EP2740134A1 - Polymers which can be used in p-type materials for organic electronic devices and photovoltaic cells. compounds, monomers, dimers, trimers, and polymers comprising formula (i) and/or formula (viii) are prepared - Google Patents

Polymers which can be used in p-type materials for organic electronic devices and photovoltaic cells. compounds, monomers, dimers, trimers, and polymers comprising formula (i) and/or formula (viii) are prepared

Info

Publication number
EP2740134A1
EP2740134A1 EP12735467.8A EP12735467A EP2740134A1 EP 2740134 A1 EP2740134 A1 EP 2740134A1 EP 12735467 A EP12735467 A EP 12735467A EP 2740134 A1 EP2740134 A1 EP 2740134A1
Authority
EP
European Patent Office
Prior art keywords
heat sinks
enclosure
polymers
formula
insulated switchgear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12735467.8A
Other languages
German (de)
French (fr)
Inventor
Torsten Wirz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Technology AG
Original Assignee
ABB Technology AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ABB Technology AG filed Critical ABB Technology AG
Priority to EP12735467.8A priority Critical patent/EP2740134A1/en
Publication of EP2740134A1 publication Critical patent/EP2740134A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/52—Cooling of switch parts
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
    • H01H33/60—Switches wherein the means for extinguishing or preventing the arc do not include separate means for obtaining or increasing flow of arc-extinguishing fluid
    • H01H33/66—Vacuum switches
    • H01H33/6606—Terminal arrangements
    • H01H2033/6613—Cooling arrangements directly associated with the terminal arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
    • H01H33/02—Details
    • H01H33/021—Use of solid insulating compounds resistant to the contacting fluid dielectrics and their decomposition products, e.g. to SF6
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B13/00—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle
    • H02B13/02—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle with metal casing
    • H02B13/035—Gas-insulated switchgear

Definitions

  • Gas-insulated switch gear especially SF 6 -insulated panels or switchboards
  • the invention relates to gas-insulated switch gears, especially medium voltage SF 6 - insulated panels or switchboards, comprising a gas-insulating enclosure for
  • heat sink means are provided for heat dissipation from the enclosure to the ambient.
  • the invention is especially applicable to medium voltage circuit breaker, disconnector and busbar arrangements having an enclosure which is designed as a gas-filled chamber for accommodating a pair of corresponding electrical switching contacts.
  • these substations may be configured according to different layouts depending on the applications, for example T-type layouts or HV-type layouts and are realized by using a series of electric components, such as
  • the document US 2005/0236371 A1 discloses a gas-insulated switch gear device comprising a first casing housing, a first terminal for input/output connection, a disconnector unit comprising a first fixed contact operatively coupled to said first terminal and a corresponding first movable contact which can be electrically connected or disconnected with said first fixed contact during operation of the disconnector unit.
  • a circuit breaker unit is electrically connected to said disconnector unit and comprising at least a couple of interruption contacts which can be actuated during operation of said circuit breaker unit, between a circuit breaker closed position where they are electrically coupled and a circuit breaker open position where they are electrically separated.
  • Actuating means are provided for operating said disconnector unit and said circuit breaker unit.
  • a second casing operatively coupled with said actuating means is provided, which houses said interruption contacts and on the outer surface of which at least said first movable contact is mounted.
  • metal heat sinks are integrated into the encapsulation to dissipate the heat more effectively.
  • These metal heat sinks usually consist of aluminium material and can be part of the encapsulation, having cooling fins on both sides. Alternatively the cooling fins can be also directly welded on the encapsulation. Often the cooling fins do not stick out into the compartment due to dielectric reasons. In that case the heat sink is a protuberance of the encapsulation. Usually, the heat sinks are painted black to increase the heat transfer performance.
  • Metal heat sinks of the aforementioned kind are expensive due to its complicated manufacturing process and high material investment. If they comprise a volume it has to be tested on tightness separately before assembly to the switch gear. Additionally, the sealing is a potential source of leakage. These heat sinks are heavy and therefore not easy to handle.
  • the welding of the cooling fins on the inside of the enclosure makes the enclosure bigger than it could be for the dielectrical performance.
  • the welding of heat fins on the inside of the enclosure is a laborious manufacturing process, resulting in a reduction of the insulating distance inside the enclosure.
  • the heat sink means consist of plastic material and comprises inside heat sinks and outside heat sinks arranged in opposite positions on both sides of the wall of the enclosure.
  • the invention bases on the recognition, that the main factors of heat dissipation elements are the thermal conductivity which is a material parameter, the surface area which is defined by the design and the heat transmission resistance which is influenced by surface condition or painting. Because of the low temperature difference which is available for heat dissipation of approximately 80°C inside and 40°C outside, the thermal conductivity for dissipation is not the most important factor, but the surface area. Therefore the principle of the present invention is to use plastic heat sinks for this special application which has preferably a thermal conductivity in the range between 0.1-100 W/mK. In the proposed arrangement heat sinks are attached inside and outside the gas enclosure wall. The special arrangement of the heat sinks provides the favourable effect that the heat is collected from the inside heat sink, conducted by the enclosure wall and dissipated by the outside heat sink to the ambient.
  • the heat sinks have to be attached to the wall of the enclosure in a way that the heat transfer is assured, preferably by gluing, silicon, silicon-gel or other adhesives.
  • the plastic material of the inside heat sinks and outside heat sinks according to the present invention may be electrically conductive or insulating, but preferably flexible.
  • plastic heat sinks can also be attached to a busbar which is arranged inside the enclosure in order to improve the whole heat transfer chain. If insulating plastic material is used, similar insulation capabilities are expected as in a design without any heat dissipation means.
  • Fig. 1 shows an enclosure of a gas-insulated switch gear comprising heat sink means attached to the wall
  • Fig. 2 shows an enclosure of a gas-insulated switch gear with an inner busbar on which heat sink means are positioned.
  • a gas-insulating enclosure 1 for accommodating - not shown - switching means. These switching means usually generate a high
  • heat sink means consist of a plastic material comprising of inside heat sinks 2 which directly correspond with outside heat sinks 3 arranged in opposite positions of both sides of wall 4 of the enclosure 1.
  • the inside heat sinks 2 as well as the outside heat sinks 3 are attached to the wall 4 of the enclosure 1 by gluing. Therefore, a first adhesive layer 5 is positioned between the wall 4 of the enclosure 1 and the inside heat sinks 2. Accordingly, a second adhesive layer 6 is provided between the wall 4 of the enclosure and the outside heat sinks 3.
  • an electrical busbar 7 is arranged inside an enclosure V. Further plastic heat sinks 2' and 3' are attached to the busbar 7 in a manner that the further plastic heat sinks 2' and 3' surround the busbar 7 which is coaxially arranged inside a cylindrical enclosure 1 ' forming the gas insulating chamber.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Patch Boards (AREA)

Abstract

Gas insulated switchgear, especially SF6-insulated panels or switchboards, comprising a gas insulating enclosure (1) for accommodating switching means, which generates a high temperature during operation, wherein heat sink means are provided for heat dissipation from the enclosure (1) to the ambient, wherein the heat sink means consists of plastic material and comprises inside heat sinks (2) and outside heat sinks (3) arranged in opposite positions on both sides of a wall (4) of the enclosure (1).

Description

Gas-insulated switch gear, especially SF6-insulated panels or switchboards
Field of the invention
The invention relates to gas-insulated switch gears, especially medium voltage SF6- insulated panels or switchboards, comprising a gas-insulating enclosure for
accommodating switching means, which generate a high temperature during operation, wherein heat sink means are provided for heat dissipation from the enclosure to the ambient.
The invention is especially applicable to medium voltage circuit breaker, disconnector and busbar arrangements having an enclosure which is designed as a gas-filled chamber for accommodating a pair of corresponding electrical switching contacts.
Background of the invention
Along the path of a power grid there are usually provided several electric substations for transmitting and distributing electricity from a power generating source to loads and users connected to the feeding grid. These substations may be configured according to different layouts depending on the applications, for example T-type layouts or HV-type layouts and are realized by using a series of electric components, such as
disconnectors, circuit breakers, instrument transformers and control systems.
The document US 2005/0236371 A1 discloses a gas-insulated switch gear device comprising a first casing housing, a first terminal for input/output connection, a disconnector unit comprising a first fixed contact operatively coupled to said first terminal and a corresponding first movable contact which can be electrically connected or disconnected with said first fixed contact during operation of the disconnector unit.
A circuit breaker unit is electrically connected to said disconnector unit and comprising at least a couple of interruption contacts which can be actuated during operation of said circuit breaker unit, between a circuit breaker closed position where they are electrically coupled and a circuit breaker open position where they are electrically separated. Actuating means are provided for operating said disconnector unit and said circuit breaker unit. Furthermore, a second casing operatively coupled with said actuating means is provided, which houses said interruption contacts and on the outer surface of which at least said first movable contact is mounted.
Due to industrial standards the temperature at the electrical contacts inside of gas- insulated switch gear must not exceed defined limits. To assure this, the heat inside the encapsulated gas compartments, generated by ohmic losses in current carrying elements like busbars, has to be dissipated to the ambient. The amount of heat which has to be dissipated is therefore dependent on the nominal current rating of the panel. The generated heat is emitted from the metal bars which usually consist of a copper material to the insulation gas around them and then dissipated through the
encapsulation.
For lower ratings of about up to 1250 Ampere the surface of the encapsulation is sufficient to match the required temperature limits. However, for higher ratings of more than 2500 Ampere metal heat sinks are integrated into the encapsulation to dissipate the heat more effectively. These metal heat sinks usually consist of aluminium material and can be part of the encapsulation, having cooling fins on both sides. Alternatively the cooling fins can be also directly welded on the encapsulation. Often the cooling fins do not stick out into the compartment due to dielectric reasons. In that case the heat sink is a protuberance of the encapsulation. Usually, the heat sinks are painted black to increase the heat transfer performance.
Metal heat sinks of the aforementioned kind are expensive due to its complicated manufacturing process and high material investment. If they comprise a volume it has to be tested on tightness separately before assembly to the switch gear. Additionally, the sealing is a potential source of leakage. These heat sinks are heavy and therefore not easy to handle.
The welding of the cooling fins on the inside of the enclosure makes the enclosure bigger than it could be for the dielectrical performance. The welding of heat fins on the inside of the enclosure is a laborious manufacturing process, resulting in a reduction of the insulating distance inside the enclosure.
Summary of the invention
It is an object of the invention to provide low weight heat sink means for gas-insulated switch gear with a suitable thermal conductivity which are easy to manufacture and to install on the enclosure for heat dissipation to the ambient.
This object is achieved by the subject-matter of the independent claim 1. Further exemplary embodiments are evident from the dependent claims.
According to the invention the heat sink means consist of plastic material and comprises inside heat sinks and outside heat sinks arranged in opposite positions on both sides of the wall of the enclosure.
The invention bases on the recognition, that the main factors of heat dissipation elements are the thermal conductivity which is a material parameter, the surface area which is defined by the design and the heat transmission resistance which is influenced by surface condition or painting. Because of the low temperature difference which is available for heat dissipation of approximately 80°C inside and 40°C outside, the thermal conductivity for dissipation is not the most important factor, but the surface area. Therefore the principle of the present invention is to use plastic heat sinks for this special application which has preferably a thermal conductivity in the range between 0.1-100 W/mK. In the proposed arrangement heat sinks are attached inside and outside the gas enclosure wall. The special arrangement of the heat sinks provides the favourable effect that the heat is collected from the inside heat sink, conducted by the enclosure wall and dissipated by the outside heat sink to the ambient.
The heat sinks have to be attached to the wall of the enclosure in a way that the heat transfer is assured, preferably by gluing, silicon, silicon-gel or other adhesives.
Alternatively it is also possible to clamp, screw or snap the heat sinks to the wall of the enclosure but between the heat sinks and the wall of the enclosure thermal conductive paste should be applied.
The plastic material of the inside heat sinks and outside heat sinks according to the present invention may be electrically conductive or insulating, but preferably flexible. Thus, deformation of the enclosure resulting from pressure changes caused by thermal load cycles can be compensated by deforming of the heat sinks, so no thermal gap can occur
According to another embodiment of the invention further plastic heat sinks can also be attached to a busbar which is arranged inside the enclosure in order to improve the whole heat transfer chain. If insulating plastic material is used, similar insulation capabilities are expected as in a design without any heat dissipation means.
These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described thereinafter.
Brief description of the drawings
Below, embodiments of the present invention are described in more detail with reference to the attached drawings.
Fig. 1 shows an enclosure of a gas-insulated switch gear comprising heat sink means attached to the wall, and Fig. 2 shows an enclosure of a gas-insulated switch gear with an inner busbar on which heat sink means are positioned.
The reference symbols used in the drawings, and their meanings, are listed in summary form in the list of reference symbols. In principle, identical parts are provided with the same reference symbols in the figures. All the figures are schematic.
Detailed description of the embodiments
According to Fig. 1 a gas-insulating enclosure 1 is provided for accommodating - not shown - switching means. These switching means usually generate a high
temperature during operation. In order to dissipate the generated heat from the enclosure 1 to the ambient special heat sink means are provided which consist of a plastic material comprising of inside heat sinks 2 which directly correspond with outside heat sinks 3 arranged in opposite positions of both sides of wall 4 of the enclosure 1.
The inside heat sinks 2 as well as the outside heat sinks 3 are attached to the wall 4 of the enclosure 1 by gluing. Therefore, a first adhesive layer 5 is positioned between the wall 4 of the enclosure 1 and the inside heat sinks 2. Accordingly, a second adhesive layer 6 is provided between the wall 4 of the enclosure and the outside heat sinks 3.
According to Fig. 2 inside an enclosure V an electrical busbar 7 is arranged. Further plastic heat sinks 2' and 3' are attached to the busbar 7 in a manner that the further plastic heat sinks 2' and 3' surround the busbar 7 which is coaxially arranged inside a cylindrical enclosure 1 ' forming the gas insulating chamber.
While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the invention is not limited to the disclosed
embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art and practising the claimed invention, from the study of the drawings, the disclosure, and the appended claims.
Reference symbols
1 Enclosure
2 Inside heat sink 3 Outside heat sink
4 Wall
5 First adhesive layer
6 Second adhesive layer
7 Busbar

Claims

Patent Claims
1. Gas insulated switchgear, especially SF6-insulated panels or switch- and conducting boards, comprising a gas insulating enclosure (1 ) for accommodating switching and/or conduction means, which generates a high temperature during operation, wherein heat sink means are provided for heat dissipation from the enclosure (1 ) to the ambient,
characterized in that the heat sink means consists of plastic material and comprises inside heat sinks (2) and outside heat sinks (3) arranged in opposite positions on both sides of a wall (4) of the enclosure (1 ).
2. Gas insulated switchgear according to Claim 1 ,
characterized in that the thermal conductivity of the plastic heat sinks (2, 3) is in the range between 0,1 to 100 W/mK.
3. Gas insulated switchgear according to Claim 1 ,
characterized in that the inside heat sinks (2) and the outside heat sinks (3) are attached to the wall (4) of the enclosure (1 ) by gluing.
4. Gas insulated switchgear according to Claim 1 ,
characterized in that the inside heat sinks (2) and the outside heat sinks (3) are attached to the wall (4) of the enclosure (1 ) by clamping, srewing or snaping, wherein a thermal conduction is provided between the wall (4) and the inside heat sinks (2) and the outside heat sinks (3) respectively.
5. Gas insulated switchgear according to Claim 1 ,
characterized in that the plastic material of the inside heat sinks (2) and the outside heat sinks (3) is flexible, in order to compensate deformation of the enclosure (1 ).
6. Gas insulated switchgear according to Claim 1 ,
characterized in that a further plastic heat sink (2', 3') is attached to a switching or conducting means arranged inside the enclosure (1').
7. Gas insulated switchgear according to Claim 1 ,
characterized in that the further plastic heat sinks (2', 3') surround the busbar (7) or are are attached there.
EP12735467.8A 2011-07-16 2012-07-12 Polymers which can be used in p-type materials for organic electronic devices and photovoltaic cells. compounds, monomers, dimers, trimers, and polymers comprising formula (i) and/or formula (viii) are prepared Withdrawn EP2740134A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP12735467.8A EP2740134A1 (en) 2011-07-16 2012-07-12 Polymers which can be used in p-type materials for organic electronic devices and photovoltaic cells. compounds, monomers, dimers, trimers, and polymers comprising formula (i) and/or formula (viii) are prepared

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11005845A EP2549500A1 (en) 2011-07-16 2011-07-16 Gas-insulated switch gear, especially SF6-insulated panels or switchboards
EP12735467.8A EP2740134A1 (en) 2011-07-16 2012-07-12 Polymers which can be used in p-type materials for organic electronic devices and photovoltaic cells. compounds, monomers, dimers, trimers, and polymers comprising formula (i) and/or formula (viii) are prepared
PCT/EP2012/002937 WO2013010651A1 (en) 2011-07-16 2012-07-12 Gas-insulated switch gear, especially sf6-insulated panels or switchboards

Publications (1)

Publication Number Publication Date
EP2740134A1 true EP2740134A1 (en) 2014-06-11

Family

ID=45002204

Family Applications (2)

Application Number Title Priority Date Filing Date
EP11005845A Withdrawn EP2549500A1 (en) 2011-07-16 2011-07-16 Gas-insulated switch gear, especially SF6-insulated panels or switchboards
EP12735467.8A Withdrawn EP2740134A1 (en) 2011-07-16 2012-07-12 Polymers which can be used in p-type materials for organic electronic devices and photovoltaic cells. compounds, monomers, dimers, trimers, and polymers comprising formula (i) and/or formula (viii) are prepared

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP11005845A Withdrawn EP2549500A1 (en) 2011-07-16 2011-07-16 Gas-insulated switch gear, especially SF6-insulated panels or switchboards

Country Status (3)

Country Link
EP (2) EP2549500A1 (en)
CN (1) CN103748649A (en)
WO (1) WO2013010651A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3859914A1 (en) * 2020-01-29 2021-08-04 ABB Schweiz AG Compartment for a medium voltage air or gas insulated switchgear

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3621108A (en) * 1970-01-21 1971-11-16 Westinghouse Electric Corp Heat-conducting fins for bus bars and other electrical conductors
EP1403891B2 (en) * 2002-09-24 2016-09-28 ABB Schweiz AG Circuit breaker
DE50304860D1 (en) * 2003-07-11 2006-10-12 Abb Research Ltd High-performance switch with cooling rib arrangement
US7250583B2 (en) 2004-04-19 2007-07-31 Abb Technology Ag Gas-insulated switchgear device
ATE441196T1 (en) * 2004-11-16 2009-09-15 Abb Research Ltd HIGH VOLTAGE POWER SWITCH WITH COOLING
CN101641756A (en) * 2007-03-28 2010-02-03 西门子公司 Electric switching device
DE102007061338A1 (en) * 2007-12-17 2009-04-23 Siemens Aktiengesellschaft Switching device and/or protection device e.g. low-voltage circuit-breaker, for switching electric current, has switching and/or protection and mechanical stabilization and/or heat dissipation element including carbon nanotube
EP2139016A1 (en) * 2008-06-24 2009-12-30 ABB Technology AG Pole part of a medium-voltage or high-voltage switchgear assembly, and method for its production
CN201732854U (en) * 2010-06-12 2011-02-02 湖南丰日电源电气股份有限公司 Valve regulated lead acid battery for solar energy storage

Non-Patent Citations (1)

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Title
See references of WO2013010651A1 *

Also Published As

Publication number Publication date
CN103748649A (en) 2014-04-23
EP2549500A1 (en) 2013-01-23
WO2013010651A1 (en) 2013-01-24

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