EP2836763B1 - Module de led comportant un film protecteur - Google Patents

Module de led comportant un film protecteur Download PDF

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Publication number
EP2836763B1
EP2836763B1 EP13715698.0A EP13715698A EP2836763B1 EP 2836763 B1 EP2836763 B1 EP 2836763B1 EP 13715698 A EP13715698 A EP 13715698A EP 2836763 B1 EP2836763 B1 EP 2836763B1
Authority
EP
European Patent Office
Prior art keywords
led module
film
screw
recess
passage opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP13715698.0A
Other languages
German (de)
English (en)
Other versions
EP2836763A1 (fr
Inventor
Tobias Frost
Peter Sachsenweger
Ralph Bertram
Gerhard Holzapfel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2836763A1 publication Critical patent/EP2836763A1/fr
Application granted granted Critical
Publication of EP2836763B1 publication Critical patent/EP2836763B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/02Wall, ceiling, or floor bases; Fixing pendants or arms to the bases
    • F21V21/03Ceiling bases, e.g. ceiling roses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • the invention is based on an LED module according to the preamble of patent claim 1.
  • LED modules with a protective film for protection against contamination are known. Furthermore, these LED modules can have passage openings for mounting the LED module to a mounting element by means of screws. If the film is not to be screwed during assembly, so the film must be removed before mounting, whereby the LED module, however, is no longer protected against dirt during assembly. From the US 2011/157891 A1 It is known to provide LED modules with a film having openings for mounting screws. Especially on construction sites, the risk of contamination is increased, such as by drilling or other construction site work resulting dust. Above all, LED modules with silicone encapsulation are very susceptible to dust and other impurities. In addition, in general, for example in an overhead mounting of an LED module by means of screwing, the problem that is increased by the risk of falling out of the screws, the assembly cost of such an LED module.
  • the object of the present invention is to provide an LED module that allows easier assembly and is sufficiently protected from contamination.
  • the LED module according to the invention comprises at least one passage opening from a first side of the LED module to a first side opposite mounting side of the LED module, wherein the through hole is formed such that a screw for fixing the LED module to a mounting member of the first side to the mounting side of the LED module is inserted into the passage opening. Furthermore, the LED module has a film which is at least partially adhered to the first side of the LED module. The film has at least one structure which comprises at least one separation of the film in the region of the at least one passage opening of the LED module.
  • the transection of the film in the region of the passage opening an insertion of a screw in the passage opening for mounting the LED module is made possible without having to remove the film during assembly.
  • the LED module is advantageously protected during installation against contamination.
  • a transection may in particular represent a slot-shaped interruption of the film, which in the normal state, ie, especially with mechanically tension-free, flat orientation of the film, no visible opening results.
  • the structure is designed in such a way that a force which is greater than the weight of the inserted screw is required to remove a screw which penetrates the foil and is at least partially inserted into the through-hole of the LED module from the through-opening.
  • the diameter of the recess can continue to be formed so that a diameter of a screw head of an inserted into the through hole screw is smaller than the diameter of the recess and larger than the diameter of the through hole.
  • the recess provides a variety of advantageous embodiments, such as that the film during Screwing the screw is not mitschraschraubt while covering the recess through the film.
  • the film is arranged on the first side of the LED module such that it at least partially covers an opening of the recess when the screw is not inserted. This covering of the opening of the recess ensures that no dirt can get into the recess and into the passage opening of the LED module.
  • the film is deformable at least in the region of the depression such that a screw with a screw head can be inserted and screwed into the recess and into the passage opening in the depression.
  • the LED module can be protected in the region of the depression by covering it by the film, in particular before assembly, but at the same time the film can also be left on the LED module during assembly, as it is characterized by its elastic or deformable properties does not interfere with the insertion of a screw.
  • the LED module can also be protected against contamination during assembly, in particular in the region of the depression, or in the region of the passage opening for the screw.
  • the film is mitverschraubt to compensate, for example, geometric irregularities or to dampen vibrations or even, with appropriate design of the film to hold the screw in addition.
  • the structure of the film may include a closed opening in the form of a recess. Furthermore, the structure of the film may include a plurality of partitions, which are arranged crossing at a point. In addition, the structure of the film may include a recess and a plurality of partitions, wherein the partitions are arranged on a boundary line of the recess. Furthermore, the structure of the film may have a plurality of partitions, which are formed as a perforation.
  • the film may be arranged on the first side of the LED module such that it at least partially covers an opening of the recess in the case of a screw inserted into the passage opening.
  • the falling out of the screw can be prevented by the at least partially covering the opening of the recess by the film.
  • this can be accomplished by deforming the structure during insertion of the screw by appropriate deformable formation of the film in the region of the depression and returns after insertion of the screw back to its original position, and in particular the opening of the recess at least partially covered again.
  • the structure of the film may be formed such that the film at least partially contacted a screw inserted into the through hole at its screw head.
  • the film may be formed such that it deforms when inserting a screw in the recess so that a force is exerted on the screw head by the deformation of the side of the screw head film, and in particular by means of the film causes a clamping of the screw head is so that the unscrewed screw is held in the through hole.
  • the foil can have an adhesive layer in at least one area which is arranged non-contacting on the first side of the LED module. This can serve as a trap for contaminants, such as dust or lint, which are absorbed by the adhesive layer and be held. By this embodiment, the prevention of contamination of the LED module can be further optimized.
  • Fig. 1 shows a schematic representation of an LED module 10 with a film 13 according to an embodiment of the invention.
  • it can also be an LED module with one or more organic LEDs.
  • the film 13 may be glued to a first side 11 of the LED module 10.
  • the film 13 may also be provided with a sheet-like adhesive layer, which is also disposed in areas where it is not needed for attachment to the housing, but as a trap for contaminants, such as dust or lint, is used, which is absorbed and held by the adhesive layer become.
  • This adhesive layer does not have to be continuous, but can also be applied partially or structured.
  • ESD electrostatic discharge
  • LED modules 10 it may be advantageous if the adhesion, both of the film 13 on the LED module 10 as well as contamination on the film 13, based on electrostatic adhesion. Furthermore, it may be advantageous for LED modules 10 to print the film 13 with important information, such as handling instructions.
  • handling instructions can, for example
  • ESD-sensitive LED modules there are 10 instructions for handling the modules, since it is not usual for installers or electricians to be instructed in the handling of ESD-sensitive components and, for example, at a construction site, an ESD-compliant environment is difficult or impossible is feasible.
  • An example of a further handling rule would be the indication that the LED module may not be touched in the area of the LEDs or that pressure may be exerted on the LEDs.
  • the film 13 can protrude beyond the first side 11 of the LED module 10, for example in the form of a pull tab 19.
  • the pull tab 19 can be arranged in the region of a plug for the power supply of the LED module 10 and in particular cover this.
  • the in Fig. 1 illustrated LED module 10 exemplarily two through holes 15 which extend from the first side 11 of the LED module 10 to the opposite mounting side 12 to the LED module 10 with screws 16 which can be inserted and screwed into these through holes 15, to attach to a mounting element.
  • the film 13 has a structure 14.
  • the film 13 with an adhesive layer as a trap for contaminants and by structures 14 in the region of the through openings 15, which cover these in part, on the one hand an excellent protection against contamination before, during and after assembly of the LED Module 10 can be accomplished and enormously simplified by the structures 14 of the film 13 assembly and the assembly time can be significantly shortened. Furthermore, a variety of options are available to form these structures 14 in order to provide the best possible adhesion of the screw 16 and at the same time maximum protection against contamination.
  • Fig. 2 shows a schematic representation of an LED module 10 with a film 13 and held by the structure 14 of the film 13 screw 16 according to an embodiment of the invention.
  • the structure 14 is designed so that a star structure of the cuts is used, which has a circle, in particular a circular recess, superimposed. Through the circular recess, the screw 16 in the Through hole are introduced and held by clamping the screw neck with the recess of the structure 14. Thus, the screw 16, even with overhead mounting, no longer fall out of the through hole 15, which facilitates the assembly considerably.
  • Fig. 3 shows a schematic representation of an LED module 10 with a film 13, the structure 14, a recess 18 partially covered, and held within the recess 18 through the structure 14 of the film 13 screw 16 according to an embodiment of the invention.
  • the structure 14 is formed with star-shaped partitions of the film 13 and a central circular recess.
  • a screw 16 can be inserted into the through hole 15 of the LED module 10, even if the circular recess is smaller in diameter than the Screw head 17.
  • the LED module 10 is configured such that it has a recess 18 in which the passage opening 15 is arranged.
  • the diameter of the recess 18 is dimensioned so that the screw head 17 can be inserted into this recess 18. Due to the fact that the structure 14 of the film 13 at least partially covers this depression 18, the screw 16 can also be held in the passage opening 15 without being tightened. Thus, the screw 16 can be completely inserted by a fitter so that the structured region of the film 13 closes again after insertion, thereby reliably preventing the screw 16 from falling out. Due to the deformable training the film 13 and in that the structure 14 of the film 13 closes again, contamination of the LED module 10, even in the region of the recess 18 can be effectively prevented. Another advantage of the recess 18 is that when screwing the screw 16 is no film 13 between the screw head 17 and the LED module 10, whereby the strength of the screw is permanently secured.
  • Fig. 4 shows a schematic representation of an LED module 10 and a film 13 with a structure 14 which holds by deformation a screw 16 in a recess 18 of the LED module 10, according to an embodiment of the invention.
  • the structure 14 is designed so that it does not close again when the screw 16 is completely inserted into the recess 18, but this is clamped by the structure 14 and held therewith.
  • a combination of these training variants of the structure 14 is conceivable, so that for example a part of the star-shaped structure 14 is made longer than another part of the structure 14, so that the structure 14 partially closes over the screw 16 and partially the screw 16 holds by clamping.
  • Fig. 5a shows an embodiment of the structure 14 as a star with only three rays.
  • the cuts through the film 13 are radially symmetrical about a boundary line of a arranged circular recess.
  • the schematically drawn screw head 17 can be slightly larger than the circular punching.
  • the circular punching is ideally just as large as the thread of the screw 16 to allow, for example, an optimal clamping of the screw neck through the recess, as in Fig. 2 shown.
  • a smaller or larger thread diameter may be very advantageous in embodiments according to FIGS. 3 and 4.
  • the structure 14 can also be called a star with four rays, as in Fig. 5b represented, or even more, executed.
  • the structure 14 can also be designed as star-shaped partitions without circular punching in the middle, as in Fig. 3c is shown schematically.
  • This variant is particularly suitable when the distance of the film 13 to the base of the recess 18 is sufficiently large, in particular when the diameter of the recess 18 is smaller than the depth of the recess 18, so that jamming of the film 13 between screw 16 and LED module 10 can be avoided when screwing.
  • This embodiment variant is therefore also particularly advantageous since no punching waste occurs which could remain on the LED module 10 in the event of a punching operation that is not performed reliably. Thus it can be avoided that this waste can come to places where it is undesirable, such as between the base of the recess 18 of the LED module 10 and the screw head 17th
  • Fig. 5d shows a variant in which the structure 14 comprises a closed cut, in particular a circular punched.
  • the structure 14 comprises a closed cut, in particular a circular punched.
  • a screw 16 can hereby be held by the punching eccentric to the through hole 15 into which the screw 16 is inserted, is mounted. If the screw 16 is inserted, it partially snaps under the film 13 and is held by the film 13 until it is fastened, in particular until it is screwed tight.
  • other forms of recess are possible, for example, triangular, as in Fig. 5e represented, or also generally n-angular.
  • Such shapes of the recess are also possible as Mittenausstanzung with severing of the film 13 at the boundary lines of the punched, in analogy to Fig. 5a and 5b ,
  • Fig. 5f shows a further embodiment possibility of the structure 14 of the film 13, again with a closed separation of the film 13 in the form of a recess.
  • the star structure is not formed as a line structure, but as a star-shaped punching.
  • the structure 14 of the film 13 may also be formed by triangular-shaped film parts.
  • Fig. 5g shows a particularly preferred embodiment of the structure 14 of the film 13.
  • the structure 14 comprises several rectilinear separations of the film 13, which intersect at a point, and beyond further severing of the film 13, which are designed like a circular arc. Due to this configuration of the structure 14, the in FIG. 3 and FIG. 4 shown holding mechanisms can be realized simultaneously. Another advantage is that even here no punching waste occurs, the could undesirably remain at a location of the LED module 10.
  • the separation of the film 13 may also be formed as a perforation, such as in Fig. 5h and Fig. 5i displayed.
  • Fig. 5h shows a structure 14 with a perforated predetermined breaking point and a single continuous punching.
  • Fig. 5i shows a further embodiment of a structure 14 with a perforation.
  • the perforation is executed on both sides and forms a kind of flap.
  • a continuous punching of the film 13 is arranged to facilitate the insertion of the screw 16.
  • the perforation can also be dispensed with, ie only a linear punching can be used in the middle.
  • the screw 16 during insertion displace the film 13, whereby the screw 16 can be held simultaneously.
  • such an LED module which has a film with a structure in the region of screw holes, wherein the structure is adapted to hold in the screw holes introduced screws, for example by clamping.
  • the mounting of such an LED module in particular an over-head mounting, can be considerably facilitated because falling out of the screws can be prevented by the structure of the film, and on the other hand can be contaminated by this formation of the film LED module can be prevented much more effective, since it is possible to remove the film after the installation of the LED module, whereby the screw holes are covered by the film at least partially, and without the film mitverschraubt.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Planar Illumination Modules (AREA)

Claims (12)

  1. Module de LED (10) avec au moins un orifice de passage (15) d'une première face (11) du module de LED (10) à une face de montage (12) du module de LED (10) opposée à la première face (11), l'orifice de passage (15) étant configuré de telle sorte qu'une vis (16) peut être introduite pour la fixation du module de LED (10) au niveau d'un élément de montage de la première face (11) à la face de montage (12) du module de LED (10) dans l'orifice de passage (15), et avec un film (13) qui est disposé de manière adhésive au moins partiellement au niveau de la première face (11) du module de LED (10), le film (13) présentant au moins une structure (14) qui comprend au moins un sectionnement du film (13) dans la zone de l'au moins un orifice de passage (15) du module de LED (10), caractérisé en ce que la structure (14) est configurée de telle sorte que pour enlever de l'orifice de passage (15) une vis (16) non vissée à fond traversant le film (13) et introduite au moins partiellement dans l'orifice de passage (15) du module de LED (10) une force est nécessaire, laquelle est plus grande que le poids de la vis (16) introduite.
  2. Module de LED (10) selon la revendication précédente, caractérisé en ce que
    le module de LED (10) présente sur la première face (11) au moins une cavité (18) dans laquelle est disposé l'au moins un orifice de passage (15), un diamètre de la cavité (18) étant plus grand qu'un diamètre de l'orifice de passage (15).
  3. Module de LED (10) selon la revendication 2,
    caractérisé en ce que
    le film (13) est disposé sur la première face (11) du module de LED (10) de telle sorte qu'il recouvre au moins partiellement une ouverture de la cavité (18) lorsqu'il n'y a pas de vis (16) introduite.
  4. Module de LED (10) selon l'une des revendications 2 ou 3,
    caractérisé en ce que
    le film (13) est déformable au moins dans la zone de la cavité (18) de telle sorte qu'une vis (16) avec une tête de vis (17) peut être introduite dans la cavité (18) et fixée à fond dans l'orifice de passage (15) dans la cavité (18).
  5. Module de LED (10) selon l'une des revendications 2 à 4,
    caractérisé en ce que
    lors du vissage à fond d'une vis (16) introduite dans l'orifice de passage (15) du module de LED (10) aucun film (13) ne se trouve entre la tête de vis (17) et une base de la cavité (18) du module de LED (10).
  6. Module de LED selon l'une des revendications précédentes,

    caractérisé en ce que
    la structure (14) du film (13) comprend un sectionnement fermé en forme d'évidement.
  7. Module de LED (10) selon l'une des revendications précédentes,
    caractérisé en ce que
    la structure (14) du film (13) comprend une pluralité de sectionnements qui sont disposés en croix dans un point.
  8. Module de LED (10) selon l'une des revendications précédentes,
    caractérisé en ce que
    la structure (14) du film (13) comprend un évidement et une pluralité de sectionnements, les sectionnements étant disposés au niveau d'une ligne de démarcation de l'évidement.
  9. Module de LED (10) selon l'une des revendications précédentes,
    caractérisé en ce que
    la structure (14) du film (13) présente une pluralité de sectionnements qui sont configurés en tant que perforation.
  10. Module de LED (10) selon l'une des revendications 3 à 10,
    caractérisé en ce que
    le film (13) est disposé au niveau de la première face (11) du module de LED (10) de telle sorte qu'il recouvre au moins partiellement la cavité (18) lorsque la vis (16) est introduite dans l'orifice de passage (15).
  11. Module de LED (10) selon l'une des revendications précédentes,
    caractérisé en ce que
    la structure (14) du film (13) est configurée de telle sorte que le film (13) entre en contact au moins partiellement avec une vis (16) introduite dans l'orifice de passage (15) au niveau de sa tête de vis (17).
  12. Module de LED (10) selon l'une des revendications précédentes,
    caractérisé en ce que
    le film (13) présente dans au moins une zone qui n'est pas disposée en contact au niveau de la première face (11) du module de LED (10) une couche adhésive.
EP13715698.0A 2012-04-13 2013-04-12 Module de led comportant un film protecteur Not-in-force EP2836763B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012206077A DE102012206077A1 (de) 2012-04-13 2012-04-13 Led-modul mit schutzfolie
PCT/EP2013/057720 WO2013153211A1 (fr) 2012-04-13 2013-04-12 Module de led comportant un film protecteur

Publications (2)

Publication Number Publication Date
EP2836763A1 EP2836763A1 (fr) 2015-02-18
EP2836763B1 true EP2836763B1 (fr) 2016-05-25

Family

ID=48087597

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13715698.0A Not-in-force EP2836763B1 (fr) 2012-04-13 2013-04-12 Module de led comportant un film protecteur

Country Status (5)

Country Link
US (1) US9546778B2 (fr)
EP (1) EP2836763B1 (fr)
CN (1) CN104220808B (fr)
DE (1) DE102012206077A1 (fr)
WO (1) WO2013153211A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202013101435U1 (de) * 2013-04-04 2013-04-19 Siteco Beleuchtungstechnik Gmbh Leuchtengehäuse mit Lochkaschierung
USD744964S1 (en) 2013-10-18 2015-12-08 Osram Gmbh LED lighting module
USD744963S1 (en) * 2014-04-01 2015-12-08 Xicato, Inc. LED module
JP1558238S (fr) * 2015-10-07 2016-09-12

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE793028A (fr) * 1971-12-24 1973-04-16 Danois & Fils Ets J Caisson pour sources lumineuses
DE2402323A1 (de) * 1974-01-18 1975-07-24 Tarco Verbindungstechnik Gmbh Mutter, insbesondere einpressmutter
DE29609669U1 (de) 1996-02-08 1996-08-29 Philips Electronics N.V., Eindhoven Leuchte
DE19753801A1 (de) * 1997-12-04 1999-06-10 Mannesmann Vdo Ag Verfahren zur Oberflächenbestückung (SMD) eines ebenen Tragkörpers und Vorrichtung zu seiner Durchführung
US8236400B2 (en) * 2004-09-17 2012-08-07 Hewlett-Packard Development Company, L.P. Adhesive cover systems for articles
US20080247178A1 (en) * 2006-12-15 2008-10-09 David Holder Covering for a light source for maintaining brightness in a degrading environment
US8545049B2 (en) * 2009-11-25 2013-10-01 Cooper Technologies Company Systems, methods, and devices for sealing LED light sources in a light module
DE102009047489B4 (de) * 2009-12-04 2013-07-11 Osram Gmbh Leuchtmodul

Also Published As

Publication number Publication date
CN104220808A (zh) 2014-12-17
DE102012206077A1 (de) 2013-10-17
CN104220808B (zh) 2017-10-27
US9546778B2 (en) 2017-01-17
WO2013153211A1 (fr) 2013-10-17
US20150078017A1 (en) 2015-03-19
EP2836763A1 (fr) 2015-02-18

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