EP2703711A1 - LED-Lampe und Wärmeableitungsvorrichtung dafür - Google Patents

LED-Lampe und Wärmeableitungsvorrichtung dafür Download PDF

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Publication number
EP2703711A1
EP2703711A1 EP12181990.8A EP12181990A EP2703711A1 EP 2703711 A1 EP2703711 A1 EP 2703711A1 EP 12181990 A EP12181990 A EP 12181990A EP 2703711 A1 EP2703711 A1 EP 2703711A1
Authority
EP
European Patent Office
Prior art keywords
heat dissipation
plural
base
led lamp
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12181990.8A
Other languages
English (en)
French (fr)
Inventor
Ching-Chuan Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wentai Technology Corp
Original Assignee
Wentai Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wentai Technology Corp filed Critical Wentai Technology Corp
Priority to EP12181990.8A priority Critical patent/EP2703711A1/de
Publication of EP2703711A1 publication Critical patent/EP2703711A1/de
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/023—Power supplies in a casing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED lamp and a heat dissipation device thereof especially to an LED lamp and a heat dissipation device thereof in which a base and a heat dissipation plate being installed, the base is installed with plural L-like shaped heat dissipation pipes, the outer side of a main body of the heat dissipation plate is formed with plural wavelike shaped fins, thereby having the advantages of smaller in volume, lighter in weight and more efficient in heat dissipation.
  • a LED lamp has the features of energy saving and long service life, therefore the LED lamp becomes the main stream for the next-generation lighting device.
  • a conventional LED lamp is often installed with a metal housing, the metal housing is integrally formed through aluminum extrusion or formed through processing a metal treatment, e.g. lathing or milling, to a solid aluminum bar, then the outer periphery thereof is formed with several heat dissipation fins for the purpose of heat dissipation.
  • 2011/0215696 is that the LED lamps disclosed in the aforesaid patents or patent application is installed with one or more heat dissipation pipes for transferring heat to the aluminum-extruded heat dissipation plate, so the heat dissipation can be conducted through the heat dissipation fins installed thereon, thereby increasing the heat dissipation efficiency.
  • the disclosed heat dissipation structure is complicated in manufacturing thereby causing the higher production cost, and the aluminum-extruded heat dissipation plate is large in volume, heavy in weight, thereby causing the volume of LED lamp to be incapable of reducing; the mentioned shortages shall be improved.
  • Another objective of the present invention is to provide a LED lamp, wherein a heat dissipation device provided therein is installed with a base and a heat dissipation plate, the base is installed with plural L-like shaped heat dissipation pipes, the outer side of a main body of the heat dissipation plate is formed with plural wavelike shaped fins, thereby increasing the heat dissipation efficiency and having the advantages of smaller in volume, lighter in weight and more efficient in heat dissipation.
  • the present invention provides a heat dissipation device, which includes: a base formed with plural recessed grooves at the bottom surface, and the inner end of each recessed groove is formed with a penetrated hole; plural heat dissipation pipes, wherein each heat dissipation pipe is hollow and formed in an L-like shape, one end thereof passes the base through the penetrated hole, the other end thereof is received in the recessed groove; and a heat dissipation plate having a main body, the center of the main body is formed with a chamber having its outer periphery installed with plural heat dissipation grooves, and each heat dissipation groove is arranged at equal interval, the outer side of the main body is formed with plural wavelike shaped heat dissipation fins.
  • the present invention provides a LED lamp, which comprises; a housing having an accommodation space; a heat dissipation device accommodated in the accommodation space; a substrate disposed at a lateral side of the heat dissipation device; a light emitting diode disposed on the substrate and used for emitting light; a light guide plate disposed at the front side of the substrate for guiding the light emitted by the light emitting diode; a lens disposed at the front side of the light guide plate, so the light emitted by the light emitting diode can be condensed then projected out of the lens; a front cover covered at the front end of the housing; a rear cover covered at the rear end of the housing; and a power unit coupled to the light emitting diode for supplying the electric power required by the light emitting diode.
  • FIG. 1 is a schematic exploded view illustrating the heat dissipation device according to one preferred embodiment of the present invention
  • FIG. 2 is a schematic view illustrating the assembly of the heat dissipation device according to one preferred embodiment of the present invention.
  • each heat dissipation pipe 20 is hollow and formed in an L-like shape, one end thereof can pass the base 10 through the penetrated hole 12, the other end thereof is received in the recessed groove 11.
  • the recessed grooves 11 are arranged at the bottom surface of the base 10 at equal angles.
  • the heat dissipation pipe 20 is filled with liquid or gas (both not shown in figures) thereby heat dissipation being enabled to be conducted through the gravity and capillary force of the heat dissipation pipe 20 and the air convection, wherein the liquid is e.g. but not limited to pure water.
  • the quantity of the heat dissipation pipe 20 can be altered according to the required power consumption of the LED lamp, when the power consumption of the LED lamp is small, less quantity of the heat dissipation pipe 20 is required, when the power consumption of the LED lamp is large, more heat dissipation pipes 20 can be adopted,
  • the heat dissipation plate 30 has a main body 31 having a chamber 32 formed in the center, the outer periphery of the chamber 32 is formed with plural heat dissipation grooves 33, and each heat dissipation groove 33 is arranged at an equal interval for being accommodated in the heat dissipation pipe 20, and the outer side of the main body 31 is formed with plural wavelike shaped heat dissipation fins 34 thereby increasing the heat dissipation area.
  • the heat dissipation device of the present invention is further installed with a fan 50 which is disposed at the top of the heat dissipation plate 30, thereby enabling the heat gathered in the heat dissipation plate 30 to be discharged for increasing the heat dissipation effect.
  • the fan 50 can be used for facilitating the heat at the distal end of the heat dissipation pipe 20 and the heat in the heat dissipation plate 30 to be discharged, thereby facilitating the heat dissipation effect of the heat dissipation device provided by the present invention, and enabling the effect of lowering temperature to be rapidly achieved.
  • FIG. 3 is a schematic exploded view illustrating the LED lamp according to another preferred embodiment of the present invention
  • FIG. 4 is a schematic view illustrating the assembly of the LED lamp according to another preferred embodiment of the present invention.
  • the present invention provides an LED lamp, which comprises: a housing 100; a heat dissipation device 110; a substrate 120; a light emitting diode 130; a light guide plate 140; a lens 150; a front cover 160; a rear cover 170; and a power unit 180.
  • the housing 100 is made of a metal material, e.g. but not limited to aluminum, an opening thereof is formed in a gradually-expanded state, and the housing 100 is formed with an accommodation space 101, the rear end of the housing 100 is formed with plural first ventilation grooves 102 and a wire hole 103, wherein the first ventilation grooves 102 can be used for assisting air to be introduced into the housing 100 with a convection means for the purpose of heat dissipation.
  • the wire hole 103 allows a wire 104 to enter the housing 100.
  • the heat dissipation device 110 is disposed in the accommodation space 101, made of a metal material, and further installed with: a base 111; plural heat dissipation pipes 112; a heat dissipation plate 113; a metal sleeve 114; and a fan 115.
  • each heat dissipation pipe 112 is hollow and formed in an L-like shape, one end thereof can pass the base 111 through the penetrated hole 1112, the other end thereof is received in the recessed groove 1111.
  • the recessed grooves 1111 are arranged at the bottom surface of the base 111 at equal angles.
  • the heat dissipation pipe 112 is filled with liquid or gas (both not shown in figures) thereby heat dissipation being enabled to be conducted through the gravity and capillary force of the heat dissipation pipe 12 and the air convection, wherein the liquid is e.g. but not limited to pure water.
  • the quantity of the heat dissipation pipe 112 can be altered according to the required power consumption of the LED lamp, when the power consumption of the LED lamp is small, less quantity of the heat dissipation pipe 112 is required, when the power consumption of the LED lamp is large, more heat dissipation pipes 112 can be adopted.
  • the fan 115 is disposed at the top of the heat dissipation plate 113, thereby enabling the heat gathered in the heat dissipation plate 113 to be discharged for increasing the heat dissipation effect.
  • the light guide plate 140 is disposed at the front side of the substrate 120 for guiding the light emitted by the light emitting diode 130.
  • one end of the power unit 180 When being used, one end of the power unit 180 is coupled to an AC power source (not shown in figures), the power unit 180 performs processes of voltage lowering and rectifying, then the wire 104 is used for transferring the DC power to the light emitting diode 130 and the fan 115, thereby enabling the light emitting diode 130 to emit light and enabling the fan 115 to operate.
  • the heat dissipation device has a base and a heat dissipation plate, the base is installed with plural L-like shaped heat dissipation pipes, the outer side of the main body of the heat dissipation plate is formed with plural wavelike shaped fins for increasing the heat dissipation efficiency, thereby having the advantages of smaller in volume, lighter in weigh and faster in heat dissipation.
  • the present invention is novel comparing to conventional LED lamp.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
EP12181990.8A 2012-08-28 2012-08-28 LED-Lampe und Wärmeableitungsvorrichtung dafür Withdrawn EP2703711A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP12181990.8A EP2703711A1 (de) 2012-08-28 2012-08-28 LED-Lampe und Wärmeableitungsvorrichtung dafür

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12181990.8A EP2703711A1 (de) 2012-08-28 2012-08-28 LED-Lampe und Wärmeableitungsvorrichtung dafür

Publications (1)

Publication Number Publication Date
EP2703711A1 true EP2703711A1 (de) 2014-03-05

Family

ID=46939519

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12181990.8A Withdrawn EP2703711A1 (de) 2012-08-28 2012-08-28 LED-Lampe und Wärmeableitungsvorrichtung dafür

Country Status (1)

Country Link
EP (1) EP2703711A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3025294A1 (fr) * 2014-09-01 2016-03-04 En Alternatives & Solaires Solutions Dispositif d'eclairage integrant une etancheite amelioree
EP3091278A4 (de) * 2014-12-31 2017-07-05 Icepipe Corporation Led-beleuchtungsvorrichtung
CN110748864A (zh) * 2019-11-22 2020-02-04 安徽润诚机电有限公司 一种led光源微短路保护装置

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080007954A1 (en) * 2006-07-05 2008-01-10 Jia-Hao Li Heat-Dissipating Structure For LED Lamp
US20090002995A1 (en) * 2007-06-27 2009-01-01 Foxconn Technology Co., Ltd. Led lamp
US7494249B2 (en) 2006-07-05 2009-02-24 Jaffe Limited Multiple-set heat-dissipating structure for LED lamp
US20100084116A1 (en) 2008-10-07 2010-04-08 Shyh-Ming Chen Structure of heat sink
EP2180249A1 (de) * 2008-10-24 2010-04-28 Hyundai Telecommunication Co., Ltd. Kreisartiger LED-Beleuchtungsarbeitsscheinwerfer mit einem Nano-Verteiler
US20100141108A1 (en) * 2008-12-08 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led illuminating device and light engine thereof
US7744250B2 (en) 2007-07-12 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp with a heat dissipation device
US7748876B2 (en) 2007-08-10 2010-07-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp with a heat sink assembly
US20100243211A1 (en) 2009-03-24 2010-09-30 Meyer Iv George Anthony Heat dissipating structure of high power led projector lamp
US20100309671A1 (en) * 2009-06-09 2010-12-09 Meyer Iv George Anthony Led lamp heat dissipating module
WO2011028805A2 (en) * 2009-09-01 2011-03-10 Savenergy Inc. Cooled led lighting assemblies
US20110215696A1 (en) 2010-03-03 2011-09-08 Cree, Inc. Led based pedestal-type lighting structure
US20110221324A1 (en) 2010-03-13 2011-09-15 Zhongshan Weiqiang Technology Co., Ltd Light emitting diode (led) lamp

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7494249B2 (en) 2006-07-05 2009-02-24 Jaffe Limited Multiple-set heat-dissipating structure for LED lamp
US20080007954A1 (en) * 2006-07-05 2008-01-10 Jia-Hao Li Heat-Dissipating Structure For LED Lamp
US20090002995A1 (en) * 2007-06-27 2009-01-01 Foxconn Technology Co., Ltd. Led lamp
US7744250B2 (en) 2007-07-12 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp with a heat dissipation device
US7748876B2 (en) 2007-08-10 2010-07-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. LED lamp with a heat sink assembly
US20100084116A1 (en) 2008-10-07 2010-04-08 Shyh-Ming Chen Structure of heat sink
EP2180249A1 (de) * 2008-10-24 2010-04-28 Hyundai Telecommunication Co., Ltd. Kreisartiger LED-Beleuchtungsarbeitsscheinwerfer mit einem Nano-Verteiler
US20100141108A1 (en) * 2008-12-08 2010-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Led illuminating device and light engine thereof
US20100243211A1 (en) 2009-03-24 2010-09-30 Meyer Iv George Anthony Heat dissipating structure of high power led projector lamp
US20100309671A1 (en) * 2009-06-09 2010-12-09 Meyer Iv George Anthony Led lamp heat dissipating module
WO2011028805A2 (en) * 2009-09-01 2011-03-10 Savenergy Inc. Cooled led lighting assemblies
US20110215696A1 (en) 2010-03-03 2011-09-08 Cree, Inc. Led based pedestal-type lighting structure
US20110221324A1 (en) 2010-03-13 2011-09-15 Zhongshan Weiqiang Technology Co., Ltd Light emitting diode (led) lamp

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3025294A1 (fr) * 2014-09-01 2016-03-04 En Alternatives & Solaires Solutions Dispositif d'eclairage integrant une etancheite amelioree
EP3091278A4 (de) * 2014-12-31 2017-07-05 Icepipe Corporation Led-beleuchtungsvorrichtung
CN110748864A (zh) * 2019-11-22 2020-02-04 安徽润诚机电有限公司 一种led光源微短路保护装置

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