EP3050408A1 - Dispositif d'éclairage pourvu d'un corps substrat - Google Patents

Dispositif d'éclairage pourvu d'un corps substrat

Info

Publication number
EP3050408A1
EP3050408A1 EP14772328.2A EP14772328A EP3050408A1 EP 3050408 A1 EP3050408 A1 EP 3050408A1 EP 14772328 A EP14772328 A EP 14772328A EP 3050408 A1 EP3050408 A1 EP 3050408A1
Authority
EP
European Patent Office
Prior art keywords
coating
substrate body
lighting device
surface area
plastic material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP14772328.2A
Other languages
German (de)
English (en)
Inventor
Matthias LOSTER
Gertrud KRÄUTER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siteco GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP3050408A1 publication Critical patent/EP3050408A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern

Definitions

  • the present invention relates to aumpssvor ⁇ direction with a substrate body and an optoelectronic component thereon.
  • optoelectronic component and "LED” in the context of this disclosure refer to a radiation-emitting optoelectronic component made of a semiconducting material, for. B. on a anorga ⁇ African or organic light emitting diode.
  • the present invention is based on the technical problem of specifying a particularly advantageous lighting device with optoelectronic component.
  • this object is achieved by aadossvor ⁇ direction with a primary formed substrate body having a surface, wherein the substrate body is provided in a coating surface portion with a coating, and with an optoelectronic component which is disposed in the coating surface portion, wherein the substrate body is provided from a substrate body plastic material and thereby electrically is conductive and has a thermal conductivity of at least 5 W / mK, and wherein the coating is provided from a coating plastic material and is electrically insulating and has a coating thickness of at most 0.5 mm to heat dissipation from the compo ⁇ ment not to block in the substrate body.
  • the substrate body of the lighting device according to the invention is "urgeformt" of a plastic material (see below in detail), so, for example, an extrusion or injection molding to be.
  • plastic material may have approximately the advantage here compared to a me ⁇ -metallic material that it can be simplified terms lighter form. It may be, for example, spend less energy than for the production of a metal melt or a larger form Schatz be accessible.
  • the plastic material may bie ⁇ th in cost terms advantages.
  • a disadvantage of the plastic material may be its comparatively low thermal conductivity.
  • the thus electrically conductive substrate body is (compared to the matrix material) improved in its thermal properties and should have a thermal conductivity of at least 1 W / mK, in this order increasingly preferred at least 3 W / mK, 5 W / mK, 7 W / mK, 9 W / mK, 10 W / mK, 11 W / mK, 12 W / mK, 13 W / mK, 14 W / mK, 15 W / mK.
  • the electrical insulation of the device is used so that the coating on Example ⁇ as a printed conductor structure for the electrical contacting of the device can be provided.
  • the coating thickness is chosen to be comparatively thin, so that the heat dissipation into the substrate body is not blocked (completely interrupted), but in the ideal case only slightly deteriorated. Accordingly, the coating thickness is at most 0.5 mm, in this order ge increasingly preferably at most 0.45 mm, 0.4 mm, 0.35 mm, 0.3 mm, 0.25 mm, 0.2 mm and 0.15 mm.
  • coating thickness is taken in each case along a Norma ⁇ len to the substrate body surface area (in thickness direction) and is preferably constant over the coating surface area; otherwise “coating thickness” refers to an average of the layer thicknesses of the coating formed over the surface area of the coating, in the surface directions perpendicular to the thickness direction the areal extent of the coating is determined.
  • the coating is "electrically insulating", so for example.
  • a specific resistance of at least 10 10 ⁇ • mm / m, in this order increasingly preferably at least 10 11 ⁇ -mm / m, 10 12 ⁇ • mm / m, 10 13 ⁇ • mm / m or 10 14 ⁇ • mm / m have;. independent of possible upper limits are increasingly able to, for example, at not more than 10 25 Q-mm 2 / ni, in the ⁇ ser order preferably not more than 10 24 Q-mm 2 / m, 10 23 Q-mm 2 / m, 10 22 Q-mm 2 / m, 10 21 Q-mm 2 / m and 10 20 Q-mm 2 / m, respectively.
  • "electrically conductive” may have a resistivity of, for example, at most 10 ⁇ -mm / m, 10 ⁇ -mm / m, 10 ⁇ -mm / m, 10 3 ⁇ -mm 2 / m, 10 2 Q-mm 2 / m resp. 10 1 Q-mm 2 / m mean (possible lower limits: 5-10 -2 Q-mm 2 / m resp. 10 "1 ⁇ • mm / m).
  • Electrode conductivity of the substrate body refers to this in its entirety, that is, on the bulk material.
  • a plurality of components may also be provided on the substrate body, for example at least 2, 3, 4, 5, 6, 7, 8, 9 or 10 components. Such a plurality of components is then preferably on a back surface of the clear ⁇ directions provided continuous, ie not interrupted, coating.
  • the or the components are "placed" in the coating surface portion, a projection of the component in thicknesses ⁇ toward the substrate body surface is thus to be fully ⁇ constantly covered by the coating.
  • the component is not necessarily disposed with respect to the thickness direction directly on the coating but it may also be an additional, the assembly of the component serving planar layer and / or a conductor track structure (see below) may be arranged between the component and coating.
  • Polypropylene for example PA6, PA66, PA10, PA11, PA12
  • polyester for example, polypropylene (PP, in particular radiation-crosslinked
  • the plastic material for example, PBT, PET, PBT / PET, PCT, ABS, ABS / PC
  • polyphenylene lensulfid LCP and / or PEEK
  • the plastic material may be provided in particular in the case of Substratkör ⁇ pers as a matrix material, into which a filling - Substance is embedded (so that the substrate body is electrically ⁇ cally conductive).
  • radiation and “light” are used synonymously throughout this disclosure and may generally include, for example, ultraviolet or infrared light; preferably, they refer to the sichtba ⁇ ren region of the spectrum.
  • a preferred embodiment relates to the degree of loading coverage of the substrate body surface by the coating, so the area ratio of the substrate body surface ⁇ (total surface area) and coating surface area.
  • the surface area of the coating surface area should be at least 30 ⁇ 6, in this order increasingly preferably at least 40%, 50%, 60%, 70%, 80% or 90%, of the Bacvinin ⁇ size measured;
  • the Substratkör ⁇ perober Assembly is completely covered with the coating, which if necessary.
  • the coating thickness is at least 5 ⁇ m, in this sequence increasingly preferably at least 7.5 ⁇ m, 10 ⁇ m, 12.5 ⁇ m, 15 ⁇ m, 17.5 ⁇ m, 20 ⁇ m, 22.5 ⁇ m, 25% ym, 27.5ym and 30 ym, respectively.
  • the coating thickness is limited for thermal reasons up, a minimum thickness for reasons of electrical insulation is preferred.
  • the pre preferably at least 30 kV / mm amount, increasingly in this order preferably at least 40 kV / mm, 50 kV / mm 60 kV / mm, 70 kV / mm , 80 kV / mm, 90 kV / mm or 95 kV / mm.
  • the "plastic materials" disclosed above can be provided as a coating material with a corresponding dielectric strength.
  • the coating can then be impact-resistant to at least 0.5 kV, 0.6 kV, 0.7 kV, 0.8 kV, 0.9 kV or 1 kV, for example.
  • the coating has a thermal conductivity of not more than 2 W / mK, in this order increasingly preferably not more than 1.8 W / mK, 1.6 W / mK, 1.4 W / mK, 1.2 W / mK or 1.1 W / mK.
  • it is not necessary to set an increased thermal conductivity specifically for the coating, but rather to determine it according to the properties of the coating plastic material itself.
  • an additional filler for increasing the thermal conductivity can be dispensed with, which results in cost savings - offers advantages (and due to the low coating thickness, the heat dissipation does not deteriorate significantly).
  • the inventively provided substrate body is or is "urgeformt", so is a solid body, which was formed from egg ⁇ nem previously usually at least temporarily shapeless material and in the course of molding was substantially brought into its final form / is, for example as an extrusion part or preferably as an injection molded part, for example, the "final shape” is not changed by the removal of a burr; "Essentially” means, for example, that the shape remains unchanged at 90%, 95% and 98 "6, respectively.
  • the coating is provided as a circuit carrier, that is, a conductor track structure is arranged on the coating.
  • the wiring pattern can be applied as part of a multi-component injection molding, for example, using as a component of the coating, and as other Kom ⁇ component about a metallizable plastic injection-sen is, which is then coated electronically and / or de-energized in a bath.
  • a carrier with the conductor track structure can be inserted and back-injected with coating and preferably substrate body in a two- or preferably three-component injection molding.
  • the conductor track structure can be introduced in such an in-mold technique, for example, by stamping or spraying in the injection mold.
  • stamping or spraying in the injection mold.
  • the coating but preferably also, the substrate body injection molded, the two are thus molded together.
  • the conductor structure may for example also in a hot-embossing process on the previously applied to the substrate body (see below) / injection molded coating are imprinted, for example from a in the embossing press to ⁇ equal stamped metal foil starting.
  • the wiring pattern may also be applied with known from the semiconductor manufacturing process, that is, by appropriate masking, for example, the wiring pattern can grow on ⁇ in exposed areas of a large surface is applied (resist) mask or a previously deposited metal layer (of the (resist) mask) can be removed, for example by etching. Also possible is a plasma deposition, again in conjunction with masking.
  • the printed conductor structure can, for example, have a thickness of the printed conductor structure of min. at least 1 ym, in this order, more preferably 2 ym, 3 ym, 4 ym, 5 ym, 6 ym, 7 ym, 8 ym, 9 ym, 10 ym, 11 ym, and 12 ym, respectively; possible upper limits (independent of the lower limits) may be, for example, 100 ym, 80 ym, 60 ym, 40 ym, 30 ym and 20 ym, respectively.
  • the substrate body has an outer surface area that opposes the device, that is, on the other side of the substrate body; in the case of a plurality of components, these are preferably arranged on one side of the substrate body and the other is a corresponding outer surface area.
  • a corresponding outer surface area is provided in a preferred embodiment as the outer surface of a luminaire.
  • the inventiveness contemporary lighting device must then so back (back with respect to the light radiation) not covered by a housing element of the luminaire ⁇ to, but is exposed. It increases the integration depth.
  • the outer surface area may also be coated, so that a part of the coating surface area may at the same time also be an outer surface area.
  • a filler may also be embedded in the plastic material of the coating and / or the substrate body, which serves to adapt the color appearance of the lighting device.
  • a filler can also be embedded in the plastic material of the substrate body and / or the coating, for example, in order to impart to the surface diffuse and / or directionally reflecting or specifically absorbing properties; a color pigment ⁇ ment is particularly preferred to be ⁇ embedded in the plastic material of the substrate body, such as titanium dioxide particles.
  • the reflectivity in the visible region of the spectrum can ⁇ , in this order with increasing preference at least 30%, 40%, 50%, 60%, 70%, 80% and 90% Betra ⁇ gene insofar example, particularly preferably based on a evenly diffuse reflection.
  • the invention also relates to a lamp with a lighting device OF INVENTION ⁇ to the invention, in particular with a just described, an outer surface of the light-providing illumination device.
  • lamp may mean a device connected directly to the power supply via a socket or a clamping / screwing / soldering contact, in which one or more lighting device (s) may be arranged and held (and electrically contacted via the lamp) ,
  • the invention relates, as already mentioned, the production of a corresponding lighting device and it should be disclosed in this regard, especially the vorste ⁇ opportunities starting called for applying the conductor pattern.
  • the substrate body is in any case urgeformt, so for example injection molded or extruded ⁇ .
  • the "injection molding” refers to a substrate ⁇ body, which is released from a cavity which flowable material has been supplied before, at least within certain limits, which is hardened in the cavity at least partially. Preferably, is supplied under elevated pressure, for example at least 1 00 bar, 50 0 bar, or 1 0 0 0 bar, possible upper limits may be about 30 0 0 bar, 250 0 bar or 2250 bar.
  • the curing can be carried out, for example, at a different hardening temperature compared to the feed temperature Trap of a thermoplastic material, for example, at lesser and in the case of a thermoset material at about hö ⁇ herer temperature.
  • the specific preparation of the sub strat emotionss independently of the coating may ⁇ example, by (at least partially) immersing the Sub ⁇ strat emotionss in a bath of the coating plastics material to be applied; Furthermore, the coating plastic material z. B. also be sprayed.
  • the coating plastic material may also be applied to the substrate body as a powder coating.
  • the coating is injection molded, and it should be the above disclosed for the injection molding of the substrate body information also disclosed in this regard.
  • the substrate body and the coating are integrally formed in a multi-component injection molding process.
  • the first cavity can ⁇ example, be applied to the substrate body-plastic material, so that the first cavity is the substrate body free ⁇ ; the surface of the substrate body (or a ent ⁇ speaking part of it) then limits the second cavity with which is supplied with the coating plastics material to cure therein to the integrally formed on the substrate body coating, at least partially (demolding is already before the complete Solidification or crosslinking possible).
  • Particularly preferred is the production of Substratkör ⁇ by and coating in the multi-component injection molding ⁇ method combined with one of the above possibilities for applying the conductor track structure.
  • the invention also relates to the use of a lighting device or a lamp equipped with such an illumination device for general lighting, in particular for illumination with a fixed lamp, preferably for the lighting of a building, such as its un ⁇ indirect environment or preferably its interior.
  • FIG. 1 shows a lighting device according to the invention in a sectional view
  • FIG. 1 shows an illumination device 1 according to the invention with an injection-molded substrate body 2.
  • a surface coating region 3 of the substrate body 2 is provided with a coating 4 made of an electrically insulating coating plastic material (PA6).
  • PA6 electrically insulating coating plastic material
  • LEDs 5 are arranged, and that is finished housed, so before each encapsulated with encapsulant ⁇ mass LED chips.
  • the LEDs 5 are provided as so-called surface mounted devices, so as SMD components.
  • the LEDs 5 At their lower surfaces facing the coating surface 6, the LEDs 5 have planar contact elements, via which they are electrically conductively connected to a conductor track structure (not shown) arranged on the coating surface 6.
  • the electrically conductive connection between the contact surface and interconnect structure is Herge ⁇ provides a conductive adhesive.
  • the interconnect structure For each LED 5, the interconnect structure provides an anode and a cathode contact, so that the LEDs 5 can thus be operated alone via the interconnect structure.
  • a driver / Control electronics are provided and equally wired via the conductor track structure with the LEDs 5.
  • the wiring pattern is first inserted tool in a form, so that it is molded to the conductor track structure during the subsequent injection molding of the coating ⁇ SEN. 4
  • the substrate body is then shaped, specifically formed on the surface of the coating 4 facing away from the conductor track structure.
  • the injection molding is advantageous; However, if only plastic were provided as a carrier material, this would have disadvantages in terms of thermal properties. During operation of the lighting device 1, the power loss of the LEDs 5 is lost as heat.
  • a plastic material with embedded carbon particles 7 is provided for the substrate body 2.
  • the electrically conductive carbon particles 7 increase the thermal conductivity of the substrate body, so that it is more than 15 W / mK.
  • the electrically insulating coating 4 of PA6 is provided without filler and accordingly has only a thermal conductivity of about 1 W / mK.
  • the coating thickness is only 10 ⁇ m, the heat dissipation into the substrate body 2 is hardly hindered. Assuming an LED area of 1 mm 2, it is possible to estimate the temperature difference that can occur across the coating 4. provides. In the case of a thermal power of 1 W, it would be approximately 10 ° C. in the case of the lighting device 1 according to the invention.
  • Figure 2 illustrates the comparison just mentioned, that is in the right half of a inventive Be ⁇ leuchtungsvorraum 1 with electrically (and thus good thermally) conductive substrate body 2 and an electrically insulating coating 4 thereon.
  • a substrate of the same total thickness is shown, which is provided continuously from the electrically and thermally insulating plastic material of the coating 4.
  • the heat is spread open to the side and thus removed more efficiently overall.

Abstract

L'invention concerne un dispositif d'éclairage (1) comprenant un corps substrat (2) en matière plastique, ce corps substrat (2) étant électroconducteur et présentant ainsi une meilleure conductivité thermique. Un composant optoélectronique (5) est disposé sur le corps substrat (2), à distance de celui-ci, au-dessus d'un revêtement électro-isolant (4), l'épaisseur de ce revêtement n'étant pas supérieure à 0,5 mm, de sorte que la dissipation de chaleur vers le corps substrat (2) ne soit pas bloquée.
EP14772328.2A 2013-09-25 2014-09-23 Dispositif d'éclairage pourvu d'un corps substrat Ceased EP3050408A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013219335.1A DE102013219335A1 (de) 2013-09-25 2013-09-25 Beleuchtungsvorrichtung mit Substratkörper
PCT/EP2014/070266 WO2015044144A1 (fr) 2013-09-25 2014-09-23 Dispositif d'éclairage pourvu d'un corps substrat

Publications (1)

Publication Number Publication Date
EP3050408A1 true EP3050408A1 (fr) 2016-08-03

Family

ID=51619168

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14772328.2A Ceased EP3050408A1 (fr) 2013-09-25 2014-09-23 Dispositif d'éclairage pourvu d'un corps substrat

Country Status (4)

Country Link
EP (1) EP3050408A1 (fr)
CN (1) CN105580500A (fr)
DE (1) DE102013219335A1 (fr)
WO (1) WO2015044144A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015106865A1 (de) * 2015-05-04 2016-11-10 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Konverterbauteils

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011086789A1 (de) * 2011-11-22 2013-05-23 Osram Gmbh Kühlkörper für Halbleiterleuchtvorrichtung mit Kunststoffteilen

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7196459B2 (en) * 2003-12-05 2007-03-27 International Resistive Co. Of Texas, L.P. Light emitting assembly with heat dissipating support
US7710045B2 (en) * 2006-03-17 2010-05-04 3M Innovative Properties Company Illumination assembly with enhanced thermal conductivity
KR20100112213A (ko) * 2009-04-06 2010-10-19 삼성전기주식회사 하이브리드층을 갖는 방열기판 및 조명용 모듈 기판
EP2273182B1 (fr) * 2009-07-07 2018-12-19 Siteco Beleuchtungstechnik GmbH Elément de support à DEL tridimensionnel doté d'une conductivité thermique
DE102009054840A1 (de) * 2009-12-17 2011-06-22 Poly-Tech Service GmbH, 67681 Leuchtmittel mit einer Mehrzahl von Leuchtdioden

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011086789A1 (de) * 2011-11-22 2013-05-23 Osram Gmbh Kühlkörper für Halbleiterleuchtvorrichtung mit Kunststoffteilen

Also Published As

Publication number Publication date
DE102013219335A1 (de) 2015-03-26
WO2015044144A1 (fr) 2015-04-02
CN105580500A (zh) 2016-05-11

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