EP2619860A1

EP2619860A1 - Housing and method for producing a housing

Info

Publication number: EP2619860A1
Application number: EP11760448.8A
Authority: EP
Inventors: Uwe Strauss; Markus Arzberger
Original assignee: Osram Opto Semiconductors GmbH
Current assignee: Ams Osram International GmbH
Priority date: 2010-09-20
Filing date: 2011-09-13
Publication date: 2013-07-31
Also published as: US20130266035A1; CN103119806B; WO2012038303A1; DE102010046088A1; US20160036198A1; US9178332B2; CN103119806A; US9461438B2

Abstract

The invention relates to a housing (1) for an optoelectronic semiconductor component (10), comprising a housing body (2) having a mounting plane (20) and a lead frame (3) with a first connecting lead (31) and a second connecting lead (32). The housing body (2) deforms the lead frame (3) in some regions. The lead frame (3) has a main extension plane which extends obliquely or perpendicularly with respect to the mounting plane (20). The invention further relates to a semiconductor component (10) having such a housing (10) and a semiconductor chip (6) and to a method for producing a housing (1).

Description

description

Housing and method of manufacturing a housing

The present application relates to a housing, a

Semiconductor device with such a housing and a

Method for producing a housing.

This patent application claims the priority of German patent application 10 2010 046 088.5, the disclosure of which is hereby incorporated by reference.

For semiconductor laser diodes with waste heat outputs up to the watt range, so-called TO packages are often found,

for example T056, T038 or T09 housing application.

Due to the relatively complicated structure of these metal housing, however, these are too expensive and expensive for applications in the consumer market.

An object is to specify a housing for an optoelectronic semiconductor component which can be produced simply and inexpensively and at the same time ensures good heat dissipation from the radiation-generating semiconductor chip.

Furthermore, a method is to be specified, with which a housing can be manufactured easily and reliably.

This object is achieved by a housing or a method according to the independent patent claims. Embodiments and developments are the subject of the dependent claims.

According to one embodiment, a housing has a housing

Optoelectronic semiconductor device a housing body with a mounting plane and a lead frame with a first connection conductor and a second connection conductor. The housing body transforms the leadframe partially. The lead frame has a main extension plane which runs obliquely or perpendicularly to the mounting plane.

Under a mounting plane is generally a level

understood that by subregions of a surface of the

Housing body is clamped, wherein the mounting plane at a mounting of the housing body to a

Connection carrier, such as a printed circuit board, parallel or substantially parallel, approximately with a tilt of

at most 10 °, to the connection carrier runs. Of the

Housing body may be formed so that it over a large area or even selectively, for example in the form of a

Tripod or a multi-leg, rests on the connection carrier.

By mounting the semiconductor chip on the prefabricated housing, in particular on the first connection conductor, a semiconductor component is realized, which is characterized by a simple and inexpensive production, wherein

waste heat generated simultaneously in the semiconductor chip during operation can be efficiently dissipated.

The housing body preferably has a first main area, wherein the first connection conductor furthermore preferably extends out of the housing body on the part of the first main area

protrudes. A part of the first main surface of the

Housing body outstanding area of the first

Connection conductor is preferred for mounting a

Semiconductor chips provided. The semiconductor chip can thus be mounted in the prefabricated housing body. The housing body can

partially adjacent to the semiconductor chip. Of the

Housing body is in this case, however, not to the

Semiconductor chip molded. In other words, that is

Semiconductor chip not or at least not completely embedded in a molding compound for the housing body.

Further preferably, the first connection conductor and the second connection conductor protrude from the housing body on the part of the first main surface. The electrical contacting of the semiconductor chip is simplified.

In a preferred embodiment, the first runs

Main surface along the mounting plane. That is, the first major surface is in the mounting plane or parallel to it. In this case, the main extension plane of the

Lead frame to the mounting plane in the same angle as the first main surface. Furthermore, in this case, the mounting of the housing body to a connection carrier can be effected such that the first main surface parallel to the

Connection carrier runs.

Under a main plane of extension of the lead frame is in doubt a parallel to a surface of the lead frame extending surface perpendicular to a

Direction is along which the extension of the lead frame is the smallest. For example, in a leadframe made of sheet metal, typically the thickness of the metal sheet determines the smallest dimension of the leadframe. The main plane of extension runs along the surface of the metal sheet. In the case of a partially curved Surface thus also extends the main extension plane according to regions curved.

In a preferred embodiment, the

Main extension plane of the lead frame formed completely planar. That is, the lead frame is free of kinks or bends. In other words, the connecting conductors during manufacture can be produced in a simple manner by structuring from a base material present in planar form, for example from an unstructured, planar metal sheet. On additional manufacturing steps for bending or buckling of the base material can thus

be waived.

The housing is preferably designed such that the semiconductor device is surface mountable.

Further preferably, the housing body in addition to the mounting plane on another mounting plane. The housing can be attached in different ways. Preferably, the mounting plane and the further mounting plane parallel to each other. In this case, the radiation direction of the radiation of the semiconductor chip relative to the

Connection carrier regardless of whether the first or the second mounting level for the attachment of the housing

is used.

In a preferred embodiment, the first

Connection conductor and the second connection conductor between the mounting plane and the other mounting level externally electrically contacted. The production of an electrically conductive connection between the connection carrier and the Connection conductors regardless of the mounting level used is thus further simplified.

In a preferred embodiment, one is along the

Main extension plane extending side surface of the first connection conductor for the attachment of the semiconductor chip is provided. In an edge emitting laser

executed semiconductor chip is thus the

Direction of radiation with respect to the connection carrier by the orientation of the first connection conductor relative to

Assembly level of the housing body specified.

In a preferred embodiment, the housing body is a plastic body which is connected to the lead frame, in particular to the first lead and to the second

Connection conductor, is molded. Such a housing body is particularly simple and by means of a casting process

inexpensive to produce. A casting process is generally understood to mean a process by means of which a molding composition can be designed according to a predetermined shape, for example by means of casting, injection molding or transfer molding.

On one side opposite the first main surface, the housing body is preferably delimited by a second main surface, preferably flat, and furthermore preferably parallel to the first main surface. The first

Main surface and / or the second main surface can the

Form mounting plane of the housing body.

In a further preferred embodiment, the first connection conductor and the second connection conductor are in an in the main extension plane extending direction spaced from each other.

The lead frame, preferably the first lead and the second lead, in a preferred

Embodiment a thickness of at least 0.5 mm, more preferably a thickness of at least 1 mm on. This ensures in a simple manner that resulting in a arranged on the first terminal conductor semiconductor chip

Loss heat can be dissipated efficiently from the semiconductor chip. The thickness is adjustable in the manufacture of the housing by the thickness of the base material for the connection conductors.

Further preferably, the first connection conductor at least partially, in particular in the part of the first

Main surface protruding from the housing body area, a cross-section of at least 1 mm ² . An efficient heat dissipation from the semiconductor chip is also for

Ensures semiconductor chips in operation

Generate waste heat outputs of 0.1 W or more. to

Improvement of heat dissipation can be especially the

Cross section of the first connecting conductor on the part of the first main surface of the housing body be greater than that

Cross section of the second connection conductor.

In a further preferred embodiment, the

Housing body at least one support element with a

Support surface on. By means of the support surface, the

Assembly level be formed. Preferably, the

Housing body on two opposite sides of the

Main extension level in each case at least one bearing surface. The bearing surfaces can be replaced by a continuous Support member or by two spaced apart

Support elements may be formed. During assembly of the housing, the housing, in particular prior to the formation of an electrically conductive connection of the connection conductor with the connection carrier, rest on at least one support surface of the at least one support element. The risk of tilting of the housing during assembly is reduced.

Furthermore, the support element on the first

Support surface opposite side a second

Form support surface. In particular, by means of the first bearing surface, the mounting plane and by means of the second

Support surface to be formed the further mounting plane or vice versa.

In a further preferred embodiment, the first connection conductor and the second connection conductor each form an external contact region, which is provided for the external electrical contacting of the housing.

In particular, a region extending in the lateral direction, that is to say in a direction running along the mounting plane, can project out of the housing body

Connecting conductor and / or the second connection conductor form one of the external contact areas.

Preferably, the contact region extends in a direction perpendicular to the mounting plane vertical direction between each of a first side surface and a second side surface.

In a preferred embodiment, the mounting plane is formed by means of the support surface of the support member and the support surface is in a direction perpendicular to the mounting plane vertical direction offset to one of the

Support surface nearest, in particular parallel to the support surface extending side surface of the lead frame formed. In particular, the first side surface

be arranged offset to the first bearing surface of the support element. Alternatively or additionally, the second side surface offset from the second bearing surface of the

Be arranged support member.

In other words, the side surface of one of

Connection conductor in the contact area and in the vertical

Direction nearest bearing surface no common plane. The offset is preferably so large that between the

Connection carrier and the nearest side surface of the contact region, so depending on the positioning of the housing relative to the connection carrier between the connection carrier and the first side surface or between the connection carrier and the second side surface, a connection layer for electrical contacting, for example, a solder or an electrically conductive adhesive formed can be when the support member rests on the connection carrier.

Preferably, the offset is between 5 μπι inclusive and 50 μπι inclusive.

In one development, the housing is designed such that the contact region on the first side surface or on the second side surface is electrically contactable. Thus, a housing is realized in a simple manner, the on

different ways is electrically contactable,

for example, from a side facing away from the second main surface or from a side facing away from the second main surface. In a preferred embodiment, at least one of the connection conductors has an extension which is, for example, pin-shaped. The extension is preferably intended to project into a recess of the connection carrier when the housing is mounted on a connection carrier. The extension preferably has a main extension direction running in the vertical direction. By means of the extension, the mounting accuracy of the housing can be increased. Of the

Extension can also be provided for electrical contacting of the connection conductor.

In a preferred development, the housing is designed such that the first connection conductor and the second connection conductor can be contacted electrically by means of the external contact regions and / or by means of the extension. In other words, the housing is depending on the

Use in different ways electric

Contactable, so that the versatility of the housing is increased in a simple manner.

In a preferred embodiment, at least one of the connection conductors has a positioning element for an optical element. The positioning element preferably runs in the main extension plane of the leadframe. Thus, the optical element by means of the positioning element in a reliable manner relative to that on the first

Terminal conductor arranged semiconductor chip can be positioned. Preferably, the optical element is designed so that it can be attached to the positioning element, for example by means of a plug connection.

In a method of manufacturing a package for a semiconductor device, according to an embodiment, it is a form Terminal conductor composite with a plurality of

Connection conductor areas provided. The

Connecting conductor regions are formed with a molding compound in such a way that in each lead region of the

Formmasse a housing body emerges, the

Connecting conductor areas in a main extension plane of the connecting conductor composite in each case by a first

Main surface of the housing body protrude from the housing body. The connection conductor network is severed between adjacent connection conductor regions, so that each housing has a housing body and from each connection conductor region emerge a first connection conductor and a second connection conductor.

The connecting conductors can be made of a planar

Connecting conductor compound emerge. In particular, the connection conductor composite can be formed by structuring a planar metal sheet, for example mechanically, for example by means of stamping or milling, or chemically, for example by means of etching. Alternatively, it is also conceivable that

Connecting conductor composite by means of a casting process

form, so that a subsequent structuring is not required.

Preferably, the connection conductor composite is in

provided coherent form, wherein between

Areas that make up the connecting conductors,

Intermediate space is formed, which in forming the

Housing body is filled with the molding material.

In a preferred embodiment, the penetrates

Anschlussleiterbereich the housing body at least three spaced locations. Preferably protrudes Terminal conductor region in the main extension plane of the terminal conductor composite, in particular in a direction parallel to the first main surface extending direction

opposite sides of the housing body out.

In a further preferred embodiment is the

each of the provided connection areas

Bridging area assigned to the connection conductor group. The bridging area connects the first terminal conductor and the second terminal conductor before cutting

together. When cutting the connection conductor compound, the bridging areas of the

Connection conductor areas separated. By means of

Bridging areas can be easily formed a contiguous connecting conductor composite. After the forming of the connection conductor composite, the connection conductors of the respective housing are mechanically stably connected to each other by means of the housing body, so that the associated

Bridging area is no longer required.

The method described is particularly suitable for producing a housing described above. in the

Related to the housing executed features can therefore be used for the process and

vice versa .

Further features, embodiments and expediencies will become apparent from the following description of

Embodiments in conjunction with the figures.

Show it: Figures 1A and 1B a first embodiment of a housing of a semiconductor device in a schematic

Side view (Figure 1B) and associated sectional view (Figure 1A); FIGS. 2A to 2C show a second exemplary embodiment of a housing in a schematic side view (FIG. 2B),

associated sectional view (Figure 2A) and in plan view (Figure 2C); Figures 3A and 3B show two mounting variants for a housing according to the second embodiment in more schematic

Cut looks;

Figure 4 shows a third embodiment of a housing in a schematic sectional view;

Figure 5 shows a fourth embodiment of a housing in a schematic sectional view;

Figure 6 shows a fifth embodiment of a housing in a schematic sectional view;

Figure 7 shows a sixth embodiment of a housing in a schematic sectional view; and FIGS. 8A to 8C show an exemplary embodiment of FIG

A method for producing a housing by means of in each case in a schematic sectional view shown

Intermediate steps.

The same, similar or equivalent elements are provided in the figures with the same reference numerals. The figures and the proportions of the elements shown in the figures with each other are not as

to scale. Rather, individual elements for better presentation and / or better

Understanding to be exaggeratedly tall.

FIGS. 1A and 1B show a first exemplary embodiment of a housing 1 for a surface-mountable housing

Semiconductor device 10 shown schematically.

The housing 1 has a first connection conductor 31 and a second connection 32. The connection conductors form a lead frame 3, to which a housing body 2 is integrally formed. The housing body is made of a plastic.

The housing body 2 extends in a vertical

Area-wise between a first main surface 21 and a second main surface 22. One region 311 of the first connection conductor 31 and a region 321 of the second

Terminal conductor 32 each protrude from the first main surface 21 of the housing body 2. The outstanding areas of the connecting conductors run parallel to each other. The protruding areas are provided for electrical contacting of a semiconductor chip.

The lead frame 3 extends planar along a

Main extension plane. The connection conductors 31, 32 thus run in a common plane. The main extension plane is perpendicular to the first main surface 21.

As shown in Figure 1B, in the prefabricated housing 1, an optoelectronic semiconductor chip 6 is arranged, for example, as an edge-emitting laser chip

can be executed. The semiconductor chip is at the first Terminal conductor 31 attached and electrically connected to this, for example by means of a solder or an electrically conductive adhesive. The second

Terminal conductor 32 is electrically conductively connected to the semiconductor chip 6 by means of a connecting line 65, for example a bonding wire.

In the exemplary embodiment shown, the semiconductor chip 6 is fastened to a side surface 310 of the first connection conductor 31, which along the main extension plane of the

Ladder frame runs. In the case of a semiconductor chip 6 designed as an edge-emitting semiconductor laser, the radiation thus takes place perpendicularly to the first main surface of the semiconductor chip

Housing body 2, ie in the vertical direction.

The radiation does not have the housing body 2

go through, so that the housing body also for the in

Semiconductor chip to be generated radiation impermeable

can be trained.

In the main extension plane of the lead frame 3, the first connection conductor 31 is spaced from the second connection conductor 32. The connection conductors are thus electrically insulated from each other in the housing 1 and only via the

Housing body 2 mechanically stable interconnected.

In a direction perpendicular to the vertical direction lateral direction of the housing body 2 by a

Side surface 23 limited. The connecting conductors 31, 32 protrude out of the housing body 2 in the lateral direction, wherein the protruding part of the first connecting conductor 31 has a first external contact region 33 and that of FIG

Housing body outstanding part of the second connection conductor 32 form a second external contact region 34. By applying an external electrical voltage between the contact regions, charge carriers from different sides can be injected into the semiconductor chip 6 and recombined there with the emission of radiation.

The semiconductor chip preferably contains a III-V

Compound semiconductor material. I I I-V semiconductor materials are for radiation generation in the ultraviolet

(Al _x In _y Gai-x- _y N) through the visible (Al _x In _y Ga _x - _y N,

especially for blue to green radiation, or

Al _x In _y Gai-x- _y P, in particular for yellow to red radiation) to the infrared (Al _x In _y Ga _x - particularly suitable _y As) spectral range. In each case, 0 <x <1, 0 <y <1 and x + y <1, in particular with x Φ 1, y 1, x Φ 0 and / or y 0.

In the vertical direction extend the first

Contact region 33 and the second contact region 34 between a first side surface 331 and 341 and a second side surface 332 and 342, respectively.

The contact areas 33, 34 are designed such that the housing in different orientation to a

Connection carrier, such as a rigid or flexible

Printed circuit board, attached and can be electrically connected to this. This will be explained in more detail in connection with FIGS. 3A and 3B.

The housing body 2 further has in plan view of the

Housing on both sides of the main extension plane in each case a support member 25. The support member 25 extends in a direction to the main extension plane of the lead frame third perpendicular direction over the remaining part of the housing body out. In the vertical direction, the support element 25 extends in each case between a first bearing surface 251 facing away from the second main surface 22 and a second bearing surface 252 facing the second main surface 22.

By means of the first bearing surface 251, a mounting plane 20 is formed. Accordingly, a further mounting plane 201 is formed by means of the second bearing surface 251. The mounting plane and the further mounting plane are parallel to each other and continue parallel to the first main surface 21 of the

Housing body 2.

The support element 25 is provided for the housing during assembly of the semiconductor device 10 on a

Mechanically stabilize the connection carrier, in particular before the semiconductor device is connected to the connection conductors 31, 32 to the connection carrier.

To produce the housing 1, the connection conductors 31, 32 may be formed from a base material in planar form, for example a metal sheet, for example a copper sheet, from a copper-containing alloy sheet. On bending or buckling of the lead frame can be omitted during manufacture.

Unlike a conventional case with a

Lead frame extend the connection conductors 31, 32 of the

Lead frame 3 in the described housing 1 in a

Level, wherein the plane perpendicular or at least obliquely to a mounting plane of the housing and thus perpendicular or at least obliquely to the connection carrier, on which the housing is arranged. Deviating from the exemplary embodiment described, the main extension plane of the connection conductors 31, 32 does not necessarily have to be perpendicular to the first main surface 21

or to the mounting planes 20, 201 of the

Housing body 2 stand. Depending on the desired

Direction of radiation of the semiconductor device may also be useful another angle of the plane relative to the main surface 21 and to the mounting planes.

The thickness of the first connection conductor 31 and the second connection conductor 32, ie the extension perpendicular to

Main extension plane of the connection conductor, amounts

preferably at least 0.5 mm, more preferably

at least 1.0 mm. This ensures that waste heat generated in the semiconductor chip 6 during operation of the semiconductor component 10 can be dissipated efficiently via the first connection conductor 31. The housing is therefore particularly suitable for

Semiconductor chips in which a comparatively high heat output must be dissipated during operation, for example 0.1 W or more. In particular, the housing is suitable for semiconductor chips which are used to generate coherent,

incoherent or partially coherent radiation are provided.

A cross section of the first connecting conductor 31 is preferably at least 1 mm 2, more preferably at least 2 mm 2. The cross section of the second connection conductor may also be smaller than the cross section of the first connection conductor 31, since this only serves for electrical contacting of the semiconductor chip. The extension of the lead frame 3 in the lateral direction can thus be the same

Functionality can be minimized. A second embodiment of a housing is in

Figures 2A to 2C schematically in sectional view, in

Side view or shown in plan.

This second embodiment substantially corresponds to the first embodiment described in connection with FIGS. 1A and 1B. In contrast, the housing has a cap 5. The cap 5 surrounds the protruding from the first main surface 21 of the housing body 2 parts of the connecting conductors 31, 32. The cap 5 is

expediently for in the semiconductor device to

generating radiation transparent or at least translucent. For example, the cap of a

Be made of plastic or a glass. A mounted on the first terminal conductor 31 semiconductor chip can by means of the cap 5 against external influences such as mechanical

Load, moisture or dust are protected. On an enclosure formed by a potting compound for the

Semiconductor chip can be dispensed with.

As shown in FIG. 2C, the housing body 2 has a circular basic shape in plan view. Such a housing shape is characterized in the production of the

Housing body made of a molding material by a particularly good mold release. Deviating from this, however, other curved, for example elliptical or even polygonal basic forms can be used.

The support member 25 is formed in the embodiment shown as a continuous elliptical element through which the main extension plane of the lead frame 3 extends and which forms the mounting plane 20 and the further mounting plane 201. Deviating from this, as in the first

Embodiment also two or more separate Support elements may be provided. Furthermore, it is also conceivable, the housing body only with a support element

to train.

In Figs. 3A and 3B are various

Mounting options for a housing shown, which is carried out as described in connection with Figures 2A to 2C.

In the variant shown in Figure 3A has a

Connection carrier 4 has a recess 41. The connection carrier has a first main surface 44 and one of the first

Main surface 44 opposite second major surface 45 on. In the variant shown in Figure 3A, the

Connection carrier 4 on the second main surface on a first pad 42 and a second pad 43. The first connection surface and the second connection surface are connected to the first connection conductor 31 or the second connection conductor 32 by means of a connection layer, for example a solder or an electrically conductive adhesive (not explicitly shown).

The first side surface 331 of the first connection carrier 31 and the first side surface 341 of the contact region of the second connection conductor 32 are each for electrical

Contacting with the pads provided. In other words, those side surfaces of the

Lead frame 3 provided for contacting, resulting in the structuring of the lead frame, such as by punching. These side surfaces are perpendicular or at least substantially perpendicular to the side surface 310, which is provided for the attachment of the semiconductor chip. The bearing surface 251 forms the mounting surface 20. The first bearing surface 251 of the support element 25 is offset relative to the first side surfaces 331, 341 of the contact region 33, 34 of the connecting conductors 31, 32, so that the housing 2 rests on the first bearing surface 251 during assembly and between the connection carrier 4 and the connecting conductors 31, 32, the connecting means can be formed.

Preferably, the offset is between 5 and 50 μπι inclusive. Deviating from that

Support surfaces of the support element or the support elements but also be flush with the respective nearest side surfaces of the contact area.

In this exemplary embodiment, only the regions 311, 312 of the connection conductors 31, 32 projecting from the housing body 2 on the part of the first main surface 21 extend through the recess 41 of the connection carrier 4. The contact regions 33, 34 of the connection conductors 31 and 32 and the housing body 2 are arranged on the same side of the connection carrier 4.

In contrast to the first illustrated in FIG. 3A

Mounting variant, the connecting surfaces 42, 43 are arranged on the first main surface 44 of the connection carrier 4 in the second assembly variant shown in Figure 3B. The recess 41 of the connection carrier 4 is so large that the housing body 2 can be partially inserted into the recess 41.

In this embodiment, those of the second

Main surface 22 of the housing body 2 facing the second

Side surfaces 332, 342 of the first contact region 33rd

or the second contact region 34 of the electrical contact with the first pad 42 and the second pad 43rd

Furthermore, the housing body 2 is located with the second

Main surface 22 facing the second support surface 252 of the support member 25, which forms the further mounting surface 201, on the connection carrier 4.

As the figures show, depending on the configuration of the connection carrier 4, in each case the first side surface or the second side surface of the contact regions of the

Connection carrier serve for electrical contacting. A semiconductor component with such a housing body with at least two mounting planes is therefore characterized by a particularly high flexibility with respect to the assembly. In mutually parallel mounting planes, the radiation takes place independently of the mounting with respect to the

Connection carrier in the same direction. Deviating from the mounting plane and the other mounting level but also be tilted to each other, so that the

Direction of emission of the semiconductor chip by the choice of

Mounting level is adjustable.

A third embodiment of a housing is shown in Figure 4 in a schematic sectional view. This third embodiment corresponds essentially to the in

Connection with the second embodiment described in FIGS. 2A to 2C. In contrast to this, the

Terminal conductor 31, 32 each have an extension 35. The extensions 35 extend through the second main surface 22 of the housing body 2. The housing 1 is arranged on a connection carrier 4, wherein the connection carrier 4 has connection openings 46, through which the extensions 35 extend. In this embodiment, the second main surface 22 of the housing body 2 serves as a mounting surface 20 for arrangement on the connection carrier 4. The extensions extend in the

Main extension plane of the lead frame 3.

The connecting conductors 31, 32 are on the side facing away from the housing body 2 of the connection carrier 4 with the

Pads 42 and 43 electrically connected.

In contrast to the second exemplary embodiment, the electrical contacting of the housing therefore does not take place via the contact regions 33, 34 extending laterally out of the housing body 2, but via the extensions 35.

The lead frame 3 protrudes from the housing body 2 on the part of the first main face 21, on the side of the second main face 22 and laterally out of the side face 23, that is, at four spaced apart locations

Housing body out. The flexibility of the housing

in terms of its mountability can be further increased so.

Deviating from the described type of mounting, the housing according to the illustrated embodiment, but also as shown in Figure 3B may be mounted so that the

Contact areas 33, 34 can serve the electrical contacting of the housing. A fourth embodiment of a housing is shown in FIG

5 is a schematic sectional view. This fourth embodiment substantially corresponds to the im

Connection with the second embodiment described in FIGS. 2A to 2C.

In contrast, the first connection conductor 31 and the second connection conductor 32 each have a

Positioning element 36, extending from the first

Side surfaces 331, 341 of the first contact region 31st

or the second contact region 34 extends away.

The electrical contacting takes place here as in

Related to Figure 3A described.

The positioning elements 36 extend through

Connection openings 46 of the connection carrier 4 therethrough.

In this embodiment, the serve

Positioning elements 36 not the electrical

Contacting the case, but the exact

Positioning of the housing relative to the connection carrier 4.

Deviating from the described embodiment, the pads 42, 43 but also on the first

Main surface 44 of the connection carrier 4 may be formed. In this case, the positioning elements can also be used for the electrical contacting of the housing.

A fifth embodiment of a housing is shown in FIG

6 shown in a schematic sectional view. This fifth embodiment corresponds essentially to the

Related to Figure 5 described fourth Embodiment. In contrast, the housing has an optical element 7. The optical element 7 is on the side facing away from the housing body 2

Connection carrier 4 arranged. The optical element 7 can continue to fulfill the function of a cap, so that can be dispensed with a separate cap.

The optical element 7 has recesses 71 into which the positioning elements 36 protrude. Because the

Positioning elements 36 with the side surface 310 for the semiconductor chip form a common plane, by means of the positioning elements 36, a precise adjustment of the optical element 7 relative to the semiconductor chip of

Semiconductor device take place.

The optical element 7 can in particular for the collimation of the radiation emitted by the semiconductor chip, in particular a collimation along the strongly diverging

Abstrahlebene ("fast axis") or the weakly divergent Abstrahlebene ("slow axis") done. Alternatively or

In addition, the optical element 7 may be formed as a diffractive optic.

A sixth exemplary embodiment of a housing 1 is shown schematically in FIG. This sixth

Embodiment corresponds substantially to the im

Related to Figure 6 described fifth

Embodiment. In contrast, the housing 2 has a further optical element 75. The further optical element 75 is fixed to the housing body 2.

For example, the further optical element 75 of the

Collimation along the highly divergent Abstrahlebene and the optical element 7 of collimation along the slightly divergent Abstrahlebene serve or vice versa. Furthermore, as described in connection with FIG. 3B, the housing is mounted so that the housing body 2 extends in sections through the recess 41 of the connection carrier 4. In this embodiment, therefore, the positioning elements 36 do not extend through the connection carrier 4, but merely serve to position the optical element 7 relative to the

Terminal conductor 31, 32 and thus relative to the mounted

Semiconductor chip.

In FIGS. 8A to 8C, with reference to FIG

Section shown intermediate steps

Embodiment of a method for producing a housing shown. The production is shown here by way of example for a housing which is designed as described in connection with FIGS. 1A and 1B.

As shown in FIG. 8A, a lead connection 30 is provided with a plurality of lead sections 300. A lead portion 300 is provided for each of a housing.

For the sake of simplified illustration, only one connecting conductor region 300 as well as partial regions of the respectively adjacent connecting conductor regions are shown in FIGS. 8A to 8C.

The connecting conductor composite 30 can be produced by structuring a metal sheet, for example mechanically, for example by stamping or milling, or chemically, for example by etching. Alternatively to a structuring of one

Metal sheet, the connection conductor composite can also be formed in an already structured form, for example by means of casting. The connecting conductor composite 300 is in planar form, so that it is possible to dispense with bending or buckling of the starting material for the connecting conductor composite.

The connecting conductor areas 300 are each one

Bridging area 301 associated with the parts of the

Anschlussleiterbereichs, from which the first terminal conductor 31 and the second terminal conductor 32 emerge, mechanically stable interconnects. By means of

Bridging regions 301, the connection carrier assembly 30 may be provided in a contiguous form.

To form the housing body 2, the

Connecting conductor areas so deformed with a molding compound that a housing body is formed in which the

Connecting conductor areas protrude from a first main surface of the housing body 2 (Figure 8B). Furthermore, the lead portions 300 protrude from a side surface 23 of the case body at opposite sides.

The bridging region 301 extends outside of

Housing body 2.

The formation of the housing body can be done for example by means of casting, injection molding or transfer molding.

To complete the case of the

Terminal conductor compound 30 is between adjacent ones

Connecting conductor areas 300 severed. In the areas where the cutting is done, the

Connecting conductor areas a relation to the contact areas 33, 34 reduced cross section, in particular a

reduced vertical extent, on. This ensures that burrs created during cutting are removed during installation Housing does not hinder the formation of a conductive connection between the side surfaces of the contact areas and the connection carrier.

The bridging regions 301 are completely separated during the separation of the connecting conductor composite 30, so that the first connecting conductor 31 and the second connecting conductor 32 are mechanically connected to one another in the finished housing only via the housing body 2 (FIG. 8C).

The invention is not limited by the description with reference to the embodiments. Rather, the includes

Invention every new feature as well as every combination of

Features, which includes in particular any combination of features in the claims, even if this feature or this combination itself is not explicitly in the

Claims or the embodiments is given.

Claims

claims

1. Housing (1) for an optoelectronic

Semiconductor device (10), wherein

- The housing has a housing body (2) with a mounting plane (20) and a lead frame (3) with a first

Connecting conductor (31) and a second connecting conductor (32);

- The housing body partially transforms the lead frame; and

- The lead frame (3) has a main extension plane which extends obliquely or perpendicular to the mounting plane (20).

2. Housing according to claim 1,

in which the housing body has a first main surface (21)

wherein the first connection conductor (31) and the second connection conductor (32) protrude from the housing body (2) from the first main surface and a region (311) of the first connection conductor (31) protruding from the housing body from the first main surface for fastening a Semiconductor chips is provided.

3. Housing according to claim 2,

the first major surface being along the mounting plane

runs.

4. Housing according to one of claims 1 to 3,

in which a side surface (310) of the first connection conductor extending along the main extension plane for the

Attachment of the semiconductor chip is provided.

5. Housing according to one of claims 1 to 4,

in which the main extension plane of the lead frame

is formed completely planar.

6. Housing according to one of claims 1 to 5,

wherein the leadframe has a thickness of at least 0.5 mm.

7. Housing according to one of claims 1 to 6,

in which the housing body has a support element (25) with a bearing surface (251, 252), wherein the mounting plane is formed by means of the support surface and the support surface is offset in a vertical direction perpendicular to the mounting plane to a side surface of the support surface closest to the support surface Lead frame is formed.

8. Housing according to one of claims 1 to 7,

in which at least one of the connection conductors has an extension (35) which is intended to project into a recess (41) of the connection carrier when the housing is mounted on a connection carrier (4).

9. Housing according to claim 8,

in which the first connection conductor and the second

Connection conductor one from the housing body

outstanding external contact region (33, 34), wherein the first connection conductor and the second

Terminal conductor by means of the external contact areas and / or by means of the extension is electrically contacted.

10. Housing according to one of claims 1 to 9,

at least one of the connecting conductors Positioning element (36) for an optical element (7).

11. An optoelectronic semiconductor component (10) having a housing (1) according to one of claims 1 to 10,

in which a semiconductor chip (6) is attached to the first connection conductor.

12. A method for producing a housing (1) for a semiconductor component (10) with the steps:

a) providing a connection conductor group (30) with a plurality of connection conductor areas (300);

b) forming the connecting conductor areas (300) with a

Molding compound such that in each lead region (300) from the molding compound results in a housing body (2), wherein the lead portions (300) in a main extension plane of the terminal conductor (30) in each case by a first main surface (21) of the housing body (2) from the housing body (2) stand out;

c) cutting through the connection conductor assembly (30) between adjacent connection conductor regions (300) such that each housing (1) has a housing body (2) and from each connection conductor region (300) a first connection conductor (31) and a second connection conductor (32) emerge.

13. The method according to claim 12,

in which the lead wire area in the

Main extension plane of the terminal conductor assembly protrudes in a parallel to the first main surface extending direction from opposite sides of the housing body.

14. The method according to claim 12 or 13,

in which the connecting conductor areas in step a) respectively a bridging region (301) of the connecting conductor composite is assigned, wherein the bridging region connects the first connecting conductor and the second connecting conductor before step c) and in which the

Bridging areas in step c) of the

Connecting conductor areas are separated.

15. The method according to any one of claims 12 to 14,

wherein a housing according to any one of claims 1 to 10 is produced.