EP2652845A1 - Method and device for emitting a laser beam in a housing - Google Patents

Method and device for emitting a laser beam in a housing

Info

Publication number
EP2652845A1
EP2652845A1 EP11811105.3A EP11811105A EP2652845A1 EP 2652845 A1 EP2652845 A1 EP 2652845A1 EP 11811105 A EP11811105 A EP 11811105A EP 2652845 A1 EP2652845 A1 EP 2652845A1
Authority
EP
European Patent Office
Prior art keywords
component
laser beam
emitting
housing
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11811105.3A
Other languages
German (de)
French (fr)
Inventor
Virginie Zeninari
Bertrand Parvitte
Lilian Joly
Vincent Lecocq
Georges Durry
Regis Hamelin
Ronan Le Loarer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Universite de Reims Champagne Ardenne URCA
AEROVIA
Original Assignee
Universite de Reims Champagne Ardenne URCA
AEROVIA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Universite de Reims Champagne Ardenne URCA, AEROVIA filed Critical Universite de Reims Champagne Ardenne URCA
Publication of EP2652845A1 publication Critical patent/EP2652845A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/02—Constructional details
    • H01S3/04—Arrangements for thermal management
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
    • H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/30—Structure or shape of the active region; Materials used for the active region
    • H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
    • H01S5/3401—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers having no PN junction, e.g. unipolar lasers, intersubband lasers, quantum cascade lasers
    • H01S5/3402—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers having no PN junction, e.g. unipolar lasers, intersubband lasers, quantum cascade lasers intersubband lasers, e.g. transitions within the conduction or valence bands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Definitions

  • the present invention relates to a method and a device for emitting a laser beam into a housing.
  • the present invention makes it possible, for example, to be adapted to a spectrometer in order to carry out gas detection.
  • Document WO 2007/050134 discloses a compact infrared laser comprising a rigid system (2) whose respective positioning of the lens (14) and the laser source (6) is related to the dimensions of the parts (see page 13, lines 24-26, page 14, lines 17-26, page 17, line 29 to page 18, line 2), without performing either active positioning, i.e., turning on the laser source, or a passive positioning, that is to say without turning on the laser source.
  • This system therefore has a repeatable positioning accuracy and sufficiently accurate.
  • the present invention aims to remedy all or part of these disadvantages.
  • the present invention aims, in a first aspect, a device for emitting a laser beam, which comprises, in a housing:
  • the heat diffusion component bearing a positioning mark and at least three holes for centering pegs machined in conjunction with the positioning mark
  • a lens support adapted to hold each said lens opposite the emitter component of the laser beam, said lens support being positioned with respect to the heat diffusion component, by means of at least three centering pins positioned in the holes of the heat diffusion component.
  • the implementation of the present invention makes it possible, in particular because the cooling component is machined to jointly form the centering pin holes and the positioning mark, an alignment accuracy which is at least of the order of 10. ⁇ .
  • the lens holder has two lateral notches and a central through-light, the side notches and the light through central being positioned to allow the passage of three centering pins inserted into the holes for centering pins.
  • the lateral notches are oriented perpendicular to the through-light.
  • the lateral notches are delimited by flexible tabs of the lens holder.
  • the emitter component is disposed parallel to the bearing surface of the housing.
  • the housing is provided with an external output of conductive links connected inside the housing with the legs of the emitter component.
  • the emitter component is a quantum cascade laser.
  • the housing further includes a Peltier cooling component.
  • said positioning mark is a notch.
  • the present invention relates to a method of manufacturing a device for emitting a laser beam, which comprises:
  • the present invention is directed to a gas spectroscopic analysis device, which comprises a device for emitting a laser beam according to the present invention and a cell in which the gas to be analyzed is located, said cell being crossed. by said laser beam.
  • FIG. 1 represents, schematically and in perspective, elements of a compact assembly of a source of radiant laser energy
  • FIG. 2 represents, schematically and in perspective, the elements illustrated in FIG. 1, assembled
  • FIG. 3 represents, schematically and in perspective, elements of a subset of the compact assembly comprising the elements illustrated in FIGS. 1 and 2,
  • FIG. 4 represents, schematically and in perspective, the assembly of the elements illustrated in FIGS. 1 and 3, to constitute a source of radiant laser energy
  • FIG. 5 represents, in the form of a logic diagram, steps implemented in a particular embodiment of the method that is the subject of the present invention.
  • FIG. 1 shows a subset comprising a housing 320 and a cooling component 325 based on the Peltier effect. It should be noted that an optional non-metallizing ceramic is used here with "pre-tinned" copper (copper) wires. In Figure 1, these elements are shown separately and, in Figure 2, assembled. The bearing face of the housing 320 is, in Figures 1 and 2, the lower face.
  • FIG. 3 shows, in an exploded form on the left, and in an assembled form, on the right, a quantum cascade laser module comprising a radiator element 330, an optical lens subassembly and a lens support mount 335, two screws 340 for assembling the optical subassembly 335 on the radiator element 330, a quantum cascade laser component 345 mounted on a base 305, a thermistor 360, several electrical connection component making the conductive relay 355.
  • the radiator element 330 also called “heat diffusion component”, diffuses the heat coming from the laser component 345.
  • the lens subassembly and frame 335 comprises two lateral notches 370 and a central through hole 375. These three openings allow the passage of three centering pins 315.
  • the heat diffusion component 330 carries a positioning mark on the upper face. In the embodiment illustrated in the figures, the positioning mark 310 is a notch.
  • the laser 345 is the object of a precise positioning with respect to the positioning mark 310. This positioning is preferably done under binocular microscope or through a recognition software of forms of an automatic report machine.
  • the notch 310 and three holes 385 for accommodating the centering pins 315 are formed together during the same machining step of the heat diffusion component 330, i.e. say that their machining is not separated by a disassembly of the radiator element 330. It is observed that the component 345 emitting the laser beam is disposed parallel to the bearing surface of the housing 320.
  • FIG. 4 shows the assembly of the elements illustrated in FIGS. 1 and 3, the mounting of the optical assembly 335 being provided with a convergent lens 365 and a housing cover 350 closing the casing 320.
  • the casing 320 is provided with an external output 380 of conductive links connected, inside the housing, with the legs of the transmitter component.
  • the lateral notches 370 are oriented perpendicular to the through-light 375.
  • the lateral notches 370 are delimited by flexible tabs of the lens holder 335.
  • the lateral notches 370 having a slight flexibility, because of the lower tab which delimits them, the centering pins 315 are held firmly in position relative to the lens support.
  • the through-light 375 ensures the precise positioning of the lens holder 335 on an axis perpendicular to that of the side notches 370.
  • the lens holder is thus positioned and held in position with a precision on two axes at least of the order of 10 ⁇ .
  • the present invention is not limited to this number of pins and holes but extends, at contrary, to all devices comprising at least two centering pins 315 and a number of holes 385 at least equal to the number of centering pins 315, said holes being machined together with the positioning mark 310.
  • the housing 320 and the cover 350 are formed.
  • the radiator element 330 is machined and, without dismounting, the notch 310 is formed. and the holes 385 of pins 315.
  • the frame of the optical assembly 335 is machined.
  • the pins 315 are positioned in the holes 385, the lens
  • the laser 345 is accurately positioned relative to the notch 310. This positioning is preferably done under a binocular, microscope or via a shape recognition software of a transfer machine. automatic.
  • the present invention applies, in particular to the packaging of laser radiation from a quantum cascade laser.
  • This housing can in particular be used in combination with a direct absorption or photo-acoustic spectrometer to perform the detection of traces of gas.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Biophysics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention relates to a device for emitting a laser beam, which comprises, in a housing (320): a component (345) emitting a laser beam and being mounted on a base (305); a heat-dissipating component (330) for dissipating the heat produced by the laser of the laser-emitting component and to which the base of the emitter component is secured, the heat-dissipating component having a positioning mark (310) and at least three holes for centring pins machined together with the positioning mark; at least one collimating lens (365); and a lens mounting (335) suitable for holding said lens opposite the component emitting the laser beam, said lens mounting being positioned relative to the heat-dissipating component by means of at least three centring pins (315) positioned in the holes of the heat-dissipating component.

Description

PROCEDE ET DISPOSITIF D'EMISSION D'UN FAISCEAU LASER DANS UN BOITIER  METHOD AND DEVICE FOR TRANSMITTING A LASER BEAM IN A CASE
La présente invention concerne un procédé et un dispositif d'émission d'un faisceau laser dans un boîtier. La présente invention permet par exemple d'être adaptée à un spectromètre en vue d'effectuer de la détection de gaz. The present invention relates to a method and a device for emitting a laser beam into a housing. The present invention makes it possible, for example, to be adapted to a spectrometer in order to carry out gas detection.
On connaît, du document WO 2007/050134, un laser compact de moyen infrarouge comportant un système rigide (2) dont le positionnement respectif de la lentille (14) et de la source laser (6) est lié aux dimensions des pièces (voir page 13, lignes 24-26, page 14, lignes 17-26, page 17, ligne 29 à page 18, ligne 2), sans effectuer ni un positionnement actif, c'est-à-dire en allumant la source laser, ni un positionnement passif, c'est-à-dire sans allumer la source laser. Ce système ne présente donc une précision de positionnement répétable et suffisamment précise.  Document WO 2007/050134 discloses a compact infrared laser comprising a rigid system (2) whose respective positioning of the lens (14) and the laser source (6) is related to the dimensions of the parts (see page 13, lines 24-26, page 14, lines 17-26, page 17, line 29 to page 18, line 2), without performing either active positioning, i.e., turning on the laser source, or a passive positioning, that is to say without turning on the laser source. This system therefore has a repeatable positioning accuracy and sufficiently accurate.
La présente invention vise à remédier à tout ou partie de ces inconvénients.  The present invention aims to remedy all or part of these disadvantages.
A cet effet, la présente invention vise, selon un premier aspect, un dispositif d'émission d'un faisceau laser, qui comporte, dans un boîtier :  For this purpose, the present invention aims, in a first aspect, a device for emitting a laser beam, which comprises, in a housing:
- un composant émetteur d'un faisceau laser monté sur une embase,  a component transmitting a laser beam mounted on a base,
- un composant de diffusion de la chaleur produite par le laser du composant émetteur de laser auquel est solidarisée l'embase du composant émetteur, le composant de diffusion de chaleur portant une marque de positionnement et au moins trois trous pour pions de centrage usinés conjointement avec la marque de positionnement,  a component for diffusing the heat produced by the laser of the laser emitting component to which the base of the emitter component is fastened, the heat diffusion component bearing a positioning mark and at least three holes for centering pegs machined in conjunction with the positioning mark,
- au moins une lentille de collimation et  - at least one collimation lens and
- un support de lentille adapté à tenir chaque dite lentille en regard du composant émetteur du faisceau laser, ledit support de lentille étant positionné par rapport au composant de diffusion de chaleur, par l'intermédiaire d'au moins trois pions de centrage positionnés dans les trous du composant de diffusion de chaleur.  a lens support adapted to hold each said lens opposite the emitter component of the laser beam, said lens support being positioned with respect to the heat diffusion component, by means of at least three centering pins positioned in the holes of the heat diffusion component.
La mise en œuvre de la présente invention permet, notamment du fait que le composant de refroidissement est usiné pour former conjointement les trous de pions de centrage et la marque de positionnement, une précision d'alignement qui est au moins de l'ordre de 10 μηι.  The implementation of the present invention makes it possible, in particular because the cooling component is machined to jointly form the centering pin holes and the positioning mark, an alignment accuracy which is at least of the order of 10. μηι.
De plus, ces dispositions permettent un positionnement passif, c'est-à-dire sans allumer la source laser, ce qui est, à la fois, plus simple et moins onéreux qu'un positionnement actif, dans lequel, on allume la source laser et on déplace des éléments mécaniques jusqu'à ce que le rayonnement laser soit configuré comme souhaité.  In addition, these arrangements allow passive positioning, that is to say without turning on the laser source, which is both simpler and less expensive than active positioning, in which, we turn on the laser source and moving mechanical elements until the laser radiation is configured as desired.
Selon des caractéristiques particulières, le support de lentille comporte deux encoches latérales et une lumière traversante centrale, les encoches latérales et la lumière traversante centrale étant positionnées pour permettre le passage de trois pions de centrage insérés dans les trous pour pions de centrage. According to particular features, the lens holder has two lateral notches and a central through-light, the side notches and the light through central being positioned to allow the passage of three centering pins inserted into the holes for centering pins.
Selon des caractéristiques particulières, les encoches latérales sont orientées perpendiculairement à la lumière traversante.  According to particular features, the lateral notches are oriented perpendicular to the through-light.
Selon des caractéristiques particulières, les encoches latérales sont délimitées par des pattes souples du support de lentille.  According to particular features, the lateral notches are delimited by flexible tabs of the lens holder.
Grâce à chacune de ces dispositions, une fois le dispositif monté, trois pions de centrage sont insérés, d'une part, respectivement dans les deux encoches latérales et dans la lumière traversante centrale du support de lentille et, d'autre part, dans les trous de l'élément radiateur. Les encoches latérales présentant une légère souplesse, du fait de la patte inférieure qui les délimite, les pions de centrage sont maintenus fermement en position par rapport au support de lentille. La lumière traversante garantit le positionnement précis du support de lentille sur un axe perpendiculaire à celui des encoches latérales. Le support de lentille est ainsi positionné et maintenu en position avec une précision d'alignement sur deux axes au moins de l'ordre de 10 μηι.  Thanks to each of these arrangements, once the device is mounted, three centering pins are inserted, on the one hand, respectively in the two lateral notches and in the central through-light of the lens support and, on the other hand, in the holes of the radiator element. The lateral notches having a slight flexibility, because of the lower tab which delimits them, the centering pins are held firmly in position relative to the lens support. The through-light ensures the precise positioning of the lens holder on an axis perpendicular to that of the lateral notches. The lens support is thus positioned and maintained in position with a precision of alignment on two axes at least of the order of 10 μηι.
Selon des caractéristiques particulières, le composant émetteur est disposé parallèlement à la surface d'appui du boîtier.  According to particular features, the emitter component is disposed parallel to the bearing surface of the housing.
Selon des caractéristiques particulières, le boîtier est muni d'une sortie extérieure de liaisons conductrices reliées, à l'intérieur du boîtier, avec les pattes du composant émetteur.  According to particular characteristics, the housing is provided with an external output of conductive links connected inside the housing with the legs of the emitter component.
Selon des caractéristiques particulières, le composant émetteur est un laser à cascade quantique.  According to particular features, the emitter component is a quantum cascade laser.
Selon des caractéristiques particulières, le boîtier comporte, en outre, un composant de refroidissement à effet Peltier.  According to particular features, the housing further includes a Peltier cooling component.
Selon des caractéristiques particulières, ladite marque de positionnement est une encoche.  According to particular features, said positioning mark is a notch.
Selon un deuxième aspect, la présente invention vise un procédé de fabrication d'un dispositif d'émission d'un faisceau laser, qui comporte :  According to a second aspect, the present invention relates to a method of manufacturing a device for emitting a laser beam, which comprises:
- une étape d'usinage conjoint, sur un composant de diffusion de chaleur, d'au moins trois trous de pions de centrage et d'une marque de positionnement,  a step of joint machining, on a heat diffusion component, of at least three holes of centering pins and a positioning mark,
- une étape de montage sur la face du composant de diffusion de chaleur portant ladite marque de positionnement, d'un composant émetteur d'un faisceau laser et  a step of mounting on the face of the heat diffusion component carrying said positioning mark, a component emitting a laser beam and
- une étape de montage d'au moins une lentille de collimation dans un support de lentille adapté à tenir chaque dite lentille en regard du composant émetteur du faisceau laser, en positionnant ledit support de lentille par rapport au composant de diffusion de chaleur, par l'intermédiaire d'au moins trois pions de centrage montés dans trois desdits trous. Selon un troisième aspect, la présente invention vise un dispositif d'analyse spectroscopique de gaz, qui comporte un dispositif d'émission d'un faisceau laser selon la présente invention et une cellule dans laquelle se trouve le gaz à analyser, ladite cellule étant traversée par ledit faisceau laser. a step of mounting at least one collimating lens in a lens holder adapted to hold each said lens opposite the emitter component of the laser beam, by positioning said lens support with respect to the heat diffusion component, by intermediate of at least three centering pins mounted in three of said holes. According to a third aspect, the present invention is directed to a gas spectroscopic analysis device, which comprises a device for emitting a laser beam according to the present invention and a cell in which the gas to be analyzed is located, said cell being crossed. by said laser beam.
Les avantages, buts et caractéristiques de ce procédé et de ce dispositif d'analyse de gaz étant similaires à ceux du dispositif d'émission d'un faisceau laser objet de la présente invention, ils ne sont pas rappelés ici.  The advantages, aims and characteristics of this method and of this gas analysis device being similar to those of the device for emitting a laser beam object of the present invention, they are not recalled here.
D'autres avantages, buts et caractéristiques de la présente invention ressortiront de la description qui va suivre faite, dans un but explicatif et nullement limitatif, en regard des dessins annexés, dans lesquels :  Other advantages, aims and features of the present invention will emerge from the description which follows, for an explanatory and non-limiting purpose, with reference to the appended drawings, in which:
- la figure 1 représente, schématiquement et en perspective, des éléments d'un assemblage compact d'une source d'énergie radiante laser,  FIG. 1 represents, schematically and in perspective, elements of a compact assembly of a source of radiant laser energy,
- la figure 2 représente, schématiquement et en perspective, les éléments illustrés en figure 1 , assemblés,  FIG. 2 represents, schematically and in perspective, the elements illustrated in FIG. 1, assembled,
- la figure 3 représente, schématiquement et en perspective, des éléments d'un sous-ensemble de l'assemblage compact comportant les éléments illustrés en figures 1 et 2,  FIG. 3 represents, schematically and in perspective, elements of a subset of the compact assembly comprising the elements illustrated in FIGS. 1 and 2,
- la figure 4 représente, schématiquement et en perspective, le montage des éléments illustrés en figures 1 et 3, pour constituer une source d'énergie radiante laser,  FIG. 4 represents, schematically and in perspective, the assembly of the elements illustrated in FIGS. 1 and 3, to constitute a source of radiant laser energy,
- la figure 5 représente, sous forme d'un logigramme, des étapes mises en œuvre dans un mode de réalisation particulier du procédé objet de la présente invention.  FIG. 5 represents, in the form of a logic diagram, steps implemented in a particular embodiment of the method that is the subject of the present invention.
On observe, en figure 1 , un sous-ensemble comportant un boîtier 320 et un composant de refroidissement 325 basé sur l'effet Peltier. On note que l'on met ici en œuvre, en option, une céramique AIN sans métallisation avec fils d'alimentation "pre-tinned" copper (cuivre). En figure 1 , ces éléments sont représentés séparés et, en figure 2, assemblés. La face d'appui du boîtier 320 est, en figures 1 et 2, la face inférieure.  FIG. 1 shows a subset comprising a housing 320 and a cooling component 325 based on the Peltier effect. It should be noted that an optional non-metallizing ceramic is used here with "pre-tinned" copper (copper) wires. In Figure 1, these elements are shown separately and, in Figure 2, assembled. The bearing face of the housing 320 is, in Figures 1 and 2, the lower face.
On observe, en figure 3, dans une forme éclatée, à gauche, et dans une forme assemblée, à droite, un module laser à cascade quantique comportant un élément radiateur 330, un sous ensemble optique de lentille et monture formant support 335 de lentille, deux vis 340 d'assemblage du sous-ensemble optique 335 sur l'élément radiateur 330, un composant laser à cascade quantique 345 monté sur une embase 305, une thermistance 360, plusieurs composant de connexion électrique faisant relais conducteurs 355.  FIG. 3 shows, in an exploded form on the left, and in an assembled form, on the right, a quantum cascade laser module comprising a radiator element 330, an optical lens subassembly and a lens support mount 335, two screws 340 for assembling the optical subassembly 335 on the radiator element 330, a quantum cascade laser component 345 mounted on a base 305, a thermistor 360, several electrical connection component making the conductive relay 355.
L'élément radiateur 330, aussi appelé « composant de diffusion de chaleur », diffuse la chaleur issue du composant laser 345. Le sous ensemble de lentille et monture 335 comporte deux encoches latérales 370 et une lumière traversante centrale 375. Ces trois ouvertures permettent le passage de trois pions de centrage 315. Le composant de diffusion de chaleur 330 porte une marque de positionnement, en face supérieure. Dans le mode de réalisation illustré dans les figures, la marque de positionnement 310 est une encoche. The radiator element 330, also called "heat diffusion component", diffuses the heat coming from the laser component 345. The lens subassembly and frame 335 comprises two lateral notches 370 and a central through hole 375. These three openings allow the passage of three centering pins 315. The heat diffusion component 330 carries a positioning mark on the upper face. In the embodiment illustrated in the figures, the positioning mark 310 is a notch.
Une fois monté sur l'embase 305, le laser 345 est l'objet d'un positionnement précis par rapport à la marque de positionnement 310. Ce positionnement est préférentiellement fait sous binoculaire, microscope ou par l'intermédiaire d'un logiciel de reconnaissance de formes d'une machine de report automatique.  Once mounted on the base 305, the laser 345 is the object of a precise positioning with respect to the positioning mark 310. This positioning is preferably done under binocular microscope or through a recognition software of forms of an automatic report machine.
Comme exposé en regard de la figure 5, l'encoche 310 et trois trous 385 pour accueillir les pions de centrage 315 sont formés conjointement au cours de la même étape d'usinage du composant de diffusion de chaleur 330, c'est-à-dire que leurs usinages ne sont pas séparés par un démontage de l'élément radiateur 330. On observe que le composant 345 émetteur du faisceau laser est disposé parallèlement à la surface d'appui du boîtier 320.  As discussed with reference to FIG. 5, the notch 310 and three holes 385 for accommodating the centering pins 315 are formed together during the same machining step of the heat diffusion component 330, i.e. say that their machining is not separated by a disassembly of the radiator element 330. It is observed that the component 345 emitting the laser beam is disposed parallel to the bearing surface of the housing 320.
On observe, en figure 4, l'assemblage des éléments illustrés en figures 1 et 3, la monture de l'ensemble optique 335 étant munie d'une lentille convergente 365 et un couvercle de boîtier 350 fermant le boîtier 320. Le boîtier 320 est muni d'une sortie extérieure 380 de liaisons conductrices reliées, à l'intérieur du boîtier, avec les pattes du composant émetteur.  FIG. 4 shows the assembly of the elements illustrated in FIGS. 1 and 3, the mounting of the optical assembly 335 being provided with a convergent lens 365 and a housing cover 350 closing the casing 320. The casing 320 is provided with an external output 380 of conductive links connected, inside the housing, with the legs of the transmitter component.
Ainsi, une fois le dispositif monté, trois pions de centrage 315 sont insérés, d'une part, respectivement dans les deux encoches latérales 370 et dans la lumière traversante centrale 375 du support de lentille 335 et, d'autre part, dans les trous 385 de l'élément radiateur 330.  Thus, once the device is mounted, three centering pins 315 are inserted, on the one hand, respectively into the two lateral notches 370 and into the central through hole 375 of the lens holder 335 and, on the other hand, into the holes 385 of the radiator element 330.
Les encoches latérales 370 sont orientées perpendiculairement à la lumière traversante 375. Les encoches latérales 370 sont délimitées par des pattes souples du support de lentille 335.  The lateral notches 370 are oriented perpendicular to the through-light 375. The lateral notches 370 are delimited by flexible tabs of the lens holder 335.
Les encoches latérales 370 présentant une légère souplesse, du fait de la patte inférieure qui les délimite, les pions de centrage 315 sont maintenus fermement en position par rapport au support de lentille. La lumière traversante 375 garantit le positionnement précis du support de lentille 335 sur un axe perpendiculaire à celui des encoches latérales 370. Le support de lentille est ainsi positionné et maintenu en position avec une précision sur deux axes au moins de l'ordre de 10 μηι.  The lateral notches 370 having a slight flexibility, because of the lower tab which delimits them, the centering pins 315 are held firmly in position relative to the lens support. The through-light 375 ensures the precise positioning of the lens holder 335 on an axis perpendicular to that of the side notches 370. The lens holder is thus positioned and held in position with a precision on two axes at least of the order of 10 μηι .
Bien que l'on ait présenté, dans les figures 1 à 4, trois pions de centrage 315 et trois trous 385 pour pions de centrage, la présente invention ne se limite pas à ce nombre de pions et de trous mais s'étend, au contraire, à tous les dispositifs comportant au moins deux pions de centrage 315 et un nombre de trous 385 au moins égal au nombre de pions de centrage 315, lesdits trous étant usinés conjointement avec la marque de positionnement 310. Comme illustré en figure 5, au cours d'une étape 405, on constitue le boîtier 320 et le couvercle 350. Au cours d'une étape 410, on usine l'élément radiateur 330 et, sans démontage, on forme l'encoche 310 et les trous 385 de pions 315. Au cours d'une étape 415, on usine la monture de l'ensemble optique 335. Although, in FIGS. 1 to 4, three centering pins 315 and three holes 385 for centering pins have been presented, the present invention is not limited to this number of pins and holes but extends, at contrary, to all devices comprising at least two centering pins 315 and a number of holes 385 at least equal to the number of centering pins 315, said holes being machined together with the positioning mark 310. As illustrated in FIG. 5, during a step 405, the housing 320 and the cover 350 are formed. During a step 410, the radiator element 330 is machined and, without dismounting, the notch 310 is formed. and the holes 385 of pins 315. During a step 415, the frame of the optical assembly 335 is machined.
Au cours d'une étape 420, on positionne les pions 315 dans les trous 385, la lentille During a step 420, the pins 315 are positioned in the holes 385, the lens
365 dans la monture de l'ensemble optique 335 et on positionne cette monture sur les pions 315. Puis, on pose les vis 340 pour serrer la monture de l'ensemble optique 335 sur le composant radiateur 330. 365 in the mount of the optical assembly 335 and this mount is positioned on the pins 315. Then, we put the screws 340 to tighten the mount of the optical assembly 335 on the radiator component 330.
Au cours d'une étape 425, on positionne précisément le laser 345 par rapport à l'encoche 310. Ce positionnement est préférentiellement fait sous binoculaire, microscope ou par l'intermédiaire d'un logiciel de reconnaissance de formes d'une machine de report automatique.  During a step 425, the laser 345 is accurately positioned relative to the notch 310. This positioning is preferably done under a binocular, microscope or via a shape recognition software of a transfer machine. automatic.
Au cours d'une étape 430, on assemble les autres pièces illustrées en figures 1 , 3 et 4.  During a step 430, the other parts illustrated in FIGS. 1, 3 and 4 are assembled.
La présente invention s'applique, notamment à la mise en boîtier du rayonnement laser issu d'un laser à cascade quantique. Ce boîtier peut en particulier être utilisé en association avec un spectromètre d'absorption directe ou photo-acoustique pour effectuer de la détection de traces de gaz.  The present invention applies, in particular to the packaging of laser radiation from a quantum cascade laser. This housing can in particular be used in combination with a direct absorption or photo-acoustic spectrometer to perform the detection of traces of gas.

Claims

REVENDICATIONS
1 . Dispositif d'émission d'un faisceau laser, qui comporte, dans un boîtier (320) un composant (345) émetteur d'un faisceau laser monté sur une embase (305) et au moins une lentille de collimation (365), caractérisé en ce qu'il comporte, en outre, dans ledit boîtier : 1. A device for emitting a laser beam, which comprises, in a housing (320), a component (345) emitting a laser beam mounted on a base (305) and at least one collimating lens (365), characterized in what it comprises, in addition, in said housing:
- un composant (330) de diffusion de la chaleur produite par le laser du composant émetteur de laser auquel est solidarisée l'embase du composant émetteur, le composant de diffusion de chaleur portant une marque de positionnement (310) et au moins trois trous (385) pour pions de centrage (315) usinés conjointement avec la marque de positionnement, et  a component (330) for diffusing the heat produced by the laser of the laser emitter component to which the base of the emitter component is secured, the heat diffusion component carrying a positioning mark (310) and at least three holes ( 385) for centering pins (315) machined together with the positioning mark, and
- un support de lentille (335) adapté à tenir chaque dite lentille en regard du composant émetteur du faisceau laser, ledit support de lentille étant positionné par rapport au composant de diffusion de chaleur, par l'intermédiaire d'au moins trois pions de centrage (315) positionnés dans les trous du composant de diffusion de chaleur.  a lens holder (335) adapted to hold each said lens opposite the emitting component of the laser beam, said lens support being positioned with respect to the heat diffusion component, by means of at least three centering pins (315) positioned in the holes of the heat diffusion component.
2. Dispositif selon la revendication 1 , dans lequel le support de lentille (335) comporte deux encoches latérales (370) et une lumière traversante centrale (375), les encoches latérales et la lumière traversante centrale étant positionnées pour permettre le passage de trois pions de centrage (315) insérés dans les trous (385) pour pions de centrage.  2. Device according to claim 1, wherein the lens holder (335) comprises two lateral notches (370) and a central through-light (375), the lateral notches and the central through-light being positioned to allow the passage of three pawns. centering tool (315) inserted into the holes (385) for centering pins.
3. Dispositif selon la revendication 2, dans lequel les encoches latérales (370) sont orientées perpendiculairement à la lumière traversante (375).  3. Device according to claim 2, wherein the lateral notches (370) are oriented perpendicularly to the through-light (375).
4. Dispositif selon l'une des revendications 2 ou 3, dans lequel les encoches latérales (370) sont délimitées par des pattes souples du support de lentille (335).  4. Device according to one of claims 2 or 3, wherein the lateral notches (370) are delimited by flexible tabs of the lens holder (335).
5. Dispositif selon l'une des revendications 1 à 4, dans lequel le composant (345) émetteur est disposé parallèlement à la surface d'appui du boîtier (320).  5. Device according to one of claims 1 to 4, wherein the component (345) transmitter is disposed parallel to the bearing surface of the housing (320).
6. Dispositif selon l'une quelconque des revendications 1 à 5, dans lequel le boîtier (320) est muni d'une sortie extérieure de liaisons conductrices (380) reliées, à l'intérieur du boîtier (320), avec les pattes du composant (345) émetteur d'un faisceau laser.  6. Device according to any one of claims 1 to 5, wherein the housing (320) is provided with an external output of conductive links (380) connected inside the housing (320) with the legs of the component (345) emitting a laser beam.
7. Dispositif selon l'une quelconque des revendications 1 à 6, dans lequel le composant (345) émetteur est un laser à cascade quantique.  7. Device according to any one of claims 1 to 6, wherein the emitter component (345) is a quantum cascade laser.
8. Dispositif selon l'une quelconque des revendications 1 à 7, dans lequel le boîtier (320) comporte, en outre, un composant (325) de refroidissement à effet Peltier.  8. Device according to any one of claims 1 to 7, wherein the housing (320) further comprises a Peltier cooling component (325).
9. Dispositif selon l'une quelconque des revendications 1 à 8, dans lequel ladite marque de positionnement (310) est une encoche.  9. Device according to any one of claims 1 to 8, wherein said positioning mark (310) is a notch.
10. Dispositif d'analyse spectroscopique de gaz, qui comporte un dispositif d'émission d'un faisceau laser selon l'une quelconque des revendications 1 à 9 et une cellule dans laquelle se trouve le gaz à analyser, ladite cellule étant traversée par ledit faisceau laser. 10. A spectroscopic gas analysis device, which comprises a device for emitting a laser beam according to any one of claims 1 to 9 and a cell wherein is the gas to be analyzed, said cell being traversed by said laser beam.
1 1 . Procédé de fabrication d'un dispositif d'émission d'un faisceau laser, caractérisé en ce qu'il comporte :  1 1. A method of manufacturing a device for emitting a laser beam, characterized in that it comprises:
- une étape (410) d'usinage conjoint, sur un composant de diffusion de chaleur a step (410) of joint machining, on a heat diffusion component
(330), d'au moins trois trous (385) de pions de centrage (315) et d'une marque de positionnement (310), (330), at least three holes (385) of centering pins (315) and a positioning mark (310),
- une étape (425) de montage sur la face du composant de diffusion de chaleur portant ladite marque de positionnement, d'un composant émetteur d'un faisceau laser (345) et  a step (425) of mounting on the face of the heat diffusion component carrying said positioning mark, a component emitting a laser beam (345) and
- une étape (420, 430) de montage d'au moins une lentille de collimation (365) dans un support de lentille (335) adapté à tenir chaque dite lentille en regard du composant émetteur du faisceau laser, en positionnant ledit support de lentille par rapport au composant de diffusion de chaleur, par l'intermédiaire d'au moins trois pions de centrage montés dans trois desdits trous.  a step (420, 430) for mounting at least one collimating lens (365) in a lens holder (335) adapted to hold each said lens opposite the emitting component of the laser beam, by positioning said lens support with respect to the heat diffusion component, by means of at least three centering pins mounted in three of said holes.
EP11811105.3A 2010-12-15 2011-12-13 Method and device for emitting a laser beam in a housing Withdrawn EP2652845A1 (en)

Applications Claiming Priority (2)

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FR1060587A FR2969315B1 (en) 2010-12-15 2010-12-15 METHOD AND DEVICE FOR TRANSMITTING A LASER BEAM IN A CASE
PCT/FR2011/052970 WO2012080652A1 (en) 2010-12-15 2011-12-13 Method and device for emitting a laser beam in a housing

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JP6967480B2 (en) * 2018-03-30 2021-11-17 パナソニック デバイスＳｕｎｘ株式会社 Laser oscillator unit, laser processing equipment

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WO2012080652A1 (en) 2012-06-21
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FR2969315A1 (en) 2012-06-22

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