Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
  • H01H9/52—Cooling of switch parts
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
  • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
  • H02B1/56—Cooling; Ventilation
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
  • H01H33/60—Switches wherein the means for extinguishing or preventing the arc do not include separate means for obtaining or increasing flow of arc-extinguishing fluid
  • H01H33/66—Vacuum switches
  • H01H33/6606—Terminal arrangements
  • H01H2033/6613—Cooling arrangements directly associated with the terminal arrangements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
  • H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
  • H01H33/02—Details
  • H01H33/021—Use of solid insulating compounds resistant to the contacting fluid dielectrics and their decomposition products, e.g. to SF6
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
  • H02B13/00—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle
  • H02B13/02—Arrangement of switchgear in which switches are enclosed in, or structurally associated with, a casing, e.g. cubicle with metal casing
  • H02B13/035—Gas-insulated switchgear

Definitions

• Gas-insulated switch gear especially SF 6 -insulated panels or switchboards
• the invention relates to gas-insulated switch gears, especially medium voltage SF 6 - insulated panels or switchboards, comprising a gas-insulating enclosure for
• heat sink means are provided for heat dissipation from the enclosure to the ambient.
• the invention is especially applicable to medium voltage circuit breaker, disconnector and busbar arrangements having an enclosure which is designed as a gas-filled chamber for accommodating a pair of corresponding electrical switching contacts.
• these substations may be configured according to different layouts depending on the applications, for example T-type layouts or HV-type layouts and are realized by using a series of electric components, such as
• the document US 2005/0236371 A1 discloses a gas-insulated switch gear device comprising a first casing housing, a first terminal for input/output connection, a disconnector unit comprising a first fixed contact operatively coupled to said first terminal and a corresponding first movable contact which can be electrically connected or disconnected with said first fixed contact during operation of the disconnector unit.
• a circuit breaker unit is electrically connected to said disconnector unit and comprising at least a couple of interruption contacts which can be actuated during operation of said circuit breaker unit, between a circuit breaker closed position where they are electrically coupled and a circuit breaker open position where they are electrically separated.
• Actuating means are provided for operating said disconnector unit and said circuit breaker unit.
• a second casing operatively coupled with said actuating means is provided, which houses said interruption contacts and on the outer surface of which at least said first movable contact is mounted.
• metal heat sinks are integrated into the encapsulation to dissipate the heat more effectively.
• These metal heat sinks usually consist of aluminium material and can be part of the encapsulation, having cooling fins on both sides. Alternatively the cooling fins can be also directly welded on the encapsulation. Often the cooling fins do not stick out into the compartment due to dielectric reasons. In that case the heat sink is a protuberance of the encapsulation. Usually, the heat sinks are painted black to increase the heat transfer performance.
• Metal heat sinks of the aforementioned kind are expensive due to its complicated manufacturing process and high material investment. If they comprise a volume it has to be tested on tightness separately before assembly to the switch gear. Additionally, the sealing is a potential source of leakage. These heat sinks are heavy and therefore not easy to handle.
• the welding of the cooling fins on the inside of the enclosure makes the enclosure bigger than it could be for the dielectrical performance.
• the welding of heat fins on the inside of the enclosure is a laborious manufacturing process, resulting in a reduction of the insulating distance inside the enclosure.
• the heat sink means consist of plastic material and comprises inside heat sinks and outside heat sinks arranged in opposite positions on both sides of the wall of the enclosure.
• the invention bases on the recognition, that the main factors of heat dissipation elements are the thermal conductivity which is a material parameter, the surface area which is defined by the design and the heat transmission resistance which is influenced by surface condition or painting. Because of the low temperature difference which is available for heat dissipation of approximately 80°C inside and 40°C outside, the thermal conductivity for dissipation is not the most important factor, but the surface area. Therefore the principle of the present invention is to use plastic heat sinks for this special application which has preferably a thermal conductivity in the range between 0.1-100 W/mK. In the proposed arrangement heat sinks are attached inside and outside the gas enclosure wall. The special arrangement of the heat sinks provides the favourable effect that the heat is collected from the inside heat sink, conducted by the enclosure wall and dissipated by the outside heat sink to the ambient.
• the heat sinks have to be attached to the wall of the enclosure in a way that the heat transfer is assured, preferably by gluing, silicon, silicon-gel or other adhesives.
• the plastic material of the inside heat sinks and outside heat sinks according to the present invention may be electrically conductive or insulating, but preferably flexible.
• plastic heat sinks can also be attached to a busbar which is arranged inside the enclosure in order to improve the whole heat transfer chain. If insulating plastic material is used, similar insulation capabilities are expected as in a design without any heat dissipation means.
• Fig. 1 shows an enclosure of a gas-insulated switch gear comprising heat sink means attached to the wall
• Fig. 2 shows an enclosure of a gas-insulated switch gear with an inner busbar on which heat sink means are positioned.
• a gas-insulating enclosure 1 for accommodating - not shown - switching means. These switching means usually generate a high
• heat sink means consist of a plastic material comprising of inside heat sinks 2 which directly correspond with outside heat sinks 3 arranged in opposite positions of both sides of wall 4 of the enclosure 1.
• the inside heat sinks 2 as well as the outside heat sinks 3 are attached to the wall 4 of the enclosure 1 by gluing. Therefore, a first adhesive layer 5 is positioned between the wall 4 of the enclosure 1 and the inside heat sinks 2. Accordingly, a second adhesive layer 6 is provided between the wall 4 of the enclosure and the outside heat sinks 3.
• an electrical busbar 7 is arranged inside an enclosure V. Further plastic heat sinks 2' and 3' are attached to the busbar 7 in a manner that the further plastic heat sinks 2' and 3' surround the busbar 7 which is coaxially arranged inside a cylindrical enclosure 1 ' forming the gas insulating chamber.

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• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Patch Boards (AREA)

Priority Applications (1)

Applications Claiming Priority (3)

Publications (1)

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ID=45002204

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Family Applications Before (1)

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Family Cites Families (9)

• 2011
  • 2011-07-16 EP EP11005845A patent/EP2549500A1/de not_active Withdrawn
• 2012
  • 2012-07-12 WO PCT/EP2012/002937 patent/WO2013010651A1/en not_active Ceased
  • 2012-07-12 EP EP12735467.8A patent/EP2740134A1/de not_active Withdrawn
  • 2012-07-12 CN CN201280035238.7A patent/CN103748649A/zh active Pending

Non-Patent Citations (1)

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