EP2562470A3 - Verfahren zur Herstellung einer Beleuchtungsvorrichtung und entsprechende Beleuchtungsvorrichtung - Google Patents

Verfahren zur Herstellung einer Beleuchtungsvorrichtung und entsprechende Beleuchtungsvorrichtung Download PDF

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Publication number
EP2562470A3
EP2562470A3 EP12180113.8A EP12180113A EP2562470A3 EP 2562470 A3 EP2562470 A3 EP 2562470A3 EP 12180113 A EP12180113 A EP 12180113A EP 2562470 A3 EP2562470 A3 EP 2562470A3
Authority
EP
European Patent Office
Prior art keywords
lighting
lighting module
lighting device
contacts
interconnecting elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12180113.8A
Other languages
English (en)
French (fr)
Other versions
EP2562470A2 (de
EP2562470B1 (de
Inventor
Gerald Katzler
Alessandro Scordino
Franco Zanon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Osram SpA
Original Assignee
Osram GmbH
Osram SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH, Osram SpA filed Critical Osram GmbH
Publication of EP2562470A2 publication Critical patent/EP2562470A2/de
Publication of EP2562470A3 publication Critical patent/EP2562470A3/de
Application granted granted Critical
Publication of EP2562470B1 publication Critical patent/EP2562470B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/037—Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
EP12180113.8A 2011-08-24 2012-08-10 Verfahren zur Herstellung einer Beleuchtungsvorrichtung und entsprechende Beleuchtungsvorrichtung Active EP2562470B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO20110774 2011-08-24

Publications (3)

Publication Number Publication Date
EP2562470A2 EP2562470A2 (de) 2013-02-27
EP2562470A3 true EP2562470A3 (de) 2017-06-28
EP2562470B1 EP2562470B1 (de) 2018-04-11

Family

ID=44899186

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12180113.8A Active EP2562470B1 (de) 2011-08-24 2012-08-10 Verfahren zur Herstellung einer Beleuchtungsvorrichtung und entsprechende Beleuchtungsvorrichtung

Country Status (3)

Country Link
US (1) US9052074B2 (de)
EP (1) EP2562470B1 (de)
CN (1) CN102954375B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013017229A1 (de) * 2013-10-17 2015-04-23 Led-Linear Gmbh LED-Streifen sowie Steckerelement
US9748723B2 (en) * 2014-12-12 2017-08-29 Peter Sussman Solder-less board-to-wire connector
US10941930B2 (en) 2018-11-27 2021-03-09 Kichler Lighting, LLC Radially symmetric electrical connector
EP3890454A1 (de) * 2020-04-02 2021-10-06 Koninklijke Philips N.V. Verhinderung des eindringens von flüssigkeit in eine vorrichtung
FR3110671B1 (fr) 2020-05-20 2022-11-25 Fs Tunnel Ruban à diodes LED pour éclairage continu à longue durée de vie
US11125399B1 (en) 2020-06-01 2021-09-21 Apogee Lighting Holdings, Llc Connection for scalable LED luminaire tape
USD952911S1 (en) * 2021-04-03 2022-05-24 Situo (Shenzhen) Energy Technology Co., Ltd. LED strip light
WO2023114202A1 (en) * 2021-12-13 2023-06-22 Lumileds Llc Led electrical contact for 3d leds
DE102022128306A1 (de) * 2022-10-26 2024-05-02 Aspöck Systems GmbH Anschlussverbindungselement für ein Leuchtdiodenband, mit einem Anschlussverbindungselement versehenes Leuchtdiodenband und Beleuchtungsstreifen mit einem solchen Leuchtdiodenband

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002093992A1 (de) * 2001-05-15 2002-11-21 Endress + Hauser Gmbh + Co. Kg Leiterplatte mit einer darauf aufgebrachten kontakthülse
DE102009008095A1 (de) * 2009-02-09 2010-08-12 Osram Gesellschaft mit beschränkter Haftung Konfektionierbares Leuchtband
WO2010092106A1 (de) * 2009-02-13 2010-08-19 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul und verfahren zum herstellen eines leuchtmoduls
DE102009035369A1 (de) * 2009-07-30 2011-02-03 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul, Leuchtband mit mehreren zusammenhängenden Leuchtmodulen und Verfahren zum Konfektionieren eines Leuchtbands
DE102009054511A1 (de) * 2009-12-10 2011-06-16 Osram Gesellschaft mit beschränkter Haftung Verfahren zum Kontaktieren einer Leuchtvorrichtung, Werkzeug zum Durchführen des Verfahrens und Anschlusselement zum Aufsatz auf eine Leuchtvorrichtung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4173035A (en) * 1977-12-01 1979-10-30 Media Masters, Inc. Tape strip for effecting moving light display
JP2005339881A (ja) * 2004-05-25 2005-12-08 Hitachi Displays Ltd 照明装置、照明モジュール及び液晶表示装置
JP2006004723A (ja) * 2004-06-16 2006-01-05 Omron Corp コネクタ、当該コネクタを備えた光源モジュール及び面光源装置
WO2008090643A1 (ja) * 2007-01-22 2008-07-31 Sharp Kabushiki Kaisha 光源モジュール及びバックライト光源
WO2009039092A1 (en) * 2007-09-17 2009-03-26 Lumination Llc Led lighting system for a cabinet sign
US8143631B2 (en) * 2008-03-06 2012-03-27 Metrospec Technology Llc Layered structure for use with high power light emitting diode systems
US8262250B2 (en) * 2008-07-08 2012-09-11 Virginia Optoelectronics, Inc. Modular LED lighting systems and flexible or rigid strip lighting devices
JP2010073674A (ja) * 2008-08-22 2010-04-02 Alps Electric Co Ltd 基板間接続コネクタの接続端子
DE102009020851A1 (de) * 2009-05-12 2010-11-25 Osram Gesellschaft mit beschränkter Haftung Leuchtband und Verfahren zum Herstellen eines Leuchtbands

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002093992A1 (de) * 2001-05-15 2002-11-21 Endress + Hauser Gmbh + Co. Kg Leiterplatte mit einer darauf aufgebrachten kontakthülse
DE102009008095A1 (de) * 2009-02-09 2010-08-12 Osram Gesellschaft mit beschränkter Haftung Konfektionierbares Leuchtband
WO2010092106A1 (de) * 2009-02-13 2010-08-19 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul und verfahren zum herstellen eines leuchtmoduls
DE102009035369A1 (de) * 2009-07-30 2011-02-03 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul, Leuchtband mit mehreren zusammenhängenden Leuchtmodulen und Verfahren zum Konfektionieren eines Leuchtbands
DE102009054511A1 (de) * 2009-12-10 2011-06-16 Osram Gesellschaft mit beschränkter Haftung Verfahren zum Kontaktieren einer Leuchtvorrichtung, Werkzeug zum Durchführen des Verfahrens und Anschlusselement zum Aufsatz auf eine Leuchtvorrichtung

Also Published As

Publication number Publication date
EP2562470A2 (de) 2013-02-27
US9052074B2 (en) 2015-06-09
EP2562470B1 (de) 2018-04-11
CN102954375B (zh) 2016-03-30
US20130051022A1 (en) 2013-02-28
CN102954375A (zh) 2013-03-06

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