EP2963088A4 - Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body - Google Patents

Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body

Info

Publication number
EP2963088A4
EP2963088A4 EP14757094.9A EP14757094A EP2963088A4 EP 2963088 A4 EP2963088 A4 EP 2963088A4 EP 14757094 A EP14757094 A EP 14757094A EP 2963088 A4 EP2963088 A4 EP 2963088A4
Authority
EP
European Patent Office
Prior art keywords
photoelement
curable composition
sealing body
producing
cured product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14757094.9A
Other languages
German (de)
French (fr)
Other versions
EP2963088A1 (en
EP2963088B1 (en
Inventor
Masami Matsui
Mikihiro Kashio
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of EP2963088A1 publication Critical patent/EP2963088A1/en
Publication of EP2963088A4 publication Critical patent/EP2963088A4/en
Application granted granted Critical
Publication of EP2963088B1 publication Critical patent/EP2963088B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5477—Silicon-containing compounds containing nitrogen containing nitrogen in a heterocyclic ring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Sealing Material Composition (AREA)
EP14757094.9A 2013-02-28 2014-02-27 Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body Active EP2963088B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013039159 2013-02-28
PCT/JP2014/054951 WO2014133103A1 (en) 2013-02-28 2014-02-27 Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body

Publications (3)

Publication Number Publication Date
EP2963088A1 EP2963088A1 (en) 2016-01-06
EP2963088A4 true EP2963088A4 (en) 2016-08-31
EP2963088B1 EP2963088B1 (en) 2020-06-10

Family

ID=51428362

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14757094.9A Active EP2963088B1 (en) 2013-02-28 2014-02-27 Curable composition, cured product, method for using curable composition, photoelement sealing body and method for producing photoelement sealing body

Country Status (8)

Country Link
US (1) US9783715B2 (en)
EP (1) EP2963088B1 (en)
JP (1) JP6228591B2 (en)
KR (1) KR102105811B1 (en)
CN (1) CN105121555B (en)
MY (1) MY173820A (en)
TW (1) TWI637030B (en)
WO (1) WO2014133103A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104245849B (en) 2012-03-23 2016-08-17 琳得科株式会社 The using method of solidification compound, solidfied material and solidification compound
EP3034560A4 (en) * 2013-09-20 2017-04-05 Lintec Corporation Curable composition, curing product, and method for using curable composition
EP3034543B1 (en) * 2013-09-20 2021-03-31 Lintec Corporation Curable composition, curing product, and method for using curable composition
WO2015041339A1 (en) * 2013-09-20 2015-03-26 リンテック株式会社 Curable composition, cured product, and method for using curable composition
MY179587A (en) 2014-07-23 2020-11-11 Lintec Corp Curable composition, method for manufacturing curable composition, cured product, method for using curable composition, and optical device
WO2017110947A1 (en) * 2015-12-22 2017-06-29 リンテック株式会社 Curable composition, method for producing curable composition, cured product, and use of curable composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2546306A1 (en) * 2010-03-09 2013-01-16 LINTEC Corporation Curable composition, hardened material, and method for using curable composition

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995020019A1 (en) 1994-01-21 1995-07-27 Toshiba Silicone Co., Ltd. Adhesive composition and method of curing the same
JPH07309927A (en) 1994-05-17 1995-11-28 Nitto Denko Corp Optical semiconductor device
JP4221089B2 (en) 1998-05-27 2009-02-12 東レ・ダウコーニング株式会社 Composition containing siloxane
JP2001247749A (en) * 2000-03-06 2001-09-11 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP3846563B2 (en) * 2002-01-15 2006-11-15 信越化学工業株式会社 Hard protective film-forming coating agent and optical article
JP4734832B2 (en) 2003-05-14 2011-07-27 ナガセケムテックス株式会社 Encapsulant for optical element
JP2005263869A (en) 2004-03-16 2005-09-29 Nagase Chemtex Corp Resin composition for sealing optical semiconductor
US7351477B2 (en) * 2004-04-07 2008-04-01 Shin-Etsu Chemical Co., Ltd. Antifouling coating compositions and coated articles
US20050288415A1 (en) * 2004-06-23 2005-12-29 Beers Melvin D Highly elastomeric and paintable silicone compositions
JP4771046B2 (en) 2005-03-11 2011-09-14 信越化学工業株式会社 Curable silicone rubber composition and method for producing composite molded body of liquid crystal polymer and silicone rubber
JP2006328231A (en) 2005-05-26 2006-12-07 Nagase Chemtex Corp Resin composition for encapsulating optical element
JP5224734B2 (en) 2007-06-25 2013-07-03 日東電工株式会社 Epoxy resin composition for optical semiconductor element sealing and optical semiconductor device using the same
WO2009101753A1 (en) * 2008-02-14 2009-08-20 Lintec Corporation Molding material composed of polyorganosiloxane compound, sealing material, and sealed optical device
CN102046700B (en) 2008-03-26 2015-03-11 琳得科株式会社 Fixing material comprising silane compound polymer and photonic device sealed body
JP5129102B2 (en) * 2008-12-02 2013-01-23 株式会社カネカ Curable composition and cured product
CN103282440B (en) * 2010-11-30 2016-01-20 琳得科株式会社 The using method of solidification compound, cured article and solidification compound
JP6046898B2 (en) 2011-03-10 2016-12-21 リンテック株式会社 Curable composition, cured product and method of using curable composition

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2546306A1 (en) * 2010-03-09 2013-01-16 LINTEC Corporation Curable composition, hardened material, and method for using curable composition

Also Published As

Publication number Publication date
JP6228591B2 (en) 2017-11-08
KR102105811B1 (en) 2020-04-29
JPWO2014133103A1 (en) 2017-02-02
WO2014133103A1 (en) 2014-09-04
EP2963088A1 (en) 2016-01-06
CN105121555A (en) 2015-12-02
US20160009970A1 (en) 2016-01-14
TW201500471A (en) 2015-01-01
MY173820A (en) 2020-02-24
KR20150122223A (en) 2015-10-30
TWI637030B (en) 2018-10-01
US9783715B2 (en) 2017-10-10
CN105121555B (en) 2018-09-18
EP2963088B1 (en) 2020-06-10

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