of a tin bronze CuSn6 with tin in a weight fraction of about 6 and has a high material hardness greater than 130 HV (Vickers hardness).
- the high material hardness in the second contact region B2 enables a stable press-fit connection PV between the contact element KE and the circuit carrier ST2.
- FIG. 2 a section of a copper strip KB for the production of a plurality of contact elements KE shown in FIG. 1 is shown schematically.
- the copper tape KB is formed as a long and narrow band and includes a first elongated strip SRI made of the aforementioned first copper material, that is, E copper (Cu-ETP). Further, the copper tape KB includes a second elongated strip SR2 made of the aforementioned second copper material, namely, the tin bronze CuSn6.
- the first and second strips SRI, SR2 are materially connected via an electron-beam welded joint EV, which extends in the longitudinal direction LR of the first and second strips SRI, SR2.
- the contact elements KE one after the other in the longitudinal direction LR are punched out of this copper band KB, the sections punched out of the area of the first strip SRI denoting the respective first contact areas Bl of the contact elements KE and the sections stamped out of the area of the second strip SR2 form second contact areas B2 of the con ⁇ tact elements KE.
- the punched-out contact elements KE are bent at the electron beam welded joint EV L-shaped.
- the contact elements KE can be produced inexpensively in simple manufacturing ⁇ steps as a commodity.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014208226.9A DE102014208226B4 (en) | 2014-04-30 | 2014-04-30 | Contact element, circuit arrangement with such a contact element and copper tape for producing a plurality of contact elements |
PCT/EP2015/059229 WO2015165914A1 (en) | 2014-04-30 | 2015-04-28 | Contact element for an electric connection, copper strip for producing a plurality of contact elements |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3138161A1 true EP3138161A1 (en) | 2017-03-08 |
EP3138161B1 EP3138161B1 (en) | 2018-09-19 |
Family
ID=53002674
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP15718369.0A Active EP3138161B1 (en) | 2014-04-30 | 2015-04-28 | Contact element for an electric connection, copper strip for producing a plurality of contact elements |
Country Status (6)
Country | Link |
---|---|
US (1) | US9991618B2 (en) |
EP (1) | EP3138161B1 (en) |
CN (1) | CN106463853B (en) |
DE (1) | DE102014208226B4 (en) |
ES (1) | ES2703211T3 (en) |
WO (1) | WO2015165914A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102014208226B4 (en) | 2014-04-30 | 2020-07-23 | Conti Temic Microelectronic Gmbh | Contact element, circuit arrangement with such a contact element and copper tape for producing a plurality of contact elements |
EP3404774B1 (en) | 2017-05-17 | 2021-10-06 | Infineon Technologies AG | Method for electrically connecting an electronic module and electronic assembly |
DE102017214465A1 (en) | 2017-08-18 | 2019-02-21 | Ept Gmbh | Contact pin for pressing into a printed circuit board and contact arrangement |
US10566713B2 (en) * | 2018-01-09 | 2020-02-18 | Semiconductor Components Industries, Llc | Press-fit power module and related methods |
DE102019209451B4 (en) * | 2019-06-28 | 2021-04-01 | Vitesco Technologies Germany Gmbh | Electrical contact element, power electronics device with an electrical contact element |
DE102019128085A1 (en) | 2019-10-17 | 2021-04-22 | CCT Composite Coating Services GmbH | Layer arrangement for a friction-increasing connection |
DE102020209504A1 (en) | 2020-07-28 | 2022-02-03 | Mahle International Gmbh | hybrid press-fit contact |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1177231B (en) | 1962-05-25 | 1964-09-03 | Harting Elektro W | Contact piece for electrical plug connections |
US6204065B1 (en) * | 1997-03-27 | 2001-03-20 | Ngk Insulators, Ltd. | Conduction assist member and manufacturing method of the same |
US5980335A (en) * | 1998-03-27 | 1999-11-09 | Molex Incorporated | Electrical terminal |
US7077658B1 (en) * | 2005-01-05 | 2006-07-18 | Avx Corporation | Angled compliant pin interconnector |
DE102006031839B4 (en) | 2006-07-07 | 2009-09-03 | Auto-Kabel Management Gmbh | Electrical contact element |
CH701206A2 (en) * | 2009-06-02 | 2010-12-15 | Huber+Suhner Ag | Printed circuit board assembly. |
DE102009025113A1 (en) * | 2009-06-11 | 2010-12-16 | Continental Teves Ag & Co. Ohg | Press-in contact for connecting an electronic component to a printed circuit board and press-fit tool |
US8959764B2 (en) * | 2009-11-06 | 2015-02-24 | International Business Machines Corporation | Metallurgical clamshell methods for micro land grid array fabrication |
DE112012002122B4 (en) * | 2011-05-17 | 2020-11-26 | Interplex Industries, Inc. | Inter-plate connection system with deformation avoidance of flexible flexible pins |
DE102012213812A1 (en) | 2012-08-03 | 2014-02-06 | Robert Bosch Gmbh | Einpresskontaktierung |
DE102014208226B4 (en) | 2014-04-30 | 2020-07-23 | Conti Temic Microelectronic Gmbh | Contact element, circuit arrangement with such a contact element and copper tape for producing a plurality of contact elements |
US9331400B1 (en) * | 2014-12-19 | 2016-05-03 | Tyco Electronics Corporation | Male contact assembly |
-
2014
- 2014-04-30 DE DE102014208226.9A patent/DE102014208226B4/en active Active
-
2015
- 2015-04-28 US US15/307,910 patent/US9991618B2/en active Active
- 2015-04-28 EP EP15718369.0A patent/EP3138161B1/en active Active
- 2015-04-28 CN CN201580023249.7A patent/CN106463853B/en active Active
- 2015-04-28 WO PCT/EP2015/059229 patent/WO2015165914A1/en active Application Filing
- 2015-04-28 ES ES15718369T patent/ES2703211T3/en active Active
Also Published As
Publication number | Publication date |
---|---|
EP3138161B1 (en) | 2018-09-19 |
CN106463853B (en) | 2020-02-14 |
US9991618B2 (en) | 2018-06-05 |
US20170054235A1 (en) | 2017-02-23 |
ES2703211T3 (en) | 2019-03-07 |
DE102014208226A1 (en) | 2015-11-05 |
CN106463853A (en) | 2017-02-22 |
DE102014208226B4 (en) | 2020-07-23 |
WO2015165914A1 (en) | 2015-11-05 |
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