EP2652806A1 - Verfahren zum erzeugen einer lumineszenzkonversionsstoffschicht, zusammensetzung hierfür und bauelement umfassend eine solche lumineszenzkonversionsstoffschicht - Google Patents
Verfahren zum erzeugen einer lumineszenzkonversionsstoffschicht, zusammensetzung hierfür und bauelement umfassend eine solche lumineszenzkonversionsstoffschichtInfo
- Publication number
- EP2652806A1 EP2652806A1 EP11794749.9A EP11794749A EP2652806A1 EP 2652806 A1 EP2652806 A1 EP 2652806A1 EP 11794749 A EP11794749 A EP 11794749A EP 2652806 A1 EP2652806 A1 EP 2652806A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- composition
- layer
- luminescence conversion
- substrate
- solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010054280A DE102010054280A1 (de) | 2010-12-13 | 2010-12-13 | Verfahren zum Erzeugen einer Lumineszenzkonversionsstoffschicht, Zusammensetzung hierfür und Bauelement umfassend eine solche Lumineszenzkonversionsstoffschicht |
PCT/EP2011/072627 WO2012080263A1 (de) | 2010-12-13 | 2011-12-13 | Verfahren zum erzeugen einer lumineszenzkonversionsstoffschicht, zusammensetzung hierfür und bauelement umfassend eine solche lumineszenzkonversionsstoffschicht |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2652806A1 true EP2652806A1 (de) | 2013-10-23 |
Family
ID=45346484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11794749.9A Withdrawn EP2652806A1 (de) | 2010-12-13 | 2011-12-13 | Verfahren zum erzeugen einer lumineszenzkonversionsstoffschicht, zusammensetzung hierfür und bauelement umfassend eine solche lumineszenzkonversionsstoffschicht |
Country Status (7)
Country | Link |
---|---|
US (1) | US9142731B2 (zh) |
EP (1) | EP2652806A1 (zh) |
KR (1) | KR101621130B1 (zh) |
CN (1) | CN103262270B (zh) |
DE (1) | DE102010054280A1 (zh) |
TW (1) | TWI577053B (zh) |
WO (1) | WO2012080263A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9252338B2 (en) * | 2012-04-26 | 2016-02-02 | Intematix Corporation | Methods and apparatus for implementing color consistency in remote wavelength conversion |
DE102012213195A1 (de) * | 2012-07-26 | 2014-01-30 | Osram Gmbh | Verfahren zum Belegen einer Oberfläche mit Leuchtstoff |
DE102012106984A1 (de) * | 2012-07-31 | 2014-02-06 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
DE102012217643A1 (de) * | 2012-09-27 | 2014-03-27 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
DE102012109217A1 (de) * | 2012-09-28 | 2014-04-03 | Osram Opto Semiconductors Gmbh | Beleuchtungsvorrichtung zum Erzeugen einer Lichtemission und Verfahren zum Erzeugen einer Lichtemission |
DE102013103416A1 (de) * | 2013-04-05 | 2014-10-23 | Osram Opto Semiconductors Gmbh | Elektromagnetische Strahlung emittierende Baugruppe und Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe |
DE102013226630A1 (de) | 2013-12-19 | 2015-06-25 | Osram Gmbh | Konversionselement, Bauelement und Verfahren zur Herstellung eines Bauelements |
CN105874618A (zh) | 2014-01-08 | 2016-08-17 | 皇家飞利浦有限公司 | 经波长转换的半导体发光器件 |
DE102014010854A1 (de) | 2014-07-25 | 2016-01-28 | Technische Universität Braunschweig | Leuchtmittel |
DE202015105428U1 (de) * | 2015-04-29 | 2016-08-01 | Tridonic Jennersdorf Gmbh | LED Modul mit verbesserter Wärmeabfuhr |
EP3098861B1 (en) * | 2015-05-29 | 2020-05-06 | Nichia Corporation | Light emitting device, and method of manufacturing a light emitting device |
JP2017220530A (ja) * | 2016-06-06 | 2017-12-14 | シチズン電子株式会社 | 発光装置の製造方法 |
DE102017130574A1 (de) * | 2017-12-19 | 2019-06-19 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines Konversionselements und Konversionselement |
Family Cites Families (29)
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US5508337A (en) * | 1992-02-11 | 1996-04-16 | Bayer Aktiengesellschaft | Powder coating compositions, a process for their preparation, and their use for the coating of heat resistant substrates |
US6623670B2 (en) | 1997-07-07 | 2003-09-23 | Asahi Rubber Inc. | Method of molding a transparent coating member for light-emitting diodes |
JP3861400B2 (ja) * | 1997-09-01 | 2006-12-20 | セイコーエプソン株式会社 | 電界発光素子およびその製造方法 |
US6252254B1 (en) | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
DE10010638A1 (de) * | 2000-03-03 | 2001-09-13 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines lichtabstrahlenden Halbleiterkörpers mit Lumineszenzkonversionselement |
US6604971B1 (en) | 2000-05-02 | 2003-08-12 | General Electric Company | Fabrication of LED lamps by controlled deposition of a suspension media |
DE10036940A1 (de) | 2000-07-28 | 2002-02-07 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Lumineszenz-Konversions-LED |
US6635363B1 (en) * | 2000-08-21 | 2003-10-21 | General Electric Company | Phosphor coating with self-adjusting distance from LED chip |
US6616862B2 (en) | 2001-05-21 | 2003-09-09 | General Electric Company | Yellow light-emitting halophosphate phosphors and light sources incorporating the same |
CN101335322B (zh) * | 2001-09-03 | 2010-12-08 | 松下电器产业株式会社 | 荧光体层、半导体发光装置及半导体发光元件的制造方法 |
DE10147040A1 (de) | 2001-09-25 | 2003-04-24 | Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh | Beleuchtungseinheit mit mindestens einer LED als Lichtquelle |
US7051818B2 (en) | 2002-04-22 | 2006-05-30 | P.E.T. International, Inc. | Three in one combined power unit for nitrogen system, fluid system, and coiled tubing system |
JP4263453B2 (ja) | 2002-09-25 | 2009-05-13 | パナソニック株式会社 | 無機酸化物及びこれを用いた発光装置 |
WO2005046735A1 (en) * | 2003-11-07 | 2005-05-26 | Newport Instruments | A reagent system and method for modifying the luminescence of lanthanide(iii) macrocyclic complexes |
KR100610249B1 (ko) * | 2003-12-23 | 2006-08-09 | 럭스피아 주식회사 | 황색 발광 형광체 및 그것을 채용한 백색 반도체 발광장치 |
US7217583B2 (en) | 2004-09-21 | 2007-05-15 | Cree, Inc. | Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension |
JP4557824B2 (ja) * | 2005-07-04 | 2010-10-06 | 株式会社東芝 | 発光装置およびその製造方法 |
US7518160B2 (en) * | 2005-10-31 | 2009-04-14 | Kyocera Corporation | Wavelength converter, lighting system, and lighting system assembly |
US20070128745A1 (en) | 2005-12-01 | 2007-06-07 | Brukilacchio Thomas J | Phosphor deposition method and apparatus for making light emitting diodes |
KR100735320B1 (ko) * | 2005-12-27 | 2007-07-04 | 삼성전기주식회사 | 형광체막 형성방법 및 이를 이용한 발광다이오드 패키지제조방법 |
JP2007250629A (ja) | 2006-03-14 | 2007-09-27 | Toshiba Corp | 発光装置及びその製造方法、並びに蛍光パターン形成物 |
TWI363785B (en) * | 2007-11-30 | 2012-05-11 | Ind Tech Res Inst | Ink composition and fabrication method of color conversion film |
US8058088B2 (en) * | 2008-01-15 | 2011-11-15 | Cree, Inc. | Phosphor coating systems and methods for light emitting structures and packaged light emitting diodes including phosphor coating |
KR101442146B1 (ko) * | 2008-02-25 | 2014-09-23 | 삼성디스플레이 주식회사 | 광원 유닛, 이를 포함하는 액정 표시 장치 및 이의 제조방법 |
TW201003979A (en) * | 2008-07-11 | 2010-01-16 | Harvatek Corp | Light emitting diode chip packaging structure using sedimentation and manufacturing method thereof |
JP5325560B2 (ja) * | 2008-12-18 | 2013-10-23 | スタンレー電気株式会社 | 発光装置、および、発光装置の製造方法 |
KR101562022B1 (ko) * | 2009-02-02 | 2015-10-21 | 삼성디스플레이 주식회사 | 발광 다이오드 유닛, 이를 포함하는 표시 장치 및 발광 다이오드 유닛 제조 방법 |
TWI381556B (zh) | 2009-03-20 | 2013-01-01 | Everlight Electronics Co Ltd | 發光二極體封裝結構及其製作方法 |
JP5744386B2 (ja) * | 2009-10-07 | 2015-07-08 | 日東電工株式会社 | 光半導体封止材 |
-
2010
- 2010-12-13 DE DE102010054280A patent/DE102010054280A1/de active Pending
-
2011
- 2011-12-08 TW TW100145235A patent/TWI577053B/zh active
- 2011-12-13 EP EP11794749.9A patent/EP2652806A1/de not_active Withdrawn
- 2011-12-13 KR KR1020137011551A patent/KR101621130B1/ko active IP Right Grant
- 2011-12-13 WO PCT/EP2011/072627 patent/WO2012080263A1/de active Application Filing
- 2011-12-13 US US13/877,296 patent/US9142731B2/en active Active
- 2011-12-13 CN CN201180059950.6A patent/CN103262270B/zh active Active
Non-Patent Citations (1)
Title |
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See references of WO2012080263A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR101621130B1 (ko) | 2016-05-13 |
TWI577053B (zh) | 2017-04-01 |
US20130267051A1 (en) | 2013-10-10 |
CN103262270B (zh) | 2016-02-10 |
WO2012080263A1 (de) | 2012-06-21 |
DE102010054280A1 (de) | 2012-06-14 |
KR20130093640A (ko) | 2013-08-22 |
US9142731B2 (en) | 2015-09-22 |
CN103262270A (zh) | 2013-08-21 |
TW201301581A (zh) | 2013-01-01 |
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