EP3015177A1 - Ultraschall-signalwandler mit einer schicht aus mikroballons - Google Patents

Ultraschall-signalwandler mit einer schicht aus mikroballons Download PDF

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Publication number
EP3015177A1
EP3015177A1 EP15192348.9A EP15192348A EP3015177A1 EP 3015177 A1 EP3015177 A1 EP 3015177A1 EP 15192348 A EP15192348 A EP 15192348A EP 3015177 A1 EP3015177 A1 EP 3015177A1
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EP
European Patent Office
Prior art keywords
layer
active element
microballoons
support element
transducer according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15192348.9A
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English (en)
French (fr)
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EP3015177C0 (de
EP3015177B1 (de
Inventor
Gérard Fleury
Laurent Chupin
Jean-Luc Guey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Imasonic
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Imasonic
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Application granted granted Critical
Publication of EP3015177C0 publication Critical patent/EP3015177C0/de
Publication of EP3015177B1 publication Critical patent/EP3015177B1/de
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/002—Devices for damping, suppressing, obstructing or conducting sound in acoustic devices

Definitions

  • the present invention relates to an ultrasonic transducer, for transmitting and / or receiving an ultrasonic wave beam.
  • ultrasound is generated with a high acoustic intensity, for example for the destruction of cancerous tissue, dislocation of blood clots or stones, or the release of chemicals.
  • Other applications are placed in the industrial field, for example in sonochemistry, in the field of communication and energy transfer, in the submarine field, in the oil field.
  • the acronym HIFU is commonly used for the English "High Intensity Focused Ultrasound".
  • the effect can be thermal or mechanical and, in the context of biological applications, can be biophysical by contributing, for example, to the activation of active chemicals, gene transfer or permeability control of a membrane.
  • the effect is located near the focal point.
  • the ultrasonic generation of high density of average power by the transducer causes the heating of this one, degrading its performances.
  • the heating of the transducer may cause its deformation by expansion, which may result in a displacement of the focal point where the ultrasonic beams converge due to the change of geometry of the transducer.
  • the heating of the transducers of the state of the art and their lack of rigidity imposes the limitation to low levels of their average transmission power per unit area.
  • the transducers of the state of the art are not entirely satisfactory, insofar as they are usually fragile.
  • an ultrasound transducer especially for medical imaging applications, with a damping and absorbing backing medium.
  • This rear medium plays primarily an acoustic role but also contributes to the mechanical strength of the entire structure of the transducer.
  • the patent application EP 1 542 005 A1 describes an ultrasound probe comprising a layer piezoelectric oscillator forming an active element, comprising, for the first time, possibly porous acoustic adaptation layers, as well as an acoustic lens, with a damping and absorbing medium at the rear.
  • This rear medium is directly in contact with the active element. There is then an acoustic coupling between the active element and this rear environment and a part of the ultrasonic wave is transmitted to the rear element and creates reflections that interfere with the emission of ultrasonic waves and adversely affect the performance of the transducer.
  • the patent application WO 2008/121238 A2 proposes to provide, in a damping and absorbing backing medium, an absorption layer for attenuating ultrasonic waves propagating in said rear medium.
  • This absorption layer consists of woven porous fibers. There is therefore an acoustic coupling between the active element and this rear environment, and a portion of the energy of the ultrasonic waves is converted into heat in these fibers, which attenuates the amplitude of the waves in the rear medium.
  • this configuration is not optimal since the power of the ultrasonic waves emitted by the active element is reduced by this absorption. As a result, the efficiency of the transducer is reduced, which prevents high power applications.
  • the absorption layer opposes heat transfer to remove the heat produced by the active element. This heat can not be removed by the rear environment, which is problematic for power applications.
  • the patent application EP 2,602,788 proposes an ultrasonic transducer, in particular a therapy transducer, comprising an active element for generating ultrasonic waves, and a support element situated at the rear of the active element, the support element comprising a front face complementary to a rear face of the active element, said support element being shaped so that the complementary rear face of the active element is in simple support without significant acoustic coupling with the front face of said support element, the active element and the support element being coupled thermally.
  • Such a transducer makes it possible to obtain a thermal coupling between the active element and the support element without acoustic coupling.
  • the front face of the support element and the rear face of the active element are shaped to define between them, when the support element and the active element are in simple support, a discontinuous layer of gas. a thickness sufficiently small to promote thermal coupling between the support member and the active element.
  • the conformation of the front face of the support element and the rear face of the active element must then be finely controlled, for example via the surface states, which complicates the manufacture of this transducer.
  • the sealing of the transducer must be ensured, to prevent water from replacing the air in the air layer, which complicates the manufacture.
  • the object of the present invention is to overcome the drawbacks of the state of the art, and in particular to make it possible to obtain a transducer without acoustic coupling between the active element and the support element, while remaining of simple design and manufacture. and inexpensive.
  • the ultrasonic transducer 1 comprises an active element 3 for generating and / or receiving ultrasonic waves, and a support element 4 located at the rear of the active element 3.
  • the rear of the active element 3 is understood to mean the the active element 3 opposed to the direction in which the active element 3 emits the useful beam of ultrasonic waves, this transmission direction corresponding to the front of the active element 3.
  • the active element 3 generally consists mainly of a piezoelectric material, possibly piezocomposite, possibly multilayer, and a set of at least two electrodes which make it possible to create an electric field in the thickness of the piezoelectric material.
  • one or more acoustic adaptation layers are integrated in this active element, on the front face of the active element 3, to facilitate acoustic transfer towards the front of the transducer 1.
  • the active element 3 can implement piezoelectric phenomena.
  • the active element 3 can be any electro-acoustic device such as a capacitive transducer, for example a capacitive micromachined transducer (or CMUT for the English Capacitive Micromachined Ultrasonic Transducer), an electrostrictive transducer, ...
  • the support member 4 serves as a form reference and mechanical reinforcement, in particular allowing the transducer 1 to withstand shocks. In addition, in case of thermal expansion of the active element 3, due to its use or external conditions, the support element 4 keeps the active element in a useful form.
  • the support element 4 has a rigidity greater than the active element 3 in order to constitute a shape reference for it.
  • the transducer comprises an assembly layer 5 between said active element 3 and said support element 4.
  • the assembly layer 5 assures the assembly of the active element 3 with the support element 4, that is to say withstands a vacuum force of at least 400 mbar, without, however, creating significant acoustic coupling, and providing some thermal coupling.
  • the acoustic coupling between the active element 3 and the support element 4 is considered significant if more than 10% of the acoustic energy produced by the active element 3 is transmitted to the support element 4.
  • the energy transmitted to the support element 4 can be estimated by comparison between the energy supplied to the active element 3 and the acoustic energy collected at the front of the active element 3, with and without the support element 4, taking care of take into account additional factors such as thermal energy or acoustic dispersion in the air.
  • the assembly layer 5 allows a thermal coupling between the active element 3 and the support element 4. This thermal coupling makes it possible to drain the heat emitted during the cycles of emission of ultrasonic waves by the active element 3 from there to the support element 4, thus allowing increased power of ultrasonic emission and / or prolonged operation.
  • the thermal coupling between the active element 3 and the support element 4 is considered satisfactory if the thermal resistance of the interface between the active element 3 and the support element 4 is less than 0.002 m 2 .KW -1 .
  • the thermal resistance is less than 0.0008 m 2 .KW -1 .
  • a heat resistance value of 0.002 m 2 .KW -1 corresponds to an air thickness of 50 ⁇ m, while that of 0.0008 m 2 .KW -1 corresponds to an air thickness of 20 ⁇ m (at the atmospheric pressure).
  • the assembly layer 5 has a thickness of between 1 .mu.m and 120 .mu.m, preferably less than 50 .mu.m, in order to promote heat transfer.
  • the apparent acoustic impedance of the assembly layer 5 is chosen very different from the acoustic impedances of the active element 3 and the support element 4. An impedance ratio greater than 100 is preferable.
  • the assembly layer 5 has an apparent acoustic impedance at 25 ° C between 300 and 150000 Pa.s / m, and preferably between 300 and 3000 Pa.s / m.
  • Such apparent acoustic impedance can be estimated by resetting a model such as a one-dimensional KLM model, as a function of electrical impedance measurement results of the transducer with and without the assembly layer 5.
  • the assembly layer 5 comprises cavities containing gas. Cavities average at least 0.5 ⁇ m and less than 50 ⁇ m in their largest dimension.
  • the gas may be air, isobutane, or another gas such as helium. The following description is made in the context of a preferred non-limiting embodiment, in which the cavities are microballoons 7 containing gas.
  • a microballoon 7 comprises a shell enclosing a gas.
  • the envelope is very thin with respect to the diameter of the microballoons.
  • the thickness of the envelope is thus less than 1 ⁇ m, and preferably less than 0.5 ⁇ m; it is for example 0.1 microns.
  • the microballoons 7 have a low density, closer to the air than that of water, typically less than 100 kg.m -3 , for example from about 55 to 65 kg.m -3 .
  • the envelope of a microballoon 7 may be made of plastic, in particular thermoplastic.
  • the envelope is a mixture of thermoplastics having different phase change temperatures.
  • the envelope is a mixture comprising mainly acrylonitrile, methacrylate and acrylate.
  • the microballoons preferably have a high compressibility, the elastic compressibility of the microballoons 7 being preferably greater than 1x10 -6 Pa -1 .
  • the volume of a microballoon 7 is reduced by elastic deformation by half compared to its volume at atmospheric pressure, and returns to its initial volume when it is again subjected to the atmospheric pressure.
  • a high compressibility of the microballoons allows the assembly layer 5 to conform to the surfaces of the active element 3 and the support element 4.
  • the layer 6 of microballoons can be constituted by a layer of cork particles, whose closed pores, filled with gas, constitute said microballoons 7 and have an average size of less than 50 ⁇ m, and preferably less than 40 ⁇ m. or even less than 30 ⁇ m.
  • microballoons 7 preferably form a continuous layer 6 in the assembly layer 5, this layer 6 extending over the entire interface between the active element 3 and the support element 4 constituted by the assembly 5.
  • the continuity of the layer 6 of microballoons 7 makes it possible to ensure the homogeneity of the characteristics of the assembly layer 5.
  • this continuous layer 6 of microballoons is a monolayer of microballoons. The fineness of such a layer 6 of microballoons 7 makes it possible to obtain a thin assembly layer 5.
  • the microballoons 7 are therefore embedded in a binder consisting of an adhesive.
  • the assembly layer 5 comprises a layer of adhesive adhering to the active element 3 and to the support element 4, the microballoon layer 6 being embedded in said layer of adhesive.
  • the glue preferably has the following characteristics. It has a low acoustic impedance, a good electrical insulation, with for example a dielectric constant of at least 4, and preferably a good thermal conduction in order to lead to the support element 4 the heat generated by the active element 3, with a thermal resistance of less than 0.002 m 2 .KW -1 , and preferably less than 0.0008 m 2 .KW -1 .
  • the adhesive has a good fluidity before polymerization, with a dynamic viscosity of less than 0.50 Pa.s (500 cP), for example 0.35 Pa.s (or 350 cP), in order to coat the microballoons 7 and to conform to the surfaces of the active element 3 and the support element 4.
  • the adhesive also has a low hardness once polymerized, to allow the adaptation of the assembly layer 5 to mechanical stresses resulting from the use of the transducer, with for example the thermal expansion of the active element 3.
  • a low hardness after polymerization provides a low acoustic impedance, which allows the active element 3 to be acoustically decoupled from the element 4.
  • the adhesive preferably has a hardness after polymerization less than 90 ShoreA, for example less than or equal to 65 ShoreA, and preferably less than 50 ShoreA, or even less than 20 ShoreA.
  • the adhesive layer may for example be a poly-epoxy resin, better known as an epoxy resin.
  • the adhesive layer 5 may comprise a first layer 51 between the microballoon layer 6 and the active element 3, and a second layer 52 between the microballoon layer 6 and the support element 4, the second layer 52 being thicker than the first layer 51, for example at least twice as thick.
  • the first layer 51 has a thickness of less than 20 ⁇ m, preferably less than 10 ⁇ m
  • the second layer 52 may have a thickness greater than 40 ⁇ m.
  • the microballoon layer 6 is thus closer to the active element 3 than to the support element 4.
  • the acoustic decoupling is then obtained by the microballoon layer 6 as close as possible to the active element 3.
  • the second layer 52 does not play an acoustic role: its characteristics can be chosen different from those of the first layer 51.
  • the first layer 51 may consist of a first material and the second layer 52 may consist of a second material different from the first material.
  • the characteristics of the first material and the second material may be selected according to the functions to be performed by their respective layers. For example, while the first material has glue characteristics discussed above, the second material may have a higher acoustic impedance.
  • the greater thickness of the second layer 52 makes it easier to manufacture the transducer, and in particular makes it possible to reduce the requirements on the surface on the front face 41 of the support element 4 since any irregularities may be absorbed by the second layer 52.
  • a second thicker layer 52 allows it to collect the differences in thermal expansion between the active element 3 and the support element 4, especially when the second material has the mechanical characteristics of the adhesive mentioned above.
  • the second material of the second layer 52 is preferably a good thermal conductor, in order to maintain the thermal coupling between the active element 3 and the support element 4, especially as the second layer 52 is thick.
  • the acoustic decoupling operated by the layer of microballoons widens the possibilities of choice of the first and second materials.
  • the second material presents a higher thermal conductivity than the thermal conductivity of the first material.
  • a layer of adhesive 51, 52 is deposited on at least one of the rear face 31 of the active element and the front face 41 of the support element.
  • a layer of adhesive 51 is deposited on the rear face 31 of the active element 3 and a layer of adhesive 52 is deposited on the front face 41 of the support element.
  • the adhesive layer 52 may be thicker and in a material different from the first adhesive layer 51. In the example illustrated by the figure 3a only the layer of adhesive 51 deposited on the rear face 31 of the active element 3 is illustrated.
  • the adhesive layer 51, 52 is thin, with a thickness of less than 40 or 50 ⁇ m, and homogeneous. It is possible to scrape the adhesive layer 51, 52 to homogenize the thickness.
  • a template can be used to ensure the thickness of the glue when scraping with a hard squeegee. However, the surface state of the scraped surface, with a hard squeegee, may be sufficient to guarantee a residual adhesive thickness after scraping.
  • the control of the glue thickness can also result from the combined choice of a flexible squeegee pressed against the surface with a controlled pressure and a scraping speed adapted according to the viscosity of the glue.
  • microballoons 7 are then deposited on the adhesive layer 51, or on only one of the adhesive layers 51, 52, so as to form a continuous layer of microballoons 7.
  • the microballoons can be placed in abundance on the glue 51, and evacuate the microballoons in excess, that is to say those that are not retained by the glue, by blowing a stream of air or shaking.
  • the Figures 3b and 3c thus illustrate respectively the case before and after evacuation of microballoons 7 in excess.
  • the rear face 31 of the active element 3 is then assembled with the front face 41 of the support element 4, as on FIG. figure 3d .
  • the active element 3 and the support element 4 are pressed against each other, and a heat treatment can optionally be carried out.
  • microballoons 7 with a diameter of between 18 and 28 ⁇ m, and thicknesses of 20 ⁇ m to 30 ⁇ m before assembly for the adhesive layers 51, 52, an assembly layer 5 with a thickness of between 35 ⁇ m is obtained. and 50 ⁇ m.
  • the thickness of the assembly layer can be calibrated by depositing shims of known thickness in the layer of glue before pressurizing the surfaces against each other. These wedges may for example take the form of son whose calibrated diameter corresponds to the target thickness of the assembly layer. For example, it may be enamelled copper wire with a diameter of 30 microns or polyethylene son of 20 microns.
  • a double-sided adhesive tape as a layer of adhesive 51, 52, on one or on each of the faces of the rear face 31 of the active element 3 and the front face 41 of the element 4.
  • the microballoons 7 are deposited as before, and the assembly is done under pressure, for example with a pressure of the order of 1 bar for 48 hours.
  • the resulting assembly layer 5 has a thickness of the order of 75 to 100 microns.
  • Another solution is to prepare a mixture of glue and microballoons, then to deposit this mixture on one face of the rear face 31 of the active element and the front face 41 of the support element, or on both sides, then to assemble as previously described, for example with a pressure of the order of 1 bar.
  • a template as previously mentioned can be used.
  • An example of a mixture comprises 14% of microballoons by volume, and the remainder of glue.
  • these preferably constitute at least 10% of the mixture by volume.
  • microballoons 7 covered with adhesive, in which case the assembly is done without adding glue.
  • Another solution is to use microballoons with thermoplastic envelope without adding glue.
  • a microballoon layer 7 with a thermoplastic envelope is deposited on one of the rear face 31 of the active element 3 and the front face 41 of the support element 4.
  • the rear face 31 of the active element 3 is then assembled.
  • the front face 41 of the support element 4, then the microballoons 7 are heated in order to obtain a heat-sealing of the microballoons, without completely melting said microballoons 7 so that they can keep their gas enclosed in the assembly layer 5.
  • a very fine assembly layer for example less than 40 ⁇ m thick, is then obtained with microballoons having a diameter before assembly of between 18 and 28 ⁇ m.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Measuring Volume Flow (AREA)
EP15192348.9A 2014-11-03 2015-10-30 Ultraschall-signalwandler mit einer schicht aus mikroballons Active EP3015177B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1460554A FR3027827B1 (fr) 2014-11-03 2014-11-03 Transducteur ultrasonore a couche de microballons

Publications (3)

Publication Number Publication Date
EP3015177A1 true EP3015177A1 (de) 2016-05-04
EP3015177C0 EP3015177C0 (de) 2023-12-13
EP3015177B1 EP3015177B1 (de) 2023-12-13

Family

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Family Applications (1)

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EP15192348.9A Active EP3015177B1 (de) 2014-11-03 2015-10-30 Ultraschall-signalwandler mit einer schicht aus mikroballons

Country Status (2)

Country Link
EP (1) EP3015177B1 (de)
FR (1) FR3027827B1 (de)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0031614A1 (de) * 1979-12-17 1981-07-08 North American Philips Corporation Bogenförmige Anordnung mehrerer Ultraschallwandler
FR2580286A1 (fr) * 1985-04-12 1986-10-17 Sintra Materiau anechoique allege
US5068902A (en) * 1986-11-13 1991-11-26 Epic Corporation Method and apparatus for reducing acoustical distortion
EP0589396A2 (de) * 1992-09-23 1994-03-30 Acuson Corporation Ultraschallwandler mit festem absorbierenden Träger
EP1542005A1 (de) 2003-12-09 2005-06-15 Kabushiki Kaisha Toshiba Ultraschallsonde mit leitfähiger akustischer Anpassungsschicht und Ultraschalldiagnosegerät
WO2008121238A2 (en) 2007-03-30 2008-10-09 Gore Enterprise Holdings, Inc. Improved ultrasonic attenuation materials
EP2602788A2 (de) 2011-12-07 2013-06-12 Imasonic Ultraschall-Signalwandler mit einem unterstützten aktiven Element

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0031614A1 (de) * 1979-12-17 1981-07-08 North American Philips Corporation Bogenförmige Anordnung mehrerer Ultraschallwandler
FR2580286A1 (fr) * 1985-04-12 1986-10-17 Sintra Materiau anechoique allege
US5068902A (en) * 1986-11-13 1991-11-26 Epic Corporation Method and apparatus for reducing acoustical distortion
EP0589396A2 (de) * 1992-09-23 1994-03-30 Acuson Corporation Ultraschallwandler mit festem absorbierenden Träger
EP1542005A1 (de) 2003-12-09 2005-06-15 Kabushiki Kaisha Toshiba Ultraschallsonde mit leitfähiger akustischer Anpassungsschicht und Ultraschalldiagnosegerät
WO2008121238A2 (en) 2007-03-30 2008-10-09 Gore Enterprise Holdings, Inc. Improved ultrasonic attenuation materials
EP2602788A2 (de) 2011-12-07 2013-06-12 Imasonic Ultraschall-Signalwandler mit einem unterstützten aktiven Element

Also Published As

Publication number Publication date
FR3027827B1 (fr) 2020-01-31
FR3027827A1 (fr) 2016-05-06
EP3015177C0 (de) 2023-12-13
EP3015177B1 (de) 2023-12-13

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