EP3116070B1 - Steckverbinder eines gesicherten integrierten schaltkreises - Google Patents

Steckverbinder eines gesicherten integrierten schaltkreises Download PDF

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Publication number
EP3116070B1
EP3116070B1 EP16178218.0A EP16178218A EP3116070B1 EP 3116070 B1 EP3116070 B1 EP 3116070B1 EP 16178218 A EP16178218 A EP 16178218A EP 3116070 B1 EP3116070 B1 EP 3116070B1
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EP
European Patent Office
Prior art keywords
integrated circuit
connection strip
connection
zone
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16178218.0A
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English (en)
French (fr)
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EP3116070A1 (de
Inventor
Stéphane PAVAGEAU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Banks and Acquirers International Holding SAS
Original Assignee
Ingenico Group SA
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Filing date
Publication date
Priority claimed from FR1556439A external-priority patent/FR3038779A1/fr
Application filed by Ingenico Group SA filed Critical Ingenico Group SA
Publication of EP3116070A1 publication Critical patent/EP3116070A1/de
Application granted granted Critical
Publication of EP3116070B1 publication Critical patent/EP3116070B1/de
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials

Definitions

  • the invention lies in the field of integrated circuit connectors, of the type of those arranged on a memory card (chip card).
  • the invention more particularly relates to a connecting strip of an integrated circuit connector.
  • the invention also relates to an integrated circuit connector intended to be inserted into a memory card reading terminal.
  • Such a terminal can be a payment terminal, an identification terminal. More generally, the invention relates to any type of terminal that may include an integrated circuit reader.
  • the memory card reading terminals comprise, in addition to a memory card reader, a certain number of components such as a keyboard, a screen, one or more processors, memory, a power supply source. For several years, memory card reading terminals have seen their functions multiply. This is particularly true for payment terminals. In addition to the payment function, the terminals embed network communication functions, detection functions for contactless memory cards (“contactless” cards), coupon management functions (for example loyalty coupons), and so on.
  • the integrated circuit reader in fact, remains a weak link in the integrated circuit reading terminal. This is due to the fact that the integrated circuit reader comprises an integrated circuit insertion slot, this slot making the interior of the terminal accessible from the outside. More in particular, attackers seek to gain access to the integrated circuit connector.
  • the integrated circuit connector is the part of the integrated circuit reader that comes into contact with the chip or the microprocessor on board the integrated circuit.
  • This integrated circuit reader comprises an integrated circuit reader body 10, comprising a slot for inserting an integrated circuit 11.
  • the integrated circuit connector is directly integrated within the integrated circuit reader. It includes 12 pins for connection to the printed circuit (PCB) 13 (partial view).
  • the PCB 13 also includes electronic components 14. To protect the memory card reader 10, the latter is covered with a complete protection 15, as well as a front protection 15b.
  • connection blade is a metal strip comprising a connection portion 22 which comes into contact with the motherboard of the integrated circuit reader, a contact zone 21 which comes into contact with the integrated circuit chip, and a connecting portion 23 connecting the contact area 21 and the connection portion 22).
  • the introduction of this LM metal strip makes it possible to feel which connection strips are activated and to intercept the data transmitted between the terminal and the smart card.
  • the document EP 2793314 describes a leaf contact spring for making electrical contact with a smart card.
  • the document US 4,921,430 discloses a connector for electronic devices.
  • Document 2166623 discloses a contact piece comprising a base portion, a deformable portion and an insulating coating layer on a part of the deformable portion.
  • the document US 2003109182 discloses a contact module (10) for a connector. These documents do not teach a method for reducing the cost of manufacturing contacts.
  • the proposed technique does not have these drawbacks of the prior art.
  • the invention relates more particularly to a connecting strip as defined in claim 1.
  • connection strip comprises an upper surface and a lower surface, said upper surface being intended to be oriented towards an integrated circuit, said lower surface being intended to be oriented towards a printed circuit to which said connection strip is connected. , said at least one electrically isolated zone being located at least in part at said lower surface.
  • said contact zone has a convex shape capable of coming into contact with an integrated circuit and in that said connecting strip comprises a first electrically insulated zone situated on said lower surface, at least partly at said level. contact area.
  • connection strip further comprises a connection portion intended to be connected to a printed circuit, and in this that said connection strip comprises a second electrically insulated zone located at least in part at the level of said connection portion.
  • said connecting strip further comprises a connecting portion connecting said contact zone and said connection portion, and in that said connecting strip comprises a third electrically isolated zone located at least in part at said level. binding portion.
  • said electrically insulated zone comprises an electric insulator belonging to the group comprising: a resin; an insulating varnish; an insulating adhesive.
  • said electrically insulated zone comprises an electric insulator made of a polyurethane type resin.
  • the polyurethane type resin has the advantage of having significant chemical and thermal resistance.
  • Another type of resin could be used, such as an overmolded plastic for example.
  • the invention also relates to an integrated circuit connector characterized in that it comprises at least one connection strip as described above.
  • said connector comprises a base of parallelepiped shape within which said at least one connection blade is positioned.
  • the technique also relates to a payment terminal comprising an integrated circuit connector as described previously.
  • the invention also relates to a manufacturing process as defined in claim 8.
  • the step of applying a coating comprises a step of bonding an insulating adhesive to said at least one surface. lower part of said connecting strip, at the level of a contact zone for reading an integrated circuit. You can also put the resin before forming or before assembly
  • the application of a coating comprises a step of depositing a drop of resin on said at least one lower surface of said connection blade, at a contact zone for reading a integrated circuit.
  • a drip requires at least in part an implementation by gravity (i.e. gravity causes the drop to fall on the support).
  • Another method could be the implementation of an overmolding (at high or low pressure).
  • the general principle of the present technique consists in isolating one or more zones of the connection blades of an integrated circuit connector so that they cannot be spied on by any device provided with a metal wire and seeking To reach the connection strips in areas which are accessible from outside the connector.
  • the areas in light gray represent the metal part of the connection strips 40 of the integrated circuit connector while the areas in dark gray represent the parts isolated by an insulator.
  • This insulation can be, as desired, a resin (local drop), an insulating varnish or an adhesive.
  • This insulator constitutes an effective countermeasure, in particular against attacks. Previously described In fact, because of the insulation, even the attacker succeeds in inserting a metal wire under a connection blade, he cannot come into contact with it without damaging the blade itself (ie remove the insulation). However, such an action necessarily requires significant damage to the terminal itself. Such a deterioration would be perceived by the terminal which would then be able to trigger adequate protection measures.
  • the figure 3 is an exploded view of a contact zone 21 of a connection blade 30 of an integrated circuit reader.
  • the contact area 21 has a domed shape comprising two inclined sections 211, 212 with respect to the connecting portion 23 and a curved section 210 between the two inclined sections 211, 212.
  • the connecting blade 30 comprises an upper surface SS and a surface. lower SI.
  • the upper surface SS is intended to be oriented towards an integrated circuit; the lower surface S1 is intended to be oriented towards a printed circuit to which the connection strip 30 is connected.
  • the upper surface SS of the lead blade 30 in the curved section 210 is intended to contact a contact area of an integrated circuit in order to transmit signals.
  • the connection strip 30 comprises a first electrically insulated zone implemented by an electrical insulator 31 placed on its lower surface SI at the level of the contact zone 21.
  • an electrical insulator 31 placed on its lower surface SI at the level of the contact zone 21.
  • the space below the contact zone 21, of convex shape is particularly vulnerable, because the space below this contact zone 21 allows a sounder (a metal blade or an electric cable) to pass through which comes into contact with the lower surface of the connection strip 30.
  • this electrical insulator 31 the sounder can no longer come into contact with the metal part of the connection strip 30.
  • the sensitive signals transmitted by this connection strip are thus protected.
  • the use, as insulation, of a drop of resin has the additional advantage of filling the gap between the blade and the plastic, which, in addition to the insulation, avoids being able to pass an object under contact.
  • connection strip 40 comprising a contact area 21, a connection portion 22 and a connection portion 23 connecting the contact area 21 and the connection portion 22.
  • the connection portion 22 comprises a section inclined relative to the connection portion 23 and a connection section 221.
  • the connection section 221 is substantially parallel to the connection portion 23 and has a different height from that of the connection portion 23.
  • the connecting portion 23 comprises, at its end close to the connection portion, a fixing hole 231. This fixing hole 231 allows the connection strip to be fixed in a base of an integrated circuit connector.
  • connection blade 40 also includes an upper surface SS and a lower surface S1.
  • the upper surface SS is intended to be oriented towards a chip of an integrated circuit;
  • the lower surface SI is intended to be oriented towards a printed circuit to which the connection strip 40 is connected (for example a motherboard of a terminal).
  • the connection strip 40 comprises, in this illustration, a first electrically insulated zone implemented by an electric insulator 31 placed on its lower surface SI at the level of the contact zone.
  • connection portion 22 does not include any electrically isolated zone.
  • a second electrically isolated zone at the connection portion 22.
  • electrical insulators on the upper surface SI and / or the upper surface SS at the level of the connection portion. level of the inclined section 222 of the connection portion 22.
  • the upper surface SS and / or the lower surface SI in the connecting portion 23 can / can also be electrically insulated by an insulator.
  • connection strip 40 comprises a third electrically isolated zone. More precisely, the lower surface in the connection section 23 of each connection strip 40 is electrically insulated by an electrical insulator 51. Indeed, when the assembled connection strips are mounted in an integrated circuit connector, the connection portion 23 is located in a plane having a height greater than that of the connection section 221 soldered to a printed circuit. There is thus a space (possibly empty) between the connecting portion 23 and the printed circuit on which the connector is soldered. A fraudster could thus attempt to insert, in this space above the connecting portion 23, a sounder coming into contact with the lower surface of the metal part of the connecting blade 40. This attempt would be doomed to failure. . Indeed, thanks to this electrical insulator 51, the sounder can no longer come into contact with the metal part of the connection strip 40 in the connection portion 23. The sensitive signals transmitted by this connection strip 40 are thus protected.
  • Zone 232 is close to contact zone 21.
  • Zone 231 is close to connection portion 21.
  • the zones 233 comprising the fixing holes 231 cooperate with the base of the connector on the one hand and are welded to the motherboard on the other hand. Thus, zones 232 and 233 do not need to be protected.
  • the electrical insulator can be placed only on the connection strip (s) which transmits sensitive signals.
  • the connection blade for the power supply does not transmit any sensitive signal. It does not require protection by the insulation. The manufacturing cost of the connection blades can thus be reduced.
  • the figure 6 is an exploded view of a contact zone of a connection blade according to a specific embodiment of the proposed technique.
  • This contact zone 21 comprises in particular an insulating envelope 60 placed on the lower surface SI at the contact area level.
  • This contact envelope 60 covers not only the lower surface S1 in the contact zone 21, and also a part of the lateral sides CL of the contact zone 21. This coverage of the lateral zones offers greater protection. It avoids side contact.
  • the insulating casing 60 is mounted on the lower surface SI of the contact zone 21 of the connecting strip.
  • the lateral sides CL of the contact zone 21 are partially covered by the insulating envelope 60.
  • This insulating envelope 60 makes it possible to improve the durability and reliability of the insulating zone. It is also a way to ensure that even the edges are protected, and therefore the total surface is insulated. Indeed, it is more difficult to remove this insulating envelope.
  • the lateral sides CL of the contact zone are entirely covered by the insulating casing 60. Thus, it is no longer possible to establish an electrical connection at the level of the lateral sides CL of the zone of contact. contact 21.
  • a similar insulating envelope could also be placed in another area of the connection strip in order to protect the lateral sides and to improve the hardness and reliability of the insulating area.
  • this electrical insulator can be placed after the manufacture of the connection blade, i.e. after the shaping and cutting steps.
  • the advantage of placing this insulator at the end of the process is that it allows flexibility in the production.
  • the preferred means are an adhesive bonded to a lower surface of the connection strip, at the level of the contact zone, or even a small drop of resin deposited under the contact zone (on the lower surface of the connection blade, at the contact area).
  • the varnish could be more delicate in the case of an application at the end of the process, since no burrs on the “functional contact” surface side are allowed. The cost of such an implementation could therefore be higher.
  • a drop of UV-type resin, relatively easy to use, of the acrylate-urethane type, solidified by polymerization, is also a possible solution in another embodiment. Such a solution is presented in relation to the figure 8 .
  • the contact envelope 60 is made of a resin which is UV cured.
  • the contact envelope 60 is made of a resin which is UV cured.
  • only one contact is protected. It is of course possible to protect all the contacts of the same group (for example depositing a drop of resin on all the front contacts of a connector).
  • Vitralit® 9180 resin was used, which notably has the advantage of being resistant to high temperatures (and therefore to the operation of soldering the connector to a printed circuit board, which solder may be carried out by reflow), and whose viscosity (when the drop is applied) is also adapted to the manufacturing process. Furthermore, such a resin has the advantage of having significant chemical resistance, in order to avoid other types of attack (i.e. chemical for example).

Claims (10)

  1. Verbindungsklinge (30, 40) eines Steckverbinders eines integrierten Schaltkreises, umfassend einen Kontaktbereich (21) von gewölbter Form, der geeignet ist, mit einem integrierten Schaltkreis zum Lesen des integrierten Schaltkreises in Kontakt zu kommen, und mindestens einen elektrisch isolierten Bereich (31, 51, 60), wobei die Verbindungsklinge (30, 40) eine obere Fläche (SS) und eine untere Fläche (SI) aufweist, wobei die obere Fläche (SS) dazu bestimmt ist, auf den integrierten Schaltkreis gerichtet zu werden, während die untere Fläche (SI) dazu bestimmt ist, auf einen integrierten Schaltkreis gerichtet zu werden, mit dem die Verbindungklinge (30, 40) verbunden ist, dadurch gekennzeichnet, dass der mindestens eine elektrisch isolierte Bereich (31, 51, 60) einen elektrischen Isolator aufweist, der zu der Gruppe gehört, umfassend: ein Harz; einen Isolierlack; einen isolierenden Kleber, und dadurch, dass die Verbindungklinge (30, 40) einen ersten elektrisch isolierten Bereich (31, 60) aufweist, wobei sich der erste elektrisch isolierte Bereich (31, 60):
    - nur auf der unteren Fläche (SI) befindet; oder
    - nur auf der unteren Fläche (SI) und auf den Seitenflächen (CL) des Kontaktbereichs (21) unter dem gesamten Kontaktbereich (21) befindet.
  2. Verbindungsklinge nach Anspruch 1, dadurch gekennzeichnet, dass die Verbindungsklinge ferner einen Verbindungsabschnitt aufweist, der dazu bestimmt ist, mit einem integrierten Schaltkreis verbunden zu werden, und dadurch, dass die Verbindungsklinge mindestens einen zweiten elektrisch isolierten Bereich aufweist, der sich mindestens teilweise auf Ebene des Verbindungsabschnitts befindet.
  3. Verbindungsklinge nach Anspruch 2, dadurch gekennzeichnet, dass die Verbindungsklinge ferner einen Verbindungsbereich aufweist, der den Kontaktbereich und den Verbindungsabschnitt verbindet, und dadurch, dass die Verbindungklinge einen dritten elektrisch isolierten Bereich aufweist, der sich mindestens teilweise auf Ebene des Verbindungsbereichs befindet.
  4. Verbindungsklinge nach Anspruch 1, dadurch gekennzeichnet, dass der elektrische Isolator aus einem Harz vom Typ des Polyurethanharzes gebildet ist.
  5. Steckverbinder eines integrierten Schaltkreises, dadurch gekennzeichnet, dass er mindestens eine Verbindungsklinge nach einem der Ansprüche 1 bis 4 aufweist.
  6. Steckverbinder eines integrierten Schaltkreises nach Anspruch 5, umfassend einen quaderförmigen Sockel, in dessen Innerem die mindestens eine Verbindungsklinge angeordnet ist.
  7. Zahlungsendgerät, dadurch gekennzeichnet, dass es mindestens einen Steckverbinder eines integrierten Schaltkreises nach Anspruch 5 aufweist.
  8. Verfahren zur Herstellung einer Verbindungsklinge (30, 40) eines Steckverbinders eines integrierten Schaltkreises, wobei das Verfahren aufweist:
    - einen Schritt zum Formen einer Metallklinge, wodurch eine formatierte Metallklinge bereitgestellt wird,
    - einen Schritt des Schneidens der formatierten Metallklinge derart, dass die formatierte Metallklinge eine Verbindungsklinge (30, 40) eines Steckverbinders eines integrierten Schaltkreises wird, umfassend einen Kontaktbereich (21) von gewölbter Form, der geeignet ist, mit einem integrierten Schaltkreis zum Lesen des integrierten Schaltkreises in Kontakt zu kommen, wobei die Verbindungsklinge (30, 40) eine obere Fläche (SS) und eine untere Fläche (SI) aufweist, wobei die obere Fläche (SS) dazu bestimmt ist, auf den integrierten Schaltkreis gerichtet zu werden, während die untere Fläche (SI) dazu bestimmt ist, auf einen integrierten Schaltkreis gerichtet zu werden, mit dem die Verbindungsklinge (30, 40) verbunden ist,
    wobei das Verfahren dadurch gekennzeichnet ist, dass es ferner einen Schritt des Aufbringens einer elektrisch isolierenden Beschichtung auf mindestens einem Bereich der Verbindungsklinge aufweist, wobei die elektrisch isolierende Beschichtung zu der Gruppe gehört, umfassend: ein Harz; einen Isolierlack; einen isolierenden Kleber, derart, dass die Verbindungklinge (30, 40) einen ersten elektrisch isolierten Bereich (31, 60) aufweist, wobei sich der erste elektrisch isolierte Bereich (31, 60):
    - nur auf der unteren Fläche (SI) befindet; oder
    - nur auf der unteren Fläche (SI) und den Seitenflächen (CL) des Kontaktbereichs (21) unter dem gesamten Kontaktbereich (21) befindet.
  9. Verfahren zur Herstellung einer Verbindungsklinge nach Anspruch 8, dadurch gekennzeichnet, dass der Schritt des Aufbringens einer Beschichtung einen Schritt des Aufklebens eines isolierenden Klebers auf die mindestens eine untere Fläche der Verbindungsklinge auf Ebene eines Kontaktbereichs zum Lesen eines integrierten Schaltkreises aufweist.
  10. Verfahren zur Herstellung einer Verbindungsklinge nach Anspruch 8, dadurch gekennzeichnet, dass der Schritt des Aufbringens einer Beschichtung einen Schritt des Abscheidens, das durch die Schwerkraft umgesetzt wird, eines Harztropfens auf die mindestens eine untere Fläche der Verbindungsklinge auf Ebene eines Kontaktbereichs zum Lesen eines integrierten Schaltkreises aufweist.
EP16178218.0A 2015-07-07 2016-07-06 Steckverbinder eines gesicherten integrierten schaltkreises Active EP3116070B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1556439A FR3038779A1 (fr) 2015-07-07 2015-07-07 Connecteur de carte a puce securise
FR1558450A FR3038780B1 (fr) 2015-07-07 2015-09-11 Connecteur de circuit integre securise

Publications (2)

Publication Number Publication Date
EP3116070A1 EP3116070A1 (de) 2017-01-11
EP3116070B1 true EP3116070B1 (de) 2021-10-06

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EP16178218.0A Active EP3116070B1 (de) 2015-07-07 2016-07-06 Steckverbinder eines gesicherten integrierten schaltkreises

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Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS643778A (en) * 1987-06-25 1989-01-09 Matsushita Electric Works Ltd Installation supervisory equipment
DE59901657D1 (de) * 1998-08-17 2002-07-11 Infineon Technologies Ag Kontaktiervorrichtung, insbesondere zum ankontaktieren von elektrischen bauelementen und schaltungsträgern, sowie verfahren zu deren herstellung
JP2003142183A (ja) * 2001-11-01 2003-05-16 Fujitsu Component Ltd コンタクトモジュール、コネクタおよびコンタクトモジュールの製造方法
JP2010073341A (ja) * 2008-09-16 2010-04-02 Kitagawa Ind Co Ltd 表面実装コンタクト
EP2793314A1 (de) * 2013-04-16 2014-10-22 GFD Gesellschaft für Diamantprodukte mbH Kontaktfeder und dessen Verwendung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

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