EP2903026A4 - Radiation detection element and radiograph detection device - Google Patents

Radiation detection element and radiograph detection device

Info

Publication number
EP2903026A4
EP2903026A4 EP13840886.9A EP13840886A EP2903026A4 EP 2903026 A4 EP2903026 A4 EP 2903026A4 EP 13840886 A EP13840886 A EP 13840886A EP 2903026 A4 EP2903026 A4 EP 2903026A4
Authority
EP
European Patent Office
Prior art keywords
radiograph
detection device
radiation
detection element
radiation detection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13840886.9A
Other languages
German (de)
French (fr)
Other versions
EP2903026B1 (en
EP2903026A1 (en
Inventor
Yoshihiro Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of EP2903026A1 publication Critical patent/EP2903026A1/en
Publication of EP2903026A4 publication Critical patent/EP2903026A4/en
Application granted granted Critical
Publication of EP2903026B1 publication Critical patent/EP2903026B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/24Measuring radiation intensity with semiconductor detectors
    • G01T1/241Electrode arrangements, e.g. continuous or parallel strips or the like
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity
    • G01T1/24Measuring radiation intensity with semiconductor detectors
    • G01T1/247Detector read-out circuitry
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H01L27/14605Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14632Wafer-level processed structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14665Imagers using a photoconductor layer
    • H01L27/14676X-ray, gamma-ray or corpuscular radiation imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/0248Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
    • H01L31/0256Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
    • H01L31/0264Inorganic materials
    • H01L31/0272Selenium or tellurium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/085Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors the device being sensitive to very short wavelength, e.g. X-ray, Gamma-rays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
EP13840886.9A 2012-09-28 2013-09-27 Radiation detection element and radiograph detection device Active EP2903026B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012218426 2012-09-28
PCT/JP2013/076421 WO2014051118A1 (en) 2012-09-28 2013-09-27 Radiation detection element and radiograph detection device

Publications (3)

Publication Number Publication Date
EP2903026A1 EP2903026A1 (en) 2015-08-05
EP2903026A4 true EP2903026A4 (en) 2016-05-11
EP2903026B1 EP2903026B1 (en) 2017-10-25

Family

ID=50388507

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13840886.9A Active EP2903026B1 (en) 2012-09-28 2013-09-27 Radiation detection element and radiograph detection device

Country Status (6)

Country Link
US (1) US9651685B2 (en)
EP (1) EP2903026B1 (en)
JP (1) JP5770945B2 (en)
CN (1) CN104685629B (en)
TW (1) TWI655755B (en)
WO (1) WO2014051118A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6138754B2 (en) * 2014-03-03 2017-05-31 富士フイルム株式会社 Radiographic imaging system, radiographic imaging device, radiographic imaging device control method, and radiographic imaging device control program
KR102347817B1 (en) * 2015-07-02 2022-01-10 삼성디스플레이 주식회사 Display apparatus
JP2017098830A (en) * 2015-11-26 2017-06-01 キヤノン株式会社 Radiation imaging device, radiation imaging system, and manufacturing method of radiation imaging device
WO2018123907A1 (en) * 2016-12-27 2018-07-05 シャープ株式会社 Imaging panel and production method for same
CN107507843B (en) * 2017-06-05 2020-05-08 上海奕瑞光电子科技股份有限公司 Pixel structure and X-ray image sensor
EP3699613A1 (en) * 2017-10-18 2020-08-26 Sony Semiconductor Solutions Corporation Charge detection sensor and potential measuring system
CN109087927B (en) * 2018-08-15 2021-01-29 京东方科技集团股份有限公司 Array substrate, X-ray detection panel and X-ray detection device
US11353759B2 (en) * 2018-09-17 2022-06-07 Nuclera Nucleics Ltd. Backplanes with hexagonal and triangular electrodes
KR102659426B1 (en) * 2018-12-27 2024-04-19 엘지디스플레이 주식회사 Digital x-ray detector
CN110324548B (en) * 2019-06-27 2021-11-09 Oppo广东移动通信有限公司 Pixel unit circuit, signal processing method and storage medium
FR3117268B1 (en) * 2020-12-08 2022-12-09 St Microelectronics Crolles 2 Sas Pixel of a light sensor and method of manufacturing the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003255049A (en) * 2002-03-06 2003-09-10 Canon Inc Light-detecting apparatus and radiation-detecting apparatus
US20070177044A1 (en) * 2006-01-27 2007-08-02 Shunsuke Maruyama Solid-state image pickup device
US20110121189A1 (en) * 2009-11-20 2011-05-26 Fujifilm Corporation Radiation detector
US20110174957A1 (en) * 2010-01-15 2011-07-21 Fujifilm Corporation Radiation detection element
EP2743986A1 (en) * 2011-08-12 2014-06-18 FUJIFILM Corporation Radiation detection element, radiograph detection panel, and radiograph detection device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4264251B2 (en) * 2002-12-09 2009-05-13 富士フイルム株式会社 Solid-state imaging device and operation method thereof
JP5043380B2 (en) * 2005-07-25 2012-10-10 キヤノン株式会社 Radiation detection apparatus and radiation detection system
JP4832034B2 (en) * 2005-09-14 2011-12-07 富士フイルム株式会社 MOS image sensor
US7880787B2 (en) 2005-09-14 2011-02-01 Fujifilm Corporation MOS image sensor
JP2007081139A (en) * 2005-09-14 2007-03-29 Fujifilm Corp Mos image sensor
US20100059753A1 (en) * 2006-06-16 2010-03-11 Silk Displays Matrix electronic devices using opaque substrates and fabrication method therefor
US7965326B2 (en) * 2006-09-27 2011-06-21 Fujifilm Corporation Semiconductor element, method of driving semiconductor element and solid imaging apparatus
JP2008198910A (en) * 2007-02-15 2008-08-28 Fujifilm Corp Radiation image detection device and its manufacturing method
JP2013068472A (en) * 2011-09-21 2013-04-18 Fujifilm Corp Radiation detection element, radiation image detection panel, and radiation image imaging apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003255049A (en) * 2002-03-06 2003-09-10 Canon Inc Light-detecting apparatus and radiation-detecting apparatus
US20070177044A1 (en) * 2006-01-27 2007-08-02 Shunsuke Maruyama Solid-state image pickup device
US20110121189A1 (en) * 2009-11-20 2011-05-26 Fujifilm Corporation Radiation detector
US20110174957A1 (en) * 2010-01-15 2011-07-21 Fujifilm Corporation Radiation detection element
EP2743986A1 (en) * 2011-08-12 2014-06-18 FUJIFILM Corporation Radiation detection element, radiograph detection panel, and radiograph detection device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014051118A1 *

Also Published As

Publication number Publication date
TW201419510A (en) 2014-05-16
EP2903026B1 (en) 2017-10-25
JP5770945B2 (en) 2015-08-26
TWI655755B (en) 2019-04-01
US20160178763A1 (en) 2016-06-23
JPWO2014051118A1 (en) 2016-08-25
WO2014051118A1 (en) 2014-04-03
US9651685B2 (en) 2017-05-16
EP2903026A1 (en) 2015-08-05
CN104685629B (en) 2016-04-06
CN104685629A (en) 2015-06-03

Similar Documents

Publication Publication Date Title
GB2511754B (en) Radiation Detection Device and Method
EP2902807A4 (en) Radiograph detection device
EP2889664A4 (en) Focus detection device and imaging device
HK1207416A1 (en) Micro-hotplate device and sensor comprising such micro-hotplate device
EP2903026A4 (en) Radiation detection element and radiograph detection device
EP2806287A4 (en) Object detection device
EP2902830A4 (en) Focus detection device, and imaging device
EP2916145A4 (en) Radiation detection device and manufacturing method therefor
EP2749873A4 (en) Ct system and detection device for ct system
EP2868255A4 (en) Imaging device and imaging system
EP2998837A4 (en) Pointing device detection sensor and pointing device detection device
GB2508083B (en) Photomultiplier apparatus and radiation detector incorporating such apparatus
EP2860965A4 (en) Imaging element and imaging device
HUE036039T2 (en) Neutron detection unit and neutron detection arrangement
EP2897129A4 (en) Scintillator panel and radiation detection device
EP2876648A4 (en) Scintillator panel and radiation detector
EP2814016A4 (en) Object detection device
EP2979115A4 (en) Radiation detection apparatus
EP2891880A4 (en) Nuclear material detection device and nuclear material detection method
EP2896974A4 (en) Scintillator panel and radiation detector
GB201610591D0 (en) Radiographic device and radiographic system
EP2833406A4 (en) Imaging element and imaging device
EP2882098A4 (en) Amplifier and radiation detector
GB2505616A8 (en) Radiation sensing device and control circuit
EP2876646A4 (en) Scintillator panel and radiation detector

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20150324

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20160408

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 27/144 20060101AFI20160404BHEP

Ipc: H01L 27/146 20060101ALI20160404BHEP

Ipc: G01T 7/00 20060101ALI20160404BHEP

Ipc: G01T 1/24 20060101ALI20160404BHEP

Ipc: G01T 1/20 20060101ALI20160404BHEP

Ipc: H01L 31/09 20060101ALI20160404BHEP

17Q First examination report despatched

Effective date: 20161207

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602013028551

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01L0027144000

Ipc: H01L0027146000

RIC1 Information provided on ipc code assigned before grant

Ipc: G01T 1/24 20060101ALI20170324BHEP

Ipc: H01L 31/09 20060101ALI20170324BHEP

Ipc: H01L 27/144 20060101ALI20170324BHEP

Ipc: H01L 31/08 20060101ALI20170324BHEP

Ipc: H01L 31/0272 20060101ALI20170324BHEP

Ipc: H01L 27/146 20060101AFI20170324BHEP

Ipc: G01T 1/20 20060101ALI20170324BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20170509

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 940658

Country of ref document: AT

Kind code of ref document: T

Effective date: 20171115

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602013028551

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20171025

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 940658

Country of ref document: AT

Kind code of ref document: T

Effective date: 20171025

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180125

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180125

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180225

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20180126

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602013028551

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 6

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20180726

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20180930

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180927

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180927

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180930

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180930

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180930

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20180927

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20171025

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20130927

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20171025

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20200812

Year of fee payment: 8

Ref country code: GB

Payment date: 20200916

Year of fee payment: 8

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20210927

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210927

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210930

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230515

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20230802

Year of fee payment: 11