EP2985755A1 - Dispositif électronique ayant une partie qui est soumise à une détérioration dépendante de la température - Google Patents

Dispositif électronique ayant une partie qui est soumise à une détérioration dépendante de la température Download PDF

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Publication number
EP2985755A1
EP2985755A1 EP14180481.5A EP14180481A EP2985755A1 EP 2985755 A1 EP2985755 A1 EP 2985755A1 EP 14180481 A EP14180481 A EP 14180481A EP 2985755 A1 EP2985755 A1 EP 2985755A1
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EP
European Patent Office
Prior art keywords
electronic device
deterioration
temperature
estimate
leds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14180481.5A
Other languages
German (de)
English (en)
Inventor
Lieve Lea Andrea Lanoye
Benoit Didier Raphael CATTEAU
Hans Achiel Gilberte Van Parys
Luc Henri Jozef Peeters
Lieven Henri Penninck
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TP Vision Holding BV
Original Assignee
TP Vision Holding BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TP Vision Holding BV filed Critical TP Vision Holding BV
Priority to EP14180481.5A priority Critical patent/EP2985755A1/fr
Publication of EP2985755A1 publication Critical patent/EP2985755A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/3406Control of illumination source
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2320/00Control of display operating conditions
    • G09G2320/04Maintaining the quality of display appearance
    • G09G2320/041Temperature compensation
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2320/00Control of display operating conditions
    • G09G2320/04Maintaining the quality of display appearance
    • G09G2320/043Preventing or counteracting the effects of ageing
    • G09G2320/048Preventing or counteracting the effects of ageing using evaluation of the usage time
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/02Details of power systems and of start or stop of display operation
    • G09G2330/021Power management, e.g. power saving
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/34Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
    • G09G3/36Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source using liquid crystals
    • G09G3/3611Control of matrices with row and column drivers

Definitions

  • the present invention relates to electronic devices, in particular to display devices, having a part which is subject to temperature behaviour dependent deterioration.
  • the usual way of design is to make the design such that under worst case conditions, with full load and maximal ambient temperature, the thermal conditions stay within the acceptable range so that a required quality level can be guaranteed. This results in a cost increasing effect for electronic devices.
  • an electronic device comprising circuitry, whereby a deterioration of at least one part of the electronic device is dependent on a temperature behaviour of the part in a preceding period, and whereby the device further comprises means for deriving, for the said part, an estimate indicative of a thermal accumulated deterioration caused by the temperature behaviour in the preceding period, and means for controlling the device in dependence on the estimate of the thermal accumulated deterioration, so as to cause that said part to deteriorate in a defined manner.
  • the invention is partly based on the insight that in case the thermal accumulated damage is below average there is room to operate the device at a higher power consumption enabling a higher performance without a negative effect on the guaranteed life span of the device.
  • the electronic device is a display device comprising image rendering means and circuitry, comprising a driving circuit for supplying drive signals for the rendering means so as to cause a rendering of images represented by an image signal received by the circuitry.
  • This embodiment enables the design of a very thin display with an improved balance between the lifespan and performance against low costs.
  • the light sources generating the light for rendering the images and solder joints with which the electric components are fixed to a circuit board are highly sensitive for the temperature behaviour.
  • a high operating temperature has a negative effect on the life span of the light source.
  • a solder joint is sensitive for creep caused by temperature variations.
  • An embodiment of the display device comprises a computing model for deriving the estimate on the basis of a power consumption in the preceding period.
  • This embodiment has the advantage that it is very well suited for devices in which the temperature of the part cannot or difficult determined by means of a sensor.
  • the inventors realized that the temperature of the component can reliable estimated on the basis of the power consumption behaviour by a dedicated computing model that can be optimized in advance for a type of display device.
  • Fig. 1 shows an embodiment 100 of an electronic device according to the invention.
  • the device 100 comprises circuitry 101 of a usual type for signal processing.
  • a part 102 of the device 100 is subject to a deterioration which is dependent on a behaviour of a temperature of the part.
  • the deterioration can be directly related to temperature level of the part, such that the speed of deterioration depends on the temperature. The higher the temperature the higher the speed of deterioration. However the deterioration can also be dependent on temperature variations. A well-known type of such temperature variation dependent deterioration is creep of solder joints.
  • the part 102 can be a part of the circuitry 101 itself or a part outside the circuitry, for example a solder joint or a component sensitive for deteriorations, for example a light source in the form of a LED or OLED.
  • heat is produced in the device 101.
  • the major part of the heat can be produced by the electronic circuitry 101 and/or by part 102 in case this part is a heat producing component. This heat produces a rise of the temperature. The temperature behaviour cause a deterioration of the component 102.
  • the circuitry 101 and the part 102 are located within a housing 105 of the device.
  • the device 100 is of a type of which the dimensions of the housing 105 are so small that the heat produced within the housing is that high that it forms a restriction on the power consumption for one or more desirable operation modes of the device 100.
  • this is realized by adding a part 103 and a part 104 to the device 101, whereby part 103 is arranged to derive an estimate indicative of a thermal accumulated deterioration of the part 102 caused by the temperature behaviour in the preceding period and whereby part 104 controls the device in dependence on the estimate of the thermal accumulated deterioration, so as to cause part 102 to deteriorate in a defined manner.
  • Part 103 can determine the estimate in several different manners. So is it possible to use a temperature sensor for sensing the temperature of the part 102 for determining the temperature of part 102 and calculate an estimate on the basis of the historical behaviour of the determined temperature. Often the power consumption of the device 100 is a good indication of the heat produced in the electronic device. In that case the temperature may be indirectly calculated by a model using the power information is a basis to estimate the deterioration. This can be done by a sequence of two models, a first computing model for estimating the temperature on the bases of the consumed power, followed by a second computing model for the estimating of the thermal accumulated deterioration based on the behaviour of the estimated temperature. It will be clear that the first and second computing model can alternatively be combined in one computing model.
  • part 104 controls the device 100 so that the deterioration develops in defined manner.
  • the estimate of the thermal accumulated deterioration is compared with corresponding value in the reference curve.
  • the possible operation modes can be extended or limited. For example in case the comparison indicates that the thermal accumulated deterioration is too high then extra high performance modes can be disabled until the estimate of actual has become below the reference curve value again. It is also possible to modify all operation modes such that they all operate temporarily at a lower level until the estimate of the thermal accumulated deterioration has become below the reference curve value again.
  • the part 104 in response to the detection that the estimate of the thermal accumulated deterioration is above the reference curve value it is also possible to intervene in case the estimate of the thermal accumulated deterioration is (far) below the reference curve value. For example it can be detected whether the estimate of the thermal accumulated deterioration is more than a predefined threshold below the reference curve value. If so, the operation modes can modified such that in average to the devices consumes more power so that the average performance is increased.
  • the display device 1 comprises image rendering means in the form of an LCD display panel 2 and circuitry 7 coupled to the LCD display panel 2 to supply electric energy and a control signal to the LCD display panel 2.
  • the LCD display panel comprises a matrix of LCD cells arranged in rows and columns.
  • a column control circuit 8 and row control circuit 9 controls the switching of the individual LCD cells.
  • the LCD display panel 2 is provided with backlight units 3 and 4.
  • the backlights units 3 and 4 comprises light sources in the form of LEDs 5 which are placed on the left and right side of the panel to radiate light into a light guide placed behind LCD cells in the panel 2.
  • Driving circuit 10 derives from the input signal control signals for the backlight units 3 and 4 and for the column control circuit 8 and row control circuit 9 so as to cause a rendering of the images represented in the image signal on the LCD display panel 2.
  • Driving circuit 10 is of a type that controls the level of the backlight depending on the brightness of the images to be rendered. For dark images the level is set on a low level and for bright images the level of the backlight is set to a high level. This way of control enables the rendering of high quality images with a high dynamic contrast range.
  • the temperatures values are amongst others a function of the backlight level. Since the backlight is dynamically changed based on the brightness of the images to be rendered, the temperatures vary during the operation of the display device 1.
  • the level of the back light can be temporarily boosted in a boost mode to an extraordinary high level.
  • the deterioration of the LEDs 5 is dependent on its operation temperature. If the LEDs 5 are operating below nominal power, during the rendering of dark images, it will deteriorate slower than nominal. However in case the LEDs 5 are operating above nominal power, during the rendering of bright images, it will deteriorate faster than nominal.
  • the total damages already caused during operation is here defined as the thermal accumulated deterioration (TAD).
  • Fig. 3 shows, for a prior art device, a curve 24 of the thermal accumulated deterioration TAD as a function of the operation time Ttot.
  • TADmax indicates the maximum damage with which the LEDs still operate within the required specifications.
  • Reference signs 20 and 21 indicate periods with a steep slope of the curve 24. In these periods the deterioration is above nominal, which may be caused by a high power consumption in the backlight units 3 and 4, for example because the display device 1 is often operated in the boosting mode.
  • Reference signs 22 and 23 indicate parts of the curve 24 with a moderate slope. In these periods the deterioration is below nominal, which may be caused by a low power consumption in the backlight units 3 and 4, for example because the display device 1 is not or hardly operated in the boosting mode.
  • the life span of the display device 1 strongly depends on the way it is used by the user. In case the user likes bright images he will set the brightness at a high level resulting in a power consumption of the LEDs which is above nominal. Also in case the display is used in an environment with a high level of ambient light the brightness will be set at a high level.
  • the deterioration also depends on the ambient temperature in the room where the display device is operating.
  • the temperature of the LEDs and solder joint will be rise to a lower level for lower ambient temperatures and consequently the deterioration will be lower.
  • an estimate of the thermal accumulate deterioration is made and compared with a reference value corresponding with the total time that the display device was already in operation.
  • the thermal accumulated deterioration exceeds the reference value the average power level of the back lights is decreased, for example by limiting the boosting mode, so as to prevent that the end of life span is reached too soon.
  • the thermal accumulated deterioration can be estimated using a thermal model taking into account the heat caused in the LEDs by at least the major heat sources, i.e the LEDs themselves.
  • LEDs are also the major heat sources for the solder junctions in the backlight unit.
  • the temperature of the LEDs and solder joints is strongly correlated with the power consumed by the backlight units.
  • the relation between the consumed power and the thermal accumulated deterioration is determined in advance during the design of the display device.
  • a computing model using this relation is built in the display device 1 for estimating the thermal accumulated deterioration based on the power consumed by the backlight units 3 and 4.
  • the temperature can be measured by means of a temperature sensor
  • a model which estimates the thermal accumulate deterioration (TAD) based on the behaviour of the measured temperature, can be used.
  • an estimator 12 which makes use of a model that estimates the thermal accumulated deterioration of the LEDs 5 on the basis of the power consumed by the backlight units 3 and 4.
  • a signal indicative of the consumed power is supplied to the estimator 12 via a signal line 13.
  • a signal representing the estimate of the thermal estimated deterioration is supplied to a control unit 15 via signal line 14.
  • Control unit 15 compares the estimate with a reference value belonging to the total time Ttot.
  • Fig.4 shows a suitable function 30 of the reference value Ref as a function of the total operation time Ttot.
  • the control unit detects that the thermal accumulated deterioration TAD exceeds the reference value Ref, as for example at moment t1 indicated in Fig.4 , the average power of the backlights is reduced, for example by disabling the boosting mode. This results in a less steeper slope of the thermal accumulated deterioration TAD, so that the thermal accumulated deterioration TAD will move to the reference value Ref until it comes below the reference value Ref again at moment t2. Then the reduction of the average power of the backlights 3 and 4 is discontinued. In case the boosting mode was disabled in t1 it can be enabled again in t2.
  • the function 30 of the reference value Ref in Fig.4 is a linear function. However it will be clear that other functions are also suitable. Several continuously increasing functions, ending with TADmax, can be used. In case the slope of the reference function is steeper than the slope of the curve of the thermal accumulated deterioration corresponding with operation of the back light with the boosting mode switched off the thermal accumulated deterioration can always be kept close to the reference value Ref.
  • the average power of the backlights can controlled in a similar way by comparing the estimated value of the creep with a reference value and reduce or discontinue the reduction in dependence on the result of the comparison.
  • Fig.2 the parts performing several functions are represented by separate boxes. It will be clear that the all or part of these functions function can be performed by a programmable unit executing a suitable computer program loaded in a memory of the programmable unit.
  • Fig.5 shows schematically a suitable program for an embodiment in which the LED power is controlled in dependence on the thermal accumulated deterioration of the solder joints TAD1, the thermal accumulated deterioration of the LEDs 5 TAD2, the temperature of the solder joints Tin and the temperature Tex (touch temperature) of the exterior of the enclosure of the display device 1.
  • the program shown in Fig. 5 comprises a plurality of cooperating subprograms.
  • Subprogram 40 extracts the image information.
  • the image information is supplied to a subprogram 41 comprising an algorithm to derive the required LED power for the backlight units and control signals for the LCD for the rendering of the sequence images represented by the image information.
  • subprogram 41 Information representing the required LED power is transferred by subprogram 41 to a subprogram 42, a sub program 44 and a subprogram 45.
  • Subprogram 42 comprising a computing model for deriving from the history of the required LED power an estimate indicating the thermal accumulated deterioration TAD2 of the LEDs 5.
  • a subprogram 43 the thermal accumulated deterioration is compared with the reference value Ref2.
  • Subprogram 44 comprises a computing model for deriving from the required LED power an estimate indicating the thermal accumulated deterioration TAD1 of the solder joints of the backlight units 3 and 4.
  • a subprogram 46 the thermal accumulated deterioration is compared with the reference value Ref1.
  • the subprograms 42 and 44 compute the thermal accumulated deteriorations TAD1 and TAD2 directly from the required LED power.
  • each of the models for computing of the TAD1 and TAD2 can be split into two subsequent sub models; one for computing the temperature based on the required LED power followed by a model computing the thermal accumulated deterioration based on the computed temperature.
  • Subprogram 45 comprises a computing model for estimating the touch temperature Tex and comparing this with a maximum acceptable value Texmax.
  • the result of the comparison is transferred to sub program 41.
  • a subprogram 47 receives a temperature measurement signal Tin from a temperature sensor placed in the display device 1 to determine the temperature of the solder joints. The temperature measurement signal Tin is compared with a reference value representing the maximum acceptable temperature Tinmax. The result of the comparison is transferred to subprogram 41.
  • Subprogram 41 comprises an algorithm to determine whether at least one of the parameters TAD1, TAD2, Tin or Tex exceeds its reference value. If so the subprogram 41 adapts the algorithm that determines the required LED power and control signal for the LCD cells, so as to bring the average power of the backlight units to a lower level. This can be done by disabling the boosting mode as long as at least one of the parameters T1, T2, Tin or Tex exceeds its reference value. Alternatively other modifications are possible, for example the maximum boost level can be temporarily decreased to a lower level.
  • Another solution is to decrease the brightness setting of the display device until all parameters are again below their reference values.
  • the back light produces an uniform light level behind the complete area covered by the LCD cells.
  • the invention is also applicable for backlights which comprise separate controllable parts for separate segments of the rendered image. In that case a thermal accumulated deterioration can be determined for the separated segments. The average power of the backlight segments for which the thermal accumulated deterioration exceeds its reference value can be reduced.
  • the display device according to the invention a better balance between image quality and cost is achieved.
  • the TV is tested at maximum power under high ambient temperature conditions whether it stays within the specifications. In doing so the head room, that is created by normal use by a lower temperature and using the dimming algorithms for the backlight, is not used.
  • this extra margin is used to temporarily enhance the brightness of the rendered images by boosting the backlight for a limited time.
  • the invention enables the use of the extra margin for the creation of brighter images over short periods of time, maximizing the performance of the display device with a given thermal design.
  • LED display can be comprised by a TV system.
  • the display can be comprised by several other types of devices for rendering video and/or images, such as monitors, tablets and projectors.
  • the invention is not limited to this type of display devices.
  • the invention is applicable for all display devices having parts which have a deterioration which depends its temperature behaviour in the preceding period, and whereby the level of deterioration is such that the deterioration becomes a limiting factor for the design of the display device, for example for OLED displays, where the lifespan of OLEDs forms a problem.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Liquid Crystal Display Device Control (AREA)
EP14180481.5A 2014-08-11 2014-08-11 Dispositif électronique ayant une partie qui est soumise à une détérioration dépendante de la température Withdrawn EP2985755A1 (fr)

Priority Applications (1)

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EP14180481.5A EP2985755A1 (fr) 2014-08-11 2014-08-11 Dispositif électronique ayant une partie qui est soumise à une détérioration dépendante de la température

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EP14180481.5A EP2985755A1 (fr) 2014-08-11 2014-08-11 Dispositif électronique ayant une partie qui est soumise à une détérioration dépendante de la température

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EP2985755A1 true EP2985755A1 (fr) 2016-02-17

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6388388B1 (en) 2000-12-27 2002-05-14 Visteon Global Technologies, Inc. Brightness control system and method for a backlight display device using backlight efficiency
EP2081175A2 (fr) * 2008-01-18 2009-07-22 Samsung Mobile Display Co., Ltd. Affichage électroluminescent organique et son procédé de commande
US20100277410A1 (en) * 2009-03-24 2010-11-04 Apple Inc. Led selection for white point control in backlights
US20130265293A1 (en) * 2010-12-16 2013-10-10 Kenji Kanzaka Projection type display device and method of restart processing
EP2731094A2 (fr) * 2009-11-27 2014-05-14 Yazaki Corporation Dispositif d'affichage pour véhicule

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6388388B1 (en) 2000-12-27 2002-05-14 Visteon Global Technologies, Inc. Brightness control system and method for a backlight display device using backlight efficiency
EP2081175A2 (fr) * 2008-01-18 2009-07-22 Samsung Mobile Display Co., Ltd. Affichage électroluminescent organique et son procédé de commande
US20100277410A1 (en) * 2009-03-24 2010-11-04 Apple Inc. Led selection for white point control in backlights
EP2731094A2 (fr) * 2009-11-27 2014-05-14 Yazaki Corporation Dispositif d'affichage pour véhicule
US20130265293A1 (en) * 2010-12-16 2013-10-10 Kenji Kanzaka Projection type display device and method of restart processing

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
ECKERT T ET AL: "A solder joint fatigue life model for combined vibration and temperature environments", ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, 2009. ECTC 2009. 59TH, IEEE, PISCATAWAY, NJ, USA, 26 May 2009 (2009-05-26), pages 522 - 528, XP031474966, ISBN: 978-1-4244-4475-5 *
SCHUBERT, A ET AL.: "Fatigue Life Models of SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulations", 53RD ECTC, 2003, pages 603 - 610
SCHUBERT, A ET AL.: "Fatigue Life Models of SnAgCu and SnPb Solder Joints Evaluated by Experiments and Simulations", 53RD ECTC, 2003, pages 603 - 610, XP002731923 *
ZAHN B A ED - INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS: "Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials", 2003 PROCEEDINGS 53RD. ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE. (ECTC). NEW ORLEANS, LA, MAY 27 - 30, 2003; [PROCEEDINGS OF THE ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE], NEW YORK, NY : IEEE, US, vol. CONF. 53, 27 May 2003 (2003-05-27), pages 83 - 94, XP010648371, ISBN: 978-0-7803-7991-6, DOI: 10.1109/ECTC.2003.1216261 *

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