EP2746013B1 - A method for banding edges of furniture boards - Google Patents

A method for banding edges of furniture boards Download PDF

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Publication number
EP2746013B1
EP2746013B1 EP12461566.7A EP12461566A EP2746013B1 EP 2746013 B1 EP2746013 B1 EP 2746013B1 EP 12461566 A EP12461566 A EP 12461566A EP 2746013 B1 EP2746013 B1 EP 2746013B1
Authority
EP
European Patent Office
Prior art keywords
inner layer
image
chips
glue
furniture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP12461566.7A
Other languages
German (de)
French (fr)
Other versions
EP2746013A1 (en
Inventor
Boguslaw Balcerak
Tomasz Kecerski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furnirex Sp z oo
Original Assignee
FURNIREX SP Z OO
FURNIREX SP Z O O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FURNIREX SP Z OO, FURNIREX SP Z O O filed Critical FURNIREX SP Z OO
Priority to ES12461566.7T priority Critical patent/ES2552740T3/en
Priority to EP12461566.7A priority patent/EP2746013B1/en
Publication of EP2746013A1 publication Critical patent/EP2746013A1/en
Application granted granted Critical
Publication of EP2746013B1 publication Critical patent/EP2746013B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity

Definitions

  • the present invention relates to a method according to claim 1 for bonding edges of furniture boards applicable to hutch furniture.
  • Hutch furniture consist of a set of furniture boards, which constitute walls and fronts of furniture, couplers i.e. screws or shanks and various other elements such as holders or legs.
  • the furniture boards of hutch furniture are manufactured from chipboards (particle boards) of MDF or HDF type.
  • the main face areas of chipboards are covered by a coating material such as veneer, scaleboard or foil.
  • Chipboards are cut to match the required dimensions of the final furniture board, and the edges of furniture boards are bonded with an edge cover such as tape or foil.
  • the edge cover is bonded with the board by a suitable glue, which is usually heated when applying on the surface of the edge.
  • manufacturing defects such as imprecise bonding of the edges by the cover material or excessive amount of glue at the edge region.
  • the manufacturing defects are caused by diverse quality of the raw material of the inner layer of the chipboard.
  • boards made from conifers have physical properties different than boards made from deciduous wood. If the inner layer of furniture boards is made of recycled material, the boards of the same production batch may have different properties.
  • the aim of present invention is to develop a method for bonding edges of furniture boards, which provides high precision of finishing the edges of furniture boards with different properties of the inner layer, providing optimal usage of the glue.
  • the object of the present invention is a method for bonding edges of furniture boards comprising a chip inner layer, wherein an edge cover is bonded with the furniture board by means of a glue heated to a certain temperature, wherein the volume and temperature of the glue are individually adjusted for each bonded edge, depending on the parameters of the raw material of the chip inner layer determined by an analyzer of the image of the chip inner layer.
  • the image of the edge of chip inner layer to be bonded is compared by the analyzer of the image of the chip inner layer with a set of reference images stored in a reference database, wherein the image which is most similar to the image of the edge of furniture to be bonded is selected, and thereafter the volume of glue and its temperature are adjusted according to data specified for the selected reference image.
  • At least one parameter of the image of the edge of the chip inner layer selected from a group containing: mean brightness of chips, mean size of chips, variations of brightness and size of particular chips, distribution of chips size, size of empty inter-chips spaces.
  • Fig. 1 presents schematically the furniture board with an edge cover
  • Fig. 2A-2F present examples of different types of chipboards
  • Fig. 3 presents a diagram of a process line for bonding edges of furniture boards according to the invention.
  • the furniture board 100 presented in Fig. 1 includes a chip inner layer 101 covered by outer face layers 102, 103 for example natural or plastic veneer.
  • the edge cover 104 such as a tape or foil, is bonded to the edge of the boards.
  • Fig. 2A-2F present examples of boards of different types:
  • Fig. 2A presents a board having a compact structure with small empty inter-chips spaces, wherein the inner layer is made from softwood with a small addition of recycled material.
  • Fig. 2B presents a board having a compact structure with empty inter-chips spaces, wherein the inner layer is made from softwood with a higher percentage of large chips and a higher percentage of recycled material.
  • Fig. 2C presents a board having a quite loose structure with large empty inter-chips spaces, wherein the inner layer is made from softwood with a high percentage of recycled material.
  • Fig. 2D presents a board having a compact structure with small empty inter-chips spaces, wherein the inner layer is made from deciduous wood with small addition of recycled material.
  • Fig. 2E presents a board having a compact structure with large empty inter-chips spaces, wherein the inner layer is made from deciduous wood with a high percentage of thick chips and low percentage of recycled material.
  • Fig. 2F presents a board having a loose structure with large empty inter-chips spaces, wherein the inner layer is made from softwood with a high percentage of recycled material.
  • Fig. 3 presents a diagram of a process line for bonding edges of furniture boards according to the invention.
  • the boards are fed from station 201 by a conveyor to a cutting and milling station 202, wherein the chipboards are cut to match the required dimensions of the furniture board, and edges of the boards are formed appropriately.
  • the parameters of the raw material of the inner layer are determined at the inner layer analysis station 203.
  • the analysis station 203 is equipped with a camera, which captures an image of the edge of the board fed by the conveyor.
  • the parameters of the material of the inner layer can be determined by two methods.
  • the first method is realized by comparing the image of the edge of the furniture board to be bonded with images from a reference database 204.
  • the database 204 may store, for each raw material to be analyzed, a set of images illustrating the appearance of the board, pre-determined by a system operator.
  • the analysis station 203 uses algorithms for image comparison and for determining image similarity, determines the image of the reference database 204, which is most similar to the image of the board fed by the conveyor and thereby determines the type of the raw material.
  • the analysis of image is performed by defining image parameters such as mean brightness of chips, mean size of chips, variations of brightness and size of particular chips, distribution of chips size, empty inter-chips spaces etc. That parameters are used to define the material of the inner layer of the board, the level of compaction, the content of recycled material and other parameters, which are necessary to determine the parameters of the process for bonding the edges of furniture board.
  • Knowing the parameters of the inner layer material enables to determine the parameters of the process of bonding of the edge cover, which is performed on station 205, wherein two parallel edges are subject to the bonding process. There are adjusted, at least, the volume of the glue which is fed by the glue feeder 206 and the melting point of the glue which is heated by the heater 207.
  • an exemplary MELT EB 1756 glue made by Follmann&Co, Minden, Germany can be used with the following process parameters:
  • the board is then conveyed by a turn-table 208, which rotates it by an angle of 90°, to the next cutting and milling station 209 in order to process the remaining two edges of the board, in the same way as at the station 202.
  • the edges are bonded on a bonding station 210 equipped with a glue feeder 211 and a heater 212, for which the process parameters are defined in the same way as for stations 205 - 207.
  • the bonded boards are collected on a collecting station 213.
  • the method of the present invention enables continuous monitoring of the process of bonding of board edges and adjustment of parameters of the process to a particular raw material of the chip inner layer of furniture boards.
  • the volume of glue used in the process and the energy supplied for heating glue is optimized, which results in reduction of production costs, reduction of amount of harmful substances (glue) contained in the manufactured boards and good quality of edge bonding as well as prevention from leakage of glue from edges of boards.

Description

  • The present invention relates to a method according to claim 1 for bonding edges of furniture boards applicable to hutch furniture.
  • Hutch furniture consist of a set of furniture boards, which constitute walls and fronts of furniture, couplers i.e. screws or shanks and various other elements such as holders or legs.
  • The furniture boards of hutch furniture are manufactured from chipboards (particle boards) of MDF or HDF type. The main face areas of chipboards are covered by a coating material such as veneer, scaleboard or foil. Chipboards are cut to match the required dimensions of the final furniture board, and the edges of furniture boards are bonded with an edge cover such as tape or foil. The edge cover is bonded with the board by a suitable glue, which is usually heated when applying on the surface of the edge. An example of the state-of-art method is given in DE 196 15 879 .
  • At high-volume production of furniture boards, wherein the boards are bonded with high speeds, they may occur manufacturing defects, such as imprecise bonding of the edges by the cover material or excessive amount of glue at the edge region. The manufacturing defects are caused by diverse quality of the raw material of the inner layer of the chipboard.
  • For example, boards made from conifers have physical properties different than boards made from deciduous wood. If the inner layer of furniture boards is made of recycled material, the boards of the same production batch may have different properties.
  • The aim of present invention is to develop a method for bonding edges of furniture boards, which provides high precision of finishing the edges of furniture boards with different properties of the inner layer, providing optimal usage of the glue.
  • The object of the present invention is a method for bonding edges of furniture boards comprising a chip inner layer, wherein an edge cover is bonded with the furniture board by means of a glue heated to a certain temperature, wherein the volume and temperature of the glue are individually adjusted for each bonded edge, depending on the parameters of the raw material of the chip inner layer determined by an analyzer of the image of the chip inner layer.
  • Preferably, the image of the edge of chip inner layer to be bonded is compared by the analyzer of the image of the chip inner layer with a set of reference images stored in a reference database, wherein the image which is most similar to the image of the edge of furniture to be bonded is selected, and thereafter the volume of glue and its temperature are adjusted according to data specified for the selected reference image.
  • Preferably, by means of the analyzer of the chip inner layer there is determined at least one parameter of the image of the edge of the chip inner layer, selected from a group containing: mean brightness of chips, mean size of chips, variations of brightness and size of particular chips, distribution of chips size, size of empty inter-chips spaces.
  • The invention is shown by means of exemplary embodiment on a drawing, in which Fig. 1 presents schematically the furniture board with an edge cover, Fig. 2A-2F present examples of different types of chipboards, and Fig. 3 presents a diagram of a process line for bonding edges of furniture boards according to the invention.
  • The furniture board 100 presented in Fig. 1 includes a chip inner layer 101 covered by outer face layers 102, 103 for example natural or plastic veneer. The edge cover 104, such as a tape or foil, is bonded to the edge of the boards.
  • Fig. 2A-2F present examples of boards of different types:
  • Fig. 2A presents a board having a compact structure with small empty inter-chips spaces, wherein the inner layer is made from softwood with a small addition of recycled material.
  • Fig. 2B presents a board having a compact structure with empty inter-chips spaces, wherein the inner layer is made from softwood with a higher percentage of large chips and a higher percentage of recycled material.
  • Fig. 2C presents a board having a quite loose structure with large empty inter-chips spaces, wherein the inner layer is made from softwood with a high percentage of recycled material.
  • Fig. 2D presents a board having a compact structure with small empty inter-chips spaces, wherein the inner layer is made from deciduous wood with small addition of recycled material.
  • Fig. 2E presents a board having a compact structure with large empty inter-chips spaces, wherein the inner layer is made from deciduous wood with a high percentage of thick chips and low percentage of recycled material.
  • Fig. 2F presents a board having a loose structure with large empty inter-chips spaces, wherein the inner layer is made from softwood with a high percentage of recycled material.
  • Fig. 3 presents a diagram of a process line for bonding edges of furniture boards according to the invention. The boards are fed from station 201 by a conveyor to a cutting and milling station 202, wherein the chipboards are cut to match the required dimensions of the furniture board, and edges of the boards are formed appropriately. Next, the parameters of the raw material of the inner layer are determined at the inner layer analysis station 203.
  • The analysis station 203 is equipped with a camera, which captures an image of the edge of the board fed by the conveyor. The parameters of the material of the inner layer can be determined by two methods.
  • The first method is realized by comparing the image of the edge of the furniture board to be bonded with images from a reference database 204. For example, the database 204 may store, for each raw material to be analyzed, a set of images illustrating the appearance of the board, pre-determined by a system operator. The analysis station 203, using algorithms for image comparison and for determining image similarity, determines the image of the reference database 204, which is most similar to the image of the board fed by the conveyor and thereby determines the type of the raw material.
  • In the other method, the analysis of image is performed by defining image parameters such as mean brightness of chips, mean size of chips, variations of brightness and size of particular chips, distribution of chips size, empty inter-chips spaces etc. That parameters are used to define the material of the inner layer of the board, the level of compaction, the content of recycled material and other parameters, which are necessary to determine the parameters of the process for bonding the edges of furniture board.
  • Knowing the parameters of the inner layer material enables to determine the parameters of the process of bonding of the edge cover, which is performed on station 205, wherein two parallel edges are subject to the bonding process. There are adjusted, at least, the volume of the glue which is fed by the glue feeder 206 and the melting point of the glue which is heated by the heater 207. For example, in order to bond the board edges with a foil having a thickness of 0,4mm by means of spreading granulated, fusible glue, an exemplary MELT EB 1756 glue made by Follmann&Co, Minden, Germany can be used with the following process parameters:
    • for the inner layer shown in Fig. 2E and Fig. 2B: the glue temperature shall be 195-200 °C and the volume of glue shall be 100 - 115 g/m2
    • for the inner layer shown in Fig. 2F the glue temperature shall be 190 - 195 °C and the volume of glue shall be 100 - 115 g/m2
    • for the inner layer shown in Fig. 2D the glue temperature shall be 200 - 205 °C and the volume of glue shall be 85 - 90 g/m2
    • for the inner layer shown in Fig. 2A and Fig. 2C the glue temperature shall be 190 - 195 °C and the volume of glue shall be 85 - 90 g/m2
  • The board is then conveyed by a turn-table 208, which rotates it by an angle of 90°, to the next cutting and milling station 209 in order to process the remaining two edges of the board, in the same way as at the station 202. Afterwards, the edges are bonded on a bonding station 210 equipped with a glue feeder 211 and a heater 212, for which the process parameters are defined in the same way as for stations 205 - 207. The bonded boards are collected on a collecting station 213.
  • The method of the present invention enables continuous monitoring of the process of bonding of board edges and adjustment of parameters of the process to a particular raw material of the chip inner layer of furniture boards. Thus, the volume of glue used in the process and the energy supplied for heating glue is optimized, which results in reduction of production costs, reduction of amount of harmful substances (glue) contained in the manufactured boards and good quality of edge bonding as well as prevention from leakage of glue from edges of boards.

Claims (3)

  1. A method for bonding edges of furniture boards comprising a chip inner layer, wherein an edge cover is bonded with the furniture board by means of a glue heated to a certain temperature, characterized in that the volume and temperature of the glue are individually adjusted for each bonded edge, depending on the parameters of the raw material of the chip inner layer determined by an analyzer of the image of the chip inner layer.
  2. The method according to claim 1, characterized in that the image of the edge of chip inner layer to be bonded is compared by the analyzer of the image of the chip inner layer with a set of reference images stored in a reference database, wherein the image which is most similar to the image of the edge of furniture to be bonded is selected, and thereafter the volume of glue and its temperature are adjusted according to data specified for the selected reference image.
  3. The method according to claim 1, characterized in that by means of the analyzer of the chip inner layer there is determined at least one parameter of the image of the edge of the chip inner layer, selected from a group containing: mean brightness of chips, mean size of chips, variations of brightness and size of particular chips, distribution of chips size, size of empty inter-chips spaces.
EP12461566.7A 2012-12-18 2012-12-18 A method for banding edges of furniture boards Not-in-force EP2746013B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ES12461566.7T ES2552740T3 (en) 2012-12-18 2012-12-18 Procedure to join edges of furniture panels
EP12461566.7A EP2746013B1 (en) 2012-12-18 2012-12-18 A method for banding edges of furniture boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12461566.7A EP2746013B1 (en) 2012-12-18 2012-12-18 A method for banding edges of furniture boards

Publications (2)

Publication Number Publication Date
EP2746013A1 EP2746013A1 (en) 2014-06-25
EP2746013B1 true EP2746013B1 (en) 2015-08-26

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EP12461566.7A Not-in-force EP2746013B1 (en) 2012-12-18 2012-12-18 A method for banding edges of furniture boards

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ES (1) ES2552740T3 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117381935B (en) * 2023-11-21 2024-04-09 广州赛志系统科技有限公司 Flexible control method and control system for edge sealing of plate and intelligent production line for flexible edge sealing

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1279290B1 (en) * 1995-04-21 1997-12-09 Media Profili Srl IMPROVED PROCEDURE FOR ENGRAVING A POOR WOOD PANEL PARTICULARLY FOR THE CREATION OF FURNISHING COMPONENTS, AND
US6122065A (en) * 1996-08-12 2000-09-19 Centre De Recherche Industrielle Du Quebec Apparatus and method for detecting surface defects
US6618492B1 (en) * 2000-06-26 2003-09-09 Georgia-Pacific Resins, Inc. System and method for measurement of adhesive resin distribution on wood flakes using a scanner

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ES2552740T3 (en) 2015-12-01
EP2746013A1 (en) 2014-06-25

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