EP3088798A2 - Procede et dispositif d'agencement d'un porte-circuit comprenant une source lumineuse semi-conductrice dans un emplacement defini par rapport a un systeme optique d'un dispositif d'eclairage - Google Patents
Procede et dispositif d'agencement d'un porte-circuit comprenant une source lumineuse semi-conductrice dans un emplacement defini par rapport a un systeme optique d'un dispositif d'eclairage Download PDFInfo
- Publication number
- EP3088798A2 EP3088798A2 EP16167219.1A EP16167219A EP3088798A2 EP 3088798 A2 EP3088798 A2 EP 3088798A2 EP 16167219 A EP16167219 A EP 16167219A EP 3088798 A2 EP3088798 A2 EP 3088798A2
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- EP
- European Patent Office
- Prior art keywords
- optical system
- light
- circuit carrier
- emitting region
- relative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/147—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device
- F21S41/148—Light emitting diodes [LED] the main emission direction of the LED being angled to the optical axis of the illuminating device the main emission direction of the LED being perpendicular to the optical axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/19—Attachment of light sources or lamp holders
Definitions
- the present invention relates to a method and a device for arranging a circuit carrier in a specific position relative to an optical system of a lighting device.
- the circuit carrier has at least one semiconductor light source mounted thereon.
- the invention also relates to a lighting device with an optical system and a circuit carrier arranged according to this method relative to the optical system.
- the circuit carrier is then arranged with the mounted or LEDs mounted in the optical system of a lighting device and fixed there.
- the circuit carrier has reference points or markings which are arranged relative to at least one corresponding reference region of the optical system. Because of from the WO 2014/153576 A1 known high-precision placement method of the LEDs on the circuit board, the light-emitting areas of the LEDs are thus also arranged more precisely with respect to the rest of the optical system. However, the purely mechanical positioning of the circuit carrier in the optical system leads to inaccuracies.
- the present invention Based on the described prior art, the present invention, the object of the accuracy in the positioning and alignment of light emitting surfaces of semiconductor light sources relative to an optical system of a lighting device to improve.
- At least one light-emitting region of the at least one semiconductor light source is optically detected, the optically detected at least one light-emitting region for determining an actual position of the at least one light-emitting region with respect to at least a reference range of the optical system is evaluated, a desired position of the at least one light emitting area is specified with respect to the at least one reference range of the optical system, the determined actual position with the predetermined desired position for determining a positional difference of the at least one light emitting area the at least one semiconductor light source is compared relative to the optical system, and a relative movement of the circuit carrier relative to the optical system for reducing, preferably for minimizing the position difference is performed.
- the circuit carrier with the semiconductor light source, in particular the light-emitting region of the semiconductor light source, and at least a part of the optical system, for example by means of a camera.
- a reference region of the optical system is detected.
- the actual position (position and orientation) of the light-emitting region of the semiconductor light source relative to the reference region can be determined.
- a corresponding desired position is specified. This was previously calculated or based on practical experiments on prototypes of the optical system or determined by simulation using a suitable simulation tool. By comparing the desired position with the actual position, a position difference can be determined.
- a relative movement of the circuit carrier with the light-emitting region on the one hand and the rest of the optical system on the other hand can be carried out so that the position difference is minimized.
- the position of the circuit carrier is set relative to the rest of the optical system exactly to the desired position.
- the relative movement between the light-emitting region of the semiconductor light source and the reference region of the optical system includes, for example, a displacement in the surface extension (in an XY plane) of the light-emitting region and a rotation about a perpendicular axis (about a Z-axis).
- the lower side or a lower wall of the reflector in the XY plane simultaneously forms a bearing surface for the semiconductor light source.
- the underside of the lower wall of the reflector is preferably flat and formed without steps or bulges.
- the light-emitting region can be positioned and aligned with an accuracy of approximately +/- 50 ⁇ m relative to the optical system, for example in the form of a reflector or its reflection surface.
- a particular advantage of the present invention is that a complex and expensive placement of semiconductor light sources on a circuit carrier can be dispensed with. It can be used a simple and inexpensive process.
- the desired high accuracy between the light emitting area of the semiconductor light sources and the rest of the optical system is - regardless of the placement of the semiconductor light sources on the circuit board - subsequently realized in the context of the arrangement of the circuit carrier relative to the optical system.
- improved positioning accuracy of the semiconductor light sources relative to the optical system can be realized.
- the position of the light-emitting region can be determined, for example, by means of edge detection. To improve the detection, it is conceivable to either activate the semiconductor light source during the optical detection so that the light emitting area emits light, or with the semiconductor light source switched off, to illuminate the light emitting area from outside with light which excites a converter material of the light emitting area to emit light , For example, when phosphorus is used as the converter material, it can be excited by emitting blue light to emit yellow light.
- the optical system comprises a reflector.
- the circuit carrier is arranged relative to a reflection surface of the reflector in a precise position and optionally attached.
- the reflection surface is the photometrically effective surface of the reflector.
- the reference region is preferably arranged outside the reflection surface in order not to impair the photometric properties of the reflector.
- the reflector be received by a suitable holding device or attached thereto.
- the position of the reflector in three-dimensional space is defined by mechanical application of a reference region of the reflector to a suitable delivery device whose position in space is known. About the position of Delivery device in the room so the position of the reflector is determined in the room.
- a camera detects a light-emitting region of the semiconductor light source, for example an LED emission surface or converter material there, and determines the actual position of the light-emitting region with respect to the reference region of the reflector.
- a target position of the light emitting area with respect to the reference area is predetermined.
- the semiconductor light source is preferably a light-emitting diode (LED), particularly preferably a surface-mounted (SMD) light-emitting diode which has been mounted on the circuit carrier by means of an SMT (Surface Mounted Technology) method.
- the light-emitting diode preferably comprises only one light-emitting region (so-called LED chip), but may also have a plurality of light-emitting regions (LED chips). If the LED has a plurality of LED chips, each of the LED chips is assigned to a specific reflector area or reflector section or to a specific reflector chamber. The reflector areas, reflector sections or reflector chambers can be adjusted relative to the respective associated LED chip.
- the circuit carrier is, for example, at least partially made of a metal, in particular aluminum. Of course, it can also be made of another material, for example FR4.
- the at least one reference region an integral part of a part of the optical system is that this part of the optical system is made by a tool comprising at least one tool part and that this part of the optical system and the reference area are made by the same tool part.
- the part of the optical system is a reflector
- the means for evaluating and / or the means for comparing are implemented as software that runs on a computing device of the device.
- the computing device may be a microprocessor, a microcontroller or a conventional personal computer running the necessary software to evaluate the optically detected images of the light emitting area and the actual position of the light emitting area relative to the optical system with the corresponding predetermined target Situation to compare.
- the computing device with the software running on it thus represents the control of the device according to the invention.
- the camera and an adjustment device can be connected to the computing device. The camera detects, on command of the controller, images from the light-emitting area of the semiconductor light source and also from the reference area of the optical system and returns corresponding image data to the computing device. There, the image data are evaluated in order to determine the actual position of the light-emitting area relative to the reference area.
- the predetermined target position can be stored.
- the controller calculates suitable control signals for the adjusting device in order to reduce the positional difference. In particular, the Position difference minimized.
- the controller forwards the control signals to the adjusting device.
- the adjusting device performs a relative movement of the circuit carrier relative to the optical system, for example, by moving the circuit carrier relative to the optical system, whereby the positional difference becomes smaller. Then, when a desired end position of the circuit carrier relative to the reference range of the optical system is reached, the circuit carrier can be fixed to the optical system.
- the present invention also relates to a lighting device having an optical system and a circuit carrier arranged in a specific position, which has at least one semiconductor light source mounted thereon, which is characterized in that the circuit carrier is arranged relative to the optical system such that at least one light emitting Area of the at least one semiconductor light source is arranged after an optical detection of the at least one light emitting area with the smallest possible position difference in a desired position with respect to at least one reference region of the optical system.
- the illumination device differs from known illumination devices in that a light-emitting region of a semiconductor light source is arranged particularly precisely to a light-effective region of the optical system.
- an LED chip of a light-emitting diode is positioned and aligned with high precision relative to a reflection surface of a reflector of the illumination device.
- the accuracy is in the range of at least +/- 50 ⁇ m. Experiments have shown that even accuracies of +/- 30 ⁇ m can be achieved.
- the High accuracy is particularly advantageous for LED headlamps that produce a light distribution with a light-dark border, for example, a low beam or a fog light with horizontal light-dark boundary or a Supplementfernlicht or marker light (marker light) with vertical light-dark boundaries.
- the circuit carrier together with the LED can be glued to the optical system as soon as the circuit carrier is arranged in the desired desired position relative to the optical system.
- a UV-sensitive adhesive can be used, which cures quickly upon UV irradiation.
- a reflector a peel force of at least 20 N resistance realized.
- the semiconductor light sources are, for example, designed as light-emitting diodes (LEDs). These have a light-emitting region which, for example, comprises converter material which, when illuminated by blue light from an LED, emits yellow light which turns white with the blue light of the LED Light mixes.
- LEDs light-emitting diodes
- At least one LED is mounted on a circuit carrier, which may have, for example, a metal, in particular aluminum.
- a circuit carrier which may have, for example, a metal, in particular aluminum.
- the circuit carrier with the LED or LEDs mounted thereon is arranged in the optical system of a lighting device and fixed there.
- the circuit carrier has reference points or markings which are arranged relative to at least one corresponding reference region of the optical system. The purely mechanical positioning of the circuit carrier in the optical system leads to inaccuracies.
- a circuit carrier can be arranged particularly precisely relative to the optical system of a lighting device.
- the optical system can be a light module 20 (cf. FIG. 2 ) a lighting device of a motor vehicle, for example.
- a motor vehicle headlight or a motor vehicle light be.
- the optical system 20 comprises, for example, a reflection surface 24 of a reflector 22, a light entry region of an attachment optics made of a solid transparent material for bundling light rays by refraction when entering the optics and / or exit from the optics and / or by means of total internal reflection at lateral boundary surfaces the optics, or a light entry region of a light guide or the like, in relation to a high-precision arrangement of a light emitting diode 32 is important so that the optical system 20 can produce a predetermined light distribution as accurately as possible.
- the inventive method is below Referring to the flowchart of FIG. 1 explained in more detail. In advance of the process, an LED 32 by any method, for example.
- the inventive method begins in a functional block 2.
- a functional block 4 at least one light-emitting region 34 of the at least one semiconductor light source 32 is optically detected.
- an LED 32 with a light-emitting region 34 is arranged on the circuit substrate 30, an LED 32 with a light-emitting region 34.
- the optical detection of the light-emitting region 34 can be carried out, for example, with a camera 52 of a device 50 according to the invention (cf. FIG. 8 ). The camera 52 looks over a mirror 54 at the light emitting area 34 of the LED 32.
- the optically detected at least one light-emitting region 34 is then evaluated to determine its actual position with respect to at least one reference region of the optical system 20.
- This can be done, for example, in a computing device 56 of the device 50.
- the computing device 56 is, for example, a personal computer on which a suitable computer program runs, which is programmed to evaluate the at least one light-emitting region 34 and carries out the evaluation when it runs on the computing device 56.
- the recorded images of the light-emitting region 34 are transmitted to the arithmetic unit 56 via one or more data transmission connections, for example in the form of data lines 58.
- the data transmission can also be wireless, for example via radio.
- the computing device 56 has a microprocessor 60 which is designed to execute the computer program.
- the computer program can be stored on a memory element 62 of the computing device 56 and transmitted to the microprocessor 60 for execution, either by command or as a whole.
- the reference region preferably comprises at least one clearly visible surface, edge or contour of the optical system 20.
- the reference region clearly defines a position of the optical system 20 in three-dimensional space.
- the reference region comprises a contoured recess in an upper wall of the reflector 22 or end surfaces 26, 28 defined thereby (cf. FIGS. 4 and 5 ).
- the reference regions 26, 28 are arranged outside a photometrically effective region of the optical system 20, in particular outside the reflection surface 24, in order not to impair the photometric properties of the reflector 22.
- the reference regions comprise two end faces 26, which open at right angles to one another and open in the direction of light exit 36, and also have a flat end face 28, which is perpendicular to the light exit direction 36.
- the at least one reference region 26, 28 is an integral part of a part 22 of the optical system 20.
- This part 22 of the optical system 20 is produced by a tool comprising at least one tool part.
- This part 22 of the optical system 20 and the reference region 26, 28 are manufactured by the same tool part.
- this means that the at least one reference region 26, 28 is an integral part of the reflector 22 that the Reflector 22 is made by a tool comprising at least one tool part and that the reflector 22 and the reference region 26, 28 are made by the same tool part (no use of sliders or other tool parts separate from the tool part at the location of the reference region 26, 28).
- a predetermined setpoint position of the at least one light-emitting region 34 with respect to the at least one reference region 26, 28 of the optical system 20 is also stored in the memory element 62.
- the desired position was previously determined by calculation or by practical tests on prototypes of the optical system 20, by simulation with the aid of a suitable simulation tool or by means of a suitable calibration tool.
- the ascertained actual position is compared with the predetermined desired position for determining a positional difference of the at least one light-emitting region 34 of the at least one semiconductor light source 32 relative to the optical system 20 or the at least one reference region 26, 28. This can also be done, for example, in the computing device 56 of the device 50. On the computing device 56 may run a suitable computer program that is programmed to compare the determined actual position with the predetermined target position and makes the comparison when it runs on the computing device 56.
- the computer program may be stored on the memory element 62 of the computing device 56 and transmitted to the microprocessor 60 for execution either by command or as a whole.
- a relative movement of the circuit carrier 30 relative to the optical system 20 or the reference regions 26, 28 is carried out with the aim of achieving a reduction, preferably a minimization of the positional difference between the actual and desired position of the light-emitting region 34 .
- This can be achieved, for example, by a manipulator 64 holding the circuit carrier 30, for example by means of a mechanical or pneumatic gripper 68, and moving the circuit carrier 30 relative to the optical system 20 or the reference regions 26, 28.
- the manipulator 64 has an actuator in the upper region, which transmits movements via control rods 70 to the gripper 68.
- the manipulator 64 may also be designed differently.
- control signals for the manipulator 64 are calculated as a function of the determined position difference of the at least one light-emitting region 34 of the at least one semiconductor light source 32 relative to the optical system 20 or the at least one reference region 26, 28.
- the control signals are transmitted via one or more data transmission connections, for example in the form of data lines 66, from the arithmetic unit 56 to the manipulator 64.
- the data transmission can also be wireless, for example via radio.
- the relative movement between the light-emitting region 34 of the semiconductor light source 32 and the reference region 26, 28 of the optical system 20 includes, for example, shifting in the areal extent (in an XY plane) of the light-emitting area 34 (see FIG. FIG. 6 ) and a rotation C about a perpendicular axis (about a Z-axis).
- the lower side or a lower wall of the reflector 22 simultaneously forms a bearing surface for the semiconductor light source 32 in the XY plane.
- the underside of the lower wall of the reflector 22 is preferably formed flat and without steps or bulges. In this way, the light-emitting region 34 can be positioned and aligned with an accuracy of approximately +/- 50 ⁇ m relative to the optical system 20, for example, to the reflection surface 24 of a reflector 22.
- the positioning and alignment of the circuit carrier 30 relative to the optical system 20 and the reference regions 26, 28 in functional block 10 can be done in one pass by moving the circuit carrier 30 to its target position and orientation. However, it is also conceivable that the movement and alignment take place in the context of an iterative process.
- a corresponding iteration loop 12 is in FIG. 1 drawn with dashed line.
- the circuit carrier 30 is initially moved only slightly in the direction of its target position and orientation. Then, in function block 4, the light-emitting surface 34 is detected again, in function block 6 the actual position is determined, in function block 8 the determined actual position is compared with the predetermined desired position and corresponding control signals for manipulator 64 are calculated.
- the manipulator 64 is then again supplied with the drive signals in order to move the circuit carrier 30 further in the direction of its target position and orientation.
- the iteration loop 12 can be so many times be run through until an abort criterion is met, for example. Until the position difference is smaller than a predetermined limit.
- the circuit carrier 30 arranged in or near the desired position can be fixed in a functional block 14 on the optical system 20.
- the circuit carrier 30 can be attached to the reflector 22 of a lighting device. It is conceivable, for example, an attachment by welding, gluing or staples. For bonding, a fast curing adhesive under the influence of UV radiation can be used.
- a reflection surface 24 of the reflector 22nd is positioned. In a function block 16, the method is then terminated.
- a particular advantage of the present invention is that a complex and expensive placement of semiconductor light sources 32 on a circuit carrier 30 can be dispensed with. For this purpose, a simple and inexpensive method can be used.
- the desired high accuracy between the light-emitting region 34 of the semiconductor light sources 32 and the rest of the optical system 20 is - independently of the placement of the semiconductor light sources 32 on the circuit substrate 30 - then realized in the context of the arrangement of the circuit substrate 30 relative to the optical system 20.
- improved positioning accuracy of the semiconductor light sources 32 relative to the optical system 20 be realized.
- the actual position of the light-emitting region 34 can be determined in function block 6, for example, by means of edge detection.
- a converter material of the light emitting portion 34 for emitting light.
- phosphorus when phosphorus is used as the converter material, it can be excited by emitting blue light to emit yellow light.
- the edges of the luminous surface 34 are better spaced from the surrounding dark area of the remaining semiconductor light source 32. It is essential that the light for illuminating the scene to be detected in the detection can be filtered out with a filter and only the fluorescent light is used for detection.
- the semiconductor light source 32 is preferably a light emitting diode (LED), more preferably a surface mounted (SMD) light emitting diode mounted on the circuit substrate 30 by an SMT (Surface Mounted Technology) process.
- the light-emitting diode 32 preferably comprises only one light-emitting region 34 (so-called LED chip), but may also have a plurality of light-emitting regions (LED chips).
- each of the LED chips 34 is preferably associated with a particular reflector area or reflector portion or a particular reflector chamber. The reflector areas, reflector sections or reflector chambers can be relative to their respective associated LED chip 34 can be adjusted.
- the reflector 22 be picked up or fastened at the beginning of the process by a suitable holding device.
- the position of the reflector 22 in three-dimensional space is defined by mechanical application of the reference region 26, 28 of the reflector 22 to a suitable delivery device whose position in space is known.
- the position of the reflector 22 or the reflection surface 24 in the room is determined by the position of the delivery device in the room.
- the camera 52 detects the light-emitting region 34 of the semiconductor light source 32, for example an LED emission surface or converter material there, and determines the actual position of the light-emitting region 34 with respect to the reference region 26, 28 of the reflector 22.
- a target position of the light emitting area 34 with respect to the reference area 26, 28 is predetermined.
- a camera both the semiconductor light source 32, for example.
- An LED Abstrahlober Structure or there existing converter material as the light emitting region 34, as well as the reference regions 26, 28 in the same image. This has the advantage that the reference regions 26, 28 and the measurement object can be captured in one image and evaluated together to determine the actual position of the light-emitting region 34 with respect to the image Reference range 26, 28 of the reflector 22 to determine.
- the present invention also relates to a lighting device with an optical system 20 and a circuit carrier 30 arranged in a specific position thereto, which has at least one semiconductor light source 32 mounted thereon.
- the optical system 20 is arranged together with the circuit carrier in a housing of the illumination device.
- the case is preferably made of plastic and has in the light exit direction 36 on a light exit opening, which is closed by a transparent cover.
- FIGS. 2 to 7 only the optical system 20 and the circuit carrier 30 with the semiconductor light source 32 are shown. For better clarity, the housing of the lighting device and the cover were omitted.
- the circuit carrier 30 is arranged relative to the optical system 20 such that at least one light emitting region 34 of the at least one semiconductor light source 32 after an optical detection of the at least one light emitting region 34 with the smallest possible position difference to a desired position with respect is arranged on at least one reference region 26, 28 of the optical system 20.
- the illumination device differs from known illumination devices in that a light-emitting region 34 of a semiconductor light source 32 is arranged particularly precisely to a photometrically effective region 24 of the optical system 20.
- an LED chip 34 of a light-emitting diode 32 is positioned and aligned with high precision relative to a reflection surface 24 of a reflector 22 of the illumination device.
- the accuracy is in the range of +/- 50 ⁇ m.
- the high accuracy is particularly advantageous for LED headlamps that produce a light distribution with a light-dark border, for example, a low beam or a fog light with horizontal light-dark boundary or a Generalfernlicht or marker light (marker light) with vertical light-dark boundaries.
- the reflector 22 is preferably made of a bulk molding compound (BMC).
- BMC bulk molding compound
- the reflector 22 may also be made of a thermoplastic, for example polycarbonate (PC) or another.
- PC polycarbonate
- BMC is supplied as a shapeless mass in bags or other containers. Compared to pure resin, BMC has higher strengths, stiffness and temperature limits.
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- General Engineering & Computer Science (AREA)
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015207709.8A DE102015207709A1 (de) | 2015-04-27 | 2015-04-27 | Verfahren und Vorrichtung zur Anordnung eines Schaltungsträgers mit einer Halbleiterlichtquelle in einer bestimmten Lage relativ zu einem optischen System einer Beleuchtungseinrichtung |
Publications (3)
Publication Number | Publication Date |
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EP3088798A2 true EP3088798A2 (fr) | 2016-11-02 |
EP3088798A3 EP3088798A3 (fr) | 2016-12-28 |
EP3088798B1 EP3088798B1 (fr) | 2018-07-25 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP16167219.1A Active EP3088798B1 (fr) | 2015-04-27 | 2016-04-27 | Procede et dispositif d'agencement d'un porte-circuit comprenant une source lumineuse semi-conductrice dans un emplacement defini par rapport a un systeme optique d'un dispositif d'eclairage |
Country Status (2)
Country | Link |
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EP (1) | EP3088798B1 (fr) |
DE (1) | DE102015207709A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3388737A1 (fr) * | 2017-03-30 | 2018-10-17 | Valeo North America, Inc. | Cadre de position destiné à une source de lumière |
WO2018210696A1 (fr) * | 2017-05-15 | 2018-11-22 | HELLA GmbH & Co. KGaA | Procédé de montage d'un module lumineux pour dispositif d'éclairage |
EP4375007A1 (fr) * | 2022-11-24 | 2024-05-29 | ZKW Group GmbH | Procédé d'assemblage automatisé d'un composant pour un phare de véhicule automobile |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017113673A1 (de) * | 2017-06-21 | 2018-12-27 | HELLA GmbH & Co. KGaA | Beleuchtungsvorrichtung für Fahrzeuge und Befestigungsverfahren |
DE102018113561B4 (de) * | 2018-06-07 | 2023-08-10 | Automotive Lighting Reutlingen Gmbh | Verfahren zum Montieren und Justieren eines DMD-Chips in einem Lichtmodul für einen Kraftfahrzeugscheinwerfer |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014153576A1 (fr) | 2013-02-28 | 2014-10-02 | A.B. Mikroelektronik Gesellschaft Mit Beschränkter Haftung | Procédé de montage de composants sur un support de circuits et support de circuits |
Family Cites Families (4)
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JP5055193B2 (ja) * | 2008-04-24 | 2012-10-24 | 日東電工株式会社 | 光電気混載基板の製造方法 |
AT513362B1 (de) * | 2012-08-23 | 2014-06-15 | Zizala Lichtsysteme Gmbh | Verfahren zum Positionieren eines Licht formenden Körpers |
AT513444B1 (de) * | 2012-10-09 | 2014-07-15 | Zizala Lichtsysteme Gmbh | Lichtmodul mit zwei oder mehr Reflektoren für ein Kraftfahrzeug sowie Kraftfahrzeugscheinwerfer |
DE102012111312B4 (de) * | 2012-11-23 | 2022-10-13 | HELLA GmbH & Co. KGaA | Vorrichtung und Verfahren zum Justieren eines LED-Moduls |
-
2015
- 2015-04-27 DE DE102015207709.8A patent/DE102015207709A1/de not_active Ceased
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2016
- 2016-04-27 EP EP16167219.1A patent/EP3088798B1/fr active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014153576A1 (fr) | 2013-02-28 | 2014-10-02 | A.B. Mikroelektronik Gesellschaft Mit Beschränkter Haftung | Procédé de montage de composants sur un support de circuits et support de circuits |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3388737A1 (fr) * | 2017-03-30 | 2018-10-17 | Valeo North America, Inc. | Cadre de position destiné à une source de lumière |
US10495278B2 (en) | 2017-03-30 | 2019-12-03 | Valeo North America, Inc. | Vehicle lighting device with adjustable alignment frame for an optical element and method for assembling a lighting device with an adjustable frame for an optical element |
WO2018210696A1 (fr) * | 2017-05-15 | 2018-11-22 | HELLA GmbH & Co. KGaA | Procédé de montage d'un module lumineux pour dispositif d'éclairage |
EP4375007A1 (fr) * | 2022-11-24 | 2024-05-29 | ZKW Group GmbH | Procédé d'assemblage automatisé d'un composant pour un phare de véhicule automobile |
Also Published As
Publication number | Publication date |
---|---|
EP3088798B1 (fr) | 2018-07-25 |
EP3088798A3 (fr) | 2016-12-28 |
DE102015207709A1 (de) | 2016-10-27 |
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