EP2927297A4 - Adhesive agent composition, adhesive sheet, and electronic device and production method therefor - Google Patents
Adhesive agent composition, adhesive sheet, and electronic device and production method thereforInfo
- Publication number
- EP2927297A4 EP2927297A4 EP13858649.0A EP13858649A EP2927297A4 EP 2927297 A4 EP2927297 A4 EP 2927297A4 EP 13858649 A EP13858649 A EP 13858649A EP 2927297 A4 EP2927297 A4 EP 2927297A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic device
- production method
- agent composition
- method therefor
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000853 adhesive Substances 0.000 title 2
- 230000001070 adhesive effect Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
- B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
- B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/383—Natural or synthetic rubber
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/412—Transparent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2409/00—Presence of diene rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012263877 | 2012-11-30 | ||
JP2012263876 | 2012-11-30 | ||
PCT/JP2013/082173 WO2014084352A1 (en) | 2012-11-30 | 2013-11-29 | Adhesive agent composition, adhesive sheet, and electronic device and production method therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2927297A1 EP2927297A1 (en) | 2015-10-07 |
EP2927297A4 true EP2927297A4 (en) | 2016-08-03 |
Family
ID=50827980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13858649.0A Withdrawn EP2927297A4 (en) | 2012-11-30 | 2013-11-29 | Adhesive agent composition, adhesive sheet, and electronic device and production method therefor |
Country Status (7)
Country | Link |
---|---|
US (1) | US9809728B2 (en) |
EP (1) | EP2927297A4 (en) |
JP (3) | JPWO2014084352A1 (en) |
KR (1) | KR102189387B1 (en) |
CN (1) | CN104797670B (en) |
TW (1) | TWI639667B (en) |
WO (1) | WO2014084352A1 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015129624A1 (en) * | 2014-02-25 | 2015-09-03 | リンテック株式会社 | Adhesive composition, adhesive sheet, and electronic device |
WO2015198991A1 (en) * | 2014-06-27 | 2015-12-30 | 富士フイルム株式会社 | Method for producing electronic device and composite film |
WO2016084791A1 (en) * | 2014-11-25 | 2016-06-02 | コニカミノルタ株式会社 | Sealing film, function element and method for producing sealing film |
CN107851731B (en) * | 2015-06-09 | 2020-05-12 | 株式会社Lg化学 | Organic electronic device |
CN107849414B (en) | 2015-06-09 | 2020-06-05 | 株式会社Lg化学 | Adhesive composition, adhesive film comprising the same, and organic electronic device comprising the same |
KR102028187B1 (en) * | 2016-04-22 | 2019-10-04 | 주식회사 엘지화학 | Adhesive composition for optical use and adhesive layer for optical use comprising cured product thereof |
CN106531904A (en) * | 2016-11-22 | 2017-03-22 | 武汉船舶通信研究所 | OLED display device package and packaging method |
US9960389B1 (en) | 2017-05-05 | 2018-05-01 | 3M Innovative Properties Company | Polymeric films and display devices containing such films |
KR102283118B1 (en) * | 2017-11-01 | 2021-07-28 | 주식회사 엘지화학 | Organic-inorganic complex solar cell and method for manufacturing same |
WO2019131968A1 (en) * | 2017-12-28 | 2019-07-04 | 日東電工株式会社 | Adhesive composition and adhesive sheet |
WO2019131967A1 (en) * | 2017-12-28 | 2019-07-04 | 日東電工株式会社 | Sheet body, electronic component housing case, moisture permeability evaluation method for sheet bodies, moisture permeation measurement method, and moisture permeability evaluation device for sheet bodies |
EP3820920A2 (en) | 2018-07-12 | 2021-05-19 | 3M Innovative Properties Company | Composition comprising styrene isobutylene block copolymer and ethylenically unsaturated monomer |
TWI685119B (en) * | 2018-10-02 | 2020-02-11 | 臺灣塑膠工業股份有限公司 | Method of laminating film for dye-sensitized cell |
JP7346907B2 (en) * | 2019-05-21 | 2023-09-20 | 王子ホールディングス株式会社 | Method for producing adhesive sheet, adhesive sheet with release sheet, and laminate |
CN110776837B (en) * | 2019-08-15 | 2022-04-01 | 广东东溢新材料科技有限公司 | Light-transmitting barrier composite film and preparation method thereof |
JP7347087B2 (en) * | 2019-09-30 | 2023-09-20 | 味の素株式会社 | adhesive sheet |
WO2021124856A1 (en) * | 2019-12-20 | 2021-06-24 | 日東電工株式会社 | Adhesive sheet |
KR20220048517A (en) * | 2020-10-12 | 2022-04-20 | 삼성디스플레이 주식회사 | Display apparatus |
JP6985553B1 (en) * | 2021-06-10 | 2021-12-22 | 株式会社サンエー化研 | Adhesive composition and adhesive sheet |
WO2023119752A1 (en) * | 2021-12-21 | 2023-06-29 | 日東電工株式会社 | Adhesive sheet |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007111607A1 (en) * | 2006-03-29 | 2007-10-04 | National Starch And Chemical Investment | Radiation-curable rubber adhesive/sealant |
WO2010063579A1 (en) * | 2008-12-03 | 2010-06-10 | Tesa Se | Method for encapsulating an electronic arrangement |
WO2012032907A1 (en) * | 2010-09-07 | 2012-03-15 | リンテック株式会社 | Adhesive sheet and electronic device |
WO2013002288A1 (en) * | 2011-06-28 | 2013-01-03 | リンテック株式会社 | Adhesive composition and adhesive sheet |
WO2013015096A1 (en) * | 2011-07-25 | 2013-01-31 | リンテック株式会社 | Gas barrier film laminate and electronic component |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05101884A (en) | 1991-10-11 | 1993-04-23 | Idemitsu Kosan Co Ltd | Sealing method and patterning method of organic electroluminescent element |
JPH05182759A (en) | 1991-12-26 | 1993-07-23 | Pioneer Video Corp | Organic el element |
WO2000033127A1 (en) * | 1998-11-30 | 2000-06-08 | Teijin Limited | Liquid crystal device and transparent conductive substrate preferable to the same |
JP3260349B2 (en) * | 2000-06-05 | 2002-02-25 | 松下電器産業株式会社 | Sealant for electrochemical device and electrochemical device using the same |
JP3726789B2 (en) | 2002-08-23 | 2005-12-14 | 富士電機ホールディングス株式会社 | Organic EL display |
JP2004224991A (en) | 2003-01-27 | 2004-08-12 | Nitto Denko Corp | Adhesive composition and organic el-displaying device |
US7018713B2 (en) * | 2003-04-02 | 2006-03-28 | 3M Innovative Properties Company | Flexible high-temperature ultrabarrier |
JP4373270B2 (en) * | 2004-05-13 | 2009-11-25 | 大日本印刷株式会社 | Gas barrier film, and liquid crystal display element and EL display element formed using the same |
JP2007197517A (en) | 2006-01-24 | 2007-08-09 | Three M Innovative Properties Co | Adhesive sealing composition, sealing film and organic el element |
US7629397B2 (en) * | 2006-06-23 | 2009-12-08 | Exxonmobil Chemical Patents Inc. | Phase separation process utilizing a hydrofluorocarbon |
US8202927B2 (en) * | 2007-08-09 | 2012-06-19 | Dai Nippon Printing Co., Ltd. | Near-infrared absorbing composition and near-infrared absorbing filter |
KR101623220B1 (en) * | 2008-06-02 | 2016-05-20 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Adhesive encapsulating composition and electronic devices made therewith |
KR20160105527A (en) * | 2008-07-10 | 2016-09-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Viscoelastic lightguide |
JP5544109B2 (en) * | 2009-03-31 | 2014-07-09 | リンテック株式会社 | Gas barrier film and electronic device |
JP2011054743A (en) * | 2009-09-01 | 2011-03-17 | Nitto Denko Corp | Adhesive sealing material for end of solar cell panel, sealing structure of end of the solar cell panel and sealing method, and solar cell module and method for manufacturing the module |
TW201121360A (en) * | 2009-10-14 | 2011-06-16 | Zeon Corp | Organic electroluminescent light source device |
JP2011096988A (en) * | 2009-11-02 | 2011-05-12 | Keiwa Inc | Adhesive sheet for protecting back of solar cell module, and solar cell module using the same |
KR101165220B1 (en) * | 2009-11-02 | 2012-07-16 | 케이와 인코포레이티드 | Adhesive sheet for protecting back sheet for photovoltaic module and photovoltaic module using the same |
JP5719647B2 (en) | 2010-04-09 | 2015-05-20 | 日東電工株式会社 | Sealing composition, double glazing and solar cell panel |
JP5593175B2 (en) * | 2010-09-09 | 2014-09-17 | リンテック株式会社 | Sealing adhesive sheet, electronic device, and organic device |
TWI464066B (en) * | 2011-02-02 | 2014-12-11 | Toyo Boseki | A laminate |
JP2012179762A (en) * | 2011-02-28 | 2012-09-20 | Nitto Denko Corp | Transparent gas-barrier film, method of manufacturing the same, organic electroluminescence device, solar battery, and thin-film battery |
-
2013
- 2013-11-29 WO PCT/JP2013/082173 patent/WO2014084352A1/en active Application Filing
- 2013-11-29 US US14/648,579 patent/US9809728B2/en active Active
- 2013-11-29 KR KR1020157010507A patent/KR102189387B1/en active IP Right Grant
- 2013-11-29 JP JP2014549917A patent/JPWO2014084352A1/en active Pending
- 2013-11-29 CN CN201380061490.XA patent/CN104797670B/en active Active
- 2013-11-29 TW TW102143715A patent/TWI639667B/en active
- 2013-11-29 EP EP13858649.0A patent/EP2927297A4/en not_active Withdrawn
-
2018
- 2018-04-27 JP JP2018086566A patent/JP6482704B2/en active Active
-
2019
- 2019-02-21 JP JP2019029548A patent/JP6734955B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007111607A1 (en) * | 2006-03-29 | 2007-10-04 | National Starch And Chemical Investment | Radiation-curable rubber adhesive/sealant |
WO2010063579A1 (en) * | 2008-12-03 | 2010-06-10 | Tesa Se | Method for encapsulating an electronic arrangement |
WO2012032907A1 (en) * | 2010-09-07 | 2012-03-15 | リンテック株式会社 | Adhesive sheet and electronic device |
EP2615144A1 (en) * | 2010-09-07 | 2013-07-17 | Lintec Corporation | Adhesive sheet and electronic device |
WO2013002288A1 (en) * | 2011-06-28 | 2013-01-03 | リンテック株式会社 | Adhesive composition and adhesive sheet |
EP2727972A1 (en) * | 2011-06-28 | 2014-05-07 | Lintec Corporation | Adhesive composition and adhesive sheet |
WO2013015096A1 (en) * | 2011-07-25 | 2013-01-31 | リンテック株式会社 | Gas barrier film laminate and electronic component |
EP2737997A1 (en) * | 2011-07-25 | 2014-06-04 | Lintec Corporation | Gas barrier film laminate and electronic component |
Non-Patent Citations (1)
Title |
---|
See also references of WO2014084352A1 * |
Also Published As
Publication number | Publication date |
---|---|
US9809728B2 (en) | 2017-11-07 |
US20150299519A1 (en) | 2015-10-22 |
CN104797670B (en) | 2017-12-29 |
JP6734955B2 (en) | 2020-08-05 |
TWI639667B (en) | 2018-11-01 |
JP2019116098A (en) | 2019-07-18 |
JP2018141166A (en) | 2018-09-13 |
CN104797670A (en) | 2015-07-22 |
JP6482704B2 (en) | 2019-03-13 |
EP2927297A1 (en) | 2015-10-07 |
WO2014084352A1 (en) | 2014-06-05 |
KR20150092093A (en) | 2015-08-12 |
TW201435026A (en) | 2014-09-16 |
KR102189387B1 (en) | 2020-12-11 |
JPWO2014084352A1 (en) | 2017-01-05 |
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