EP2978558A2 - Verfahren und vorrichtung zum abtragen von sprödhartem, für laserstrahlung transparentem material mittels laserstrahlung - Google Patents
Verfahren und vorrichtung zum abtragen von sprödhartem, für laserstrahlung transparentem material mittels laserstrahlungInfo
- Publication number
- EP2978558A2 EP2978558A2 EP14721752.5A EP14721752A EP2978558A2 EP 2978558 A2 EP2978558 A2 EP 2978558A2 EP 14721752 A EP14721752 A EP 14721752A EP 2978558 A2 EP2978558 A2 EP 2978558A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- laser radiation
- brittle
- primary
- threshold
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
Definitions
- the invention relates to a method and a device for removing, such as drilling, cutting or scribing, of brittle, transparent to laser radiation material by means of laser radiation, wherein the material has a volume of a given thickness between a top and a bottom of the material and the material a defined optical penetration depth which is greater than or equal to the thickness of the material, wherein the laser radiation incident at a defined angle of incidence between an axis of the laser radiation and the surface normal of the top and the laser radiation incident on the top of the material referred to as the primary laser radiation wherein the primary laser radiation at the bottom of the material is at least partially reflected, so that in the volume of the material by the reflection of a secondary laser radiation is generated, by absorption of a coherent superposition primarily an electron density is generated in the volume of the material having at least two levels of electron density with different effects on the material, these levels of electron density being associated with material specific thresholds of intensity of the primary laser radiation by reaching the first threshold value of the laser radiation Intensity of the primary laser radiation is
- Such methods are used, inter alia, in display technology, in which thin glass substrates, a brittle-hard material, must be processed.
- display technology in which thin glass substrates, a brittle-hard material, must be processed.
- industrial display technology conquers an ever larger market volume and tends to ever lighter devices with sensitive "Touchscreen” and thus also thinner glass panes for for example Smart Phones and Tablet Computer.
- Thin glass substrates offer advantages for displays when the durability and mechanical stability of thicker glass can be achieved. These thin glass panes are used in almost all Fiat Panel Displays (FDP's).
- Conventional methods for processing such thin glass panes are milling with a defined cutting edge, or they are based on mechanical effects of cracking (cracking and breaking) deliberately introduced into the material or the material.
- a variety of known process variants using laser radiation is also based on utilizing the mechanical effects of the principle of scribing and subsequent fracturing by replacing the scribe with the action of laser radiation and refracting the material / material after exposure to the laser radiation.
- Conventional mechanical processing cutting, drilling
- microcracks are introduced or even small parts, so-called chips, are broken out, so that grinding or etching is necessary as a post-processing process.
- Cracks of the first kind Damage / cracking / chipping occurs on the back side of the material. Cracks of the first kind occur even when there is no damage on the front - from where the laser radiation is incident - and no abrasion has taken place.
- Cracks of the second kind Cracks or damages - also called spikes - originate from the leading edge, which represents the transition from the unchanged part of the surface of the workpiece into the lateral removal flanks of the forming removal recess.
- the cracks or damages of the second kind run over a large depth into the volume of the material compared to cracks of the third kind. This from the
- Third type cracks The formation of fine, not so deep penetrating cracks occurs in addition to the cracks of the second kind or damages of the second kind - along the worn surface (cut edge); they are not limited to the area near the leading edge and occur where the laser radiation in the Abtragsvertiefung on the abraded surface (Abtragsflanken), ie the Abtragsflanken, occurs. They spread from the worn surface into the material.
- the third type of cracks penetrate less deeply into the material compared to the first type of cracks.
- the rough surface of the Abtragsverianaung has in comparison to the leading edge to a roughness with smaller radii of curvature.
- the focusing effect of the rough surface of the Abtragsvertiefung is much stronger than the focusing effect of the leading edge. That the focal length, which can be assigned to the local roughness or the small radii of curvature of the rough surface is substantially smaller than the focal length of the comparatively large radii of curvature of the leading edge.
- JP 2005 230 863A describes a method and an apparatus for processing transparent material by means of laser radiation.
- the laser radiation enters the material to be processed reflections should be avoided, including the entire workpiece to be immersed in a liquid.
- WO 2006 045 130A1 describes a method and an arrangement for dividing glass panes.
- the material to be cut is positively with a reflection glass disc deposited to allow reflections or amplify. Due to the different surface roughnesses of both the underside of the glass to be cut and the solid plate used, an air gap is formed so that considerable reflections nevertheless occur.
- the present invention has for its object to provide a method and an apparatus with which a back damage, such as cutting, scribing and drilling of brittle-hard material that is transparent to laser radiation, is avoided, which means damage, cracking and / or Chipping on the back of the material, so cracks of the first kind, as described above, can be avoided.
- a back damage such as cutting, scribing and drilling of brittle-hard material that is transparent to laser radiation
- the underside is in this case that surface of the material or material to be processed which lies opposite the surface on which the laser beam is incident.
- ultra-short pulsed laser radiation which is referred to as "wide-band-gap" material.
- Wide-band-gap material is through characterized a band gap between valence and conduction band which is greater than 1 eV.
- Ultra-short pulsed laser radiation means laser radiation with pulse durations in the range of less than 500 ps (picoseconds).
- the absorption of a material transparent to laser radiation with a defined optical penetration depth greater than or equal to the thickness of the material has two physically different ranges with respect to the intensity of the laser radiation, which are termed “linear absorption” and "non-linear absorption be designated.
- a threshold behavior for the intensity of the laser radiation present locally in the material for the achievement of a non-linear absorption in the material, which is transparent for a small intensity or has a small value for the absorption of laser radiation and for larger
- Upper values - above the at least two thresholds for modification / cracks and flaking / erosion - become strongly absorbing the intensity of the laser radiation.
- the temporal pulse shape strongly influences the achievement of the threshold values and thus the absorption in the material.
- Finding a suitable temporal pulse shape is the subject of research and not state of the art.
- the achievement of the thresholds is characterized by the value for the intensity of the laser radiation, and for a pulse duration smaller than 10 ps (fluence based)
- the thresholds are characterized by the value for the fluence of the laser radiation (surface-related energy input)
- a material is suitable for avoiding backside damage if the values of optical properties for index of refraction and absorption index agree with values for the optical properties of the brittle-hard material to be removed.
- a reflection of laser radiation By absorbing a coherent superposition of primary, directly incident laser radiation and secondary laser radiation reflected at the back, an electron density is created in the volume of the material.
- the optical properties of the further material may be adjusted by a spatial structuring of the interface between the brittle-hard material and the further material.
- Such structuring can take place, for example, by virtue of the fact that a grid-shaped, periodic structure on the Rear of the material is generated so that no reflected and diffracted only from the material radiation occurs.
- the backside material is to be regarded as the area in which the amplitude of the patterning is present, and the backside material is to be regarded as the periodic change of material and environment (eg air).
- the degree of reflection - a property of the surface - depends not only on the optical properties of the materials but also on their bulk the nature of the surface itself (including its geometric shape); this dependence of the degree of reflection on the shape of the boundary surface both prove the Fresnel law and the diffraction theory.
- both a liquid and a solid plate can preferably be used.
- the brittle-hard material can be inserted into the corresponding liquid bath for processing so that the underside is in contact with the liquid.
- a liquid in particular immersion oils, as z. B. in immersion microscopy use.
- a solid plate is used as another material, a sheet of ductile or thermosetting ductile material should be used, the type of material depending on the result of the manufacturing process of that material, for example curing, for the resulting refractive index.
- the composition of the liquid should be adjusted so that the values of the optical properties for refractive index and absorption index match those for the optical properties of the brittle-hard material to be removed so precisely that the first (damage) or the second ( Erosion) threshold for the intensity should not be exceeded, depending on whether damage or erosion should be avoided.
- a solid plate may have the above-mentioned structuring of that surface which bears against the underside of the brittle-hard material to be processed. In any case, attention should be paid to the necessary form-fit between the material and the solid plate.
- the optical interface is minimized in its effect on the reflection of laser radiation, so that exceeding the first threshold for the intensity is avoided and thus damage to the bottom (back) is avoided.
- the optical effect of this interface could be eliminated.
- a perfect or almost perfect adjustment of the refractive indices is given in particular if the first and the second threshold of the intensity of the laser radiation are not exceeded, wherein the first threshold value is assigned to the occurrence of a damage and the second threshold value is assigned to the occurrence of an ablation.
- a lack of (back) damage on the underside characterizes the inventive composition of the liquid composition.
- a slight mismatch will then result in the first threshold being exceeded causing damage (e.g., cracks).
- a coarser mismatch then leads to erosion on the bottom (back) in the form of flaking.
- the reflections on / from the material backside are to be avoided.
- FIG. 1 schematically shows the structure of an arrangement according to the invention
- FIG. 2 shows a further arrangement according to the invention
- Figure 3 is a schematic representation to the principle of the emergence of a
- Figure 4 shows two schematic illustrations, wherein the left image A shows the back of a processed glass without the deposit by another material, while the right image B shows the back with deposit by another material.
- Figures 1 and 2 show two arrangements with which a brittle, laser-transparent material, designated by the reference numeral 1, can be processed with laser radiation in order to achieve the effects according to the invention, in particular cracks of the first kind on the back side of the material avoided or prevented as a result of processing.
- the brittle-hard material 1 to be processed is deposited in a form-fitting manner on its underside 2 by a further material 3, which is, for example, a solid plate.
- a further material 3 which is, for example, a solid plate.
- the laser radiation is radiated from the upper side 4 onto the thin, plate-shaped material. It is therefore essential that the material 1 on the bottom 2 - where the laser radiation impinges after passing through the material thickness - which is opposite to the top 4, on which the primary laser radiation is opposite, flat and thus positively locked.
- the arrangement according to the invention differs from that of Figure 1 in that the brittle-hard material is not deposited on its underside 2 by a solid plate, but immersed in a liquid bath 5, so that the underside 2 is covered by the liquid.
- the liquid 5 is filled for example in a tub 6; the material 1 is carried on the bottom 7 of the tub 6 by two supports 8.
- Figure 3 the principle of the formation of a back damage is shown, which is just avoided with the arrangements and measures of Figures 1 and 2.
- the transparent material 1 and its bottom 2 are with the same
- This simulation shows a periodic increase in intensity near the backside 2, indicated by region 11, which causes the damage / cracks / chipping.
- FIG. 3 simulates a case in which the brittle-hard material 1 has a thickness d and a primary laser radiation 12 is incident thereon.
- the region 11 of the periodic increase in the radiation intensity arises from the fact that in the volume of the brittle-hard material 1, a secondary radiation 13 is generated by reflection of primary radiation 12 at the bottom.
- a secondary radiation 13 is generated by reflection of primary radiation 12 at the bottom.
- an electron density in the brittle-hard material 1 increases in at least two stages, wherein these stages are assigned threshold values of an intensity of the laser radiation.
- the achievement of the first threshold value is characterized by a modification of the material properties and the achievement of the second threshold value is characterized by a mechanical damage, the mechanical damage occurring in the form of cracks / chipping or erosion.
- This further material on the underside 2 of the brittle-hard material 1 may be a solid body 3 (FIG. 1) or a liquid 5 (FIG. 2).
- the above effects on the underside of the brittle-hard material 1 can also be enhanced by setting the optical properties of the interface between the brittle-hard material 1 and the further material by periodic structuring so that no reflections (diffraction orders) in the volume the first material 1 are directed.
- FIG. 4 shows a comparison in the two schematic images in order to clarify the effects of the invention. While the left image A shows the back side of a processed glass plate without being deposited by another material, the right image B shows the back side where processing has been performed under the same conditions with deposition by another material. Damage is indicated schematically in the form of lines or line segments. It becomes clear that the glass plate according to image B shows far less damage than the glass plate of image A.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013005135.5A DE102013005135A1 (de) | 2013-03-26 | 2013-03-26 | Verfahren und Vorrichtung zum Abtragen von sprödhartem, für Laserstrahlung transparentem Material mittels Laserstrahlung |
PCT/EP2014/000788 WO2014154345A2 (de) | 2013-03-26 | 2014-03-24 | Verfahren und vorrichtung zum abtragen von sprödhartem, für laserstrahlung transparentem material mittels laserstrahlung |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2978558A2 true EP2978558A2 (de) | 2016-02-03 |
Family
ID=50678136
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14721752.5A Withdrawn EP2978558A2 (de) | 2013-03-26 | 2014-03-24 | Verfahren und vorrichtung zum abtragen von sprödhartem, für laserstrahlung transparentem material mittels laserstrahlung |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2978558A2 (de) |
KR (1) | KR20150135381A (de) |
CN (1) | CN105283265A (de) |
DE (1) | DE102013005135A1 (de) |
WO (1) | WO2014154345A2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3221727B1 (de) | 2014-11-19 | 2021-03-17 | Trumpf Laser- und Systemtechnik GmbH | System zur asymmetrischen optischen strahlformung |
DE102014116958B9 (de) | 2014-11-19 | 2017-10-05 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung |
DE102014116957A1 (de) | 2014-11-19 | 2016-05-19 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches System zur Strahlformung |
US9948866B2 (en) * | 2016-02-01 | 2018-04-17 | The Boeing Company | Systems and methods for protecting against high-radiant-flux light based on time-of-flight |
US11344973B2 (en) * | 2018-04-19 | 2022-05-31 | Corning Incorporated | Methods for forming holes in substrates |
CN113560714A (zh) * | 2021-08-05 | 2021-10-29 | 深圳市恩德斯科技有限公司 | 透明材料表面镀层的激光选择性加工方法、成型工艺及装置 |
CN114799539A (zh) * | 2022-06-27 | 2022-07-29 | 中国华能集团清洁能源技术研究院有限公司 | 一种激光划刻方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005230863A (ja) * | 2004-02-19 | 2005-09-02 | Institute Of Physical & Chemical Research | 透明材料内部の処理方法およびその装置 |
DE102004020737A1 (de) * | 2004-04-27 | 2005-11-24 | Lzh Laserzentrum Hannover E.V. | Vorrichtung zum Durchtrennen von Bauteilen aus sprödbrüchigen Materialien mit spannungsfreier Bauteillagerung |
AT501000B1 (de) | 2004-10-25 | 2006-10-15 | Lisec Maschb Gmbh | Verfahren und anordnung zum teilen von glas, insbesondere flachglas |
DE102005055174B8 (de) * | 2005-11-18 | 2007-07-26 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Verfahren zum Abtrag von lichtdurchlässigen Materialien mit Laserstrahlung und Vorrichtung hierfür |
-
2013
- 2013-03-26 DE DE102013005135.5A patent/DE102013005135A1/de not_active Ceased
-
2014
- 2014-03-24 WO PCT/EP2014/000788 patent/WO2014154345A2/de active Application Filing
- 2014-03-24 CN CN201480030335.6A patent/CN105283265A/zh active Pending
- 2014-03-24 EP EP14721752.5A patent/EP2978558A2/de not_active Withdrawn
- 2014-03-24 KR KR1020157030101A patent/KR20150135381A/ko not_active Application Discontinuation
Non-Patent Citations (2)
Title |
---|
None * |
See also references of WO2014154345A2 * |
Also Published As
Publication number | Publication date |
---|---|
CN105283265A (zh) | 2016-01-27 |
DE102013005135A1 (de) | 2014-10-02 |
WO2014154345A2 (de) | 2014-10-02 |
KR20150135381A (ko) | 2015-12-02 |
WO2014154345A3 (de) | 2014-12-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2014154345A2 (de) | Verfahren und vorrichtung zum abtragen von sprödhartem, für laserstrahlung transparentem material mittels laserstrahlung | |
EP3416921B1 (de) | Verfahren zur kantenbearbeitung von glaselementen und verfahrensgemäss bearbeitetes glaselement | |
EP2734480B1 (de) | Verfahren und anordnung zum erzeugen von fasen an kanten von flachglas | |
EP2978561B1 (de) | Verfahren zum abtragen von sprödhartem material mittels laserstrahlung | |
WO2017009379A1 (de) | Verfahren und vorrichtung zum abtrennen von glas- oder glaskeramikteilen | |
DE102013212577A1 (de) | Verfahren zum Abtragschneiden eines Werkstücks mittels eines gepulsten Laserstrahls | |
WO2006111446A1 (de) | Verfahren zum feinpolieren/-strukturieren wärmeempflindlicher dielektrischer materialien mittels laserstrahlung | |
DE102012003202A1 (de) | Vorrichtung und Verfahren zum Bearbeiten von Werkstücken, insbesondere von Schneiden oder mit Schneiden versehenen Werkstücken, mit einem Nasslaser | |
EP2203393A1 (de) | Schneidrädchen | |
EP2700471A1 (de) | Verfahren zur Werkstückbearbeitung | |
EP2978562B1 (de) | Verfahren zum abtragen von sprödhartem material mittels laserstrahlung | |
WO2014154341A2 (de) | Verfahren zum abtragen von sprödhartem material mittels laserstrahlung | |
EP2139657A1 (de) | Verfahren und vorrichtung zur herstellung von dünnen scheiben oder folien aus halbleiterkörpern | |
DE112018007873T5 (de) | Diamantglättungsverfahren | |
DE102013114659B4 (de) | Vorrichtung zum schneidenden und/oder spanenden Bearbeiten eines Objektes | |
DE102017121140A1 (de) | Laserbearbeitung eines transparenten Werkstücks | |
DE102015009622A1 (de) | Verfahren zum Abtragen von sprödhartem Material mittels Laserstrahlung | |
WO2012000986A1 (de) | Schneidwerkzeug, insbesondere schneidrädchen und verfahren zu dessen herstellung unter verwendung eines geneigten laserstrahles | |
EP3854515A1 (de) | Verfahren zur bearbeitung sprödharter materialien | |
DE10140533A1 (de) | Verfahren und Vorrichtung zur Mikrobearbeitung eines Werkstücks mit Laserstrahlung | |
DE102015010369A1 (de) | Verfahren zum Abtragen von sprödhartem Material eines Werkstücks | |
EP4296244A1 (de) | Substratträger aus glas zur bearbeitung eines substrats und ein verfahren zu dessen herstellung | |
DE102023110225A1 (de) | Substratträger aus Glas zur Bearbeitung eines Substrats und ein Verfahren zu dessen Herstellung | |
DE102008042855B4 (de) | Verfahren zum Brechen von geschlossenen Freiformkonturen aus sprödbrüchigem Material | |
DE10013693A1 (de) | Verfahren zur Herstellung einer, aus an organischem Glas bestehenden Schnittstreckerplatte |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20150916 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: SCHULZ, WOLFGANG Inventor name: EPPELT, URS |
|
DAX | Request for extension of the european patent (deleted) | ||
17Q | First examination report despatched |
Effective date: 20171025 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20180306 |