Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q1/00—Details of, or arrangements associated with, antennas
  • H01Q1/12—Supports; Mounting means
  • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
  • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
  • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/0772—Physical layout of the record carrier
  • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/0772—Physical layout of the record carrier
  • G06K19/07735—Physical layout of the record carrier the record carrier comprising means for protecting against electrostatic discharge
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01Q—ANTENNAS, i.e. RADIO AERIALS
  • H01Q1/00—Details of, or arrangements associated with, antennas
  • H01Q1/12—Supports; Mounting means
  • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
  • H01Q1/2291—Supports; Mounting means by structural association with other equipment or articles used in bluetooth or WI-FI devices of Wireless Local Area Networks [WLAN]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/484—Connecting portions
  • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
  • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
  • H01L2224/732—Location after the connecting process
  • H01L2224/73251—Location after the connecting process on different surfaces
  • H01L2224/73265—Layer and wire connectors
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/181—Encapsulation

Definitions

• the invention relates to an electronic module for a smart card with a dual contact and contactless communication interface, and a smart card integrating such a module.
• an electronic module comprising a microelectronic chip, a contact terminal block intended to be brought into contact with the corresponding terminals of a contact chip card reader, and two electrical contacts located on the rear face of the electronic module and allowing connection to the antenna of the card body;
• a plastic card in ISO 7816-1 format comprising an antenna, in particular in the so-called ID1 format;
• connection bridge or "strap” in English terminology, consisting of two vias interconnected by an electrical connection that spans the turns of the antenna and connects the connection pad of the antenna. the most eccentric antenna, or distal pad, to a proximal connection pad of the antenna, located near the terminal of the contactless communication interface of the chip.
• This arrangement makes it possible, on the one hand, to connect the connection wires to the chip in a standard manner in terms of loop height and wire length, and on the other hand to provide a peripheral bonding zone on the module that is sufficient for his later report on the card body.
• the fact of using a substrate with vias is an expensive structure, because to make the vias must first drill holes in the substrate, then clean the holes, activate the flanks of carbon or palladium holes to make them conductive to allow their metallization in a subsequent step, then complete the via with a metallization, and thus electrically connect the two faces of the substrate.
• vias manufacturing steps introduce additional quality review steps, and decreases in overall performance. manufacturing, which leads to an increased unit cost compared to a product that would be devoid of vias.
• the metal at the edges of the vias or interconnection wells poses another problem, since there is a risk of electrical short circuit between the wiring wire connected in a well and going to an ISO contact, and the metal in Well edge, which is electrically connected to the antenna. An ISO contact can then inadvertently be connected to the antenna. This defect is all the more likely that the connection son between chip and ISO contacts are long, especially greater than 2 mm in length, and even more serious that it is not necessarily detected during tests performed by the manufacturer of the electronic module, while the performance of the card in the field in contactless mode is strongly deteriorated.
• an electronic module for smart card provided in turn a substrate having a single metallized face, and wherein the antenna is located on the module itself.
• the antenna is then made by thin turns etched on the upper face of the module, which also includes the module's ISO contacts which are accessible by a smart card reader contacts.
• the fine engraved turns are exposed to contact with the fingers or more generally to the environment of use of the smart card, which tends to rapidly deteriorate the turns and to make the operation of the smart card in contactless mode impossible.
• the antenna since the antenna is located entirely on the electronic module, its surface is small, which limits the performance and the communication range of the smart card in contactless mode.
• the antenna terminals are located in the encapsulation zone, which makes the electronic module described in this document incompatible with the use of an ID1 format antenna located on the periphery of the smart card body. , which has a greater range of communication.
• the ISO contacts and the turns of the antenna of the module are located on the upper face of the module which is visible, and the surface thus occupied makes that this module can not be the object a graphic customization on its visible upper face. Goals of the invention
• a general object of the invention is therefore to provide an electronic module for a smart card with a dual contact and non-contact communication interface, which does not have the aforementioned drawbacks.
• Another aim of the invention is to propose an electronic module for a smart card with a dual contact and non-contact communication interface, which is of simpler manufacture and at a lower cost than the known modules, without high level of reliability.
• a particular object of the invention is to propose an electronic module for a smart card with a dual contact and non-contact communication interface, not requiring interconnections or vias between the faces of the substrate, and capable of solving the problems of risk of short circuit between the ISO contacts of the smart card and its antenna.
• the principle of the invention provides that the connection pads of the antenna of the smart card, and the ISO contacts of the module according to ISO 7816-2, are located on one and the same face of the module , ie the rear or bottom face of the module substrate, the visible front face after mounting the module in a smart card body being constituted by a substantially electrically insulating face and capable of receiving any informative marking or graphic personalization.
• the subject of the invention is therefore an electronic module for a smart card with a dual contact and non-contact communication interface, said module comprising on the one hand an electrically insulating substrate on which electrical contacts pads are made on the one hand. allowing operation by contact with the corresponding contacts of a chip card reader, and secondly contact pads for connection to corresponding pads of an antenna located on the body of the smart card and allowing its non-contact operation with a remote smart card reader, characterized in that said substrate is coated with a single electrically conductive layer, in particular metal, located on the underside of the electronic module, and in that the upper face of the electronic module for flush with an outer face of the chip card is formed by said electrically insulating substrate, the latter being provided with lights to appear all or part of said pads of electrical contacts.
• the electrically insulating layer is chosen to allow easy realization of graphic personalization, printing or equivalent.
• This advantageous embodiment makes it possible in particular to accumulate the low cost of using a substrate having a single metallized or conductive face, and the possibility of marking, printing or graphically customizing the surface of the module located between the openings or lights. corresponding to the ISO contact terminals.
• the electronic chip of the module is located in an encapsulation zone protecting the chip, and the contact pads for the connection to an antenna of the card body are located outside said encapsulation area.
• the insertion of the module according to the invention into the cavity of a smart card body makes it possible to obtain in addition a smart card whose operation in contactless mode is efficient, because of the presence of a large antenna, greater than the size of the electronic module, and in particular the ID1 format.
• the invention also relates to a smart card with a dual contact and contactless communication interface, comprising an electronic module as described above.
• FIG. 1C illustrates a sectional view of the electronic module of Figure 1B according to a section plane CC;
• FIGS. 2A and 2B respectively illustrate a plan view in top view and in bottom view of an electronic module according to the invention
• FIG. 2C and 2D illustrate sectional views of the module of Figures 2A, 2B according to a plurality of sectional planes.
• FIGS. 1A and 1B illustrate a known electronic module 1, including a chip 2 bonded using an adhesive layer 4 (FIG. 1C) on an electrically insulating substrate 3.
• the chip 2 is connected to a 1 to a terminal block of electrical contacts 5 located on the upper face 11 of the module, which is opposed to the lower face 10 which carries the chip, these contacts 5 being intended to ensure operation in contact mode with a contact reader (not shown).
• the electrical connections between the ISO contacts 5 and the corresponding output pads of the chip 2 are made by well-known conductive vias 6, also called interconnection wells, or "bonding" wells in English terminology, and which allow to connect electrically, using connecting son 7, the output pads 8 of the chip and the ISO contacts 5 located on the opposite face of the module.
• the chip 2 is connected on the other hand to an antenna located in a card body or directly on the module 1, by means of metal studs 9 located on the lower face 10 of the module, the connection to the antenna enabling radiofrequency communication with a contactless smart card reader, not shown.
• the module 1 comprises, on its lower face 10, a peripheral surface 12 for bonding the module in the cavity of the smart card body provided for this purpose, and the antenna pads 9 are typically located on this surface 12, outside of an encapsulation zone 13 formed by a resin that protects the chip and its connections 7 to the ISO contacts 5.
• the electrical contacts 5 of the terminal block are located on one side of the module substrate, corresponding to the upper face 11 of the module, and the chip is located on the opposite face of the substrate, corresponding to the lower face 10 of the module.
• the substrate 3 of the module is of the so-called "double-sided" type, ie it comprises two metallized faces, namely a first metallized face (the upper face 11 in the example shown) which carries the ISO 5 metal contacts, and a second partially metallized face (the lower face 10 in the example shown) which carries metal solder pads 9 for connection to the antenna, and vias 6 for connections between the chip and the ISO contacts.
• the connecting vias 6 to the contacts 5 are located inside the encapsulation zone delimited by the resin 13 protecting the chip. This is typically a drop of polymerizable resin, while the pads 9 for connection to the antenna are located inside or outside the encapsulation zone, depending on whether the antenna is made directly on the electronic module, or on the body of the smart card.
• the embodiment shown corresponding to the state of the art requires that the substrate of the module is metallized (that is to say, at least partially coated with a metal layer) on both faces.
• the ISO contacts 5 are on the upper surface 11 of the module, and the chip 2 is glued to the lower face 10 of the module.
• This double metallization is problematic in some cases of use, because it substantially doubles the unit cost of an electronic module for smart card, compared to a module having a single metallized substrate side.
• the area 18 surrounding the via 6 is metallic and leaves only a small gap 19 with respect to the wire 7 also metallic, which creates the risk of short circuit mentioned above.
• the present invention therefore sought to design a so-called single-sided electronic module, having a single conductive face, in particular metallized, in order to reduce the supply costs of the substrate of the module, while avoiding the problems of poor communication performance and low wear resistance mentioned in connection with the module described in DE 196 32 115 Cl above.
• the substrate 3 is well coated with a single metallized layer. But unlike the aforementioned document, it is located on the side of the lower face 10 of the module, the upper face 11 of the module being constituted by an electrically insulating layer (the substrate 3) made of plastic or dielectric material.
• This electrically insulating layer is provided with a series of openings 15 also called "lights", which reveal at least partially the ISO contacts 5 made on the underside of the module. In this way, the ISO contacts 5 remain accessible to the corresponding contacts of a contact chip card reader.
• the upper face 11 of the electronic module being essentially (that is to say outside the surface of the lights 15) made of a plastic material, it is easy to customize graphically, by printing of information or logos relating to the application of the smart card, or its issuer (bank, etc.).
• an antenna In order to ensure the communication of the smart card by radiofrequency, an antenna is necessary. But according to the invention, it is not performed on the module itself as taught in DE 196 32 115 Cl. An antenna of larger size, typically ID1 format, is used. In order to connect it to the electronic module 21, it has on its single metallized side 10, two antenna pads 9 made outside the encapsulation zone 13 of the chip. Homologous studs (not shown) are then provided in known manner in the cavity of the card body capable of receiving the electronic module, and the insertion of the module in the card body causes the electrical connection between the antenna pins of the card body and the antenna pads of the module.
• the invention proposes an electronic module design, in particular for a smart card with a dual contact and contactless communication mode, having a particularly innovative but simple design, using a very economical substrate since it is provided with a single metallized conductive side, while maximizing radiofrequency communication performance through the use of a large format antenna (ID1 format), and while leaving free on the upper face of the module, a plastic zone of relatively large size that lends itself easily to graphic customizations.
• ID1 format large format antenna
• the invention therefore makes it possible to manufacture an electronic module that can optimize the best compromise between the cost and the simplicity of manufacture, the performance of operation in radiofrequency mode, and the use of the visible surface of the module as a communication medium .

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Computer Networks & Wireless Communication (AREA)
• Credit Cards Or The Like (AREA)

Applications Claiming Priority (2)

Publications (1)

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ID=51167959

Family Applications (1)

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• 2014
  • 2014-03-03 FR FR1400545A patent/FR3018132B1/fr active Active
• 2015
  • 2015-03-03 US US15/123,375 patent/US20170077590A1/en not_active Abandoned
  • 2015-03-03 WO PCT/FR2015/000046 patent/WO2015132485A1/fr active Application Filing
  • 2015-03-03 EP EP15713198.8A patent/EP3114612A1/de not_active Withdrawn

Non-Patent Citations (1)

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