EP3006814A1 - Ampoule à del à haute efficacité lumineuse - Google Patents

Ampoule à del à haute efficacité lumineuse Download PDF

Info

Publication number
EP3006814A1
EP3006814A1 EP14891350.2A EP14891350A EP3006814A1 EP 3006814 A1 EP3006814 A1 EP 3006814A1 EP 14891350 A EP14891350 A EP 14891350A EP 3006814 A1 EP3006814 A1 EP 3006814A1
Authority
EP
European Patent Office
Prior art keywords
led
filament
center column
alloy
aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14891350.2A
Other languages
German (de)
English (en)
Other versions
EP3006814A4 (fr
Inventor
Qianjun YAN
Jiwei Gao
Xiaoqiu XU
Zhaoxin Xiao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Hangke Optoelectronics Stock Ltd Corp
Original Assignee
Hangzhou Hangke Optoelectronics Stock Ltd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Hangke Optoelectronics Stock Ltd Corp filed Critical Hangzhou Hangke Optoelectronics Stock Ltd Corp
Publication of EP3006814A1 publication Critical patent/EP3006814A1/fr
Publication of EP3006814A4 publication Critical patent/EP3006814A4/fr
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F21V23/009—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing the casing being inside the housing of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present application relates to an LED lamp, and particularly to a high lumen efficiency LED lamp which is directly assembled from filaments.
  • LED lighting is considered as one of the most promising areas in the twenty-first Century. With the issue of laws and decrees for forbidding incandescent lamps in various countries, LED has been used in the lighting field more and more widely.
  • An LED filament packaged on a transparent substrate is favored by terminal customers due to its high lumen efficiency and appearance similar to a traditional tungsten filament lamp.
  • the filament uses a P-N junction of an LED chip to emit light at an angle of 4JI, and when the filament is packaged on a frame or a ceramic, the blue light emitting downwards is lost by a half when it is reflected back through the P-N junction, and eventually results in loss of 25% of the blue light.
  • the lost blue light may be utilized, and the lumen efficiency of the LED light source may be improved.
  • the filament using the transparent substrate basically has no heat dissipation capability, and the assembled lamp has an excessively high temperature which makes the feature of high lumen efficiency less prominent, especially for a lamp with high luminous flux made of this filament, therefore, an urgent issue to be addressed is to improve the heat dissipation capability of the filament lamp.
  • An object of the present application is to provide a LED lamp with high lumen efficiency, to overcome the deficiencies in the conventional technology.
  • An LED lamp with high lumen efficiency includes a plurality of LED filaments, a center column, an LED driver, a standard interface, and a housing; wherein the plurality of LED filaments and the center column are sealed by the housing, and a heat dissipating material is filled in the housing. Two ends of each of the LED filaments are connected to two center column electrodes of the center column via two filament electrodes of the LED filament by spot welding, and the plurality of LED filaments are arranged surrounding the center column in the lamp.
  • a lower portion of the center column is connected to a gas discharge tube; and each of the center column electrodes of the center column is connected to the LED driver via an electrical connecting wire, the LED driver is connected to the standard interface via a lead, and the standard interface is electrically connected to an external AC or DC power supply.
  • the plurality of LED filaments are arranged surrounding the center column in the lamp in the following ways, the LED filaments are arranged linearly surrounding the center column in a shape of a cone; the LED filaments are arranged linearly surrounding the center column in a cross shape; the LED filaments are arranged surrounding the center column in a shape of a regular polygon; and the LED filaments are arranged surrounding the center column in a shape of M.
  • the LED filament includes filament electrodes, a transparent substrate, a plurality of LED chips, a bonding wire, and fluorescent glue, the plurality of LED chips are fixed on the transparent substrate having the filament electrode at two ends, and the LED chips are connected by the bonding wires, and the filament electrodes are connected to respective LED chips by the bonding wires, and the LED chips, the bonding wire and the transparent substrate are enclosed by the fluorescent glue.
  • the LED filament includes filament electrodes, a transparent substrate, a plurality of LED chips, a circuit and fluorescent glue, the plurality of LED chips are fixed on the transparent substrate having the circuit, and the circuit on the transparent substrate is connected to the filament electrodes at two ends of the transparent substrate via the LED chips, and the LED chips and the transparent substrate are enclosed by the fluorescent glue.
  • the LED filament includes filament electrodes, a conductive substrate, a plurality of LED chips, and a bonding wire, the plurality of LED chips are fixed on the conductive substrate having micropores, the conductive substrate has one end functioning as one filament electrode and another end connected to another filament electrode by a bonding material, the LED chips are connected by the bonding wires, and the filament electrodes are connected to respective LED chips by the bonding wires, and the LED chips, the bonding wires, the micropores, the bonding material and the conductive substrate are enclosed by the fluorescent glue.
  • the center column includes one or more of an insulating layer, a first interlayer, a second interlayer, a first plating layer, a third interlayer and a second plating layer;
  • the material of the insulating layer is glass or transparent ceramics;
  • the material of the first interlayer is metal including silver, aluminum or titanium;
  • the material of the second interlayer is paraffin or metal salt;
  • the material of the plating layer is silver, aluminum, titanium or platinum;
  • the material of the third interlayer is copper or copper alloy;
  • the material of the second plating layer is one or more of aluminum oxide, silicon dioxide, and titanium dioxide
  • the material of the center column electrode is gold, silver, copper, iron, aluminum, gold alloy, silver alloy, copper alloy, iron alloy, or aluminum alloy.
  • the heat dissipating material is gas or liquid; and in the case that the heat dissipating material is gas, its composition is basic gas or is a mixture of the basic gas with auxiliary gas, and a ratio of the mass of the basic gas to the mass of the auxiliary gas is 80-100:0-20, the basic gas is formed by mixing one or more of hydrogen, nitrogen and helium in any proportion, and the auxiliary gas is formed by mixing one or more of neon, argon, krypton and xenon in any proportion; and in the case that the heat dissipating material is liquid, its composition is a mixture formed by mixing one or more of water, ethanol, glycerol, silicone oil in any proportion
  • the housing is a transparent glass housing, a frosted glass housing or a glass housing with an external portion being coated with transparent silica gel.
  • the standard interface is E12, E14, E26, E27 or E39.
  • the material of the transparent substrate is transparent glass, neoceramic glass, transparent ceramics, yttrium aluminum garnet, aluminum oxide (sapphire), aluminum oxynitride, yttrium oxide ceramics, magnesium fluoride ceramics, calcium fluoride ceramics or transparent heat-resistant PC/PS/PMMA.
  • the material of the conductive substrate is copper, silver, aluminum, iron, copper alloy, silver alloy, aluminum alloy, or iron alloy.
  • the LED chip is one or more of a UV chip, a blue light chip, and a green light chip.
  • the material of the bonding wire is gold, silver, copper, iron, aluminum, gold alloy, silver alloy, copper alloy, iron alloy, or aluminum alloy.
  • the fluorescent glue is formed by mixing LED encapsulating glue and fluorescent powder, the LED encapsulating glue is silica gel, epoxy resin, Hybrid material or PMMA; and the fluorescent powder is formed by one or more of green fluorescent powder, yellow fluorescent powder, and red fluorescent powder, and a mass ratio of the encapsulating glue, the green fluorescent powder, the yellow fluorescent powder, and the red fluorescent powder is 100: (0-30): (5-50): (0-10).
  • the advantageous effect of the present application is that, by using the material with high heat dissipation performance and the center column with high heat conductivity, the LED filament with high lumen efficiency may operate in a low temperature to realize the high lumen efficiency.
  • an LED lamp with a high lumen efficiency includes multiple LED filaments 1, a center column 3, an LED driver 7, a standard interface 9, and a housing 10.
  • the multiple LED filaments 1 and the center column 3 are sealed by the housing 10, and a heat dissipating material 11 is filled in the housing 10.
  • Two ends of each LED filament 1 are connected to two center column electrodes 4 of the center column 3 via two filament electrodes 2 of the LED filament 1 by spot welding, and the multiple LED filaments 1 are provided in the lamp and arranged in various shapes surrounding the center column 3.
  • a lower portion of the center column 3 is connected to a gas discharge tube 5.
  • the center column electrode 4 of the center column 3 is connected to the LED driver 7 via an electrical connecting wire 6, the LED driver 7 is connected to the standard interface 9 via a lead 8, and the standard interface 9 is electrically connected to an external AC or DC power supply.
  • Figure 1(a) shows a first embodiment of the lamp, wherein the LED filaments 1 are arranged linearly in the shape of a cone.
  • Figure 1(b) shows a second embodiment of the lamp, wherein the LED filaments 1 are arranged linearly in a cross shape.
  • Figure 1(c) shows a third embodiment of the lamp, wherein the LED filaments 1 are arranged in the shape of a regular polygon.
  • Figure 1(d) shows a fourth embodiment of the lamp, wherein the LED filaments 1 are arranged in the shape of M.
  • Figure 2(a) shows a first embodiment of the center column 3, in which the center column 3 includes an insulating layer 3-1 enclosing a first interlayer 3-2 (made of a metal with high reflectivity, such as silver, aluminum, or titanium).
  • a first interlayer 3-2 made of a metal with high reflectivity, such as silver, aluminum, or titanium.
  • Figure 2(b) shows a second embodiment of the center column 3, in which the center column 3 includes an insulating layer 3-1 enclosing a first interlayer 3-2 (made of a metal with high reflectivity, such as silver, aluminum, or titanium) and a second interlayer 3-3 (made of a thermal phase change material, such as paraffin or metal salt) contained inside the first interlayer 3-2.
  • a first interlayer 3-2 made of a metal with high reflectivity, such as silver, aluminum, or titanium
  • a second interlayer 3-3 made of a thermal phase change material, such as paraffin or metal salt
  • Figure 2(c) shows a third embodiment of the center column 3, in which the center column 3 includes an insulating layer 3-1 enclosing a third interlayer 3-5 (made of copper or copper alloy) and a first plating layer 3-4 (made of a reflective material, such as silver, aluminum, or titanium, or platinum) plated on the surface of the third interlayer 3-5.
  • a third interlayer 3-5 made of copper or copper alloy
  • a first plating layer 3-4 made of a reflective material, such as silver, aluminum, or titanium, or platinum
  • Figure 2(d) shows a fourth embodiment of the center column 3, in which the center column 3 includes an insulating layer 3-1 enclosing a third interlayer 3-5 (made of copper or copper alloy), a second interlayer 3-3 (made of a thermal phase change material, such as paraffin or metal salt) contained inside the third interlayer 3-5, and a first plating layer 3-4 (made of a reflective material, such as silver, aluminum, or titanium, or platinum) plated on the surface of the third interlayer 3-5.
  • a third interlayer 3-5 made of copper or copper alloy
  • a second interlayer 3-3 made of a thermal phase change material, such as paraffin or metal salt
  • a first plating layer 3-4 made of a reflective material, such as silver, aluminum, or titanium, or platinum
  • Figure 2(e) shows a fifth embodiment of the center column 3, in which the center column 3 includes a third interlayer 3-5 (made of copper or copper alloy) and a second plating layer 3-6 (made of a reflective material, such as aluminum oxide, silicon dioxide, or titanium dioxide) plated on the surface of the third interlayer 3-5.
  • a third interlayer 3-5 made of copper or copper alloy
  • a second plating layer 3-6 made of a reflective material, such as aluminum oxide, silicon dioxide, or titanium dioxide
  • FIG. 3(a) shows a first embodiment of the LED filament 1.
  • the LED filament 1 includes filament electrodes 2, a transparent substrate 12, multiple LED chips 13, bonding wires 14, and fluorescent glue 15.
  • the LED chips 13 (mainly for horizontal chips) are fixed on the transparent substrate 12 (made from materials such as transparent glass, transparent ceramics, yttrium aluminum garnet, sapphire or transparent heat-resistant PC/PS/PMMA) by a die bond material (such as silicone, epoxy resin, hybrid or PMMA, PU), and two ends of the transparent substrate 12 are provided with the filament electrode 2.
  • a die bond material such as silicone, epoxy resin, hybrid or PMMA, PU
  • the multiple LED chips 13 are connected by the bonding wires, and the electrodes 2 are connected to the respective chips 13 by the bonding wires, and then the LED chips 13, the bonding wires 14 and the substrate 12 are enclosed by the fluorescent glue 15 to form a 360 degree lightning LED filament 1.
  • FIG. 3(b) shows a second embodiment of the LED filament 1.
  • the LED filament 1 includes filament electrodes 2, a transparent substrate 12, multiple LED chips 13, a circuit 16, and fluorescent glue 15.
  • the LED chips 13 (mainly for flip chips) are fixed on the transparent substrate 12 (made of materials, such as transparent glass, transparent ceramics, yttrium aluminum garnet, sapphire or transparent heat-resistant PC/PS/PMMA) by a die bond material (such as gold, gold tin alloy or solder paste), and the transparent substrate 12 has the circuit 16.
  • the circuit 16 on the substrate 12 is connected to the filament electrodes 2 at two ends of the substrate via the LED chips 13, and then the LED chips 13 and the substrate 12 are enclosed by the fluorescent glue 15 to form a 360 degree lightning LED filament 1.
  • Figures 3(c) to 3(e) show a third embodiment of the LED filament 1
  • Figure 3(c) is a perspective view of the LED filament 1
  • Figure 3(d) is a view showing a semi-finished LED filament 1
  • Figure 3(e) is a view showing the appearance of a finished LED filament 1.
  • the LED filament 1 includes a filament electrode 2, a conductive substrate 17, multiple LED chips 13, and bonding wires 14.
  • Multiple LED chips 13 are fixed on the conductive substrate 17 (made of materials, such as copper, silver, iron, copper alloy, silver alloy, or iron alloy) by a die bond material (such as silica gel, epoxy resin, Hybrid, PMMA, or PU), and the conductive substrate 17 has micropores 18 (micro cavities formed by air and having a size of 10nm to 100um).
  • the conductive substrate 17 has one end functioning as a filament electrode 2, and another end connected to another filament electrode 2 by a bonding material 19 (made of a polymer material such as PPA, PCT, EMC, SMC, or LCP).
  • the LED chips 13 are connected by the bonding wires 4, and the filament electrodes 2 are connected to the respective LED chips 13 by the bonding wires 4, and then the LED chips 13, the bonding wires 14, the micropores 18, the bonding material 19 and the conductive substrate 17 are enclosed by the fluorescent glue 15 by molding, with only the filament electrodes 2 not being enclosed, as shown in Figure 3(e).

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
EP14891350.2A 2014-05-04 2014-05-04 Ampoule à del à haute efficacité lumineuse Withdrawn EP3006814A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2014/076700 WO2015168825A1 (fr) 2014-05-04 2014-05-04 Ampoule à del à haute efficacité lumineuse

Publications (2)

Publication Number Publication Date
EP3006814A1 true EP3006814A1 (fr) 2016-04-13
EP3006814A4 EP3006814A4 (fr) 2017-01-04

Family

ID=54391924

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14891350.2A Withdrawn EP3006814A4 (fr) 2014-05-04 2014-05-04 Ampoule à del à haute efficacité lumineuse

Country Status (2)

Country Link
EP (1) EP3006814A4 (fr)
WO (1) WO2015168825A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3190328A1 (fr) * 2016-01-06 2017-07-12 Shandong Prosperous Star Optoelectronics Co., Ltd Lampe à del simulant la structure d'une lumière incandescente
RU188947U1 (ru) * 2018-05-23 2019-04-30 Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" (ТУСУР) Светодиодная лампа
CN117174809A (zh) * 2023-09-05 2023-12-05 连云港天凯照明电器有限公司 一种高光效led灯珠及包含其的led照明装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3179153A1 (fr) * 2015-12-11 2017-06-14 Epistar Corporation Appareil d'éclairage

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101968181B (zh) * 2010-09-08 2013-03-20 浙江锐迪生光电有限公司 一种高效率led灯泡
CN102109115B (zh) * 2010-12-29 2012-08-15 浙江锐迪生光电有限公司 一种P-N结4π出光的高压LED及LED灯泡
CN201944638U (zh) * 2010-11-22 2011-08-24 葛世潮 一种可直接替换白炽灯用于感应灯的led灯泡
PT2535640E (pt) * 2010-09-08 2015-02-27 Zhejiang Ledison Optoelectronics Co Ltd Lâmpada de led e barra de iluminação de led capazes de emitirem uma luz superior a 4 pi
JP2015515087A (ja) * 2012-03-12 2015-05-21 浙江鋭迪生光電有限公司 Ｌｅｄ発光柱及びそれを用いたｌｅｄランプ
JP5864349B2 (ja) * 2012-04-20 2016-02-17 スタンレー電気株式会社 Ｌｅｄ電球
CN203395690U (zh) * 2013-08-13 2014-01-15 宁波卓明电子有限公司 一种 led 灯泡
CN203553214U (zh) * 2013-11-01 2014-04-16 四川柏狮光电技术有限公司 一种led灯丝
CN103712106A (zh) * 2013-12-26 2014-04-09 四川柏狮光电技术有限公司 一种大角度全周光led灯泡

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3190328A1 (fr) * 2016-01-06 2017-07-12 Shandong Prosperous Star Optoelectronics Co., Ltd Lampe à del simulant la structure d'une lumière incandescente
RU188947U1 (ru) * 2018-05-23 2019-04-30 Федеральное государственное бюджетное образовательное учреждение высшего образования "Томский государственный университет систем управления и радиоэлектроники" (ТУСУР) Светодиодная лампа
CN117174809A (zh) * 2023-09-05 2023-12-05 连云港天凯照明电器有限公司 一种高光效led灯珠及包含其的led照明装置
CN117174809B (zh) * 2023-09-05 2024-04-30 连云港天凯照明电器有限公司 一种高光效led灯珠及包含其的led照明装置

Also Published As

Publication number Publication date
EP3006814A4 (fr) 2017-01-04
WO2015168825A1 (fr) 2015-11-12

Similar Documents

Publication Publication Date Title
CN203857313U (zh) 一种高光效的led球泡灯
CN107170733B (zh) Led灯丝及其led球泡灯
US9217544B2 (en) LED based pedestal-type lighting structure
CN103994349A (zh) 高光效的led球泡灯
WO2012053134A1 (fr) Carte de montage, dispositif électroluminescent et lampe
WO2012090356A1 (fr) Dispositif électroluminescent, module électroluminescent et lampe
JP2017532793A (ja) Ｌｅｄ封止に使用する基板、３次元ｌｅｄ封止体、３次元ｌｅｄ封止体を有する電球及びこれらの製造方法
CN105387355A (zh) 一种并联型led发光体及led照明灯
TW201101548A (en) LED package structure with a plurality of standby pads for increasing wire-bonding yield and method for manufacturing the same
CN203892915U (zh) 一种线性led发光体和led照明灯
EP3006814A1 (fr) Ampoule à del à haute efficacité lumineuse
CN106015991A (zh) 一种使用2πLED灯丝的电源内置球泡灯
CN204345344U (zh) Led灯丝及使用该led灯丝的灯泡
CN107305922B (zh) 一种带电源一体化360度立体发光光源的制备方法
CN203810164U (zh) 一种导热性led发光体和led照明灯
CN207602616U (zh) 一种新型led封装结构
US20150354796A1 (en) Wide-angle emitting led driven by built-in power and assembly method thereof
CN108321282B (zh) 一种紫外led封装器件
CN204592952U (zh) 一种带散热件led灯丝的led灯丝灯
CN102903838A (zh) 带散热结构的封装led光源及其制备方法
WO2008055406A1 (fr) Del de lumière blanche
CN203023841U (zh) 芯片倒装于透明陶瓷管的4π出光LED发光管及照明灯
CN204179108U (zh) 发光装置以及灯
CN215220749U (zh) 一种光源封装结构、led灯泡
CN103165792A (zh) 一种led散热封装结构、led灯及其制造方法

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20151221

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

A4 Supplementary search report drawn up and despatched

Effective date: 20161202

RIC1 Information provided on ipc code assigned before grant

Ipc: F21K 9/232 20160101ALI20161128BHEP

Ipc: F21V 3/04 20060101ALN20161128BHEP

Ipc: F21Y 103/10 20160101ALN20161128BHEP

Ipc: F21Y 109/00 20160101ALN20161128BHEP

Ipc: F21V 19/00 20060101ALI20161128BHEP

Ipc: F21Y 107/00 20160101ALN20161128BHEP

Ipc: F21V 29/00 20150101ALI20161128BHEP

Ipc: F21V 23/00 20150101ALN20161128BHEP

Ipc: F21Y 101/00 20160101ALI20161128BHEP

Ipc: F21S 2/00 20160101AFI20161128BHEP

Ipc: F21Y 115/10 20160101ALN20161128BHEP

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20171108

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20180519