EP2802804A1 - Heat dissipation device, lighting device, and luminaire having said lighting device - Google Patents
Heat dissipation device, lighting device, and luminaire having said lighting deviceInfo
- Publication number
- EP2802804A1 EP2802804A1 EP13700025.3A EP13700025A EP2802804A1 EP 2802804 A1 EP2802804 A1 EP 2802804A1 EP 13700025 A EP13700025 A EP 13700025A EP 2802804 A1 EP2802804 A1 EP 2802804A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat dissipation
- vent holes
- lighting device
- accommodating cavity
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to a heat dissipation device, a lighting device, and a luminaire having said lighting device.
- Lighting device generally have a large demand for heat dissi ⁇ pation since a light engine and a driver are both heat sources generating a large amount of heat. Thus, efficient heat dissipation is required to ensure the normal operation of the lighting device. Especially for an LED lighting de- vice, the above demand becomes more urgent.
- a typical LED lighting device comprises a light engine, a heat dissipation device, and a driver.
- the heat dissipation device is provided between the light engine and the driver.
- the heat dissipation device is in direct thermal contact with the light engine and the driver.
- the thermal contact portion of the heat dissipation device By means of the thermal contact portion of the heat dissipation device, the heat generated is transferred to other parts of the heat dissipation device for heat dissipation.
- the overall heat dissipation capacities of the heat dissipation device will be lim ⁇ ited.
- the first solution in the prior art is potting a heat dissipation gel, viz. potting the heat dissipation gel into the cavity of the heat dissipation device accommodating the light engine or accommodating the driver to improve the heat dissi- pation capacities.
- the drawback of this solution lies in increasing the cost and the weight of the whole lighting device.
- the second solution in the prior art is providing a thickened base wall and using the same to support the light engine so as to enhance the heat dissipation capacities of the contact portion.
- the drawback of this solution lies in increasing the cost and the weight of the whole lighting device .
- the object of the present invention lies in providing a heat dissipation device which is capable of overcom ⁇ ing the drawbacks of various solutions in the prior art and has the advantages of having a simple manufacturing process and remarkably improving the heat dissipation capacities.
- a heat dissipation device characterized by, comprising a heat dis- sipation body and a plurality of heat dissipation pipes , wherein the heat dissipation body has heat dissipation wall which defined an accommodating cavity for at least partially accommodating a first heat source, the heat dissipation wall have a plurality of vent holes, the heat dissipation pipes are mounted into the accommodating cavity through the vent holes, and one end of the heat dissipation pipe is in air communication with the vent hole.
- the combination of the first vent holes and the heat dissipation pipes not only in- creases the thermal conduction area and the air convection around the first heat source, but also reduces the overall thermal resistance of the heat dissipation device, thereby remarkably improving the heat dissipation capacity.
- the heat dissipation wall has a base wall and a circumferential wall which defined the accommodating cavity jointly with the base wall, and a first vent holes are opened in the base wall.
- the heat dissipation body may be configured to have, for example, an inverted U shape or have an closed accommodating cavity.
- the bottom surface of the accommodating cavity may be configured as the base wall having the first vent holes so as to dissipate heat in the accommodating cavity where a second heat source is located, to the outside.
- the base wall has a support portion supporting a second heat source and a circumferential area enclosing the support portion, the first vent holes being opened in the circumferential area.
- accommodating cavity is a cavity opened at one side.
- the possibility is provided that the first heat source partially protrudes out of the accommodating cavity, thereby further improving the heat dissipation of the first heat source.
- the circumferential wall has a first section and a second section, the first section and the second section define a surface of the heat dissipation body facing away from the base wall, a plurality of second vent holes are opened in the surface, and the other end of the heat dissipation pipe is in air communication with the second vent hole.
- the first vent holes are in air communication with the second vent holes via the heat dissipation pipes, thereby further improving the heat dissipation capacity.
- the first section has a conical shape and the second section has a cylindrical shape.
- the second vent holes it is possible not only to provide the second vent holes, but also to matches with the shape second heat source.
- the overall appearance of the heat dissipation device can be improved .
- the plurality of first vent holes and the plural ⁇ ity of second vent holes are circumferentially distributed on the base wall and the surface, respectively, such that the heat generated in the respective directions may be dissipated outward .
- the heat dissipation pipes are made of copper. Due to the good heat conduction performance of the copper, the heat dissipation capacity of the heat dissipation device may be further improved.
- the heat dissipation body is made of Al . Since Al as a light metal has the advantages of good heat dissipation performance and lighter weight, a balance may be achieved between the heat dissipation performance and the weight of the whole heat dissipation device.
- the heat dissipation body is formed by a spinning or punching process.
- the use of said process makes it easy to form the heat dissipation body and the vent holes of the heat dissipation body and reduces significantly the manufacturing cost.
- the present invention also relates to a lighting device comprising the heat dissipation device as described above, a driver housing for accommodating a driver as a first heat source and a light engine as a second heat source.
- the heat dissipation manner of combining the above heat dissipation pipes and the first vent holes of the heat dissipation device according to the present invention increases the overall structure strength and separates the heat of the driver from the heat of the light engine, thereby improving the heat dis- sipation capacities of the lighting device.
- the light engine comprises a circuit board and an LED chip provided on the circuit board.
- the heat dissipation device according to the present invention particularly satisfies the high requirement for heat dissipation of the LED chip.
- the lighting device further comprises a housing which encloses the light engine and is mounted to the support portion of the base wall, with the first vent holes exposed.
- the first vent holes are exposed directly to the ambient sur- roundings, which may transfer heat directly to the ambient surroundings and further reduce the effect of the light engine on the heat dissipation.
- the driver housing has a cylindrical portion at a side facing the accommodating cavity and a collar at a side facing away from the accommodating cavity, the collar protruding out of the accommodating cavity.
- the collar at least partially protrudes out of the accommodating cavity, which ensures that part of heat may be dissipated from one side of the driver housing and that the heat may be dissipated via the second vent holes from one side of the driver housing.
- the plurality of heat dissipation pipes are mounted in the accommodating cavity, in an area between the heat dissipation device and the driver housing, and are in communication with the first vent holes and the second vent holes.
- the heat of the driver may be dissipated outward from either the first vent holes or the second vent holes.
- the plurality of heat dissipation pipes are arranged in such a way that the heat dissipation pipes are in contact with walls defining the first vent holes and the sec- ond vent holes, thereby improving not only the heat dissipation by air convection but also the heat dissipation by conduction .
- the present invention further relates to a luminaire.
- the lighting device and the luminaire according to the present invention have the advantages of having a simple manufacturing process and low cost as well as remarkably improving the heat dissipation capacities.
- Fig. 1 is a stereoscopic view of a lighting device according to a first embodiment according to the present invention
- Fig. 2 is an exploded view of a lighting device according to a first embodiment according to the present invention
- Fig. 3 is a side sectional view of a lighting device according to a first embodiment according to the present invention
- Fig. 4 is a top view of a lighting device according to a first embodiment of the present invention.
- Fig. 5 is a front view of a lighting device according to a first embodiment of the present invention.
- Fig. 6 is a bottom view of a lighting device according to a first embodiment of the present invention.
- Fig. 1 is a stereoscopic view of a lighting device 100 ac- cording to a first embodiment according to the present inven- tion.
- Fig. 2 is an exploded view of a lighting device 100 according to a first embodiment according to the present invention.
- Fig. 2 shows a heat dissipation device 10 according to the present invention.
- the heat dissipation device 10 accord- ing to the present invention mainly comprises two parts: a heat dissipation body 1 and a plurality of heat dissipation pipes 2. Vent holes are opened in the heat dissipation body 1, for example, first vent holes 14 as shown in this embodi ⁇ ment.
- the heat dissipation pipes 2 may be made of high ther- mal conduction materials and are configured to be inserted into the first vent holes 14 of the heat dissipation body 1 and further inserted into an accommodating cavity 15 (see Fig. 3) of the heat dissipation body 1 for accommodating a first heat source. Since the heat dissipation pipes 2 not only are in contact with the heat dissipation body 1 to increase the heat dissipation area for transferring the heat in the accommodating cavity 15 but also form an air convection path with the first vent holes, the heat dissipation capacities are significantly improved.
- the heat dissipation body 1 comprises a base wall 13 as a bottom surface and a circumferential wall 16 defining the accommodating cavity 15 together with the base wall 13.
- the first vent holes 14 are opened in the base wall 13.
- said base wall 13 comprises two parts, viz. a support portion 131 which is mainly used for supporting and being in thermal contact with a second heat source 4 and a circumferential area 132 which is arranged to surround the support portion 131.
- the first vent holes 14 are opened in the circumferential area 132 in said preferred embodiment to separate heat dissipation paths of a first heat source 3 and the second heat source 4.
- the first vent holes 14 are preferably uniformly distributed in the circumferential area 132 to realize uniform and comprehensive heat dissipation.
- second vent holes 18 may further be provided.
- the second vent holes 18 are preferably opened at the position of the heat dissipation body 1 facing away from the first vent holes 14.
- the accommodating cavity 15 is open at the first heat source side.
- a surface 17 is formed on which the second vent holes 18 are opened and which are used for supporting the heat dissipation pipes 2.
- the circumferential wall 16 has a first section 161 and a second section 162.
- the second section has a smaller diameter than the first section, thereby forming a step, which is the end surface 17 of the heat dissipation body 1 facing away from the base wall 13.
- a plurality of second vent holes 18 are opened in the end surface 17.
- the other end 22 of the heat dissipation pipe 2 is in air communication with the second vent hole 18.
- the heat may be dissipated either from the second heat source side or from the first heat source side.
- the second vent holes 18 are preferably uniformly distributed on the surface 17 so as to realize uniform and comprehensive heat dissipation.
- the lighting device comprising an improved heat dissipation device according to the present invention is as shown in Figs. 1 and 2.
- the lighting device 100 comprises a housing 5, a light engine 4, the heat dissipation device 10, a driver housing 3 for accommodating a driver (not shown) , and an electrical connection part 6 connected to a power supply.
- the light engine 4 comprises a circuit board and an LED chip pro ⁇ vided on the circuit board.
- the housing 5 is mounted to the heat dissipation device 10 so as to adjust the direction of light emitted from the LED chip 42 of the light engine 4 supported by the support portion 131 of the base wall 3 of the heat dissipation device 10.
- the shape of the housing 5 is de- signed to match the profile of the heat dissipation device 10.
- the two jointly form a streamlined profile, especially jointly forming a profile similar to a conventional incandescent lamp.
- the driver housing 3 partially protrudes from the heat dissipation device 10 and a protruding portion 32 also matches the profile of the heat dissipation device 10 to jointly constitute a streamlined profile, ensuring that the lighting device 100 is configured to have a compact structure and an artistic appearance.
- the driver housing 3 is electri- cally connected to the light engine 4 via the heat dissipation device 10 at one side and electrically connected to the electrical connection part 6 leading to the power supply at the other side. Since the present invention does not focus on the electrical connection, a detailed description of how to perform the electrical connection is omitted herein.
- the heat dissipation device 10 is provided between the light engine 4 and the driver housing 3.
- the light engine 4 and the driver housing 3 are mounted at two sides of the heat dissipation device 10, re- spectively.
- the light engine 4 is mounted at a first side 11 of the heat dissipation device 10 viz. an upper surface as shown in said figure, and the driver housing 3 accommodating the driver mounted at the other side 12, viz. a lower surface as shown in said figure.
- the heat dissipation body 1 supports the light engine 4 at one side, and the heat dissipation device 10 may have a cavity formed at one side for accommodating the light engine 4 or may have the base wall 13 of the heat dissipation body 1 for supporting the light engine 4, as shown in said embodi- ment.
- the heat dissipation body 1 has the accommodating cavity 15 for at least partially accommodating the driver housing 3 formed at the other side, said accommodating cavity 15 being defined by the base wall 13 and the circumferential wall 16.
- the heat dissipation body 1 of the heat dissipation device 10 has the first vent holes 14 and/or the second vent holes 18.
- the first vent holes 14 are in air communication with the second vent holes 18 or in air communication with the second vent holes 18 preferably via the heat dissipation pipes 2 (see Fig. 3) .
- the first vent holes 14 are exposed and in direct communication with the ambient surroundings.
- the second vent holes 18 are exposed and in direct communication with the ambient surroundings.
- Fig. 3 is a side sectional view of a lighting device according to a first embodiment according to the present invention. As shown in Fig. 3, the plurality of heat dissipation pipes 2 are provided in an area of the accommodating cavity 15 be- tween the heat dissipation device 10 and the driver housing
- the heat dissipation pipes 2 uniformly surround the driver housing 3 in a circumferential direction to receive the heat of the driver housing 3 uniformly and comprehensively.
- the heat dissipation pipes 2 are not only in communication with the first vent holes 14 and the second vent holes 18 but also in direct thermal contact with walls defining the first vent holes 14 and the second vent holes 18 so as to realize a combination of two heat dissipation manners, thermal conduction and air convection.
- the lighting device 100 according to the present invention improves the effect of heat dissipation by air convection and prevents the heat of the driver from being transferred to the light engine 4.
- the driver housing 3 has a cylindrical portion 31 and a collar 32.
- the cylindrical portion 31 is configured to be just accommodated in the accommodating cavity 15.
- the collar 32 has a larger size than the cylindrical portion 31 and is configured to protrude from the heat dissi- pation device 10 and constitute a part of the profile of the lighting device 100.
- the shape of the driver housing may be freely designed according to different design requirements.
- the driver housing 3 is made of plastic and manufactured by an injection molding process. Therefore, plastic with general heat dissipation capacity such as PC, PE, and so on is generally used to make the driver housing, thereby reducing the cost and the processing complexity.
- the selection of the heat dissipation materials for the heat dissipation body and the heat dissipation pipes shall be made in consideration of a balance between the improvement of the overall heat dissipation capacity and the total weight of the heat dissipation device.
- the heat dissipation body is made of Al with better heat dissipa- tion capacity and lighter weight and the heat dissipation pipes are made of copper. In other embodiment, other heat dissipation metal may be selected.
- the heat dissipation device 10 may be formed by a spinning or punching process or by other low-cost processes.
- Fig. 4 is a top view of a lighting device according to a first embodiment of the present invention, Fig.
- FIG. 5 is a front view of a lighting device according to a first embodiment of the present invention
- Fig. 6 is a bottom view of a lighting device according to a first embodiment of the pre- sent invention.
- the details of the lighting device 100 may be seen more clearly. It is shown in the figures that the first vent holes 14 and the second vent holes 18 may effectively dissipate the heat transferred by the heat dissipation pipes 2 to the ambient surroundings, thereby improving the heat dissipation capacity of the lighting device of the present invention.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210007665.6A CN103206689B (en) | 2012-01-11 | 2012-01-11 | Heat abstractor, light-emitting device and the light fixture with the light-emitting device |
PCT/EP2013/050059 WO2013104553A1 (en) | 2012-01-11 | 2013-01-03 | Heat dissipation device, lighting device, and luminaire having said lighting device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2802804A1 true EP2802804A1 (en) | 2014-11-19 |
EP2802804B1 EP2802804B1 (en) | 2016-08-24 |
Family
ID=47521020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13700025.3A Not-in-force EP2802804B1 (en) | 2012-01-11 | 2013-01-03 | Heat dissipation device, lighting device, and luminaire having said lighting device |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2802804B1 (en) |
CN (1) | CN103206689B (en) |
WO (1) | WO2013104553A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104359034A (en) * | 2014-11-23 | 2015-02-18 | 陈善能 | Multifunctional air-purification LED (Light-Emitting Diode) lamp |
CN108361675A (en) * | 2018-03-31 | 2018-08-03 | 江苏泓睿德智能科技有限公司 | A kind of heat dissipation device of LED lamp and preparation method thereof |
CN113606525B (en) * | 2021-09-14 | 2022-08-19 | 滨海治润电子有限公司 | Diode with good leakproofness |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI345661B (en) * | 2006-10-30 | 2011-07-21 | Coretronic Corp | Backlight module |
DE102007045555A1 (en) * | 2007-09-24 | 2009-04-02 | Ledon Lighting Gmbh | Heat sink and cooling system for one LED module |
US20100033071A1 (en) * | 2008-07-15 | 2010-02-11 | Nuventix Inc. | Thermal management of led illumination devices with synthetic jet ejectors |
CN102128433A (en) * | 2010-01-13 | 2011-07-20 | 江苏恒源照明有限公司 | Radiating device for LED (Light-Emitting Diode) chip integrated encapsulated light source |
US8125126B2 (en) * | 2010-05-07 | 2012-02-28 | Industrial Technology Research Institute | Multi-facet light emitting lamp |
KR101102859B1 (en) * | 2010-06-30 | 2012-01-10 | (주)이노셈코리아 | Led lighting lamp for improved airvent efficiency |
CN201748200U (en) * | 2010-07-02 | 2011-02-16 | 惠州市华阳多媒体电子有限公司 | LED bulb lamp |
US9810418B2 (en) * | 2010-08-12 | 2017-11-07 | Micron Technology, Inc. | Solid state lights with cooling structures |
-
2012
- 2012-01-11 CN CN201210007665.6A patent/CN103206689B/en not_active Expired - Fee Related
-
2013
- 2013-01-03 EP EP13700025.3A patent/EP2802804B1/en not_active Not-in-force
- 2013-01-03 WO PCT/EP2013/050059 patent/WO2013104553A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN103206689B (en) | 2017-09-12 |
WO2013104553A1 (en) | 2013-07-18 |
CN103206689A (en) | 2013-07-17 |
EP2802804B1 (en) | 2016-08-24 |
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