EP2869394A1 - Hohlraumresonator für Funkfrequenzsignale - Google Patents

Hohlraumresonator für Funkfrequenzsignale Download PDF

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Publication number
EP2869394A1
EP2869394A1 EP20130190700 EP13190700A EP2869394A1 EP 2869394 A1 EP2869394 A1 EP 2869394A1 EP 20130190700 EP20130190700 EP 20130190700 EP 13190700 A EP13190700 A EP 13190700A EP 2869394 A1 EP2869394 A1 EP 2869394A1
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EP
European Patent Office
Prior art keywords
cavity resonator
cavity
axial end
capacitive element
end plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20130190700
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English (en)
French (fr)
Inventor
Dieter Ferling
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Alcatel Lucent SAS
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Alcatel Lucent SAS
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Filing date
Publication date
Application filed by Alcatel Lucent SAS filed Critical Alcatel Lucent SAS
Priority to EP20130190700 priority Critical patent/EP2869394A1/de
Publication of EP2869394A1 publication Critical patent/EP2869394A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/04—Coaxial resonators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
    • H01P1/2136—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using comb or interdigital filters; using cascaded coaxial cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/06—Cavity resonators

Definitions

  • the invention relates to a cavity resonator for radio frequency, RF, signals.
  • Such cavity resonators are for example used in filters for RF signals, especially microwave signals with a frequency of e.g. some GHz.
  • said cavity resonator comprising a basically cylindrical shape with opposing first and second axial end plates, wherein said first axial end plate comprises a first area section and a second area section, wherein said first and second area sections are connected with each other by at least one capacitive element, and wherein a basically cylindrical post comprising an electrically conductive surface is provided in said cavity resonator such that an electrically conductive connection is established between an inner surface of said first area section of said first axial end plate and an inner surface of said second axial end plate.
  • first axial end plate also denoted as “cover plate” or “top cover”
  • cover plate also denoted as “cover plate” or “top cover”
  • a capacitive load imposed on said electrically conductive post can be controlled by providing a corresponding capacity for the at least one capacitive element which provides the electrical (capacitive) connection between the two area sections of the first axial end plate.
  • the at least one capacitive element may comprise a constant capacitance which may e.g. be determined during manufacture of the cavity resonator.
  • said at least one capacitive element comprises a variable, i.e. tunable or controllable, capacitance, which e.g. enables a resonance frequency tuning for said cavity resonator later on, e.g. during operation of the cavity resonator ("dynamic tuning").
  • the metallic post basically extends over the complete inner height of the cavity of said cavity resonator there is no requirement of performing any tuning measures inside the cavity of the cavity resonator. Instead, the tuning may solely be performed by modifying or providing a respective capacitive element which connects the first area section and the second area section of the first axial end plate with each other.
  • At least one capacitive element is arranged inside of said cavity resonator, i.e. resides inside the cavity of the cavity resonator.
  • said capacitive element is protected from environmental influences, and a particularly small configuration is attained.
  • At least one capacitive element can be arranged outside said cavity of said cavity resonator, for example on and outer surface of the first and second area sections of the first axial end plate, whereby a particularly efficient tuning is enabled without the requirement of accessing the cavity of the cavity resonator.
  • At least one capacitive element may be arranged inside the cavity, and at least one capacitive element may be arranged outside of said cavity.
  • At least one capacitive element is a tunable capacitive element, a capacity of which is controllable, wherein said tunable capacitive element preferably comprises at least one of a varactor diode, a micro electro mechanical system capacitor (MEMS-capacitor) or a barium strontium titanate (BST) capacitor.
  • MEMS-capacitor micro electro mechanical system capacitor
  • BST barium strontium titanate
  • the basically cylindrical shape of said cavity resonator comprises a substantially circular cross-section.
  • said post also comprises a substantially circular cross-section.
  • the cavity resonator and/or the post comprised within said cavity of the cavity resonator.
  • the cavity resonator may comprise a basically cylindrical shape with other than circular cross-section, such as e.g. rectangular, polygonal or even arbitrary cross-section. According to further embodiments, this also applies to the side walls and/or the post.
  • said first area section comprises a basically circular shape or a basically rectangular shape. Further shapes are also possible.
  • the first and second area sections of the first axial end plate are electrically separated from each other, i.e. isolated from each other, with the exception of the at least one capacitive element, by means of which the capacitive tuning is enabled.
  • the electrical separation or isolation of the first and second area sections of the first axial end plate may be achieved by providing a gap (e.g., air-filled) therebetween, and/or electrically isolating material.
  • a very small gap may be provided in order to avoid leakage of RF energy from the inside of the cavity to the outside of the cavity.
  • the gap must be made large enough between the first and second area sections to avoid undesired bridging of the gap by e.g. dust particles or the like.
  • a further capacitive element is provided on an outer surface of said first area section of said first axial end plate, wherein said further capacitive element is preferably electrically connected in series to said at least one capacitive element.
  • the further capacity may also be designed to have a constant capacitance, whereas the at least one capacitive element may be configured as a tunable capacity.
  • said cavity resonator is implemented by using a circuit carrier, preferably a printed circuit board, wherein said first axial end plate of said cavity resonator is implemented in a first layer of said printed circuit board, wherein said second axial end plate of said cavity resonator is implemented in a second layer of said printed circuit board, and wherein side wall portions and portions of the post are implemented in a third layer of said printed circuit board, wherein said third layer is arranged between said first and second layers.
  • the first and second layers and/or the second and third layers may be directly adjacent to each other.
  • further layers of the circuit carrier may be provided between said layers.
  • side wall portions and/or portions of the post comprise a plurality of vias (vertical interconnect access; German:
  • said at least one capacitive element is attached to said first layer, preferably directly soldered and/or glued to said first layer, whereby a particularly efficient mounting and a comparatively small form factor is attained.
  • the cavity of the cavity resonator is substantially filled with a fluid, particularly with gas, preferably air.
  • a fluid particularly with gas, preferably air.
  • the present embodiment provides for a basically air-filled cavity of the cavity resonator.
  • the cavity may also be evacuated, at least to some extent, to even further reduce dielectric losses.
  • said first axial end plate comprises and/or is made of a circuit carrier, preferably a printed circuit board (PCB), wherein said first and second area sections are implemented within at least one conductive layer of said printed circuit board.
  • the complete axial end plate(s) of the cavity resonator may e.g. be manufactured by using a printed circuit board wherein electrically conductive structures required for the cavity resonator are implemented in the form of copper layers of the printed circuit board, and/or by using vias, or the like.
  • Such printed circuit board may e.g. be clamped to and/or screwed to and/or soldered to the remaining body of the cavity resonator to the complete cavity resonator.
  • side wall portions of said cavity and/or at least said second axial end plate comprise material with an electrically conductive surface (e.g., any suitable type of substrate with a metallized surface or a plating).
  • said structures may also be made of electrically conductive materials such as e.g. copper.
  • at least the second axial end plate and/or the side walls and/or the post are provided together by a monolithic piece of conductive material such as e.g. copper.
  • Figure 1 schematically depicts a cross-sectional side view of a cavity resonator 100 according to an embodiment.
  • the cavity resonator 100 comprises a basically cylindrical shape with a fist axial end plate 102 and a second axial end plate 104.
  • the basic shape of the cavity resonator 100 comprises a circular geometry. Consequently, the first and second axial end plates 102, 104 also comprise a basically circular shape.
  • the first axial end plate 102 comprises a first area section 1020 and a second area section 1022.
  • the first area section 1020 is arranged at a radial inner position, whereas the second area section 1022 is arranged radially outwards of said first area section 1020.
  • the area sections 1020, 1022 are separated electrically in the area of the end plate 102, i.e. isolated, from each other by a gap G.
  • the only electrically conductive connection in the area of the end plate 102 between said area sections 1020, 1022 is established by at least one capacitive element 110, which is connected to respective portions of the first and second area sections 1020, 1022 in an electrically conductive manner via its terminals 110', 110".
  • the cavity resonator 100 comprises a post 120 which comprises a basically cylindrical shape and an electrically conductive surface.
  • the post 120 is provided in said cavity resonator 100 such that an electrically conductive connection is established between an inner surface 1020a of said first area section 1020 of said first axial end plate 102 and an inner surface 104a of said second axial end 104.
  • This structure enables to define a capacitive load on the cavity resonator 100, which enables the tuning of the resonance frequency of the cavity resonator 100 by means of the capacitive element 110.
  • the capacitive element 110 may comprise a static capacitance value. This value may e.g. be chosen during manufacture or calibration of the cavity resonator 100 to properly set the resonance frequency of the cavity resonator 100.
  • the capacitive element 110 is a tunable capacitive element, a capacitance of which is controllable.
  • the capacitive element 110 may comprise a varactor diode or MEMS capacitors or BST capacitor or the like. Thereby, a dynamic tuning of the electrical capacitance which is connecting the area sections 1020, 1022 is enabled, which may be employed to dynamically tune the resonance frequency of the cavity resonator 100 during an operation of the cavity resonator.
  • resonance frequency drifts, temperature dependencies or the like may be compensated over the whole life time of the cavity resonator 100 without a requirement for mechanical alterations such as tuning screws or even machining of the cavity 1000 and/or the post 120 or the like, as is required by conventional cavity resonators.
  • the cavity resonator 100 comprises a monolithic body defining the axial end plates 102, 104, the side walls 106, and the post 120.
  • said monolithic body may be made of copper or another metal or another material with conductive surface like metalized plastic.
  • the capacitive element 110 may be placed on an outer surface or top surface 1022b, i.e. by gluing and/or soldering or the like.
  • a first terminal 110' of the capacitive element 110 may be soldered to the outer surface 1020b of the area section 1020
  • a second terminal 110" of the capacitive element 110 may be soldered to the outer surface 1022b of the area section 1022.
  • a feeding mechanism for providing RF energy to the cavity resonator 100 is also depicted by Figure 1 .
  • the feeding mechanism comprises an RF guide 204 such as a micro-strip transmission line or the like, with a substrate layer 202 placed on top of it. Coupling of RF energy between the cavity resonator 100 and the transmission line 204 is enabled in a per se known manner by means of an opening in the axial end plate 104, cf. the double arrow (for example magnetic coupling between transmission line 204 and the cavity resonator via a coupling slot in the ground plane).
  • one or more cavity resonators 100 may be connected with signal sources and/or signal sinks (not depicted), e.g. for building an RF filter comprising several cavity resonators.
  • signal sources and/or signal sinks not depicted
  • Other variants (not shown) for coupling RF energy with said cavity are also possible.
  • the opening in the axial end plate 104 is not necessarily required.
  • Figure 2 depicts a further embodiment 100a of the cavity resonator, wherein a further capacitive element is implemented directly on the outer surface 1020b of the first area section 1020.
  • the further capacitive element comprises a dielectric layer 1102 attached to the outer surface 1020b of the first area section 1020 and an electrically conductive layer 1104, which together with the outer surface 1020b or the first area section 1020, respectively, forms said further capacitive element.
  • this further capacitive element is connected electrically in series with the capacitive element 110 thus providing a further degree of freedom regarding capacitive tuning of the cavity resonator 100a.
  • the further capacitive element 1104, 1102, 1020b may be designed to have a constant capacitance, which may e.g. be defined during manufacture of item 100a, and which may e.g. be chosen for coarse tuning the desired resonance frequency of the cavity resonator 100a. Fine tuning of the resonance frequency of the cavity resonator 100a may be performed later on, especially also dynamically (during operation of the cavity resonator 100a), by controlling the capacitance of the capacitive element 110.
  • said capacitive element 110 may comprise at least one varactor diode and/or a MEMS array or the like. Control terminals for controlling the capacitance of the capacitive element 110 are not depicted for the sake of clarity.
  • the gap G ( Fig. 1 ) between the elements 1020, 1022 may also be filled with an electrically isolating material, e.g. for sealing the cavity 1000 to protect it from environmental influences.
  • Figure 3a schematically depicts a top view of a cavity resonator 100a having a shape as e.g. depicted by figure 1 .
  • the main body comprises a circular cross-section, which also applies to the first axial end plate 102.
  • the post 120 comprises a circular cross-section.
  • the first area section 1020 also comprises a circular shape
  • the second area section 1022 comprises a circular ring shape as depicted by figure 3a .
  • the basically circular-shaped gap G is defined between the area sections 1020, 1022 which effects an electric isolation between these elements, as already explained above with reference to Fig. 1 .
  • tuning element 110 connects said elements 1020, 1022 with each other by means of its capacitance.
  • a capacitive tuning of the cavity resonator 100a may be performed.
  • Figure 3b depicts a further embodiment 100b of the cavity resonator.
  • the cavity resonator 100b depicted by figure 3b comprises three capacitive elements 110, 110a, 110b, each of which connects the elements 1020, 1022 with each other.
  • the elements 110, 110a, 110b may also be considered as being connected in parallel to each other, whereby the effective tuning capacitance between elements 1020, 1022 of the arrangement 110, 110a, 110b is defined by the sum of the individual capacitance values of the elements 110, 110a, 110b.
  • the capacitive element 110a may comprise a rather large capacitance tuning range for coarse tuning of the effective capacitance, whereas capacitive element 110b has rather small capacitance range for fine tuning the effective capacitance.
  • each of the three capacitive elements 110, 110a, 110b comprises a varactor diode, three control voltages (not shown) would have to be provided to the arrangement 110, 110a, 110b for tuning.
  • control voltages not shown
  • other combinations of static and controllable capacitance values are also possible.
  • Figure 3c depicts a further embodiment 100c of a cavity resonator, wherein the post 120 comprises circular cylinder geometry.
  • the gap G1 between the area sections 1020, 1022 comprises a basically rectangular shape due to the rectangular shape of the inner section 1020.
  • the area sections 1020, 1022 are electrically conductively connected by each other by means of first capacitive element 110a and second capacitive element 110b.
  • Figure 4 schematically depicts a side view of a circuit carrier arrangement, for example a printed circuit board (PCB), which comprises three layers L1, L2, L3. While the layers L1, L2 are electrically conductive, e.g. copper layers, the intermediate layer L3 between the first and second layers L1, L2 comprises an electrically isolating material, e.g. composite material of the FR4-type or the like.
  • PCB printed circuit board
  • Such printed circuit board may advantageously be used to either form a complete cavity resonator according to an embodiment, cf. figure 5 , or to form a part of a cavity resonator as will be explained below with reference to figures 6 to 7b .
  • Other multi-layer circuit carrier materials instead of PCB and/or FR4-type material may also be used, e.g. multi-layer circuit carriers based on ceramic substrates or the like.
  • Figure 5 schematically depicts a top view of a cavity resonator 100d according to a further embodiment.
  • This cavity resonator 100d is implemented within a printed circuit board, a schematic side view of which is depicted by figure 4 .
  • Electrically conductive side walls (also cf. reference sign 106 of Fig. 1 ) of the cavity resonator 100d according to figure 5 are implemented by a circular arrangement of a plurality of vias 1200.
  • an electrically conductive surface of the post 120 is attained by a circular arrangement of further vias 1202.
  • the area sections 1020, 1022 are implemented in the form of correspondingly shaped electrically conductive elements implemented in a per se known manner within the first conductive layer L1 of the printed circuit board ( figure 5 ).
  • layers L1, L2 of the Fig. 4 PCB may be copper layers as known in the art.
  • the area sections 1020, 1022 according to the embodiments may e.g. be attained by per se known PCB manufacturing steps (e.g., by etching or milling of the copper layers L1, L2), as well as the vias 1200, 1202 (e.g., by drilling and metallizing).
  • a gap G2 of electrically non-conductive material (the gap may comprise portions of e.g. FR-4 material of layer L3 as depicted by Fig. 4 ) resulting between the sections 1020, 1022 is bridged as explained above by at least one capacitive element 110 according to the embodiments.
  • the capacitive element 110 (and/or further capacitive elements which are not depicted by Fig. 5 for clarity) may directly be attached to a surface of the first layer L1, i.e. by glueing and/or by soldering.
  • a variable capacitor may directly be soldered onto the copper surface of the area sections 1020, 1022.
  • Fig. 6 schematically depicts a cross-sectional side view of a further embodiment 100e of a cavity resonator, which is implemented by using a three layer PCB material.
  • the first axial end plate 102 and the second axial end plate 104 of the cavity resonator 100e according to figure 6 are implemented in the form of correspondingly shaped copper layers of a printed circuit board PCB (also figure 4 , copper layers L1, L2).
  • Tuning capacitors 110, 110a are positioned on an outer surface of the first axial end plate 102. According to an embodiment, the tuning capacitors 110, 110a may directly be soldered to said outer surface. More specifically, according to the configuration depicted by Figure 6 , a first terminal of the tuning capacitor 110 is soldered to a surface portion 1020b of the first area section 1020 ( Fig. 1 ), and a second terminal of the tuning capacitor 110 is soldered to a surface portion 1022b of the second area section 1022. In analogy, a first terminal of the further tuning capacitor 110a is soldered to said surface portion 1020b, and a second terminal of the further tuning capacitor 110a is soldered to said surface portion 1022b.
  • the side walls of the cavity resonator 100e may be implemented by a basically circular arrangement of a plurality of vias 1200 as depicted by Fig. 5 , wherein the spacing of adjacent vias 1200 is chosen sufficiently small so as to prevent RF leakage out of the cavity 1000 to a desired degree.
  • the post 120 may be implemented by a basically circular arrangement of a plurality of vias 1202 as depicted by Fig. 5 , wherein the spacing of adjacent vias 1200 is chosen sufficiently small so as to emulate a sufficiently "smooth" radially outer “surface” of the post 120.
  • the post 120 may also be provided in the form of a cylindrical piece of conductive material (or material with an electrically conductive outer surface) which is integrated into a bore hole of the PCB material, or the like.
  • the cavity 1000 of the cavity resonator 100e is filled with the material of the electrically non-conductive third layer L3 ( Fig. 4 ) of the PCB.
  • Figure 7a , 7b schematically depict cross-sectional side views of further embodiments 100f, 100g with capacitive elements inside and outside of the cavity 1000.
  • the cavity resonators 100f, 100g comprise a first axial end plate which comprises a printed circuit board PCB'.
  • the remaining body of the cavity resonators 100f, 100g may e.g. be made of metal such as copper, preferably as a monolithic unit 104, 106, 120.
  • a three layer PCB configuration PCB' which inter alia serves to implement the first axial end plate 102 ( Fig. 1 ) of the cavity resonator 100f.
  • first area section (also cf. reference sign 1020 of Fig. 1 ) is formed by copper element c13
  • the second area section (also cf. reference sign 1022 of Fig. 1 ) is formed by copper elements c11, c12.
  • the first area section is further formed by copper element c23, which is connected in an electrically conductive fashion by means of several vias v32, only one of which is provided with a reference sign for the sake of clarity.
  • further copper elements c21, c22 are provided which are connected in an electrically conductive fashion by means of several vias v31 with the copper elements c11, c12 of the first copper layer L1.
  • copper elements c11, c12 of the first layer L1 and copper elements c21, c22 of the second layer L2 contribute to forming the second area section of the first axial end plate 102 ( Fig. 1 ).
  • copper elements c13, c23 of the first and second layers L1, L2 contribute to forming the first area section of the first axial end plate 102 ( Fig. 1 ).
  • the gaps between the area sections 1020, 1022, or the copper segments c11, c13, c12 and c21, c23, c22, respectively, are "filled” with the insulating layer material of the third layer L3 of the circuit carrier PCB'.
  • the cavity 1000 of the cavity resonator 100f is protected against environmental influences.
  • the capacitive elements 110, 110a are soldered directly onto the copper elements c11, c12, c13.
  • the cavity 1000 may be filled with air or another fluid, which yields reduced losses as compared to the FR-4-filled cavity of the embodiment of Fig. 6 .
  • Figure 7b depicts a further embodiment 100g, where the functionality of the first axial end plate 102 ( Fig. 1 ) is implemented by using a circuit carrier PCB'.
  • the capacitive elements 110, 110a are placed inside the cavity 1000, thus avoiding to lead an RF signal path outside the cavity 1000, which reduces parasitic effects.
  • the capacitive elements 110, 110a may be soldered directly onto the copper elements c21, c22, c23.
  • a further advantage of the embodiment of Fig. 7b is a better electrical performance, e.g. higher cut-off frequency (no via holes are inserted into the signal path which connects the cavity gap).
  • the embodiments 100f, 100g explained above with reference to Figures 7a , 7b may advantageously be manufactured in a three-step approach:
  • One step comprises providing the circuit carrier PCB'
  • a further step comprises providing the remaining body parts 104, 106, 120 (preferably in form of a monolithic metal body) of the resonator
  • a third step is used for attaching the circuit carrier PCB' with the attached capacitive elements 110, 110a to the remaining body parts.
  • the shape of the copper elements c21, c22, c23 may easily be adapted when manufacturing the circuit carrier PCB', so that the circuit carrier PCB' may be used for a wide variety of resonator geometries and sizes.
  • the proposed solution according to the embodiments allows filter tuning by means of electrical components ("adjustable capacitor” 110, 110a, ..), e.g. with tunable MEMS-capacitors, BST capacitors, switched capacitors or varactor diodes.
  • additional bias capacitors may be used for biasing the varactor diodes ( Figure 2 ).
  • all varactor diodes connected to a same bias capacitor e.g. the further capacitor 1102, 1104 of Fig. 2
  • using more than one bias capacitor allows to bias different varactor diodes individually.
  • a combination of varactor diode characteristics (capacity range) and the capacitance value of a used bias capacitor allows to define the tuning range of the resulting capacitor and thereby the tuning frequency range of the cavity resonator 100.
  • appropriate designs for the capacity elements 110, 110a, .. allow to realize tunable cavity resonators (and thus also filters) suitable for coarse tuning over the whole frequency band and for fine tuning within a limited frequency range. This also allows to increase the tuning resolution.
  • two varactor diodes may be mounted on a same bias capacitor and may be biased with the same voltage e.g. for coarse tuning, while a third varactor diode is mounted on a second bias capacitor and biased with a second voltage e.g. for fine tuning.
  • any block diagrams herein represent conceptual views of illustrative circuitry embodying the principles of the invention.
  • any flow charts, flow diagrams, state transition diagrams, pseudo code, and the like represent various processes which may be substantially represented in computer readable medium and so executed by a computer or processor, whether or not such computer or processor is explicitly shown.

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EP20130190700 2013-10-29 2013-10-29 Hohlraumresonator für Funkfrequenzsignale Withdrawn EP2869394A1 (de)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017099296A1 (ko) * 2015-12-11 2017-06-15 주식회사 웨이브텍 주파수 튜너블 공진기

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443244A (en) * 1967-08-23 1969-05-06 Varian Associates Coaxial resonator structure for solid-state negative resistance devices
US4249147A (en) * 1978-10-20 1981-02-03 Tx Rx Systems Inc. Cavity filter and multi-coupler utilizing same
DE19602815A1 (de) * 1995-01-27 1996-08-08 Israel State Mikrowellenbandpaßfiltervorrichtung mit Kreuzkopplung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3443244A (en) * 1967-08-23 1969-05-06 Varian Associates Coaxial resonator structure for solid-state negative resistance devices
US4249147A (en) * 1978-10-20 1981-02-03 Tx Rx Systems Inc. Cavity filter and multi-coupler utilizing same
DE19602815A1 (de) * 1995-01-27 1996-08-08 Israel State Mikrowellenbandpaßfiltervorrichtung mit Kreuzkopplung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017099296A1 (ko) * 2015-12-11 2017-06-15 주식회사 웨이브텍 주파수 튜너블 공진기

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