EP2853982A3 - Adaptive thermoelektrische Kühlung in einem Prozessor - Google Patents

Adaptive thermoelektrische Kühlung in einem Prozessor Download PDF

Info

Publication number
EP2853982A3
EP2853982A3 EP14186431.4A EP14186431A EP2853982A3 EP 2853982 A3 EP2853982 A3 EP 2853982A3 EP 14186431 A EP14186431 A EP 14186431A EP 2853982 A3 EP2853982 A3 EP 2853982A3
Authority
EP
European Patent Office
Prior art keywords
processor
adaptive
thermoelectric cooling
tec
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP14186431.4A
Other languages
English (en)
French (fr)
Other versions
EP2853982A2 (de
Inventor
Rahul Khanna
Thanunathan Rangarajan
Richard Thomaiyar
Minh Le
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of EP2853982A2 publication Critical patent/EP2853982A2/de
Publication of EP2853982A3 publication Critical patent/EP2853982A3/de
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/324—Power saving characterised by the action undertaken by lowering clock frequency
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/3287—Power saving characterised by the action undertaken by switching off individual functional units in the computer system
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/3296—Power saving characterised by the action undertaken by lowering the supply or operating voltage
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Computing Systems (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Power Sources (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Cooling System (AREA)
EP14186431.4A 2013-09-25 2014-09-25 Adaptive thermoelektrische Kühlung in einem Prozessor Ceased EP2853982A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/036,655 US9297559B2 (en) 2013-09-25 2013-09-25 Adaptive thermoelectric cooling in a processor

Publications (2)

Publication Number Publication Date
EP2853982A2 EP2853982A2 (de) 2015-04-01
EP2853982A3 true EP2853982A3 (de) 2015-07-15

Family

ID=51627200

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14186431.4A Ceased EP2853982A3 (de) 2013-09-25 2014-09-25 Adaptive thermoelektrische Kühlung in einem Prozessor

Country Status (2)

Country Link
US (1) US9297559B2 (de)
EP (1) EP2853982A3 (de)

Families Citing this family (24)

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US9292010B2 (en) * 2012-11-05 2016-03-22 Rockwell Automation Technologies, Inc. Online integration of model-based optimization and model-less control
US20140328018A1 (en) * 2013-05-03 2014-11-06 Nvidia Corporation Fanless notebook computer structure providing enhanced graphics performance and form factor
US9842428B2 (en) * 2014-06-27 2017-12-12 Samsung Electronics Co., Ltd. Dynamically optimized deferred rendering pipeline
US20160161998A1 (en) * 2014-12-05 2016-06-09 Corsair Memory, Inc. Actively Cooled Liquid Cooling System
US9870037B2 (en) * 2015-04-01 2018-01-16 Dell Products, L.P. Method and apparatus for collaborative power and thermal control of fan run time average power limiting
US9639128B2 (en) 2015-08-04 2017-05-02 Qualcomm Incorporated System and method for thermoelectric memory temperature control
CN106681453A (zh) * 2016-11-24 2017-05-17 电子科技大学 一种高性能多核微处理器的动态热管理方法
DE102017007198A1 (de) * 2017-08-02 2019-02-07 smartbee GbR (vertretungsberechtigte Gesellschafter: Wind plus Sonne GmbH, 48599 Gronau; Smart Material Printing b.v., Enschede, NL; NewLine Soft GmbH, 48599 Gronau; mb Beteiligungen Unternehmergesellschaft (haftungsbeschränkt), 48683 Ahaus) Kontaminationsfei kühlbare, umschlossene, bei Betrieb Wärme abgebende, elektrische und/oder elektronische Bauteile und Geräte
CN107701483A (zh) * 2017-11-17 2018-02-16 英业达科技有限公司 温度控制装置及其方法
CN109032324B (zh) * 2018-07-03 2021-01-26 北京百度网讯科技有限公司 数据中心功率管控方法、装置、设备及计算机可读介质
US11169583B2 (en) * 2018-08-07 2021-11-09 Western Digital Technologies, Inc. Methods and apparatus for mitigating temperature increases in a solid state device (SSD)
TWI686691B (zh) * 2018-08-16 2020-03-01 緯穎科技服務股份有限公司 電子裝置及被動元件
US11137809B2 (en) 2018-12-20 2021-10-05 Advanced Micro Devices, Inc. Runtime localized cooling of high-performance processors
DE102019102505B4 (de) * 2019-01-31 2021-09-30 R. Stahl Schaltgeräte GmbH Explosionsgeschützte Vorrichtung mit zünddurchschlag-sicherem Gasströmungspfad und Kühlkörper
EP3703476B1 (de) * 2019-02-28 2022-07-20 Ovh Kühlanordnung mit primären und sekundären kühlvorrichtungen zum kühlen einer elektronischen vorrichtung
US20210191770A1 (en) * 2019-12-18 2021-06-24 Advanced Micro Devices, Inc. Preemptively cooling of processing unit compute elements
CN113031672A (zh) * 2019-12-25 2021-06-25 中兴通讯股份有限公司 温度控制方法、系统及存储介质
US20210278887A1 (en) 2020-03-05 2021-09-09 Samsung Electronics Co., Ltd. Thermal control for electronic devices
US11510346B2 (en) * 2020-08-24 2022-11-22 Baidu Usa Llc Method and system for enhancing electronics cooling using a thermoelectric element
US11848641B2 (en) * 2021-01-13 2023-12-19 Baidu Usa Llc Temperature based self-regulated cooling enhancement
KR20220116632A (ko) * 2021-02-15 2022-08-23 삼성전자주식회사 스토리지 장치의 구동 방법 및 이를 수행하는 스토리지 장치
US11930625B2 (en) * 2021-03-26 2024-03-12 Baidu Usa Llc Thermal management system and method for power optimization for cooling an electronic rack
CN114020071B (zh) * 2021-11-10 2022-10-18 经纬恒润(天津)研究开发有限公司 恒温系统及恒温控制方法
US20240028100A1 (en) * 2022-07-20 2024-01-25 University Of Malta Method and system for power optimization for system of thermoelectric cooling devices

Citations (3)

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Publication number Priority date Publication date Assignee Title
US20050078451A1 (en) * 2003-10-10 2005-04-14 Ioan Sauciuc Computer system having controlled cooling
US20100117579A1 (en) * 2003-08-15 2010-05-13 Michael Culbert Methods and apparatuses for operating a data processing system
US20120312030A1 (en) * 2011-06-07 2012-12-13 B/E Aerospace, Inc. Thermoelectric Cooling System for a Food and Beverage Compartment

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US7725238B2 (en) * 2004-11-19 2010-05-25 Perkins Michael T System and method for smart system control for flowing fluid conditioners
US7460932B2 (en) * 2005-11-29 2008-12-02 International Business Machines Corporation Support of deep power savings mode and partial good in a thermal management system
US7817423B2 (en) * 2006-03-06 2010-10-19 Graham Andrew Morehead Peltier-assisted liquid-cooled computer enclosure
US7865751B2 (en) * 2007-06-18 2011-01-04 Intel Corporation Microarchitecture controller for thin-film thermoelectric cooling
US7800315B2 (en) * 2007-09-21 2010-09-21 Exclara, Inc. System and method for regulation of solid state lighting
US8027798B2 (en) * 2007-11-08 2011-09-27 International Business Machines Corporation Digital thermal sensor test implementation without using main core voltage supply
US8966657B2 (en) * 2009-12-31 2015-02-24 Intel Corporation Provisioning, upgrading, and/or changing of hardware
KR102165542B1 (ko) * 2010-04-16 2020-10-14 플렉스 라이팅 투 엘엘씨 필름 기반 라이트가이드를 포함하는 프론트 조명 디바이스
US8838935B2 (en) * 2010-09-24 2014-09-16 Intel Corporation Apparatus, method, and system for implementing micro page tables
US8892924B2 (en) * 2011-05-31 2014-11-18 Intel Corporation Reducing power consumption of uncore circuitry of a processor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100117579A1 (en) * 2003-08-15 2010-05-13 Michael Culbert Methods and apparatuses for operating a data processing system
US20050078451A1 (en) * 2003-10-10 2005-04-14 Ioan Sauciuc Computer system having controlled cooling
US20120312030A1 (en) * 2011-06-07 2012-12-13 B/E Aerospace, Inc. Thermoelectric Cooling System for a Food and Beverage Compartment

Also Published As

Publication number Publication date
EP2853982A2 (de) 2015-04-01
US20150082811A1 (en) 2015-03-26
US9297559B2 (en) 2016-03-29

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