EP3113221A1 - Passive cooling module - Google Patents

Passive cooling module Download PDF

Info

Publication number
EP3113221A1
EP3113221A1 EP15174978.5A EP15174978A EP3113221A1 EP 3113221 A1 EP3113221 A1 EP 3113221A1 EP 15174978 A EP15174978 A EP 15174978A EP 3113221 A1 EP3113221 A1 EP 3113221A1
Authority
EP
European Patent Office
Prior art keywords
passive cooling
heat
cooling module
base plate
passive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15174978.5A
Other languages
German (de)
French (fr)
Other versions
EP3113221B1 (en
Inventor
Martin Lasinger
Edwin KRMPOTIC
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohde and Schwarz GmbH and Co KG
Original Assignee
Rohde and Schwarz GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohde and Schwarz GmbH and Co KG filed Critical Rohde and Schwarz GmbH and Co KG
Priority to EP15174978.5A priority Critical patent/EP3113221B1/en
Publication of EP3113221A1 publication Critical patent/EP3113221A1/en
Application granted granted Critical
Publication of EP3113221B1 publication Critical patent/EP3113221B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Definitions

  • the invention relates to a passive cooling module which can be assembled with other passive cooling modules to form a cooling structure.
  • Heat generating elements can generate during operation heat.
  • Heat generating elements can comprise electronic components and/or electronic circuits comprising a plurality of electronic components which during operation consume electric power which is converted into heat.
  • the heat generated during operation of the electronic components can be harmful to the electronic components, because an increased temperature can shorten the operation lifetime of an electronic component or an electronic system.
  • Heat sinks can be used to cool heat generating elements.
  • a heat sink cools a heat generating element by absorbing and dissipating the generated heat.
  • a heat sink can be made of a thermal conductive material and normally has a specific shape which improves the transfer of generated heat. In a conventional heat sink, the shape of the heat sink is formed such that it provides a great surface area.
  • a heat sink can be designed to maximize its surface area surrounded by a cooling medium to increase the performance of the respective heat sink.
  • Conventional heat sinks are attached to the heat generating element and transfer thermal energy from the high temperature heat generating element to a lower temperature fluid medium.
  • the shape and design of a conventional heat sink is adapted to the shape of the heat generating element to be cooled and the required heat transfer performance.
  • a conventional heat sink is attached to the heat generating element to be cooled by said heat sink, wherein the heat generating element is carried by a mechanical structure or printed circuit board.
  • Conventional heat sinks do not allow to form a mechanical carrying structure which carries heat generating elements and is configured to cool the heat generating elements at the same time.
  • the invention provides according to a first aspect a passive cooling module having a shape adapted to be assembled with one or more passive cooling modules having a matching shape to form a cooling structure, said passive cooling module comprising a base plate to receive heat from at least one heat generating element attached to said base plate, wherein heat sink elements are connected to said base plate to transfer heat from said base plate to a surrounding fluid.
  • At least one heat spreading element is attached to said base plate.
  • the heat spreading element attached to said base plate of said passive cooling module is adapted to spread heat received from a heat generating element attached to said heat spreading element across said base plate of said passive cooling module.
  • the heat spreading element comprises a vacuum-sealed chamber filled with a liquid.
  • the liquid within said vacuum-sealed chamber is formed by water absorbed by a copper-mesh wick, wherein said water passes as vapour through a micro-perforated copper sheet where it cools and returns as liquid to the copper-mesh wick within said vacuum-sealed chamber.
  • said heat sink elements comprise heat sink fins.
  • the fluid surrounding said heat sink elements is formed by air or water.
  • the heat sink elements extend perpendicular from said base plate and are enclosed by a metal plate.
  • a thermally conductive pad is provided between the heat generating element and said heat spreading element.
  • the base plate, the heat sink elements and the metal plate are made of aluminium.
  • the passive cooling module has a polygonal shape, in particular a triangular shape, a rectangular shape or a hexagonal shape.
  • the passive cooling module has a L-shape or a T-shape.
  • the invention further provides according to a further aspect a cooling structure comprising a plurality of passive cooling modules according to the first aspect of the present invention, wherein each cooling module carries at least one heat generating element.
  • the heat generating element comprises at least one electronic component.
  • the heat generating elements carried by the passive cooling modules of said cooling structure are electrically connected to each other via electric cables.
  • At least one fan is mounted to said cooling structure, wherein said fan supplies air as a cooling fluid to the heat sink elements of passive cooling modules assembled within said cooling structure.
  • a heat spreading element 7 is attached to the base plate 2.
  • the heat spreading element 7 is adapted to spread heat received from the heat generating element 3 across the base plate 2 of the passive cooling module 1. In this way, the received heat is spread out by the heat spreading element 7 to all heat sink elements 4-i connected to the base plate 2.
  • a thermally conductive pad 8 is provided between the heat generating element 3 and the heat spreading element 7.
  • the heat generating element 3 can comprise one or several electronic components mounted for instance on a printed circuit board which during operation consume electrical power and generate thermal energy.
  • the base plate 2, the heat sink elements 4-i and the surrounding metal plate 5 can be made of aluminium or aluminium alloys.
  • other thermally conductive materials can be used such as copper or diamonds.
  • Fig. 2 shows a perspective view on the passive cooling module 1 as illustrated in Fig. 1 .
  • the base plate 2 is formed to receive two heat spreading elements 7A, 7B, where two different heat generating elements can be attached to the base plate 2, for instance by screws.
  • Fig. 2 shows receiving holes 9A-1 to 9A-4 for mounting a first heat generating element 3A to the base plate 2 by means of screws and receiving holes 9B-1 to 9B-4 for mounting a second heat generating element 3B to the second heat spreader 7B on the base plate 2.
  • the number of heat spreading elements 7 inserted in or attached to the base plate 2 can vary.
  • Fig. 3 shows an exemplary embodiment of a cooling structure 10 according to the second aspect of the present invention comprising four passive cooling modules 1-1, 1-2, 1-3, 1-4 as shown in Fig. 2 .
  • the four passive cooling modules 1-1, 1-2, 1-3, 1-4 are connected to each other in a preferred embodiment by means of screws to form the passive cooling structure 10 as shown in Fig. 3 .
  • the passive cooling modules 1-i as shown in Figs. 1 , 2 have a equilateral triangle shape, a square or quadratic passive cooling structure 10 consisting of four passive cooling modules 1-i is formed as shown in Fig. 3 .
  • the outer periphery of this passive cooling structure 10 is formed by the base plates 2-1, 2-2, 2-3, 2-4 of the passive cooling modules 1-1, 1-2, 1-3, 1-4, respectively.
  • the heat generating elements 3-i such as electronic circuits or electronic components can be attached to the outer periphery of the passive cooling structure 10 which carries the heat generating elements 3-i and cools the heat generating elements 3-i at the same time.
  • a fan can be mounted to the cooling structure 10 as shown in Fig. 3 .
  • the fan can supply a cooling fluid, in particular air, to the heat sink elements or heat sink fins of the passive cooling modules 1-i assembled within the cooling structure 10.
  • the cooling structure 10 as shown in Fig. 3 can be mounted such that the cooling fluid, i.e. air, passes along the heat sink elements 4-i vertically to improve convection.
  • the passive cooling structure 10 as shown in Fig. 3 different heat generating elements 3-i attached to the base plates 2-i via the heat spreading elements 7-i can be electrically connected to each other via electric or electronic cables. In this way, the cooling structure 10 can carry a plurality of complex or less complex electronic heat generating components 3-i which form a complex electronic circuit.
  • Fig. 4 shows a further exemplary embodiment of a passive cooling structure 10 made of four passive cooling modules 1-i as shown in Figs. 1 , 2 .
  • the passive cooling structures 10 shown in Figs. 3 , 4 use the same basic passive cooling modules 1-i but have a completely different structural form.
  • Fig. 5 shows a further exemplary cooling structure 10 made of passive cooling modules 1-i as shown in Figs. 1 , 2 .
  • the cooling structure 10 illustrated in Fig. 5 comprises eight passive cooling modules 1-i and can be made of two cooling structures 10 as shown in Fig. 4 .
  • the form of the passive cooling structures 10 can be adapted to a specific surrounding or available place in a transporting container or casing of a machine.
  • the passive cooling module 1 comprises a heat spreading element 7 which has at least one vacuum-sealed chamber filled with a liquid.
  • the liquid is formed by water.
  • the liquid within the vacuum-sealed chamber of the heat spreading element 7 can be absorbed by a copper-mesh wick.
  • the heat spreader 7 comprises a copper encased two-phase vapour chamber into which pure water is vacuum-sealed. The water can be absorbed by a copper-mesh wick and passes as vapour through a micro-perforated copper sheet where it cools and returns as a liquid to the copper-mesh wick.
  • the water turns to steam or vapour passing through the micro-perforated copper sheet.
  • the water moves through micro channels changing from water to vapour and back to water removing excess heat.
  • the heat spreader 7 spreads the received heat across the base plate 2 of the passive cooling module 1 so that the heat reaches the heat sink elements 4-i attached to the base plate 2.
  • the heat sink elements 4-i transfer the received heat to the cooling fluid such as air.
  • Fig. 6 shows a diagram illustrating the operation of a heat spreading element 7 comprising a vacuum-sealed chamber filled with water.
  • the thermal conductivity of the heat spreading element 7 depends on the temperature T as illustrated in the diagram of Fig. 6 . If the temperature T falls beneath 0°C, the water freezes and the thermal conductivity of the heat spreading element 7 becomes very low, i.e. almost zero. If the temperature T rises beyond 0°C, the frozen liquid, i.e. water, becomes fluid and the thermal conductivity of the heat spreading element 7 increases rapidly in a step function as shown in Fig. 6 .
  • the heat spreading element 7 has a very low thermal conductivity and isolates the heat generating element 3 from the base plate 2 of the passive cooling module 1.
  • the heat generating element 3 comprises electronic components, this has the significant advantage that the electronic components are not cooled by the passive cooling module 1 and no energy has to be wasted to warm up the heat generating electronic components 3 and to keep them in their regular operation temperature range.
  • the thermal conductivity of the heat spreading element 7 is high as shown in Fig. 6 so that heat generated by the heat generating elements 3 is transported efficiently by the heat spreading element 7 and spread out across the base plate 2 of the passive cooling module 1 so that the heat generated by the heat generating components 3 is transferred efficiently to the heat sink elements 4-i.
  • the threshold temperature T TH of the diagram illustrated in Fig. 6 depends on the liquid filled within the vacuum-sealed chamber of the heat spreading element 7. In a possible embodiment, the threshold temperature T TH is adapted to the operation temperature range of the heat generating element 3 attached to the passive cooling module 1.
  • the size and width of the heat spreading element 7 can vary depending on the size of the base plate 2.
  • Fig. 7 shows a top view of a passive cooling structure 10 as shown in Fig. 3 consisting of four passive cooling modules 1-i as shown in the embodiment of Fig. 1 , 2 .
  • the cooling structure 10 carries four heat generating elements 3-1, 3-2, 3-3, 3-4 which can comprise one or several electronic components generating heat during operation.
  • the electronic components 3-i are connected to each other via electronic cables 11-i as illustrated in Fig. 7 .
  • the different electronic components 3-i can form a complex electronic circuit cooled by the cooling structure 10 as shown in Fig. 7 .
  • channels between heat sink elements can be used for cabling.
  • Fig. 8 shows a further exemplary passive cooling structure 10 made of six equilateral triangular passive cooling modules 1-i.
  • the cooling structure 10 carries six different heat generating elements 3-i.
  • Fig. 9 shows a further more complex passive cooling structure 10 consisting of a plurality of triangular shaped passive cooling modules 1-i.
  • the passive cooling structure 10 is a frame carrying ten heat generating elements 3-1 to 3-10 facing outwards and six heat generating elements 3-11 to 3-16 facing inwards.
  • the different electronic heat generating components 3-i can perform different functions in a complex electronic circuitry.
  • the inward facing electronic components 3-i can be for instance very sensitive components which have to be protected against mechanical shock or vibrations and/or electromagnetic fields. Since the heat generating electronic elements 3-11 to 3-16 are surrounded by the passive cooling structure 10, they are automatically protected to some extent against mechanical damage or mechanical shocks.
  • the outer heat generating components 3-1 to 3-10 can be formed by less sensitive electronic components, in particular electromechanical components.
  • the outer heat generating electronic elements 3-1 to 3-10 can be formed by elements having an interface function in the complex electronic circuit, whereas the inner heat generating electronic components 3-11 to 3-16 form core components of the complex circuit such as data processing elements.
  • the different electronic components or heat generating elements 3-i as shown in Fig. 9 can be connected to each other via electric cables not illustrated in Fig. 9 .
  • Fig. 10 shows a further exemplary embodiment of a passive cooling structure 10 consisting of four L-shaped passive cooling modules 1-1, 1-2, 1-3, 1-4 each carrying a heat generating element 3-1, 3-2, 3-3, 3-4.
  • the cooling structure 10 shown in Fig. 10 also forms a frame similar to the cooling structure shown in Fig. 9 .
  • Fig. 11 shows a further exemplary embodiment of a passive cooling structure 10 consisting of two complementary L-shaped passive cooling modules 1-1, 1-2 each carrying a heat generating element 3-1, 3-2.
  • Fig. 12 shows a further exemplary embodiment of a cooling structure consisting of four square passive cooling modules 1-1, 1-2, 1-3, 1-4 carrying four heat generating elements 3-1, 3-2, 3-3, 3-4.
  • Fig. 13 shows a further exemplary embodiment of a square passive cooling structure 10 consisting of nine identical square passive cooling modules 1-1 to 1-9, where each passive cooling module carries at least one heat generating element 3-i.
  • Fig. 14 shows a further exemplary embodiment of a passive cooling structure 10 formed by four hexagonal passive cooling modules 1-i each carrying at least one heat generating element 3-i.
  • Fig. 15 shows a further exemplary embodiment of a passive cooling structure 10 consisting of several passive cooling modules 1-i of different matching shape.
  • the passive cooling structure 10 forms an arc and comprises seven passive cooling modules 1-1, 1-2, 1-3, 1-4, 1-5, 1-6, 1-7.
  • Each passive cooling module 1-i carries at least one heat generating element 3-i.
  • the passive cooling module 10 consists of passive cooling modules of different types.
  • the first, third and fifth and seventh passive cooling modules 1-1, 1-3, 1-5, 1-7 within the arc-shaped passive cooling structure 10 are formed by square-shaped passive cooling modules, whereas the second, fourth and sixth passive cooling modules 1-2, 1-4, 1-6 are formed by triangular passive cooling modules.
  • the side length of the square-shaped passive cooling modules 1-1, 1-3, 1-5, 1-7 matches the side length of the triangular passive cooling modules 1-2, 1-4, 1-6 to form a compact structure.
  • the created cooling structure 10 can be specifically adapted to the respective use case.
  • the created cooling structure 10 has a low weight and provides high mechanical resistance.
  • the cooling structure 10 is formed by assembling a plurality of passive cooling modules 1 to each other and can carry a plurality of even heavy heat generating elements 3-i or of the components wherein it cools the heat generating elements 3-i at the same time very efficiently.
  • the cooling structure 10 is also able to carry additional elements or devices such as cooling fans.
  • the cooling structure 10 allows to mount different types of heat generating elements or components 3-i to face outwards or to face inwards depending on the respective function and/or sensitivity of the mounted heat generating element 3-i. This increases flexibility in the design of a complex electronic circuit consisting of a plurality of heat generating components 3-i and allows to locate the heat generating elements or components according to their sensitivity and function at a proper place outside or inside a passive cooling structure frame 10.
  • the cooling structure 10 can be adapted in its form to a surrounding carrying container or bag or to the available place within the casing of a complex machine.
  • the passive cooling structure 10 can be scaled to the number of heat generating components 3 within the complex circuit.
  • the passive cooling modules 1 used in the cooling structure 10 are mechanically robust and provide efficient cooling of the mounted heat generating components 3.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A passive cooling module (1) having a shape adapted to be assembled with one or more passive cooling modules having a matching shape to form a cooling structure, said passive cooling module (1) comprising a base plate (2) to receive heat from at least one heat generating element (3) attached to said base plate (2), wherein heat sink elements (4) are connected to said base plate (2) to transfer heat from said base plate (2) to a surrounding fluid.

Description

  • The invention relates to a passive cooling module which can be assembled with other passive cooling modules to form a cooling structure.
  • Heat generating elements can generate during operation heat. Heat generating elements can comprise electronic components and/or electronic circuits comprising a plurality of electronic components which during operation consume electric power which is converted into heat. The heat generated during operation of the electronic components can be harmful to the electronic components, because an increased temperature can shorten the operation lifetime of an electronic component or an electronic system.
  • Heat sinks can be used to cool heat generating elements. A heat sink cools a heat generating element by absorbing and dissipating the generated heat. A heat sink can be made of a thermal conductive material and normally has a specific shape which improves the transfer of generated heat. In a conventional heat sink, the shape of the heat sink is formed such that it provides a great surface area. A heat sink can be designed to maximize its surface area surrounded by a cooling medium to increase the performance of the respective heat sink.
  • Conventional heat sinks are attached to the heat generating element and transfer thermal energy from the high temperature heat generating element to a lower temperature fluid medium. The shape and design of a conventional heat sink is adapted to the shape of the heat generating element to be cooled and the required heat transfer performance.
  • A conventional heat sink is attached to the heat generating element to be cooled by said heat sink, wherein the heat generating element is carried by a mechanical structure or printed circuit board. Conventional heat sinks do not allow to form a mechanical carrying structure which carries heat generating elements and is configured to cool the heat generating elements at the same time.
  • Accordingly, it is an object of the present invention to provide a heat sink element which can be used to build a mechanical structure which carries at least one heat generating element and which at the same time provides efficient cooling of the heat generating elements carried by the mechanical structure.
  • This object is achieved by a passive cooling module comprising the features of claim 1.
  • The invention provides according to a first aspect a passive cooling module having a shape adapted to be assembled with one or more passive cooling modules having a matching shape to form a cooling structure,
    said passive cooling module comprising a base plate to receive heat from at least one heat generating element attached to said base plate,
    wherein heat sink elements are connected to said base plate to transfer heat from said base plate to a surrounding fluid.
  • In a possible embodiment of the passive cooling module according to the first aspect of the present invention, at least one heat spreading element is attached to said base plate.
  • In a further possible embodiment of the passive cooling module according to the first aspect of the present invention, the heat spreading element attached to said base plate of said passive cooling module is adapted to spread heat received from a heat generating element attached to said heat spreading element across said base plate of said passive cooling module.
  • In a further possible embodiment of the passive cooling module according to the first aspect of the present invention, the heat spreading element comprises a vacuum-sealed chamber filled with a liquid.
  • In a further possible embodiment of the passive cooling module according to the first aspect of the present invention, the liquid within said vacuum-sealed chamber is formed by water absorbed by a copper-mesh wick, wherein said water passes as vapour through a micro-perforated copper sheet where it cools and returns as liquid to the copper-mesh wick within said vacuum-sealed chamber.
  • In a further possible embodiment of the passive cooling module according to the first aspect of the present invention, said heat sink elements comprise heat sink fins.
  • In a still further possible embodiment of the passive cooling module according to the first aspect of the present invention, the fluid surrounding said heat sink elements is formed by air or water.
  • In a still further possible embodiment of the passive cooling module according to the first aspect of the present invention, the heat sink elements extend perpendicular from said base plate and are enclosed by a metal plate.
  • In a further possible embodiment of the passive cooling module according to the first aspect of the present invention, a thermally conductive pad is provided between the heat generating element and said heat spreading element.
  • In a further possible embodiment of the passive cooling module according to the first aspect of the present invention, the base plate, the heat sink elements and the metal plate are made of aluminium.
  • In a further possible embodiment of the passive cooling module according to the first aspect of the present invention, the passive cooling module has a polygonal shape, in particular a triangular shape, a rectangular shape or a hexagonal shape.
  • In a further possible embodiment of the passive cooling module according to the first aspect of the present invention, the passive cooling module has a L-shape or a T-shape.
  • The invention further provides according to a further aspect a cooling structure comprising a plurality of passive cooling modules according to the first aspect of the present invention, wherein each cooling module carries at least one heat generating element.
  • In a possible embodiment of the cooling structure according to the second aspect of the present invention, the heat generating element comprises at least one electronic component.
  • In a further possible embodiment of the cooling structure according to the second aspect of the present invention, the heat generating elements carried by the passive cooling modules of said cooling structure are electrically connected to each other via electric cables.
  • In a further possible embodiment of the cooling structure according to the second aspect of the present invention, at least one fan is mounted to said cooling structure,
    wherein said fan supplies air as a cooling fluid to the heat sink elements of passive cooling modules assembled within said cooling structure.
  • In the following, possible embodiments of the different aspects of the present invention are explained in more detail with reference to the enclosed figures.
    • Fig. 1
    shows a first possible embodiment of a passive cooling module according to the first aspect of the present invention;
    Fig. 2
    shows a perspective view of the passive cooling module according to the first embodiment as illustrated in Fig. 1;
    Fig. 3
    shows an exemplary embodiment of a passive cooling structure according to the second aspect of the present invention made of passive cooling modules as illustrated in Figs. 1 and 2;
    Fig. 4
    shows a further exemplary passive cooling structure according to the second aspect of the present invention made of passive cooling modules as illustrated in Figs. 1 and 2;
    Fig. 5
    shows a further exemplary cooling structure made of passive cooling modules as illustrated in Figs. 1 and 2;
    Fig. 6
    shows a diagram for illustrating the operation of a passive cooling module according to a preferred embodiment;
    Fig. 7
    shows a top view of a cooling structure made of four assembled passive cooling modules as illustrated in Figs. 1 and 2;
    Fig. 8
    shows a top view of a further exemplary embodiment of a cooling structure made of six identical triangular passive cooling modules according to the first aspect of the present invention;
    Fig. 9
    shows an exemplary complex cooling structure according to the second aspect of the present invention comprising a plurality of assembled passive cooling modules according to the first aspect of the present invention;
    Fig. 10
    shows a further exemplary embodiment of a passive cooling structure according to the second aspect of the present invention consisting of several L-shaped passive cooling modules according to the first aspect of the present invention;
    Fig. 11
    shows a further exemplary cooling structure according to the second aspect of the present invention consisting of two complementary L-shaped passive cooling modules according to the first aspect of the present invention;
    Fig. 12
    shows a further exemplary cooling structure according to the second aspect of the present invention comprising several rectangular passive cooling modules according to the first aspect of the present invention;
    Fig. 13
    illustrates a further exemplary embodiment of a passive cooling structure according to the second aspect formed by a plurality of rectangular passive cooling modules according to the first aspect of the present invention;
    Fig. 14
    shows a further exemplary embodiment of a cooling structure according to the second aspect of the present invention comprising several hexagonal passive cooling modules according to the first aspect of the present invention.
    Fig. 15
    shows a further exemplary embodiment of a cooling structure according to the second aspect of the present invention.
    As can be seen in Fig. 1 illustrating an exemplary embodiment of a passive cooling module 1 according to the first aspect of the present invention the illustrated passive cooling module 1 has a shape adapted to be assembled with one or more further passive cooling modules having a matching shape to form a cooling structure according to the second aspect of the present invention. In the shown embodiment of Fig. 1, the passive cooling module 1 comprises a triangular shape. The illustrated passive cooling module 1 comprises a base plate 2 with at least one heat generating element 3 which is attached to the base plate 2. In a possible embodiment, a heat generating element 3 is fixed to said base plate 2 by mechanical fastening means comprising screws, bolts, etc. Alternatively, an adhesive can be used to fix the heat generating element 3 to the base plate 2. The base plate 2 is adapted to receive heat from the attached heat generating element 3. As can be seen in the embodiment of Fig. 1, heat sink elements 4-1, 4-2...4-n are connected to said base plate 2 to transfer heat from said base plate 2 to a surrounding fluid. In a possible embodiment, the heat sink elements 4-i comprise heat sink fins as shown in Fig. 1. The shown heat sink elements 4-i can extend in a possible embodiment perpendicular from the base plate 2 as shown in Fig. 1. In the embodiment shown in Fig. 1, the heat sink elements 4-i vary in length and are enclosed by a metal plate 5 to provide a triangular shape of the passive cooling module 1. As shown in Fig. 1, the base plate 2 can comprise on one side several grooves for inserting the heat sink elements 4-i which can be soldered to the base plate 2 using a soldering agent. The number of heat sink elements 4-i can vary. In the illustrated embodiment of Fig. 1, the passive cooling module 1 comprises eight heat sink fins arranged in parallel to each other and attached to the base plate 2 by inserting the heat sink fins on one side into a corresponding groove 6-i and soldering the heat sink fins to said base plate 2. As shown in Fig. 1, each heat sink fin can be bent at the other end so that the surrounding metal plate 5 can be soldered to the heat sink fins 4-i. The parallel arranged heat sink fins 4-i as shown in the embodiment of Fig. 1 form fluid channels for a cooling fluid such as water, air or oil. The cooling fluid moving along the heat sink elements 4-i can receive thermal energy from the heat sink elements 4-i to cool the at least one heat generating element 3 attached to the base plate 2 of the passive cooling module 1.
  • In a possible embodiment, a heat spreading element 7 is attached to the base plate 2. The heat spreading element 7 is adapted to spread heat received from the heat generating element 3 across the base plate 2 of the passive cooling module 1. In this way, the received heat is spread out by the heat spreading element 7 to all heat sink elements 4-i connected to the base plate 2. In a further possible embodiment, a thermally conductive pad 8 is provided between the heat generating element 3 and the heat spreading element 7.
  • The heat generating element 3 can comprise one or several electronic components mounted for instance on a printed circuit board which during operation consume electrical power and generate thermal energy. In a possible embodiment, the base plate 2, the heat sink elements 4-i and the surrounding metal plate 5 can be made of aluminium or aluminium alloys. In an alternative embodiment, other thermally conductive materials can be used such as copper or diamonds.
  • Fig. 2 shows a perspective view on the passive cooling module 1 as illustrated in Fig. 1. In the shown embodiment, the base plate 2 is formed to receive two heat spreading elements 7A, 7B, where two different heat generating elements can be attached to the base plate 2, for instance by screws. Fig. 2 shows receiving holes 9A-1 to 9A-4 for mounting a first heat generating element 3A to the base plate 2 by means of screws and receiving holes 9B-1 to 9B-4 for mounting a second heat generating element 3B to the second heat spreader 7B on the base plate 2. The number of heat spreading elements 7 inserted in or attached to the base plate 2 can vary.
  • Fig. 3 shows an exemplary embodiment of a cooling structure 10 according to the second aspect of the present invention comprising four passive cooling modules 1-1, 1-2, 1-3, 1-4 as shown in Fig. 2. The four passive cooling modules 1-1, 1-2, 1-3, 1-4 are connected to each other in a preferred embodiment by means of screws to form the passive cooling structure 10 as shown in Fig. 3. Since the passive cooling modules 1-i as shown in Figs. 1, 2 have a equilateral triangle shape, a square or quadratic passive cooling structure 10 consisting of four passive cooling modules 1-i is formed as shown in Fig. 3. The outer periphery of this passive cooling structure 10 is formed by the base plates 2-1, 2-2, 2-3, 2-4 of the passive cooling modules 1-1, 1-2, 1-3, 1-4, respectively. Accordingly, in the embodiment as illustrated in Fig. 3, the heat generating elements 3-i such as electronic circuits or electronic components can be attached to the outer periphery of the passive cooling structure 10 which carries the heat generating elements 3-i and cools the heat generating elements 3-i at the same time. In a possible embodiment, a fan can be mounted to the cooling structure 10 as shown in Fig. 3. The fan can supply a cooling fluid, in particular air, to the heat sink elements or heat sink fins of the passive cooling modules 1-i assembled within the cooling structure 10. In an alternative embodiment, if no fan is provided the cooling structure 10 as shown in Fig. 3 can be mounted such that the cooling fluid, i.e. air, passes along the heat sink elements 4-i vertically to improve convection. In a possible embodiment of the passive cooling structure 10 as shown in Fig. 3, different heat generating elements 3-i attached to the base plates 2-i via the heat spreading elements 7-i can be electrically connected to each other via electric or electronic cables. In this way, the cooling structure 10 can carry a plurality of complex or less complex electronic heat generating components 3-i which form a complex electronic circuit.
  • Fig. 4 shows a further exemplary embodiment of a passive cooling structure 10 made of four passive cooling modules 1-i as shown in Figs. 1, 2. As can be seen from Figs. 3, 4, the passive cooling structures 10 shown in Figs. 3, 4 use the same basic passive cooling modules 1-i but have a completely different structural form.
  • Fig. 5 shows a further exemplary cooling structure 10 made of passive cooling modules 1-i as shown in Figs. 1, 2. The cooling structure 10 illustrated in Fig. 5 comprises eight passive cooling modules 1-i and can be made of two cooling structures 10 as shown in Fig. 4. As can be seen from the exemplary embodiments shown in Figs. 3, 4, 5, by using the same passive cooling modules 1-i different cooling structures 10 of completely different form can be created. The form of the passive cooling structures 10 can be adapted to a specific surrounding or available place in a transporting container or casing of a machine.
  • In a possible embodiment of the passive cooling module 1 according to the first aspect of the present invention, the passive cooling module 1 comprises a heat spreading element 7 which has at least one vacuum-sealed chamber filled with a liquid. In a possible embodiment, the liquid is formed by water. In a possible embodiment, the liquid within the vacuum-sealed chamber of the heat spreading element 7 can be absorbed by a copper-mesh wick. In a possible embodiment, the heat spreader 7 comprises a copper encased two-phase vapour chamber into which pure water is vacuum-sealed. The water can be absorbed by a copper-mesh wick and passes as vapour through a micro-perforated copper sheet where it cools and returns as a liquid to the copper-mesh wick. As soon as external heat reaches the enclosed water, the water turns to steam or vapour passing through the micro-perforated copper sheet. The water moves through micro channels changing from water to vapour and back to water removing excess heat. The heat spreader 7 spreads the received heat across the base plate 2 of the passive cooling module 1 so that the heat reaches the heat sink elements 4-i attached to the base plate 2. The heat sink elements 4-i transfer the received heat to the cooling fluid such as air.
  • Fig. 6 shows a diagram illustrating the operation of a heat spreading element 7 comprising a vacuum-sealed chamber filled with water. The thermal conductivity of the heat spreading element 7 depends on the temperature T as illustrated in the diagram of Fig. 6. If the temperature T falls beneath 0°C, the water freezes and the thermal conductivity of the heat spreading element 7 becomes very low, i.e. almost zero. If the temperature T rises beyond 0°C, the frozen liquid, i.e. water, becomes fluid and the thermal conductivity of the heat spreading element 7 increases rapidly in a step function as shown in Fig. 6. Accordingly, when the passive cooling module 1 is used in a surrounding with very low temperatures under 0°C, the heat spreading element 7 has a very low thermal conductivity and isolates the heat generating element 3 from the base plate 2 of the passive cooling module 1. As the heat generating element 3 comprises electronic components, this has the significant advantage that the electronic components are not cooled by the passive cooling module 1 and no energy has to be wasted to warm up the heat generating electronic components 3 and to keep them in their regular operation temperature range.
  • In contrast, if the heat generating electronic components 3 operate in a surrounding temperature of more than 0°C, the thermal conductivity of the heat spreading element 7 is high as shown in Fig. 6 so that heat generated by the heat generating elements 3 is transported efficiently by the heat spreading element 7 and spread out across the base plate 2 of the passive cooling module 1 so that the heat generated by the heat generating components 3 is transferred efficiently to the heat sink elements 4-i. The threshold temperature TTH of the diagram illustrated in Fig. 6 depends on the liquid filled within the vacuum-sealed chamber of the heat spreading element 7. In a possible embodiment, the threshold temperature TTH is adapted to the operation temperature range of the heat generating element 3 attached to the passive cooling module 1. The size and width of the heat spreading element 7 can vary depending on the size of the base plate 2.
  • Fig. 7 shows a top view of a passive cooling structure 10 as shown in Fig. 3 consisting of four passive cooling modules 1-i as shown in the embodiment of Fig. 1, 2. In the shown embodiment, the cooling structure 10 carries four heat generating elements 3-1, 3-2, 3-3, 3-4 which can comprise one or several electronic components generating heat during operation. The electronic components 3-i are connected to each other via electronic cables 11-i as illustrated in Fig. 7. The different electronic components 3-i can form a complex electronic circuit cooled by the cooling structure 10 as shown in Fig. 7. Also channels between heat sink elements can be used for cabling.
  • Fig. 8 shows a further exemplary passive cooling structure 10 made of six equilateral triangular passive cooling modules 1-i. In the shown embodiment, the cooling structure 10 carries six different heat generating elements 3-i.
  • Fig. 9 shows a further more complex passive cooling structure 10 consisting of a plurality of triangular shaped passive cooling modules 1-i. The passive cooling structure 10 is a frame carrying ten heat generating elements 3-1 to 3-10 facing outwards and six heat generating elements 3-11 to 3-16 facing inwards. The different electronic heat generating components 3-i can perform different functions in a complex electronic circuitry. In the exemplary embodiment as shown in Fig. 9, the inward facing electronic components 3-i can be for instance very sensitive components which have to be protected against mechanical shock or vibrations and/or electromagnetic fields. Since the heat generating electronic elements 3-11 to 3-16 are surrounded by the passive cooling structure 10, they are automatically protected to some extent against mechanical damage or mechanical shocks. In contrast, the outer heat generating components 3-1 to 3-10 can be formed by less sensitive electronic components, in particular electromechanical components. In a further possible embodiment, the outer heat generating electronic elements 3-1 to 3-10 can be formed by elements having an interface function in the complex electronic circuit, whereas the inner heat generating electronic components 3-11 to 3-16 form core components of the complex circuit such as data processing elements. The different electronic components or heat generating elements 3-i as shown in Fig. 9 can be connected to each other via electric cables not illustrated in Fig. 9.
  • Fig. 10 shows a further exemplary embodiment of a passive cooling structure 10 consisting of four L-shaped passive cooling modules 1-1, 1-2, 1-3, 1-4 each carrying a heat generating element 3-1, 3-2, 3-3, 3-4. The cooling structure 10 shown in Fig. 10 also forms a frame similar to the cooling structure shown in Fig. 9.
  • Fig. 11 shows a further exemplary embodiment of a passive cooling structure 10 consisting of two complementary L-shaped passive cooling modules 1-1, 1-2 each carrying a heat generating element 3-1, 3-2.
  • Fig. 12 shows a further exemplary embodiment of a cooling structure consisting of four square passive cooling modules 1-1, 1-2, 1-3, 1-4 carrying four heat generating elements 3-1, 3-2, 3-3, 3-4.
  • Fig. 13 shows a further exemplary embodiment of a square passive cooling structure 10 consisting of nine identical square passive cooling modules 1-1 to 1-9, where each passive cooling module carries at least one heat generating element 3-i.
  • Fig. 14 shows a further exemplary embodiment of a passive cooling structure 10 formed by four hexagonal passive cooling modules 1-i each carrying at least one heat generating element 3-i.
  • Fig. 15 shows a further exemplary embodiment of a passive cooling structure 10 consisting of several passive cooling modules 1-i of different matching shape. The passive cooling structure 10 forms an arc and comprises seven passive cooling modules 1-1, 1-2, 1-3, 1-4, 1-5, 1-6, 1-7. Each passive cooling module 1-i carries at least one heat generating element 3-i. In the shown embodiment, the passive cooling module 10 consists of passive cooling modules of different types. The first, third and fifth and seventh passive cooling modules 1-1, 1-3, 1-5, 1-7 within the arc-shaped passive cooling structure 10 are formed by square-shaped passive cooling modules, whereas the second, fourth and sixth passive cooling modules 1-2, 1-4, 1-6 are formed by triangular passive cooling modules. In the illustrated embodiment, the side length of the square-shaped passive cooling modules 1-1, 1-3, 1-5, 1-7 matches the side length of the triangular passive cooling modules 1-2, 1-4, 1-6 to form a compact structure. By connecting two passive cooling structures 10 as illustrated in Fig. 15, even a circular-shaped complex cooling structure can be created.
  • As can be seen from the wide variety of different cooling structures as illustrated in Figs. 7 to 15, with the passive cooling modules 1 according to the present invention, it is possible to construct cooling structures with very different forms and shapes in a modular way. The created cooling structure 10 can be specifically adapted to the respective use case. The created cooling structure 10 has a low weight and provides high mechanical resistance. The cooling structure 10 is formed by assembling a plurality of passive cooling modules 1 to each other and can carry a plurality of even heavy heat generating elements 3-i or of the components wherein it cools the heat generating elements 3-i at the same time very efficiently. The cooling structure 10 is also able to carry additional elements or devices such as cooling fans. Further, the cooling structure 10 allows to mount different types of heat generating elements or components 3-i to face outwards or to face inwards depending on the respective function and/or sensitivity of the mounted heat generating element 3-i. This increases flexibility in the design of a complex electronic circuit consisting of a plurality of heat generating components 3-i and allows to locate the heat generating elements or components according to their sensitivity and function at a proper place outside or inside a passive cooling structure frame 10. The cooling structure 10 can be adapted in its form to a surrounding carrying container or bag or to the available place within the casing of a complex machine. The passive cooling structure 10 can be scaled to the number of heat generating components 3 within the complex circuit. The passive cooling modules 1 used in the cooling structure 10 are mechanically robust and provide efficient cooling of the mounted heat generating components 3.

Claims (15)

  1. A passive cooling module (1) having a shape adapted to be assembled with one or more passive cooling modules having a matching shape to form a cooling structure,
    said passive cooling module (1) comprising
    a base plate (2) to receive heat from at least one heat generating element (3) attached to said base plate (2), wherein heat sink elements (4) are connected to said base plate (2) to transfer heat from said base plate (2) to a surrounding fluid.
  2. The passive cooling module according to claim 1, wherein at least one heat spreading element (7) is attached to said base plate (2),
    wherein said heat spreading element (7) is adapted to spread heat received from a heat generating element (3) attached to said heat spreading element (7) across said base plate (2) of said passive cooling module (1).
  3. The passive cooling module according to claim 2, wherein said heat spreading element (7) comprises a vacuum-sealed chamber filled with a liquid.
  4. The passive cooling module according to claim 3, wherein said liquid within said vacuum sealed chamber is formed by water absorbed by a copper-mesh wick and passes as vapour through a micro-perforated copper sheet where it cools and returns as liquid to the copper-mesh wick within said vacuum sealed chamber.
  5. The passive cooling module according to one of the preceding claims 1 to 4, wherein said heat sink elements (4) comprise heat sink fins.
  6. The passive cooling module according to one of the preceding claims 1 to 5, wherein the fluid surrounding said heat sink elements (4) is formed by air or water.
  7. The passive cooling module according to one of the preceding claims 1 to 6, wherein the heat sink elements (4) extend perpendicular from said base plate (2) and are enclosed by a metal plate (5).
  8. The passive cooling module according to one of the preceding claims 2 to 7,
    wherein a thermally conductive pad (8) is provided between the heat generating element (3) and said heat spreading element (7).
  9. The passive cooling module according to one of the preceding claims 1 to 8, wherein said base plate (2), the heat sink elements (4) and the metal plate (5) of the passive cooling module are made of aluminium.
  10. The passive cooling module according to one of the preceding claims 1 to 9, wherein said passive cooling module (1) has a polygonal shape, in particular a triangular shape, a rectangular shape or a hexagonal shape.
  11. The passive cooling module according to one of the preceding claims 1 to 9, wherein said passive cooling module (1) has an L-shape or a T-shape.
  12. A cooling structure comprising a plurality of passive cooling modules according to one of the preceding claims 1 to 11, each carrying at least one heat generating element (3).
  13. The cooling structure according to claim 12, wherein said heat generating element (3) comprises at least one electronic component.
  14. The cooling structure according to claim 12 or 13, wherein the heat generating elements (3) carried by the passive cooling modules (1) of said cooling structure (10) are electrically connected to each other via electric cables.
  15. The cooling structure according to one of the preceding claims 12 to 14, wherein at least one fan is mounted to said cooling structure (10),
    wherein said fan supplies air as a cooling fluid to the heat sink elements (4) of passive cooling modules (1) assembled within said cooling structure (10).
EP15174978.5A 2015-07-02 2015-07-02 Passive cooling module Active EP3113221B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP15174978.5A EP3113221B1 (en) 2015-07-02 2015-07-02 Passive cooling module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP15174978.5A EP3113221B1 (en) 2015-07-02 2015-07-02 Passive cooling module

Publications (2)

Publication Number Publication Date
EP3113221A1 true EP3113221A1 (en) 2017-01-04
EP3113221B1 EP3113221B1 (en) 2020-03-18

Family

ID=53719618

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15174978.5A Active EP3113221B1 (en) 2015-07-02 2015-07-02 Passive cooling module

Country Status (1)

Country Link
EP (1) EP3113221B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019057416A1 (en) * 2017-09-20 2019-03-28 Robert Bosch Gmbh COOLING BODY SEGMENT, REFRIGERATOR BODY AND METHOD FOR COOLING COMPONENTS
DE102024122418A1 (en) 2024-08-06 2026-02-12 Connaught Electronics Ltd. Control unit heat sink and control unit cooling arrangement as well as electronic control unit with a control unit cooling arrangement

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3277346A (en) * 1962-08-29 1966-10-04 Int Electronic Res Corp Cooler package for electronic components
DE3415554A1 (en) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Heat sink for power electronic components
JP2005264834A (en) * 2004-03-18 2005-09-29 Toyota Motor Corp Waste heat recovery device
DE102005031759A1 (en) * 2005-07-07 2007-01-18 Semikron Elektronik Gmbh & Co. Kg Converter arrangement for use in dynamically controlled motor, has cooling device comprising metallic mold bodies, and cooling surfaces formed with cooling units, where cooling medium e.g. air, flows through cooling device
EP2672618A1 (en) * 2012-06-04 2013-12-11 ABB Oy Modular motor inverter arrangement with cooling sections forming inner duct ring capacitor on the outside
GB2520108A (en) * 2013-08-28 2015-05-13 Hamilton Sundstrand Corp Fin-diffuser heat sink with high conductivity heat spreader

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3277346A (en) * 1962-08-29 1966-10-04 Int Electronic Res Corp Cooler package for electronic components
DE3415554A1 (en) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Heat sink for power electronic components
JP2005264834A (en) * 2004-03-18 2005-09-29 Toyota Motor Corp Waste heat recovery device
DE102005031759A1 (en) * 2005-07-07 2007-01-18 Semikron Elektronik Gmbh & Co. Kg Converter arrangement for use in dynamically controlled motor, has cooling device comprising metallic mold bodies, and cooling surfaces formed with cooling units, where cooling medium e.g. air, flows through cooling device
EP2672618A1 (en) * 2012-06-04 2013-12-11 ABB Oy Modular motor inverter arrangement with cooling sections forming inner duct ring capacitor on the outside
GB2520108A (en) * 2013-08-28 2015-05-13 Hamilton Sundstrand Corp Fin-diffuser heat sink with high conductivity heat spreader

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019057416A1 (en) * 2017-09-20 2019-03-28 Robert Bosch Gmbh COOLING BODY SEGMENT, REFRIGERATOR BODY AND METHOD FOR COOLING COMPONENTS
CN111095539A (en) * 2017-09-20 2020-05-01 罗伯特·博世有限公司 Cooling body segment for a cooling component, cooling body and method
JP2020534699A (en) * 2017-09-20 2020-11-26 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ How to cool heatsink segments, heatsinks and components
DE102024122418A1 (en) 2024-08-06 2026-02-12 Connaught Electronics Ltd. Control unit heat sink and control unit cooling arrangement as well as electronic control unit with a control unit cooling arrangement

Also Published As

Publication number Publication date
EP3113221B1 (en) 2020-03-18

Similar Documents

Publication Publication Date Title
JP4152467B2 (en) Heat removal device from PC card array
US5168919A (en) Air cooled heat exchanger for multi-chip assemblies
US7286352B2 (en) Thermally expanding base of heatsink to receive fins
EP4030264B1 (en) Systems for cooling electronic components in a sealed computer chassis
JP5765897B2 (en) Heat sink including a base plate structure having a periodic pattern, and related apparatus and method (heat sink including a base plate structure having a periodic pattern)
US20040218362A1 (en) System and apparatus for heat removal
US7505272B2 (en) Heat sinks for dissipating a thermal load
EP2693859A2 (en) Systems and methods for dissipating heat in an enclosure
BR102017008697A2 (en) THERMAL MANAGEMENT SYSTEM
CN114503795B (en) Thermal control system for mesh network device and associated mesh network device
EP2658359B1 (en) Thermal separation of electronic control chassis heatsink fins
US9804644B2 (en) Thermally conductive and vibration damping electronic device enclosure and mounting
CN108207103A (en) electronic chassis assembly
EP3113221B1 (en) Passive cooling module
MXPA03004441A (en) HIGH PERFORMANCE THERMAL BATTERY SETTINGS TO BE USED IN HIGH DENSITY PACKAGING APPLICATIONS.
US10079042B2 (en) Thermally conductive and vibration damping electronic device enclosure and mounting
EP3806492B1 (en) Passive thermal-control system of a mesh network device and associated mesh network devices
US7400502B2 (en) Connector heat transfer unit
EP3560308B1 (en) A computer circuit board cooling arrangement
US11026343B1 (en) Thermodynamic heat exchanger
JP5773976B2 (en) refrigerator
Kumar et al. Thermal Analysis of Rectangular and Tapered Pin fins heat sink using Icepak
RU152503U1 (en) PASSIVE HEAT REMOVAL SYSTEM FROM ELECTRONIC COMPONENT
WO2014182403A1 (en) Printed circuit board heat dissipation system

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN PUBLISHED

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20170512

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20170727

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20191021

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602015048886

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1246899

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200415

Ref country code: IE

Ref legal event code: FG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200618

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20200318

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200619

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200618

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200718

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200812

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1246899

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200318

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602015048886

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602015048886

Country of ref document: DE

26N No opposition filed

Effective date: 20201221

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20200702

REG Reference to a national code

Ref country code: DE

Ref legal event code: R073

Ref document number: 602015048886

Country of ref document: DE

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20200731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200702

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200702

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200731

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200731

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200731

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200702

REG Reference to a national code

Ref country code: DE

Ref legal event code: R074

Ref document number: 602015048886

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200731

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210202

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

REG Reference to a national code

Ref country code: GB

Ref legal event code: S28

Free format text: APPLICATION FILED

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210202

PGRI Patent reinstated in contracting state [announced from national office to epo]

Ref country code: DE

Effective date: 20210507

REG Reference to a national code

Ref country code: GB

Ref legal event code: S28

Free format text: RESTORATION ALLOWED

Effective date: 20210802

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200731

PGRI Patent reinstated in contracting state [announced from national office to epo]

Ref country code: FR

Effective date: 20210707

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200318

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230525

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20250722

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20250724

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20250723

Year of fee payment: 11

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602015048886

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01L0023360000

Ipc: H10W0040200000