EP2862425A1 - Method for producing a three-dimensional conductor trace structure and a conductor trace structure produced according to this method - Google Patents

Method for producing a three-dimensional conductor trace structure and a conductor trace structure produced according to this method

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Publication number
EP2862425A1
EP2862425A1 EP13740202.0A EP13740202A EP2862425A1 EP 2862425 A1 EP2862425 A1 EP 2862425A1 EP 13740202 A EP13740202 A EP 13740202A EP 2862425 A1 EP2862425 A1 EP 2862425A1
Authority
EP
European Patent Office
Prior art keywords
coating
conductor track
track structure
carrier material
dimensional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13740202.0A
Other languages
German (de)
French (fr)
Inventor
Roman Ostholt
Wolfgang John
Robin Alexander KRÜGER
Bernd Rösener
Arne Schnoor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LPKF Laser and Electronics AG
Original Assignee
LPKF Laser and Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LPKF Laser and Electronics AG filed Critical LPKF Laser and Electronics AG
Publication of EP2862425A1 publication Critical patent/EP2862425A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1157—Using means for chemical reduction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Definitions

  • a method for producing a three-dimensional interconnect structure and a conductor track structure produced by this method is to produce a three-dimensional interconnect structure and a conductor track structure produced by this method.
  • the invention relates to a method for producing a three-dimensional strip conductor structure on a dielectric carrier material. Furthermore, the invention relates to a conductor track structure produced by this method.
  • the advantages of the MID technology over conventional methods of circuit carrier generation lie in the improved freedom of design and environmental compatibility as well as in a rationalization potential with regard to the manufacturing process of the end product.
  • the improved design freedom and the integration of electrical and mechanical functions in an injection molded part can lead to a miniaturization of the assembly.
  • new functions can be realized and any shapes can be designed.
  • thermoplastic material is doped with a laser-activatable additive.
  • a laser beam activates the additive in the writing process in accordance with the course of the subsequent printed conductor structure and at the same time generates a microrough track.
  • the metal particles of this trace form the seeds for the subsequent metallization.
  • electroless copper bath the printed conductor layers are formed precisely on these tracks.
  • nickel and a gold finish can be applied.
  • metallization causes a significant proportion of the total cost of the manufacturing process.
  • No. 7,087,523 B2 describes the production of a three-dimensional strip conductor structure on a carrier material.
  • gold nanoparticles in the form of droplets are deposited in a printing process as a suspension on a flat surface of the carrier material and exposed to a selective electromagnetic radiation. Due to the thermal energy input, there is a melting of the particles, wherein the liquid is evaporated. Subsequently, the melt solidifies to the desired conductor track structure.
  • the invention has for its object to provide a way to further improve the process and reduce the manufacturing cost.
  • the method should substantially increase the cost-effectiveness in the production of three-dimensional printed conductor structures.
  • the invention has the object to provide a printed conductor structure produced by this method.
  • the first object is achieved by a method according to the features of claim 1.
  • the further embodiment of the invention can be found in the dependent claims.
  • a method is provided in which the carrier material is at least partially provided with at least one planar coating and the coating is exposed only in a partial region of a selective electromagnetic radiation, so that the effective surface of the electromagnetic radiation is smaller than the coating surface, so as to selective radiation exposure by the introduced energy to achieve a United of contained in the coating or generated in situ particles, which form in this way the desired three-dimensional wiring pattern.
  • the essential idea of the invention is therefore based on a full-surface application of the coating, for example as a paint application, and a selective electromagnetic irradiation of the coating.
  • a significant difference of the invention over the prior art is in particular that the application of the coating over the entire surface can be made on almost arbitrarily contoured, three-dimensional surfaces, while the action on the thus created three-dimensional surface coating only selectively, so limited to certain area proportions ,
  • the coating preferably contains as a substantial proportion of material metal oxides which are present in the coating or generated during the irradiation or which have organometallic compounds as a substantial proportion of material, the selective energy is introduced into the coating by the selective electromagnetic radiation to the chemical Trigger locally reaction between the reaction partners contained in the coating or incurred or released.
  • metal oxides in particular nanoscale copper oxides are applied with a suitable coating of a reducing agent as a coating on the substrate and selectively so limited to the surface portion of the produced conductor track structure exposed to electromagnetic radiation, so that the metal oxide is reduced to elemental metal.
  • a suitable coating of a reducing agent as a coating on the substrate and selectively so limited to the surface portion of the produced conductor track structure exposed to electromagnetic radiation, so that the metal oxide is reduced to elemental metal.
  • the area of action of the electromagnetic radiation corresponds to the coating of the printed conductor to be produced.
  • the coating thus fulfills the dual function of reducing agent on the one hand and as a protective layer on the other to avoid spontaneous sintering of the active particles.
  • Another, also particularly promising embodiment of the invention is also achieved by an electrostatic charge of the metal oxides or their coating.
  • a positive or negative charge which is partially canceled by the action of the electromagnetic radiation, induces the sintering of the particles by removing the repulsive forces.
  • supplementary constituents of the coating lead to steric hindrance and thus to a considerable delay in the reactions. By these components are changed by selective energy supply by means of electromagnetic radiation, there is an application of steric hindrance and thus to the desired sintering of the metallic particles.
  • such particles are contained in the coating, which particles have an extent of less than 1 ⁇ m in at least one direction. As a result, the sintering process is significantly favored.
  • the use of a laser as electromagnetic radiation source proves to be particularly practical which, due to its optimum suitability for three-dimensional writing processing and its problem-free control of the power, in conjunction with controllability of the energy input, is particularly suitable for targeted energy input.
  • the application of the coating can be realized by means of known contourless processes, wherein the coating process preferably takes place in the liquid phase.
  • the coating can also be applied as a powder.
  • a particularly useful embodiment of the method for the three-dimensional coating is realized by surface application methods such as spraying, pad printing or dipping.
  • a one or more repetition of the cycle comprising the application of the coating and the selective electromagnetic irradiation for reinforcing the conductive layer can be advantageously realized in order to increase the strength of the conductor track structure.
  • the conductor track structure is amplified without external current or galvanic, so as to be able to set desired conductor track strengths and to achieve a targeted layer structure.
  • an intermediate layer in particular a primer layer
  • the scope can be extended to almost any surface and also the adhesive strength can be significantly improved.
  • adhesion-promoting components can be added to the coating from the outset. In particular, therefore, an adhesion promoter can be contained in the coating.
  • non-irradiated areas of the coating are removed by means of an aqueous or organic solvent and the non-irradiated material portions of the coating are dissolved, so that they can be reused for the production of further coatings. This improves the economy of the process.
  • the second-mentioned object to provide a three-dimensional interconnect structure produced by the method, is preferably realized by an antenna, a sensor or an electromagnetic shield, wherein the contours of the interconnect structure can be optimally adapted to the carrier material embodied, for example, as a molded part.
  • carrier material Although a variety of materials are suitable as a carrier material, in particular in conjunction with a primer layer, carrier materials having a substantial proportion of polymers, glasses and ceramics have proven to be particularly practical.
  • 1 a to 1 d show a sequence of the method steps in carrying out the method.
  • FIGS. 1 a to 1 d The method according to the invention for producing a printed conductor structure 4 on a dielectric carrier material 1 is described below with reference to FIGS. 1 a to 1 d, not a three-dimensional, but a flat carrier material 1 being shown for the sake of clarity, differing from the preferred application in FIG.
  • the carrier material 1 is first provided with a two-dimensional coating 2.
  • the coating 2 contains particles which contain metal oxides as a substantial proportion of material.
  • metal oxides for example, nanoscale copper oxides which are partially or completely coated with reducing agents are suitable for this purpose.
  • a spray method not shown here is used for applying the coating 2, for example, a spray method not shown here is used.
  • the coating 2 is selectively exposed to electromagnetic radiation from a laser 3.
  • the conductor track structure 4 correspondingly forms the radiation input of the laser 3.
  • Coating 2 removed by means of an aqueous or organic solvent is suitable for a large number of typical applications, the conductor track structure 4 can be amplified, for example, without external current or galvanically. Of course, the cycle with the application of the coating 2 and the selective irradiation can also be repeated.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)

Abstract

The invention relates to a method for producing a conductor trace structure (4) on a dielectric carrier material (1). The carrier material (1) is first furnished with a flat coating (2). Nanoscale particles containing a substantial material content of metal oxides such as copper oxides, which are coated with a suitable reduction agent, are contained in the coating (2). Then, the coating (2) is exposed selectively to an electromagnetic radiation from a laser (3). Due to selective action of radiation, this results in a sintering of particles contained in or generated in situ in the coating (2), producing the conductive trace structure (4).

Description

Verfahren zur Herstellung einer dreidimensionalen Leiterbahnstruktur sowie eine nach diesem Verfahren hergestellte Leiterbahnstruktur  A method for producing a three-dimensional interconnect structure and a conductor track structure produced by this method
Die Erfindung betrifft ein Verfahren zur Herstellung einer dreidimensionalen Leiterbahnstruktur auf einem dielektrischen Trägermaterial. Weiterhin betrifft die Erfindung eine nach diesem Verfahren hergestellte Leiterbahnstruktur. The invention relates to a method for producing a three-dimensional strip conductor structure on a dielectric carrier material. Furthermore, the invention relates to a conductor track structure produced by this method.
Ein solches Verfahren wird in der Praxis bei der Herstellung räumlicher, beispielsweise spritzgegossener Schaltungsträger bereits vielfach eingesetzt und zählt somit durch offenkundige Vorbenutzung zum Stand der Technik. Derart hergestellte Formteile mit integrierter Leiterbahnstruktur werden als "Molded Interconnect Devices" (MID) bezeichnet. Such a method is already widely used in practice in the production of spatial, for example injection-molded circuit carrier and thus counts by public prior use of the prior art. Molded parts with integrated interconnect structure produced in this way are referred to as "Molded Interconnect Devices" (MID).
Die Vorteile der MID-Technik gegenüber klassischen Methoden der Schaltungsträgererzeugung liegen sowohl in der verbesserten Gestaltungsfreiheit und Umweltverträglichkeit als auch in einem Rationalisierungspotenzial bezüglich des Herstellungsprozesses des Endprodukts. Die verbesserte Gestaltungsfreiheit und die Integration von elektrischen und mechanischen Funktionen in ein Spritzgussteil können zu einer Miniaturisierung der Baugruppe führen. Außerdem können neue Funktionen realisiert und beliebige Formen gestaltet werden. The advantages of the MID technology over conventional methods of circuit carrier generation lie in the improved freedom of design and environmental compatibility as well as in a rationalization potential with regard to the manufacturing process of the end product. The improved design freedom and the integration of electrical and mechanical functions in an injection molded part can lead to a miniaturization of the assembly. In addition, new functions can be realized and any shapes can be designed.
Bei dem bekannten Verfahren zur Laser-Direkt-Strukturierung (LDS) wird ein thermoplastischer Kunststoff mit einem laseraktivierbaren Additiv dotiert. Ein Laserstrahl aktiviert im schreibenden Verfahren entsprechend dem Verlauf der späteren Leiterbahnstruktur das Additiv und erzeugt zugleich eine mikroraue Spur. Die Metallpartikel dieser Spur bilden die Keime für die nachfolgende Metallisierung. In einem stromlosen Kupferbad entstehen genau auf diesen Spuren die Leiterbahnschichten. Nacheinander lassen sich so Schichten aus Kupfer, Nickel und ein Goldfinish aufbringen. In der Praxis verursacht die Metallisierung einen erheblichen Anteil der Gesamtkosten des Herstellungsverfahrens. Die US 7,087,523 B2 beschreibt die Herstellung einer dreidimensionalen Leiterbahnstruktur auf einem Trägermaterial. Mittels eines Generators werden in einem Druckverfahren Goldnanopartikel in Form von Tröpfchen als Suspension auf einer ebenen Oberfläche des Trägermaterials abgeschieden und einer selektiven elektromagnetischen Strahlung ausgesetzt. Aufgrund des thermischen Energieeintrages kommt es zu einem Aufschmelzen der Partikel, wobei die Flüssigkeit verdampft wird. Anschließend erstarrt die Schmelze zu der gewünschten Leiterbahnstruktur. In the known method for laser direct structuring (LDS), a thermoplastic material is doped with a laser-activatable additive. A laser beam activates the additive in the writing process in accordance with the course of the subsequent printed conductor structure and at the same time generates a microrough track. The metal particles of this trace form the seeds for the subsequent metallization. In an electroless copper bath, the printed conductor layers are formed precisely on these tracks. One after the other layers of copper, nickel and a gold finish can be applied. In practice, metallization causes a significant proportion of the total cost of the manufacturing process. No. 7,087,523 B2 describes the production of a three-dimensional strip conductor structure on a carrier material. By means of a generator, gold nanoparticles in the form of droplets are deposited in a printing process as a suspension on a flat surface of the carrier material and exposed to a selective electromagnetic radiation. Due to the thermal energy input, there is a melting of the particles, wherein the liquid is evaporated. Subsequently, the melt solidifies to the desired conductor track structure.
Ein ähnliches Verfahren ist aus der US 7,820,097 B2 bekannt, bei dem ein flaches Substrat, beispielsweise Papier oder Folie, mit einem Material enthaltend zumindest ein Metall, beispielsweise Kupfer, beschichtet wird, wobei das Material im Siebdruck-, Inkjet-, Druckoder Laserdruckverfahren auf das Substrat aufgebracht wird. Das Verfahren dient dabei dem Materialauftrag in Form hoch aufgelöster Muster. Die Materialstärke beträgt in mindestens einer Dimension weniger als 1 Mikrometer. Durch die vollflächige Bestrahlung des gesamten Materials mittels einer Blitz-Lampe während einer Dauer zwischen einer Mikrosekunde und hundert Millisekunden wird das Material auf dem Substrat reduziert und versintert. A similar process is known from US Pat. No. 7,820,097 B2, in which a flat substrate, for example paper or foil, is coated with a material containing at least one metal, for example copper, wherein the material is applied by screen printing, inkjet, printing or laser printing Substrate is applied. The process serves the material application in the form of high-resolution patterns. The material thickness is less than 1 micrometer in at least one dimension. The full-surface irradiation of the entire material by means of a flash lamp for a period between one microsecond and one hundred milliseconds reduces and sinters the material on the substrate.
Ferner ist es aus der US 2009/0181 184 A1 bekannt, zur Herstellung einer elektrisch leitfähigen Schicht einen Film als Beschichtung und zusätzlich ein Reduziermittel als Flüssigkeit aufzutragen. Indem das Substrat einer elektromagnetischen Strahlung ausgesetzt wird, wird der Film elektrisch leitfähig. Furthermore, it is known from US 2009/0181 184 A1, for the production of an electrically conductive layer, to apply a film as a coating and additionally a reducing agent as a liquid. By exposing the substrate to electromagnetic radiation, the film becomes electrically conductive.
Der Erfindung liegt die Aufgabe zugrunde, eine Möglichkeit zu schaffen, das Verfahren weiter zu verbessern und den Herstellungsaufwand zu reduzieren. Insbesondere soll durch das Verfahren die Wirtschaftlichkeit bei der Herstellung dreidimensionaler Leiterbahnstrukturen wesentlich erhöht werden. Weiterhin liegt der Erfindung die Aufgabe zugrunde, eine nach diesem Verfahren hergestellte Leiterbahnstruktur zu schaffen. The invention has for its object to provide a way to further improve the process and reduce the manufacturing cost. In particular, the method should substantially increase the cost-effectiveness in the production of three-dimensional printed conductor structures. Furthermore, the invention has the object to provide a printed conductor structure produced by this method.
Die erstgenannte Aufgabe wird erfindungsgemäß mit einem Verfahren gemäß den Merkmalen des Anspruchs 1 gelöst. Die weitere Ausgestaltung der Erfindung ist den Unteransprüchen zu entnehmen. The first object is achieved by a method according to the features of claim 1. The further embodiment of the invention can be found in the dependent claims.
Erfindungsgemäß ist also ein Verfahren vorgesehen, bei dem das Trägermaterial zumindest abschnittsweise mit zumindest einer flächigen Beschichtung versehen wird und die Beschichtung lediglich in einem Teilbereich einer selektiven elektromagnetischen Strahlung ausgesetzt wird, sodass die Wirkfläche der elektromagnetischen Strahlung kleiner als die Beschichtungsfläche ist, um so aufgrund der selektiven Strahlungseinwirkung durch die eingebrachte Energie ein Vereintem von in der Beschichtung enthaltenen oder in situ erzeugten Partikeln zu erreichen, welche auf diese Weise die gewünschte dreidimensionale Leiterbahnstruktur bilden. According to the invention, therefore, a method is provided in which the carrier material is at least partially provided with at least one planar coating and the coating is exposed only in a partial region of a selective electromagnetic radiation, so that the effective surface of the electromagnetic radiation is smaller than the coating surface, so as to selective radiation exposure by the introduced energy to achieve a United of contained in the coating or generated in situ particles, which form in this way the desired three-dimensional wiring pattern.
Der wesentliche Gedanke der Erfindung geht demnach aus von einem vollflächigen Auftrag der Beschichtung, beispielsweise als Lackauftrag, und einer selektiven elektromagnetischen Bestrahlung der Beschichtung. Ein wesentlicher Unterschied der Erfindung gegenüber dem Stand der Technik besteht insbesondere auch darin, dass der Auftrag der Beschichtung vollflächig auf nahezu beliebig konturierte, dreidimensionale Oberflächen erfolgen kann, während die Einwirkung auf die so geschaffene flächige dreidimensionale Beschichtung lediglich selektiv, also beschränkt auf bestimmte Flächenanteile erfolgt. The essential idea of the invention is therefore based on a full-surface application of the coating, for example as a paint application, and a selective electromagnetic irradiation of the coating. A significant difference of the invention over the prior art is in particular that the application of the coating over the entire surface can be made on almost arbitrarily contoured, three-dimensional surfaces, while the action on the thus created three-dimensional surface coating only selectively, so limited to certain area proportions ,
Indem die Beschichtung vorzugsweise als einen wesentlichen Materialanteil Metalloxide enthält, die in der Beschichtung vorhanden sind oder während der Bestrahlung erzeugt werden oder die als einen wesentlichen Materialanteil metallorganische Verbindungen aufweisen, wird durch die selektive elektromagnetische Strahlung die erforderliche Energie in die Beschichtung eingebracht, um die chemische Reaktion zwischen den in der Beschichtung enthaltenen oder entstandenen bzw. freigesetzten Reaktionspartnern lokal begrenzt auszulösen. By the coating preferably contains as a substantial proportion of material metal oxides which are present in the coating or generated during the irradiation or which have organometallic compounds as a substantial proportion of material, the selective energy is introduced into the coating by the selective electromagnetic radiation to the chemical Trigger locally reaction between the reaction partners contained in the coating or incurred or released.
Beispielsweise werden dabei Metalloxide, insbesondere nanoskalige Kupferoxide mit einer geeigneten Ummantelung eines Reduktionsmittels als Beschichtung auf das Trägermaterial aufgebracht und selektiv also auf den Flächenanteil der herzustellenden Leiterbahnstruktur beschränkt, der elektromagnetischen Strahlung ausgesetzt, sodass das Metalloxid zu elementarem Metall reduziert wird. Dadurch entspricht die Einwirkungsfläche der elektromagnetischen Strahlung auf die Beschichtung der herzustellenden Leiterbahn. For example, while metal oxides, in particular nanoscale copper oxides are applied with a suitable coating of a reducing agent as a coating on the substrate and selectively so limited to the surface portion of the produced conductor track structure exposed to electromagnetic radiation, so that the metal oxide is reduced to elemental metal. As a result, the area of action of the electromagnetic radiation corresponds to the coating of the printed conductor to be produced.
Die Beschichtung erfüllt damit die Doppelfunktion als Reduktionsmittel einerseits und als Schutzschicht zur Vermeidung einer spontanen Versinterung der aktiven Teilchen andererseits. The coating thus fulfills the dual function of reducing agent on the one hand and as a protective layer on the other to avoid spontaneous sintering of the active particles.
Eine andere, ebenfalls besonders Erfolg versprechende Ausgestaltung der Erfindung wird auch durch eine elektrostatische Ladung der Metalloxide bzw. deren Beschichtung erreicht. Eine positive oder negative Ladung, welche durch die Einwirkung der elektromagnetischen Strahlung partiell aufgehoben wird, induziert durch Aufhebung der abstoßenden Kräfte die Versinterung der Partikel. Bei einer anderen, ebenfalls besonders Erfolg versprechenden Abwandlung der vorliegenden Erfindung führen ergänzende Bestandteile der Beschichtung zu einer sterischen Hinderung und damit zu einer erheblichen Verzögerung der Reaktionen. Indem durch selektive Energiezufuhr mittels der elektromagnetischen Strahlung diese Bestandteile verändert werden, kommt es zu einer Aufgebung der sterischen Hinderung und damit zu der gewünschten Versinterung der metallischen Partikel. Another, also particularly promising embodiment of the invention is also achieved by an electrostatic charge of the metal oxides or their coating. A positive or negative charge, which is partially canceled by the action of the electromagnetic radiation, induces the sintering of the particles by removing the repulsive forces. In another, also particularly promising modification of the present invention, supplementary constituents of the coating lead to steric hindrance and thus to a considerable delay in the reactions. By these components are changed by selective energy supply by means of electromagnetic radiation, there is an application of steric hindrance and thus to the desired sintering of the metallic particles.
Bei einer anderen, ebenfalls besonders vorteilhaften Abwandlung des erfindungsgemäßen Verfahrens sind in der Beschichtung solche Partikel enthalten, die zumindest in einer Richtung eine Erstreckung von weniger als 1 μηη aufweisen. Hierdurch wird der Sinterprozess wesentlich begünstigt. In another, likewise particularly advantageous modification of the method according to the invention, such particles are contained in the coating, which particles have an extent of less than 1 μm in at least one direction. As a result, the sintering process is significantly favored.
Als besonders praxisnah erweist sich dabei der Einsatz eines Lasers als elektromagnetische Strahlungsquelle, welcher sich aufgrund seiner optimalen Eignung für eine dreidimensionale schreibende Bearbeitung und seine problemlose Regelung der Leistung in Verbindung mit einer Steuerbarkeit des Energieeintrags für den gezielten Energieeintrag besonders eignet.  In this case, the use of a laser as electromagnetic radiation source proves to be particularly practical which, due to its optimum suitability for three-dimensional writing processing and its problem-free control of the power, in conjunction with controllability of the energy input, is particularly suitable for targeted energy input.
Der Auftrag der Beschichtung kann mittels an sich bekannter konturloser Verfahren realisiert werden, wobei der Beschichtungsprozess vorzugsweise in flüssiger Phase erfolgt. Alternativ kann die Beschichtung auch als Pulver aufgetragen werden. Eine besonders sinnvolle Ausgestaltung des Verfahrens für die dreidimensionale Beschichtung wird durch flächige Auftragsverfahren wie Sprühen, Tampondruck oder Tauchen realisiert. The application of the coating can be realized by means of known contourless processes, wherein the coating process preferably takes place in the liquid phase. Alternatively, the coating can also be applied as a powder. A particularly useful embodiment of the method for the three-dimensional coating is realized by surface application methods such as spraying, pad printing or dipping.
Darüber hinaus ist auch eine ein- oder mehrmalige Wiederholung des Zyklus umfassend das Aufbringen der Beschichtung und der selektiven elektromagnetischen Bestrahlung zur Verstärkung der leitfähigen Schicht vorteilhaft realisierbar, um die Stärke der Leiterbahnstruktur zu erhöhen. In addition, a one or more repetition of the cycle comprising the application of the coating and the selective electromagnetic irradiation for reinforcing the conductive layer can be advantageously realized in order to increase the strength of the conductor track structure.
Bei einer anderen besonders vorteilhaften Ausführungsform der Erfindung wird die Leiterbahnstruktur außenstromlos oder galvanisch nach verstärkt, um so gewünschte Leiterbahnstärken einstellen zu können und einen gezielten Schichtaufbau zu erreichen. In another particularly advantageous embodiment of the invention, the conductor track structure is amplified without external current or galvanic, so as to be able to set desired conductor track strengths and to achieve a targeted layer structure.
Wenn gemäß einer weiteren vorteilhaften Ausgestaltung des Verfahrens vor dem Aufbringen der Beschichtung eine Zwischenschicht, insbesondere eine Haftvermittlerschicht, auf das Trägermaterial aufgetragen wird, kann der Anwendungsbereich auf nahezu beliebige Oberflächen erweitert und zudem die Haftfestigkeit wesentlich verbessert werden. Alternativ können haftvermittelnde Komponenten der Beschichtung von vornherein zugesetzt werden. Insbesondere kann also in der Beschichtung ein Haftvermittler enthalten sein. If according to a further advantageous embodiment of the method before the application of the coating, an intermediate layer, in particular a primer layer, is applied to the carrier material, the scope can be extended to almost any surface and also the adhesive strength can be significantly improved. Alternatively, adhesion-promoting components can be added to the coating from the outset. In particular, therefore, an adhesion promoter can be contained in the coating.
Besonders sinnvoll ist es zudem, wenn die nicht bestrahlten Bereiche der Beschichtung mittels eines wässrigen oder organischen Lösungsmittels entfernt und die nicht bestrahlten Materialanteile der Beschichtung gelöst werden, sodass diese zur Herstellung weiterer Beschichtungen wiederverwendet werden können. Hierdurch wird die Wirtschaftlichkeit des Verfahrens verbessert. It is also particularly useful if the non-irradiated areas of the coating are removed by means of an aqueous or organic solvent and the non-irradiated material portions of the coating are dissolved, so that they can be reused for the production of further coatings. This improves the economy of the process.
Die zweitgenannte Aufgabe, eine nach dem Verfahren hergestellte dreidimensionale Leiterbahnstruktur zu schaffen, wird vorzugsweise durch eine Antenne, einen Sensor oder eine elektromagnetische Abschirmung realisiert, wobei die Konturen der Leiterbahnstruktur dem beispielsweise als Formteil ausgeführten Trägermaterial optimal angepasst werden können. The second-mentioned object, to provide a three-dimensional interconnect structure produced by the method, is preferably realized by an antenna, a sensor or an electromagnetic shield, wherein the contours of the interconnect structure can be optimally adapted to the carrier material embodied, for example, as a molded part.
Obwohl sich als Trägermaterial insbesondere in Verbindung mit einer Haftvermittlerschicht eine Vielzahl von Materialien eignen, haben sich bereits Trägermaterialien mit einem wesentlichen Materialanteil aus Polymeren, Gläsern und Keramik als besonders praxisnah erwiesen. Although a variety of materials are suitable as a carrier material, in particular in conjunction with a primer layer, carrier materials having a substantial proportion of polymers, glasses and ceramics have proven to be particularly practical.
Die Erfindung lässt verschiedene Ausführungsformen zu. Zur weiteren Verdeutlichung ihres Grundprinzips ist eine davon in der Zeichnung dargestellt und wird nachfolgend beschrieben. Diese zeigt in The invention allows for various embodiments. To further clarify its basic principle, one of them is shown in the drawing and will be described below. This shows in
Fig. 1 a bis 1 d eine Abfolge der Verfahrensschritte bei der Durchführung des Verfahrens. 1 a to 1 d show a sequence of the method steps in carrying out the method.
Nachfolgend wird anhand der Figuren 1 a bis 1 d das erfindungsgemäße Verfahren zur Herstellung einer Leiterbahnstruktur 4 auf einem dielektrischen Trägermaterial 1 dargestellt, wobei zur besseren Übersichtlichkeit abweichend von dem bevorzugten Einsatzzweck in der Figur 1 a kein dreidimensionales, sondern ein flaches Trägermaterial 1 dargestellt ist. The method according to the invention for producing a printed conductor structure 4 on a dielectric carrier material 1 is described below with reference to FIGS. 1 a to 1 d, not a three-dimensional, but a flat carrier material 1 being shown for the sake of clarity, differing from the preferred application in FIG.
Wie in Figur 1 b zu erkennen ist, wird das Trägermaterial 1 zunächst mit einer flächigen Beschichtung 2 versehen. In der Beschichtung 2 sind Partikel enthalten, die als einen wesentlichen Materialanteil Metalloxide enthalten. Beispielsweise eignen sich hierzu nanoskalige Kupferoxide, die mit Reduktionsmitteln partiell oder vollständig umhüllt sind. Zum Auftragen der Beschichtung 2 wird beispielsweise ein hier nicht näher dargestelltes Sprühverfahren eingesetzt. In dem in Figur 1 c dargestellten nächsten Schritt wird die Beschichtung 2 selektiv einer elektromagnetischen Strahlung eines Lasers 3 ausgesetzt - Dadurch kommt es aufgrund der selektiven Strahlungseinwirkung zu einem Versintern von in der Beschichtung 2 enthaltenen oder in situ erzeugten Partikeln, wobei sich die Leiterbahnstruktur 4 entsprechend dem Strahlungseintrag des Lasers 3 ausbildet. As can be seen in FIG. 1 b, the carrier material 1 is first provided with a two-dimensional coating 2. The coating 2 contains particles which contain metal oxides as a substantial proportion of material. For example, nanoscale copper oxides which are partially or completely coated with reducing agents are suitable for this purpose. For applying the coating 2, for example, a spray method not shown here is used. In the next step shown in FIG. 1 c, the coating 2 is selectively exposed to electromagnetic radiation from a laser 3. As a result of the selective action of radiation, sintering of particles contained in the coating 2 or generated in situ occurs, with the conductor track structure 4 correspondingly forms the radiation input of the laser 3.
Schließlich werden, wie in Figur 1 d ersichtlich, die nicht bestrahlten Bereiche der Finally, as can be seen in FIG. 1d, the unirradiated areas of the
Beschichtung 2 mittels eines wässrigen oder organischen Lösungsmittels entfernt. Obwohl die so geschaffene Leiterbahnstruktur 4 für eine Vielzahl typischer Einsatzzwecke geeignet ist, kann die Leiterbahnstruktur 4 beispielsweise außenstromlos oder galvanisch verstärkt werden. Selbstverständlich kann der Zyklus mit dem Aufbringen der Beschichtung 2 und der selektiven Bestrahlung ebenfalls wiederholt werden. Coating 2 removed by means of an aqueous or organic solvent. Although the thus created conductor track structure 4 is suitable for a large number of typical applications, the conductor track structure 4 can be amplified, for example, without external current or galvanically. Of course, the cycle with the application of the coating 2 and the selective irradiation can also be repeated.

Claims

PAT E NTAN S P RÜC H E PAT E NTAN SP RETURN
1 . Verfahren zur Herstellung einer dreidimensionalen Leiterbahnstruktur (4) auf einem dielektrischen Trägermaterial (1 ), dadurch gekennzeichnet, dass das Trägermaterial (1 ) zumindest abschnittsweise mit einer flächigen Beschichtung (2) versehen wird und dass die Beschichtung (2) in einem Teilbereich einer selektiven elektromagnetischen Strahlung ausgesetzt wird, sodass es aufgrund der selektiven Strahlungseinwirkung zu einem 1 . Method for producing a three-dimensional interconnect structure (4) on a dielectric support material (1), characterized in that the support material (1) is at least partially provided with a flat coating (2) and in that the coating (2) in a partial region of a selective electromagnetic Radiation is exposed so that it due to the selective action of radiation to a
Versintern von in der Beschichtung (2) enthaltenen oder in situ erzeugten Partikeln kommt und so die dreidimensionale Leiterbahnstruktur (4) hergestellt wird. Sintering of particles contained in the coating (2) or generated in situ occurs and thus the three-dimensional conductor track structure (4) is produced.
2. Verfahren nach Anspruch 1 , dadurch gekennzeichnet, dass die in der Beschichtung (2) enthaltenen Partikel 2. The method according to claim 1, characterized in that in the coating (2) contained particles
• als einen wesentlichen Materialanteil Metalloxide enthalten, die nach oder während der Bestrahlung reduziert werden,  Contain as a substantial proportion of material metal oxides which are reduced after or during the irradiation,
• als einen wesentlichen Materialanteil aus metallorganischen Verbindungen bestehen, • consist of a material content of organometallic compounds,
• Bestandteile enthalten, die elektrisch oder elektrostatisch aufgeladen sind und/oder• contain components that are electrically or electrostatically charged and / or
• Bestandteile enthalten, die sterisch gehindert sind. • contain ingredients that are sterically hindered.
3. Verfahren nach zumindest einem der vorhergehenden Ansprüche, dadurch 3. The method according to at least one of the preceding claims, characterized
gekennzeichnet, dass die Partikel zumindest in einer Richtung eine Erstreckung von weniger als 1 μηη aufweisen. characterized in that the particles have an extension of less than 1 μηη at least in one direction.
4. Verfahren nach zumindest einem der vorhergehenden Ansprüche, dadurch 4. The method according to at least one of the preceding claims, characterized
gekennzeichnet, dass die Beschichtung (2) der elektromagnetischen Strahlung eines Lasers (3) ausgesetzt wird. in that the coating (2) is exposed to the electromagnetic radiation of a laser (3).
5. Verfahren nach zumindest einem der vorhergehenden Ansprüche, dadurch 5. The method according to at least one of the preceding claims, characterized
gekennzeichnet, dass die Beschichtung (2) durch Sprühen, Drucken oder Tauchen auf das Trägermaterial (1 ) aufgebracht wird. in that the coating (2) is applied to the carrier material (1) by spraying, printing or dipping.
6. Verfahren nach zumindest einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Leiterbahnstruktur (4) außenstromlos und/oder galvanisch nach verstärkt wird. 6. The method according to at least one of the preceding claims, characterized in that the conductor track structure (4) without external power and / or galvanically amplified.
7. Verfahren nach zumindest einem der vorhergehenden Ansprüche, dadurch 7. The method according to at least one of the preceding claims, characterized
gekennzeichnet, dass vor dem Aufbringen der Beschichtung (2) eine Zwischenschicht, insbesondere eine Haftvermittlerschicht, auf das Trägermaterial (1 ) aufgetragen wird. in that, prior to the application of the coating (2), an intermediate layer, in particular an adhesion promoter layer, is applied to the carrier material (1).
8. Verfahren nach zumindest einem der vorhergehenden Ansprüche, dadurch 8. The method according to at least one of the preceding claims, characterized
gekennzeichnet, dass die nicht bestrahlten Bereiche der Beschichtung (2) insbesondere mittels eines wässrigen oder organischen Lösungsmittels entfernt werden. in that the non-irradiated areas of the coating (2) are removed in particular by means of an aqueous or organic solvent.
9. Verfahren nach Anspruch 8, dadurch gekennzeichnet, dass die nicht bestrahlten Materialanteile der Beschichtung (2) gelöst und wiederverwendet werden. 9. The method according to claim 8, characterized in that the non-irradiated material portions of the coating (2) are dissolved and reused.
10. Verfahren nach zumindest einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Trägermaterial (1 ) ein Reduktionsmittel als einen Materialbestandteil und/oder mindestens eine Beschichtung mit einem Reduktionsmittel aufweist. 10. The method according to at least one of the preceding claims, characterized in that the carrier material (1) comprises a reducing agent as a material component and / or at least one coating with a reducing agent.
1 1 . Leiterbahnstruktur (4) hergestellt nach zumindest einem der vorangegangenen 1 1. Printed conductor structure (4) produced according to at least one of the preceding
Ansprüche. Claims.
12. Leiterbahnstruktur (4) nach Anspruch 1 1 , dadurch gekennzeichnet, dass diese eine Leiterbahnstruktur (4) auf einem dielektrischen Trägermaterial (1 ) Teil eines Molded 12, conductor track structure (4) according to claim 1 1, characterized in that this is a conductor track structure (4) on a dielectric carrier material (1) part of a Molded
Interconnect Device (MID) ist. Interconnect Device (MID) is.
13. Leiterbahnstruktur (4) nach Anspruch 1 1 , dadurch gekennzeichnet, dass diese eine Leiterbahnstruktur (4) einer Antenne, eines Sensors oder einer elektromagnetischen 13, conductor track structure (4) according to claim 1 1, characterized in that this is a conductor track structure (4) of an antenna, a sensor or an electromagnetic
Abschirmung ist. Shielding is.
EP13740202.0A 2012-06-19 2013-06-13 Method for producing a three-dimensional conductor trace structure and a conductor trace structure produced according to this method Withdrawn EP2862425A1 (en)

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