EP2718625A1

EP2718625A1 - Illuminating glass partition

Info

Publication number: EP2718625A1
Application number: EP12731540.6A
Authority: EP
Inventors: Anne Gierens; Aude Montgermont; Jingwei Zhang
Original assignee: Saint Gobain Glass France SAS; Compagnie de Saint Gobain SA
Current assignee: Saint Gobain Glass France SAS
Priority date: 2011-06-09
Filing date: 2012-06-07
Publication date: 2014-04-16
Also published as: CN103732988A; WO2012168659A1; FR2976342A1; CN103732988B; FR2976342B1

Abstract

The invention relates to an illuminating glass partition comprising at least one glass module (1A, 1 B, 1 C), and a lighting system (3) associated with the glass module, based on light-emitting diodes (30) on a PCB support facing the edge (13) of at least one side of the module. The partition comprises at least one profile (31) for receiving diodes, provided with a longitudinal metal base (33) facing the edge of the module and carrying the PCB support. The partition comprises a profile (2) for assembling the partition, comprising a core (20) facing the edge and extending along the edge, the assembly profile also comprising lateral wings (21, 22) either side of the edge of the module and associated with the module, in addition to defining an inner space (26) housing the diodes on the PCB support(s), the base of the receiving profile being separate from the assembly profile or built into the assembly profile. The invention also relates to the assembly of the partition.

Description

GLASS LIGHTING FENCE

The invention relates to an illuminating glass partition comprising on the one hand at least one glass module which comprises at least one glass sheet, and secondly a lighting system associated with the glass module.

The usual illuminating partitions include their lighting system located inside the partition behind the main faces of the glass sheets.

The object of the invention is to propose a new generation of robust glass partition wall, ecological with a simple and fast installation.

In the remainder of the description, the terms "horizontal", "vertical", "superior", "lower", "high", "low", are qualified by qualifying the elements used in the context of a normal installation of the partition, that is to say relating to a vertical concept with respect to a horizontal (flat) floor on which would be placed (or fixed) said partition.

According to the invention, the illuminating glass partition, in particular intended to be associated (mounted) between a lower reception surface (ground or other lower surface) and an upper reception surface (ceiling or other) and preferably any the least associated (posed or even fixed) to a lower surface, comprises firstly at least one glass module having two main faces and a wafer, the module comprising at least one glass sheet, and secondly a system of lighting, and

the lighting system comprises light-emitting diodes whose light-emitting face is arranged opposite the edge of at least one side of the module (and is spaced from the edge of the module), the glass module (in particular the glass) forming a light guide emitted by the diodes and the module comprising means for extracting the light thus guided, for illumination via at least one of the main faces,

the diodes are arranged on at least one support and power supply device known as PCB support, the partition comprises at least one diode reception section which is provided with a longitudinal base, facing the edge of the module and carrying the PCB support, and

- the partition comprises a partition mounting profile (fixed or placed on a floor, or ceiling or even spaced from the floor, the ceiling) having a core facing the wafer extending along the edge and the profile mounting further comprising side wings on both sides of the module portion and associated with the module, the mounting profile delimiting an interior space housing the diodes on the PCB support (s), the base of the profile of reception being distinct from the mounting profile or integrated into the mounting profile.

Such lighting based on light emitting diodes (LED or LED in English) associated with the edge of the glass is at a low energy consumption robust over time. The mounting profile hides the diodes and protects them.

In addition, the host profile of diodes on PCB support (s) allows to quickly install the lighting system in the partition and provides a simple manufacturing system. The metal base, dissipating the heat, ensures the longevity of the diodes. The diodes are independent of the glass modules. The modules used are conventional glazing without the need to drill holes in the edge of the glass module to arrange the diodes.

Advantageously, the diodes are of the type "top emitting" in English and not "side emitting", that is to say that they illuminate in the opposite direction to their support device and not laterally. The emitting face of the diodes is parallel to the edge of the module and preferably to the mounting surface (plane).

For flexibility of use for example, preferably or the PCB supports with the diodes are removable from the partition for example are not permanently attached to the mounting profile of the partition or the module (slice, main faces .. .), for example they are positioned, reported in the partition (in the internal space defined by the profile of mounting) or fixed by removable means including screw type in the partition (in the internal space defined by the mounting profile).

Preferably the base with the PCB support (s) and the diodes can be dismantled from the partition for example it is not fixed permanently (or integrated) to the mounting profile of the partition for example reported or fixed by removable means including screw type or attached to the module.

Also preferably, a hood covering the diodes (optionally removably attached to the base or extending the base in one piece), is removable from the partition for example is not permanently attached (or integrated) to a partition mounting profile or not permanently attached to the module.

In one embodiment, the base is a plate (plane) and the profile optionally comprises side walls connected to the opening base at the periphery of the module faces, in particular for an installation on the upper side.

Depending on the installation constraints, the reception profile is secured to the glass module before insertion of the module into the mounting profile or is integral with the mounting profile, including the core before insertion of the module into the mounting profile.

In one embodiment, the partition may comprise a part capable of maintaining a spacing between the emitting face of the diodes and the edge of the module.

The spacer preferably forms at least one support abutment of the module when the lighting system is arranged at the upper horizontal side of the module in the mounted position of the partition, or the part preferably forms at least one stop support and support of the module section when the lighting system is arranged at the lower horizontal side of the module in the assembled position of the partition.

For high mounting, this part is therefore able to maintain a spacing between the emitting face of the diodes and the wafer of the module during installation in particular. For low mounting, this part maintains a spacing between the emitting face of the diodes and the wafer of the module during installation in particular and possibly forms a bearing abutment and support module.

Thus, the piece forms a stop (support) during assembly in the partition at the bottom as in the upper part to avoid bumping the diodes, and further a support stop (vis-à-vis the weight of the module) for the lower part.

The base may be a plate, in particular flat (hollow or solid), and the profile optionally comprises one or more side walls connected to the base and opening at the periphery of the faces of the module, in particular for an installation of the upper side; For example, the base assembly and the side wall (s) form an L or U and in particular are in one piece.

The part may comprise at least a first lateral wall to the diodes, in particular reported or even connected to the base of the reception profile, or two side walls connected to the base of the reception profile. The first side wall is preferably at least partly facing the edge of the module and disposed protruding from the emitting face of the diodes. Advantageously, the inner space of the mounting profile houses the spacer, in particular houses the first protruding side wall, or even the second projecting wall, and the base of the receiving profile, the PCBs being arranged longitudinally to said mounting profile.

In the rest of the description, the first side wall, and when there is a second side wall, the two side walls are part of the reception profile or are part of a separate part of the reception profile. Preferably, the spacer is made of the support profile supporting the diodes.

By "connected" in the expression "a first lateral wall, in particular reported or even connected to the base", is meant a fastening of the wall to the base (the base being for example flat of rectangular, hollow or solid cross section) during the manufacture of the assembly, the wall and the base forming a single unitary unit or even a piece in one piece, the wall being integrated in the base, for example cross section L or U. Preferably the side wall is orthogonal to the wafer (flat, parallel to the mounting surface), is further orthogonal to the PCB support and / or the core of the mounting profile of the partition.

Also preferably, the protruding side wall (removably attached to the base optionally or extending the base in one piece), is removable from the partition for example is not permanently attached (or integrated) to a profile mounting the partition or permanently attached to the module.

Thanks to the protruding side wall, the faces of the diodes are protected from shocks during assembly opposite the edge of the module so as to arrange the diodes vis-à-vis this wafer.

In addition, particularly along the lower side of the module in the mounted position of the partition, the weight of the module is not an inconvenience and does not risk damaging the diodes because the module can not touch the diodes.

To reduce the space requirement and / or to be housed in the mounting profile of the wall of given width possibly reduced, or the protruding side wall or walls preferably do not protrude (laterally) from the edge of the module or preferably exceed at most 1 cm or even 5 mm (on one or both sides of the module). Likewise, the lateral wing (s) preferably preferably exceed 1 cm or even 5 mm on the side of the module.

According to one characteristic, the spacer part, in particular the first lateral wall, constitutes a spacer between the diodes and the edge of the module, preferably a longitudinal spacer over the majority or even any length of the module side.

Advantageously, when the lighting system is arranged at the level of the lower horizontal side of the module in the mounted position of the partition, the spacer, in particular the first wall, forms at least one bearing stop and support of the wafer. module including extending in the zone or zones excluding diodes or even support (s) PCB, preferably a (single) longitudinal stop on the majority or even any length of the lower horizontal side. The side wall (s) may be sufficient to form one or more support stops, it may depend on the width of the PCB support (s) and the weight of the module. It may be preferred to complete the support by a closed "central" surface opposite the base, in particular parallel to the (flat) edge of the module.

In the lower part of the partition in the mounted position thereof, the spacer advantageously constitutes a support surface for the module (by one or more stops).

Preferably the support width of the module (by a stop or several stops) on the spacer extends over the majority or even (at least) 2/3 of the width of the wafer of said module. Preferably, the support width extends over the entire width of said module.

In the case of a monolithic glazing, the support width may extend over most or even at least 2/3 of the width of the glass sheet.

In the vas of a laminated glazing, the support width may extend over most or at least 2/3 of one of the glass sheets or over the width of the assembly.

The support width may be the cumulative width of the end of the first projecting side wall and of a second projecting side wall, walls on either side of the diodes (for example centered on the monolithic or laminated module) and possibly also cumulated with the closed surface (perforated to the right of the diodes) opposite to the base connecting these side walls.

According to another characteristic, the partition comprises, in the interior space, opposite the edge of the module, a solid (preferably planar) surface, in particular forming a bearing abutment of the edge of the module, surface opposite to the base of the module. reception profile including parallel to the base in at least one zone excluding diodes or even support (s) PCB (without diodes). The solid surface extends longitudinally in the zone of the diodes being perforated in line with the diodes, in particular forming still abutment of support of the wafer of the module in the zone of the diodes.

"Off-diode zones" means the area of the full surface, areas that are not necessarily all areas diodes. In fact, in certain zones outside the diodes, the surface will not be strictly full because, for example, it may have holes for fixing means.

By solid surface is meant a surface as opposed to a perforated surface, and in particular a continuous hole along a longitudinal axis.

The solid surface is advantageously perforated to the right of the diodes. The solid surface is formed by at least one L-shaped wall which protrudes from the base of the receiving profile and extends into zones outside the diodes, preferably in parallel return and with a width equal to the base, or is formed by two projecting walls which are joined together in the zones outside the diodes in a rectangular closed section.

The solid surface is in particular opposite the base of the profile, along the longitudinal axis of extension of the diodes.

The profile with this solid surface (especially in the center of the glazing) is much more advantageous than a profile which would be made of a part in two lateral parts projecting or separated on either side of the diodes, or even on a profile a piece of a single piece of width equal to the edge of the glazing and provided with a slot or a longitudinal opening facing the edge of the glazing, this opening being present in the zone of the diodes and outside the diode areas especially if multiple PCBs are used.

In the mounted position of the partition and in the upper part, the spacer, which nevertheless does not need to constitute a support abutment with respect to the weight of the glazing, may comprise, as for the lower part, a solid surface. view of the edge of the module, surface opposite the base, in non-diode areas, or even support PCB (s), the solid surface extending longitudinally in the diode zone being perforated to the right of the diodes.

The part may in its entirety (base and wall) have an L-shaped cross-section, for example in the diode areas, and this L-section is preferably combined with a solid surface or with a return outside of the diode areas. As a variant, the part presents as a whole (base and walls) a U-shaped section in the zones of diodes, the U being joined by a solid surface opposite the base in the areas outside the diodes.

Preferably, the partition comprises in the interior space, a first and a second side wall to the diodes, facing the edge of the module and arranged projecting from the emitting face of the diodes (so-called protruding walls), and extending longitudinally at the base of the reception profile, the first and second walls being preferably connected or even linked to the base, and the diodes and preferably their PCB support (s) are arranged between the first and second walls.

Preferably, the partition comprises between the wafer of the module and the diodes, a cover facing the wafer covering the diodes and the PCB or supports and adapted to let the light of the diodes to the edge of the module, s' optionally extending longitudinally (over the entire length of) on the base, and preferably the cover is hollow with at least one U-shaped cross section or Ω. The cover forms the solid abutment or support surface and is pierced to the right of the diodes when it is not transparent to the right of the diodes.

Or, the partition comprises first and second protruding side walls to the diodes and extending longitudinally to the base, walls connected to form a solid surface opposite and parallel to the base, the so-called perforated solid surface being provided with an orifice (s) crossing, preferably of circular or oblong shape, which are at the right of the diodes to let the light emitted by the diodes pass through, or the solid surface being able to let the light emitted by the diodes pass through (solid surface transparent for example), the space provided between the walls possibly housing the diodes and the PCB support (s).

The spacer has for example at least one first sidewall diodes which can be reported on the base or even on the PCB support and a possible second wall which is attached to the base or even on the PCB support, the first wall projection extends laterally to form a solid surface, or back, opposite and parallel to the base return fixed to the base or to the PCB support by fixing means preferably removable, in particular screw type.

The spacer has, for example, at least a first lateral wall to the diodes which is attached to the base or even to the PCB support, and the base of the reception profile integrates the first projecting wall

(arranged protruding from the emitting face of the diodes), thus forming a single piece, in particular in L.

The room or the reception profile comprises a first sidewall with the diodes and protruding (disposed projecting from the emitting face of the diodes) and a second projecting wall (arranged protruding from the emitting face of the diodes), the diodes being between the first and second walls, the walls being on the base of the profile, the second wall being open laterally. C The second wall is open in at least one longitudinal opening and at a part of its height, in particular the lower part of its height extending from the base, so as to make the PCB support accessible, in order to facilitate its removal from the the base of the profile and therefore the partition. There can be as many openings as PCB supports on the base or even a single opening.

The lighting system is arranged for example on two opposite sides of the partition, preferably at the upper and lower horizontal sides of the module or modules in the mounted position of the partition.

The glass sheet or sheets are based on a glass having a high light transmission, of at least 85%, when the measurement is carried out under illuminant D65 on a sheet of glass with parallel faces 4 mm thick.

The glass of the modules can be tempered. In addition, the modules may have all kinds of usual properties for partitions, such as acoustic properties.

Advantageously, the spacer comprises at least a first lateral wall to the diodes which forms means for redirecting towards the edge of the module a fraction of the lateral light emitted by the diodes in the direction of the module, preferably by specular reflection, the first wall being flared towards the edge of the module or perpendicular to the edge.

According to another characteristic, the base comprises means of heat dissipation, in particular of a metallic material, which is preferably the material constituting the base, or in that an intermediate piece between the base and the PCB support comprises heat dissipation means, in particular based on a metallic material, which is preferably the constituent material of the part, in particular of L-shaped section including the protruding wall of the profile.

The spacer part or the receiving profile when it constitutes the spacer, is made or not of several parts made integral (preferably two pieces maximum), of the same material or not, including the materials of manufacturing are plastic or composite material, or Teflon or a metallic material. Preferably the receiving profile or the spacer are metallic and even in one piece.

Preferably, the base of the profile is a flat plate (supporting the weight of the module if necessary), parallel to the edge of the module, and at least the first wall of the profile, in a plane parallel to the base, is a flat plate ( plastic or metal), in particular holes in the right of the diodes, parallel to the edge.

The diodes are arranged on several PCB supports including previously mounted on the base of the reception profile, in particular with the aforementioned solid surface of the spacer opposite the base between the PCBs.

Preferably, the width of the base in a plane parallel to the base is less than or equal to the width of the wafer of the module. Thus, the profile has dimensions adapted to its function while having a minimized volume for its integration to the partition. Preferably the width of the base is at least 2/3 of the width of the module, in particular for the transfer of the weight of the module. The spacer is preferably not associated with the main faces of the glazing, whether by any type of attachment (lateral clamping, glue, etc.).

The spacer is preferably not attached to the edge of the glass sheet.

The spacer can be integral with the base of the profile, or it is preferably attached to the base of the profile.

The reception profile when it forms the spacer is in no way associated with the main faces of the glazing, whether by any type of attachment (lateral clamping, glue, etc.).

The receiving profile when forming the spacer is preferably not attached to the edge of the glass sheet.

The first wall is attached or even attached to a mounting profile of the partition.

Preferably in a mounting of the diodes in the upper position of the partition, the base of the reception profile is reported in the mounting profile in particular by the web or a shoulder of the web of the mounting profile.

The height of the diodes is less than 10 mm or even 5 mm and the distance between the diodes and the edge of the module is less than 10 mm or even 5 mm, the diodes comprising semiconductor chips optionally covered with sealing means at the water.

The partition comprises a single row of diodes along the edge of the module distributed longitudinally in one or more groups of diodes on PCB support (s), or in the case of a module with two glass sheets spaced by a gas blade forming double glazing, possibly two rows of diodes each facing the edge of each glass sheet.

In addition, the mounting profile is said to be lower, and preferably the base is placed or even fixed on one or more shims placed on the web of the mounting profile, facing the edge of the module.

The web of the mounting profile, parallel to the edge of the module, is preferably perforated, in particular for fixing said mounting profile by screwing to the mounting surface. The mounting profile (lower or upper) preferably comprises a shoulder having a longitudinal groove, the shoulder serving as a support surface to the base which is preferably fixed by a screw-nut assembly cooperating with the groove of the shoulder .

The illuminating partition of the invention is intended for any type of use outside and / or inside, in a building or in a vehicle (including transport ...) in a public space, such as a separation between rooms, compartment, a separation within the same room, to be a door, a window, a counter, an interior decoration device, a railing, a furniture product, a standing luminaire in particular to parallelepipedic shape, etc.

The use of such a partition is to provide a transparent and illuminating wall which ensures the separation of a space; the partition makes it possible to constitute an illuminating physical separation delimiting on both sides zones of occupation of the space. It is therefore an application totally remote from a lighting module for display screen or signage illuminating panel, the latter applications are also generally attached to a wall.

Moreover, the partition is preferably transparent, especially outside light extraction means (or possibly the glass sheet is provided with a semi-reflective coating, such as a mirror mirror such as the product sold under the name Mirastar of the applicant company). It is further preferred to see the illumination on both sides of the module.

The profile or the spacer can preferably integrate into a mounting profile of the partition without being visible after mounting.

Preferably, the profile or the spacer opposite the edge of the module has no return towards the main faces of the module. The profile or the part thus does not extend at the level of the faces of the module in particular so as not to hide even partially the faces of the module.

It should be noted that the mounting profile is not necessarily attached to the floor but could be attached to another surface. Furthermore the partition is not necessarily fixed, it can be movable relative to its association surface (floor, ceiling etc.).

The height of the partition is not necessarily the height between the floor and the ceiling (if any).

The mounting profile of the partition can be made of several parts. It comprises a U-shaped part, the U cavity forming the internal space housing the diodes. Preferably the profile is provided with a removable or movable wing, and preferably comprises removable sealing means affixed between the module and the mounting profile, in particular fixed by clipping.

Finally, the invention proposes a method of mounting the partition (as described above) to a floor (floor etc.) in which:

the lower mounting profile is fixed to the ground (preferably by screw through the web of the profile),

- If one (or not) the floor is not perfectly flat, one or more shims in the mounting profile (against the core or against an internal shoulder to the projecting profile and parallel to the core),

regardless of the installation destination of the partition, the diodes are placed in the mounting profile on the PCB support (s) and the part (in particular the first lateral projecting wall), preferably the first wall being associated with the base from the reception profile with the PCB supports by pre-assembly, preferably insert the base with PCB support and diodes into the mounting profile,

the module or modules are placed on the part, in particular the first projecting wall, preferably on several lateral projecting walls on either side of the diodes,

- we put sealing means,

- It may replace a removable or movable side portion of the mounting profile.

The method of mounting the partition (as described above) to a ceiling (roof, etc.) comprises the following steps:

the mounting profile is fixed to the ceiling (preferably by screws via its pierced core), in the mounting profile, the diodes are installed on the PCB support (s) and the part, in particular the protruding wall preferably pre-assembled, preferably several lateral projecting walls,

the glass module or modules are fixed,

- we put sealing means,

a movable lateral part of the mounting profile may be replaced.

For the method of mounting a partition to a ceiling or a floor, the diodes or the PCB support are hooded by the solid perforated surface, preferably associated with the first wall. The solid surface extends in a zone outside the diodes and / or outside the PCB support.

The present invention is now described with the aid of examples which are only illustrative and in no way limit the scope of the invention, and from the attached illustrations, in which:

- Figure 1 schematically illustrates a front view of a glass illuminating partition according to the invention;

- Figure 2 is a partial schematic sectional view of the lower side of the partition in mounted position;

- Figure 3 is a partial schematic sectional view in the vertical plane of the diodes and the upper side of the wall in the mounted position;

- Figure 4 corresponds to a variant of Figure 3 in a section in a vertical plane between the diodes, the diodes do not extend along the entire length of the profile as shown in the variant of Figure 7;

- Figure 5 is a variant of the lower mounting profile of the partition;

FIGS. 6a to 6e are views of the reception profile of the diodes with a base and a cover, respectively, in side perspective, exploded, from above, and in section in a vertical plane on the one hand in a diode and on the other hand according to a fixation;

FIG. 7 is a variant of FIG. 6c; - Figure 8 is a top view and in section with the associated module of Figure 7 to the right of the diodes;

- Figure 9 is a variant in sectional view of the receiving profile according to Figure 8;

FIGS. 10 to 12 further illustrate other variants of the receiving profile at the right of the diodes, outside the zones, preferably with a solid surface, of the reception profile;

- Figure 13 illustrates a sectional view of another variant of integration of a reception profile in an upper profile mounting of the partition.

The illuminating glass partition 1 of the invention as illustrated in FIG.

1 is able to illuminate and is intended for example to separate adjacent parts of a building or form a separating element or design arranged in an isolated manner in a room.

The partition is mounted vertically between the floor 4 and the ceiling 5 of a room,

(floor and / or roof of a vehicle) with a suitable height. It comprises at least one glassmaker module 1A, possibly several modules

1A, 1B and 1C contiguous in a vertical plane in a horizontal direction to provide the proper width of the partition.

The partition comprises for its mounting lower and upper mounting profiles 2 which allow to fix respectively between the floor and the ceiling, as will be illustrated below.

Partition 1 is illuminating because comprising, as can be seen in FIGS. 2 and 3, a lighting system 3 based on light-emitting diodes 30 comprising reception profiles 31 of the diodes, the reception profiles 31 being arranged in the mounting profiles 2 in a hidden way for an observer looking at the mounted partition (dotted in Figure 1).

Preferably, with regard to FIG. 1, the lighting system 3 is arranged only in the horizontal lower and upper mounting profiles 2 of the partition, and not against the vertical edges so as not to modify the aesthetic appearance of the partition. partition at the splice junctions

18 between modules. Each glass module, such as that 1A shown in Figures 2 and 3, comprises two sheets of glasses 10 and 1 1 laminated and assembled together by an intermediate sheet 12 of plastic.

The glass sheets are preferably made of a glass having a high light transmission, of at least 85%, when the measurement is carried out under illuminant D65 on a glass sheet with parallel faces 4 mm thick. Preferably, it will be a so-called extra-clear glass, such as the DIAMANT® glass sold by the company SAINT-GOBAIN GLASS.

In a variant, the module could comprise only one sheet of glass.

In yet another variant, the module could comprise two glass sheets spaced by a gas blade, such as air, to form a double glazing.

The glass sheets for a laminated module will have for example a thickness of 5, 6 or 8 mm.

The glass sheet for a monolithic module will preferably be tempered and preferably have a thickness of 10 or 12 mm, for example.

Partition 1 provides illumination provided by at least one module or each of the glass modules.

Preferably, the lighting being based on diodes, the partition comprises light diffusion means 6 associated with one of the faces of the glass for a monolithic module (a single sheet of glass), or when the module comprises at least one minus two sheets of glass (laminated or insulating module of double-glazed type), associated with one of the inner faces (turned towards the inside of the module) of one of the glass sheets.

The diffusion means 6 are preferably screen printed on the glass and are, for example, enamel. They extend over the glass according to a chosen arrangement and patterns. They do not necessarily cover all of the glass surface of the module and can thus delimit so-called dark functional areas. The dark areas are for example arranged centrally or peripherally to the module. They consist for example of transparent areas (glass clear) or opaque, or even mirrors. In Figure 1, have been illustrated different patterns of the diffusion means 6 on each of the modules, the non-limiting geometry.

As illustrated in FIGS. 2 and 3, the module 1A is illuminated by the lighting system 3 opposite the wafer 13 of the module.

The light coming from the diodes 30 which are located opposite the slice

13 of the module, for example facing the center of the wafer, is propagated in the thickness of glass (or even the intermediate sheet) in a direction transverse to the planes formed by the main faces 14 and 15 of the module to be redirected thanks to diffusion means 6 to the outside of the module, For a monolithic module, the diodes are arranged facing the edge of the single sheet of glass. For a module with two glass sheets spaced by an air gap, the diodes are preferably arranged facing each of the slices of the glass sheets.

As expressed above, the diodes are arranged opposite the horizontal upper and lower sides of the module.

With reference to FIGS. 2 and 3, the mounting profiles 2 incorporate the lighting system 3, more specifically the diodes 30 and the reception profiles 31 housing the diodes.

In order to accommodate the reception profiles 31, each of the mounting profiles is preferably a U-section section with a core 20 and two parallel and opposite wings 21 and 22 connected orthogonally to the core 20.

Each of the mounting profiles is preferably fixed respectively to the floor and the ceiling by screwing, the screws passing through the core 20.

The end surface portions 16 and 17 of the U of each mounting section grip the respective main faces 14 and 15 of the module.

The mounting profile has a U-shaped section of a single piece or a double U shape.

Alternatively, the mounting profile may be in several parts for example, a portion of the U, preferably at a wing, may be removable to facilitate the introduction of the reception profiles 31 and the glass module. FIG. 3 illustrates this configuration detail, the wing 22 of the section 2 being reported for example by clipping.

The mounting profiles 2 are preferably metal, aluminum or stainless steel.

Removable sealing means 7 are provided by being affixed against the module and the free ends 21a and 22a of the respective wings 21 and 22 of the mounting profiles. These sealing means are for example fixed by clipping.

The mounting profile 2 is intended to be secured to the fastening surface by fastening means 9 visible in Figures 3 and 4, such as screws which pass through the core 20 and are intended to cooperate with said fastening surface. It is preferable not to use self-tapping screws; preliminary orifices will be provided in the soul.

The screws will be distributed according to the length of the mounting profile and several reception profiles 31 will be provided by being arranged along the length of the mounting profile and between the fixing screws if they have projecting heads.

Alternatively, the screws may have flat heads which are embedded in countersinks of the web 20 of the profiles, so as not to project.

A reception profile 31 may have a length equivalent to a glass module or several glass modules.

For the lower mounting profile (Figure 2), in order to compensate for unevenness of the ground, the partition is arranged level with one or more shims 8. The shim is arranged inside the mounting profile against the core 20, the module 1A associated with the lighting system 3 being intended to rest on the wedge or shims.

The wedges may be arranged inside the U along the longitudinal axis of the mounting profile and distributed between the fastening means of the mounting profile.

Alternatively and as illustrated in Figure 5, the mounting profile 2 comprises inside the U, against the core 20 a longitudinal shoulder 23 on which rests or one of the wedges 8. The shoulder 23 forms with the 20 a cavity to allow the establishment of the fastening means 9. According to the invention, the lighting system 3 comprises the diodes 30 and a reception profile 31 for supporting the diodes. The lighting system 3 is optically coupled to the edge 13 of a glass module. Also, the mounting profiles 2 have an interior volume 26 defined by the core 20 and the wings 21 and 22, which is sufficient and adapted to receive the reception profile 31 with the diodes.

The receiving profile 31 may have various configurations, as seen later, particularly when used either in a lower mounting profile or in an upper mounting profile.

The diodes 30 are disposed in a known manner on one or more support and power supply devices 32, which are typically printed circuit boards (PCBs). An electrical insulating varnish is provided on the diode connections.

The diodes (like their PCB support) are not embedded in sealing resin avoiding a too imposing thickness of these and their support. Advantageously, the diodes comprise a semiconductor chip combined with an optical resin (phosphor) and optionally a sealed layer, in particular deposited by gun, which covers the diodes and the surface of the support.

The width of the PCB support device 32 is for example less than or equal to the width of the module wafer or even a glass sheet.

By way of example, the elements have the following dimensions:

- PCB width: 10 mm or 5 mm,

- Thickness of PCB: 2 mm,

- Height of the diodes: 2 mm,

- Width of the base: 12 to 15 mm for a PCB 10 mm wide,

- height protruding from the profile relative to the top of the diode: 2 mm,

height separating the top of the diode and the edge of the glass: approximately 8 mm,

- Size of the diodes: 3.5 mm by 3.5 mm. The support and power devices or PCB 32 are mounted on each of the reception profiles 31 and are electrically connected to a central electrical connection not shown.

The mounting of the PCB devices with the diodes to the reception profile 31 can be done at the factory, the profiles 31 being delivered for mounting the partition by already integrating the PCB or PCBs with the diodes. The insertion of the PCB or PCBs with the diodes can also be done during the mounting of the partition, by bringing the diodes via their support devices 32 into the profiles 31.

The arrangement of the support devices will be seen later,

Several devices 32 are arranged adjacent each other along the reception profile 31.

More specifically, the receiving profile 31 has a longitudinal overall body with a base and at least one side wall.

The base 33 preferably extends over the entire edge of the glass module, especially if it is the lower edge. The side wall 34 also preferably extends over the entire edge of the glass module, especially if it is the lower edge.

The base 33 is elongated and parallelepipedic. Its two opposite main faces are flat, one accommodating the (s) support device (s) 32 of the diodes and the other resting on the core 20 of the mounting profile, possibly via a shim 8 or the shoulder 23 .

The side wall 34 extends orthogonally to the base 31 towards the glass module. It has a height (dimension orthogonal to the horizontal) greater than the diodes 30, so as to project beyond the illuminating distal end surface of the diodes.

The profile 31 is preferably provided with two parallel and spaced parallel side walls 34 between which the diodes are arranged and preferably their support (s) without these latter protruding from the distal end surfaces of the walls. opposite of the base.

Thus, the profile may have a general L-shaped assembly (not shown) with a single projecting wall or U, being respectively open on its side or on its surface opposite to the base. In particular, when the profile has two side walls 34 and 35, they are formed of two spaced plates and placed perpendicularly to the base 33 being joined together in a solid surface area 36 outside the diodes and the PCB. As illustrated in FIG. 4, the walls 34 and 35 are connected together in the zones which do not include the diodes with a rectangular closed section. Thus, when the diodes do not extend over the entire length of the profile but they are for example distributed in separate groups (Figure 7), grooves have been made in the solid walls only to the PCB.

However one can provide a trough in the base or in the connecting surface to accommodate the PCB or PCB in non-diode areas.

The reception profile 31 may be one-piece or made of several parts, the base constituting at least a part alone.

In a preferred embodiment of the invention (Figures 2 to 5 according to an integration in the lower and upper mounting profiles), the profile 31, with reference to Figures 6a and 6b, comprises the base 33 and a hollow longitudinal cover 33A U-shaped section returned or Ω whose wings spaced constitute the respective walls 34 and 35.

The cover 33A is attached against the base 33 after installation or fixing the PCB or 32 diodes on said base 33. Figure 6a partially illustrates the hood of the base 33 and the PCB or PCB with the diodes.

The cover 33A is hollow to provide space for the housing of the diodes 30 and their associated resistors 38, the PCB 32 resting on the base 33 away from the closed and full face 36 of the cover. The cover can alternatively be in contact with the PCBs.

The hollow cover 33A has its cavity facing the base 33, while it is intended to present its opposite closed side 36 facing the glass module. However, it has, in the thickness of its closed side 36, through orifices 37 which are intended to be opposite the diodes, thus allowing the light of the diodes to escape from the profile 31 (FIGS. 6b, 6c and 6d). and redirect the side light to the edge. In addition, to accommodate the resistors 38 in the hood and under the closed side 36, blind holes 38A are provided, as visible in Figure 6b for which the hood is viewed from below.

The cover 33A is fixed to the base 33 preferably by screws 39B through the bores 39 and 39A respectively arranged in the thickness of the closed side 36 and in the thickness of the PCB support and the base 33 (FIGS. 6b and 6e) .

The section 31 thus forms with its base 33 and its cover 33A a protective casing trapping the PCB supports and the diodes whose light is extracted through the orifices 37 (Figure 6d).

The base and its perforated cover are parallel to the edge of the module in order to illuminate it, the edge of the module being flat and preferably non-beveled.

The side walls of the cover form the projecting side walls 34 and 35 of the profile 31, the distal end surface of these walls 34 and 35 being formed by a portion of the closed face 36 of the cover parallel to the edge of the glass module.

For the lower side of the module in particular, the closed portion 36 of the cover with orifices 37 may be in direct contact with the edge of the module, as illustrated in FIGS. 2 and 5.

The openings 37 of the cover can be adapted to the size of each diode, for example a circular shape in which each diode is centered and inscribed. They may also be oblong in relation to a group of diodes, as illustrated in FIG.

The reception profile 31 may be made as seen above of several parts made integral, of the same constitutive material or not. The materials of manufacture are for example plastic or composite material, or Teflon for the side wall or walls forming a cover.

Advantageously, the profile 31 incorporates heat dissipation means, in particular based on a metallic material, in particular stainless steel, aluminum

The heat dissipation means are at least integral with the support devices 32 of the diodes. This helps dissipate the heat emitted by the diodes at their connection to the support devices 32. Preferably, the carrier base of the PCB support (s) (themselves metal or not) form these means of dissipation of heat.

The profile as a whole could be metallic and form as such the heat dissipation means.

In yet another embodiment of the profile (not shown) preferably for the upper part of the partition, the section 31 is monobloc (having base and projecting walls) in a single U-section metal material, the diodes and their PCBs being housed inside, an oblong orifice 37 in the manner of a groove (or hollow) being preferably arranged over the entire length of the profile, the diodes being aligned and centered with respect to this groove.

In addition to protecting the diodes provided by the walls 34 and 35, these constitute stops for the glass module. These stops advantageously realize a spacer between the diodes and the glass module so that it does not crush by its weight the diodes which are opposite its edge 13.

Indeed, according to the invention, the glass unit 1A is supported by its lower edge 13 on the profile 31 of the lighting system, the profile resting on the core of the mounting profile possibly via the shim 8. The side walls 34 and 35 of the profile carry everything (in the zone or zones excluding diodes) or part of the slices of the glass sheets 10 and 1 1, the diodes 30 being protected from the weight of the module. The weight of the module imposed on the side walls is then transferred to the base of the profile and the core of the lower mounting profile.

Figure 9 is a variant of sectional section 31 for example intended to be arranged in a lower mounting profile. The sidewalls 34 and 35 have their inner side which is cut and flared towards the wafer. In the off-diode zones, zones which are not at the right of the diodes and PCBs, the walls 34 and 35 preferably meet as previously described in solid surface 36. FIG. 10 represents another variant of a two-piece profile, the first part corresponding to the first wall 34 having an L shape, a flange being associated orthogonally with the second flat metal part forming the base (attached wing or even fixed on this base). ) while the other wing forms a return parallel to the base and having an orifice 37 opposite the diode 30 and for example fixing the first part to the base by screwing in an off-diode zone (or out of PCB) . In out-of-diode regions, which are not diode and PCB regions, the wall 34 preferably forms a solid surface 36 to support the weight of the substrate in the lower position.

Figures 1 1 to 13 show still other variants of profiles.

In FIG. 11, which is a partial perspective view only at the level of the diode zones of FIG. 7, the profile presents with its metal base 33 and its two lateral walls 34 and 35 (plastic or metal) a U-shaped shape. with open section at the top opposite the diodes while the PCB supports are arranged in the bottom of the U. In the non-diode zones (preferably also outside the PCB), the walls 34 and 35 preferably join to form the surface full stop module and even module support in lower position. The bearing surface extends over the width of the module.

As a variant of FIGS. 7 and 11 for which the orifices of the solid surface are in the form of rectangles grouping a plurality of diodes, the orifices could be unitary to the right of the diodes. In top view, the solid surface would correspond to the bars of a ladder, the empty spaces between the bars forming the passage holes of the light to the right of the diodes.

In Figure 12, the profile is in one piece (base and protruding wall in a metal part) with an L-shaped section incorporating a single side wall 34 opposite a first sheet of glass, the diodes being arranged facing each other. a second sheet of glass. In the diode areas, the profile is preferably provided with indentations or notches to clear the surface at the right of the diodes, while in the non-diode areas (preferably also outside the PCB), the wall 34 is solid and constitutes the surface full stop module and even module support in lower position. Concerning the profile 31 housed in the upper mounting profile 2 (FIGS. 3 and 4), the latter not having to bear the weight of the glazing, the end surfaces of the side walls 34 and 35 need not be necessarily contiguous to the slice 13 of the module.

In the embodiment of Figures 3 and 4, the mounting profile 2 comprises at its core and within the space 26, the shoulder 23 which has a longitudinal groove 24. The cavity formed between the shoulder 23 and the core 20 makes it possible to house fastening means of the flat nut type 90 and screws 91 for fixing the receiving profile 31 to the mounting profile, the nut being inserted through the groove 24 parallel to that then rotated 90 ° to ensure the fixing resting against the shoulder perpendicular to the groove. The fastening of the profile by screw is carried out by the same bores 39 and 39A for fixing the cover 33A to the base 33.

In another variant of installation of PCB diodes preferably in the upper mounting profile (variant shown in FIG. 13), the core of the mounting profile forms the carrier base of the PCBs with the diodes and the two projecting lateral walls 34. and 35 are attached to the web 20 of the mounting profile and preferably directly made integral with the web 20 of the mounting profile, for example by gluing.

The two protruding walls are preferably joined together, at least for the profile of the lower part, to form a closed and solid surface opposite the core, the surface being perforated in line with the diodes, for example as already shown in FIG. .

The assembly of a partition of the invention is made in the following manner with respect to the partition of FIGS. 1 and 2.

The lower and upper mounting profiles 2 are respectively fixed to the floor and the ceiling, their opening facing each other.

Shims 8 are optionally arranged on the bottom of the core 20 of the lower mounting profile.

The reception profile 31 intended to support the module is introduced into the lower mounting profile and disposed in its base against the wedge 8. A provisional retention of the profile can be performed to position it correctly in the space 26 of the mounting profile to be centered and parallel to the wings 21 and 22 of the mounting profile. This maintenance is for example made by double-sided tape.

The reception profile 31 intended to be fixed facing the upper horizontal side of the module, is fixed in the upper mounting profile 2.

The glass module is then positioned facing the mounting profiles and maintained inclined by introducing its upper side with the upper profile into the upper mounting profile when the upper mounting profile 2 does not have a removable side portion 22,

The upper mounting profile has in its interior space 26 a clearance between the core 20 and the upper profile 31 which is adapted to lift the module sufficiently to position it vertically and down to obtain the introduction of its lower horizontal side in the lower mounting profile. The protruding walls 34 and 35 of the upper profile protect the diodes during assembly of the module.

Finally, vertically descending the module, it is abutted against the side walls 34 and 35 and the solid surface 36 of the receiving section 31 of the lower mounting profile, protecting the diodes. The module is in place.

Sealing means 7 are arranged in the interstices separating the module from the free ends of the wings 21 and 22 of the mounting profiles 2.

Therefore, preferably according to the invention, for the lower part the side wall 34 (spacer or L-shaped profile) or the side walls 34 and 35 of the profile (or the spacer) with their zone closed 36 carry all (in the off-diode areas) or part of the slices of the glass sheets 10 and 1 1, the diodes 30 being protected from the weight of the module. The weight of the module imposed on the closed zone 36 is then transferred to the base of the profile and to the core of the lower mounting profile.

In all of the aforementioned embodiments, the width of the solid surface is (at least) equal to the width of the module wafer in non-diode zones at least for the lower portion.

Claims

Illuminating glass partition comprising at least one glass module (1A, 1B, 1C) having two main faces (14, 15) and a wafer (13), the module comprising at least one glass sheet ( 10, 1 1), and on the other hand a lighting system (3) characterized in that:

the lighting system (3) comprises light-emitting diodes (30) whose light-emitting face is disposed facing the edge (13) of at least one side of the module, the light-guiding module emitted by the diodes and the module comprising means for extracting the light (6) thus guided, for illumination via at least one of the main faces,

the diodes (30) are arranged on at least one support and power supply device (32), said PCB support,

the partition comprises at least one reception section (31) of the diodes which is provided with a longitudinal metal base (33) facing the edge of the module and carrying the PCB support, and

the partition comprises a mounting section of the partition comprising a web facing the wafer extending along the wafer, the mounting profile also comprising lateral wings on either side of the wafer of the module and associated with the module, the mounting profile defining an interior space (26) housing the diodes on the support (s) PCB (s), the base of the receiving profile being separate from the mounting profile or integrated into the mounting profile.

Partition according to claim 1, characterized in that the PCB support with the diodes, and preferably the base, are removable from the partition.

Partition according to any one of the preceding claims, characterized in that the base is a plate and the receiving profile optionally comprises side walls connected to the base opening at the periphery of the module faces, in particular for an installation on the upper side. Partition according to one of claims 1 or 2, characterized in that the partition comprises, in the interior space, a part capable of maintaining a spacing between the emitting face of the diodes and the module edge, in particular having a solid surface opposite at the base and / or one or more side walls protruding from the diodes in the direction of the wafer.

Partition according to one of the preceding claims, characterized in that the reception profile is secured to the glass module before insertion of the module in the mounting profile or is integral with the mounting profile, including the core before insertion of the module into the mounting profile.

Partition according to any one of the preceding claims, characterized in that the partition comprises, in the interior space, opposite the edge of the module, a solid surface (36), in particular forming a bearing abutment of the edge of the module, surface opposite the base (33) in at least out-of-diode areas, or even support (s) PCB, the solid surface extending longitudinally in the diode zone being perforated at the right of the diodes, including forming still stop support of the module edge in the area of the diodes.

Partition according to the preceding claim, characterized in that the module rests on the solid bearing surface (36) on at least 2/3 of the width of its wafer or the entire width of its wafer when the system lighting device (3) is arranged at the lower horizontal side of the module in the assembled position of the partition.

Partition according to one of the preceding claims, characterized in that the partition comprises, in the interior space, at least a first side wall to the diodes (34, 35), connected to the base of the reception profile, or two walls lateral (34,35) connected to the base of the receiving profile, the first side wall being at least partly opposite the edge of the module and arranged projecting from the emitting face of the diodes or the two side walls, preferably at least in part opposite the edge of the module, are arranged projecting from the emitting face of the diodes.

9. Partition according to any one of the preceding claims, characterized in that the partition, in the interior space, comprises a first and a second side wall to the diodes (34, 35) opposite the edge of the module and disposed in protrusion of the emitting face of the diodes and extending longitudinally to the base, the first and second walls being preferably reported or even bonded to the base, and in that the diodes and preferably their PCB support (s) are arranged between the first and second walls.

10. Partition according to any one of the preceding claims, characterized in that the partition comprises, between the edge of the module and the diodes, a hood covering the diodes and the PCB or supports and adapted to let the light of the diodes to the wafer of the module, and in particular forming a solid surface (36), the cover possibly extending longitudinally on the base, and preferably the cover is hollow with at least one U-shaped cross section or Ω.

1 1. Partition according to any one of the preceding claims, characterized in that the partition, in the interior space, comprises a first lateral wall to the diodes (34, 35) which is attached to the base or even to the PCB support and the base integrates the first side wall disposed projecting from the emitting face of the diodes, thereby forming a single piece including L-shaped.

12. Partition according to any one of the preceding claims, characterized in that the mounting profile (2) is said to be lower, and preferably the base is placed or fixed on one or more shims (8) placed on the core of the mounting profile, next to the edge of the module.

13. Partition according to any one of the preceding claims, characterized in that the web of the mounting profile, parallel to the edge of the module, is preferably perforated to fix said mounting profile by screwing.

14. Partition according to any one of the preceding claims, characterized in that the mounting profile comprises a shoulder having a longitudinal groove, the shoulder serving as a support surface to the base which is preferably fixed by a screw-nut assembly cooperating with the groove of the shoulder.

15. Partition wall according to any one of the preceding claims, characterized in that the mounting profile, in particular is made of several parts, including a U-shaped portion whose U cavity forms the interior space housing the diodes, and preferably the profile being provided with a removable or movable wing, and preferably comprising removable sealing means affixed between the module and the mounting profile, in particular fixed by clipping.

16. Partition according to any one of the preceding claims, characterized in that it is used outdoors, indoors, in a building or in a vehicle, in a public space, as a separation between rooms, compartment, separation to the interior of the same room, door, showcase, counter, interior decoration device, railing, furniture product, standing luminaire in particular with parallelepiped shape.

17. A method of mounting a partition to a floor or other lower reception surface according to any one of claims 1 to 16, characterized in that

the diodes are mounted in the mounting profile on the PCB support (s) and the part with the first protruding and lateral wall to the diodes, preferably the first wall being associated with the base of the reception profile with the PCB supports by pre-assembly ,

- the base is placed in the mounting profile,

the module or modules are placed on the first protruding wall, preferably on several lateral protruding walls on either side of the diodes

- It may replace a removable or movable side portion of the mounting profile.

18. A method of mounting a partition to a ceiling or against another upper reception surface according to any one of claims 1 at 16, characterized in that the diodes are mounted in the mounting profile on the PCB support (s) and the part with the first diode side wall and preferably pre-mounted protrusion, and preferably with a plurality of lateral projecting walls.

A method of mounting a partition to a ceiling or a floor according to claim 17 or 18, characterized in that the diodes or the PCB support is hooded by the solid perforated surface, preferably associated with the first wall.