EP2927297A4 - Adhesive agent composition, adhesive sheet, and electronic device and production method therefor - Google Patents

Adhesive agent composition, adhesive sheet, and electronic device and production method therefor

Info

Publication number
EP2927297A4
EP2927297A4 EP13858649.0A EP13858649A EP2927297A4 EP 2927297 A4 EP2927297 A4 EP 2927297A4 EP 13858649 A EP13858649 A EP 13858649A EP 2927297 A4 EP2927297 A4 EP 2927297A4
Authority
EP
European Patent Office
Prior art keywords
electronic device
production method
agent composition
method therefor
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13858649.0A
Other languages
German (de)
French (fr)
Other versions
EP2927297A1 (en
Inventor
Kenta Nishijima
Satoshi Naganawa
Emi FUCHI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of EP2927297A1 publication Critical patent/EP2927297A1/en
Publication of EP2927297A4 publication Critical patent/EP2927297A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/383—Natural or synthetic rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/412—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2409/00—Presence of diene rubber
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
EP13858649.0A 2012-11-30 2013-11-29 Adhesive agent composition, adhesive sheet, and electronic device and production method therefor Withdrawn EP2927297A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012263877 2012-11-30
JP2012263876 2012-11-30
PCT/JP2013/082173 WO2014084352A1 (en) 2012-11-30 2013-11-29 Adhesive agent composition, adhesive sheet, and electronic device and production method therefor

Publications (2)

Publication Number Publication Date
EP2927297A1 EP2927297A1 (en) 2015-10-07
EP2927297A4 true EP2927297A4 (en) 2016-08-03

Family

ID=50827980

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13858649.0A Withdrawn EP2927297A4 (en) 2012-11-30 2013-11-29 Adhesive agent composition, adhesive sheet, and electronic device and production method therefor

Country Status (7)

Country Link
US (1) US9809728B2 (en)
EP (1) EP2927297A4 (en)
JP (3) JPWO2014084352A1 (en)
KR (1) KR102189387B1 (en)
CN (1) CN104797670B (en)
TW (1) TWI639667B (en)
WO (1) WO2014084352A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129624A1 (en) * 2014-02-25 2015-09-03 リンテック株式会社 Adhesive composition, adhesive sheet, and electronic device
KR101745293B1 (en) * 2014-06-27 2017-06-08 후지필름 가부시키가이샤 Method for producing electronic device and composite film
JPWO2016084791A1 (en) * 2014-11-25 2017-08-31 コニカミノルタ株式会社 Sealing film, functional element, and method for manufacturing sealing film
CN107849414B (en) 2015-06-09 2020-06-05 株式会社Lg化学 Adhesive composition, adhesive film comprising the same, and organic electronic device comprising the same
KR102040469B1 (en) 2015-06-09 2019-11-05 주식회사 엘지화학 Organic electronic device
CN109072028B (en) * 2016-04-22 2020-09-04 株式会社Lg化学 Optical adhesive composition and optical adhesive layer comprising cured product thereof
CN106531904A (en) * 2016-11-22 2017-03-22 武汉船舶通信研究所 OLED display device package and packaging method
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
KR102283118B1 (en) * 2017-11-01 2021-07-28 주식회사 엘지화학 Organic-inorganic complex solar cell and method for manufacturing same
WO2019131967A1 (en) * 2017-12-28 2019-07-04 日東電工株式会社 Sheet body, electronic component housing case, moisture permeability evaluation method for sheet bodies, moisture permeation measurement method, and moisture permeability evaluation device for sheet bodies
US20210079270A1 (en) * 2017-12-28 2021-03-18 Nitto Denko Corporation Sheet body, electronic part case, method for testing moisture permeation of sheet body, method for measuring moisture permeability and moisture permeation testing device for sheet body
WO2020012329A2 (en) 2018-07-12 2020-01-16 3M Innovative Properties Company Composition comprising styrene isobutylene block copolymer and ethylenically unsaturated monomer
TWI685119B (en) * 2018-10-02 2020-02-11 臺灣塑膠工業股份有限公司 Method of laminating film for dye-sensitized cell
JP7346907B2 (en) * 2019-05-21 2023-09-20 王子ホールディングス株式会社 Method for producing adhesive sheet, adhesive sheet with release sheet, and laminate
CN110776837B (en) * 2019-08-15 2022-04-01 广东东溢新材料科技有限公司 Light-transmitting barrier composite film and preparation method thereof
JP7347087B2 (en) * 2019-09-30 2023-09-20 味の素株式会社 adhesive sheet
WO2021124856A1 (en) * 2019-12-20 2021-06-24 日東電工株式会社 Adhesive sheet
KR20220048517A (en) * 2020-10-12 2022-04-20 삼성디스플레이 주식회사 Display apparatus
JP6985553B1 (en) * 2021-06-10 2021-12-22 株式会社サンエー化研 Adhesive composition and adhesive sheet
WO2023119752A1 (en) * 2021-12-21 2023-06-29 日東電工株式会社 Adhesive sheet

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007111607A1 (en) * 2006-03-29 2007-10-04 National Starch And Chemical Investment Radiation-curable rubber adhesive/sealant
WO2010063579A1 (en) * 2008-12-03 2010-06-10 Tesa Se Method for encapsulating an electronic arrangement
WO2012032907A1 (en) * 2010-09-07 2012-03-15 リンテック株式会社 Adhesive sheet and electronic device
WO2013002288A1 (en) * 2011-06-28 2013-01-03 リンテック株式会社 Adhesive composition and adhesive sheet
WO2013015096A1 (en) * 2011-07-25 2013-01-31 リンテック株式会社 Gas barrier film laminate and electronic component

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05101884A (en) 1991-10-11 1993-04-23 Idemitsu Kosan Co Ltd Sealing method and patterning method of organic electroluminescent element
JPH05182759A (en) 1991-12-26 1993-07-23 Pioneer Video Corp Organic el element
DE69941114D1 (en) * 1998-11-30 2009-08-27 Teijin Ltd LIQUID CRYSTAL DISPLAY AND DAFUER PREFERRED TRANSPARENT, CONDUCTIVE SUBSTRATE
JP3260349B2 (en) * 2000-06-05 2002-02-25 松下電器産業株式会社 Sealant for electrochemical device and electrochemical device using the same
JP3726789B2 (en) 2002-08-23 2005-12-14 富士電機ホールディングス株式会社 Organic EL display
JP2004224991A (en) 2003-01-27 2004-08-12 Nitto Denko Corp Adhesive composition and organic el-displaying device
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
JP4373270B2 (en) * 2004-05-13 2009-11-25 大日本印刷株式会社 Gas barrier film, and liquid crystal display element and EL display element formed using the same
JP2007197517A (en) * 2006-01-24 2007-08-09 Three M Innovative Properties Co Adhesive sealing composition, sealing film and organic el element
US7629397B2 (en) * 2006-06-23 2009-12-08 Exxonmobil Chemical Patents Inc. Phase separation process utilizing a hydrofluorocarbon
US8202927B2 (en) * 2007-08-09 2012-06-19 Dai Nippon Printing Co., Ltd. Near-infrared absorbing composition and near-infrared absorbing filter
US8232350B2 (en) * 2008-06-02 2012-07-31 3M Innovative Properties Company Adhesive encapsulating composition and electronic devices made therewith
EP2313800A4 (en) * 2008-07-10 2014-03-19 3M Innovative Properties Co Viscoelastic lightguide
JP5544109B2 (en) * 2009-03-31 2014-07-09 リンテック株式会社 Gas barrier film and electronic device
JP2011054743A (en) 2009-09-01 2011-03-17 Nitto Denko Corp Adhesive sealing material for end of solar cell panel, sealing structure of end of the solar cell panel and sealing method, and solar cell module and method for manufacturing the module
JPWO2011046144A1 (en) * 2009-10-14 2013-03-07 日本ゼオン株式会社 Organic electroluminescence light source device
JP2011096988A (en) * 2009-11-02 2011-05-12 Keiwa Inc Adhesive sheet for protecting back of solar cell module, and solar cell module using the same
KR101165220B1 (en) * 2009-11-02 2012-07-16 케이와 인코포레이티드 Adhesive sheet for protecting back sheet for photovoltaic module and photovoltaic module using the same
JP5719647B2 (en) * 2010-04-09 2015-05-20 日東電工株式会社 Sealing composition, double glazing and solar cell panel
JP5593175B2 (en) 2010-09-09 2014-09-17 リンテック株式会社 Sealing adhesive sheet, electronic device, and organic device
TWI464066B (en) * 2011-02-02 2014-12-11 Toyo Boseki A laminate
JP2012179762A (en) * 2011-02-28 2012-09-20 Nitto Denko Corp Transparent gas-barrier film, method of manufacturing the same, organic electroluminescence device, solar battery, and thin-film battery

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007111607A1 (en) * 2006-03-29 2007-10-04 National Starch And Chemical Investment Radiation-curable rubber adhesive/sealant
WO2010063579A1 (en) * 2008-12-03 2010-06-10 Tesa Se Method for encapsulating an electronic arrangement
WO2012032907A1 (en) * 2010-09-07 2012-03-15 リンテック株式会社 Adhesive sheet and electronic device
EP2615144A1 (en) * 2010-09-07 2013-07-17 Lintec Corporation Adhesive sheet and electronic device
WO2013002288A1 (en) * 2011-06-28 2013-01-03 リンテック株式会社 Adhesive composition and adhesive sheet
EP2727972A1 (en) * 2011-06-28 2014-05-07 Lintec Corporation Adhesive composition and adhesive sheet
WO2013015096A1 (en) * 2011-07-25 2013-01-31 リンテック株式会社 Gas barrier film laminate and electronic component
EP2737997A1 (en) * 2011-07-25 2014-06-04 Lintec Corporation Gas barrier film laminate and electronic component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014084352A1 *

Also Published As

Publication number Publication date
KR102189387B1 (en) 2020-12-11
CN104797670A (en) 2015-07-22
US20150299519A1 (en) 2015-10-22
TWI639667B (en) 2018-11-01
JP6734955B2 (en) 2020-08-05
JP2018141166A (en) 2018-09-13
JP6482704B2 (en) 2019-03-13
JPWO2014084352A1 (en) 2017-01-05
KR20150092093A (en) 2015-08-12
TW201435026A (en) 2014-09-16
US9809728B2 (en) 2017-11-07
CN104797670B (en) 2017-12-29
EP2927297A1 (en) 2015-10-07
JP2019116098A (en) 2019-07-18
WO2014084352A1 (en) 2014-06-05

Similar Documents

Publication Publication Date Title
EP2927297A4 (en) Adhesive agent composition, adhesive sheet, and electronic device and production method therefor
EP2927296A4 (en) Adhesive agent composition, adhesive sheet, and electronic device
EP2815880A4 (en) Functional film, method for producing the same, and electronic device including comprising functional film
EP2913372A4 (en) Adhesive agent composition and adhesive sheet
EP2987840A4 (en) Adhesive composition, adhesive layer, and adhesive sheet
EP2921203A4 (en) Transdermal absorption sheet, and manufacturing method for same
EP2927298A4 (en) Adhesive agent composition, adhesive sheet, and electronic device
EP2677408A4 (en) Electronic device, display method, and program
EP2835256A4 (en) Transparent sheet and method for manufacturing same
EP2871219A4 (en) Adhesive layer and adhesive sheet
EP3035396A4 (en) Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same
EP2861538A4 (en) Bioconversion processes and apparatus
EP2927295A4 (en) Adhesive agent composition, adhesive sheet, and electronic device
EP2902460A4 (en) Adhesive sheet and method for manufacturing adhesive sheet
EP2881096A4 (en) Composite sheet production method and device
EP3035397A4 (en) Heat-conductive adhesive sheet, manufacturing method for same, and electronic device using same
EP2982726A4 (en) Electrically peelable adhesive composition, electrically peelable adhesive sheet, and method for using electrically peelable adhesive sheet
EP2915766A4 (en) Method for affixing adhesive sheets and device for affixing adhesive sheets
EP2826833A4 (en) Adhesive composition and adhesive sheet
SG11201404536VA (en) Display device, electronic device comprising same, and drive method for display device
TWI563049B (en) Adhesive composition and adhesive sheet
EP2921295A4 (en) Web adhesive application device and adhesive application method as well as cardboard sheet manufacturing device
EP2826832A4 (en) Adhesive composition and adhesive sheet
TWI560510B (en) Electronic ink display device and method for manufacturing the same
EP2675174A4 (en) Receiving device, receiving method, and electronic device

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20150527

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20160630

RIC1 Information provided on ipc code assigned before grant

Ipc: H05B 33/04 20060101ALI20160624BHEP

Ipc: C09J 123/22 20060101AFI20160624BHEP

Ipc: C09J 7/00 20060101ALI20160624BHEP

Ipc: H01L 51/50 20060101ALI20160624BHEP

Ipc: C09J 109/00 20060101ALI20160624BHEP

Ipc: C09J 7/02 20060101ALI20160624BHEP

Ipc: H01L 21/56 20060101ALI20160624BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20200402

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

RIC1 Information provided on ipc code assigned before grant

Ipc: C09J 123/22 20060101ALI20200710BHEP

Ipc: C09J 7/38 20180101AFI20200710BHEP

Ipc: H01L 51/52 20060101ALI20200710BHEP

Ipc: H05B 33/04 20060101ALI20200710BHEP

INTG Intention to grant announced

Effective date: 20200812

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20201223