EP2721342B1 - Lighting device - Google Patents
Lighting device Download PDFInfo
- Publication number
- EP2721342B1 EP2721342B1 EP12727372.0A EP12727372A EP2721342B1 EP 2721342 B1 EP2721342 B1 EP 2721342B1 EP 12727372 A EP12727372 A EP 12727372A EP 2721342 B1 EP2721342 B1 EP 2721342B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- printed circuit
- lighting device
- heat
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to a lighting device according to the preamble of claim 1.
- the invention relates to a lighting device with at least one, arranged on a circuit board lamp and a heat sink having a heat input surface, which is connected in a thermally conductive surface with the circuit board.
- the illumination device has an elongate heat sink, which has a flat heat coupling surface, which is heat conductively connected to a side facing away from the light emitting diode opposite rear side surface of the circuit board.
- the heat sink is designed as an air guide body, which has lateral openings for the passage of cooling air. The loss of heat occurring during operation of the illumination device in the LED is first transmitted from the light emitting diode through the front of the circuit board in the circuit board, penetrates this and is then coupled through the back surface of the circuit board in the heat input surface of the heat sink in this.
- the heat sink then transfers the heat to the cooling air flowing through its openings.
- the circuit board is connected to the heat sink is in the DE 20 2009 001475 U1 not revealed.
- Common are mechanical fasteners, such as screws, or a cohesive connection, which is made possible by an adhesive layer located between the back surface of the circuit board and the heat input surface of the heat sink.
- a connection is relatively complex, since the required items (screws, glue) stockpiled and must be mounted.
- Unfavorable is also that between the back surface of the circuit board and the heat input surface of the heat sink, a relatively large thermal resistance is present, which limits the cooling of the light emitting diode.
- DE 10 2008 052 869 A1 describes an LED street lamp with a base body having a double convex curved inside. On this two-fold convex curved inside correspondingly curved mounting rails are arranged. In the mounting rails flexible strip-shaped circuit boards are inserted, which are curved accordingly. On the circuit boards LEDs with housings and reflectors are arranged so that the light distribution of the LED street light is determined by the double curvature of the inside of the body. The printed circuit boards should lie flat against the mounting rails in order to achieve good heat transfer from the printed circuit boards to the mounting rails. For this purpose, the housing of the LEDs are fastened with spring clips on the mounting rails. As a result, the circuit boards are only selectively pressed against the corresponding mounting rails.
- Rigid circuit boards typically have at least one layer of fiber reinforced plastic, e.g. from impregnated with epoxy resin glass fibers, or cheaper phenol resin impregnated paper.
- flexible circuit boards are based on foils, e.g. made of polyimide films. Flexible printed circuit boards can be bent or rolled up without significant effort.
- the invention is based on the observation that the heat transfer of boards of the lighting devices according to the prior art are either structurally complex or that the heat transfer is unsatisfactory.
- US 2010/0328947 A1 discloses a light band with a profile as a support and réelleableit Economics.
- the profile is U-shaped, with the two side legs projecting beyond the center leg in such a way that the corresponding projections each form an edge facing the center leg of a respective longitudinal groove.
- a flexible printed circuit board equipped with LEDs is used, so that the flexible printed circuit board rests flat on the center leg and is supported on the supernatants.
- the middle leg may have a flat or a curved contact surface for the flexible printed circuit board.
- WO 2009/128005 and US Pat. No. 7,182,627 B1 each disclose a lighting device with a heat sink, which has a plane heat coupling surface, on which a board equipped with LEDs is mounted flat by means of fastening elements.
- the fastening element is soldered to a heat-conducting layer of the board to improve the heat dissipation.
- US Pat. No. 7,182,627 B1 however, the board is clamped together with a fixing plate between the heat sink and a cover by means of screws.
- the illumination device has at least one rigid printed circuit board with at least one luminous means arranged thereon, e.g. at least one LED.
- the circuit board is connected areally with a heat input surface of the heat sink.
- the heat input surface of the heat sink is curved and the circuit board is clamped by means of connecting elements with the heat sink so that the circuit board against a restoring force, preferably against the restoring force of the circuit board, is pressed flat against the heat input surface of the heat sink. Consequently, the printed circuit board is preferably pressed surface against the curved heat input surface of the heat sink against a force counteracting its elastic deformation. As a result, the printed circuit board is uniformly pressed against the heat input surface. Thus, an optimal and uniform heat transfer is possible. Of course, to achieve this effect, the circuit board does not have to be directly adjacent to the heat interface.
- the intermediate layer may be plastic, e.g. to compensate for bumps.
- the printed circuit board is pressed by this tension over the heat input surface of the heat sink largely uniformly to the heat sink, whereby a good heat dissipation of the heat loss occurring in the lamp is made possible in the heat sink. Since the circuit board is clamped to the heat sink, additional fasteners which pass through the circuit board and / or cohesively with the heat sink connect, be saved. The lighting device is therefore inexpensive to produce.
- the heat input surface has a cylindrical curvature, which results in the commercially available "rigid" circuit boards with a constant thickness at least approximately constant contact pressure when the circuit board is pressed radially at their ends.
- the heat input surface is therefore preferably curved preferably constant in one direction only.
- the curvature may be a circular cylindrical curvature or reject the circular shape.
- the curvature in its entirety or in sections may have an approximately elliptical or exponential profile.
- the curved heat input surface for example, therefore preferably has the shape of a column segment of a column with a cylindrical or elliptical base.
- the curvature of the flexible board is determined by the light distribution to be achieved. According to the invention, however, the curvature serves only to achieve a uniform contact of the printed circuit board with the heat input surface of the heat sink.
- the printed circuit board is therefore preferably still "quasi-flat", i. only minimally curved.
- the change in the tangent angle of the curvature is preferably less than 1 ° / cm, more preferably less than 0.5 ° / cm.
- the illumination device can be very flat.
- such a small curvature is sufficient to ensure a uniform flat fitting of the rigid printed circuit board.
- the light distribution is not perceptibly influenced by such a small curvature.
- the heat input surface preferably has a convex curvature.
- the connecting elements which clamp the heat sink to the circuit board, can then be arranged on the edge of the heat sink.
- the illumination device has an optical system having at least one reflector and / or a lens for guiding the light emitted by the at least one luminous means, and if the printed circuit board is clamped between the optics and the heat sink.
- the lighting device can thereby be inexpensively and easily assembled during their production.
- the tensioned via the connecting elements with the heat sink optics acts as a mechanical spring, which presses the circuit board areally to the heat input surface of the heat sink. As a result, a good heat-conducting connection between the circuit board and the heat sink is achieved.
- the optics centering elements which cooperate with matching centering counterparts of the circuit board.
- the printed circuit board and the at least one lighting means located thereon are then positioned in the correct position after being mounted on the optics.
- the centering elements are preferably designed as projections and the centering counterparts as matching openings.
- the centering elements are formed as openings and the centering counterparts as matching projections.
- the projections taper from their foot to their free end. As a result, a still simple installation of the lighting device is made possible.
- the centering elements are preferably formed dome-shaped.
- a plurality of bulbs arranged in a row next to each other on the circuit board, the optics having a plurality of abutment points, which are arranged in the extension direction of the row of lamps behind each other and spaced from each other by gaps, wherein the abutment points come to rest on the circuit board, wherein the lighting means are provided at the intermediate spaces, and wherein the connecting elements are arranged transversely to the extension direction of the lamp row on both sides of the abutment points.
- the optics has a plurality of bridge parts which extend transversely to the row of the lighting means, wherein the abutment points are arranged on the bridge parts at a distance from the bridge ends thereof.
- the circuit board can be even better pressed flat against the heat sink.
- a plurality of lighting means are arranged in a row next to each other on the circuit board, wherein the lighting means are positioned at the height of the most prominent point of the convex curvature.
- An in Fig. 1 as a whole designated 1 lighting device has as light source 2 a plurality of light-emitting diodes, which are arranged on a printed circuit board 3 in a row next to each other.
- the circuit board 3 extends in the undeflected rest position in a plane.
- the printed circuit board 3 is connected in a heat-conducting manner to a heat sink 4, which consists of a good heat-conducting material, for example aluminum.
- the lighting means 2 are arranged on the front side of the printed circuit board 3. With its rear side facing away from the light sources 2, the printed circuit board 3 lies flat against a heat input surface 5 of the heat sink 4. The heat loss occurring in the bulbs 2 is first transmitted from the bulbs 2 on the circuit board and then through the circuit board and introduced into the heat input surface 5 of the heat sink 4.
- the heat sink 4 has on its side facing away from the heat input surface 5 front cooling fins 6, via which the heat loss is dissipated to the ambient air.
- the heat input surface 5 of the heat sink 4 has a convex, approximately cylindrical curvature whose most prominent position is arranged approximately centrally to the circuit board 3.
- the cylinder axis of curvature is normal to the plane in Fig. 1 arranged and runs above the heat sink 4.
- cross-sectional plane extends the heat input surface 5, starting from the left edge of the circuit board 3 to the center of the circuit board 3 towards something down and in the course of the middle to the right edge of the circuit board 3 back up slightly.
- the illumination device For directing and bundling the light emitted by the light sources 2, the illumination device has an optical system 7 which has a housing part the plurality, in the drawing, not shown, light-deflecting optical elements are provided which are arranged in the emission of the light emitting means 2.
- Fig. 1 In Fig. 1 can be seen that the circuit board 3 is clamped by means of connecting elements 8 between the optics 7 and the heat sink 4 that the optics 7 against the restoring force of their material at a plurality of spaced abutment point 9 on the front of the circuit board 3 comes to rest and the Printed circuit board 3 between the optics 7 and the heat sink 4 is clamped.
- the connecting elements 8 pass through openings of the heat sink and are anchored in the optic 7.
- the connecting elements 8 are arranged next to the printed circuit board 3.
- the connecting elements 8 At their end remote from the optics 7, the connecting elements 8 have a broadening which overlaps the edge area of the passage opening of the heat sink.
- the connecting elements 8 may be screws, for example.
- the abutment points 9 are the most prominent point of the convex cylindrical curvature of the heat input surface 5 opposite. Due to the restoring or spring force of the optics 7, the printed circuit board 3 is pressed flat against the heat input surface 5 with its rear side. This results in a low thermal resistance between the printed circuit board 3 and the heat sink 4 at the heat input surface 5.
- the optical system 7 has a plurality of domed or frustoconical centering elements 10, each of which passes through a matching opening of the printed circuit board 3 ( Fig. 1 ).
- the centering elements 10 are slightly conical and taper, starting from their foot to their free end.
- the optics 7 has a plurality of adjacently disposed abutment points 9 in a row, and that adjacent to each other adjacent abutment points 9 are each spaced apart by a gap 11.
- a respective illuminant is arranged approximately centrally between the abutment points 9 adjoining the intermediate space 11.
- the interspaces 11 are each configured as a wall breakthrough.
- the optics 7 has a plurality of bridge-shaped bridge parts 12 which extend transversely to the row of lamps and are anchored at their bridge ends to housing edge regions which run approximately parallel to the row of lamps.
- the abutment points 9 are arranged approximately centrally between the bridge ends.
- Fig. 1 It can be seen that the bridge parts 12 in the longitudinal direction have an approximately W-shaped course and are anchored to the ends of the two outer W-legs with the housing edge regions.
- the abutment site 9 is located at the ends of the inner W-legs remote from the outer W-legs.
- the bridge portions 12 between the abutment point 9 and the bridge ends each have a deviating from a straight line course.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Description
Die Erfindung betrifft eine Beleuchtungseinrichtung nach dem Oberbegriff des Anspruchs 1. Insbesondere betrifft die Erfindung eine Beleuchtungseinrichtung mit mindestens einem, auf einer Leiterplatte angeordneten Leuchtmittel und einem Kühlkörper, der eine Wärmeeinkoppelfläche aufweist, die flächig wärmeleitend mit der Leiterplatte verbunden ist.The invention relates to a lighting device according to the preamble of
Man unterscheidet zwischen den üblichen starren oder festen Leiterplatten und sogenannten flexiblen Leiterplatten. Starre Leiterplatten haben in der Regel wenigstens eine Schicht aus einem faserverstärkten Kunststoff, z.B. aus mit Epoxidharz getränkten Glasfasern, oder günstiger aus Phenolharz getränktem Papier. Flexible Leiterplatten hingegen basieren auf Folien, z.B. aus Polyimid-Folien. Flexible Leiterplatten lassen sich ohne nennenswerten Kraftaufwand biegen oder einrollen.One distinguishes between the usual rigid or solid printed circuit boards and so-called flexible printed circuit boards. Rigid circuit boards typically have at least one layer of fiber reinforced plastic, e.g. from impregnated with epoxy resin glass fibers, or cheaper phenol resin impregnated paper. On the other hand, flexible circuit boards are based on foils, e.g. made of polyimide films. Flexible printed circuit boards can be bent or rolled up without significant effort.
Die Erfindung beruht auf der Beobachtung, dass die Wärmeübertragung von Platinen der Beleuchtungseinrichtungen nach dem Stand der Technik entweder konstruktiv aufwendig sind oder dass der Wärmeübertrag unbefriedigend ist.The invention is based on the observation that the heat transfer of boards of the lighting devices according to the prior art are either structurally complex or that the heat transfer is unsatisfactory.
Es besteht deshalb die Aufgabe, eine Beleuchtungseinrichtung der eingangs genannten Art zu schaffen, die bei einem einfachen und kostengünstigen Aufbau eine wirksame Kühlung des Leuchtmittels ermöglicht.It is therefore an object to provide a lighting device of the type mentioned, which allows for a simple and inexpensive construction effective cooling of the bulb.
Diese Aufgabe wird dadurch gelöst, dass die Beleuchtungseinrichtung mindestens eine starre Leiterplatte mit wenigstens einem darauf angeordneten Leuchtmittel, z.B. wenigstens eine LED, aufweist. Die Leiterplatte ist flächig mit einer Wärmeeinkoppelfläche des Kühlkörpers verbunden. Die Wärmeeinkoppelfläche des Kühlkörpers ist gekrümmt und die Leiterplatte ist mit Hilfe von Verbindungselementen mit dem Kühlkörper verspannt so dass die Leiterplatte gegen eine Rückstellkraft, bevorzugt gegen die Rückstellkraft der Leiterplatte, flächig an die Wärmeeinkoppelfläche des Kühlkörpers angedrückt wird. Folglich wird die Leiterplatte bevorzugt gegen eine ihrer elastischen Verformung entgegenwirkenden Kraft flächig an die gekrümmte Wärmeeinkoppelfläche des Kühlkörpers angedrückt. Dadurch liegt die Leiterplatte gleichmäßig flächig angedrückt an der Wärmeeinkoppelfläche an. Somit wird eine optimale und gleichmäßige Wärmeübertragung ermöglicht. Natürlich muss die Leiterplatte um diesen Effekt zu erreichen nicht unmittelbar an der Wärmeeinkopplefläche anliegen.This object is achieved in that the illumination device has at least one rigid printed circuit board with at least one luminous means arranged thereon, e.g. at least one LED. The circuit board is connected areally with a heat input surface of the heat sink. The heat input surface of the heat sink is curved and the circuit board is clamped by means of connecting elements with the heat sink so that the circuit board against a restoring force, preferably against the restoring force of the circuit board, is pressed flat against the heat input surface of the heat sink. Consequently, the printed circuit board is preferably pressed surface against the curved heat input surface of the heat sink against a force counteracting its elastic deformation. As a result, the printed circuit board is uniformly pressed against the heat input surface. Thus, an optimal and uniform heat transfer is possible. Of course, to achieve this effect, the circuit board does not have to be directly adjacent to the heat interface.
Zwischen dem Kühlkörper und der Leiterplatte kann z.B. eine bevorzugt elektrisch isolierende aber thermisch gut leitende Zwischenschicht angeordnet sein. Die Zwischenschicht kann plastisch sein, z.B. um Unebenheiten auszugleichen.Between the heat sink and the circuit board, e.g. a preferably electrically insulating but thermally well conductive intermediate layer may be arranged. The intermediate layer may be plastic, e.g. to compensate for bumps.
In vorteilhafter Weise wird die Leiterplatte durch diese Verspannung über die Wärmeeinkoppelfläche des Kühlkörpers weitgehend gleichmäßig an den Kühlkörper angedrückt, wodurch eine gute Wärmeableitung der in dem Leuchtmittel auftretenden Verlustwärme in den Kühlkörper ermöglicht wird. Da die Leiterplatte mit dem Kühlkörper verspannt ist, können zusätzliche Befestigungselemente, welche die Leiterplatte durchsetzen und/oder stoffschlüssig mit dem Kühlkörper verbinden, eingespart werden. Die Beleuchtungseinrichtung ist daher kostengünstig herstellbar.Advantageously, the printed circuit board is pressed by this tension over the heat input surface of the heat sink largely uniformly to the heat sink, whereby a good heat dissipation of the heat loss occurring in the lamp is made possible in the heat sink. Since the circuit board is clamped to the heat sink, additional fasteners which pass through the circuit board and / or cohesively with the heat sink connect, be saved. The lighting device is therefore inexpensive to produce.
Bei einer zweckmäßigen Ausgestaltung weist die Wärmeeinkoppelfläche eine zylindrische Krümmung auf, das ergibt bei den handelsüblichen "starren" Leiterplatten mit einer konstanten Dicke einen zumindest in etwa konstanten Anpressdruck, wenn die Leiterplatte an ihren Enden radial angedrückt wird. Die Wärmeeinkoppelfläche ist also bevorzugt nur in einer Richtung bevorzugt konstant gekrümmt. Die Krümmung kann eine kreiszylindrische Krümmung sein oder von der Kreisform abweisen. Insbesondere kann die Krümmung insgesamt oder abschnittweise einen etwa elliptischen oder exponentiellen Verlauf aufweisen. Die gekrümmte Wärmeeinkoppelfläche hat daher beispielsweise bevorzugt die Form eines Säulensegments einer Säule mit einer zylindrischen oder elliptischen Grundfläche.In an expedient embodiment, the heat input surface has a cylindrical curvature, which results in the commercially available "rigid" circuit boards with a constant thickness at least approximately constant contact pressure when the circuit board is pressed radially at their ends. The heat input surface is therefore preferably curved preferably constant in one direction only. The curvature may be a circular cylindrical curvature or reject the circular shape. In particular, the curvature in its entirety or in sections may have an approximately elliptical or exponential profile. The curved heat input surface, for example, therefore preferably has the shape of a column segment of a column with a cylindrical or elliptical base.
Es genügt eine im Vergleich zum Stand der Technik sehr geringe Krümmung. Nach dem Stand der Technik ist die Krümmung der flexiblen Platine durch die zu erreichende Lichtverteilung bestimmt. Nach der Erfindung jedoch dient die Krümmung nur dazu ein gleichmäßiges Anliegen der Leiterplatte an der Wärmeeinkoppelfläche des Kühlkörpers zu erreichen. Die Leiterplatte ist daher bevorzugt noch "quasi plan", d.h. nur minimal gekrümmt. Die Änderung des Tangentenwinkels der Krümmung ist bevorzugt kleiner als 1°/cm, besonders bevorzugt kleiner als 0,5°/cm. Dadurch kann die Beleuchtungseinrichtung sehr flach ausfallen. Zudem genügt solch eine geringe Krümmung, um ein gleichmäßiges flächiges Anliegend der starren Leiterplatte zur Sicherzustellen. Gleichzeitig wird durch eine solch geringe Krümmung die Lichtverteilung nicht wahrnehmbar beeinflusst.It is sufficient in comparison to the prior art very low curvature. According to the prior art, the curvature of the flexible board is determined by the light distribution to be achieved. According to the invention, however, the curvature serves only to achieve a uniform contact of the printed circuit board with the heat input surface of the heat sink. The printed circuit board is therefore preferably still "quasi-flat", i. only minimally curved. The change in the tangent angle of the curvature is preferably less than 1 ° / cm, more preferably less than 0.5 ° / cm. As a result, the illumination device can be very flat. In addition, such a small curvature is sufficient to ensure a uniform flat fitting of the rigid printed circuit board. At the same time, the light distribution is not perceptibly influenced by such a small curvature.
Bevorzugt weist die Wärmeeinkoppelfläche eine konvexe Krümmung auf. Die Verbindungselemente, welche den Kühlkörper mit der Leiterplatte verspannen, können dann am Rand des Kühlkörpers angeordnet sein.The heat input surface preferably has a convex curvature. The connecting elements, which clamp the heat sink to the circuit board, can then be arranged on the edge of the heat sink.
Besonders vorteilhaft ist, wenn die Beleuchtungseinrichtung eine mindestens einen Reflektor und/oder eine Linse aufweisende Optik zur Lenkung des von dem wenigstens einen Leuchtmittel ausgesendeten Lichts aufweist, und wenn die Leiterplatte zwischen der Optik und dem Kühlkörper eingespannt ist. Die Beleuchtungseinrichtung lässt sich dadurch bei ihrer Herstellung kostengünstig und auf einfache Weise montieren. Die über die Verbindungselemente mit dem Kühlkörper verspannte Optik wirkt wie eine mechanische Feder, welche die Leiterplatte flächig an die Wärmeeinkoppelfläche des Kühlkörpers anpresst. Dadurch wird eine gut wärmeleitende Verbindung zwischen der Leiterplatte und dem Kühlkörper erreicht.It is particularly advantageous if the illumination device has an optical system having at least one reflector and / or a lens for guiding the light emitted by the at least one luminous means, and if the printed circuit board is clamped between the optics and the heat sink. The lighting device can thereby be inexpensively and easily assembled during their production. The tensioned via the connecting elements with the heat sink optics acts as a mechanical spring, which presses the circuit board areally to the heat input surface of the heat sink. As a result, a good heat-conducting connection between the circuit board and the heat sink is achieved.
Bei einer bevorzugten Ausführungsform der Erfindung weist die Optik Zentrierelemente auf, die mit dazu passenden Zentriergegenstücken der Leiterplatte zusammenwirken. Die Leiterplatte und das mindestens eine darauf befindliche Leuchtmittel sind dann nach ihrer Montage lagerichtig an der Optik positioniert. Die Zentrierelemente sind bevorzugt als Vorsprünge und die Zentriergegenstücke als dazu passende Öffnungen ausgestaltet. Selbstverständlich ist auch eine umgekehrte Anordnung möglich, bei welcher die Zentrierelemente als Öffnungen und die Zentriergegenstücke als dazu passende Vorsprünge ausgebildet sind.In a preferred embodiment of the invention, the optics centering elements which cooperate with matching centering counterparts of the circuit board. The printed circuit board and the at least one lighting means located thereon are then positioned in the correct position after being mounted on the optics. The centering elements are preferably designed as projections and the centering counterparts as matching openings. Of course, a reverse arrangement is possible in which the centering elements are formed as openings and the centering counterparts as matching projections.
Zweckmäßigerweise verjüngen sich die Vorsprünge ausgehend von ihrem Fuß zu ihrem freien Ende hin. Dadurch wird eine noch einfache Montage der Beleuchtungseinrichtung ermöglicht. Die Zentrierelemente sind bevorzugt domförmig ausgebildet.Conveniently, the projections taper from their foot to their free end. As a result, a still simple installation of the lighting device is made possible. The centering elements are preferably formed dome-shaped.
Bei einer bevorzugten Ausgestaltung sind auf der Leiterplatte mehrere Leuchtmittel in einer Reihe nebeneinander angeordnet, wobei die Optik mehrere Widerlagerstellen aufweist, die in Erstreckungsrichtung der Leuchtmittelreihe hintereinander angeordnet und durch Zwischenräume voneinander beabstandet sind, wobei die Widerlagerstellen an der Leiterplatte zur Anlage kommen, wobei die Leuchtmittel an den Zwischenräumen vorgesehen sind, und wobei die Verbindungselemente quer zur Erstreckungsrichtung der Leuchtmittelreihe beidseits der Widerlagerstellen angeordnet sind. Dadurch ergibt sich eine längliche Beleuchtungseinrichtung, bei der die Leiterplatte entlang der Leuchtmittelreihe jeweils benachbart zu den einzelnen Leuchtmitteln an die Wärmeeinkoppelfläche des Kühlkörpers angepresst wird. Somit ist die Leiterplatte über ihre gesamte Länge gut wärmeleitend mit dem Kühlkörper verbunden.In a preferred embodiment, a plurality of bulbs arranged in a row next to each other on the circuit board, the optics having a plurality of abutment points, which are arranged in the extension direction of the row of lamps behind each other and spaced from each other by gaps, wherein the abutment points come to rest on the circuit board, wherein the lighting means are provided at the intermediate spaces, and wherein the connecting elements are arranged transversely to the extension direction of the lamp row on both sides of the abutment points. This results in an elongated illumination device, in which the printed circuit board is pressed against the heat input surface of the heat sink along the row of light sources adjacent to the individual light sources. Thus, the circuit board is connected over its entire length good thermal conductivity with the heat sink.
Vorteilhaft ist, wenn die Optik mehrere Brückenteile aufweist, die sich quer zur Reihe der Leuchtmittel erstrecken, wobei die Widerlagerstellen an den Brückenteilen mit Abstand zu deren Brückenenden angeordnet sind. Die Leiterplatte kann dadurch noch besser flächig an den Kühlkörper angepresst werden.It is advantageous if the optics has a plurality of bridge parts which extend transversely to the row of the lighting means, wherein the abutment points are arranged on the bridge parts at a distance from the bridge ends thereof. The circuit board can be even better pressed flat against the heat sink.
Bei einer bevorzugten Ausführungsform der Erfindung sind auf der Leiterplatte mehrere Leuchtmittel in einer Reihe nebeneinander angeordnet, wobei die Leuchtmittel in Höhe der am weitesten vorstehenden Stelle der konvexen Krümmung positioniert sind. Durch diese Maßnahme kann die Leiterplatte mit einer hohen Flächenpresskraft an die Wärmeeinkoppelfläche des Kühlkörpers angepresst werden.In a preferred embodiment of the invention, a plurality of lighting means are arranged in a row next to each other on the circuit board, wherein the lighting means are positioned at the height of the most prominent point of the convex curvature. By this measure, the circuit board can be pressed with a high surface pressure force to the heat input surface of the heat sink.
Nachfolgend ist ein Ausführungsbeispiel der Erfindung anhand der Zeichnung näher erläutert. Es zeigt:
-
Fig. 1 einen Querschnitt durch eine Beleuchtungseinrichtung, die als Leuchtmittel mehrere die auf einer Leiterplatte angeordnete Leuchtdioden aufweist, -
Fig. 2 eine Vorderansicht der Beleuchtungseinrichtung und -
Fig. 3 eine Ansicht auf die Rückseite der Beleuchtungseinrichtung.
-
Fig. 1 a cross section through an illumination device which has a plurality of light emitting diodes arranged on a printed circuit board as a light source, -
Fig. 2 a front view of the lighting device and -
Fig. 3 a view of the back of the lighting device.
Eine in
Zum Abführen der beim Betrieb der Beleuchtungseinrichtung 1 in den Leuchtmitteln 2 auftretenden Verlustwärme ist die Leiterplatte 3 flächig wärmeleitend mit einem Kühlkörper 4 verbunden, der aus einem gut wärmeleitenden Werkstoff besteht, beispielsweise aus Aluminium.For dissipating the loss of heat occurring during operation of the
In
Wie in
Zur Lenkung und Bündelung des von den Leuchtmitteln 2 ausgesendeten Lichts weist die Beleuchtungseinrichtung eine Optik 7 auf, die ein Gehäuseteil hat, an dem mehrere, in der Zeichnung nicht näher dargestellte, lichtablenkende optische Elemente vorgesehen sind, die im Abstrahlbereich der Leuchtmittel 2 angeordnet sind.For directing and bundling the light emitted by the
In
Die Widerlagerstellen 9 liegen der am weitesten vorstehenden Stelle der konvexzylindrischen Krümmung der Wärmeeinkoppelfläche 5 gegenüber. Durch die Rückstell- bzw. Federkraft der Optik 7 wird die Leiterplatte 3 mit ihrer Rückseite flächig an die Wärmeeinkoppelfläche 5 anpresst. Dadurch ergibt sich an der Wärmeeinkoppelfläche 5 ein geringer Wärmewiderstand zwischen der Leiterplatte 3 und dem Kühlkörper 4.The abutment points 9 are the most prominent point of the convex cylindrical curvature of the
Damit die Optik 7 lagerichtig relativ zu der Leiterplatte 3 und den darauf angeordneten Leuchtmitteln 2 positioniert ist, weist die Optik 7 mehrere dom- oder kegelstumpfförmige Zentrierelemente 10 auf, die jeweils eine dazu passende Öffnung der Leiterplatte 3 durchsetzen (
In
In
In
- 11
- BeleuchtunsgeinrichtungBeleuchtunsgeinrichtung
- 22
- LeuchtmittelLamp
- 33
- Leiterplattecircuit board
- 44
- Kühlkörperheatsink
- 55
- WärmeeinkoppelflächeWärmeeinkoppelfläche
- 66
- Kühlrippecooling fin
- 77
- Optikoptics
- 88th
- Verbindungselementconnecting element
- 99
- WiderlagerstelleAbutment point
- 1010
- Zentrierelementcentering
- 1111
- Zwischenraumgap
- 1212
- Brückenteilbridge part
Claims (9)
- Lighting device (1) with at least one illuminant (2) arranged on a printed circuit board (3), and at least one heat sink (4) with at least one curved heat coupling surface (5) which is flatly heat-conductively connected with the printed circuit board (3),
characterized in that
the printed circuit board (3) is a rigid printed circuit board and is clamped with the heat sink (4) by means of connecting elements (8), such that the printed circuit board (3) is flatly pressed against the heat coupling surface (5) of the heat sink (4) by a force acting against its elastic deformation force, wherein the printed circuit board fits evenly flat to the heat coupling surface. - Lighting device (1) according to claim 1, characterized in that the heat coupling surface (5) has a cylindrical curvature.
- Lighting device (1) according to claim 1 or 2, characterized in that the heat coupling surface (5) has a convex curvature.
- Lighting device (1) according to one of claims 1 to 3, characterized in that the lighting device (1) comprises at least one reflector and/or optics (7) having a lens, for directing the light emitted by the at least one illuminant (2), and that the printed circuit board (3) is clamped between the optics (7) and the heat sink (4).
- Lighting device (1) according to one of claims 1 to 4, characterized in that the optics (7) comprises centering elements (10), which interact with matching centering counter parts of the printed circuit board (3).
- Lighting device (1) according to claim 5, characterized in that the centering counter parts are designed as openings and the centering elements (10) are designed as projections, and that the projections taper from their base to their free end.
- Lighting device (1) according to one of claims 1 to 6, characterized in that a plurality of illuminants (2) are arranged in a row next to each other on the printed circuit board (3), that the optics (7) comprises a plurality of abutment points (9), which are arranged behind one another in the extension direction of the illuminant row and are spaced apart from one another by gaps (11), that the abutment points (9) come to rest at the printed circuit board (3), that the illuminants (2) are provided at the gaps (11), and that the connecting elements (8) are arranged transversely to the extension direction of the illuminant row on either side of the abutment points (9).
- Lighting device (1) according to claim 7, characterized in that the optics (7) comprises a plurality of bridge parts (12), which extend transversely to the row of illuminants (2), and that the abutment points (9) are arranged at the bridge parts (12) with distance to their bridge ends.
- Lighting device (1) according to one of claims 3 to 8, characterized in that a plurality of illuminants (2) are arranged in a row next to each other on the printed circuit board (3), and that the illuminants (2) are positioned at the level of the most projecting point of the convex curvature.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011051047.8A DE102011051047B4 (en) | 2011-06-14 | 2011-06-14 | lighting device |
PCT/EP2012/061232 WO2012171972A2 (en) | 2011-06-14 | 2012-06-13 | Lighting device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2721342A2 EP2721342A2 (en) | 2014-04-23 |
EP2721342B1 true EP2721342B1 (en) | 2015-09-09 |
Family
ID=46275835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12727372.0A Not-in-force EP2721342B1 (en) | 2011-06-14 | 2012-06-13 | Lighting device |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2721342B1 (en) |
DE (1) | DE102011051047B4 (en) |
WO (1) | WO2012171972A2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2918393B1 (en) * | 2014-03-14 | 2021-08-04 | LUNUX Lighting GmbH | Lighting device, housing shell for a lighting device and manufacturing method for a lighting device |
DE102014109114B4 (en) * | 2014-06-30 | 2024-04-25 | HELLA GmbH & Co. KGaA | Arrangement of a heat sink in a headlight |
CN106801832A (en) * | 2016-12-14 | 2017-06-06 | 安徽银盾斯金铝业有限公司 | A kind of car coat type LED street lamp radiator aluminium section bar |
DE102020002951A1 (en) * | 2019-06-07 | 2020-12-31 | Marquardt Gmbh | Device with a housing |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7182627B1 (en) * | 2006-01-06 | 2007-02-27 | Advanced Thermal Devices, Inc. | High illumosity lighting assembly |
DE102006048230B4 (en) * | 2006-10-11 | 2012-11-08 | Osram Ag | Light-emitting diode system, method for producing such and backlighting device |
TWI324669B (en) * | 2007-03-15 | 2010-05-11 | Ind Tech Res Inst | Light modules |
DE102007050893B4 (en) * | 2007-10-24 | 2011-06-01 | Continental Automotive Gmbh | Method for positioning and mounting a LED assembly and positioning body therefor |
WO2009128005A1 (en) * | 2008-04-17 | 2009-10-22 | Koninklijke Philips Electronics N.V. | Thermally conductive mounting element for attachment of printed circuit board to heat sink |
DE202008005814U1 (en) * | 2008-04-30 | 2008-08-07 | Kracht, Torsten | Rotatable and swiveling lamp unit |
DE102008052869B4 (en) * | 2008-09-15 | 2014-06-26 | Siteco Beleuchtungstechnik Gmbh | Luminaire with LED mounting rail |
DE202009001475U1 (en) | 2009-02-06 | 2009-04-16 | Osram Gesellschaft mit beschränkter Haftung | Heat sink for a lighting device |
TW201100711A (en) * | 2009-06-30 | 2011-01-01 | Power Light Tech Co Ltd | Light emitting diode light source assembly with heat dissipation base |
-
2011
- 2011-06-14 DE DE102011051047.8A patent/DE102011051047B4/en not_active Expired - Fee Related
-
2012
- 2012-06-13 EP EP12727372.0A patent/EP2721342B1/en not_active Not-in-force
- 2012-06-13 WO PCT/EP2012/061232 patent/WO2012171972A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2721342A2 (en) | 2014-04-23 |
DE102011051047A1 (en) | 2012-12-20 |
WO2012171972A3 (en) | 2013-04-04 |
WO2012171972A2 (en) | 2012-12-20 |
DE102011051047B4 (en) | 2015-06-18 |
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