EP2653018B1 - Control device and method for producing a control device - Google Patents

Control device and method for producing a control device Download PDF

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Publication number
EP2653018B1
EP2653018B1 EP11778881.0A EP11778881A EP2653018B1 EP 2653018 B1 EP2653018 B1 EP 2653018B1 EP 11778881 A EP11778881 A EP 11778881A EP 2653018 B1 EP2653018 B1 EP 2653018B1
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EP
European Patent Office
Prior art keywords
printed circuit
housing
circuit board
control device
damping element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP11778881.0A
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German (de)
French (fr)
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EP2653018A1 (en
Inventor
Markus Kroeckel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
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Robert Bosch GmbH
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Filing date
Publication date
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Publication of EP2653018A1 publication Critical patent/EP2653018A1/en
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Publication of EP2653018B1 publication Critical patent/EP2653018B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0039—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally

Definitions

  • the invention relates to a control device according to the preamble of claim 1. Furthermore, the invention relates to a method for producing a control device according to the invention.
  • a control device is already well known.
  • a printed circuit board is inserted into a so-called "plug-in housing" until it has arrived in its insertion direction in an end position within the housing.
  • the insertion is facilitated if necessary by strip-like guides for the circuit board, so that damage during insertion or insertion of the circuit board can be avoided in the housing.
  • the circuit board is fixed, for example via a connected to the circuit board, frontally arranged on the housing connector strip within the housing.
  • Critical in such housing designs is the vibration stress of the circuit board during operation of the control device within a motor vehicle. In particular, it is necessary that the circuit board is not excited to vibrations or vibrations, which can influence or damage, for example, the solder joints of the electronic components.
  • a housing for a control unit which has a hood-like cover.
  • the lid is connected under edge-side intermediate layer of the circuit board to the base plate.
  • this has an elastic damping element which is arranged between the printed circuit board and the facing side of the hood-shaped cover part, wherein the damping element presses with a certain axial force on the circuit board and thus absorbs or dampens vibrations of the printed circuit board.
  • a device which is provided for vibration-free supporting a composite of a plurality of circuit boards in a housing.
  • the device has an elastic compensation ring, which is arranged on one of the inner wall of the housing facing side of a printed circuit board and which is pressed by a movable pressure piece against the printed circuit board.
  • the pressure piece is fastened by means of a locking bolt in a through hole of a printed circuit board.
  • the present invention seeks to further develop a control device according to the preamble of claim 1 such that even with the use of so-called plug-in housings vibration stress of the circuit board can be avoided during operation of the control unit in a motor vehicle.
  • This object is achieved in a control device with the features of claim 1.
  • the invention is based on the idea of providing at least one damping element which is fastened to the printed circuit board, wherein the housing of the control device has a deformation section which comes into operative connection with the damping element by dents. In other words, this means that despite the damping element, it is possible to insert the printed circuit board into a plug-in housing without the damping element coming into contact with components within the control device or of the housing. Only in the end position of the circuit board within the housing, the required connection between the damping element, the circuit board and the housing of the controller is formed by denting the deformation section.
  • both printed circuit boards are arranged vibration-insulated in the housing. It is provided that between the circuit boards a damping element is arranged and that the damping element is preferably arranged in alignment with the other damping elements.
  • the insertion of the printed circuit board or the printed circuit boards in the housing is facilitated if the housing has guide elements for the at least one printed circuit board, which are aligned in the insertion direction of the at least one printed circuit board.
  • the housing in the region of the deformation region has a separate, connected to the housing additional element which projects in the direction of the circuit board, and cooperates in the mounted state of the at least one circuit board after dousing with the damping element.
  • the housing in the region of the deformation region has a vorgedelltes, in particular produced by deep drawing housing , wherein the deformation region protrudes in the direction of the printed circuit board and cooperates in the mounted state of the at least one printed circuit board after drowning with the damping element.
  • the invention also includes a method for producing a control device according to the invention.
  • a method for producing a control device in this case, it is provided that, in the end position of the at least one printed circuit board in the housing, at least one deformation region of the housing is dented in a direction perpendicular to the at least one printed circuit board from the outside of the housing and at least in clamping engagement with one another a, arranged in alignment with the deformation region damping element is brought.
  • Such a method allows easy installation or trouble-free insertion of the at least one printed circuit board in the housing.
  • a first inventive control device 10 is shown, as it is used in particular as a control unit 10 in a motor vehicle.
  • the control unit 10 is preferably fixed to the body of the motor vehicle, possibly via additional support elements or holding elements.
  • the control unit 10 has a so-called "plug-in housing", the housing 11 is at least substantially cup-shaped.
  • the housing 11 has a bottom wall 12, a top wall 13, two side walls 14, of which only one side wall 14 in the Fig. 1 to 3 is recognizable, and has a bottom 15.
  • the walls 12, 13, the side walls 14 and the bottom 15 may each be formed as separate components, or preferably at least partially, for example by deep drawing, be formed as a one-piece component.
  • the lower wall 12 and the upper wall 13 of the housing 11 are made of sheet metal or plastically deformable material.
  • guide elements 16, for example in the form of beads or separate components, which preferably extend over the entire length of the two side walls 14, ie from the opening 18 of the housing 11 to the bottom 15, are respectively arranged on the housing inner side on the two side walls 14.
  • a circuit carrier in the form of a printed circuit board 20 is arranged.
  • the printed circuit board 20 carries on its upper side or its underside unillustrated electrical or electronic components. It is essential to the invention that two damping elements 22, 23 are connected to the printed circuit board 20 in the exemplary embodiment.
  • the upper damping element 22 arranged on the upper side of the printed circuit board 20 has a greater height than the lower damping element 23 arranged on the underside of the printed circuit board 20.
  • the upper damping element 22 is conically shaped in cross-section with a rounded tip, while the lower one Damping element 23 is formed substantially cylindrical.
  • the two damping elements 22, 23 are connected in a manner not shown to the printed circuit board 20, e.g. by gluing or by a mechanical component not recognizable in the figures. Furthermore, the damping elements 22, 23 made of an elastic material, such as a rubber, which is elastically deformable in a direction, in particular perpendicular to the plane of the circuit board 20.
  • the housing 11 has a first deformation region 24 on its upper wall 13 and a second deformation region 25 on the lower wall 12.
  • the two deformation regions 24, 25 already in the manufacturing process of the housing 11, in particular when the two walls 12, 13 of the housing 11 are formed by a deep-drawing process, in the form of indentations (pre-) were formed.
  • the first deformation region 24 has a depth T1.
  • the second deformation region 25 has a depth T2, wherein T2 is smaller than T1.
  • the two deformation regions 24, 25 are further arranged in a plane perpendicular to the walls 12, 13 in alignment with each other and, for example, at least on the end face of the printed circuit board 20 facing spherical segment shaped.
  • the first deformation region 24 can also be formed, for example, by an additional element 27 arranged on the inner side of the housing, which is arranged in operative connection with the upper wall 13 of the housing 11.
  • the assembly process of the controller 10 is carried out according to the sequence of Fig. 1 to 3 such that the circuit board 20 is inserted with the pre-mounted damping elements 22, 23 in the direction of arrow 28 in the housing 11.
  • the guide elements 16 prevent, in particular, that components arranged on the printed circuit board 20 are mechanically damaged or damaged during the insertion of the printed circuit board 20 into the housing 11.
  • end position of the circuit board 20 in the housing 11 are the two damping elements 22, 23 aligned with the two deformation regions 24, 25 or aligned with these, but initially still a distance (not shown) between the damping elements 22, 23 and the deformation regions 24th , 25 exists.
  • the deformation areas 24, 25 continue to push in the direction of the two damping elements 22, 23 until this come into operative connection with the damping elements 22, 23 and apply this to a specific contact force.
  • damping elements 22, 23 are provided on the printed circuit board 20.
  • shape or the cross section of the damping elements 22, 23 is not limited to the illustrated conical or cylindrical damping elements 22, 23. It is also conceivable, for example, to dispense with one of the two damping elements 22, 23, so that the printed circuit board 20 in a plane perpendicular to its extension against a fixed stop, e.g. is pressed against the guide elements 16 as soon as the corresponding embossing force F is exerted on the one damping element 22, 23.
  • the control unit 10a has two printed circuit boards 30, 31, which are arranged parallel to each other within the housing 32, and which are electrically connected to each other by means of an electrical connection element 33, in particular a stranded wire. Furthermore, it can be seen that the housing 32 of the control device 10a for the two printed circuit boards 30, 31 in each case over the longitudinal direction of the housing 32 extending guides 35, 36, which are formed for example by a thermoforming process. On the upper side of the upper printed circuit board 30, a first damping element 37 is arranged, and on the underside of the lower printed circuit board 31, a second damping element 38.
  • a third damping element 39 is arranged, which is arranged in alignment with the two other damping elements 37, 38.
  • This third, in advance attached to the circuit boards 30, 31 damping element 39 simultaneously ensures the correct distance between the two circuit boards 30, 31 when inserted into the housing 32, so that damage to components can be excluded.
  • the assembly process of the control device 10a takes place in such a way that initially the two printed circuit boards 30, 31 are pushed completely into their end position into the housing 32 of the control device 10a. Subsequently, i. Only after the two printed circuit boards 30, 31 have reached their end position are the impressions 43, 44 formed by applying a corresponding stamping force F in the region of the two deformation regions 41, 42. The deformation regions 41, 42 are thus flat prior to the formation of the indentations 43, 44.
  • Such an assembly or manufacturing process in which the deformation regions 41, 42 or the impressions 43, 44 are formed only after reaching the end position of the printed circuit boards 30, 31 in the housing 32, compared to the control unit 10, in which the deformation regions 24th , 25 already partially preformed have the advantage that the components on the circuit boards 30, 31 may also have a relatively large height, without them when inserting the circuit boards 30, 31 can come into conflict with vorgegargten deformation areas 24, 25.
  • control unit 10b which differs from the control unit 10a in that in the control unit 10b or in the housing 46 of the control unit 10b, the deformation regions 47, 48 in the form of indentations 49, 50 are already preformed.
  • the assembly process of the control device 10b corresponds to the control device 10a, only two printed circuit boards 31, 31 are used in the control device 10b.
  • control devices 10, 10a, 10b described so far can be modified or modified in many ways without deviating from the idea of the invention.
  • This consists in the use of damping elements 22, 23, 37 to 39 in a slide-in housing, after the assembly of the printed circuit board 20 and the printed circuit boards 30, 31 in operative connection with housing sections, in particular by plastic deformation of the housing 11, 32, 46 arrive ,

Description

Stand der TechnikState of the art

Die Erfindung betrifft ein Steuergerät nach dem Oberbegriff des Anspruchs 1. Ferner betrifft die Erfindung ein Verfahren zum Herstellen eines erfindungsgemäßen Steuergeräts.The invention relates to a control device according to the preamble of claim 1. Furthermore, the invention relates to a method for producing a control device according to the invention.

Ein Steuergerät nach dem Oberbegriff des Anspruchs 1 ist bereits allgemein bekannt. Dabei wird eine Leiterplatte in ein sogenanntes "Einschubgehäuse" eingeschoben, bis diese in ihrer Einschubrichtung in einer Endposition innerhalb des Gehäuses angekommen ist. Das Einschieben wird hierbei ggf. durch leistenartige Führungen für die Leiterplatte erleichtert, so dass Beschädigungen beim Einführen bzw. Einschieben der Leiterplatte in das Gehäuse vermieden werden können. In der Endposition innerhalb des Gehäuses wird die Leiterplatte beispielsweise über eine mit der Leiterplatte verbundene, stirnseitig am Gehäuse angeordnete Steckerleiste innerhalb des Gehäuses fixiert. Kritisch bei derartigen Gehäusekonstruktionen ist die Vibrationsbelastung der Leiterplatte beim Betrieb des Steuergeräts innerhalb eines Kraftfahrzeugs. Insbesondere ist es erforderlich, dass die Leiterplatte nicht zu Vibrationen bzw. Schwingungen angeregt wird, die beispielsweise die Lötverbindungen der elektronischen Bauteile beeinflussen bzw. schädigen können.A control device according to the preamble of claim 1 is already well known. In this case, a printed circuit board is inserted into a so-called "plug-in housing" until it has arrived in its insertion direction in an end position within the housing. The insertion is facilitated if necessary by strip-like guides for the circuit board, so that damage during insertion or insertion of the circuit board can be avoided in the housing. In the end position within the housing, the circuit board is fixed, for example via a connected to the circuit board, frontally arranged on the housing connector strip within the housing. Critical in such housing designs is the vibration stress of the circuit board during operation of the control device within a motor vehicle. In particular, it is necessary that the circuit board is not excited to vibrations or vibrations, which can influence or damage, for example, the solder joints of the electronic components.

Weiterhin ist aus dem Stand der Technik ein Gehäuse für ein Steuergerät bekannt, das einen haubenartigen Deckel aufweist. Hierbei wird der Deckel unter randseitiger Zwischenlage der Leiterplatte mit der Grundplatte verbunden. Zur Vermeidung der angesprochenen Vibrationsbelastungen der Leiterplatte weist diese dabei ein elastisches Dämpfungselement auf, das zwischen der Leiterplatte und der zugewandten Seite des haubenförmigen Deckelteils angeordnet ist, wobei das Dämpfungselement mit einer gewissen Axialkraft auf die Leiterplatte drückt und somit Schwingungen der Leiterplatte absorbiert bzw. dämpft.Furthermore, a housing for a control unit is known from the prior art, which has a hood-like cover. In this case, the lid is connected under edge-side intermediate layer of the circuit board to the base plate. In order to avoid the aforementioned vibration loads of the printed circuit board, this has an elastic damping element which is arranged between the printed circuit board and the facing side of the hood-shaped cover part, wherein the damping element presses with a certain axial force on the circuit board and thus absorbs or dampens vibrations of the printed circuit board.

Aus der DE 35 31 958 A1 ist eine Vorrichtung bekannt, die zum vibrationsfreien Abstützen eines Verbunds aus mehreren Leiterplatten in einem Gehäuse vorgesehen ist. Die Vorrichtung weist einen elastischen Ausgleichsring auf, der auf einer der Innenwand des Gehäuses zugewandten Seite einer Leiterplatte angeordnet ist und der von einem beweglichen Druckstück gegen die Leiterplatte gedrückt wird. Das Druckstück wird dabei mittels eines Rastbolzens in einer Durchgangsöffnung einer Leiterplatte befestigt. Beim Einschieben der Anordnung aus Leiterplatte und Druckstück in das Gehäuse, wird das Druckstück gegen den Ausgleichsring gedrückt. bis das Druckstück an einer Innenwand des Gehäuses anliegt. Dadurch wird eine vibrations- und spannungsarme Halterung der Leiterplatte erzielt.From the DE 35 31 958 A1 a device is known which is provided for vibration-free supporting a composite of a plurality of circuit boards in a housing. The device has an elastic compensation ring, which is arranged on one of the inner wall of the housing facing side of a printed circuit board and which is pressed by a movable pressure piece against the printed circuit board. The pressure piece is fastened by means of a locking bolt in a through hole of a printed circuit board. When inserting the arrangement of printed circuit board and pressure piece in the housing, the pressure piece is pressed against the balance ring. until the pressure piece bears against an inner wall of the housing. As a result, a vibration and low-voltage mounting of the circuit board is achieved.

Offenbarung der ErfindungDisclosure of the invention

Ausgehend von dem dargestellten Stand der Technik liegt der Erfindung die Aufgabe zugrunde, ein Steuergerät nach dem Oberbegriff des Anspruchs 1 derart weiterzubilden, dass auch bei der Verwendung von sogenannten Einschubgehäusen Vibrationsbelastungen der Leiterplatte während des Betriebs des Steuergeräts in einem Kraftfahrzeug vermieden werden. Diese Aufgabe wird bei einem Steuergerät mit den Merkmalen des Anspruchs 1 gelöst. Der Erfindung liegt dabei die Idee zugrunde, wenigstens ein Dämpfungselement vorzusehen, das an der Leiterplatte befestigt ist, wobei das Gehäuse des Steuergeräts einen Deformationsabschnitt aufweist, der durch Eindellen mit dem Dämpfungselement in Wirkverbindung gelangt. Mit anderen Worten gesagt bedeutet dies, dass es trotz des Dämpfungselements möglich ist, die Leiterplatte in ein Einschubgehäuse einzuschieben, ohne dass das Dämpfungselement dabei mit Bauteilen innerhalb des Steuergeräts bzw. des Gehäuses in Kontakt gerät. Erst in der Endposition der Leiterplatte innerhalb des Gehäuses wird die erforderliche Verbindung zwischen dem Dämpfungselement, der Leiterplatte und dem Gehäuse des Steuergeräts durch Eindellen des Deformationsabschnitts ausgebildet.Based on the illustrated prior art, the present invention seeks to further develop a control device according to the preamble of claim 1 such that even with the use of so-called plug-in housings vibration stress of the circuit board can be avoided during operation of the control unit in a motor vehicle. This object is achieved in a control device with the features of claim 1. The invention is based on the idea of providing at least one damping element which is fastened to the printed circuit board, wherein the housing of the control device has a deformation section which comes into operative connection with the damping element by dents. In other words, this means that despite the damping element, it is possible to insert the printed circuit board into a plug-in housing without the damping element coming into contact with components within the control device or of the housing. Only in the end position of the circuit board within the housing, the required connection between the damping element, the circuit board and the housing of the controller is formed by denting the deformation section.

Vorteilhafte Weiterbildungen des erfindungsgemäßen Steuergeräts sind in den Unteransprüchen angegeben.Advantageous developments of the control device according to the invention are specified in the subclaims.

Besonders bevorzugt ist eine Ausgestaltung der Erfindung, bei der auf jeweils beiden Seiten der Leiterplatte ein Dämpfungselement angeordnet ist. Dadurch lassen sich insbesondere Biegespannungen auf die Leiterplatte durch die axiale Kraft infolge der Dämpfungselemente vermeiden.Particularly preferred is an embodiment of the invention, in which a damping element is arranged on both sides of the printed circuit board. As a result, in particular bending stresses can be avoided on the circuit board by the axial force due to the damping elements.

Auch ist es möglich, ein Steuergerät zu realisieren, in dessen Gehäuse zwei Leiterplatten angeordnet sind, wobei beide Leiterplatten vibrationsgedämmt im Gehäuse angeordnet sind. Hierbei ist es vorgesehen, dass zwischen den Leiterplatten ein Dämpfungselement angeordnet ist und dass das Dämpfungselement vorzugsweise zu den anderen Dämpfungselementen fluchtend angeordnet ist.It is also possible to realize a control device, in the housing two printed circuit boards are arranged, both printed circuit boards are arranged vibration-insulated in the housing. It is provided that between the circuit boards a damping element is arranged and that the damping element is preferably arranged in alignment with the other damping elements.

Das Einführen der Leiterplatte bzw. der Leiterplatten in das Gehäuse wird erleichtert, wenn das Gehäuse Führungselemente für die wenigstens eine Leiterplatte aufweist, die in Einschubrichtung der wenigstens einen Leiterplatte ausgerichtet sind.The insertion of the printed circuit board or the printed circuit boards in the housing is facilitated if the housing has guide elements for the at least one printed circuit board, which are aligned in the insertion direction of the at least one printed circuit board.

In einer weiteren Ausgestaltung der Erfindung ist es vorgesehen, dass das Gehäuse im Bereich des Deformationsbereichs ein separates, mit dem Gehäuse verbundenes Zusatzelement aufweist, das in Richtung der Leiterplatte ragt, und im montierten Zustand der wenigstens einen Leiterplatte nach dem Eindellen mit dem Dämpfungselement zusammenwirkt. Dadurch können relativ niedrig bzw. kurz bauende Dämpfungselemente eingesetzt werden, wobei zwischen der Leiterplatte und der zugewandten Seite des Gehäuses ein relativ großer Abstand ausgebildet sein kann. Trotzdem ist nur eine relativ geringe Eindellung an dem Deformationsbereich erforderlich, da der axiale Abstand zwischen der Leiterplatte bzw. dem Dämpfungselement und dem Gehäuse durch das Zusatzelement überbrückt werden kann. Weiterhin lassen sich durch die Länge bzw. die Eigenschaften des Zusatzelements die Dämpfungseigenschaften in gewünschter Art und Weise relativ einfach beeinflussen.In a further embodiment of the invention, it is provided that the housing in the region of the deformation region has a separate, connected to the housing additional element which projects in the direction of the circuit board, and cooperates in the mounted state of the at least one circuit board after dousing with the damping element. As a result, relatively low or short design damping elements can be used, wherein between the circuit board and the side facing the housing, a relatively large distance can be formed. Nevertheless, only a relatively small indentation on the deformation area is required because the axial distance between the circuit board or the damping element and the housing can be bridged by the additional element. Furthermore, can be relatively easily influenced by the length or the properties of the additional element, the damping properties in the desired manner.

Um das Eindellen bzw. Ausbilden des Deformationsabschnitts während der Fertigung bzw. der Montage der Leiterplatte im Gehäuse zu vereinfachen, ist es darüber hinaus in einer vorteilhaften Ausgestaltung der Erfindung vorgesehen, dass das Gehäuse im Bereich des Deformationsbereichs ein vorgedelltes, insbesondere durch Tiefziehen hergestelltes Gehäuse aufweist, wobei der Deformationsbereichs in Richtung der Leiterplatte ragt und im montierten Zustand der wenigstens einen Leiterplatte nach dem Eindellen mit dem Dämpfungselement zusammenwirkt.In order to simplify the denting or forming of the deformation section during production or assembly of the printed circuit board in the housing, it is also provided in an advantageous embodiment of the invention that the housing in the region of the deformation region has a vorgedelltes, in particular produced by deep drawing housing , wherein the deformation region protrudes in the direction of the printed circuit board and cooperates in the mounted state of the at least one printed circuit board after drowning with the damping element.

Die Erfindung umfasst auch ein Verfahren zum Herstellen eines erfindungsgemäßen Steuergeräts. Hierbei ist es vorgesehen, dass in der Endposition der wenigstens einen Leiterplatte in dem Gehäuse wenigstens ein Deformationsbereich des Gehäuses in einer Richtung senkrecht zur wenigstens einen Leiterplatte von der Gehäuseaußenseite eingedellt und in klemmender Wirkverbindung zu wenigstens einem, in Ausrichtung mit dem Deformationsbereich angeordneten Dämpfungselement gebracht wird. Ein derartiges Verfahren ermöglicht eine problemlose Montage bzw. ein problemloses Einführen der wenigstens einen Leiterplatte in das Gehäuse.The invention also includes a method for producing a control device according to the invention. In this case, it is provided that, in the end position of the at least one printed circuit board in the housing, at least one deformation region of the housing is dented in a direction perpendicular to the at least one printed circuit board from the outside of the housing and at least in clamping engagement with one another a, arranged in alignment with the deformation region damping element is brought. Such a method allows easy installation or trouble-free insertion of the at least one printed circuit board in the housing.

Weitere Vorteile, Merkmale und Einzelheiten der Erfindung ergeben sich aus der nachfolgenden Beschreibung bevorzugter Ausführungsbeispiele sowie anhand der Zeichnung.Further advantages, features and details of the invention will become apparent from the following description of preferred embodiments and from the drawing.

Diese zeigt in:

Fig. 1 bis 3
jeweils vereinfachte Längsschnitte durch ein erfindungsgemäßes Steuergerät mit einer Leiterplatte während verschiedener Montagephasen,
Fig. 4 und 5
einen Querschnitt, bzw. einen Längsschnitt durch ein Steuergerät, in dessen Gehäuse zwei Leiterplatten angeordnet sind, bevor die Leiterplatten im Gehäuse über Dämpfungselemente fixiert sind,
Fig. 6 und 7
einen Querschnitt bzw. einen Längsschnitt durch das Steuergerät gemäß Fig. 4 und 5 nach dem Fixieren der beiden Leiterplatten und
Fig. 8 bis 10
ein gegenüber den Fig. 4 und 5 modifiziertes Gehäuse zur Verwendung mit zwei Leiterplatten bei der Montage der Leiterplatten während verschiedener Zeitpunkte, jeweils im Längsschnitt.
This shows in:
Fig. 1 to 3
simplified longitudinal sections through an inventive control device with a printed circuit board during different assembly phases,
4 and 5
a cross section, or a longitudinal section through a control unit, in the housing two printed circuit boards are arranged before the circuit boards are fixed in the housing via damping elements,
6 and 7
a cross section and a longitudinal section through the control unit according to 4 and 5 after fixing the two circuit boards and
Fig. 8 to 10
one opposite the 4 and 5 modified housing for use with two printed circuit boards during assembly of printed circuit boards at different times, each in a longitudinal section.

Gleiche Bauteile, bzw. Bauteile mit gleicher Funktion sind in den Figuren mit den gleichen Bezugsziffern versehen.The same components or components with the same function are provided in the figures with the same reference numerals.

In der Fig. 3 ist ein erstes erfindungsgemäßes Steuergerät 10 dargestellt, wie es insbesondere als Steuergerät 10 in einem Kraftfahrzeug verwendet wird. Hierbei ist das Steuergerät 10 vorzugsweise mit der Karosserie des Kraftfahrzeugs, gegebenenfalls über zusätzliche Trägerelemente bzw. Halteelemente, fest verbunden.In the Fig. 3 a first inventive control device 10 is shown, as it is used in particular as a control unit 10 in a motor vehicle. In this case, the control unit 10 is preferably fixed to the body of the motor vehicle, possibly via additional support elements or holding elements.

Das Steuergerät 10 weist ein sogenanntes "Einschubgehäuse" auf, dessen Gehäuse 11 zumindest im Wesentlichen topfförmig ausgebildet ist. Das bedeutet, dass das Gehäuse 11 eine untere Wand 12, eine obere Wand 13, zwei Seitenwände 14, von denen lediglich eine Seitenwand 14 in den Fig. 1 bis 3 erkennbar ist, sowie einen Boden 15 aufweist. Die Wände 12, 13, die Seitenwände 14 sowie der Boden 15 können dabei jeweils als separate Bauteile ausgebildet sein, oder vorzugsweise zumindest teilweise, beispielsweise durch Tiefziehen, als einstückiges Bauteil ausgebildet sein. Insbesondere bestehen die untere Wand 12 und die obere Wand 13 des Gehäuses 11 aus Blech bzw. plastisch verformbarem Material. Ferner sind an der Gehäuseinnenseite an den beiden Seitenwänden 14 jeweils Führungselemente 16, z.B. in Form von Sicken oder separaten Bauteilen angeordnet, die vorzugsweise über die gesamte Länge der beiden Seitenwände 14, d.h. von der Öffnung 18 des Gehäuses 11 bis zum Boden 15 reichen.The control unit 10 has a so-called "plug-in housing", the housing 11 is at least substantially cup-shaped. This means that the housing 11 has a bottom wall 12, a top wall 13, two side walls 14, of which only one side wall 14 in the Fig. 1 to 3 is recognizable, and has a bottom 15. The walls 12, 13, the side walls 14 and the bottom 15 may each be formed as separate components, or preferably at least partially, for example by deep drawing, be formed as a one-piece component. In particular, the lower wall 12 and the upper wall 13 of the housing 11 are made of sheet metal or plastically deformable material. Furthermore, guide elements 16, for example in the form of beads or separate components, which preferably extend over the entire length of the two side walls 14, ie from the opening 18 of the housing 11 to the bottom 15, are respectively arranged on the housing inner side on the two side walls 14.

Innerhalb des Gehäuses 11 ist ein Schaltungsträger in Form einer Leiterplatte 20 angeordnet. Die Leiterplatte 20 trägt auf ihrer Oberseite bzw. ihrer Unterseite nicht dargestellte elektrische oder elektronische Bauteile. Erfindungswesentlich ist, dass mit der Leiterplatte 20 im Ausführungsbeispiel zwei Dämpfungselemente 22, 23 verbunden sind. Hierbei weist das auf der Oberseite der Leiterplatte 20 angeordnete obere Dämpfungselement 22 eine größere Höhe auf als das an der Unterseite der Leiterplatte 20 angeordnete untere Dämpfungselement 23. Im dargestellten Ausführungsbeispiel ist das obere Dämpfungselement 22 im Querschnitt kegelförmig mit einer gerundeten Spitze ausgebildet, während das untere Dämpfungselement 23 im Wesentlichen zylindrisch ausgebildet ist.Within the housing 11, a circuit carrier in the form of a printed circuit board 20 is arranged. The printed circuit board 20 carries on its upper side or its underside unillustrated electrical or electronic components. It is essential to the invention that two damping elements 22, 23 are connected to the printed circuit board 20 in the exemplary embodiment. In this case, the upper damping element 22 arranged on the upper side of the printed circuit board 20 has a greater height than the lower damping element 23 arranged on the underside of the printed circuit board 20. In the exemplary embodiment shown, the upper damping element 22 is conically shaped in cross-section with a rounded tip, while the lower one Damping element 23 is formed substantially cylindrical.

Die beiden Dämpfungselemente 22, 23 sind auf nicht näher dargestellte Art und Weise mit der Leiterplatte 20 fest verbunden, z.B. durch eine Klebung oder durch ein mechanisches, in den Figuren nicht erkennbares Bauteil. Weiterhin bestehen die Dämpfungselemente 22, 23 aus einem elastischen Material, beispielsweise einem Gummi, der in einer Richtung insbesondere senkrecht zur Ebene der Leiterplatte 20 elastisch deformierbar ist.The two damping elements 22, 23 are connected in a manner not shown to the printed circuit board 20, e.g. by gluing or by a mechanical component not recognizable in the figures. Furthermore, the damping elements 22, 23 made of an elastic material, such as a rubber, which is elastically deformable in a direction, in particular perpendicular to the plane of the circuit board 20.

Das Gehäuse 11 weist an seiner oberen Wand 13 einen ersten Deformationsbereich 24, und an der unteren Wand 12 einen zweiten Deformationsbereich 25 auf. Hierbei kann es vorgesehen sein, dass die beiden Deformationsbereiche 24, 25 bereits beim Herstellungsprozess des Gehäuses 11, insbesondere wenn die beiden Wände 12, 13 des Gehäuses 11 durch einen Tiefziehprozess ausgebildet sind, in Form von Eindellungen (vor-) ausgebildet wurden. Ferner erkennt man anhand der Figuren, dass der erste Deformationsbereich 24 eine Tiefe T1 aufweist. Demgegenüber weist der zweite Deformationsbereich 25 eine Tiefe T2 auf, wobei T2 kleiner ist als T1. Die beiden Deformationsbereiche 24, 25 sind ferner in einer Ebene senkrecht zu den Wänden 12, 13 fluchtend zueinander angeordnet und beispielsweise zumindest auf an dem der Leiterplatte 20 zugewandten Endbereich kugelabschnittsförmig geformt.The housing 11 has a first deformation region 24 on its upper wall 13 and a second deformation region 25 on the lower wall 12. In this case, it can be provided that the two deformation regions 24, 25 already in the manufacturing process of the housing 11, in particular when the two walls 12, 13 of the housing 11 are formed by a deep-drawing process, in the form of indentations (pre-) were formed. Furthermore, it can be seen from the figures that the first deformation region 24 has a depth T1. In contrast, the second deformation region 25 has a depth T2, wherein T2 is smaller than T1. The two deformation regions 24, 25 are further arranged in a plane perpendicular to the walls 12, 13 in alignment with each other and, for example, at least on the end face of the printed circuit board 20 facing spherical segment shaped.

Ergänzend wird erwähnt, dass der erste Deformationsbereich 24 auch beispielsweise durch ein an der Gehäuseinnenseite angeordnetes Zusatzelement 27 gebildet sein kann, das in Wirkverbindung mit der oberen Wand 13 des Gehäuses 11 angeordnet ist.In addition, it is mentioned that the first deformation region 24 can also be formed, for example, by an additional element 27 arranged on the inner side of the housing, which is arranged in operative connection with the upper wall 13 of the housing 11.

Der Montageprozess des Steuergeräts 10 erfolgt entsprechend der Abfolge der Fig. 1 bis 3 derart, dass die Leiterplatte 20 mit den vormontierten Dämpfungselementen 22, 23 in Richtung des Pfeils 28 in das Gehäuse 11 eingeschoben wird. Hierbei verhindern die Führungselemente 16 insbesondere, dass auf der Leiterplatte 20 angeordnete Bauteile beim Einschieben der Leiterplatte 20 in das Gehäuse 11 mechanisch vorgeschädigt oder geschädigt werden. In der in der Fig. 3 dargestellten Endposition der Leiterplatte 20 in dem Gehäuse 11 sind die beiden Dämpfungselemente 22, 23 mit den beiden Deformationsbereichen 24, 25 ausgerichtet bzw. fluchten mit diesen, wobei jedoch zunächst noch ein Abstand (nicht dargestellt) zwischen den Dämpfungselementen 22, 23 und den Deformationsbereichen 24, 25 besteht.The assembly process of the controller 10 is carried out according to the sequence of Fig. 1 to 3 such that the circuit board 20 is inserted with the pre-mounted damping elements 22, 23 in the direction of arrow 28 in the housing 11. In this case, the guide elements 16 prevent, in particular, that components arranged on the printed circuit board 20 are mechanically damaged or damaged during the insertion of the printed circuit board 20 into the housing 11. In the in the Fig. 3 shown end position of the circuit board 20 in the housing 11 are the two damping elements 22, 23 aligned with the two deformation regions 24, 25 or aligned with these, but initially still a distance (not shown) between the damping elements 22, 23 and the deformation regions 24th , 25 exists.

Zum Fixieren der Leiterplatte 20 in dem Gehäuse 11 wird dann von der Gehäuseaußenseite auf die beiden Deformationsbereiche 24, 25 eine senkrecht zur Leiterplatte 20 gerichtete Prägekraft F ausgeübt, die die Deformationsbereiche 24, 25 weiter in Richtung der beiden Dämpfungselemente 22, 23 eindrücken, bis diese in Wirkverbindung mit den Dämpfungselementen 22, 23 gelangen und diese mit einer bestimmten Kontaktkraft beaufschlagen.For fixing the printed circuit board 20 in the housing 11 is then applied from the outside of the housing on the two deformation regions 24, 25 directed perpendicular to the printed circuit board 20 embossing force F, the deformation areas 24, 25 continue to push in the direction of the two damping elements 22, 23 until this come into operative connection with the damping elements 22, 23 and apply this to a specific contact force.

In der in der Fig. 3 dargestellten Endposition ist somit die Leiterplatte 20 zumindest in einer Ebene senkrecht zur Leiterplatte 20 in dem Gehäuse 11 fixiert. Die Fixierung der Leiterplatte 20 in Einschubrichtung erfolgt entweder durch separate, in den Figuren nicht dargestellte Elemente oder aber, bevorzugt, durch eine ebenfalls nicht dargestellte Steckerleiste, die mit der Leiterplatte 20 bzw. deren Anschlüssen mechanisch und elektrisch verbunden ist und gleichzeitig dem Verschluss der Öffnung 18 des Gehäuses 11 dient.In the in the Fig. 3 illustrated end position is thus the circuit board 20 at least in a plane perpendicular to the circuit board 20 fixed in the housing 11. The Fixation of the printed circuit board 20 in the insertion direction is carried out either by separate, not shown in the figures elements or, preferably, by a likewise not shown connector strip which is mechanically and electrically connected to the circuit board 20 and its terminals and at the same time the closure of the opening 18th of the housing 11 is used.

Ergänzend wird erwähnt, dass es selbstverständlich im Rahmen der Erfindung liegt, mehr als zwei Dämpfungselemente 22, 23 auf der Leiterplatte 20 vorzusehen. Weiterhin ist die Form bzw. der Querschnitt der Dämpfungselemente 22, 23 nicht auf die dargestellten kegelförmigen bzw. zylindrischen Dämpfungselemente 22, 23 beschränkt. Auch ist es beispielsweise denkbar, auf eines der beiden Dämpfungselemente 22, 23 zu verzichten, so dass die Leiterplatte 20 in einer Ebene senkrecht zu deren Erstreckung gegen einen festen Anschlag, z.B. gegen die Führungselemente 16 gedrückt wird, sobald die entsprechende Prägekraft F auf das eine Dämpfungselement 22, 23 ausgeübt wird.In addition, it is mentioned that it is of course within the scope of the invention to provide more than two damping elements 22, 23 on the printed circuit board 20. Furthermore, the shape or the cross section of the damping elements 22, 23 is not limited to the illustrated conical or cylindrical damping elements 22, 23. It is also conceivable, for example, to dispense with one of the two damping elements 22, 23, so that the printed circuit board 20 in a plane perpendicular to its extension against a fixed stop, e.g. is pressed against the guide elements 16 as soon as the corresponding embossing force F is exerted on the one damping element 22, 23.

In den Fig. 4 bis 7 ist ein gegenüber dem Steuergerät 10 modifiziertes Steuergerät 10a dargestellt. Das Steuergerät 10a weist zwei Leiterplatten 30, 31 auf, die innerhalb des Gehäuses 32 parallel zueinander angeordnet sind, und die mittels eines elektrischen Verbindungselements 33, insbesondere einer Litze, elektrisch miteinander verbunden sind. Ferner erkennt man, dass das Gehäuse 32 des Steuergeräts 10a für die beiden Leiterplatten 30, 31 jeweils über die Längsrichtung des Gehäuses 32 verlaufende Führungen 35, 36 aufweist, die beispielsweise durch einen Tiefziehprozess gebildet sind. Auf der Oberseite der oberen Leiterplatte 30 ist ein erstes Dämpfungselement 37 angeordnet, und auf der Unterseite der unteren Leiterplatte 31 ein zweites Dämpfungselement 38. Vorzugsweise bzw. optional kann es vorgesehen sein, dass zwischen der Unterseite der oberen Leiterplatte 30 und der Oberseite der unteren Leiterplatte 31 ein drittes Dämpfungselement 39 angeordnet ist, welches fluchtend zu den beiden anderen Dämpfungselementen 37, 38 angeordnet ist. Dieses dritte, vorab an den Leiterplatten 30, 31 befestigte Dämpfungselement 39 sorgt gleichzeitig für den richtigen Abstand zwischen den beiden Leiterplatten 30, 31 beim Einschieben in das Gehäuse 32, so dass eine Beschädigung von Bauelementen ausgeschlossen werden kann.In the Fig. 4 to 7 is a comparison with the controller 10 modified control unit 10a shown. The control unit 10a has two printed circuit boards 30, 31, which are arranged parallel to each other within the housing 32, and which are electrically connected to each other by means of an electrical connection element 33, in particular a stranded wire. Furthermore, it can be seen that the housing 32 of the control device 10a for the two printed circuit boards 30, 31 in each case over the longitudinal direction of the housing 32 extending guides 35, 36, which are formed for example by a thermoforming process. On the upper side of the upper printed circuit board 30, a first damping element 37 is arranged, and on the underside of the lower printed circuit board 31, a second damping element 38. Preferably, it can be provided that between the underside of the upper printed circuit board 30 and the upper side of the lower printed circuit board 31, a third damping element 39 is arranged, which is arranged in alignment with the two other damping elements 37, 38. This third, in advance attached to the circuit boards 30, 31 damping element 39 simultaneously ensures the correct distance between the two circuit boards 30, 31 when inserted into the housing 32, so that damage to components can be excluded.

Hinsichtlich der Form bzw. Anordnung der Dämpfungselemente 37 bis 39 gilt das in Bezug auf die Dämpfungselemente 22, 23 Beschriebene. Der Montageprozess des Steuergeräts 10a erfolgt derart, dass zunächst die beiden Leiterplatten 30, 31 vollständig bis in ihre Endposition in das Gehäuse 32 des Steuergeräts 10a eingeschoben werden. Anschließend, d.h. erst nachdem die beiden Leiterplatten 30, 31 ihre Endposition erreicht haben, werden im Bereich der beiden Deformationsbereiche 41, 42 die Eindellungen 43, 44 durch Aufbringen einer entsprechenden Prägekraft F ausgebildet. Die Deformationsbereiche 41, 42 sind somit vor dem Ausbilden der Eindellungen 43, 44 eben ausgebildet. Ein derartiger Montage- bzw. Fertigungsprozess, bei dem die Deformationsbereiche 41, 42 bzw. die Eindellungen 43, 44 erst nach Erreichen der Endposition der Leiterplatten 30, 31 in dem Gehäuse 32 ausgebildet werden, hat gegenüber dem Steuergerät 10, bei dem die Deformationsbereiche 24, 25 bereits teilweise vorgebildet sind den Vorteil, dass die Bauteile auf den Leiterplatten 30, 31 auch eine relativ große Höhe aufweisen können, ohne dass sie beim Einschieben der Leiterplatten 30, 31 in Konflikt mit vorgeprägten Deformationsbereichen 24, 25 gelangen können.With regard to the shape or arrangement of the damping elements 37 to 39 applies with respect to the damping elements 22, 23 Described. The assembly process of the control device 10a takes place in such a way that initially the two printed circuit boards 30, 31 are pushed completely into their end position into the housing 32 of the control device 10a. Subsequently, i. Only after the two printed circuit boards 30, 31 have reached their end position are the impressions 43, 44 formed by applying a corresponding stamping force F in the region of the two deformation regions 41, 42. The deformation regions 41, 42 are thus flat prior to the formation of the indentations 43, 44. Such an assembly or manufacturing process in which the deformation regions 41, 42 or the impressions 43, 44 are formed only after reaching the end position of the printed circuit boards 30, 31 in the housing 32, compared to the control unit 10, in which the deformation regions 24th , 25 already partially preformed have the advantage that the components on the circuit boards 30, 31 may also have a relatively large height, without them when inserting the circuit boards 30, 31 can come into conflict with vorgeprägten deformation areas 24, 25.

In den Fig. 8 bis 10 ist ein Steuergerät 10b dargestellt, das sich von dem Steuergerät 10a dadurch unterscheidet, dass bei dem Steuergerät 10b bzw. in dem Gehäuse 46 des Steuergeräts 10b die Deformationsbereiche 47, 48 in Form von Eindellungen 49, 50 bereits vorgebildet sind. Insofern entspricht der Montageprozess des Steuergeräts 10b dem Steuergerät 10a, lediglich werden bei dem Steuergerät 10b zwei Leiterplatten 31,31 verwendet.In the Fig. 8 to 10 a control unit 10b is shown, which differs from the control unit 10a in that in the control unit 10b or in the housing 46 of the control unit 10b, the deformation regions 47, 48 in the form of indentations 49, 50 are already preformed. In this respect, the assembly process of the control device 10b corresponds to the control device 10a, only two printed circuit boards 31, 31 are used in the control device 10b.

Die soweit beschriebenen Steuergeräte 10, 10a, 10b können in vielfältiger Art und Weise abgewandelt bzw. modifiziert werden, ohne vom Erfindungsgedanken abzuweichen. Dieser besteht in der Verwendung von Dämpfungselementen 22, 23, 37 bis 39 in einem Einschubgehäuse, die nach der Montage der Leiterplatte 20 bzw. der Leiterplatten 30, 31 in Wirkverbindung mit Gehäuseabschnitten, insbesondere durch plastisches Verformen des Gehäuses 11, 32, 46, gelangen.The control devices 10, 10a, 10b described so far can be modified or modified in many ways without deviating from the idea of the invention. This consists in the use of damping elements 22, 23, 37 to 39 in a slide-in housing, after the assembly of the printed circuit board 20 and the printed circuit boards 30, 31 in operative connection with housing sections, in particular by plastic deformation of the housing 11, 32, 46 arrive ,

Claims (10)

  1. Control device (10; 10a; 10b), in particular for a motor vehicle, having a housing (11; 32; 46) which is embodied as a slide-in housing and in the interior of which at least one printed circuit board (20; 30, 31) is arranged,
    characterized
    in that the at least one printed circuit board (20; 30, 31) is assigned at least one damping element (22, 23; 37, 38, 39) which is preferably connected to the printed circuit board (20; 30, 31) and is elastic at least in a plane perpendicular to the printed circuit board (20; 30, 31), and in that the at least one damping element (22, 23; 37, 38, 39) interacts with a deformation region (24, 25; 41, 42; 47, 48) of the housing (11; 32; 46), which is formed by denting inward a housing section, and in the process said damping element (22, 23; 37, 38, 39) produces a bearing contact with the at least one damping element (22, 23; 37, 38, 39).
  2. Control device according to Claim 1, characterized
    in that a damping element (22, 23; 37, 38, 39) is arranged on each of the two sides of the printed circuit board (20; 30, 31).
  3. Control device according to Claim 1, characterized
    in that two printed circuit boards (30, 31) are provided, in that a damping element (39) is arranged between the printed circuit boards (30, 31), and in that the damping element (39) is preferably arranged flush with the other damping elements (37, 38).
  4. Control device according to one of Claims 1 to 3,
    characterized
    in that the housing (11; 32; 46) has guide elements (16; 35, 36) for the at least one printed circuit board (20; 30, 31) which are oriented in the slide-in direction of the at least one printed circuit board (20; 30, 31).
  5. Control device according to one of Claims 1 to 4,
    characterized
    in that the housing (11) has, in the region of the deformation region (24), a separate additional element (27) which is connected to the housing (11), which projects in the direction of the printed circuit board (20), and in the mounted state of the printed circuit board (20) interacts with the inward damping element (22) after the denting.
  6. Control device according to one of Claims 1 to 4,
    characterized
    in that the housing (11; 46) has, in the region of the deformation region (24, 25; 47, 48), a pre-dented housing (11; 46), manufactured, in particular, by deep drawing, wherein the deformation region (24, 25; 47, 48) projects in the direction of the printed circuit board (20; 30, 31), and in the mounted state of the at least one printed circuit board (20; 30, 31) interacts with the damping element (22, 23; 37, 38, 39) after the denting.
  7. Control device according to one of Claims 1 to 6,
    characterized
    in that the housing (11; 32; 46) is embodied as a deep-drawn, single-piece component made of sheet metal.
  8. Method for manufacturing a control device (10; 10a; 10b) according to one of Claims 1 to 7, wherein at least one printed circuit board (20; 30, 31) is slid into the control device (10; 10a; 10b) which is embodied as a slide-in control device,
    characterized
    in that in the end position of the at least one printed circuit board (20; 30, 31) in the housing (11; 32; 46) at least one deformation region (24, 25; 41, 42; 47, 48) of the housing (11; 32; 46) is dented inward from the outside of the housing in a direction perpendicular to the at least one printed circuit board (20; 30, 31), and is placed in a clamping operative connection with at least one damping element (22, 23; 37, 38, 39) which is arranged in alignment with the deformation region (24, 25; 41, 42; 47, 48).
  9. Method according to Claim 8,
    characterized
    in that when a plurality of printed circuit boards (30, 31) are present, a damping element (39) is arranged between the printed circuit boards (30, 31), which damping element (39) spaces apart the printed circuit boards (30, 31) from one another.
  10. Method according to Claim 8 or 9,
    characterized
    in that deformation regions (41, 42), which are first dented inward in the end position of the at least one printed circuit board (30, 31) in the housing (32) are provided on opposite sides of the housing (32).
EP11778881.0A 2010-12-15 2011-11-03 Control device and method for producing a control device Not-in-force EP2653018B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010063158A DE102010063158A1 (en) 2010-12-15 2010-12-15 Control device and method for manufacturing a control device
PCT/EP2011/069341 WO2012079838A1 (en) 2010-12-15 2011-11-03 Control device and method for producing a control device

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EP2653018A1 EP2653018A1 (en) 2013-10-23
EP2653018B1 true EP2653018B1 (en) 2015-01-07

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EP (1) EP2653018B1 (en)
CN (1) CN103262673B (en)
BR (1) BR112013014953A2 (en)
DE (1) DE102010063158A1 (en)
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WO (1) WO2012079838A1 (en)

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EP2704327A1 (en) * 2012-09-04 2014-03-05 Optosys SA Method of manufacturing an inductive proximity switch

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3833836A (en) * 1973-06-18 1974-09-03 Sanders Associates Inc Printed circuit board package with cooling and vibration damping means
DE2904604A1 (en) * 1979-02-07 1980-08-14 Siemens Ag ASSEMBLY AND ASSEMBLY CARRIER FOR RECEIVING ASSEMBLIES
FR2579858B1 (en) * 1985-03-29 1988-09-30 Thomson Csf ANTI-VIBRATION DEVICE FOR ELECTRONIC BOARDS
DE3531958C2 (en) * 1985-09-07 1994-03-24 Bosch Gmbh Robert Device for supporting circuit boards that can be inserted into a housing
US5253147A (en) * 1992-10-01 1993-10-12 Delco Electronics Corporation Shock and vibration isolation mounting device having suspension vibration dampening
DE19909198A1 (en) * 1999-03-03 2000-09-07 Bosch Gmbh Robert Shock absorbing mounting arrangement
SE520661C2 (en) * 2001-04-12 2003-08-05 Emerson Energy Systems Ab Cooling apparatus and method for forming such an apparatus
KR100632542B1 (en) * 2001-11-05 2006-10-11 신에츠 폴리머 가부시키가이샤 Circuit component connector, its connection structure, and gasket
US6937475B2 (en) * 2003-09-04 2005-08-30 Dell Products L.P. Mounting and grounding assembly for circuit board mounted parallel to chassis bottom
DE102007001415A1 (en) * 2007-01-09 2008-07-10 Siemens Ag Fixation element for printed circuit boards
DE102008033193A1 (en) * 2008-07-15 2010-02-04 Continental Automotive Gmbh Motor control device of a vehicle

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DE102010063158A1 (en) 2012-06-21
BR112013014953A2 (en) 2016-09-13
EP2653018A1 (en) 2013-10-23
WO2012079838A1 (en) 2012-06-21
CN103262673A (en) 2013-08-21
CN103262673B (en) 2016-01-13
MX2013006008A (en) 2013-07-15

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