EP2813548A4 - Powdered sealing agent, and sealing method - Google Patents

Powdered sealing agent, and sealing method

Info

Publication number
EP2813548A4
EP2813548A4 EP13746725.4A EP13746725A EP2813548A4 EP 2813548 A4 EP2813548 A4 EP 2813548A4 EP 13746725 A EP13746725 A EP 13746725A EP 2813548 A4 EP2813548 A4 EP 2813548A4
Authority
EP
European Patent Office
Prior art keywords
sealing
powdered
agent
sealing agent
sealing method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13746725.4A
Other languages
German (de)
French (fr)
Other versions
EP2813548A1 (en
Inventor
Hiroaki Arita
Yoshiki Nakaie
Mitsuteru Mutsuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Evonik Ltd
Original Assignee
Daicel Evonik Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012026239A external-priority patent/JP2013163709A/en
Priority claimed from JP2012027132A external-priority patent/JP2013163754A/en
Application filed by Daicel Evonik Ltd filed Critical Daicel Evonik Ltd
Publication of EP2813548A1 publication Critical patent/EP2813548A1/en
Publication of EP2813548A4 publication Critical patent/EP2813548A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/12—Esters; Ether-esters of cyclic polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/20—Carboxylic acid amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/02—Polyamides derived from omega-amino carboxylic acids or from lactams thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/36—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino acids, polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
    • C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
    • C09K2200/0667—Polyamides, polyimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
EP13746725.4A 2012-02-09 2013-02-08 Powdered sealing agent, and sealing method Withdrawn EP2813548A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012026239A JP2013163709A (en) 2012-02-09 2012-02-09 Powdered sealing agent and sealing method
JP2012027132A JP2013163754A (en) 2012-02-10 2012-02-10 Powdery sealing agent and sealing method
PCT/JP2013/053045 WO2013118864A1 (en) 2012-02-09 2013-02-08 Powdered sealing agent, and sealing method

Publications (2)

Publication Number Publication Date
EP2813548A1 EP2813548A1 (en) 2014-12-17
EP2813548A4 true EP2813548A4 (en) 2015-04-15

Family

ID=48947619

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13746725.4A Withdrawn EP2813548A4 (en) 2012-02-09 2013-02-08 Powdered sealing agent, and sealing method

Country Status (5)

Country Link
US (1) US20150024130A1 (en)
EP (1) EP2813548A4 (en)
KR (1) KR20140127302A (en)
CN (1) CN104136539A (en)
WO (1) WO2013118864A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108025493A (en) * 2015-09-04 2018-05-11 沙特基础工业全球技术有限公司 Powder composition, the method for preparing by powder composition product and coating and the product thus prepared
CN106084753B (en) * 2016-06-17 2018-06-29 皖西学院 A kind of dedicated ultraviolet resistance stretch-proof organic composite material of LED lens and preparation method thereof
FR3087775B1 (en) 2018-10-24 2022-12-02 Arkema France LOW MELTING TEMPERATURE COPOLYAMIDE POWDERS

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4172161A (en) * 1977-07-13 1979-10-23 Chemische Werke Huls Ag Pulverulent copolyamides for the coating of glass bottles
US4487895A (en) * 1979-05-19 1984-12-11 Chemische Werke H/u/ ls AG Powdered mixture of polyamides for heat sealing by the powder point process
EP2620463A1 (en) * 2010-09-22 2013-07-31 Daicel-Evonik Ltd. Powdered sealant and sealing method
EP2826818A1 (en) * 2012-03-16 2015-01-21 Daicel-Evonik Ltd. Sealant paste and sealing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4318047C2 (en) * 1993-05-29 1995-09-14 Atochem Elf Deutschland Use of copolyamides as hot melt adhesive for heat sealing
JP4359793B2 (en) 1998-10-22 2009-11-04 ノードソン株式会社 Method for sealing a printed circuit board on which electronic components are mounted
JP2001234125A (en) 2000-02-24 2001-08-28 Sumitomo Seika Chem Co Ltd Powder coating material for spray coating
JP2002363395A (en) * 2001-05-31 2002-12-18 Toray Ind Inc Sealing resin composition, molded article and electronic sealed part
JP2003176408A (en) * 2001-09-21 2003-06-24 Kuraray Co Ltd Polyamide composition for sealing electric and electronic parts
JP2003321606A (en) * 2002-04-30 2003-11-14 Nippon Paint Co Ltd Polyamide resin composition for insert mold
JP2005179582A (en) * 2003-12-22 2005-07-07 Matsushita Electric Works Ltd Resin composition for optical semiconductor encapsulation, preform for optical semiconductor encapsulation and optical semiconductor device
JP5209229B2 (en) 2007-05-09 2013-06-12 中島硝子工業株式会社 Manufacturing method of solar cell module
JP5594930B2 (en) 2007-10-17 2014-09-24 小松精練株式会社 Hot-melt type member for organic thin film solar cell and organic thin film solar cell case sealing panel
JP5348869B2 (en) 2007-10-17 2013-11-20 小松精練株式会社 Hot melt type member for organic electronic device, barrier film sealing member, organic electronic device sealing panel using them
JP5100630B2 (en) * 2008-12-26 2012-12-19 電気化学工業株式会社 Solar cell encapsulant

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4172161A (en) * 1977-07-13 1979-10-23 Chemische Werke Huls Ag Pulverulent copolyamides for the coating of glass bottles
US4487895A (en) * 1979-05-19 1984-12-11 Chemische Werke H/u/ ls AG Powdered mixture of polyamides for heat sealing by the powder point process
EP2620463A1 (en) * 2010-09-22 2013-07-31 Daicel-Evonik Ltd. Powdered sealant and sealing method
EP2826818A1 (en) * 2012-03-16 2015-01-21 Daicel-Evonik Ltd. Sealant paste and sealing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013118864A1 *

Also Published As

Publication number Publication date
KR20140127302A (en) 2014-11-03
WO2013118864A1 (en) 2013-08-15
CN104136539A (en) 2014-11-05
EP2813548A1 (en) 2014-12-17
US20150024130A1 (en) 2015-01-22

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Legal Events

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RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20150317

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/29 20060101ALI20150311BHEP

Ipc: H01L 23/31 20060101ALI20150311BHEP

Ipc: C08L 77/00 20060101AFI20150311BHEP

Ipc: H01L 21/56 20060101ALI20150311BHEP

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