EP2613354A1 - Lichtemittierende Vorrichtung mit mehreren Hohlräumen - Google Patents
Lichtemittierende Vorrichtung mit mehreren Hohlräumen Download PDFInfo
- Publication number
- EP2613354A1 EP2613354A1 EP12150037.5A EP12150037A EP2613354A1 EP 2613354 A1 EP2613354 A1 EP 2613354A1 EP 12150037 A EP12150037 A EP 12150037A EP 2613354 A1 EP2613354 A1 EP 2613354A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- light emitting
- emitting device
- cavities
- emitting unit
- central slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical group [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 4
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000000605 extraction Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 8
- 239000004033 plastic Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Definitions
- the present invention relates to a light emitting device, in particular to a Multi-Cavities light emitting device capable of emitting a warm white light.
- LED light emitting diodes
- the LED module 1a comprises a substrate 10a, a plurality of LED chips (such as blue LED chips) 20a, a fluorescent plastic (such as a yellow fluorescent plastic) 30a and a plurality of lenses 40a, wherein the substrate 10a includes a plurality of slots 11a arranged in a matrix, and the LED chips 20a are installed into the slots 11a respectively, and the fluorescent plastic 30a is filled into the slots 11a for covering the LED chips 20a and emitting a desired light color, and finally the lenses 40a are combined and formed onto the fluorescent plastic 30a and the LED chips 20a to seal each LED chip 20a. With the lens 40a, the light emitting efficiency of the LED chip 20a can be improved to provide a white light source.
- LED chips such as blue LED chips
- a fluorescent plastic such as a yellow fluorescent plastic
- the lenses 40a are combined with the LED chips 20a one by one, so that the overall assembling time and cost will be increased.
- a large number of slots 11 a are densely disposed, so that a substrate with a larger area is required, and the strength of the substrate 10a will be affected adversely, and the substrate 10a may be cracked or broken easily to result in a low yield rate.
- the present invention provides a Multi-Cavities light emitting device, comprising: a base, a first light emitting unit, and at least two second light emitting units, and the base has a central slot and at least two side slots symmetrically formed on external sides of the central slot.
- the central slot and the side slots are formed in an area greater than 50% of the area of the base, and the first light emitting unit is installed in the central slot, and the two second light emitting units are installed in the at least two side slots respectively.
- Another objective of the present invention is to provide a Multi-Cavities light emitting device, wherein a ceramic material is used for making the base, and a gap between the central slot and each of the side slots is greater than 0.5mm to maintain the strength of the base, so as avoid the substrate from being cracked or broken, and improve the yield rate of the product.
- the light emitting device of the present invention comprises at least three slots formed on the base, and the blue LED chip and the red LED chip are installed into each corresponding slot, and the blue LED chip is covered by a plastic layer containing a yellow or green phosphor, so as to emit a warm white light. Since the red LED chip is not covered with a fluorescent plastic layer, therefore the light extraction efficiency of the red LED chip will not be affected, and the overall light extraction efficiency of the light emitting device can be improved.
- the lens is integrally sealed onto the central slot and at least two side slots, and thus it is not necessary to seal the slots one by one, and the manufacturing time and labor of the light emitting device can be reduced to lower the overall cost.
- the invention can minimize the light emitting area effectively to facilitate a secondary optical design at a later stage, so as to provide a more practical use of the present invention.
- FIG. 1 is a schematic planar view of a conventional LED module
- FIG. 2 is a partial cross-sectional view of a conventional LED module
- FIG. 3 is a schematic planar view of a Multi-Cavities light emitting device of the present invention.
- FIG. 4 is a cross-sectional view of a Multi-Cavities light emitting device of the present invention.
- FIG. 5 is a cross-sectional view of a Multi-Cavities light emitting device in accordance with another embodiment of the present invention.
- FIG. 6 is a cross-sectional view of another Multi-Cavities light emitting device in accordance with a further embodiment of the present invention.
- the Multi-Cavities light emitting device 1 comprises a base 10, a first light emitting unit 20, at least two second light emitting units 30, a light conversion layer 40 and a lens 50.
- the base 10 has a central slot 11 and at least two side slots 12 symmetrically formed on external sides of the central slot 11.
- the base 10 can be a ceramic base having a plurality of conductive holes 13 and an inner-layer circuit 14, but the invention is not limited to such arrangement only.
- the first light emitting unit 20 is a blue light emitting unit
- each of the second light emitting units 30 is a red light emitting unit
- the central slot 11 and the side slots 12 are substantially in a long elliptical shape, and a gap between the central slot 11 and each of the side slots 12 is greater than 0.5mm.
- the central slot 11 and the side slots 12 are formed in an area greater than 50% of the area of the base 10.
- the first light emitting unit 20 is installed in the central slot 11, and the two second light emitting units 30 are installed into two corresponding side slots 12 respectively.
- the first light emitting unit 20 (which is the blue light emitting unit) and the second light emitting units 30 (which are the red light emitting units) are electrically coupled through the conductive holes 13 and the inner-layer circuit 14, and the substrate 10 includes a plurality of electric connecting pads 15 installed at the bottom of the substrate 10.
- the blue light emitting unit installed in the central slot 11 is a blue LED chip array
- the red light emitting units installed on both external sides of the blue light emitting unit are red LED chip arrays.
- the light conversion layer 40 is a plastic layer containing a yellow or green phosphor, and the light conversion layer 40 is covered onto the first light emitting unit 20 (which is the blue light emitting unit).
- the first light emitting unit 20 which is the blue light emitting unit
- YAG yttrium aluminum garnet
- the lens 50 is protruded from the base for sealing the central slot 11 and the at least two side slots 12, and the lens 50 is made of resin, silicone, or epoxy resin, and a diffusion agent is added into the material of the lens to form the shape of a lens naturally, so as to enhance the light extraction and mix the lights emitted from the first light emitting unit 20 (which is the blue light emitting unit) and the second light emitting units 30 (which are the red light emitting units).
- FIG. 5 for a cross-sectional view of a Multi-Cavities light emitting device in accordance with another embodiment of the present invention, the difference between FIG. 5 and FIG 4 resides on that the blue light emitting unit 20 is combined into the central slot 11 by the method of a flip chip.
- the blue light emitting unit and the red light emitting unit can be interchangeable.
- the first light emitting unit 20 can be a red light emitting unit
- each of the second light emitting units 30 can be a blue light emitting unit.
- the red light emitting unit is installed in the central slot 11.
- the side slots 12 include the blue light emitting units installed therein respectively, and the side slots 12 are filled with the light conversion layers 40, and the light conversion layers 40 are disposed at positions corresponding to the blue light emitting units for covering the blue light emitting unit, and the lens 50 is provided for sealing the central slot 11 and side slots 12, so as to complete assembling the light emitting device 1.
- this preferred embodiment is substantially the same as the first preferred embodiment, and the light emitting device 1' of this preferred embodiment comprises a base 10', a first light emitting unit 20' (which is a blue light emitting unit), at least four second light emitting units 30' (which are red light emitting units), a light conversion layer 40' and a lens 50'.
- the base 10' has a central slot 11' and four side slots 12', and the side slots 12' are formed around external sides of the central slot 11', wherein each side slot 12' includes a second light emitting unit 30' installed therein, and each second light emitting unit 30' (which is the red light emitting unit) includes a plurality of red LED chips connected in series with each other, and the red light emitting unit can be substituted by a red LED array.
- the quantity and position of the second light emitting units 30' and the first light emitting units 20' are not limited, so that the desired brightness and color temperature can be adjusted flexibly.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12150037.5A EP2613354B1 (de) | 2012-01-03 | 2012-01-03 | Lichtemittierende Vorrichtung mit mehreren Hohlräumen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12150037.5A EP2613354B1 (de) | 2012-01-03 | 2012-01-03 | Lichtemittierende Vorrichtung mit mehreren Hohlräumen |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2613354A1 true EP2613354A1 (de) | 2013-07-10 |
EP2613354B1 EP2613354B1 (de) | 2020-05-06 |
Family
ID=45440419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12150037.5A Active EP2613354B1 (de) | 2012-01-03 | 2012-01-03 | Lichtemittierende Vorrichtung mit mehreren Hohlräumen |
Country Status (1)
Country | Link |
---|---|
EP (1) | EP2613354B1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105489738A (zh) * | 2016-02-16 | 2016-04-13 | 惠州雷曼光电科技有限公司 | 色温显指可调的白光led器件、其制备方法及调控方法 |
CN106716654A (zh) * | 2014-09-17 | 2017-05-24 | 飞利浦照明控股有限公司 | 柔性发光装置 |
CN111403579A (zh) * | 2020-02-29 | 2020-07-10 | 华中科技大学 | 一种具有阵列透镜出光面的大功率白光led及制备方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040070333A1 (en) * | 2002-10-11 | 2004-04-15 | Highlink Technology Corporation | Full-color display divice |
US20040217364A1 (en) * | 2003-05-01 | 2004-11-04 | Cree Lighting Company, Inc. | Multiple component solid state white light |
US20050127816A1 (en) * | 2003-12-16 | 2005-06-16 | Naofumi Sumitani | Light emitting device and method of manufacturing the same |
WO2005091392A1 (en) * | 2004-03-18 | 2005-09-29 | Phoseon Technology, Inc. | Micro-reflectors on a substrate for high-density led array |
WO2007114614A1 (en) * | 2006-03-31 | 2007-10-11 | Seoul Semiconductor Co., Ltd. | Light emitting device and lighting system having the same |
US20080035938A1 (en) * | 2003-05-05 | 2008-02-14 | Lamina Lighting, Inc. | Thermally coupled light source for an image projection system |
US20090189177A1 (en) * | 2008-01-24 | 2009-07-30 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode package and manufacturing method thereof |
DE102010027875A1 (de) * | 2010-04-16 | 2011-10-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2211083A4 (de) * | 2007-11-12 | 2014-06-25 | Mitsubishi Chem Corp | Beleuchtungssystem |
CN101968169A (zh) * | 2010-08-05 | 2011-02-09 | 深圳市众明半导体照明有限公司 | 一种高亮度高显色指数的暖白光led灯 |
-
2012
- 2012-01-03 EP EP12150037.5A patent/EP2613354B1/de active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040070333A1 (en) * | 2002-10-11 | 2004-04-15 | Highlink Technology Corporation | Full-color display divice |
US20040217364A1 (en) * | 2003-05-01 | 2004-11-04 | Cree Lighting Company, Inc. | Multiple component solid state white light |
US20080035938A1 (en) * | 2003-05-05 | 2008-02-14 | Lamina Lighting, Inc. | Thermally coupled light source for an image projection system |
US20050127816A1 (en) * | 2003-12-16 | 2005-06-16 | Naofumi Sumitani | Light emitting device and method of manufacturing the same |
WO2005091392A1 (en) * | 2004-03-18 | 2005-09-29 | Phoseon Technology, Inc. | Micro-reflectors on a substrate for high-density led array |
WO2007114614A1 (en) * | 2006-03-31 | 2007-10-11 | Seoul Semiconductor Co., Ltd. | Light emitting device and lighting system having the same |
US20090189177A1 (en) * | 2008-01-24 | 2009-07-30 | Samsung Electro-Mechanics Co., Ltd. | Light emitting diode package and manufacturing method thereof |
DE102010027875A1 (de) * | 2010-04-16 | 2011-10-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106716654A (zh) * | 2014-09-17 | 2017-05-24 | 飞利浦照明控股有限公司 | 柔性发光装置 |
CN105489738A (zh) * | 2016-02-16 | 2016-04-13 | 惠州雷曼光电科技有限公司 | 色温显指可调的白光led器件、其制备方法及调控方法 |
CN111403579A (zh) * | 2020-02-29 | 2020-07-10 | 华中科技大学 | 一种具有阵列透镜出光面的大功率白光led及制备方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2613354B1 (de) | 2020-05-06 |
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