EP2593715A1

EP2593715A1 - Heat sink for a semiconductor lamp and semiconductor lamp

Info

Publication number: EP2593715A1
Application number: EP11743461.3A
Authority: EP
Inventors: Nicole Breidenassel; Klaus Eckert; Guenter Hoetzl; Markus Hofmann; Fabian Reingruber
Original assignee: Osram GmbH
Current assignee: Osram GmbH
Priority date: 2010-07-13
Filing date: 2011-07-08
Publication date: 2013-05-22
Also published as: US20130107531A1; DE102010031293A1; WO2012007403A1; CN103003631A

Abstract

The heat sink (4) is provided in particular for a semiconductor lamp (1), wherein the heat sink is constructed from at least one sheet-metal part and has at least one flow structure (3a) wherein the flow structure is designed to guide cooling air (A) along an inner side (9b) of the heat sink (4) and wherein the flow structure is designed to direct the cooling air at the inner side of the heat sink at least partly along a longitudinal axis (L) of the heat sink. The semiconductor lamp (1), more particularly retrofit lamp, has at least one heat sink (4) of this type.

Description

description

The invention relates to a heat sink for at least one semiconductor lamp. The invention further relates to a semicon ^¬ terlampe with such a heat sink.

LED retrofit lamps require heat sinks whose typical cooling surface is over 50% of the surface of the lamp size specified by the lamp standards due to the high level of heat dissipation of the light emitting diodes (LEDs) for typical desired brightnesses and lifetimes. It is known to use aluminum die-cast heat sinks for LED retrofit lamps, which however are relatively heavy and thus significantly lead to a significantly greater weight of the LED retrofit lamps in comparison to other lamp shapes. Also known are heat sinks made of a thermally conductive plastic, which, however, at an equivalent heat dissipation ^¬ performance significantly more expensive than aluminum die-cast heat sink. Also, sheet bending heat sinks are known, which have a simple cylindrical shape to achieve low cost. Alternatively, manufacturing technology and price more expensive "stacked fin" heat sink are known.

It is the object of the present invention, at least ei ^¬ nen disadvantages of the prior art at least partially eliminate and in particular to provide a way to cool a semiconductor lamp having a smaller visible cooling surface, a lower lamp weight and / or a lamp easier to manufacture, in particular Retrofit lamp, allows. This object is achieved according to the features of the independent claims. Preferred embodiments are insbesonde ^¬ re the dependent claims. The object is achieved by a heat sink, which is constructed from at least one sheet metal part and has at least one flow structure, wherein the flow structure is adapted to conduct cooling air on an inner side of the Kühlkör ^¬ pers along and wherein the flow structure is adapted to the cooling air the inside of the Kühlkör ^¬ pers at least partially along a longitudinal axis of the cooling ^¬ body to steer.

In the case of an irregularly shaped heat sink, the axis of the greatest length extension is to be regarded as the longitudinal axis, and in the case of a symmetrically shaped heat sink, the axis of symmetry, parallel to the heat sink measured, has the greatest longitudinal extension.

The flow structure may, in particular, have at least one air ^passage opening to the inside and / or at least one air ^{guide area} arranged on the inside (eg an air guide plate). The at least one air conduction region can have, for example, an air guiding structure extending at least partially vertically, ie parallel to the longitudinal axis, eg air baffles. The air guiding structure can also enlarge a heat dissipation area that can be surrounded by the cooling air and thus improve cooling performance.

The longitudinal axis may simultaneously correspond to an axis of symmetry of the heat sink. The heat sink may in particular at one end be provided (in respect to the longitudinal axis) for connection to at least one semiconductor light source and turned ^¬ directs his and at its other end for connection to an electrical connection (such as socket) is provided and set up. A flow of cooling air may be maximum, in particular when the heat sink is oriented vertically or has a vertical position or orientation. Under a vertical Right position or orientation of the heat sink can be understood in particular a position or orientation in which a longitudinal axis of the heat sink is vertical. Alter ^¬ natively or additionally can be understood by a vertical position that the heat sink is oriented so that its position ent ^¬ speaks a built-in semiconductor light ^¬ position, wherein the at least one semiconductor light source and a base vertically or vertically angeord ^¬ are net. In particular, a position or orientation can be understood by a vertically upward position or orientation in which a bordering on the base end of the heat sink below a least a half ^¬ conductor light source adjacent end of the heat sink is located on the; analogously can be understood by a vertically downward position or orientation, the reverse position.

The less vertically or horizontally the heat sink is aligned, the lower the flow of cooling air directed or deflected along the longitudinal axis may be.

The heat sink opens up the possibility that an improved heat dissipation performance is achieved compared with heat sinks provided for a horizontal flow or with respect to heat sinks in the form of simple cylinder sheet metal sleeves, in particular with a vertical orientation. Specifically, by the flow structure, in particular by the arrangement of the at least one air passage opening and / or the at least one Luftleitbereichs, achieved ^¬ who, that the heat sink is also increasingly flowed on its inside, which increases the heat dissipation performance. In addition, can be achieved by the deflection in the longitudinal direction a longer air flow on the inside even at an obliquely (neither vertically nor horizontally) oriented heat sink, which further improves the cooling performance.

It is an embodiment that the heat sink is designed as a heat sink for a retrofit lamp. So can the associated lamp serve as a replacement for a conventional lamp. When used as a heat sink for a retro-fit lamp, the heat sink is limited in its outer contour at least approximately to the corresponding outer contour of a conventional lamp. As a result, a heat sink is required, which enables a high heat dissipation power in a small space, which provides the present invention.

In particular, the retrofit lamp may be an incandescent retrofit lamp (to replace a conventional incandescent lamp). Alternatively, the retrofit lamp may for example be a halogen lamp retrofit lamp.

It is still an embodiment that the heat sink is made of several sheet metal parts. It is preferred that the heat sink is made of not more than five sheet metal parts, in particular of not more than three sheet metal parts. This results in a weight savings compared to an aluminum ^¬ minium-cast body and a reduced manufacturing complexity compared to the thermally conductive plastic. In addition, a simple and inexpensive assembly of the heat sink is possible ^¬ .

It is a particularly advantageous for low-cost manufacture and a high durability embodiment is that the heat sink (exact) is a sheet metal part, that is in ande ^¬ ren words, is present as a one-piece sheet metal part.

The sheet may in particular be a steel, copper and / or aluminum sheet. The sheet may also consist of any other suitable thermally conductive and plastically deformable material. Such a material may particularly egg ^¬ ne thermal conductivity λ of at least 15 W / (mK), and in ^¬ particular of more than 50 W / (mK), in particular of more than 100 W / (mK) have. Accordingly, the invention can thus also be realized with a material having the properties essential for shaping a metallic Sheet, ie simple plastic deformability with corre ^¬ large amounts of expansion and high thermal conductivity on ^¬ has, without necessarily being a metallic material.

The at least one sheet metal part may in particular be designed as a bent sheet metal part whose shape has been designed in particular at least partially by a sheet metal bending process, a deep drawing process and / or a punching process. This allows a particularly simple production.

It is yet another embodiment that the heat sink or the flow structure comprises a first group of air passage openings with at least one first Luftdurchlassöff- and a second group of air passage openings with at least one second air passage opening or, wherein in a vertical position of the heat sink, the at least one air passage opening of a group acts as an air inlet opening and the at least one air passage opening of the other group acts as an air outlet opening.

In a change of the vertical orientation from a downward position to an upward position, and vice versa, at least one of the air passage openings may change from their function as an air inlet opening into an air outlet opening, and vice versa. At least one of the air passage openings may also remain an air inlet opening or an air outlet opening.

It is a further development that the heat sink or the flow structure has a first group of air passage openings and a second group of air passage openings, wherein at least one air passage opening of the first group acts as an air inlet opening in a vertical position of the heat sink and the at least one air passage - Lassöffnung the second group acts as an air outlet opening (vice versa when changing the orientation).

Advantageously, the majority of the air passage openings of a group, in particular all the air outlet openings of a group, act in the same way in a vertical position of the heat sink, ie either as air inlet openings or as air outlet openings (the function preferably changes when the orientation changes). A uniform and / or defined flow ^¬ distribution can be achieved in particular.

It is yet a further development that the first group and the second group of the air passage openings along a longitudinal axis of the heat sink are arranged separately from each other. Thus, a spatial separation of the air passage openings of the various groups is achieved, resulting in an increased vertical air flow on the inside of the Kühlkör ^¬ pers. The air passage openings along different sections of the longitudinal axis can be divided as desired between the Grup ^¬ pen. The air passage openings of a group may be disposed on a contiguous portion of the longitudinal axis or divided by air passage openings of the other group into two or more subsets (located at different portions of the longitudinal axis).

It is also an embodiment that each group has a plurality of rotationally symmetrically arranged with respect to a longitudinal axis of the heat sink air passage openings. Characterized the longitudinal axis or the light-receiving socket is achieved even air flow egg ne regardless of a rotational position of the semiconductor lamp bezüg ^¬ Lich.

It is further an embodiment that at least one air passage opening, in particular a group, is arranged in a support region for at least one semiconductor light source of the semiconductor lamp ^¬ . This gives the advantage that Air from a at least one semiconductor light source overarching light source space can flow directly to the heat sink (especially in a vertically downward position) or cooling air can flow directly into the light source space (especially in a vertically upwardly ^¬ directed position). Also, a good heat dissipation of the heated by the at least one semiconductor light source support area can be achieved on the heat sink. Consequently, the semiconductor light sources can be cooled particularly effectively. The at least one air passage opening may in particular comprise a plurality of air passage openings, in particular annularly arranged air passage openings.

It is a development that between at least one air passage opening of the first group and at least one coupled air passage opening of the second group, an at least partially vertically extending air guiding structure is present. It is yet an embodiment that the cooling body has a circumferential about the longitudinal lateral surface, into the min ^¬ a ring of air passage openings, in particular the first group and in particular in addition, is introduced least at least one ring of air passage openings of the second group, wherein the air passage apertures, Minim particular ^¬ least one of the groups at least partially associated with a respective air ^¬ baffle. By the air guide plate, an entry of air into air inlet openings and / or an outlet of air from the air outlet openings can be supported, for example by preventing counterflow of air reaches the corresponding openings, or by the fact that air is deflected into the openings.

It is also an embodiment that the cooling body has at least two on the support area for the at least one semi-conductor light source ^¬ the semiconductor lamp arranged tubular baffles, wherein the baffles concen- are arranged to a longitudinal axis and at least one of the present in the support area air passage openings are arranged on the support area between the air guide plates. This results in the advantage that a particularly large and rectilinear flow channel to or from the support surface for the at least one semiconductor light source be ^¬ reitgestellt. Also a particularly large Wärmeab ^¬ guide surface of the heat sink is achieved. This allows the Aufla ^¬ gefläche be cooled particularly effective. In particular, air can be removed or introduced particularly effectively from the air passage openings provided in the support area. Also, such a heat sink is particularly simple in construction. It is yet a further embodiment, that one of the tube-shaped air baffle plates is configured as an outer wall of a Treiberge ^¬ housing. Thus a particularly compact semiconductor lamp can be provided which also supports a ^¬ be Sonder efficient cooling of a clean- out in the driver housing driver.

It is also an embodiment that the cooling body has at least one end at least in a transverse profile (in a profile perpendicular to the longitudinal axis) curved shape. The curved shape may be in particular a umlau ^¬ fend wavy shape. This allows, among other things, performing or disposing also of a wide driver housing into the heat sink, without a vertical Luftströ ^¬ mung is blocked. Such a heat sink is also easy to manufacture, in particular in one piece.

It is a development that the heat sink (in particular its lateral surface) in a transverse profile (in a profile pa ^¬ rallel to the longitudinal axis) has a curved shape. The curved shape may be, for example, a multi-stu ^¬ fenförmige shape. In particular, a transverse region of a step (eg on an upper side) can be easily air-cooled. attach passage openings that allow for a vertical alignment a large flow area in the vertical direction. The curved shape may also be a waveform, for example. Then air passage openings may be present in particular at a region at the longitudinal ends of the heat sink, so that a particularly long vertical air flow on the inside of the Kühlkör ^¬ pers is possible, and thus a particularly effective Küh ^¬ ment. By the step shape and the waveform Any treatment can Sonder large heat radiation can be achieved in a limited space at ei ^¬ ner same small number of pieces for the production of the heat sink.

It is a further development, that the cooling body concentrically arranged more about its longitudinal axis, having vertically directed ^¬ struts. These are particularly easy to attach, for example to a base, provide good internal flow through air, even in a horizontal orientation and allow a one-piece design of the heat sink.

It is a special development that a driver housing can run at least partially in the struts. It is still a development that the heat sink and the piston are formed by the same element, the piston also serves as a heat sink, or vice versa.

The type of the air passage openings is not limited and may be e.g. Include slits, holes, free-form openings, etc.

It is still an embodiment that the cooling body forms a plurality of substantially separate, vertically aligned air channels. As a result horizonta ^¬ le flow component can be suppressed to a large extent. The object is also achieved by a semiconductor ^{lamp which has} at least one heat sink as described above. Under a semiconductor lamp, a lamp can be ver ^¬ were in particular having at least one light source in the form of a semiconductor light source. The at least one semiconductor light source preferably comprises at least one light-emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. A color can be monochrome (eg red, green, blue etc.) or multichrome (eg white). Also the of the at least one light emitting diode light emitted infraro a ^¬ tes light (IR LED) or an ultraviolet light (UV-LED) may be. Several light emitting diodes can produce a mixed light; eg a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor (conversion LED). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be at least equipped with a private and / or shared optics for beam guidance, for example, at least one Fresnel lens, collimator, and so on ^¬ min. Instead of or in addition to inorganic light-emitting diodes, for example based on InGaN or AlInGaP, it is generally also possible to use organic LEDs (OLEDs, eg polymer OLEDs). Alternatively, the at least one semiconductor light source, for example, have at least one diode laser.

The semiconductor lamp is preferably in particular a retro-fit lamp, since in retrofit lamps of the heat sink described can be used particularly advantageously, which provides even with a limited space a high heat dissipation be ^¬ . The at least one semiconductor lamp has Minim ^¬ least a semiconductor source and at least one connection (Socket) to a light. Typically, the base is associated with a (with respect to the longitudinal axis) of the rear end or end portion of the semiconductor lamp, while the Minim ^¬ a semiconductor lamp is associated with a respect to the longitudinal axis) of the front end portion of the semiconductor lamp tens and the semiconductor lamp light at least predominantly before ^¬ radiates its half-space in a.

The semiconductor lamp can in particular also a driver for driving the at least one semiconductor light source aufwei ^¬ sen, the driver may in particular be at least partially housed in a drive housing.

It is an embodiment that the heat sink together with another part of the semiconductor lamp, in particular with egg ^¬ nem driver housing and / or with an adjacent cover, at least one of the air passage openings. This at least one passage opening thus does not need to be completely formed in the heat sink, which can considerably simplify production of the heat sink. In particular, a plurality of (smaller) air passage openings can be generated from such an at least one air passage ^opening through the other part of the semiconductor lamp. It is yet an embodiment that the semiconductor lamp is a retrofit lamp extending along a longitudinal axis, in particular incandescent retrofit lamp, which has at its front end at least one semiconductor source which is arched over by an at least partially translucent cover, which at its rear end a Socket has and which has the heat sink between the cover and the base.

The semiconductor lamp can in particular have a driver housing between the base and the cover, which is surrounded by the heat sink. It is a development that the cover has at least one air passage opening. Thus, a flow of cooling air can be generated in the light source space bounded by the cover. In particular, if there is also at least one air passage opening in the support area, even a passage through the light source space can be generated, which enables a particularly good heat dissipation from the at least one semiconductor light source. The fact that the cover has at least one air passage opening may also mean that at least one air passage opening is present at an edge of the cover and, for example, can also be delimited by the heat sink.

The cover may in particular be a piston, e.g. for an incandescent retrofit lamp, or a flat cover, e.g. for a halogen lamp retrofit lamp.

The at least one semiconductor light source may be the side of a circuit board to be mounted on a pre ^¬, wherein the printed circuit board rests with its rear side on the on position portion of the cooling body, optionally a layer of a thermally highly conductive material such as a thermal interface of ^¬ lenmaterial ( conductive foil "thermal interface material"), for example, from egg ^¬ nem thermally conductive adhesive, a thermally conductive paste or heat; TIM. The circuit board may be pre ^¬ the side fitted at her with at least one electronic component in particular.

In the following figures, the invention will be described schematically with reference to exemplary embodiments. Identical or identically acting Ele ^¬ elements may be provided with the same reference numerals for clarity.

1 shows in side view a downwardly directed from ^¬ LED lamps retrofit ge ^¬ Mäss a first embodiment; 2 shows the LED light bulbs retrofit shows ge ^¬ Mäss the first embodiment as a sectional side view;

3 shows a top view of a sheet metal for producing a heat sink of the light bulbs.

Retrofit lamp according to the first embodiment ^¬ form;

4 shows an oblique view of arriving at the Kühlkör ^¬ per molded sheet of Figure 3;

5 shows an oblique view of an LED

Incandescent retrofit lamp according to a two ^¬ th embodiment;

6 shows a side view of a LED

Incandescent retrofit lamp according to a third embodiment

7 shows an oblique view of an LED

Incandescent retrofit lamp according to a four ^¬ th embodiment;

Figure 8a shows, as a sectional view in Schrägan- provides an LED light bulbs retrofit ge ^¬ Mäss a fifth embodiment;

8b shows an oblique view of the LED light bulbs

Retrofit lamp according to the fifth embodiment ^¬ approximate shape;

9a to 9c show in a view obliquely from above three different conditions in a ^¬ together menbau of the heat sink of the LED incandescent retrofit lamp according to the fifth embodiment ^¬ approximate shape;

10a shows an oblique view of an LED light bulb

Retrofit lamp according to a sixth embodiment;

10B shows as a side view in a different perspective view of the LED incandescent retrofit lamp according to the sixth exporting ^¬ approximate shape; Fig .IIa to lld show, in a view obliquely from above, four different conditions in a ^¬ together menbau of the heat sink of the LED incandescent retrofit lamp according to the sixth exporting ^¬ approximate shape;

FIG. 1 shows a variant of the heat sink of FIG

LED incandescent retrofit lamp according to the sixth embodiment with a tool still in use,

12 shows an oblique view in side view of an LED incandescent retrofit lamp ge ^¬ Mäss a seventh embodiment;

13 shows a sectional side view of an LED incandescent retrofit lamp ge ^¬ Mäss an eighth embodiment;

FIG. 14 shows a partial sectional view in FIG

Side view of an LED lamp according to a ninth embodiment;

15 shows the LED lamp according to the ninth From ^¬ guide die as a sectional view in plan view;

Fig. 16 is a side view of an LED lamp according to a tenth embodiment;

17 shows the LED lamp according to the tenth From ^¬ guide die as S chn itt is ste 1 development in plan view;

FIG. 17b shows a variant of the heat sink of FIG

LED incandescent retrofit lamp according to the tenth embodiment with a tool still in use,

18 shows a sectional side view of an LED incandescent retrofit lamp ge ^¬ Mäss an eleventh embodiment;

19 shows a side view of the LED incandescent retrofit lamp according to the eleventh execution ^¬ shape in an upwardly facing orientation; Fig. 20 shows a process for producing a

Heatsink of the LED incandescent retrofit ^¬ lamp according to the eleventh embodiment;

21a shows a side view of an LED incandescent lamp retrofit lamp according to a twelfth embodiment; and

Fig.21b shows the LED incandescent retrofit lamp ge ^¬ Mäss the twelfth Au sf Uh rungsfo rm as a sectional view in side view.

Fig.l shows a side view of a semiconductor lamp in the form ei ^¬ ner LED incandescent retrofit lamp 1 according to a first Ausfüh ^¬ tion form, which is shown in a vertical, downward orientation or position. The vertical orientation or position here means that a longitudinal axis L of the lamp 1 is vertical. Such alignment can be taken, for example, when the lamp 1 is screwed into a downwardly directed socket of a lamp. 2 shows the lamp 1 as a sectional view in side view.

The lamp 1 has at its lower end (which in the dar ^¬ Asked downwardly facing upward pointing) on a base 2, which is exemplified as a screw-cap, eg Edison base executed. The upper end of the lamp 1, which points down here, has a cover in the form of a translucent piston 3, which may consist of a transparent or opaque (milky) material. Between the base 2 and the piston 3 is a heat sink 4th

The heat sink 4 encloses a driver housing 5 in which a driver (not shown) is located. The driver is driven elekt ^¬ input side connected to the socket 2 and on the output side with at least one semiconductor light source. 6 The min ^¬ least one semiconductor light source 6, which comprises at least one light emitting diode herein may, for example, on an as Substrate serve PCB 7 to be mounted. More specifically, one (in this view downward) front side For ^¬ te of the circuit board 7 with the at least one semiconductor ^¬ light source 6 is fitted, whereas the circuit board 7 rests with its (in this case upwardly) back on a supporting portion 8 of the cooling element 4, optionally via a Wärmeleit ^¬ position (o.Fig.). The support area 8 of the heat sink 4 is formed as a plane perpendicular to the longitudinal axis L circular disk ^¬ forms.

In its extending from the piston 3 to the base 2 area ("shell area") 9, the outer surface or outer side 9a simultaneously forms part of the outer contour of the lamp 1, a plurality of air passage openings 10, 11 are introduced. The air passage openings 10, 11 are distributed along the longitudinal axis L on different sections or floors, namely annular or rotationally symmetrical to the longitudinal axis L in the lateral surface 9 of the cooling ^¬ body 4. The air passage openings 10 are directly at or in the vicinity of the support area. 8 positioned and bil ^¬ a ring Rl of air passage openings 10. The air passage openings 11 are further positioned in the direction of the base 2 and thereby form four floors or rings R2 to R5, which are assigned to a respective different portion of the longitudinal axis L, in about equidistant with respect to the longitudinal axis L.

While the air passage openings 10 are formed as simple openings, each of the air passage openings 11 on the outside 9a a lamellar air guide ^plate 12 is assigned ^¬ assigns. The air guide plate 12 engages directly on a piston 3 facing edge of the associated air passage opening 11 and extends obliquely outwardly outgoing in the direction of the base second

In the downwardly oriented position shown, in particular cooling air A can enter into the air passage openings 10. th, which thus serve as air inlet openings. The entered air passes over an inner side 9b of the heat sink 4, flows through an inner space 13 and can then exit from the air passage openings 11 as exhaust air B. The air passage openings 11 thus serve as air outlet openings. Consequently, the air passage openings 10 are grouped in a first group of air passage openings 10, which act as air inlet openings, and in a second group of air passage openings 11, which act as air outlet openings.

By means of the air baffles 12 it is achieved that no high-flow of air at the lamp 1 enters the air passage openings 11 and thus obstructs the escape of the air warmed up in the interior of the heat sink 4. The lamp 1 thus enables a particularly effective air flow in the interior of the heat sink 4, in particular in the vertical direction. By so improved cooling of the heat sink 4 may be 6 verbes ^¬ sert of the at least one semiconductor light source is a Wärmeab ^¬ driving. Also, the increased internal vertical airflow causes the driver housing 5 to be effectively cooled over at least a majority of its length, greatly increasing a lifetime of the driver housed therein.

In the opposite case, with the lamp 1 facing upwards (and thus the base 2 downwards and the piston

3 upward), cooling air can enter through the air passage ^¬ openings 11 in the interior of the heat sink 4, which thus serve as air inlet openings, and exit through the air passage openings 10, which consequently serve as air outlet openings. The baffles 12 cause in this orientation a capture of cooling air and amplify an air flow through the interior 13 of the heat sink

4. Even in the case of a horizontal or horizontal alignment, a cooling air flow still results through the heat sink 4, for example through the air passage openings 10, which serve partially depending on the rotational position of the lamp 1 as the air inlet openings ^¬ (if they are directed downward) or air outlet openings are (if they are oriented upwards).

FIG. 3 shows, with the aid of a flat metal sheet 15, a possibility of producing the heat sink 4 in one piece. The sheet metal 15 is a metal sheet, which is initially in its planar form and punched out on its outer contour. For this purpose, the sheet 15 has angular sector-shaped (cake-like) regions 16, which together will form the circular bearing surface 8. In the subsequent below the areas 16 of the plate 15 each area 16 are each assigned four in a column Sl to S6 stacked punched La see. The tabs correspond to the baffles 12. The baffles 12 simultaneously form four rows, which correspond to the rows R2 to R5 of the baffles 12 of the cooling ^¬ body 4. Between the tabs or air guide plates 12 and the areas 16 each have a Luftdurchlass- opening 10 has been punched out. The air passage openings 10 correspond to the row Rl of the heat sink 4

The plate 15 can be prepared in a simple manner from a flat starting sheet by simple punching operations. However, except for a punching, any suitable material ^¬ abrading method is suitable, for example a cutting or EDM.

To assemble the heat sink, the sheet 15 is rolled as shown by the bent arrow PI until the side edges meet. The plate 15 can be firmly connected to this contact area, for example by welding. In the following, the regions 16 can be folded inwards, and the air baffles can be turned inwards (in the resulting interior of the heat sink 4) and / or outwards be bent or bent. Thus, the finished heat sink 4 shown in oblique view in Figure 4 is formed. The heat sink 4 shown in Figure 4 is shown only for ease of illustration as a body having a cylindrical basic shape and can in principle also have all other rollable forms, in particular rotationally symmetrical shapes. The rolling can be carried out with or without the introduction of bending edges. By way of example, curling may also be understood as bending along one or more bending edges, for example for producing a not only circular-cylindrical heat sink but also, for example, for producing a heat sink having a cylindrical basic shape which has a polygonal, for example square or hexagonal, cross-sectional profile. Also, the heat sink 4 is not limited to a cylinder-like basic shape, but may, for example, as shown in Fig.l and Fig.2 further and narrower sections along its longitudinal axis L and may for example also be conical, conical or pyramid-shaped. It is advantageous that the basic shape of the heat sink 4 at least approximately approaches a corresponding outer contour of ^¬ a conventional, to be replaced lamp and in particular does not exceed its outer contour. 5 shows an oblique view of an LED incandescent light retrofit lamp 20 according to a second embodiment. The lamp 20 is constructed similarly to the lamp 1, wherein the heat sink 21 has a basic shape similar to the heat sink 4. Nevertheless, the position of the lamp 20, which is oriented obliquely downwards, in the illustrated position as air outlets ^¬ the air passage openings 11 are designed differently. Thus, two rows or rings R2, R3 of Luftdurchlassöff ^¬ openings IIa are present, which are covered analogous to the heat sink 4 each of an air guide plate 12. However, a row R4, arranged nearer to the base 2, of the air passage openings IIb arranged in a ring around the longitudinal axis L is designed such that (similar to the air passageway) Laßöffnungen 10) are formed comparatively narrow and also have no air baffle.

It is thus generally possible for the air passage openings IIa, IIb of a group of air passage openings 11 to be designed differently, preferably in such a way that air passage openings IIa, IIb are at the same height or in the region of an equal section of the longitudinal axis L (corresponding to ^FIG The rings R2 to R4) are designed the same, but are designed differently between different sections of the longitudinal axis L. Cooling air A thus penetrates through the first group of air passage openings 10 into the cooling body 21 and through the second group of the air passage openings IIa and IIb as warmed exhaust air B again. The air passage openings IIa and IIb form corresponding subgroups of the second group.

Again, a function of the air passage openings can be changed when changing the vertical orientation, for example, a function of an air inlet opening to an air outlet opening, or vice versa.

6 shows a side view of an LED incandescent lamp retrofit lamp 22 according to a third embodiment similar to the lamp 20, wherein the heat sink 23 is now configured so that the baffles 12 of the ring R2 of the air through ^¬ lassöffnungen IIa inward in the direction of Interior of the heat sink 23 are bent. As a result, in the downwardly oriented position shown, the cooling air A can penetrate from the outside into the air passage openings IIa of the ring R2, which thus serve as air inlet openings. The air passage ^¬ openings 11 and IIa and IIb of the rows R3 and R4 are identical to the lamp 20 and serve as Luftauslass ^¬ openings for the exhaust air B. The lamp 22 thus allows in the position shown a greater inflow of the cooling air A in the In addition, in the reverse vertical position, an outflow in the interior of the heat sink 23 located exhaust air B facilitates so that overall results in an increased air flow.

The heat sink 23 can be made of the same metal sheet 15 as the heat sink 21. It is thus mög ^¬ lich by a simple direction to be converted to the deflection of the baffles 12 to vary the air flow on the inside of the associated heat sink 4, 21 or 23 targeted. 7 shows an oblique view of an LED incandescent light retrofit lamp 25 according to a fourth embodiment, which is constructed similarly to the lamp 20. Again, the piston 3 and the support surface 8 next floor, row or ring Rl of air passage openings 10 of the heat sink 26 in the orientation shown down a number of air inlet openings, while the closer to the base 2 three rings R2, R3 of R4 than Air passage openings IIa, IIb, more specifically as air outlet openings serve. Whereas in the case of the heat sink 21 of the lamp 20 the air guide plates 12 attach to the air passage openings IIa at an edge which points in the direction of the piston 3 or the air passage openings 10 and the air guide plates 12 are bent outwards, the air guide plates 12 of the heat sink 26 are the Lamp 25 bent inwards and put it on the pointing in the direction of the base 2 edge to the air passage openings IIa.

Figure 8a shows, as a sectional view in an oblique seitli ^¬ chen view of an LED incandescent retrofit lamp 27 according to a fifth embodiment. Fig. 8b shows the lamp 27 in an oblique view from the side. The heat sink 28 of the lamp 27 now has a circular disk-shaped support area 29, on the front side, which is directed in the longitudinal direction L, the circuit board 7 is mounted centrally with three light-emitting diodes 6 here. The front side of the support 29 is arched over by the translucent piston 3. In the support area 29 are the side of the circuit board 12 two concentric to Arranged longitudinal axis L arranged rings, each with a plurality of ring-sector-shaped recesses 30 The recesses 30 are directly adjacent to the light source space 32 vaulted by the piston 3.

In the foremost region of the piston 3, i. At the apex, there is also a central air passage opening 3a.

At the rear of the support region 29, which points in the direction of the base 2, three tubular air guide elements are arranged concentrically to the longitudinal axis L.

An outer air guiding element 31a engages an outer edge of the support region 29 and has the largest diameter of the three air guiding elements 31, as well as their shortest length (along the longitudinal axis L).

An inner tubular air guide element 31c has the smallest diameter of the three tubular air guide elements 31, but the largest length. In particular, his is through ^¬ diameter so small that it is smaller than the smallest ring of the recesses 30. The inner air guiding element 31c is thus covered at its front end by the support portion 8 substantially. The inner air guide 31c also serves as a driver housing 5, in the interior of which a driver is accommodated. The lower end of the inner spoiler 31 c is closed by the base 2.

Between the air guiding elements 31a and 31c, there is a central tubular air guiding element 31b which has a diameter lying between a diameter of the larger ring of the recesses 30 and the smaller ring of the recesses 30. The length of the air guiding element 31b is between the length of the inner air guiding element 31c and the length of the outer air guiding element 31a. When operating in the downward vertical orientation or, as shown, in a substantially downward orientation of the lamp 27, cooling air may enter the light source space 32 through the central air passage opening 3a and exit through the recesses 30 again. Thus, a breeze is generated by the light source space 32, which can effectively cool the LEDs 6.

Since the air guide elements 31a to 31b are open both at its outer side, te (the side facing away from the longitudinal axis L side) and with its inner side (which is the longitudinal axis L-facing side) for cooling air, they allow, due to their large ^¬ SEN cooling surface effective cooling In addition, the drivers located in the inner air guiding element 31c serving as the driver housing can be cooled particularly effectively by the air flow directed in the longitudinal direction L.

The stepped length of the air guiding elements 31a to 31c is used, use as incandescent retrofit lamp for enabling ^¬ handy, since an outer contour of a conventional light bulb can be at least approximately maintained.

When the orientation is reversed, cooling air can be transported selectively vertically to the recesses 30 and reach the light source space 32, which likewise causes cooling of the semiconductor light source or LEDs 6. Also here ermögli ^¬ chen the tubular air guide elements 31 also a effekti ^¬ ve cooling of the support area 29th

The 9a to Fig.9c show, in a view obliquely from above three different states in an assembling of the Kühlkör ^¬ pers 28 9a shows the already provided with the two concentric rings of recesses 30 supporting region 29, at a lateral edge outer, shortest tubular air guide ment 31a has been attached. Alternatively, the body 29, 31a shown may also be made in one piece, for example by deep drawing. Is in the next steps the average, medium length tubular air-guiding element 31b (9b) fixed to the support surface 29 between the two rings of recesses 30, for example by laser welding, and also the inherent ^¬ re, longest tubular air directing member 31c so on Aufla - Set area 29 that it is laterally surrounded by the recesses 30. Alternatively, the air guide element 31b and / or the air guide element 31c can also be part of a can-shaped body analogous to, for example, the can-shaped body 29, 31a, the three can-shaped bodies or air guide elements 31a, 31b and 31c being connected to one another in the support area. The air guide elements 31 and the Aussparun ^¬ gene are 30 to one another and arranged concentrically to the longitudinal axis L of the heat sink 28th Fig.9c shows the completed sammengesetzten to ^¬ heat sink 28. The heat sink 28 is therefore composed here of only three or four sheet metal parts.

Figure 10a shows an LED bulb 33 according to retrofit ei ^¬ ner sixth embodiment in a view obliquely from the side. Fig. 10b shows the lamp 33 in an oblique view at a different angle.

The associated heat sink 34 is now designed so that its lateral surface 35 is completely closed. Furthermore, the jacket 35 runs from the piston 3 in the direction of the base 2 with decreasing diameter. At the same time, the cross-sectional profile of the jacket 35 (in a plane perpendicular to the longitudinal axis L) has a circumferential or closed waviness increasing with approach to the base 2. At its adjoining the piston 3 or adjacent edge 36, the jacket 35 of the heat sink 34 still has a circular shape in the cross-sectional profile, which in Diameter corresponds at least approximately to the diameter of the edge of the piston 3. 35 at its bottom, to the base 2 at ^¬ adjacent edge 37, the lateral surface to a high Wel ^¬ ligkeit, wherein a diameter of an inner contour of the cross-sectional profile is preferably somewhat larger than a cross-sectional dimension of a (within the cooling body 34 anzuord ^¬ nenden driver housing o. Fig.). A diameter of the outer contour of the cross-sectional profile at the lower edge 37 is greater than a diameter of the base 2, so that rotationally symmetrical about the longitudinal axis L distributed rear Luftdurchlassöff ^¬ openings 38 result, which correspond to one outwardly directed wave crest of the shell 35. It need at the lower edge 37 so no air passage openings specially introduced, for example, punched to be.

If at the same time 34 min ^¬ least comprises the contact area of the heat sink, a recess may be (slightly oblique) according to aligned the bottom position of the lamp 33 cooling air through the Luftdurchlassöff- voltage 3a of the piston 3 occur in the light source chamber in the embodiment shown, at least substantially, then through the Flow light source space and then escape through the recesses of the support area again from the light source space. The air continues to flow along the inside of the heat sink 34 to the air passage openings 38, which point in the direction of the base 2. The heat sink 34 further enables effective cooling of the support region, wherein the cooling capability is increased by the waviness or Wellenför ^¬ migkeit the lateral surface 35 in comparison to a monotonously ge ^¬ curved surface.

In an alternative embodiment, air passage openings may also be provided in the lateral surface 35, for example similar to the air passage openings 10, 11 shown for the lamps 1 and 20. Figs. IIa to Fig.lld show various stages of a ^¬ sammenbaus to the heat sink 34, wherein Fig.lld finished shows the heatsink 34 to ^¬ sammengebauten. Fig. IIa shows a circular disc-shaped support or such a support area 39, on whose outer edge, as shown in Fig. IIb, a tubular attachment is attached, which corresponds to the lateral surface 35. In a further step (or alternatively already before the application of the shell 35 forming the top) 39 annular recesses 40 are introduced into the Auflagebe ^¬ rich, here in the vicinity of the outer edge, as shown in Fig.lle. In the following, the outer surface 35 is forming attachment ^¬ plastically formed ver, as shown in Fig.lld. A driver housing can be inserted into the heat sink 34 through a resulting rear opening 41 of the lateral surface 35 or of the heat sink 34, for example, inserted. The driver housing may for example have a cylindrical basic shape. The heat sink 34 may also be referred to as a hollow body with a truncated cone-shaped basic shape and open at its narrower end cover surface, wherein the sheath ^¬ surface 35 in the ripple of the upper top surface (which is formed by the support area 39) to the open upper surface toward increases.

The heat sink 34 may also be made in one piece, as will now be described in greater detail with reference to FIG. Fig.lle shows in a view obliquely from below a cooling ^¬ body 34a in yet a variant. The heat sink 34a is formed similarly to the heat sink 34 and runs towards a socket near end and is increasingly wavy in cross-sectional profile. In contrast to the heat sink 34, the heat sink 34a now has in its lateral surface 35a large air passage openings 72, which in particular over more than half the length or height of the heat sink 34a extend. This heat sink 34a allows a greater flow on its inner side 35c in a horizontal or horizontal orientation. The ripple of the heat sink 34a can be achieved, which a tool 74, for example a punch, is introduced into the analog to 11C configured in cup ^¬. The tool has the desired waveform on its shell-side outer surface. The tool 74 need not complete or introduced plant with the support area 29 to the ^¬, but it can. Subsequently, by lateral pressure on the lateral surface 35a of the heat sink 34a, the lateral surface can be suitably plastically deformed onto the waveform. This solves the problem that otherwise a tool, which is introduced into the cup shown in Fig. IIb, after a bending operation can not be removed. Due to the wave-shaped deformation, the material is also exposed during this bending a low voltage. However, other shapes and also a bend to a round stamp are conceivable.

The large air passage openings 72 can be created by a punching process. In a variant thereof, a part of the material may in this case circumferentially are bent inwardly so that small Luftleitfinnen or air deflecting walls are ent ^¬ that extend the cooling surface in addition (not ge ^¬ shows).

The large air passage openings 72 also influence the deformation behavior of the lateral surface 35a, e.g. with respect to a curvature in the longitudinal direction. By a corresponding variation of the shape and / or size of the air passage openings 72, the basic shape of the longitudinal profile can thus also be influenced in a targeted manner.

Small recesses 73 at the rear end of the heat sink 34a serve for snapping with a housing, eg plastic housing. housing, which can be used as a driver housing, for example. In addition, recesses may be introduced at the front end of the heat sink 34 a (o.Fig.), To eg a locking of a piston, in particular plastic piston, or similar. to enable.

12 shows in a view obliquely from the side of a LED incandescent retrofit lamp 42 according to a seventh embodiment ^¬ form, which is constructed similar to the lamp 33, but now in addition or alternatively to the recesses 40 in the vicinity of the piston 3 annular having circumferential recesses 43 in the heat sink 44. As a result, in particular, an inflow of cooling air into the interior of the heat sink 44 (or its exhaust air, in particular in the opposite position) can be enhanced, which causes even more effective cooling. Alternatively, the recesses 43 may serve for fastening the piston 3, for example as latching recesses.

13 shows a sectional side view of an LED incandescent retrofit lamp 45 according to an eighth exporting ^¬ approximate shape, wherein the cooling body 46 now has a stepped shape in longitudinal profile, with cross-sections or Obersei ^¬ th 47 of the respective stages with a ring around the longitudinal axis L arranged recesses 48 are provided. At the same time, a plurality of recesses 49a are located in the support region 49 of the heat sink 46, so that air passes through a central air passage opening 3a, through the light source space 32 and further through the recesses 49a from the light source space 32 into the interior of the heat sink 46 and from there to the air space. passage openings 48 can flow. Be characterized similar advantages are achieved as in the lamp 33. Here, too, can ^¬ additionally or alternatively to the recesses 49 openings in the side surfaces 50 of the heat sink 46 is introduced. The heat sink 46 may also be formed as a one-piece sheet ^¬ part, for example by punching, possibly bending and / or deep drawing. Figure 14 outlines an LED lamp 51 according to a ninth From ^¬ guide die in a side view in partial section. The cooling body 52 surrounding a driver housing 53 so that the heat sink 52 a plurality of symmetrically about the longitudinal axis L arranged together with the driver housing 53, having vertically oriented air channels ^¬ 54th The air ducts 54 are configured and arranged such that they are arranged laterally next to or outside the support area and the piston 3, so that they have free openings and air ducts 54 when viewed from above the bulb 51, as also shown in FIG 15 shown. The air ducts 54 thus do not open into the light source space 32. In the downward pointing position of the lamp 51, cooling air A can thus flow into an open end 55 of the air ducts 54, flow through the air ducts 54 and flow out again at an opposite end 56. As a result, a very strong air volume flow of cooling air A is achieved in the case of a heat transfer surface of the heat sink 52 that is at the same time particularly large.

Alternatively, the heat sink 52 may rest or rest on the support surface, with recesses (eg, cutouts) being present in the support surface which open into the adjacent openings of the air ducts 54. The recesses are preferably adapted to the wavy cross-sectional profile of the air channels 54 for a strong air flow. FIG. 15 shows a cross section perpendicular to the longitudinal axis L through the lamp 51 according to FIG. 14 at the level of the heat sink 52. The round driver housing 53 is surrounded symmetrically by a plurality of cooling passages 54. This allows a particularly effective cooling of the driver housing 53. The driver housing 53 forms an inner edge of the cooling channels 54, wherein the cooling channels 54 are designed and arranged like a flower. The heat sink 52 may be provided as a one-piece sheet metal part being formed ^¬, for example by a sheet metal strip is formed so that it has a wavy, sinusoidal, for example, tooth-shaped along its longitudinal axis in the longitudinal profile, theta-shaped or otherwise suitable periodic, having shape. The sheet metal strip thus formed can then be placed, for example, in the form of a sleeve around the driver housing 53 (or another object) and then fastened. The heat sink 52 may generally be a bellows-shaped body.

16 shows an LED lamp 57 according to a tenth exporting ^¬ approximate shape, in which the air passage openings are now 58 incorporated as a lateral, vertically extending slots in the associated cooling body 59 and running up to the rear end of the heat sink 59th That for the air vents

Material stamped in is used as an inwardly bent air guide plate 60, in particular as an air guide plate 60 which points radially inwardly through the bend, as shown in FIG. 17 also in cross section perpendicular to the longitudinal axis. Characterized vertically-oriented air ducts 61 ge ^¬ provide in the heat sink 59 together with the driver housing 53, which enable a particularly effective cooling of lamp 57 especially in a vertical orientation. The heat sink 59 can be constructed, for example, from only one sheet metal part, as will now be explained analogously with reference to Fig.17b. 17b shows, in a view obliquely from below, a heat sink 59a in accordance with a with respect to the heat sink

59 modified variant. The cooling body 59a now has a lateral surface 59b into which slot-like air passage openings 58a oriented rotationally symmetrically in the longitudinal direction are introduced and thus form hollow struts 77. The Hohlstre ^¬ ben 77 are arranged symmetrically on an outer edge of the support area 8 about the longitudinal axis L and open to the inside. The hollow struts 77 now each have on their two longitudinal sides an inwardly bent air guide plate 60a, which points essentially radially inwards. The air guide plates 60a can be ge ^¬ formed by means of a tool 79, which is adapted in cross-section now that it has lateral or lateral, vertically extending forward cracks 80 which with respect to the longitudinal axis L of rotation ^¬ symmetrically in a (to be generating) hollow struts 77 conforming patterns are arranged. Thus, after a preliminary punching or cutting operation, the air baffles 60a may be bent to abutment with a respective projection 80. The tool 79 can be easily pulled out again after the bending process.

At its lower end, the struts 77 each latch hooks or detents 78 for attachment to the base. To fasten the hollow struts 77 can be pressed slightly inward and relaxed to engage in a corresponding Rastge ^¬ genelement, eg the base again. The heat sink 76 is thus particularly easy to assemble. Allow the air deflectors 60a and the hollow struts 77, in particular with a similar as shown in Figure 17 inserted ^¬ translated housing, a vertical air pipe already at a slightly inclined vertical orientation while gleichzei ^¬ tig also by means of lateral recesses 81 on the inner edges the air baffles 60a an air flow is made possible transversely to the heat sink 59a, in particular in a horizontal direction out ^¬ direction. Again, a driver housing can be inserted from behind between the struts, for example, a cylindrical driver housing 53rd

Also in the support area 29 recesses may be provided.

The heat sink 59a may be configured, for example, as a one-piece bent sheet metal part. The heat sink 59 can be made in an analogous manner.

18 shows a sectional side view of an LED incandescent retrofit lamp 62 according to an eleventh exporting ^¬ approximate shape whose cooling body 63 now has a bellows-like lateral surface 64 and side wall in a longitudinal section (in a plane parallel to the longitudinal axis L) wavelike is ^¬ forms. As a result, an enlarged cooling surface and / or a particularly compact design in the direction of the longitudinal axis L is made possible. 19 shows the lamp 62 in side ^¬ view in an upward orientation. In the heat sink 63 recesses 65 are each introduced in the region of its longitudinal ends, while an intermediate long region of the lateral surface 64 is closed completely Umlau ^¬ fend. As a result, cooling air A can only enter the heat sink 63 at one of the end regions of the lateral surface 64 and only leave it again as exhaust air B in the vicinity of the other end after passing through a large length of the heat sink 63. Also, an inner air flow is achieved by the heat sink 63 over a long length, where ^¬ can be cooled by the heat sink 63 and a present in the heat sink 63 driver housing 5 particularly effective in vertical alignment of the lamp 62.

20 shows a sequence for producing the heat sink 63, wherein in the left part of the drawing an open-ended hollow cylinder with a circular cross-sectional profile (alternatively, other profile shapes are possible) is shown, in whose lateral surface 64 the recesses 65 acting as air passage openings have already been introduced , By acting in the direction of the longitudinal axis L compressive force F on the Deckflä ^¬ chen or open ends of the still unfinished heat sink 63, which is shown in a left partial image, the cooling body 63 is compressed and thus takes its waveform. This embodiment has the advantage that the heat sink 63 is produced in one piece and in a particularly simple manner. bar is. Also, the heat sink may additionally have in the cross-sectional profile, for example, a waveform, rib shape or other suitable shape. 21 shows a side view of an LED incandescent lamp retrofit lamp 66 according to a twelfth embodiment, in which a translucent piston 67, which can be made of plastic, for example, in particular in several pieces, now di ^¬ rectly seated on the base 2. For this purpose, piston openings 68 are annularly and rotationally symmetrical about the longitudinal axis L introduced in a lower end region and an upper end portion of the piston 67, while the piston 67 is otherwise circumferentially closed between its end regions. As a result, similar to the principle shown in Fig. 18, air may enter the piston ports 68 at one of the end portions and exit the piston 67 through the piston ports 68 at the other end portion. The embodiment shown has the advantage that here not only the driver is cooled directly by the air flowing into the heat sink or the piston 67, but also the circuit board and the Leuchtdi ^¬ oden can be exposed directly to an air flow, which is a particularly effective Can cause cooling.

Fig.21b shows the LED incandescent retrofit lamp 66 as a sectional side view in a possible training.

In their surrounded by the translucent piston 67 lamp inside the LED incandescent retrofit lamp 66 is equipped with a heat sink 69, which is analogous to two by 180 ° staggered and connected to its support surface 29 heat sinks 28, see, for example, Fig.9c constructed. Thereby, two sets of tubular air guiding elements 31a to 31c are collinear with each other and opening in opposite directions. They form a coherent pipe system, in which the spaces between the jewei ^¬ ligen tubular air guide elements 31 a and 31 b and 31 b and 31 c are interconnected by the recesses 30 in the support surface 29. Due to the lower plunger apertures 68 entering the cooling air A thus first flows through the be ^¬ nachbart arranged set of the air guiding elements 31a to 31c high and further through the recesses 30 in the support surface 29 and by the other set of air-directing elements 31a to 31c to the upper piston ports 68 From the upper piston openings 68, the air exits as exhaust air B again. The heat sink 69 can be manufactured by mounting two heat sinks 28 to one another or by manufacturing a heat sink 69 and the following mounting of separate tubular air guide elements 31a to 31c 29 on the far not so treated side of the support surface In particular, the the base 2 facing tubular air ^¬ vane 31c can in turn serve as a housing for a Trei ^¬ over 71st

Since the printed circuit board 7 and the light-emitting diodes 6 can no longer be accommodated on the support region 29, a flexible, ribbon-shaped printed circuit board 70 (alternatively several individual, also inflexible or rigid, LED / on an outer side of the (combined) tubular outer air guide 31a Light source modules) with its rear side fixed, while the light-emitting diodes 6 are arranged on their outwardly directed front side. The LEDs 6 thus form ei ^¬ nen outer ring which is perpendicular to the longitudinal axis L.

This refinement has the advantage that the cooling body 69 has a very large cooling surface that is easily accessible through the piston openings 68 for the cooling air A.

By the piston 67, the inner structure of the lamp 66 is shielded opaque, for example by means of a diffusely scattering, in particular milky white, piston 67th Of course, the present invention is not limited to the embodiments shown.

Thus features of the individual embodiments can also be mixed, e.g. in terms of a number, shape and arrangement of the air vents.

In addition, the semiconductor light sources may be located elsewhere than on the support area and may be e.g. be annular or strip-shaped attached to the piston.

In general, at least one sealing element can be provided for fastening the piston or another cover. The sealing element can in particular be arranged on a front side of the location on, in particular pressed, his.

Reference sign list

1 LED incandescent retrofit lamp

2 sockets

3 pistons

3a central air passage opening

4 heatsinks

5 driver housing

6 semiconductor light source

7 circuit board

8 circulation area

9 jacket area

9a outside of the heat sink

9b inside of the heat sink

10 air passage opening

11 air passage opening

IIa air passage opening

IIb air passage opening

12 air baffle

13 interior

15 sheet metal

16 angular sector-shaped area

20 LED incandescent retrofit lamp

21 heat sink

22 LED incandescent retrofit lamp 23 heat sink

25 LED incandescent retrofit lamp

26 heat sink

27 LED incandescent retrofit lamp

28 heat sink

29 circulation area

30 recess

31 air guide

31a tubular air guide element

31b tubular air guide 31c tubular air guide

32 light source room

33 LED incandescent retrofit lamp 34 heat sink

34a heat sink

35 coat

35a coat

35c inside of the heat sink

36 edge

37 edge

38 air passage opening

39 circulation area

40 recess

41 opening

42 LED incandescent retrofit lamp

43 recess

44 heat sink

45 LED incandescent retrofit lamp

46 heat sink

47 top of the step

48 air passage opening

49 recess

49a recess

50 side surfaces

51 LED lamp

52 heat sink

53 driver housing

54 cooling channel

55 open end

56 opposite end

57 LED lamp

58 air passage opening

58a air passage opening

59 heat sink

59a heat sink

59b coat

60 air baffle

60a air baffle

62 LED incandescent retrofit lamp

63 heat sink 64 lateral surface

65 recess

66 LED incandescent retrofit lamp

67 pistons

68 piston opening

69 heat sink

70 circuit board

71 drivers

72 air passage opening

73 recess

74 tool

76 heat sink

77 Hollow strut

78 latch

79 tool

80 lead

81 return

Rl ring

R2 ring

R3 ring

R4 ring

R5 ring

L longitudinal axis

Sl column

S2 column

S3 column

S4 column

S5 column

S6 column

PI arrow

A cooling air

B exhaust air

F compressive force

Claims

claims

1. heat sink (4; 21; 23; 26; 28; 34; 34a; 44; 46; 52; 59;

59a; 63; 69; 76), in particular for a semiconductor lamp (1; 20; 22; 25; 27; 33; 42; 45; 51; 57; 62; 66), wherein

- The heat sink from at least one sheet metal part is built up ^¬ and

- At least one flow structure (3a, 10, 11, IIa, IIb, 12, 30, 31, 31a, 31b, 31c, 38, 40, 43, 48, 49a, 54, 55, 56, 58, 58a, 60, 60a , 61; 65; 68; 72) has ^¬,

- wherein the flow structure is adapted to conduct cooling air (A) on an inner side (9b, 35c) of the cooling ^¬ body along and

- wherein said flow structure is configured to direct the cooling air to the inside of the cooling body at ^¬ least partially along a longitudinal axis (L) of the cooling ^¬ body.

2. The heat sink according to claim 1, wherein the heat sink is designed as a heat sink for a retrofit lamp, in particular a light bulb retrofit lamp (1; 20; 22; 25; 27; 33; 42; 45; 51; 57; 62; 66) is.

3. Heatsink according to one of the preceding claims, wherein the heat sink consists of exactly one sheet metal part.

4. heat sink (4; 21) according to one of the preceding claims,

- wherein the flow structure (3a, 10, 11, IIa, IIb;

30; 38; 40; 43; 48; 55, 56; 65; Comprising 68); 68) a first group of air passage openings (3a; 10; 30; 40; 43; 55; 65; 68) and a second group of Luftdurchlassöff ^¬ voltages (11; IIa, IIb; 38; 48; 56; 65 in the case of a vertical position of the cooling body, the at least one air passage opening (3a; 10; 30; 40; 43; 55; 65; 68) of the first group is used as an air intake. outlet opening acts and the at least one ^air-¬ outlet opening (11; IIa, IIb; 38; 48; 56; 65; 68) of the second group acts as an air outlet opening, and - wherein the air passage openings (the first group and the second group along a longitudinal axis ( L) of the heat sink (4; 21) are separated from one another angeord ^¬ net.

A heat sink according to claim 4, wherein each group comprises a plurality of air passage openings (3a; 10,11; IIa, IIb; 30; 38; 40; 43; 48; 55,56; 65; 68) arranged rotationally symmetrically with respect to a longitudinal axis (L) of the heat sink ,

Heatsink according to one of the preceding claims, wherein at least one air passage opening (30; 40; 49a) in a support region (8; 29; 39) for at least one semiconductor light source (6) of the semiconductor lamp is arranged.

7. Heatsink according to one of the preceding claims, wherein the cooling body has a peripheral to the longitudinal axis (L) circumferential surface (9) into which at least one ring (Rl; R2; R3; R4; R5) is introduced from air passage openings, wherein the air passage openings at least partially in each case an air guide plate (12) is assigned.

8. The heat sink according to claim 6, wherein the heat sink has at least two tubular air guide plates (31a, 31b, 31c) arranged on the support region for the at least one semiconductor light source (6) of the semiconductor lamp, wherein the air guide plates (31a, 31b, 31c) are concentric to a longitudinal axis (L) are arranged and wherein at least one of the existing in the support area air passage openings (30) is arranged on the support area (29; 39) between the air guide plates.

9. The heat sink according to claim 8, wherein one of the tubular air baffles (31c) is designed as an outer wall of a driver housing ^¬ (5).

10. Heatsink according to one of the preceding claims, wherein the cooling body has at least one end curved at least in a cross-sectional profile, insbeson ^¬ dere wave-shaped.

11. Heatsink according to one of the preceding claims, wherein the cooling body forms a plurality of substantially separate, vertically aligned air channels (54; 61).

12. Semiconductor lamp, in particular retrofit lamp (1; 20; 22;

25; 27; 33; 42; 45; 51; 57; 62; 66) comprising Minim ^¬ least one cooling body (4; 21; 23; 26; 28; 34; 34a; 44; 46; 52; 59; 59a; 63; 69; 76) according to any one of the preceding claims.

13. semiconductor lamp according to claim 12, wherein the heat sink together with another part of the semiconductor lamp, in particular with a driver housing; forms, Minim ^¬ least one of the air passage openings (38) (5 53).

14. A semiconductor lamp according to any one of claims 12 or 13, where ^¬ in the semiconductor lamp is a along a longitudinal axis ^¬ (L) extending retrofit lamp, in particular incandescent lamp retrofit lamp, which is

- At its front end, at least one semiconductor source (6) which is overarched by an at least teilwei ^¬ se translucent cover (3; 67), which

- Has at its rear end a base (2), and which

- Between the cover (3; 67) and the base (2) has the heat sink. A semiconductor lamp according to claim 14, wherein the cover has at least one air passage opening (3a).