EP2839210A1 - Dispositif de dissipation de chaleur et dispositif d'éclairage avec le dispositif de dissipation de chaleur - Google Patents

Dispositif de dissipation de chaleur et dispositif d'éclairage avec le dispositif de dissipation de chaleur

Info

Publication number
EP2839210A1
EP2839210A1 EP13716315.0A EP13716315A EP2839210A1 EP 2839210 A1 EP2839210 A1 EP 2839210A1 EP 13716315 A EP13716315 A EP 13716315A EP 2839210 A1 EP2839210 A1 EP 2839210A1
Authority
EP
European Patent Office
Prior art keywords
cup
heat sink
heat dissipating
dissipating device
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13716315.0A
Other languages
German (de)
English (en)
Other versions
EP2839210B1 (fr
Inventor
MingTao WANG
Guoan HE
Libo Wu
Jin Hu
Dirk Buchhauser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ledvance GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2839210A1 publication Critical patent/EP2839210A1/fr
Application granted granted Critical
Publication of EP2839210B1 publication Critical patent/EP2839210B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals

Definitions

  • the present invention relates to a heat dissipating device and an illuminating device with the heat dissipating device.
  • the heat dissipating device can be made from materials having different thermal conductivities. For instance, a bulb for accommodating a light engine and a driver can be made from a thermal conductive plastic, and metal fins are inserted into inside of the bulb for heat dis ⁇ sipation.
  • a heat dissipating device has a cup body for accommodating a light engine, and a bottom surface of the cup body or the whole cup body is made of a metal. On an opposite side of the cup body, an accommodating cavity made from a thermal conductive plastic and extending from a bottom surface thereof is formed, for accommodating a driver that should be in electrical insulation from a light engine.
  • one object of the present invention lies in pro ⁇ viding a heat dissipating device for illuminating device.
  • the heat dissipating device has a simple structure, good heat dissipating performance and at least partially has electri- cally insulating property.
  • the heat dissipating device for illuminating device in accordance with the present invention comprises a first heat sink, characterized in that the first heat sink comprises a first cup and a second cup superposing on each other, wherein the first heat sink is made from a first thermal conductive mate ⁇ rial, the heat dissipating device further comprises a second heat sink made from an insulative second thermal conductive material, the first cup and the second cup are partially cov ⁇ ered by the second heat sink, respectively, and the first thermal conductive material has a higher thermal conductivity than the second thermal conductive material.
  • the concept of the present invention lies in manufacturing the heat dissipating device utilizing materials having a high thermal conductivity, as much as is possible, as main body, while assuring electrical insulation with part of electronic components provided in the heat dissipating device or elec ⁇ tronic components provided near to the heat dissipating de ⁇ vice in the illuminating device, so as to realize good heat dissipating effect.
  • the heat dissipating device in accordance with the present invention is made from first and second thermal conductive materials, wherein the first thermal conductive material has a better thermal conductivity than the second thermal conductive material, while the second thermal conductive material has characteristics of electrical insulation.
  • the first thermal conductive material is provided with a big area in the heat dissipating device to form the main part of the heat dissipating device, i.e. main heat dissipating component.
  • the first cup and the second cup are partially covered by the second heat sink according to the present invention, that is, the second heat sink that has the electrical insulating ef- feet and can conduct heat partially envelops the first heat sink.
  • the heat dissipating device manufactured in such a man ⁇ ner also can be called "hybrid heat-sink".
  • the first cup and the second cup superpose on each other such that the first heat sink having a cross section with an H-shaped profile is formed.
  • the first cup and the second cup abut against each other through respective end surfaces thereof so as to form the first heat sink, moreover, open ends of the first and second cups face opposite direc- tions to form, for instance, an upper open end and a low open end of the first heat sink.
  • the first heat sink formed in such a manner can accommodate two components to dissipate heat in the first and the second cups, respectively, so as to dissipate heat therefrom.
  • the second heat sink has a body, and the first cup and the second cup are at least partially covered by the body, respectively.
  • the body for instance, can cover inner circumferential walls and/or outer circumferential walls and/or inner surfaces of respective bases of the first cup and the second cup, so as to form a profile matching the shape of the first heat sink and to be in good thermal con ⁇ tact with the first heat sink.
  • the outer circumferential walls of the first cup and the second cup are covered by the body.
  • the in- sulating second heat sink only covers the outer circumferential walls of the first heat sink, and the second heat sink is not on the inner circumferential walls of the first heat sink, i.e. the inner circumferential walls of the first and second cups, and the inner surfaces of the bases facing re- spective open ends.
  • components to dissipate heat accommodated in the first and second cups can be in direct, quick and highly effective thermal contact with the first heat sink.
  • the heat dissipating device can be, through the second heat sink, in electrically- insulating thermal contact with neighboring components arranged in the illuminating device.
  • the inner circumferential walls and the outer circumferential walls of the first cup and the second cup are imbedded into the body.
  • the second heat sink covers the inner surface of the base of the first cup.
  • the second heat sink does not cover the inner surface of the base of the second cup.
  • the electrically insulating second heat sink preferably can cover the inner surface of the base of the first cup in a form of extra layer, and the inner surface faces the open end of the first cup.
  • Such multiplex insulation configuration allows the first cup to be completely imbedded into the second heat sink, and electrical insulation between the first cup and electronic component accommodated therein can be assured with the second heat sink. Therefore, there is no need to provide an additional electrically insulating housing for such electronic component.
  • the inner surface of the base of the second cup faces the open end of the second cup, and com ⁇ ponents to dissipate heat and requiring no electrically insu- lating protection can be preferably directly mounted on and is in thermal contact with this inner surface, and also can be arranged in the second cup in other manners.
  • the first cup and the second cup are made of a metal. Since metal has a higher thermal conductivity than rubber, plastic or other materials, aluminum, copper and other metals having good thermal conductivity can be chosen herein to manufacture the first cup and the second cup.
  • the first cup and the second cup are made in one piece.
  • the first cup and the second cup are of a metal material, they can be made in one piece to be- come the first heat sink utilizing various suitable proc ⁇ esses, which simplifies the manufacturing process and reduces the cost.
  • the superposing regions of the since the superposing regions of the ,
  • first and second cups i.e. bases of the first and second cups, are also made in one piece, the thermal conductive ef ⁇ fect between the first cup and the second cup is enhanced.
  • the first cup and the second cup are made through a stamping process, respectively.
  • the first cup and the second cup have similar profiles, large-scale production of such cups can be realized through the stamping process.
  • the first cup and the second cup are joined by means of thermal conductive glue, by means of which the bases of the first cup and the second cup closely abut against each other as much as is possible and can be in fixed connection. Therefore, the thermal conducting effect between the first cup and the second cup also can be improved.
  • the second heat sink further comprises a plurality of fins formed on an outer circumferential wall of the body.
  • Heat dissipating area of the heat dissipating device can be increased by forming extra fins, for instance, heat trans ⁇ ferred to the second heat sink radiates to surrounding envi ⁇ ronment in a heat radiation mode.
  • the plurality of fins and the body are made in one piece.
  • the fins and the second heat sink can be directly made in one piece, the manufacturing process is simplified.
  • the fins are configured as insert-type fins or other parts having suitable structures for arrangement on the outer circumferential wall of the body.
  • the first heat sink and the second heat sink are made together through an injection molding process, by means of which the second heat sink can be sprayed on the first heat sink and is enabled to have a profile matching the first heat sink.
  • the second heat sink is made from a thermal conduc- tive plastic.
  • the second heat sink can have dual properties of thermal conduction and insulation.
  • the present invention further relates to an illuminating device comprising a driver, a light engine, and the heat dissipating device above.
  • the driver is arranged in the first cup and the light engine is arranged in the second cup.
  • the driver and the light engine are accommodated by the first and the second cups so as to save the structure space inside the il- luminating device.
  • the heat dissipating device also can advantageously transmit outwardly heat generated by the driver and the light engine.
  • the first cup and the driver can be in electrically-insulating thermal contact so as to dissipate heat while meeting requirements of elec ⁇ trics security.
  • Fig. 1 is a 3D exploded diagram of a first embodiment of a heat dissipating device in accordance with the present inven ⁇ tion;
  • Fig. 2 is a cross-section diagram of a second embodiment of a heat dissipating device in accordance with the present inven ⁇ tion
  • Fig. 3 is a cross-section diagram of a third embodiment of a heat dissipating device in accordance with the present inven ⁇ tion
  • Fig. 4 is a cross-section diagram of a fourth embodiment of a heat dissipating device in accordance with the present inven- tion.
  • Fig. 1 shows a first embodiment of a heat dissipating device 100 in accordance with the present invention.
  • the heat dissi- pating device 100 for an illuminating device (not shown) comprises a first heat sink 1 and a second heat sink 4.
  • the first heat sink 1 and the second heat sink 4 are made from two materials having different thermal conductivities, respectively.
  • the first heat sink 1 having good thermal conductivity is config ⁇ ured as a first cup 2 and a second cup 3 that are arranged opposite to each other, wherein open ends of the two cups face opposite directions for accommodating the components to dissipate heat, respectively; and another material having a slightly low thermal conductivity, preferably having electri ⁇ cally insulating characteristic, is used to manufacture the second heat sink 4.
  • the first cup 2 and the second cup 3 herein are particularly partially covered by the second heat sink 4 such that the first heat sink 1 having a high thermal conductivity is assembled at a big area with the electrically insulating second heat sink 4 for use, thereby the heat dis ⁇ sipating device 100 has an ideal heat dissipating effect and the first heat sink 1 can be assured to electrically insulate from components to dissipate heat mounted therein or compo- nents surrounding the heat dissipating device 100 in the il ⁇ luminating device.
  • the first cup 2 and the second cup are identical in the present embodiment.
  • the first cup 2 and the second cup 3 are configured as two independent parts and directly closely abut against each other through respective bases thereof.
  • the first cup 2 and the second cup 3 are made from a metal having a high thermal con ⁇ ductivity, and the metal is, for instance, aluminum, copper or other suitable metal materials. Based on properties of metal material, the first cup 2 and the second cup 3 can be manufactured through a stamping process in production for improving the productive efficiency and reducing the manufac ⁇ turing cost.
  • a thermal conductive plastic is preferably chosen as a thermal conductive material having electrically insulting performance to manufacture the second heat sink 4.
  • a plurality of additional fins 10 are formed on an outer circumferential wall of the body 5 for increasing the thermal contact area between the heat dissipating device 100 and the external environment.
  • the fins 10 can be advantageously formed on the body 5 in one piece .
  • the fins 10 and the body 5 are formed independently, and mechanical linking structures such as slot and connecting piece are formed on the fins 10 or the body 5 to assemble the fins 10 and the body 5 together.
  • the first cup 2 and the second cup 3 can be advantageously in fixed thermal-conductive con ⁇ nection through bases thereof utilizing, for instance, thermal conductive glue.
  • Fig. 2 is a cross-section diagram of a second embodiment of a heat dissipating device in accordance with the present inven ⁇ tion.
  • the first cup 2 and the sec ⁇ ond cup 3 are made into an H-shaped first heat sink 1 in an integral manner, and the first heat sink 1 is covered by the body 5 of the second heat sink 4 through an insert-injection process or a similar process.
  • a hybrid heat dis ⁇ sipating device structure characterized by "outer plastic and inner metal" as shown in the cross-section diagram is accomplished.
  • the second heat sink 4 made from a thermal conduc ⁇ tive plastic herein is an outer housing of the heat dissipat ⁇ ing device 100, and then the heat dissipating device 100 can electrically insulate from other components arranged sur ⁇ rounding or near to the heat dissipating device 100 in the illuminating device.
  • Fig. 3 is a cross-section diagram of a third embodiment of a heat dissipating device 100 in accordance with the present invention.
  • the third embodiment is different from the embodi ⁇ ment shown in Fig. 2 in that circumferential walls of the first cup 2 and the second 3 are completely imbedded into the body 5 made from a thermal conductive plastic, i.e. the ther- mal conductive plastic completely covers the inner circumfer ⁇ ential walls 6 and the outer circumferential walls 7 of the first heat sink 1.
  • an electrically-insulating thermal contact can be assured between the inner circumferential walls 6 of the first cup 2 and the second cup 3 and part of components to dissipate heat accommodated therein, and bases of the first cup 2 and the second cup 3 are in direct thermal contact with another part of the components to dissi ⁇ pate heat.
  • the heat dissipating device 100 hav ⁇ ing such structure can be in safe and highly-effective perti- nent thermal contact with respective components to dissipate heat .
  • Fig. 4 is a cross-section diagram of a fourth embodiment of a heat dissipating device in accordance with the present inven ⁇ tion.
  • the fourth embodiment is different from the embodiment shown in Fig. 3 in that apart from the inner circumferential walls 6 and the outer circumferential walls 7 of the first heat sink 1 being completely imbedded into the body 5, a bot ⁇ tom surface of the base of the first cup 2, i.e. an inner surface 8 facing the open end, is also imbedded into the body 5, and an inner surface 9 of the base of the second cup 3 is not covered by the body 5.
  • the electrically insulating first cup 2 is particularly suitable to accommodate components such as driver or the like, and therefore, there is no need to provide an additional prior insulating housing for the driver accommodated therein.

Abstract

La présente invention porte sur un dispositif de dissipation de chaleur (100) pour un dispositif d'éclairage, lequel dispositif de dissipation de chaleur comprend un premier dissipateur de chaleur (1), et est caractérisé en ce que le premier dissipateur de chaleur (1) comprend une première coupelle (2) et une seconde coupelle (3) superposées l'une à l'autre, le premier dissipateur de chaleur (1) étant réalisé à partir d'un premier matériau thermiquement conducteur, le dispositif de dissipation de chaleur (100) comprenant de plus un second dissipateur de chaleur (4) réalisé à partir d'un second matériau thermiquement conducteur isolant, la première coupelle (2) et la seconde coupelle (3) étant partiellement recouvertes par le second dissipateur de chaleur (4), respectivement, et le premier matériau thermiquement conducteur ayant une conductivité thermique supérieure à celle du second matériau thermiquement conducteur. La présente invention porte également sur un dispositif d'éclairage avec un tel dispositif de dissipation de chaleur (100).
EP13716315.0A 2012-04-17 2013-04-17 Dispositif de dissipation de chaleur et dispositif d'éclairage avec le dispositif de dissipation de chaleur Active EP2839210B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201210113354.8A CN103375786B (zh) 2012-04-17 2012-04-17 散热装置和具有该散热装置的照明装置
PCT/EP2013/057971 WO2013156511A1 (fr) 2012-04-17 2013-04-17 Dispositif de dissipation de chaleur et dispositif d'éclairage avec le dispositif de dissipation de chaleur

Publications (2)

Publication Number Publication Date
EP2839210A1 true EP2839210A1 (fr) 2015-02-25
EP2839210B1 EP2839210B1 (fr) 2017-03-15

Family

ID=48095883

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13716315.0A Active EP2839210B1 (fr) 2012-04-17 2013-04-17 Dispositif de dissipation de chaleur et dispositif d'éclairage avec le dispositif de dissipation de chaleur

Country Status (3)

Country Link
EP (1) EP2839210B1 (fr)
CN (1) CN103375786B (fr)
WO (1) WO2013156511A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104235748B (zh) * 2013-06-19 2018-08-31 欧司朗有限公司 灯壳及其制造方法和包括该灯壳的照明装置
KR20200000479A (ko) * 2015-03-20 2020-01-02 사빅 글로벌 테크놀러지스 비.브이. 조명기구용 플라스틱 히트싱크
CA3155752A1 (fr) 2021-04-23 2022-10-23 Eaton Intelligent Power Limited Appareil d'eclairage composite

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM338326U (en) * 2008-03-19 2008-08-11 Unity Opto Technology Co Ltd Adjustable type lamp
CN201265843Y (zh) * 2008-09-25 2009-07-01 沈锦祥 一种led灯具灯杯及使用这种灯杯的led灯具
US8829771B2 (en) * 2009-11-09 2014-09-09 Lg Innotek Co., Ltd. Lighting device
US8525395B2 (en) * 2010-02-05 2013-09-03 Litetronics International, Inc. Multi-component LED lamp

Also Published As

Publication number Publication date
EP2839210B1 (fr) 2017-03-15
CN103375786A (zh) 2013-10-30
WO2013156511A1 (fr) 2013-10-24
CN103375786B (zh) 2019-11-12

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