EP2927297A4 - Adhesive agent composition, adhesive sheet, and electronic device and production method therefor - Google Patents

Adhesive agent composition, adhesive sheet, and electronic device and production method therefor

Info

Publication number
EP2927297A4
EP2927297A4 EP13858649.0A EP13858649A EP2927297A4 EP 2927297 A4 EP2927297 A4 EP 2927297A4 EP 13858649 A EP13858649 A EP 13858649A EP 2927297 A4 EP2927297 A4 EP 2927297A4
Authority
EP
European Patent Office
Prior art keywords
electronic device
production method
agent composition
method therefor
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13858649.0A
Other languages
German (de)
French (fr)
Other versions
EP2927297A1 (en
Inventor
Kenta Nishijima
Satoshi Naganawa
Emi FUCHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of EP2927297A1 publication Critical patent/EP2927297A1/en
Publication of EP2927297A4 publication Critical patent/EP2927297A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • C09J7/381Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/383Natural or synthetic rubber
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/412Transparent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/20Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206Organic displays, e.g. OLED
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/10Presence of inorganic materials
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00Presence of diene rubber
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00Presence of polyolefin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00Presence of polyester
    • C09J2467/005Presence of polyester in the release coating
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00Presence of polyester
    • C09J2467/006Presence of polyester in the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565Moulds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/564Details not otherwise provided for, e.g. protection against moisture
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
EP13858649.0A 2012-11-30 2013-11-29 Adhesive agent composition, adhesive sheet, and electronic device and production method therefor Withdrawn EP2927297A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012263877 2012-11-30
JP2012263876 2012-11-30
PCT/JP2013/082173 WO2014084352A1 (en) 2012-11-30 2013-11-29 Adhesive agent composition, adhesive sheet, and electronic device and production method therefor

Publications (2)

Publication Number Publication Date
EP2927297A1 EP2927297A1 (en) 2015-10-07
EP2927297A4 true EP2927297A4 (en) 2016-08-03

Family

ID=50827980

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13858649.0A Withdrawn EP2927297A4 (en) 2012-11-30 2013-11-29 Adhesive agent composition, adhesive sheet, and electronic device and production method therefor

Country Status (7)

Country Link
US (1) US9809728B2 (en)
EP (1) EP2927297A4 (en)
JP (3) JPWO2014084352A1 (en)
KR (1) KR102189387B1 (en)
CN (1) CN104797670B (en)
TW (1) TWI639667B (en)
WO (1) WO2014084352A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129624A1 (en) * 2014-02-25 2015-09-03 リンテック株式会社 Adhesive composition, adhesive sheet, and electronic device
WO2015198991A1 (en) * 2014-06-27 2015-12-30 富士フイルム株式会社 Method for producing electronic device and composite film
WO2016084791A1 (en) * 2014-11-25 2016-06-02 コニカミノルタ株式会社 Sealing film, function element and method for producing sealing film
CN107851731B (en) * 2015-06-09 2020-05-12 株式会社Lg化学 Organic electronic device
CN107849414B (en) 2015-06-09 2020-06-05 株式会社Lg化学 Adhesive composition, adhesive film comprising the same, and organic electronic device comprising the same
KR102028187B1 (en) * 2016-04-22 2019-10-04 주식회사 엘지화학 Adhesive composition for optical use and adhesive layer for optical use comprising cured product thereof
CN106531904A (en) * 2016-11-22 2017-03-22 武汉船舶通信研究所 OLED display device package and packaging method
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
KR102283118B1 (en) * 2017-11-01 2021-07-28 주식회사 엘지화학 Organic-inorganic complex solar cell and method for manufacturing same
WO2019131968A1 (en) * 2017-12-28 2019-07-04 日東電工株式会社 Adhesive composition and adhesive sheet
WO2019131967A1 (en) * 2017-12-28 2019-07-04 日東電工株式会社 Sheet body, electronic component housing case, moisture permeability evaluation method for sheet bodies, moisture permeation measurement method, and moisture permeability evaluation device for sheet bodies
EP3820920A2 (en) 2018-07-12 2021-05-19 3M Innovative Properties Company Composition comprising styrene isobutylene block copolymer and ethylenically unsaturated monomer
TWI685119B (en) * 2018-10-02 2020-02-11 臺灣塑膠工業股份有限公司 Method of laminating film for dye-sensitized cell
JP7346907B2 (en) * 2019-05-21 2023-09-20 王子ホールディングス株式会社 Method for producing adhesive sheet, adhesive sheet with release sheet, and laminate
CN110776837B (en) * 2019-08-15 2022-04-01 广东东溢新材料科技有限公司 Light-transmitting barrier composite film and preparation method thereof
JP7347087B2 (en) * 2019-09-30 2023-09-20 味の素株式会社 adhesive sheet
WO2021124856A1 (en) * 2019-12-20 2021-06-24 日東電工株式会社 Adhesive sheet
KR20220048517A (en) * 2020-10-12 2022-04-20 삼성디스플레이 주식회사 Display apparatus
JP6985553B1 (en) * 2021-06-10 2021-12-22 株式会社サンエー化研 Adhesive composition and adhesive sheet
WO2023119752A1 (en) * 2021-12-21 2023-06-29 日東電工株式会社 Adhesive sheet

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007111607A1 (en) * 2006-03-29 2007-10-04 National Starch And Chemical Investment Radiation-curable rubber adhesive/sealant
WO2010063579A1 (en) * 2008-12-03 2010-06-10 Tesa Se Method for encapsulating an electronic arrangement
WO2012032907A1 (en) * 2010-09-07 2012-03-15 リンテック株式会社 Adhesive sheet and electronic device
WO2013002288A1 (en) * 2011-06-28 2013-01-03 リンテック株式会社 Adhesive composition and adhesive sheet
WO2013015096A1 (en) * 2011-07-25 2013-01-31 リンテック株式会社 Gas barrier film laminate and electronic component

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05101884A (en) 1991-10-11 1993-04-23 Idemitsu Kosan Co Ltd Sealing method and patterning method of organic electroluminescent element
JPH05182759A (en) 1991-12-26 1993-07-23 Pioneer Video Corp Organic el element
WO2000033127A1 (en) * 1998-11-30 2000-06-08 Teijin Limited Liquid crystal device and transparent conductive substrate preferable to the same
JP3260349B2 (en) * 2000-06-05 2002-02-25 松下電器産業株式会社 Sealant for electrochemical device and electrochemical device using the same
JP3726789B2 (en) 2002-08-23 2005-12-14 富士電機ホールディングス株式会社 Organic EL display
JP2004224991A (en) 2003-01-27 2004-08-12 Nitto Denko Corp Adhesive composition and organic el-displaying device
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
JP4373270B2 (en) * 2004-05-13 2009-11-25 大日本印刷株式会社 Gas barrier film, and liquid crystal display element and EL display element formed using the same
JP2007197517A (en) 2006-01-24 2007-08-09 Three M Innovative Properties Co Adhesive sealing composition, sealing film and organic el element
US7629397B2 (en) * 2006-06-23 2009-12-08 Exxonmobil Chemical Patents Inc. Phase separation process utilizing a hydrofluorocarbon
US8202927B2 (en) * 2007-08-09 2012-06-19 Dai Nippon Printing Co., Ltd. Near-infrared absorbing composition and near-infrared absorbing filter
KR101623220B1 (en) * 2008-06-02 2016-05-20 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Adhesive encapsulating composition and electronic devices made therewith
KR20160105527A (en) * 2008-07-10 2016-09-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Viscoelastic lightguide
JP5544109B2 (en) * 2009-03-31 2014-07-09 リンテック株式会社 Gas barrier film and electronic device
JP2011054743A (en) * 2009-09-01 2011-03-17 Nitto Denko Corp Adhesive sealing material for end of solar cell panel, sealing structure of end of the solar cell panel and sealing method, and solar cell module and method for manufacturing the module
TW201121360A (en) * 2009-10-14 2011-06-16 Zeon Corp Organic electroluminescent light source device
JP2011096988A (en) * 2009-11-02 2011-05-12 Keiwa Inc Adhesive sheet for protecting back of solar cell module, and solar cell module using the same
KR101165220B1 (en) * 2009-11-02 2012-07-16 케이와 인코포레이티드 Adhesive sheet for protecting back sheet for photovoltaic module and photovoltaic module using the same
JP5719647B2 (en) 2010-04-09 2015-05-20 日東電工株式会社 Sealing composition, double glazing and solar cell panel
JP5593175B2 (en) * 2010-09-09 2014-09-17 リンテック株式会社 Sealing adhesive sheet, electronic device, and organic device
TWI464066B (en) * 2011-02-02 2014-12-11 Toyo Boseki A laminate
JP2012179762A (en) * 2011-02-28 2012-09-20 Nitto Denko Corp Transparent gas-barrier film, method of manufacturing the same, organic electroluminescence device, solar battery, and thin-film battery

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007111607A1 (en) * 2006-03-29 2007-10-04 National Starch And Chemical Investment Radiation-curable rubber adhesive/sealant
WO2010063579A1 (en) * 2008-12-03 2010-06-10 Tesa Se Method for encapsulating an electronic arrangement
WO2012032907A1 (en) * 2010-09-07 2012-03-15 リンテック株式会社 Adhesive sheet and electronic device
EP2615144A1 (en) * 2010-09-07 2013-07-17 Lintec Corporation Adhesive sheet and electronic device
WO2013002288A1 (en) * 2011-06-28 2013-01-03 リンテック株式会社 Adhesive composition and adhesive sheet
EP2727972A1 (en) * 2011-06-28 2014-05-07 Lintec Corporation Adhesive composition and adhesive sheet
WO2013015096A1 (en) * 2011-07-25 2013-01-31 リンテック株式会社 Gas barrier film laminate and electronic component
EP2737997A1 (en) * 2011-07-25 2014-06-04 Lintec Corporation Gas barrier film laminate and electronic component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014084352A1 *

Also Published As

Publication number Publication date
US9809728B2 (en) 2017-11-07
US20150299519A1 (en) 2015-10-22
CN104797670B (en) 2017-12-29
JP6734955B2 (en) 2020-08-05
TWI639667B (en) 2018-11-01
JP2019116098A (en) 2019-07-18
JP2018141166A (en) 2018-09-13
CN104797670A (en) 2015-07-22
JP6482704B2 (en) 2019-03-13
EP2927297A1 (en) 2015-10-07
WO2014084352A1 (en) 2014-06-05
KR20150092093A (en) 2015-08-12
TW201435026A (en) 2014-09-16
KR102189387B1 (en) 2020-12-11
JPWO2014084352A1 (en) 2017-01-05

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